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MK10DX128VLK7 MK10DX128VLK7 NXP USA Inc. K10P81M72SF1.pdf Description: IC MCU 32BIT 128KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 31x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 56
DigiKey Programmable: Not Verified
auf Bestellung 480 Stücke:
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1+19.20 EUR
10+15.07 EUR
96+12.48 EUR
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74LVC827AD,112 74LVC827AD,112 NXP USA Inc. 74LVC827A.pdf Description: IC BUFF DVR TRI-ST 10BIT 24SOIC
Packaging: Bulk
auf Bestellung 9733 Stücke:
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966+0.50 EUR
Mindestbestellmenge: 966
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88MW320-A0-NAPI/AK NXP USA Inc. 88MW320-88W322.pdf Description: LOW-POWER WLAN MICROCONTROLLER S
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB RAM, 128kB ROM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 4.4V ~ 5.25V
Power - Output: 26dBm
Protocol: 802.11n/g/b, Bluetooth
Current - Receiving: 29.3mA ~ 45.2mA
Data Rate (Max): 72.2Mbps
Current - Transmitting: 27.6mA ~ 183.3mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 50
Modulation: DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART
Produkt ist nicht verfügbar
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J3R150P9U15/0ZA1FV NXP USA Inc. Description: J3R150P9U15
Packaging: Tray
Produkt ist nicht verfügbar
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MK40DX64VMC7 MK40DX64VMC7 NXP USA Inc. K40P100M72SF1.pdf Description: IC MCU 32BIT 64KB FLSH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 34x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 74
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAF4000EL/101Q20AK NXP USA Inc. Description: AUDIO DSPS SAF4000EL/101Q2041
Packaging: Tray
Produkt ist nicht verfügbar
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74ABT543ADB,118 74ABT543ADB,118 NXP USA Inc. 74ABT543A.pdf Description: IC TXRX NON-INVERT 5.5V 24SSOP
Packaging: Bulk
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 24-SSOP
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860+0.59 EUR
Mindestbestellmenge: 860
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TDA9885HN/V5,118 TDA9885HN/V5,118 NXP USA Inc. TDA9885_TDA9886_3.pdf Description: IC VIDEO DEMODULATOR 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Demodulator
Voltage - Supply: 4.5V ~ 5.5V
Applications: Professional Video
Standards: NTSC, PAL
Supplier Device Package: 32-HVQFN (5x5)
Control Interface: I2C
Produkt ist nicht verfügbar
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TDA9886TS/V5,118 TDA9886TS/V5,118 NXP USA Inc. TDA9885_TDA9886_3.pdf Description: IC VIDEO DEMODULATOR 24SSOP
Packaging: Tape & Reel (TR)
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Function: Demodulator
Voltage - Supply: 4.5V ~ 5.5V
Applications: Professional Video
Standards: NTSC, PAL, SECAM
Supplier Device Package: 24-SSOP
Control Interface: I2C
Produkt ist nicht verfügbar
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74LVC3G07GM,125 74LVC3G07GM,125 NXP USA Inc. 74LVC3G07.pdf Description: IC BUFFER TRPL OP/DRAIN 8XQFN
Packaging: Bulk
auf Bestellung 106045 Stücke:
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3796+0.13 EUR
Mindestbestellmenge: 3796
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74LVC3G07GN,115 74LVC3G07GN,115 NXP USA Inc. PHGLS27082-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 8-XSON (1.2x1)
auf Bestellung 101893 Stücke:
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2160+0.23 EUR
Mindestbestellmenge: 2160
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SAF4000EL/102Z524Y NXP USA Inc. Description: SAF4000EL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF4000EL/102Z524K NXP USA Inc. Description: SAF4000EL
Packaging: Tray
Produkt ist nicht verfügbar
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MIMX9101DVXXCAA MIMX9101DVXXCAA NXP USA Inc. IMX91IEC.pdf Description: MIMX9101DVXXCAA
Packaging: Bulk
Produkt ist nicht verfügbar
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MIMX9111DVXXJAA MIMX9111DVXXJAA NXP USA Inc. IMX91FAMFS.pdf Description: MIMX9111DVXXJAA
Packaging: Bulk
Speed: 1.4GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9101CVXXCAA MIMX9101CVXXCAA NXP USA Inc. IMX91IEC.pdf Description: MIMX9101CVXXCAA
Packaging: Bulk
Produkt ist nicht verfügbar
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MIMX9111CVXXJAA MIMX9111CVXXJAA NXP USA Inc. IMX91FAMFS.pdf Description: MIMX9111CVXXJAA
Packaging: Bulk
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9131DVVXJAA MIMX9131DVVXJAA NXP USA Inc. IMX91FAMFS.pdf Description: MIMX9131DVVXJAA
Packaging: Bulk
Speed: 1.4GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9131CVVXJAA MIMX9131CVVXJAA NXP USA Inc. IMX91FAMFS.pdf Description: MIMX9131CVVXJAA
Packaging: Bulk
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9331CVTXMAB MIMX9331CVTXMAB NXP USA Inc. IMX93IEC.pdf Description: MIMX9331CVTXMAB
Packaging: Bulk
Package / Case: 306-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-FCBGA (14x14)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9332CVTXMAB MIMX9332CVTXMAB NXP USA Inc. IMX93IEC.pdf Description: MIMX9332CVTXMAB
Packaging: Bulk
Package / Case: 306-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-FCBGA (14x14)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9331XVTXMAB MIMX9331XVTXMAB NXP USA Inc. IMX93XEC.pdf Description: MIMX9331XVTXMAB
Packaging: Bulk
Package / Case: 306-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-FCBGA (14x14)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9332XVTXMAB MIMX9332XVTXMAB NXP USA Inc. IMX93XEC.pdf Description: MIMX9332XVTXMAB
Packaging: Bulk
Package / Case: 306-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-FCBGA (14x14)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9351CVTXMAB MIMX9351CVTXMAB NXP USA Inc. IMX93IEC.pdf Description: MIMX9351CVTXMAB
Packaging: Bulk
Package / Case: 306-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-FCBGA (14x14)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9352CVTXMAB MIMX9352CVTXMAB NXP USA Inc. IMX93IEC.pdf Description: MIMX9352CVTXMAB
Packaging: Bulk
Package / Case: 306-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-FCBGA (14x14)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
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MIMX9351XVTXMAB MIMX9351XVTXMAB NXP USA Inc. IMX93XEC.pdf Description: MIMX9351XVTXMAB
Packaging: Bulk
Package / Case: 306-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-FCBGA (14x14)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9352XVTXMAB MIMX9352XVTXMAB NXP USA Inc. IMX93XEC.pdf Description: MIMX9352XVTXMAB
Packaging: Bulk
Package / Case: 306-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-FCBGA (14x14)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9331AVTYMAB NXP USA Inc. IMX93AEC.pdf Description: MIMX9331AVTYMAB
Packaging: Bulk
Produkt ist nicht verfügbar
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MIMX9332AVTYMAB NXP USA Inc. IMX93AEC.pdf Description: MIMX9332AVTYMAB
Packaging: Bulk
Produkt ist nicht verfügbar
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MIMX9351AVTYMAB NXP USA Inc. IMX93AEC.pdf Description: MIMX9351AVTYMAB
Packaging: Bulk
Produkt ist nicht verfügbar
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TJA1103SDB TJA1103SDB NXP USA Inc. getting-started-with-the-tja1103sdb:GS-TJA1103SDB Description: TJA1103 SABRE DEV BOARD
Packaging: Box
Function: Ethernet PHY
Type: Interface
Utilized IC / Part: TJA1103
Supplied Contents: Board(s)
Primary Attributes: 100BASE-T1
Embedded: Yes, MCU
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
1+325.72 EUR
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MC56F81866AMLFA MC56F81866AMLFA NXP USA Inc. MC56F81XXXL.pdf Description: MC56F81866AMLFA
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: DMA, I2C, LINbus, SCI, QSPI
Type: Digital Signal Controllers
Operating Temperature: -40°C ~ 125°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 48-LQFP (7x7)
Produkt ist nicht verfügbar
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LPC1113FBD48/303,1 LPC1113FBD48/303,1 NXP USA Inc. LPC111X.pdf Description: IC MCU 32BIT 24KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 245 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.14 EUR
10+3.92 EUR
25+3.78 EUR
80+3.64 EUR
Mindestbestellmenge: 3
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LPC1113FHN33/203,5 LPC1113FHN33/203,5 NXP USA Inc. UM10398.pdf Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1113JHN33/203E LPC1113JHN33/203E NXP USA Inc. LPC111X.pdf Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PM823HN/A0CHP PM823HN/A0CHP NXP USA Inc. PM823.pdf Description: POWER MANAGEMENT IC, DUAL SYNCHR
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Frequency - Switching: 3MHz
Topology: Step-Down (Buck) Synchronous (2), Linear (LDO) (1)
Supplier Device Package: 24-HVQFN (4x4)
Voltage/Current - Output 1: 1.1V, 1.5A
Voltage/Current - Output 2: 2.2V, 1.5A
Voltage/Current - Output 3: 1.8V, 525mA
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Number of Outputs: 3
Produkt ist nicht verfügbar
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MC56F81868LVLH NXP USA Inc. MC56F81XXXL.pdf Description: IC
Packaging: Bulk
Produkt ist nicht verfügbar
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FB32K146HAT0VLLR NXP USA Inc. Description: S32K144 32-BIT MCU, ARM CORTEX-M
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PSMN8R5-100ESQ PSMN8R5-100ESQ NXP USA Inc. PHGLS25567-1.pdf?t.download=true&u=5oefqw Description: POWER FIELD-EFFECT TRANSISTOR, 1
Packaging: Bulk
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tj)
Rds On (Max) @ Id, Vgs: 8.5mOhm @ 25A, 10V
Power Dissipation (Max): 263W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 111 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5512 pF @ 50 V
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MC9S08DZ32AMLF MC9S08DZ32AMLF NXP USA Inc. MC9S08DZ60.pdf Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DZ32ACLH MC9S08DZ32ACLH NXP USA Inc. Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908AZ32AVFUE MC908AZ32AVFUE NXP USA Inc. MC68HC908AZ32A.pdf Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HC08
Data Converters: A/D 15x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NTB0102JKZ NTB0102JKZ NXP USA Inc. NTB0102.pdf Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-X2SON (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Number of Circuits: 1
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NXH3675UK/A2Z NXP USA Inc. NXH3675A4FS.pdf Description: NXH3675UK/A2Z
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SPC5644BF0MLU1R SPC5644BF0MLU1R NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5644BCF0VLU8R SPC5644BCF0VLU8R NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5644BF0MLU1 SPC5644BF0MLU1 NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5644BCF0VLU8 SPC5644BCF0VLU8 NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5644BK0VLU1 SPC5644BK0VLU1 NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BUK9520-55A,127 BUK9520-55A,127 NXP USA Inc. BUK9520-55A.pdf Description: MOSFET N-CH 55V 54A TO220AB
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 54A (Tc)
Rds On (Max) @ Id, Vgs: 18mOhm @ 25A, 10V
Power Dissipation (Max): 118W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: TO-220AB
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 2210 pF @ 25 V
Qualification: AEC-Q101
auf Bestellung 1091 Stücke:
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BUK9520-100B,127 NXP USA Inc. BUK9520-100B.pdf Description: MOSFET N-CH 100V 63A TO220AB
Packaging: Tube
auf Bestellung 8479 Stücke:
Lieferzeit 10-14 Tag (e)
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Mindestbestellmenge: 567
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MC33FS8530A4KSR2 NXP USA Inc. FS84_FS85C_DS.pdf Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS8530A4KS NXP USA Inc. FS84_FS85C_DS.pdf Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S9KEAZN8ACTGR NXP USA Inc. S9KEA8P44M48SF0.pdf Description: KINETIS E 32-BIT MCU, ARM CORTEX
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 14
Produkt ist nicht verfügbar
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SPC5745CBK1AMMJ6 SPC5745CBK1AMMJ6 NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 2MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z2, e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC56F80738VLH MC56F80738VLH NXP USA Inc. MC56F80XXX.pdf Description: IC MCU 32BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: 56800EF
Data Converters: A/D 14x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVI, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PEMI6QFN/HE,132 PEMI6QFN/HE,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 45 OHM/8.5PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 8.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 9dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 6
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SAF7751HN/N207WK NXP USA Inc. Description: CAR DISP
Packaging: Bulk
Produkt ist nicht verfügbar
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TDA8766G/C1,118 TDA8766G/C1,118 NXP USA Inc. TDA8766.pdf Description: IC ADC 10BIT SIGMA-DELTA 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Number of Bits: 10
Configuration: ADC
Data Interface: Parallel
Reference Type: External
Operating Temperature: 20°C ~ 75°C
Voltage - Supply, Analog: 3V ~ 5.25V
Voltage - Supply, Digital: 3V ~ 5.25V
Sampling Rate (Per Second): 20M
Input Type: Single Ended
Number of Inputs: 1
Supplier Device Package: 32-LQFP (5x5)
Architecture: Sigma-Delta
Number of A/D Converters: 1
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S912XD256F1CAAR S912XD256F1CAAR NXP USA Inc. Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MK10DX128VLK7 K10P81M72SF1.pdf
MK10DX128VLK7
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 31x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 56
DigiKey Programmable: Not Verified
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1+19.20 EUR
10+15.07 EUR
96+12.48 EUR
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74LVC827AD,112 74LVC827A.pdf
74LVC827AD,112
Hersteller: NXP USA Inc.
Description: IC BUFF DVR TRI-ST 10BIT 24SOIC
Packaging: Bulk
auf Bestellung 9733 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
966+0.50 EUR
Mindestbestellmenge: 966
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88MW320-A0-NAPI/AK 88MW320-88W322.pdf
Hersteller: NXP USA Inc.
Description: LOW-POWER WLAN MICROCONTROLLER S
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB RAM, 128kB ROM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 4.4V ~ 5.25V
Power - Output: 26dBm
Protocol: 802.11n/g/b, Bluetooth
Current - Receiving: 29.3mA ~ 45.2mA
Data Rate (Max): 72.2Mbps
Current - Transmitting: 27.6mA ~ 183.3mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 50
Modulation: DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART
Produkt ist nicht verfügbar
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J3R150P9U15/0ZA1FV
Hersteller: NXP USA Inc.
Description: J3R150P9U15
Packaging: Tray
Produkt ist nicht verfügbar
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MK40DX64VMC7 K40P100M72SF1.pdf
MK40DX64VMC7
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLSH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 34x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 74
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAF4000EL/101Q20AK
Hersteller: NXP USA Inc.
Description: AUDIO DSPS SAF4000EL/101Q2041
Packaging: Tray
Produkt ist nicht verfügbar
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74ABT543ADB,118 74ABT543A.pdf
74ABT543ADB,118
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 5.5V 24SSOP
Packaging: Bulk
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 24-SSOP
auf Bestellung 2650 Stücke:
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Anzahl Preis
860+0.59 EUR
Mindestbestellmenge: 860
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TDA9885HN/V5,118 TDA9885_TDA9886_3.pdf
TDA9885HN/V5,118
Hersteller: NXP USA Inc.
Description: IC VIDEO DEMODULATOR 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Demodulator
Voltage - Supply: 4.5V ~ 5.5V
Applications: Professional Video
Standards: NTSC, PAL
Supplier Device Package: 32-HVQFN (5x5)
Control Interface: I2C
Produkt ist nicht verfügbar
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TDA9886TS/V5,118 TDA9885_TDA9886_3.pdf
TDA9886TS/V5,118
Hersteller: NXP USA Inc.
Description: IC VIDEO DEMODULATOR 24SSOP
Packaging: Tape & Reel (TR)
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Function: Demodulator
Voltage - Supply: 4.5V ~ 5.5V
Applications: Professional Video
Standards: NTSC, PAL, SECAM
Supplier Device Package: 24-SSOP
Control Interface: I2C
Produkt ist nicht verfügbar
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74LVC3G07GM,125 74LVC3G07.pdf
74LVC3G07GM,125
Hersteller: NXP USA Inc.
Description: IC BUFFER TRPL OP/DRAIN 8XQFN
Packaging: Bulk
auf Bestellung 106045 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3796+0.13 EUR
Mindestbestellmenge: 3796
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74LVC3G07GN,115 PHGLS27082-1.pdf?t.download=true&u=5oefqw
74LVC3G07GN,115
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 8-XSON (1.2x1)
auf Bestellung 101893 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2160+0.23 EUR
Mindestbestellmenge: 2160
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SAF4000EL/102Z524Y
Hersteller: NXP USA Inc.
Description: SAF4000EL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF4000EL/102Z524K
Hersteller: NXP USA Inc.
Description: SAF4000EL
Packaging: Tray
Produkt ist nicht verfügbar
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MIMX9101DVXXCAA IMX91IEC.pdf
MIMX9101DVXXCAA
Hersteller: NXP USA Inc.
Description: MIMX9101DVXXCAA
Packaging: Bulk
Produkt ist nicht verfügbar
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MIMX9111DVXXJAA IMX91FAMFS.pdf
MIMX9111DVXXJAA
Hersteller: NXP USA Inc.
Description: MIMX9111DVXXJAA
Packaging: Bulk
Speed: 1.4GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9101CVXXCAA IMX91IEC.pdf
MIMX9101CVXXCAA
Hersteller: NXP USA Inc.
Description: MIMX9101CVXXCAA
Packaging: Bulk
Produkt ist nicht verfügbar
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MIMX9111CVXXJAA IMX91FAMFS.pdf
MIMX9111CVXXJAA
Hersteller: NXP USA Inc.
Description: MIMX9111CVXXJAA
Packaging: Bulk
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9131DVVXJAA IMX91FAMFS.pdf
MIMX9131DVVXJAA
Hersteller: NXP USA Inc.
Description: MIMX9131DVVXJAA
Packaging: Bulk
Speed: 1.4GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9131CVVXJAA IMX91FAMFS.pdf
MIMX9131CVVXJAA
Hersteller: NXP USA Inc.
Description: MIMX9131CVVXJAA
Packaging: Bulk
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9331CVTXMAB IMX93IEC.pdf
MIMX9331CVTXMAB
Hersteller: NXP USA Inc.
Description: MIMX9331CVTXMAB
Packaging: Bulk
Package / Case: 306-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-FCBGA (14x14)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9332CVTXMAB IMX93IEC.pdf
MIMX9332CVTXMAB
Hersteller: NXP USA Inc.
Description: MIMX9332CVTXMAB
Packaging: Bulk
Package / Case: 306-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-FCBGA (14x14)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9331XVTXMAB IMX93XEC.pdf
MIMX9331XVTXMAB
Hersteller: NXP USA Inc.
Description: MIMX9331XVTXMAB
Packaging: Bulk
Package / Case: 306-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-FCBGA (14x14)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9332XVTXMAB IMX93XEC.pdf
MIMX9332XVTXMAB
Hersteller: NXP USA Inc.
Description: MIMX9332XVTXMAB
Packaging: Bulk
Package / Case: 306-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-FCBGA (14x14)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9351CVTXMAB IMX93IEC.pdf
MIMX9351CVTXMAB
Hersteller: NXP USA Inc.
Description: MIMX9351CVTXMAB
Packaging: Bulk
Package / Case: 306-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-FCBGA (14x14)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9352CVTXMAB IMX93IEC.pdf
MIMX9352CVTXMAB
Hersteller: NXP USA Inc.
Description: MIMX9352CVTXMAB
Packaging: Bulk
Package / Case: 306-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-FCBGA (14x14)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9351XVTXMAB IMX93XEC.pdf
MIMX9351XVTXMAB
Hersteller: NXP USA Inc.
Description: MIMX9351XVTXMAB
Packaging: Bulk
Package / Case: 306-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-FCBGA (14x14)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9352XVTXMAB IMX93XEC.pdf
MIMX9352XVTXMAB
Hersteller: NXP USA Inc.
Description: MIMX9352XVTXMAB
Packaging: Bulk
Package / Case: 306-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-FCBGA (14x14)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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MIMX9331AVTYMAB IMX93AEC.pdf
Hersteller: NXP USA Inc.
Description: MIMX9331AVTYMAB
Packaging: Bulk
Produkt ist nicht verfügbar
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MIMX9332AVTYMAB IMX93AEC.pdf
Hersteller: NXP USA Inc.
Description: MIMX9332AVTYMAB
Packaging: Bulk
Produkt ist nicht verfügbar
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MIMX9351AVTYMAB IMX93AEC.pdf
Hersteller: NXP USA Inc.
Description: MIMX9351AVTYMAB
Packaging: Bulk
Produkt ist nicht verfügbar
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TJA1103SDB getting-started-with-the-tja1103sdb:GS-TJA1103SDB
TJA1103SDB
Hersteller: NXP USA Inc.
Description: TJA1103 SABRE DEV BOARD
Packaging: Box
Function: Ethernet PHY
Type: Interface
Utilized IC / Part: TJA1103
Supplied Contents: Board(s)
Primary Attributes: 100BASE-T1
Embedded: Yes, MCU
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+325.72 EUR
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MC56F81866AMLFA MC56F81XXXL.pdf
MC56F81866AMLFA
Hersteller: NXP USA Inc.
Description: MC56F81866AMLFA
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: DMA, I2C, LINbus, SCI, QSPI
Type: Digital Signal Controllers
Operating Temperature: -40°C ~ 125°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 48-LQFP (7x7)
Produkt ist nicht verfügbar
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LPC1113FBD48/303,1 LPC111X.pdf
LPC1113FBD48/303,1
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 245 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.14 EUR
10+3.92 EUR
25+3.78 EUR
80+3.64 EUR
Mindestbestellmenge: 3
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LPC1113FHN33/203,5 UM10398.pdf
LPC1113FHN33/203,5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1113JHN33/203E LPC111X.pdf
LPC1113JHN33/203E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PM823HN/A0CHP PM823.pdf
PM823HN/A0CHP
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, DUAL SYNCHR
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Frequency - Switching: 3MHz
Topology: Step-Down (Buck) Synchronous (2), Linear (LDO) (1)
Supplier Device Package: 24-HVQFN (4x4)
Voltage/Current - Output 1: 1.1V, 1.5A
Voltage/Current - Output 2: 2.2V, 1.5A
Voltage/Current - Output 3: 1.8V, 525mA
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Number of Outputs: 3
Produkt ist nicht verfügbar
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MC56F81868LVLH MC56F81XXXL.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Bulk
Produkt ist nicht verfügbar
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FB32K146HAT0VLLR
Hersteller: NXP USA Inc.
Description: S32K144 32-BIT MCU, ARM CORTEX-M
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PSMN8R5-100ESQ PHGLS25567-1.pdf?t.download=true&u=5oefqw
PSMN8R5-100ESQ
Hersteller: NXP USA Inc.
Description: POWER FIELD-EFFECT TRANSISTOR, 1
Packaging: Bulk
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tj)
Rds On (Max) @ Id, Vgs: 8.5mOhm @ 25A, 10V
Power Dissipation (Max): 263W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 111 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5512 pF @ 50 V
auf Bestellung 975 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
398+1.22 EUR
Mindestbestellmenge: 398
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MC9S08DZ32AMLF MC9S08DZ60.pdf
MC9S08DZ32AMLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DZ32ACLH
MC9S08DZ32ACLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908AZ32AVFUE MC68HC908AZ32A.pdf
MC908AZ32AVFUE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HC08
Data Converters: A/D 15x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NTB0102JKZ NTB0102.pdf
NTB0102JKZ
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-X2SON (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Number of Circuits: 1
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6000+0.36 EUR
Mindestbestellmenge: 6000
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NXH3675UK/A2Z NXH3675A4FS.pdf
Hersteller: NXP USA Inc.
Description: NXH3675UK/A2Z
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SPC5644BF0MLU1R
SPC5644BF0MLU1R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5644BCF0VLU8R
SPC5644BCF0VLU8R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5644BF0MLU1
SPC5644BF0MLU1
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5644BCF0VLU8
SPC5644BCF0VLU8
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5644BK0VLU1
SPC5644BK0VLU1
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BUK9520-55A,127 BUK9520-55A.pdf
BUK9520-55A,127
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 55V 54A TO220AB
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 54A (Tc)
Rds On (Max) @ Id, Vgs: 18mOhm @ 25A, 10V
Power Dissipation (Max): 118W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: TO-220AB
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 2210 pF @ 25 V
Qualification: AEC-Q101
auf Bestellung 1091 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
666+0.76 EUR
Mindestbestellmenge: 666
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BUK9520-100B,127 BUK9520-100B.pdf
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 100V 63A TO220AB
Packaging: Tube
auf Bestellung 8479 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
567+0.86 EUR
Mindestbestellmenge: 567
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MC33FS8530A4KSR2 FS84_FS85C_DS.pdf
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS8530A4KS FS84_FS85C_DS.pdf
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S9KEAZN8ACTGR S9KEA8P44M48SF0.pdf
Hersteller: NXP USA Inc.
Description: KINETIS E 32-BIT MCU, ARM CORTEX
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 14
Produkt ist nicht verfügbar
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SPC5745CBK1AMMJ6 MPC5746C.pdf
SPC5745CBK1AMMJ6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z2, e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC56F80738VLH MC56F80XXX.pdf
MC56F80738VLH
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: 56800EF
Data Converters: A/D 14x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVI, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PEMI6QFN/HE,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI6QFN/HE,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 45 OHM/8.5PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 8.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 9dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 6
auf Bestellung 16000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1902+0.26 EUR
Mindestbestellmenge: 1902
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SAF7751HN/N207WK
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
Produkt ist nicht verfügbar
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TDA8766G/C1,118 TDA8766.pdf
TDA8766G/C1,118
Hersteller: NXP USA Inc.
Description: IC ADC 10BIT SIGMA-DELTA 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Number of Bits: 10
Configuration: ADC
Data Interface: Parallel
Reference Type: External
Operating Temperature: 20°C ~ 75°C
Voltage - Supply, Analog: 3V ~ 5.25V
Voltage - Supply, Digital: 3V ~ 5.25V
Sampling Rate (Per Second): 20M
Input Type: Single Ended
Number of Inputs: 1
Supplier Device Package: 32-LQFP (5x5)
Architecture: Sigma-Delta
Number of A/D Converters: 1
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
20+25.44 EUR
Mindestbestellmenge: 20
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S912XD256F1CAAR
S912XD256F1CAAR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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