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S32K376NHT1MJBST S32K376NHT1MJBST NXP USA Inc. S32K39%2C%20S32K37.pdf Description: IC MCU 32BIT 6MB FLASH 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 96x12b SAR, 4x16b Sigma-Delta
Core Size: 32-Bit 3-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINBus, SPI, UART/USART, Zipwire
Peripherals: DMA, Ethernet, I2S, PWM
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 237
auf Bestellung 760 Stücke:
Lieferzeit 10-14 Tag (e)
1+58.91 EUR
10+48.17 EUR
25+46.57 EUR
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S32K366NHT1MJBST NXP USA Inc. Description: IC
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
Operating Temperature: -40°C ~ 125°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: PWM
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K366EHT1MJBST S32K366EHT1MJBST NXP USA Inc. S32K39-S32K37-DS.pdf Description: S32K366EHT1MJBST
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 704K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART
Peripherals: PWM
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
Produkt ist nicht verfügbar
 Mindestbestellmenge: 152 Stücke
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LPC845M301JHI48Y LPC845M301JHI48Y NXP USA Inc. LPC84x.pdf Description: IC MCU 32BIT 64KB FLASH 48HVQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, Capacitive Touch, DMA, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 2597 Stücke:
Lieferzeit 10-14 Tag (e)
4+4.56 EUR
10+3.42 EUR
25+3.13 EUR
100+2.81 EUR
250+2.66 EUR
500+2.59 EUR
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MFS8630BMDA0ES MFS8630BMDA0ES NXP USA Inc. Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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SAF4000EL/102Z22AY NXP USA Inc. Description: SAF4000EL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF4000EL/102Z22AK NXP USA Inc. Description: SAF4000EL
Packaging: Tray
Produkt ist nicht verfügbar
 Mindestbestellmenge: 630 Stücke
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AFT18H357-24NR6 NXP USA Inc. RF_%20Gde.pdf Description: RF MOSFET LDMOS 28V OM1230-42
Packaging: Tape & Reel (TR)
Package / Case: OM-1230-4L2L
Mounting Type: Chassis Mount
Frequency: 1.81GHz
Configuration: Dual
Power - Output: 63W
Gain: 17.5dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L2L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 800 mA
Produkt ist nicht verfügbar
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MC9S08LG16CLF MC9S08LG16CLF NXP USA Inc. MC9S08LG32.pdf Description: IC MCU 8BIT 18KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 18KB (18K x 8)
RAM Size: 1.9K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 9x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 613 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.33 EUR
10+4 EUR
25+3.67 EUR
80+3.35 EUR
230+3.14 EUR
440+3.04 EUR
Mindestbestellmenge: 4 Stücke
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FS32K142WAT0WLFR NXP USA Inc. S32K1xx.pdf Description: S32K142W ARM CORTEX-M4F, UP TO 8
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 23x12b SAR; D/A 6x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
Produkt ist nicht verfügbar
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FS32K142WAT0WLHR NXP USA Inc. S32K1xx.pdf Description: S32K142W ARM CORTEX-M4F, UP TO 8
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 29x12b SAR; D/A 8x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
Produkt ist nicht verfügbar
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FS32K144WAT0WLFR FS32K144WAT0WLFR NXP USA Inc. S32K1xx.pdf Description: S32K144W ARM CORTEX-M4F, UP TO 8
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 23x12b SAR; D/A 6x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
Produkt ist nicht verfügbar
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MCF51QU32VHS MCF51QU32VHS NXP USA Inc. MCF51QW256.pdf Description: IC MCU 32BIT 32KB FLASH 44MAPLGA
Packaging: Tray
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 11x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DZ128CLLR MC9S08DZ128CLLR NXP USA Inc. MC9S08DZ128.pdf Description: IC MCU 8BIT 128KB FLASH 100LQFP
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 87
Supplier Device Package: 100-LQFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x12b
Core Processor: S08
auf Bestellung 1000 Stücke:
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1000+18.2 EUR
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MC9S08DZ128CLLR MC9S08DZ128CLLR NXP USA Inc. MC9S08DZ128.pdf Description: IC MCU 8BIT 128KB FLASH 100LQFP
Core Size: 8-Bit
Data Converters: A/D 24x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 87
Supplier Device Package: 100-LQFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
auf Bestellung 1000 Stücke:
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1+28.72 EUR
10+22.96 EUR
100+19.39 EUR
500+19.27 EUR
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MC9S08DZ128CLL MC9S08DZ128CLL NXP USA Inc. MC9S08DZ128.pdf Description: IC MCU 8BIT 128KB FLASH 100LQFP
DigiKey Programmable: Verified
Number of I/O: 87
Supplier Device Package: 100-LQFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
auf Bestellung 450 Stücke:
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1+28.72 EUR
10+22.96 EUR
80+19.39 EUR
450+19.27 EUR
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LFBGARBZ1BO NXP USA Inc. Description: NXP LEAD FREE 522 PIN 1.0 MM PIT
Packaging: Bulk
Produkt ist nicht verfügbar
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PNEV5190BP NXP USA Inc. RM00264.pdf Description: EVAL BOARD FOR PN5190
Utilized IC / Part: PN5190
Contents: Board(s)
Supplied Contents: Board(s)
Type: Near Field Communication (NFC)
Packaging: Bulk
Produkt ist nicht verfügbar
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LFTAS32K3H1H2A NXP USA Inc. Description: IC
Module/Board Type: Adapter Board
For Use With/Related Products: S32K3
Packaging: Box
Produkt ist nicht verfügbar
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LFVBBK77CWA NXP USA Inc. Description: QORIVVA MPC5777C 416 PIN 1.0MM V
Accessory Type: Base Board
For Use With/Related Products: MPC5777C
Packaging: Bulk
Produkt ist nicht verfügbar
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RDWWAB-8897-S1 NXP USA Inc. Description: RDWWAB-8897-S1
Packaging: Bulk
Produkt ist nicht verfügbar
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XS32K388EVB-Q289 NXP USA Inc. Description: IC
Packaging: Bulk
Produkt ist nicht verfügbar
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T4241NXE7TTB T4241NXE7TTB NXP USA Inc. T4240T4160FS.pdf Description: IC MPU QORIQ T4 1.8GHZ 1932BGA
Packaging: Bulk
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (13), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 24 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
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1+3285.02 EUR
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T4241NXE7TTB T4241NXE7TTB NXP USA Inc. T4240T4160FS.pdf Description: IC MPU QORIQ T4 1.8GHZ 1932BGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (13), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 24 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
Produkt ist nicht verfügbar
 Mindestbestellmenge: 12 Stücke
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MFS2300BMBA0EP MFS2300BMBA0EP NXP USA Inc. FS23DS.pdf Description: MFS2300BMBA0EP
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 40µA
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MFS2300BMBA0EP MFS2300BMBA0EP NXP USA Inc. FS23DS.pdf Description: MFS2300BMBA0EP
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 40µA
Supplier Device Package: 48-HVQFN (7x7)
auf Bestellung 244 Stücke:
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3+7.9 EUR
10+6.02 EUR
25+5.55 EUR
100+5.04 EUR
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MFS2303BMBA3EP MFS2303BMBA3EP NXP USA Inc. FS23DS.pdf Description: MFS2303BMBA3EP
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 40µA
Supplier Device Package: 48-HVQFN (7x7)
auf Bestellung 216 Stücke:
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2+9.75 EUR
10+7.49 EUR
25+6.92 EUR
100+6.3 EUR
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MFS2400AVMA1ES MFS2400AVMA1ES NXP USA Inc. FS2400.pdf Description: Safety Mini CAN FD SBC
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
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MFS5600AMEA0ES MFS5600AMEA0ES NXP USA Inc. FS5600.pdf Description: DUAL 36V AUTOMOTIVE DC-DC CONTRO
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 32-HVQFN (5x5)
Current - Supply: 140µA
Voltage - Supply: 2.7V ~ 36V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 490 Stücke:
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3+8.24 EUR
10+6.3 EUR
25+5.81 EUR
100+5.28 EUR
490+4.87 EUR
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MFS2320BMBA0EP MFS2320BMBA0EP NXP USA Inc. FS23DS.pdf Description: MFS2320BMBA0EP
Supplier Device Package: 48-HVQFN (7x7)
Current - Supply: 30µA
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 237 Stücke:
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3+8.78 EUR
10+6.71 EUR
25+6.2 EUR
100+5.63 EUR
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MFS2401AVBA0ES MFS2401AVBA0ES NXP USA Inc. FS2400.pdf Description: MFS2401AVBA0ES
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 32-HVQFN (5x5)
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 40V
Operating Temperature: -40°C ~ 115°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
auf Bestellung 490 Stücke:
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3+8.11 EUR
10+6.19 EUR
25+5.71 EUR
100+5.18 EUR
490+4.78 EUR
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MFS2401AVBA1ES MFS2401AVBA1ES NXP USA Inc. FS2400.pdf Description: Safety Mini CAN FD SBC
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 32-HVQFN (5x5)
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 40V
Operating Temperature: -40°C ~ 115°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 127 Stücke:
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3+8.11 EUR
10+6.19 EUR
25+5.71 EUR
100+5.18 EUR
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MFS2621AMDABAD MFS2621AMDABAD NXP USA Inc. FS26_PB.pdf Description: SAFETY SYSTEM BASIS CHIP WITH LO
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
auf Bestellung 249 Stücke:
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2+12.74 EUR
10+9.88 EUR
25+9.17 EUR
100+8.38 EUR
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MFS2633AMBA0AD MFS2633AMBA0AD NXP USA Inc. FS26_PB.pdf Description: SAFETY SYSTEM BASIS CHIP WITH LO
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Current - Supply: 29µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
auf Bestellung 213 Stücke:
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MFS8610BMBA0ES MFS8610BMBA0ES NXP USA Inc. FS8600_SDS.pdf?pspll=1 Description: IC FS86 SYSTEM BASIS CHIP ASIL
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-QFN (7x7)
Applications: Camera
Voltage - Supply: 4.5V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 260 Stücke:
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MFS2613AMDA6AD MFS2613AMDA6AD NXP USA Inc. FS26_PB.pdf Description: SAFETY SYSTEM BASIS CHIP WITH LO
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
auf Bestellung 60 Stücke:
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MFS2613AMDDCAD MFS2613AMDDCAD NXP USA Inc. FS26_PB.pdf Description: SAFETY SYSTEM BASIS CHIP WITH LO
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
auf Bestellung 220 Stücke:
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2+13.52 EUR
10+10.5 EUR
25+9.75 EUR
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MFS8633BMDA0ES MFS8633BMDA0ES NXP USA Inc. FS8600_SDS.pdf?pspll=1 Description: IC FS86 SYSTEM BASIS CHIP ASIL
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-QFN (7x7)
Applications: Camera
Voltage - Supply: 4.5V ~ 36V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 260 Stücke:
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25+9.42 EUR
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MFS8610BMDA0ES MFS8610BMDA0ES NXP USA Inc. FS8600_SDS.pdf?pspll=1 Description: IC FS86 SYSTEM BASIS CHIP ASIL
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-QFN (7x7)
Applications: Camera
Voltage - Supply: 4.5V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
auf Bestellung 250 Stücke:
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MFS8613BMBA0ES MFS8613BMBA0ES NXP USA Inc. FS8600_SDS.pdf?pspll=1 Description: IC FS86 SYSTEM BASIS CHIP ASIL
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-QFN (7x7)
Applications: Camera
Voltage - Supply: 4.5V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.73 EUR
10+10.67 EUR
25+9.9 EUR
100+9.06 EUR
260+8.64 EUR
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S9S12GN48J0VLH NXP USA Inc. Description: S12 CORE,48K FLASH
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
Produkt ist nicht verfügbar
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MGD3162AM580EKR2 NXP USA Inc. SDS_GD3162.pdf Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1000 Stücke
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MGD3162AM580EKT NXP USA Inc. SDS_GD3162.pdf Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
 Mindestbestellmenge: 176 Stücke
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PVF60NN151CMK50 PVF60NN151CMK50 NXP USA Inc. VYBRIDFSERIESEC.pdf Description: IC MCU 32BIT ROMLESS 364BGA
Core Size: 32-Bit Dual-Core
Data Converters: A/D 12bit SAR; D/A 12bit
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C
RAM Size: 1.5MB
Speed: 500MHz
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Supplier Device Package: 364-LFBGA (17x17)
Peripherals: DMA, LVD, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, SCI, SD, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Produkt ist nicht verfügbar
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MC9328MXLVP15 MC9328MXLVP15 NXP USA Inc. MC9328MXL.pdf Description: IC MPU I.MXL 150MHZ 225MAPBGA
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
Display & Interface Controllers: LCD
Graphics Acceleration: No
RAM Controllers: SDRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Supplier Device Package: 225-MAPBGA (13x13)
Voltage - I/O: 1.8V, 3.0V
Core Processor: ARM920T
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 225-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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S32K396EHT1MJBST S32K396EHT1MJBST NXP USA Inc. S32K39-S32K37-DS.pdf Description: S32K396 Arm Cortex-M7
Packaging: Tray
auf Bestellung 707 Stücke:
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1+54.17 EUR
10+43.93 EUR
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S32K394NHT1MJBSR S32K394NHT1MJBSR NXP USA Inc. S32K39-S32K37-DS.pdf Description: S32K394NHT1MJBSR
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, QSPI, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1000 Stücke
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S32K396NHT1MJBSR S32K396NHT1MJBSR NXP USA Inc. S32K39-S32K37-DS.pdf Description: S32K396NHT1MJBSR
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, QSPI, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1000 Stücke
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S32K396EHT1MJBSR S32K396EHT1MJBSR NXP USA Inc. S32K39-S32K37-DS.pdf Description: S32K396EHT1MJBSR
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1000 Stücke
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MPC8245TVV266D MPC8245TVV266D NXP USA Inc. MPC8245T_Series.pdf Description: IC MPU MPC82XX 266MHZ 352TBGA
Packaging: Tray
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
Produkt ist nicht verfügbar
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MPC8245TVV300D MPC8245TVV300D NXP USA Inc. MPC8245T_Series.pdf Description: IC MPU MPC82XX 300MHZ 352TBGA
Additional Interfaces: I2C, I²O, PCI, UART
Graphics Acceleration: No
RAM Controllers: SDRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 352-TBGA (35x35)
Voltage - I/O: 3.3V
Core Processor: PowerPC 603e
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 352-LBGA
Packaging: Tray
Produkt ist nicht verfügbar
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S9S12G48J0CLF S9S12G48J0CLF NXP USA Inc. Description: S12 CORE,64K FLASH,AU
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Number of I/O: 40
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: S12
EEPROM Size: 1.5K x 8
Program Memory Type: FLASH
Produkt ist nicht verfügbar
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S9S12G64J0MLF S9S12G64J0MLF NXP USA Inc. Description: S12 CORE,64K FLASH,AU
Number of I/O: 40
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: S12
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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S9S12G48J0CLFR S9S12G48J0CLFR NXP USA Inc. Description: S12 CORE,64K FLASH,
EEPROM Size: 1.5K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Number of I/O: 40
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: S12
Produkt ist nicht verfügbar
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S9S12G64J0CLFR S9S12G64J0CLFR NXP USA Inc. Description: S12 CORE,64K FLASH,AU
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
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S9S12G64J0CLF S9S12G64J0CLF NXP USA Inc. Description: S12 CORE,64K FLASH,AU
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
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S9S12G48J0MLFR S9S12G48J0MLFR NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
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S9S12G48J0MLF S9S12G48J0MLF NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
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MIMXRT555SFAWCR MIMXRT555SFAWCR NXP USA Inc. IMXRT500EC.pdf Description: IC MCU 32BIT 192KB ROM 141WLCSP
DigiKey Programmable: Not Verified
Number of I/O: 136
Supplier Device Package: 141-WLCSP (4.53x4.53)
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 10x12b
Core Processor: ARM® Cortex®-M33
Program Memory Type: ROM
Oscillator Type: External, Internal
Operating Temperature: -20°C ~ 70°C (TA)
RAM Size: 5M x 8
Program Memory Size: 192KB (192K x 8)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 141-XFBGA, WLCSP
Packaging: Cut Tape (CT)
auf Bestellung 5418 Stücke:
Lieferzeit 10-14 Tag (e)
1+32.4 EUR
10+25.91 EUR
25+24.29 EUR
100+22.51 EUR
250+21.67 EUR
500+21.15 EUR
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MIMXRT555SFFOCR NXP USA Inc. IMXRT500EC.pdf Description: IC MCU 32BIT 192KB ROM 249FOWLP
Packaging: Cut Tape (CT)
Package / Case: 249-WFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 249-FOWLP (7x7)
Number of I/O: 136
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
1+44.65 EUR
10+35.81 EUR
100+30.58 EUR
500+30.18 EUR
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S32K376NHT1MJBST S32K39%2C%20S32K37.pdf
S32K376NHT1MJBST
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 96x12b SAR, 4x16b Sigma-Delta
Core Size: 32-Bit 3-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINBus, SPI, UART/USART, Zipwire
Peripherals: DMA, Ethernet, I2S, PWM
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 237
auf Bestellung 760 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+58.91 EUR
10+48.17 EUR
25+46.57 EUR
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S32K366NHT1MJBST
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
Operating Temperature: -40°C ~ 125°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: PWM
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 152 Stücke
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S32K366EHT1MJBST S32K39-S32K37-DS.pdf
S32K366EHT1MJBST
Hersteller: NXP USA Inc.
Description: S32K366EHT1MJBST
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 704K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART
Peripherals: PWM
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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LPC845M301JHI48Y LPC84x.pdf
LPC845M301JHI48Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48HVQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, Capacitive Touch, DMA, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 2597 Stücke:
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AnzahlPreis
4+4.56 EUR
10+3.42 EUR
25+3.13 EUR
100+2.81 EUR
250+2.66 EUR
500+2.59 EUR
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MFS8630BMDA0ES
MFS8630BMDA0ES
Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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SAF4000EL/102Z22AY
Hersteller: NXP USA Inc.
Description: SAF4000EL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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SAF4000EL/102Z22AK
Hersteller: NXP USA Inc.
Description: SAF4000EL
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 630 Stücke
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AFT18H357-24NR6 RF_%20Gde.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM1230-42
Packaging: Tape & Reel (TR)
Package / Case: OM-1230-4L2L
Mounting Type: Chassis Mount
Frequency: 1.81GHz
Configuration: Dual
Power - Output: 63W
Gain: 17.5dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L2L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 800 mA
Produkt ist nicht verfügbar
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MC9S08LG16CLF MC9S08LG32.pdf
MC9S08LG16CLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 18KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 18KB (18K x 8)
RAM Size: 1.9K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 9x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 613 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
4+5.33 EUR
10+4 EUR
25+3.67 EUR
80+3.35 EUR
230+3.14 EUR
440+3.04 EUR
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FS32K142WAT0WLFR S32K1xx.pdf
Hersteller: NXP USA Inc.
Description: S32K142W ARM CORTEX-M4F, UP TO 8
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 23x12b SAR; D/A 6x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
Produkt ist nicht verfügbar
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FS32K142WAT0WLHR S32K1xx.pdf
Hersteller: NXP USA Inc.
Description: S32K142W ARM CORTEX-M4F, UP TO 8
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 29x12b SAR; D/A 8x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
Produkt ist nicht verfügbar
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FS32K144WAT0WLFR S32K1xx.pdf
FS32K144WAT0WLFR
Hersteller: NXP USA Inc.
Description: S32K144W ARM CORTEX-M4F, UP TO 8
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 23x12b SAR; D/A 6x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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MCF51QU32VHS MCF51QW256.pdf
MCF51QU32VHS
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 44MAPLGA
Packaging: Tray
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 11x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 2450 Stücke
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MC9S08DZ128CLLR MC9S08DZ128.pdf
MC9S08DZ128CLLR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 100LQFP
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 87
Supplier Device Package: 100-LQFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x12b
Core Processor: S08
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1000+18.2 EUR
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MC9S08DZ128CLLR MC9S08DZ128.pdf
MC9S08DZ128CLLR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 100LQFP
Core Size: 8-Bit
Data Converters: A/D 24x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 87
Supplier Device Package: 100-LQFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+28.72 EUR
10+22.96 EUR
100+19.39 EUR
500+19.27 EUR
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MC9S08DZ128CLL MC9S08DZ128.pdf
MC9S08DZ128CLL
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 100LQFP
DigiKey Programmable: Verified
Number of I/O: 87
Supplier Device Package: 100-LQFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
auf Bestellung 450 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+28.72 EUR
10+22.96 EUR
80+19.39 EUR
450+19.27 EUR
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LFBGARBZ1BO
Hersteller: NXP USA Inc.
Description: NXP LEAD FREE 522 PIN 1.0 MM PIT
Packaging: Bulk
Produkt ist nicht verfügbar
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PNEV5190BP RM00264.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR PN5190
Utilized IC / Part: PN5190
Contents: Board(s)
Supplied Contents: Board(s)
Type: Near Field Communication (NFC)
Packaging: Bulk
Produkt ist nicht verfügbar
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LFTAS32K3H1H2A
Hersteller: NXP USA Inc.
Description: IC
Module/Board Type: Adapter Board
For Use With/Related Products: S32K3
Packaging: Box
Produkt ist nicht verfügbar
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LFVBBK77CWA
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5777C 416 PIN 1.0MM V
Accessory Type: Base Board
For Use With/Related Products: MPC5777C
Packaging: Bulk
Produkt ist nicht verfügbar
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RDWWAB-8897-S1
Hersteller: NXP USA Inc.
Description: RDWWAB-8897-S1
Packaging: Bulk
Produkt ist nicht verfügbar
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XS32K388EVB-Q289
Hersteller: NXP USA Inc.
Description: IC
Packaging: Bulk
Produkt ist nicht verfügbar
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T4241NXE7TTB T4240T4160FS.pdf
T4241NXE7TTB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T4 1.8GHZ 1932BGA
Packaging: Bulk
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (13), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 24 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
auf Bestellung 9 Stücke:
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AnzahlPreis
1+3285.02 EUR
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T4241NXE7TTB T4240T4160FS.pdf
T4241NXE7TTB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T4 1.8GHZ 1932BGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (13), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 24 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
Produkt ist nicht verfügbar
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MFS2300BMBA0EP FS23DS.pdf
MFS2300BMBA0EP
Hersteller: NXP USA Inc.
Description: MFS2300BMBA0EP
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 40µA
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MFS2300BMBA0EP FS23DS.pdf
MFS2300BMBA0EP
Hersteller: NXP USA Inc.
Description: MFS2300BMBA0EP
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 40µA
Supplier Device Package: 48-HVQFN (7x7)
auf Bestellung 244 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3+7.9 EUR
10+6.02 EUR
25+5.55 EUR
100+5.04 EUR
Mindestbestellmenge: 3 Stücke
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MFS2303BMBA3EP FS23DS.pdf
MFS2303BMBA3EP
Hersteller: NXP USA Inc.
Description: MFS2303BMBA3EP
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 40µA
Supplier Device Package: 48-HVQFN (7x7)
auf Bestellung 216 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+9.75 EUR
10+7.49 EUR
25+6.92 EUR
100+6.3 EUR
Mindestbestellmenge: 2 Stücke
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MFS2400AVMA1ES FS2400.pdf
MFS2400AVMA1ES
Hersteller: NXP USA Inc.
Description: Safety Mini CAN FD SBC
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2 Stücke:
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MFS5600AMEA0ES FS5600.pdf
MFS5600AMEA0ES
Hersteller: NXP USA Inc.
Description: DUAL 36V AUTOMOTIVE DC-DC CONTRO
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 32-HVQFN (5x5)
Current - Supply: 140µA
Voltage - Supply: 2.7V ~ 36V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3+8.24 EUR
10+6.3 EUR
25+5.81 EUR
100+5.28 EUR
490+4.87 EUR
Mindestbestellmenge: 3 Stücke
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MFS2320BMBA0EP FS23DS.pdf
MFS2320BMBA0EP
Hersteller: NXP USA Inc.
Description: MFS2320BMBA0EP
Supplier Device Package: 48-HVQFN (7x7)
Current - Supply: 30µA
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 237 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3+8.78 EUR
10+6.71 EUR
25+6.2 EUR
100+5.63 EUR
Mindestbestellmenge: 3 Stücke
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MFS2401AVBA0ES FS2400.pdf
MFS2401AVBA0ES
Hersteller: NXP USA Inc.
Description: MFS2401AVBA0ES
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 32-HVQFN (5x5)
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 40V
Operating Temperature: -40°C ~ 115°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3+8.11 EUR
10+6.19 EUR
25+5.71 EUR
100+5.18 EUR
490+4.78 EUR
Mindestbestellmenge: 3 Stücke
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MFS2401AVBA1ES FS2400.pdf
MFS2401AVBA1ES
Hersteller: NXP USA Inc.
Description: Safety Mini CAN FD SBC
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 32-HVQFN (5x5)
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 40V
Operating Temperature: -40°C ~ 115°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 127 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3+8.11 EUR
10+6.19 EUR
25+5.71 EUR
100+5.18 EUR
Mindestbestellmenge: 3 Stücke
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MFS2621AMDABAD FS26_PB.pdf
MFS2621AMDABAD
Hersteller: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
auf Bestellung 249 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+12.74 EUR
10+9.88 EUR
25+9.17 EUR
100+8.38 EUR
Mindestbestellmenge: 2 Stücke
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MFS2633AMBA0AD FS26_PB.pdf
MFS2633AMBA0AD
Hersteller: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Current - Supply: 29µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
auf Bestellung 213 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+13.13 EUR
10+10.19 EUR
25+9.46 EUR
100+8.65 EUR
Mindestbestellmenge: 2 Stücke
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MFS8610BMBA0ES FS8600_SDS.pdf?pspll=1
MFS8610BMBA0ES
Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-QFN (7x7)
Applications: Camera
Voltage - Supply: 4.5V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+12.11 EUR
10+9.37 EUR
25+8.68 EUR
100+7.93 EUR
260+7.56 EUR
Mindestbestellmenge: 2 Stücke
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MFS2613AMDA6AD FS26_PB.pdf
MFS2613AMDA6AD
Hersteller: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+13.52 EUR
10+10.5 EUR
25+9.75 EUR
Mindestbestellmenge: 2 Stücke
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MFS2613AMDDCAD FS26_PB.pdf
MFS2613AMDDCAD
Hersteller: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
auf Bestellung 220 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+13.52 EUR
10+10.5 EUR
25+9.75 EUR
100+8.92 EUR
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MFS8633BMDA0ES FS8600_SDS.pdf?pspll=1
MFS8633BMDA0ES
Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-QFN (7x7)
Applications: Camera
Voltage - Supply: 4.5V ~ 36V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 260 Stücke:
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AnzahlPreis
2+13.09 EUR
10+10.16 EUR
25+9.42 EUR
100+8.62 EUR
260+8.22 EUR
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MFS8610BMDA0ES FS8600_SDS.pdf?pspll=1
MFS8610BMDA0ES
Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-QFN (7x7)
Applications: Camera
Voltage - Supply: 4.5V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
auf Bestellung 250 Stücke:
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AnzahlPreis
2+13.34 EUR
10+10.36 EUR
25+9.61 EUR
100+8.79 EUR
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MFS8613BMBA0ES FS8600_SDS.pdf?pspll=1
MFS8613BMBA0ES
Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-QFN (7x7)
Applications: Camera
Voltage - Supply: 4.5V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+13.73 EUR
10+10.67 EUR
25+9.9 EUR
100+9.06 EUR
260+8.64 EUR
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S9S12GN48J0VLH
Hersteller: NXP USA Inc.
Description: S12 CORE,48K FLASH
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
Produkt ist nicht verfügbar
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MGD3162AM580EKR2 SDS_GD3162.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MGD3162AM580EKT SDS_GD3162.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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PVF60NN151CMK50 VYBRIDFSERIESEC.pdf
PVF60NN151CMK50
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 364BGA
Core Size: 32-Bit Dual-Core
Data Converters: A/D 12bit SAR; D/A 12bit
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C
RAM Size: 1.5MB
Speed: 500MHz
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Supplier Device Package: 364-LFBGA (17x17)
Peripherals: DMA, LVD, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, SCI, SD, SPI, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Produkt ist nicht verfügbar
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MC9328MXLVP15 MC9328MXL.pdf
MC9328MXLVP15
Hersteller: NXP USA Inc.
Description: IC MPU I.MXL 150MHZ 225MAPBGA
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
Display & Interface Controllers: LCD
Graphics Acceleration: No
RAM Controllers: SDRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Supplier Device Package: 225-MAPBGA (13x13)
Voltage - I/O: 1.8V, 3.0V
Core Processor: ARM920T
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 225-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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S32K396EHT1MJBST S32K39-S32K37-DS.pdf
S32K396EHT1MJBST
Hersteller: NXP USA Inc.
Description: S32K396 Arm Cortex-M7
Packaging: Tray
auf Bestellung 707 Stücke:
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AnzahlPreis
1+54.17 EUR
10+43.93 EUR
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S32K394NHT1MJBSR S32K39-S32K37-DS.pdf
S32K394NHT1MJBSR
Hersteller: NXP USA Inc.
Description: S32K394NHT1MJBSR
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, QSPI, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K396NHT1MJBSR S32K39-S32K37-DS.pdf
S32K396NHT1MJBSR
Hersteller: NXP USA Inc.
Description: S32K396NHT1MJBSR
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, QSPI, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K396EHT1MJBSR S32K39-S32K37-DS.pdf
S32K396EHT1MJBSR
Hersteller: NXP USA Inc.
Description: S32K396EHT1MJBSR
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MPC8245TVV266D MPC8245T_Series.pdf
MPC8245TVV266D
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 352TBGA
Packaging: Tray
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
Produkt ist nicht verfügbar
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MPC8245TVV300D MPC8245T_Series.pdf
MPC8245TVV300D
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 300MHZ 352TBGA
Additional Interfaces: I2C, I²O, PCI, UART
Graphics Acceleration: No
RAM Controllers: SDRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 352-TBGA (35x35)
Voltage - I/O: 3.3V
Core Processor: PowerPC 603e
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 352-LBGA
Packaging: Tray
Produkt ist nicht verfügbar
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S9S12G48J0CLF
S9S12G48J0CLF
Hersteller: NXP USA Inc.
Description: S12 CORE,64K FLASH,AU
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Number of I/O: 40
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: S12
EEPROM Size: 1.5K x 8
Program Memory Type: FLASH
Produkt ist nicht verfügbar
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S9S12G64J0MLF
S9S12G64J0MLF
Hersteller: NXP USA Inc.
Description: S12 CORE,64K FLASH,AU
Number of I/O: 40
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: S12
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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S9S12G48J0CLFR
S9S12G48J0CLFR
Hersteller: NXP USA Inc.
Description: S12 CORE,64K FLASH,
EEPROM Size: 1.5K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Number of I/O: 40
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: S12
Produkt ist nicht verfügbar
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S9S12G64J0CLFR
S9S12G64J0CLFR
Hersteller: NXP USA Inc.
Description: S12 CORE,64K FLASH,AU
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
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S9S12G64J0CLF
S9S12G64J0CLF
Hersteller: NXP USA Inc.
Description: S12 CORE,64K FLASH,AU
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
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S9S12G48J0MLFR
S9S12G48J0MLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
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S9S12G48J0MLF
S9S12G48J0MLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
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MIMXRT555SFAWCR IMXRT500EC.pdf
MIMXRT555SFAWCR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 192KB ROM 141WLCSP
DigiKey Programmable: Not Verified
Number of I/O: 136
Supplier Device Package: 141-WLCSP (4.53x4.53)
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 10x12b
Core Processor: ARM® Cortex®-M33
Program Memory Type: ROM
Oscillator Type: External, Internal
Operating Temperature: -20°C ~ 70°C (TA)
RAM Size: 5M x 8
Program Memory Size: 192KB (192K x 8)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 141-XFBGA, WLCSP
Packaging: Cut Tape (CT)
auf Bestellung 5418 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+32.4 EUR
10+25.91 EUR
25+24.29 EUR
100+22.51 EUR
250+21.67 EUR
500+21.15 EUR
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MIMXRT555SFFOCR IMXRT500EC.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 192KB ROM 249FOWLP
Packaging: Cut Tape (CT)
Package / Case: 249-WFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 249-FOWLP (7x7)
Number of I/O: 136
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+44.65 EUR
10+35.81 EUR
100+30.58 EUR
500+30.18 EUR
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