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MC9S08AC96CFGE MC9S08AC96CFGE NXP USA Inc. MC9S08AC128.pdf Description: IC MCU 8BIT 96KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5602BF2MLL4 SPC5602BF2MLL4 NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K148HFT0MMHT FS32K148HFT0MMHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 2MB FLASH 100LFBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 156
Produkt ist nicht verfügbar
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PXLS70733AES NXP USA Inc. Description: SENSOR ACCELEROMETER UTA P2.0
Packaging: Tube
Produkt ist nicht verfügbar
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BAP70-05,215 BAP70-05,215 NXP USA Inc. BAP70-05.pdf Description: RF DIODE PIN 50V 250MW SOT-23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: PIN - 1 Pair Common Cathode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOT-23 (TO-236AB)
Current - Max: 100 mA
Power Dissipation (Max): 250 mW
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
3000+0.38 EUR
Mindestbestellmenge: 3000
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BAP70-05,215 BAP70-05,215 NXP USA Inc. BAP70-05.pdf Description: RF DIODE PIN 50V 250MW SOT-23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: PIN - 1 Pair Common Cathode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOT-23 (TO-236AB)
Current - Max: 100 mA
Power Dissipation (Max): 250 mW
auf Bestellung 5689 Stücke:
Lieferzeit 10-14 Tag (e)
21+0.86 EUR
30+0.61 EUR
33+0.54 EUR
100+0.47 EUR
250+0.44 EUR
500+0.42 EUR
1000+0.4 EUR
Mindestbestellmenge: 21
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S9S12GN16BMLCR S9S12GN16BMLCR NXP USA Inc. S12G%20Family%20Fact%20Sheet.pdf Description: IC MCU 16BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12GN16BMLC S9S12GN16BMLC NXP USA Inc. Description: IC MCU 16BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AW690HNK/A2WMP NXP USA Inc. Description: AW690HNK/A2WMP
Packaging: Bulk
Produkt ist nicht verfügbar
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AW690HNK/A2WK NXP USA Inc. Description: IC
Packaging: Bulk
Produkt ist nicht verfügbar
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S9S12GN32J1MTJ NXP USA Inc. Description: IC MCU 16BIT 32KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 14
Produkt ist nicht verfügbar
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NCF29AEXHN4/0100ZY NXP USA Inc. Description: NCF29AEXHN4
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 40-HVQFN (6x6)
Produkt ist nicht verfügbar
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MFS5600AMMA7ESR2 NXP USA Inc. FS5600.pdf Description: DUAL 36V AUTOMOTIVE DC-DC CONTRO
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 36V
Current - Supply: 140µA
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MPF5023CMBA0ESR2 NXP USA Inc. PF5023.pdf Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC34PF3001A5EPR2 MC34PF3001A5EPR2 NXP USA Inc. PF3001.pdf Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MC35FS6505NAER2 NXP USA Inc. 35FS4500-35FS6500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MFS2602AMDA0ADR2 NXP USA Inc. PB_FS26.pdf Description: AUTO SBC
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Produkt ist nicht verfügbar
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MPF7100BVBA2ESR2 MPF7100BVBA2ESR2 NXP USA Inc. PF7100.pdf Description: POWER MANAGEMENT IC, I.MX 8XL WI
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 10µA
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S912ZVCA19F1WLFR NXP USA Inc. Description: S12Z, 48LQFP, 192K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x12b SAR; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
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MC33FS8435G0ESR2 MC33FS8435G0ESR2 NXP USA Inc. FS84_FS85C_DS.pdf Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MKV46F128VLL16R NXP USA Inc. KV4XP100M168.pdf Description: KINETIS KV46: 168MHZ M4F REAL-TI
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MWCT2014SHVPAR NXP USA Inc. Description: MAXQFP100,512KB
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S912XET256W1MAAR S912XET256W1MAAR NXP USA Inc. Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AW690HNK/A2AMP NXP USA Inc. Description: IC
Packaging: Bulk
Produkt ist nicht verfügbar
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SCBGARBU1AO NXP USA Inc. Description: BGA RECEIVER/ADAPTER, 324 PIN, 1
Packaging: Bulk
Module/Board Type: Socket Module - BGA
Produkt ist nicht verfügbar
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8MPNAVQ-8GB-G 8MPNAVQ-8GB-G NXP USA Inc. 8MPNAVQQSG.pdf Description: DEV KIT
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53
Utilized IC / Part: i.MX 8M Plus
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
1+500.58 EUR
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WCT-15WTXAUTO NXP USA Inc. WCT15WTXAUTOFS.pdf Description: WCT-15WTXAUTO
Packaging: Bulk
Function: Wireless Power Supply/Charging
Type: Power Management
Contents: Board(s)
Supplied Contents: Board(s)
Primary Attributes: Transmitter
Produkt ist nicht verfügbar
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MKE02Z32VLC2R MKE02Z32VLC2R NXP USA Inc. MKE02P64M20SF0.pdf Description: IC MCU 32BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
2000+2.8 EUR
Mindestbestellmenge: 2000
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MKE02Z32VLC2R MKE02Z32VLC2R NXP USA Inc. MKE02P64M20SF0.pdf Description: IC MCU 32BIT 32KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.7 EUR
10+4.29 EUR
25+3.94 EUR
100+3.55 EUR
250+3.36 EUR
500+3.25 EUR
1000+3.16 EUR
Mindestbestellmenge: 4
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NCK2910AHN/10204Y NXP USA Inc. Description: NCK2910AHN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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KITPF5030FRDMEVM NXP USA Inc. UM11853.pdf Description: KITPF5030FRDMEVM
Packaging: Bulk
Function: Power Supply
Type: Power Management
Utilized IC / Part: PF5030
Supplied Contents: Board(s), Cable(s), Accessories
Embedded: Yes, MCU
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
1+427.06 EUR
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MPC8358VRAGDGA MPC8358VRAGDGA NXP USA Inc. MPC8358EEC.pdf Description: IC MPU MPC83XX 400MHZ 668BGA
Packaging: Tray
Package / Case: 668-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 668-PBGA-PGE (29x29)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Produkt ist nicht verfügbar
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LFK46MINTPT4A NXP USA Inc. Description: QORIVVA MPC5746M ON A 292 PIN 0.
Packaging: Bulk
For Use With/Related Products: MPC5746M
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
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TEA1998TS/1Z TEA1998TS/1Z NXP USA Inc. TEA1998TS.pdf Description: IC SYNC RECT CONTROLLER 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 60V
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: SC-74
Current - Supply: 250 µA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA1993TS/1Z TEA1993TS/1Z NXP USA Inc. TEA1993TS.pdf Description: IC SYNC RECT CONTROLLER 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: SC-74
Current - Supply: 200 µA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12GN16J0VLF S9S12GN16J0VLF NXP USA Inc. Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
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MC908JB8JDWE MC908JB8JDWE NXP USA Inc. MC68HC908JB8.pdf Description: IC MCU 8BIT 8KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 3MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4V ~ 5.5V
Connectivity: USB
Peripherals: LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
2+8.82 EUR
10+6.72 EUR
Mindestbestellmenge: 2
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MWCT2016SHVPBR NXP USA Inc. MWCT2xxxS.pdf Description: MWCT2016S,MAXQFP172
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MWCT2016SHVPB NXP USA Inc. MWCT2xxxS.pdf Description: MWCT2016S,MAXQFP172
Packaging: Tray
Produkt ist nicht verfügbar
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SSL3250AHN/C1,528 SSL3250AHN/C1,528 NXP USA Inc. SSL3250A.pdf Description: IC LED DRVR RGLTR I2C 16HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Voltage - Output: 9.5V
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 1.2MHz
Type: DC DC Regulator
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Camera Flash
Current - Output / Channel: 500mA
Internal Switch(s): Yes
Topology: Step-Up (Boost)
Supplier Device Package: 16-HVQFN (3x3)
Dimming: I2C
Voltage - Supply (Min): 2.7V
Voltage - Supply (Max): 5.5V
Produkt ist nicht verfügbar
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SSL3250AHN/C1,528 SSL3250AHN/C1,528 NXP USA Inc. SSL3250A.pdf Description: IC LED DRVR RGLTR I2C 16HVQFN
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Voltage - Output: 9.5V
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 1.2MHz
Type: DC DC Regulator
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Camera Flash
Current - Output / Channel: 500mA
Internal Switch(s): Yes
Topology: Step-Up (Boost)
Supplier Device Package: 16-HVQFN (3x3)
Dimming: I2C
Voltage - Supply (Min): 2.7V
Voltage - Supply (Max): 5.5V
Produkt ist nicht verfügbar
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MC32PF1550A8EPR2 MC32PF1550A8EPR2 NXP USA Inc. PF1550.pdf Description: POWER MANAGEMENT IC 3 BUCK REGS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.1V ~ 6V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MCIMX6S8DVM10AB MCIMX6S8DVM10AB NXP USA Inc. IMX6SDLAEC.pdf Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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DSPB56374AE DSPB56374AE NXP USA Inc. DSP56374.pdf Description: IC DSP 24BIT 150MHZ 52-LQFP
Packaging: Tray
Package / Case: 52-LQFP
Mounting Type: Surface Mount
Interface: Host Interface, I2C, SAI, SPI
Type: Audio Processor
Operating Temperature: 0°C ~ 70°C (TA)
Non-Volatile Memory: ROM (84kB)
On-Chip RAM: 54kB
Voltage - I/O: 3.30V
Voltage - Core: 1.25V
Clock Rate: 150MHz
Supplier Device Package: 52-TQFP (10x10)
Produkt ist nicht verfügbar
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S912XEG384J3VAA S912XEG384J3VAA NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCF51QU64VLF MCF51QU64VLF NXP USA Inc. MCF51QU128.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 13x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 35
DigiKey Programmable: Not Verified
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.84 EUR
10+8.33 EUR
25+7.71 EUR
80+7.11 EUR
250+6.69 EUR
500+6.49 EUR
1000+6.33 EUR
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MC33PF8100FJESR2 MC33PF8100FJESR2 NXP USA Inc. PF8100_PF8200.pdf Description: POWER MANAGEMENT IC, I.MX8, PRE-
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: Processor
Current - Supply: 10µA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33PF8100FJES MC33PF8100FJES NXP USA Inc. PF8100_PF8200.pdf Description: POWER MANAGEMENT IC, I.MX8, PRE-
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: Processor
Current - Supply: 10µA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 207 Stücke:
Lieferzeit 10-14 Tag (e)
1+19.66 EUR
10+15.42 EUR
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100+13.19 EUR
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FS32K118LFT0VLFT FS32K118LFT0VLFT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S12ZVML-MINIKIT NXP USA Inc. get-started-with-the-s12zvml-minixxx:GS-S12ZVML-MINIXXX Description: S12ZVML-MINIBRD WITH A LINIX PM
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: S12ZVML128
Supplied Contents: Board(s)
Primary Attributes: Motors (PMSM)
Embedded: Yes, MCU, 16-Bit
Produkt ist nicht verfügbar
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MIMXRT106PDVL6B NXP USA Inc. Description: IC MCU 32BIT 128MB ROM 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Number of I/O: 127
Produkt ist nicht verfügbar
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SL3S1204FUD/HA1Z NXP USA Inc. Description: IC RFID TRANSP 860-960MHZ WAFER
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 860MHz ~ 960MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Standards: EPC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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MIMXRT1011DAE5AR MIMXRT1011DAE5AR NXP USA Inc. IMXRT1010CEC.pdf Description: IC MCU 32BIT 64KB ROM 80LQFP
Packaging: Cut Tape (CT)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 500MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 128K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 15x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.3V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 44
auf Bestellung 995 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.42 EUR
10+5.6 EUR
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100+4.67 EUR
250+4.48 EUR
500+4.22 EUR
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FXLN8372QR1 FXLN8372QR1 NXP USA Inc. FXLN83xxQ.pdf Description: ACCELEROMETER 4-16G ANALOG 12QFN
Packaging: Tape & Reel (TR)
Features: Selectable Scale
Package / Case: 12-VQFN Exposed Pad
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±4g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 2.7kHz (X,Y), 600Hz (Z)
Supplier Device Package: 12-QFN (3x3)
Sensitivity (mV/g): 114.5 (±4g) ~ 28.62 (±16g)
Produkt ist nicht verfügbar
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TJA1128BTK/1Z NXP USA Inc. TJA1128.pdf Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
6000+1.17 EUR
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TJA1128BTK/1Z NXP USA Inc. TJA1128.pdf Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
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Mindestbestellmenge: 7
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TJA1128ATK/1Z NXP USA Inc. TJA1128.pdf Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJA1128ATK/1Z NXP USA Inc. TJA1128.pdf Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
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TJA1128CTK/1Z NXP USA Inc. TJA1128.pdf Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
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Lieferzeit 10-14 Tag (e)
6000+1.41 EUR
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TJA1128CTK/1Z NXP USA Inc. TJA1128.pdf Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
7+2.9 EUR
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MC9S08AC96CFGE MC9S08AC128.pdf
MC9S08AC96CFGE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 96KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5602BF2MLL4
SPC5602BF2MLL4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K148HFT0MMHT S32K1xx.pdf
FS32K148HFT0MMHT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100LFBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 156
Produkt ist nicht verfügbar
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PXLS70733AES
Hersteller: NXP USA Inc.
Description: SENSOR ACCELEROMETER UTA P2.0
Packaging: Tube
Produkt ist nicht verfügbar
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BAP70-05,215 BAP70-05.pdf
BAP70-05,215
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 250MW SOT-23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: PIN - 1 Pair Common Cathode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOT-23 (TO-236AB)
Current - Max: 100 mA
Power Dissipation (Max): 250 mW
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3000+0.38 EUR
Mindestbestellmenge: 3000
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BAP70-05,215 BAP70-05.pdf
BAP70-05,215
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 250MW SOT-23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: PIN - 1 Pair Common Cathode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOT-23 (TO-236AB)
Current - Max: 100 mA
Power Dissipation (Max): 250 mW
auf Bestellung 5689 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
21+0.86 EUR
30+0.61 EUR
33+0.54 EUR
100+0.47 EUR
250+0.44 EUR
500+0.42 EUR
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Mindestbestellmenge: 21
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S9S12GN16BMLCR S12G%20Family%20Fact%20Sheet.pdf
S9S12GN16BMLCR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12GN16BMLC
S9S12GN16BMLC
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AW690HNK/A2WMP
Hersteller: NXP USA Inc.
Description: AW690HNK/A2WMP
Packaging: Bulk
Produkt ist nicht verfügbar
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AW690HNK/A2WK
Hersteller: NXP USA Inc.
Description: IC
Packaging: Bulk
Produkt ist nicht verfügbar
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S9S12GN32J1MTJ
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 14
Produkt ist nicht verfügbar
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NCF29AEXHN4/0100ZY
Hersteller: NXP USA Inc.
Description: NCF29AEXHN4
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 40-HVQFN (6x6)
Produkt ist nicht verfügbar
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MFS5600AMMA7ESR2 FS5600.pdf
Hersteller: NXP USA Inc.
Description: DUAL 36V AUTOMOTIVE DC-DC CONTRO
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 36V
Current - Supply: 140µA
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MPF5023CMBA0ESR2 PF5023.pdf
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC34PF3001A5EPR2 PF3001.pdf
MC34PF3001A5EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MC35FS6505NAER2 35FS4500-35FS6500SDS-ASILB.pdf
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MFS2602AMDA0ADR2 PB_FS26.pdf
Hersteller: NXP USA Inc.
Description: AUTO SBC
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Produkt ist nicht verfügbar
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MPF7100BVBA2ESR2 PF7100.pdf
MPF7100BVBA2ESR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, I.MX 8XL WI
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 10µA
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S912ZVCA19F1WLFR
Hersteller: NXP USA Inc.
Description: S12Z, 48LQFP, 192K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x12b SAR; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
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MC33FS8435G0ESR2 FS84_FS85C_DS.pdf
MC33FS8435G0ESR2
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MKV46F128VLL16R KV4XP100M168.pdf
Hersteller: NXP USA Inc.
Description: KINETIS KV46: 168MHZ M4F REAL-TI
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MWCT2014SHVPAR
Hersteller: NXP USA Inc.
Description: MAXQFP100,512KB
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S912XET256W1MAAR
S912XET256W1MAAR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AW690HNK/A2AMP
Hersteller: NXP USA Inc.
Description: IC
Packaging: Bulk
Produkt ist nicht verfügbar
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SCBGARBU1AO
Hersteller: NXP USA Inc.
Description: BGA RECEIVER/ADAPTER, 324 PIN, 1
Packaging: Bulk
Module/Board Type: Socket Module - BGA
Produkt ist nicht verfügbar
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8MPNAVQ-8GB-G 8MPNAVQQSG.pdf
8MPNAVQ-8GB-G
Hersteller: NXP USA Inc.
Description: DEV KIT
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53
Utilized IC / Part: i.MX 8M Plus
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+500.58 EUR
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WCT-15WTXAUTO WCT15WTXAUTOFS.pdf
Hersteller: NXP USA Inc.
Description: WCT-15WTXAUTO
Packaging: Bulk
Function: Wireless Power Supply/Charging
Type: Power Management
Contents: Board(s)
Supplied Contents: Board(s)
Primary Attributes: Transmitter
Produkt ist nicht verfügbar
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MKE02Z32VLC2R MKE02P64M20SF0.pdf
MKE02Z32VLC2R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2000+2.8 EUR
Mindestbestellmenge: 2000
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MKE02Z32VLC2R MKE02P64M20SF0.pdf
MKE02Z32VLC2R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.7 EUR
10+4.29 EUR
25+3.94 EUR
100+3.55 EUR
250+3.36 EUR
500+3.25 EUR
1000+3.16 EUR
Mindestbestellmenge: 4
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NCK2910AHN/10204Y
Hersteller: NXP USA Inc.
Description: NCK2910AHN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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KITPF5030FRDMEVM UM11853.pdf
Hersteller: NXP USA Inc.
Description: KITPF5030FRDMEVM
Packaging: Bulk
Function: Power Supply
Type: Power Management
Utilized IC / Part: PF5030
Supplied Contents: Board(s), Cable(s), Accessories
Embedded: Yes, MCU
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+427.06 EUR
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MPC8358VRAGDGA MPC8358EEC.pdf
MPC8358VRAGDGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 668BGA
Packaging: Tray
Package / Case: 668-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 668-PBGA-PGE (29x29)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Produkt ist nicht verfügbar
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LFK46MINTPT4A
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5746M ON A 292 PIN 0.
Packaging: Bulk
For Use With/Related Products: MPC5746M
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
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TEA1998TS/1Z TEA1998TS.pdf
TEA1998TS/1Z
Hersteller: NXP USA Inc.
Description: IC SYNC RECT CONTROLLER 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 60V
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: SC-74
Current - Supply: 250 µA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA1993TS/1Z TEA1993TS.pdf
TEA1993TS/1Z
Hersteller: NXP USA Inc.
Description: IC SYNC RECT CONTROLLER 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: SC-74
Current - Supply: 200 µA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12GN16J0VLF
S9S12GN16J0VLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
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MC908JB8JDWE MC68HC908JB8.pdf
MC908JB8JDWE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 3MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4V ~ 5.5V
Connectivity: USB
Peripherals: LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+8.82 EUR
10+6.72 EUR
Mindestbestellmenge: 2
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MWCT2016SHVPBR MWCT2xxxS.pdf
Hersteller: NXP USA Inc.
Description: MWCT2016S,MAXQFP172
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MWCT2016SHVPB MWCT2xxxS.pdf
Hersteller: NXP USA Inc.
Description: MWCT2016S,MAXQFP172
Packaging: Tray
Produkt ist nicht verfügbar
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SSL3250AHN/C1,528 SSL3250A.pdf
SSL3250AHN/C1,528
Hersteller: NXP USA Inc.
Description: IC LED DRVR RGLTR I2C 16HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Voltage - Output: 9.5V
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 1.2MHz
Type: DC DC Regulator
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Camera Flash
Current - Output / Channel: 500mA
Internal Switch(s): Yes
Topology: Step-Up (Boost)
Supplier Device Package: 16-HVQFN (3x3)
Dimming: I2C
Voltage - Supply (Min): 2.7V
Voltage - Supply (Max): 5.5V
Produkt ist nicht verfügbar
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SSL3250AHN/C1,528 SSL3250A.pdf
SSL3250AHN/C1,528
Hersteller: NXP USA Inc.
Description: IC LED DRVR RGLTR I2C 16HVQFN
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Voltage - Output: 9.5V
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 1.2MHz
Type: DC DC Regulator
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Camera Flash
Current - Output / Channel: 500mA
Internal Switch(s): Yes
Topology: Step-Up (Boost)
Supplier Device Package: 16-HVQFN (3x3)
Dimming: I2C
Voltage - Supply (Min): 2.7V
Voltage - Supply (Max): 5.5V
Produkt ist nicht verfügbar
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MC32PF1550A8EPR2 PF1550.pdf
MC32PF1550A8EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC 3 BUCK REGS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.1V ~ 6V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MCIMX6S8DVM10AB IMX6SDLAEC.pdf
MCIMX6S8DVM10AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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DSPB56374AE DSP56374.pdf
DSPB56374AE
Hersteller: NXP USA Inc.
Description: IC DSP 24BIT 150MHZ 52-LQFP
Packaging: Tray
Package / Case: 52-LQFP
Mounting Type: Surface Mount
Interface: Host Interface, I2C, SAI, SPI
Type: Audio Processor
Operating Temperature: 0°C ~ 70°C (TA)
Non-Volatile Memory: ROM (84kB)
On-Chip RAM: 54kB
Voltage - I/O: 3.30V
Voltage - Core: 1.25V
Clock Rate: 150MHz
Supplier Device Package: 52-TQFP (10x10)
Produkt ist nicht verfügbar
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S912XEG384J3VAA
S912XEG384J3VAA
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCF51QU64VLF MCF51QU128.pdf
MCF51QU64VLF
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 13x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 35
DigiKey Programmable: Not Verified
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+10.84 EUR
10+8.33 EUR
25+7.71 EUR
80+7.11 EUR
250+6.69 EUR
500+6.49 EUR
1000+6.33 EUR
Mindestbestellmenge: 2
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MC33PF8100FJESR2 PF8100_PF8200.pdf
MC33PF8100FJESR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, I.MX8, PRE-
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: Processor
Current - Supply: 10µA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33PF8100FJES PF8100_PF8200.pdf
MC33PF8100FJES
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, I.MX8, PRE-
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: Processor
Current - Supply: 10µA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 207 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+19.66 EUR
10+15.42 EUR
25+14.36 EUR
100+13.19 EUR
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FS32K118LFT0VLFT S32K1xx.pdf
FS32K118LFT0VLFT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S12ZVML-MINIKIT get-started-with-the-s12zvml-minixxx:GS-S12ZVML-MINIXXX
Hersteller: NXP USA Inc.
Description: S12ZVML-MINIBRD WITH A LINIX PM
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: S12ZVML128
Supplied Contents: Board(s)
Primary Attributes: Motors (PMSM)
Embedded: Yes, MCU, 16-Bit
Produkt ist nicht verfügbar
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MIMXRT106PDVL6B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128MB ROM 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Number of I/O: 127
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SL3S1204FUD/HA1Z
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 860-960MHZ WAFER
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 860MHz ~ 960MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Standards: EPC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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MIMXRT1011DAE5AR IMXRT1010CEC.pdf
MIMXRT1011DAE5AR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB ROM 80LQFP
Packaging: Cut Tape (CT)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 500MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 128K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 15x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.3V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 44
auf Bestellung 995 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.42 EUR
10+5.6 EUR
25+5.15 EUR
100+4.67 EUR
250+4.48 EUR
500+4.22 EUR
Mindestbestellmenge: 3
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FXLN8372QR1 FXLN83xxQ.pdf
FXLN8372QR1
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 4-16G ANALOG 12QFN
Packaging: Tape & Reel (TR)
Features: Selectable Scale
Package / Case: 12-VQFN Exposed Pad
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±4g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 2.7kHz (X,Y), 600Hz (Z)
Supplier Device Package: 12-QFN (3x3)
Sensitivity (mV/g): 114.5 (±4g) ~ 28.62 (±16g)
Produkt ist nicht verfügbar
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TJA1128BTK/1Z TJA1128.pdf
Hersteller: NXP USA Inc.
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6000+1.17 EUR
Mindestbestellmenge: 6000
Im Einkaufswagen  Stück im Wert von  UAH
TJA1128BTK/1Z TJA1128.pdf
Hersteller: NXP USA Inc.
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.68 EUR
10+2.39 EUR
25+2.26 EUR
100+1.92 EUR
250+1.81 EUR
500+1.58 EUR
1000+1.31 EUR
2500+1.22 EUR
Mindestbestellmenge: 7
Im Einkaufswagen  Stück im Wert von  UAH
TJA1128ATK/1Z TJA1128.pdf
Hersteller: NXP USA Inc.
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TJA1128ATK/1Z TJA1128.pdf
Hersteller: NXP USA Inc.
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 4750 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.78 EUR
10+2.5 EUR
25+2.35 EUR
100+2.01 EUR
250+1.88 EUR
500+1.65 EUR
1000+1.36 EUR
2500+1.27 EUR
Mindestbestellmenge: 7
Im Einkaufswagen  Stück im Wert von  UAH
TJA1128CTK/1Z TJA1128.pdf
Hersteller: NXP USA Inc.
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6000+1.41 EUR
Mindestbestellmenge: 6000
Im Einkaufswagen  Stück im Wert von  UAH
TJA1128CTK/1Z TJA1128.pdf
Hersteller: NXP USA Inc.
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.9 EUR
10+2.12 EUR
25+1.93 EUR
100+1.72 EUR
250+1.62 EUR
500+1.55 EUR
1000+1.5 EUR
2500+1.45 EUR
Mindestbestellmenge: 7
Im Einkaufswagen  Stück im Wert von  UAH
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