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NT2H2331G0DUFZ NXP USA Inc. Description: NT2H2331G0DUF
Packaging: Tray
Produkt ist nicht verfügbar
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NT2H2331S0DUDZ NXP USA Inc. Description: NT2H2331S0DUD
Packaging: Tray
Produkt ist nicht verfügbar
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74HC4020D,652 74HC4020D,652 NXP USA Inc. 74HC_HCT4020.pdf Description: IC 14-STAGE BINARY RIPPLE 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 16-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 109 MHz
Number of Bits per Element: 14
auf Bestellung 26042 Stücke:
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1110+0.44 EUR
Mindestbestellmenge: 1110
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MFS2323BMBA5EP MFS2323BMBA5EP NXP USA Inc. FS23DS.pdf Description: MFS2323BMBA5EP
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 30µA
Supplier Device Package: 48-HVQFN (7x7)
auf Bestellung 237 Stücke:
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2+10.44 EUR
10+8.04 EUR
25+7.44 EUR
100+6.78 EUR
Mindestbestellmenge: 2
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MFS2323BMBA5EPR2 MFS2323BMBA5EPR2 NXP USA Inc. Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 30µA
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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FC32K146HAT0VLLT NXP USA Inc. Description: S32K146 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
Produkt ist nicht verfügbar
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MCIMX6S8DVM10AD MCIMX6S8DVM10AD NXP USA Inc. IMX6SDLCEC.pdf Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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SLS1026AXN8T1A NXP USA Inc. Description: SLS1026A XT 1.8GHZ DDR 2100 MT/
Packaging: Tray
Produkt ist nicht verfügbar
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MRF1K50H-13MHZ NXP USA Inc. MRF1K50H.pdf Description: MRF1K50H-13MHZ
Packaging: Bulk
Contents: Board(s)
Produkt ist nicht verfügbar
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MRF1K50H-88MHZ NXP USA Inc. MRF1K50H.pdf Description: MRF1K50H-88MHZ
Packaging: Bulk
Contents: Board(s)
Produkt ist nicht verfügbar
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MRF1K50N-88MHZ NXP USA Inc. MRF1K50N.pdf Description: MRF1K50N-88MHZ
Packaging: Bulk
Contents: Board(s)
Produkt ist nicht verfügbar
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S9S12ZVLS1ACFMR NXP USA Inc. Description: S12Z CPU, 16K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 18
Produkt ist nicht verfügbar
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S9S12ZVLS1ACFM NXP USA Inc. Description: S12Z CPU, 16K FLASH
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 18
Produkt ist nicht verfügbar
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S9S12ZVL32AVLFR NXP USA Inc. Description: S12Z CPU, 32K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 10x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
Produkt ist nicht verfügbar
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S9S12ZVL32AVLF S9S12ZVL32AVLF NXP USA Inc. Description: S12Z CPU, 32K FLASH
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 10x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
Produkt ist nicht verfügbar
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MPC8241LVR200D MPC8241LVR200D NXP USA Inc. MPC8241.pdf Description: IC MPU MPC82XX 200MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
auf Bestellung 5 Stücke:
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1+76.01 EUR
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AFSC5G35E37-EVB NXP USA Inc. Description: AFSC5G35E37-EVB
Packaging: Bulk
Produkt ist nicht verfügbar
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CBT3384DK,118 CBT3384DK,118 NXP USA Inc. CBT3384_Nov2009.pdf Description: IC BUS SWITCH 10BIT 24SSOP
Packaging: Bulk
auf Bestellung 84600 Stücke:
Lieferzeit 10-14 Tag (e)
1110+0.44 EUR
Mindestbestellmenge: 1110
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74CBTLV3384DK,118 74CBTLV3384DK,118 NXP USA Inc. PHGLS23839-1.pdf?t.download=true&u=5oefqw Description: IC BUS SWITCH 5 X 1:1 24SSOP
Packaging: Bulk
Package / Case: 24-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 5 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.3V ~ 3.6V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 24-SSOP
auf Bestellung 22500 Stücke:
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386+1.29 EUR
Mindestbestellmenge: 386
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LFBGAMS1A NXP USA Inc. Description: 256 PIN 1.0MM PGA SOCKET SPACER
Packaging: Bulk
Module/Board Type: Socket Module - PGA
Produkt ist nicht verfügbar
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MKE04Z128VLD4R MKE04Z128VLD4R NXP USA Inc. MKE04P80M48SF0.pdf Description: KINETIS KE04 48MHZ CORTEX-M0+ 5V
Packaging: Cut Tape (CT)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 38
DigiKey Programmable: Not Verified
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.47 EUR
10+5.98 EUR
25+5.69 EUR
100+5.42 EUR
250+5.16 EUR
500+4.98 EUR
Mindestbestellmenge: 3
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MF0ULH3101DUDV NXP USA Inc. Description: MF0ULH3101DUDV
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF0ULH3101DUFV NXP USA Inc. Description: MF0ULH3101DUFV
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAF7771EL/200Z13BY NXP USA Inc. Description: SAF7771EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7771EL/200Z13BK NXP USA Inc. Description: SAF7771EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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MC9S08GW32CLH MC9S08GW32CLH NXP USA Inc. FSCLS07409-1.pdf?t.download=true&u=5oefqw Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x16b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LCD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
DigiKey Programmable: Not Verified
auf Bestellung 800 Stücke:
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69+7.17 EUR
Mindestbestellmenge: 69
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MC9S08GW32CLH MC9S08GW32CLH NXP USA Inc. FSCLS07409-1.pdf?t.download=true&u=5oefqw Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x16b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LCD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA9026T/1Y TEA9026T/1Y NXP USA Inc. TEA9026T.pdf Description: TEA9026T
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 19.1V ~ 36V
Applications: Resonant Converter Controller
Supplier Device Package: 16-SO
Current - Supply: 5.6 mA
Produkt ist nicht verfügbar
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MPC8360VVAJDGA MPC8360VVAJDGA NXP USA Inc. MPC8360E%2C8358E.pdf Description: IC MPU MPC83XX 533MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Produkt ist nicht verfügbar
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LD6805K/12P,115 LD6805K/12P,115 NXP USA Inc. LD6805.pdf Description: IC REG LIN 1.2V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 1.2V
Control Features: Enable
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
auf Bestellung 459990 Stücke:
Lieferzeit 10-14 Tag (e)
2959+0.16 EUR
Mindestbestellmenge: 2959
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MCIMX507CVM8B MCIMX507CVM8B NXP USA Inc. IMX50CEC.pdf Description: IC MPU I.MX50 800MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, LPDDR2, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: LCD
Security Features: Boot Security, Cryptography, Secure JTAG
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
auf Bestellung 439 Stücke:
Lieferzeit 10-14 Tag (e)
1+44.77 EUR
10+36.16 EUR
25+34.01 EUR
100+31.64 EUR
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LS1088ASE7MQA LS1088ASE7MQA NXP USA Inc. LS1088AFS.pdf Description: IC MPU QORIQ 1.2GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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BTA310-600C,127 BTA310-600C,127 NXP USA Inc. PHGLS24489-1.pdf?t.download=true&u=5oefqw Description: TRIAC 600V 10A TO220AB
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Triac Type: Standard
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 35 mA
Current - Gate Trigger (Igt) (Max): 35 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 85A, 93A
Voltage - Gate Trigger (Vgt) (Max): 1.5 V
Supplier Device Package: TO-220AB
Current - On State (It (RMS)) (Max): 10 A
Voltage - Off State: 600 V
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
675+0.74 EUR
Mindestbestellmenge: 675
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MPC862PCVR66B MPC862PCVR66B NXP USA Inc. MPC862EC%2C857%28T%2CDSL%29.pdf Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 115°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
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74HCT4016D,112 74HCT4016D,112 NXP USA Inc. 74HC4016.pdf Description: IC SWITCH SPST-NO X 2 95OHM 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 95Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 14-SO
Voltage - Supply, Single (V+): 4.5V ~ 5.5V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 5Ohm
Switch Time (Ton, Toff) (Max): 30ns, 44ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 1µA
Number of Circuits: 2
Produkt ist nicht verfügbar
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74LV86PW,118 74LV86PW,118 NXP USA Inc. 74LV86_Rev3_2017.pdf Description: IC GATE XOR 4CH 2-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 0.9V ~ 2V
Input Logic Level - Low: 0.3V ~ 0.8V
Max Propagation Delay @ V, Max CL: 13ns @ 3.3V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
3000+0.17 EUR
Mindestbestellmenge: 3000
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MC33FS8520A0KS MC33FS8520A0KS NXP USA Inc. FS84_FS85C_DS.pdf Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS8510D3KS NXP USA Inc. Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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BTS7202UHP NXP USA Inc. BTS7202U.pdf Description: RX FRONT-END MODULE, 3.3-4.2 GHZ
Features: 5V Supply Voltage
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Frequency: 3.3GHz ~ 4.2GHz
RF Type: 5G, LTE
Supplier Device Package: 40-HVQFN (6x6)
Produkt ist nicht verfügbar
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MC56F83783MLH NXP USA Inc. MC56F837XXDS.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SPI
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC9S08QE16CWL MC9S08QE16CWL NXP USA Inc. MC9S08QE32.pdf Description: IC MCU 8BIT 16KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 22
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12GN16J0CLF NXP USA Inc. Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
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MC33PF8200EMES MC33PF8200EMES NXP USA Inc. PF8100_PF8200.pdf Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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SPC5604CK0CLL6 SPC5604CK0CLL6 NXP USA Inc. Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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KIT34FS6408EVB NXP USA Inc. KT34FS6407-34FS6408UG.pdf Description: EVALUATION KIT - FS6408 SAFE SY
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: MC34FS6408
Supplied Contents: Board(s)
Contents: Board(s)
Produkt ist nicht verfügbar
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S912ZVL64AVLC S912ZVL64AVLC NXP USA Inc. MC9S12ZVLRM.pdf Description: S12Z CPU, 64K FLASH
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Supplier Device Package: 32-LQFP (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
74AHC1G06GV,125 74AHC1G06GV,125 NXP USA Inc. 74AHC%28T%291G06.pdf Description: IC INVERTER 1CH 1-INP 5TSOP
Features: Open Drain
Packaging: Tape & Reel (TR)
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Current - Output High, Low: -, 8mA
Number of Inputs: 1
Supplier Device Package: 5-TSOP
Input Logic Level - High: 1.5V ~ 3.85V
Input Logic Level - Low: 0.5V ~ 1.65V
Max Propagation Delay @ V, Max CL: 7ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 1 µA
Produkt ist nicht verfügbar
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74AHCT1G06GV,125 74AHCT1G06GV,125 NXP USA Inc. 74AHC%28T%291G06.pdf Description: IC INVERTER 1CH 1-INP 5TSOP
Features: Open Drain
Packaging: Tape & Reel (TR)
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: -, 8mA
Number of Inputs: 1
Supplier Device Package: 5-TSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 1 µA
Produkt ist nicht verfügbar
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MFS8630BMBA0ESR2 MFS8630BMBA0ESR2 NXP USA Inc. Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 36V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MFS8630BMBA0ES MFS8630BMBA0ES NXP USA Inc. Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MRF7S19120NR1 MRF7S19120NR1 NXP USA Inc. MRF7S19120NR1.pdf Description: RF MOSFET LDMOS 28V TO270-4
Packaging: Tape & Reel (TR)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 1.99GHz
Power - Output: 36W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.2 A
Produkt ist nicht verfügbar
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MFS8623BMDA0ESR2 MFS8623BMDA0ESR2 NXP USA Inc. FS8600_SDS.pdf Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 36V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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LFDALT NXP USA Inc. Description: 144 PIN 0.5MM QFP ZIF SOCKET ADA
Packaging: Bulk
Module/Board Type: Socket Module - QFP
Produkt ist nicht verfügbar
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LFBGARBT4AO NXP USA Inc. Description: SURFACE MOUNT PGA SOCKET FOR 292
Packaging: Bulk
Module/Board Type: Socket Module - PGA
Produkt ist nicht verfügbar
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MFS8621BMDA0ESR2 MFS8621BMDA0ESR2 NXP USA Inc. FS8600_SDS.pdf Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 36V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MFS8621BMDA0ES MFS8621BMDA0ES NXP USA Inc. Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC9S08PB8MTGR NXP USA Inc. Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 14
Produkt ist nicht verfügbar
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LFMAJ46CS1A NXP USA Inc. Description: QORIVVA MPC5646C 256 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5646C
Type: Debugger
Contents: Board(s)
Produkt ist nicht verfügbar
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MCIMX286DVM4BR NXP USA Inc. IMX28CEC.pdf Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Produkt ist nicht verfügbar
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LFJ33INTPQA NXP USA Inc. Description: QORIVVA MPC5633M ON A 208 PIN 1.
Packaging: Bulk
For Use With/Related Products: MPC5633M
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
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NT2H2331G0DUFZ
Hersteller: NXP USA Inc.
Description: NT2H2331G0DUF
Packaging: Tray
Produkt ist nicht verfügbar
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NT2H2331S0DUDZ
Hersteller: NXP USA Inc.
Description: NT2H2331S0DUD
Packaging: Tray
Produkt ist nicht verfügbar
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74HC4020D,652 74HC_HCT4020.pdf
74HC4020D,652
Hersteller: NXP USA Inc.
Description: IC 14-STAGE BINARY RIPPLE 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 16-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 109 MHz
Number of Bits per Element: 14
auf Bestellung 26042 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1110+0.44 EUR
Mindestbestellmenge: 1110
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MFS2323BMBA5EP FS23DS.pdf
MFS2323BMBA5EP
Hersteller: NXP USA Inc.
Description: MFS2323BMBA5EP
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 30µA
Supplier Device Package: 48-HVQFN (7x7)
auf Bestellung 237 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+10.44 EUR
10+8.04 EUR
25+7.44 EUR
100+6.78 EUR
Mindestbestellmenge: 2
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MFS2323BMBA5EPR2
MFS2323BMBA5EPR2
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 30µA
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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FC32K146HAT0VLLT
Hersteller: NXP USA Inc.
Description: S32K146 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
Produkt ist nicht verfügbar
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MCIMX6S8DVM10AD IMX6SDLCEC.pdf
MCIMX6S8DVM10AD
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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SLS1026AXN8T1A
Hersteller: NXP USA Inc.
Description: SLS1026A XT 1.8GHZ DDR 2100 MT/
Packaging: Tray
Produkt ist nicht verfügbar
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MRF1K50H-13MHZ MRF1K50H.pdf
Hersteller: NXP USA Inc.
Description: MRF1K50H-13MHZ
Packaging: Bulk
Contents: Board(s)
Produkt ist nicht verfügbar
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MRF1K50H-88MHZ MRF1K50H.pdf
Hersteller: NXP USA Inc.
Description: MRF1K50H-88MHZ
Packaging: Bulk
Contents: Board(s)
Produkt ist nicht verfügbar
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MRF1K50N-88MHZ MRF1K50N.pdf
Hersteller: NXP USA Inc.
Description: MRF1K50N-88MHZ
Packaging: Bulk
Contents: Board(s)
Produkt ist nicht verfügbar
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S9S12ZVLS1ACFMR
Hersteller: NXP USA Inc.
Description: S12Z CPU, 16K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 18
Produkt ist nicht verfügbar
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S9S12ZVLS1ACFM
Hersteller: NXP USA Inc.
Description: S12Z CPU, 16K FLASH
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 18
Produkt ist nicht verfügbar
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S9S12ZVL32AVLFR
Hersteller: NXP USA Inc.
Description: S12Z CPU, 32K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 10x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
Produkt ist nicht verfügbar
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S9S12ZVL32AVLF
S9S12ZVL32AVLF
Hersteller: NXP USA Inc.
Description: S12Z CPU, 32K FLASH
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 10x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
Produkt ist nicht verfügbar
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MPC8241LVR200D MPC8241.pdf
MPC8241LVR200D
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 200MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+76.01 EUR
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AFSC5G35E37-EVB
Hersteller: NXP USA Inc.
Description: AFSC5G35E37-EVB
Packaging: Bulk
Produkt ist nicht verfügbar
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CBT3384DK,118 CBT3384_Nov2009.pdf
CBT3384DK,118
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 10BIT 24SSOP
Packaging: Bulk
auf Bestellung 84600 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1110+0.44 EUR
Mindestbestellmenge: 1110
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74CBTLV3384DK,118 PHGLS23839-1.pdf?t.download=true&u=5oefqw
74CBTLV3384DK,118
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 5 X 1:1 24SSOP
Packaging: Bulk
Package / Case: 24-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 5 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.3V ~ 3.6V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 24-SSOP
auf Bestellung 22500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
386+1.29 EUR
Mindestbestellmenge: 386
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LFBGAMS1A
Hersteller: NXP USA Inc.
Description: 256 PIN 1.0MM PGA SOCKET SPACER
Packaging: Bulk
Module/Board Type: Socket Module - PGA
Produkt ist nicht verfügbar
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MKE04Z128VLD4R MKE04P80M48SF0.pdf
MKE04Z128VLD4R
Hersteller: NXP USA Inc.
Description: KINETIS KE04 48MHZ CORTEX-M0+ 5V
Packaging: Cut Tape (CT)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 38
DigiKey Programmable: Not Verified
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+8.47 EUR
10+5.98 EUR
25+5.69 EUR
100+5.42 EUR
250+5.16 EUR
500+4.98 EUR
Mindestbestellmenge: 3
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MF0ULH3101DUDV
Hersteller: NXP USA Inc.
Description: MF0ULH3101DUDV
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF0ULH3101DUFV
Hersteller: NXP USA Inc.
Description: MF0ULH3101DUFV
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAF7771EL/200Z13BY
Hersteller: NXP USA Inc.
Description: SAF7771EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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SAF7771EL/200Z13BK
Hersteller: NXP USA Inc.
Description: SAF7771EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
Produkt ist nicht verfügbar
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MC9S08GW32CLH FSCLS07409-1.pdf?t.download=true&u=5oefqw
MC9S08GW32CLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x16b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LCD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
DigiKey Programmable: Not Verified
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
69+7.17 EUR
Mindestbestellmenge: 69
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MC9S08GW32CLH FSCLS07409-1.pdf?t.download=true&u=5oefqw
MC9S08GW32CLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x16b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LCD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA9026T/1Y TEA9026T.pdf
TEA9026T/1Y
Hersteller: NXP USA Inc.
Description: TEA9026T
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 19.1V ~ 36V
Applications: Resonant Converter Controller
Supplier Device Package: 16-SO
Current - Supply: 5.6 mA
Produkt ist nicht verfügbar
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MPC8360VVAJDGA MPC8360E%2C8358E.pdf
MPC8360VVAJDGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Produkt ist nicht verfügbar
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LD6805K/12P,115 LD6805.pdf
LD6805K/12P,115
Hersteller: NXP USA Inc.
Description: IC REG LIN 1.2V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 1.2V
Control Features: Enable
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
auf Bestellung 459990 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2959+0.16 EUR
Mindestbestellmenge: 2959
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MCIMX507CVM8B IMX50CEC.pdf
MCIMX507CVM8B
Hersteller: NXP USA Inc.
Description: IC MPU I.MX50 800MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, LPDDR2, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: LCD
Security Features: Boot Security, Cryptography, Secure JTAG
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
auf Bestellung 439 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+44.77 EUR
10+36.16 EUR
25+34.01 EUR
100+31.64 EUR
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LS1088ASE7MQA LS1088AFS.pdf
LS1088ASE7MQA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.2GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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BTA310-600C,127 PHGLS24489-1.pdf?t.download=true&u=5oefqw
BTA310-600C,127
Hersteller: NXP USA Inc.
Description: TRIAC 600V 10A TO220AB
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Triac Type: Standard
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 35 mA
Current - Gate Trigger (Igt) (Max): 35 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 85A, 93A
Voltage - Gate Trigger (Vgt) (Max): 1.5 V
Supplier Device Package: TO-220AB
Current - On State (It (RMS)) (Max): 10 A
Voltage - Off State: 600 V
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
675+0.74 EUR
Mindestbestellmenge: 675
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MPC862PCVR66B MPC862EC%2C857%28T%2CDSL%29.pdf
MPC862PCVR66B
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 115°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
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74HCT4016D,112 74HC4016.pdf
74HCT4016D,112
Hersteller: NXP USA Inc.
Description: IC SWITCH SPST-NO X 2 95OHM 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 95Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 14-SO
Voltage - Supply, Single (V+): 4.5V ~ 5.5V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 5Ohm
Switch Time (Ton, Toff) (Max): 30ns, 44ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 1µA
Number of Circuits: 2
Produkt ist nicht verfügbar
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74LV86PW,118 74LV86_Rev3_2017.pdf
74LV86PW,118
Hersteller: NXP USA Inc.
Description: IC GATE XOR 4CH 2-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 0.9V ~ 2V
Input Logic Level - Low: 0.3V ~ 0.8V
Max Propagation Delay @ V, Max CL: 13ns @ 3.3V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3000+0.17 EUR
Mindestbestellmenge: 3000
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MC33FS8520A0KS FS84_FS85C_DS.pdf
MC33FS8520A0KS
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS8510D3KS
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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BTS7202UHP BTS7202U.pdf
Hersteller: NXP USA Inc.
Description: RX FRONT-END MODULE, 3.3-4.2 GHZ
Features: 5V Supply Voltage
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Frequency: 3.3GHz ~ 4.2GHz
RF Type: 5G, LTE
Supplier Device Package: 40-HVQFN (6x6)
Produkt ist nicht verfügbar
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MC56F83783MLH MC56F837XXDS.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SPI
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
Produkt ist nicht verfügbar
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MC9S08QE16CWL MC9S08QE32.pdf
MC9S08QE16CWL
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 22
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12GN16J0CLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
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MC33PF8200EMES PF8100_PF8200.pdf
MC33PF8200EMES
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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SPC5604CK0CLL6
SPC5604CK0CLL6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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KIT34FS6408EVB KT34FS6407-34FS6408UG.pdf
Hersteller: NXP USA Inc.
Description: EVALUATION KIT - FS6408 SAFE SY
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: MC34FS6408
Supplied Contents: Board(s)
Contents: Board(s)
Produkt ist nicht verfügbar
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S912ZVL64AVLC MC9S12ZVLRM.pdf
S912ZVL64AVLC
Hersteller: NXP USA Inc.
Description: S12Z CPU, 64K FLASH
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Supplier Device Package: 32-LQFP (7x7)
Produkt ist nicht verfügbar
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74AHC1G06GV,125 74AHC%28T%291G06.pdf
74AHC1G06GV,125
Hersteller: NXP USA Inc.
Description: IC INVERTER 1CH 1-INP 5TSOP
Features: Open Drain
Packaging: Tape & Reel (TR)
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Current - Output High, Low: -, 8mA
Number of Inputs: 1
Supplier Device Package: 5-TSOP
Input Logic Level - High: 1.5V ~ 3.85V
Input Logic Level - Low: 0.5V ~ 1.65V
Max Propagation Delay @ V, Max CL: 7ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 1 µA
Produkt ist nicht verfügbar
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74AHCT1G06GV,125 74AHC%28T%291G06.pdf
74AHCT1G06GV,125
Hersteller: NXP USA Inc.
Description: IC INVERTER 1CH 1-INP 5TSOP
Features: Open Drain
Packaging: Tape & Reel (TR)
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: -, 8mA
Number of Inputs: 1
Supplier Device Package: 5-TSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 1 µA
Produkt ist nicht verfügbar
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MFS8630BMBA0ESR2
MFS8630BMBA0ESR2
Hersteller: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 36V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MFS8630BMBA0ES
MFS8630BMBA0ES
Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MRF7S19120NR1 MRF7S19120NR1.pdf
MRF7S19120NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-4
Packaging: Tape & Reel (TR)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 1.99GHz
Power - Output: 36W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.2 A
Produkt ist nicht verfügbar
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MFS8623BMDA0ESR2 FS8600_SDS.pdf
MFS8623BMDA0ESR2
Hersteller: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 36V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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LFDALT
Hersteller: NXP USA Inc.
Description: 144 PIN 0.5MM QFP ZIF SOCKET ADA
Packaging: Bulk
Module/Board Type: Socket Module - QFP
Produkt ist nicht verfügbar
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LFBGARBT4AO
Hersteller: NXP USA Inc.
Description: SURFACE MOUNT PGA SOCKET FOR 292
Packaging: Bulk
Module/Board Type: Socket Module - PGA
Produkt ist nicht verfügbar
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MFS8621BMDA0ESR2 FS8600_SDS.pdf
MFS8621BMDA0ESR2
Hersteller: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 36V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MFS8621BMDA0ES
MFS8621BMDA0ES
Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC9S08PB8MTGR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 14
Produkt ist nicht verfügbar
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LFMAJ46CS1A
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5646C 256 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5646C
Type: Debugger
Contents: Board(s)
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MCIMX286DVM4BR IMX28CEC.pdf
Hersteller: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
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LFJ33INTPQA
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5633M ON A 208 PIN 1.
Packaging: Bulk
For Use With/Related Products: MPC5633M
Module/Board Type: Socket Adapter
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