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FX32K146UAT0VLLT NXP USA Inc. S32K1xx.pdf Description: S32K146 ARM CORTEX-M4F, 112 MHZ,
Packaging: Tray
Produkt ist nicht verfügbar
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FB32K146HAT0VLLT NXP USA Inc. Description: S32K144 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
Produkt ist nicht verfügbar
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JN5168/001K NXP USA Inc. JN516X.pdf Description: ZIGBEE AND IEEE802.15.4 WIRELESS
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.485GHz
Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: Zigbee®
Current - Receiving: 17mA
Data Rate (Max): 1Mbps
Current - Transmitting: 15mA
Supplier Device Package: 40-HVQFN (6x6)
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
Produkt ist nicht verfügbar
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MFS2320BMBB1EPR2 MFS2320BMBB1EPR2 NXP USA Inc. FS23_SBC.pdf Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 30µA
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MFS2320BMBB1EP MFS2320BMBB1EP NXP USA Inc. FS23_SBC.pdf Description: IC
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 30µA
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MPC857DSLVR50B MPC857DSLVR50B NXP USA Inc. MPC862EC%2C857%28T%2CDSL%29.pdf Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
auf Bestellung 44 Stücke:
Lieferzeit 10-14 Tag (e)
8+64.49 EUR
Mindestbestellmenge: 8
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MPC857DSLVR50B MPC857DSLVR50B NXP USA Inc. MPC862EC%2C857%28T%2CDSL%29.pdf Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
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NTS0102JKZ NTS0102JKZ NXP USA Inc. NTS0102.pdf Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-X2SON (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Number of Circuits: 1
auf Bestellung 6000 Stücke:
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6000+0.36 EUR
Mindestbestellmenge: 6000
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LD6836CX4/14H,315 LD6836CX4/14H,315 NXP USA Inc. LD6836.pdf Description: IC REG LINEAR 1.4V 300MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.4V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.16V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 27000 Stücke:
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2664+0.18 EUR
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LFTQSE2T NXP USA Inc. Description: 64 PIN 0.5MM QFP SURFACE MOUNT T
Packaging: Bulk
Module/Board Type: Socket Module - QFP
Produkt ist nicht verfügbar
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WLAN7301HY NXP USA Inc. Description: WLAN7301H
Packaging: Tape & Reel (TR)
Package / Case: 18-WFLGA Exposed Pad
Frequency: 2.4GHz
RF Type: Bluetooth, WLAN
Supplier Device Package: 18-HWFLGA (2.4x2)
Produkt ist nicht verfügbar
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NCK2982RHN/00101Y NXP USA Inc. Description: MANTRA CS
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MRF24301HSR5 MRF24301HSR5 NXP USA Inc. Description: RF MOSFET LDMOS NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 2.4GHz ~ 2.5GHz
Power - Output: 300W
Gain: 13.5dB
Technology: LDMOS
Supplier Device Package: NI-780S
Produkt ist nicht verfügbar
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SC16C754BIA68,529 SC16C754BIA68,529 NXP USA Inc. SC16C754B.pdf Description: IC UART QUAD 64BYTE 68PLCC
Packaging: Tube
Package / Case: 68-LCC (J-Lead)
Number of Channels: 4, QUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 64 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 68-PLCC (24.18x24.18)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Produkt ist nicht verfügbar
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74AHCU04PW,112 74AHCU04PW,112 NXP USA Inc. PHGL-S-A0001366761-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER 6CH 1-INP 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 1
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.7V ~ 4.4V
Input Logic Level - Low: 0.3V ~ 1.1V
Max Propagation Delay @ V, Max CL: 7ns @ 5V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 2 µA
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3328+0.15 EUR
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MKL02Z16VFG4R MKL02Z16VFG4R NXP USA Inc. KL0xPB.pdf Description: IC MCU 32BIT 16KB FLASH 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 6x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN (3x3)
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
5000+2.22 EUR
Mindestbestellmenge: 5000
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MKL02Z16VFG4R MKL02Z16VFG4R NXP USA Inc. KL0xPB.pdf Description: IC MCU 32BIT 16KB FLASH 16QFN
Packaging: Cut Tape (CT)
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 6x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN (3x3)
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 5000 Stücke:
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4+4.65 EUR
10+3.46 EUR
25+3.17 EUR
100+2.85 EUR
250+2.69 EUR
500+2.6 EUR
1000+2.52 EUR
2500+2.44 EUR
Mindestbestellmenge: 4
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PCA9550D,118 PCA9550D,118 NXP USA Inc. PCA9550.pdf Description: IC LED DRVR LINEAR I2C 25MA 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Outputs: 2
Frequency: 400kHz
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 8-SO
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
auf Bestellung 2500 Stücke:
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235+2.08 EUR
Mindestbestellmenge: 235
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MWCT1013AVLH MWCT1013AVLH NXP USA Inc. WCT101xADS.pdf Description: 15W MULTI-COIL AUTO PREMIUM L
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
1+28.51 EUR
10+26.2 EUR
25+25.12 EUR
160+22.13 EUR
320+21.04 EUR
480+19.69 EUR
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S32K358GHT1VPCSR NXP USA Inc. S32K3xx.pdf Description: S32K358GHT1VPCSR
Packaging: Bulk
Package / Case: 172-QFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 1.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP-EP
Grade: Automotive
Number of I/O: 142
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K311NHT0MLFSR S32K311NHT0MLFSR NXP USA Inc. S32K3xx.pdf Description: S32K311NHT0MLFSR
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 42
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K311NHT0MPASR S32K311NHT0MPASR NXP USA Inc. S32K3xx.pdf Description: S32K311NHT0MPASR
Packaging: Bulk
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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J3R150PZU15/0ZA4FV NXP USA Inc. Description: J3R150PZU15
Packaging: Tray
Produkt ist nicht verfügbar
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J3R200PZU15/0ZA76V NXP USA Inc. Description: J3R200PZU15
Packaging: Tray
Produkt ist nicht verfügbar
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J3R200PZU15/0ZA7AV NXP USA Inc. Description: J3R200PZU15
Packaging: Tray
Produkt ist nicht verfügbar
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BF1100WR,115 BF1100WR,115 NXP USA Inc. BF1100WR.pdf Description: RF MOSFET 9V CMPAK-4
Packaging: Tape & Reel (TR)
Package / Case: SC-82A, SOT-343
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 800MHz
Configuration: N-Channel Dual Gate
Technology: MOSFET (Metal Oxide)
Noise Figure: 2dB
Supplier Device Package: CMPAK-4
Voltage - Rated: 14 V
Voltage - Test: 9 V
Current - Test: 10 mA
Produkt ist nicht verfügbar
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MC33774ATP1AE MC33774ATP1AE NXP USA Inc. PB_MC33774A.pdf Description: MC33774ATP1AE
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 4 ~ 18
Mounting Type: Surface Mount
Function: Multi-Function Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Temperature
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 112 Stücke:
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1+17.81 EUR
10+13.97 EUR
25+13.01 EUR
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A5G26H110N-2496 NXP USA Inc. A5G26H110N.pdf Description: RF MOSFET 48V 6DFN
Packaging: Bulk
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
Power - Output: 15W
Gain: 17.7dB
Supplier Device Package: 6-PDFN (7x6.5)
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 50 mA
Produkt ist nicht verfügbar
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MGD3100BM58EKR2 MGD3100BM58EKR2 NXP USA Inc. MC33GD3100_SDS.pdf Description: IC GATE DRVR HALF-BRIDGE 32BSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5V
Supplier Device Package: 32-SOIC
Channel Type: Single
Driven Configuration: Half-Bridge
Number of Drivers: 1
Gate Type: IGBT, MOSFET (N-Channel)
Current - Peak Output (Source, Sink): 15A, 15A
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC9S08DV60MLH MC9S08DV60MLH NXP USA Inc. MC9S08DV60.pdf Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 3K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DZ60MLC MC9S08DZ60MLC NXP USA Inc. Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DZ60MLH MC9S08DZ60MLH NXP USA Inc. Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LD6816CX4/30P,315 LD6816CX4/30P,315 NXP USA Inc. LD6816.pdf Description: IC REG LINEAR 3V 150MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 3V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
auf Bestellung 36000 Stücke:
Lieferzeit 10-14 Tag (e)
3328+0.15 EUR
Mindestbestellmenge: 3328
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MPC8378VRAJFA MPC8378VRAJFA NXP USA Inc. MPC837XFFS.pdf Description: IC MPU MPC83XX 533MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
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P3T1035XUK-ARD NXP USA Inc. P3T1035UK_P3T2030UK.pdf Description: P3T1035XUK ARDUINO EVAL BOARD
Packaging: Box
Function: Temperature
Type: Sensor
Contents: Board(s)
Utilized IC / Part: P3T1035xUK
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)
1+86.17 EUR
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MCIMX535DVP1C2R2 MCIMX535DVP1C2R2 NXP USA Inc. IMX53IEC.pdf Description: IC MPU I.MX53 1GHZ 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -20°C ~ 85°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX535DVP1C2 MCIMX535DVP1C2 NXP USA Inc. Description: IC MPU I.MX53 1GHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -20°C ~ 85°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
auf Bestellung 412 Stücke:
Lieferzeit 10-14 Tag (e)
1+98.51 EUR
10+81.33 EUR
84+72.83 EUR
168+70.99 EUR
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MCIMX535DVV2C MCIMX535DVV2C NXP USA Inc. IMX53CEC.pdf Description: IC MPU I.MX53 1.2GHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -20°C ~ 85°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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LFTAS32KQM2A NXP USA Inc. Description: NXP S32K FAMILY 176 LQFP TARGET
Packaging: Bulk
For Use With/Related Products: S32K
Module/Board Type: Socket Module - LQFP
Produkt ist nicht verfügbar
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RD33774CNT2EVB NXP USA Inc. Description: RD33774CNT2EVB
Packaging: Bulk
Produkt ist nicht verfügbar
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MC68L11F1CFNE3 MC68L11F1CFNE3 NXP USA Inc. MC68HC11F1.pdf Description: IC MCU 8BIT ROMLESS 68PLCC
Packaging: Tube
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 68-PLCC (24.21x24.21)
Number of I/O: 30
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MFS2304BMBA0EPR2 NXP USA Inc. FS23_SBC.pdf Description: IC
Packaging: Bulk
Produkt ist nicht verfügbar
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MFS2323BMMA0EPR2 MFS2323BMMA0EPR2 NXP USA Inc. Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MFS2305BMBA0EPR2 NXP USA Inc. FS23DS.pdf Description: MFS2305BMBA0EPR2
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 120°C
Voltage - Supply: 3.3V, 5V
Applications: System Basis Chip
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MFS2304BMBA0EP NXP USA Inc. FS23_SBC.pdf Description: IC
Packaging: Bulk
Produkt ist nicht verfügbar
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MFS2323BMMA0EP MFS2323BMMA0EP NXP USA Inc. Description: IC
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MFS2305BMBA0EP NXP USA Inc. FS23DS.pdf Description: MFS2305BMBA0EP
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 120°C
Voltage - Supply: 3.3V, 5V
Applications: System Basis Chip
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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SPC5643LFK0MLL6 SPC5643LFK0MLL6 NXP USA Inc. Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 32x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5645CCF0VLU8 SPC5645CCF0VLU8 NXP USA Inc. Description: IC MCU 32BIT 2MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz, 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74HC7403D,512 74HC7403D,512 NXP USA Inc. 74HC%28T%297403.pdf Description: IC FIFO ASYNC/SYNC 64X4 16SO
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Function: Asynchronous, Synchronous
Memory Size: 256 (64 x 4)
Operating Temperature: -40°C ~ 125°C
Data Rate: 30MHz
Access Time: 49ns
Current - Supply (Max): 1mA
Supplier Device Package: 16-SO
Bus Directional: Uni-Directional
Expansion Type: Depth, Width
Programmable Flags Support: No
Retransmit Capability: No
FWFT Support: No
Voltage - Supply: 2 V ~ 6 V
DigiKey Programmable: Not Verified
auf Bestellung 1442 Stücke:
Lieferzeit 10-14 Tag (e)
256+1.99 EUR
Mindestbestellmenge: 256
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FC32K148UAT0VLLR NXP USA Inc. Description: IC MCU 32BIT 2MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCF52213AE50 MCF52213AE50 NXP USA Inc. MCF52211.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 56
DigiKey Programmable: Not Verified
auf Bestellung 160 Stücke:
Lieferzeit 10-14 Tag (e)
29+17.89 EUR
Mindestbestellmenge: 29
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MCF52213AE50 MCF52213AE50 NXP USA Inc. MCF52211.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 56
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCF52223CVM80 MCF52223CVM80 NXP USA Inc. MCF52223DS.pdf Description: IC MCU 32BIT 256KB FLSH 81MAPBGA
Packaging: Bulk
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Number of I/O: 56
DigiKey Programmable: Not Verified
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Lieferzeit 10-14 Tag (e)
23+19.9 EUR
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MCF52223CVM80 MCF52223CVM80 NXP USA Inc. MCF52223DS.pdf Description: IC MCU 32BIT 256KB FLSH 81MAPBGA
Packaging: Tray
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Number of I/O: 56
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCF52223CVM66 MCF52223CVM66 NXP USA Inc. Description: IC MCU 32BIT 256KB FLSH 81MAPBGA
Packaging: Tray
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Number of I/O: 56
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCF52221CAE66 MCF52221CAE66 NXP USA Inc. FSCLS07443-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 56
DigiKey Programmable: Not Verified
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
1+28.02 EUR
10+22.39 EUR
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MCF5272CVM66R2 MCF5272CVM66R2 NXP USA Inc. MCF5272UM.pdf Description: IC MCU 32BIT 16KB ROM 196PBGA
Packaging: Tape & Reel (TR)
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 16KB (4K x 32)
RAM Size: 1K x 32
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROM
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, WDT
Supplier Device Package: 196-LBGA (15x15)
Number of I/O: 32
DigiKey Programmable: Not Verified
auf Bestellung 2129 Stücke:
Lieferzeit 10-14 Tag (e)
6+150.13 EUR
Mindestbestellmenge: 6
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MCF52211CAE80 MCF52211CAE80 NXP USA Inc. MCF52211.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 43
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68HC705C9ACFB MC68HC705C9ACFB NXP USA Inc. MC68HC705C9A.pdf Description: IC MCU 8BIT 16KB OTP 44QFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 352 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-QFP (10x10)
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FX32K146UAT0VLLT S32K1xx.pdf
Hersteller: NXP USA Inc.
Description: S32K146 ARM CORTEX-M4F, 112 MHZ,
Packaging: Tray
Produkt ist nicht verfügbar
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FB32K146HAT0VLLT
Hersteller: NXP USA Inc.
Description: S32K144 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
Produkt ist nicht verfügbar
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JN5168/001K JN516X.pdf
Hersteller: NXP USA Inc.
Description: ZIGBEE AND IEEE802.15.4 WIRELESS
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.485GHz
Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: Zigbee®
Current - Receiving: 17mA
Data Rate (Max): 1Mbps
Current - Transmitting: 15mA
Supplier Device Package: 40-HVQFN (6x6)
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
Produkt ist nicht verfügbar
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MFS2320BMBB1EPR2 FS23_SBC.pdf
MFS2320BMBB1EPR2
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 30µA
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MFS2320BMBB1EP FS23_SBC.pdf
MFS2320BMBB1EP
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 30µA
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MPC857DSLVR50B MPC862EC%2C857%28T%2CDSL%29.pdf
MPC857DSLVR50B
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
auf Bestellung 44 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+64.49 EUR
Mindestbestellmenge: 8
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MPC857DSLVR50B MPC862EC%2C857%28T%2CDSL%29.pdf
MPC857DSLVR50B
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
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NTS0102JKZ NTS0102.pdf
NTS0102JKZ
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-X2SON (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Number of Circuits: 1
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6000+0.36 EUR
Mindestbestellmenge: 6000
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LD6836CX4/14H,315 LD6836.pdf
LD6836CX4/14H,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.4V 300MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.4V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.16V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
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Anzahl Preis
2664+0.18 EUR
Mindestbestellmenge: 2664
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LFTQSE2T
Hersteller: NXP USA Inc.
Description: 64 PIN 0.5MM QFP SURFACE MOUNT T
Packaging: Bulk
Module/Board Type: Socket Module - QFP
Produkt ist nicht verfügbar
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WLAN7301HY
Hersteller: NXP USA Inc.
Description: WLAN7301H
Packaging: Tape & Reel (TR)
Package / Case: 18-WFLGA Exposed Pad
Frequency: 2.4GHz
RF Type: Bluetooth, WLAN
Supplier Device Package: 18-HWFLGA (2.4x2)
Produkt ist nicht verfügbar
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NCK2982RHN/00101Y
Hersteller: NXP USA Inc.
Description: MANTRA CS
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MRF24301HSR5
MRF24301HSR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 2.4GHz ~ 2.5GHz
Power - Output: 300W
Gain: 13.5dB
Technology: LDMOS
Supplier Device Package: NI-780S
Produkt ist nicht verfügbar
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SC16C754BIA68,529 SC16C754B.pdf
SC16C754BIA68,529
Hersteller: NXP USA Inc.
Description: IC UART QUAD 64BYTE 68PLCC
Packaging: Tube
Package / Case: 68-LCC (J-Lead)
Number of Channels: 4, QUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 64 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 68-PLCC (24.18x24.18)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Produkt ist nicht verfügbar
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74AHCU04PW,112 PHGL-S-A0001366761-1.pdf?t.download=true&u=5oefqw
74AHCU04PW,112
Hersteller: NXP USA Inc.
Description: IC INVERTER 6CH 1-INP 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 1
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.7V ~ 4.4V
Input Logic Level - Low: 0.3V ~ 1.1V
Max Propagation Delay @ V, Max CL: 7ns @ 5V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 2 µA
auf Bestellung 6816 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3328+0.15 EUR
Mindestbestellmenge: 3328
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MKL02Z16VFG4R KL0xPB.pdf
MKL02Z16VFG4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 6x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN (3x3)
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5000+2.22 EUR
Mindestbestellmenge: 5000
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MKL02Z16VFG4R KL0xPB.pdf
MKL02Z16VFG4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 16QFN
Packaging: Cut Tape (CT)
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 6x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN (3x3)
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+4.65 EUR
10+3.46 EUR
25+3.17 EUR
100+2.85 EUR
250+2.69 EUR
500+2.6 EUR
1000+2.52 EUR
2500+2.44 EUR
Mindestbestellmenge: 4
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PCA9550D,118 PCA9550.pdf
PCA9550D,118
Hersteller: NXP USA Inc.
Description: IC LED DRVR LINEAR I2C 25MA 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Outputs: 2
Frequency: 400kHz
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 8-SO
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
235+2.08 EUR
Mindestbestellmenge: 235
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MWCT1013AVLH WCT101xADS.pdf
MWCT1013AVLH
Hersteller: NXP USA Inc.
Description: 15W MULTI-COIL AUTO PREMIUM L
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+28.51 EUR
10+26.2 EUR
25+25.12 EUR
160+22.13 EUR
320+21.04 EUR
480+19.69 EUR
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S32K358GHT1VPCSR S32K3xx.pdf
Hersteller: NXP USA Inc.
Description: S32K358GHT1VPCSR
Packaging: Bulk
Package / Case: 172-QFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 1.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP-EP
Grade: Automotive
Number of I/O: 142
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K311NHT0MLFSR S32K3xx.pdf
S32K311NHT0MLFSR
Hersteller: NXP USA Inc.
Description: S32K311NHT0MLFSR
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 42
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K311NHT0MPASR S32K3xx.pdf
S32K311NHT0MPASR
Hersteller: NXP USA Inc.
Description: S32K311NHT0MPASR
Packaging: Bulk
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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J3R150PZU15/0ZA4FV
Hersteller: NXP USA Inc.
Description: J3R150PZU15
Packaging: Tray
Produkt ist nicht verfügbar
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J3R200PZU15/0ZA76V
Hersteller: NXP USA Inc.
Description: J3R200PZU15
Packaging: Tray
Produkt ist nicht verfügbar
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J3R200PZU15/0ZA7AV
Hersteller: NXP USA Inc.
Description: J3R200PZU15
Packaging: Tray
Produkt ist nicht verfügbar
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BF1100WR,115 BF1100WR.pdf
BF1100WR,115
Hersteller: NXP USA Inc.
Description: RF MOSFET 9V CMPAK-4
Packaging: Tape & Reel (TR)
Package / Case: SC-82A, SOT-343
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 800MHz
Configuration: N-Channel Dual Gate
Technology: MOSFET (Metal Oxide)
Noise Figure: 2dB
Supplier Device Package: CMPAK-4
Voltage - Rated: 14 V
Voltage - Test: 9 V
Current - Test: 10 mA
Produkt ist nicht verfügbar
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MC33774ATP1AE PB_MC33774A.pdf
MC33774ATP1AE
Hersteller: NXP USA Inc.
Description: MC33774ATP1AE
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 4 ~ 18
Mounting Type: Surface Mount
Function: Multi-Function Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Temperature
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 112 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+17.81 EUR
10+13.97 EUR
25+13.01 EUR
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A5G26H110N-2496 A5G26H110N.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET 48V 6DFN
Packaging: Bulk
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
Power - Output: 15W
Gain: 17.7dB
Supplier Device Package: 6-PDFN (7x6.5)
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 50 mA
Produkt ist nicht verfügbar
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MGD3100BM58EKR2 MC33GD3100_SDS.pdf
MGD3100BM58EKR2
Hersteller: NXP USA Inc.
Description: IC GATE DRVR HALF-BRIDGE 32BSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5V
Supplier Device Package: 32-SOIC
Channel Type: Single
Driven Configuration: Half-Bridge
Number of Drivers: 1
Gate Type: IGBT, MOSFET (N-Channel)
Current - Peak Output (Source, Sink): 15A, 15A
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC9S08DV60MLH MC9S08DV60.pdf
MC9S08DV60MLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 3K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DZ60MLC
MC9S08DZ60MLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DZ60MLH
MC9S08DZ60MLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LD6816CX4/30P,315 LD6816.pdf
LD6816CX4/30P,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 3V 150MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 3V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
auf Bestellung 36000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3328+0.15 EUR
Mindestbestellmenge: 3328
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MPC8378VRAJFA MPC837XFFS.pdf
MPC8378VRAJFA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
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P3T1035XUK-ARD P3T1035UK_P3T2030UK.pdf
Hersteller: NXP USA Inc.
Description: P3T1035XUK ARDUINO EVAL BOARD
Packaging: Box
Function: Temperature
Type: Sensor
Contents: Board(s)
Utilized IC / Part: P3T1035xUK
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+86.17 EUR
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MCIMX535DVP1C2R2 IMX53IEC.pdf
MCIMX535DVP1C2R2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX53 1GHZ 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -20°C ~ 85°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX535DVP1C2
MCIMX535DVP1C2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX53 1GHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -20°C ~ 85°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
auf Bestellung 412 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+98.51 EUR
10+81.33 EUR
84+72.83 EUR
168+70.99 EUR
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MCIMX535DVV2C IMX53CEC.pdf
MCIMX535DVV2C
Hersteller: NXP USA Inc.
Description: IC MPU I.MX53 1.2GHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -20°C ~ 85°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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LFTAS32KQM2A
Hersteller: NXP USA Inc.
Description: NXP S32K FAMILY 176 LQFP TARGET
Packaging: Bulk
For Use With/Related Products: S32K
Module/Board Type: Socket Module - LQFP
Produkt ist nicht verfügbar
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RD33774CNT2EVB
Hersteller: NXP USA Inc.
Description: RD33774CNT2EVB
Packaging: Bulk
Produkt ist nicht verfügbar
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MC68L11F1CFNE3 MC68HC11F1.pdf
MC68L11F1CFNE3
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 68PLCC
Packaging: Tube
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 68-PLCC (24.21x24.21)
Number of I/O: 30
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MFS2304BMBA0EPR2 FS23_SBC.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Bulk
Produkt ist nicht verfügbar
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MFS2323BMMA0EPR2
MFS2323BMMA0EPR2
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MFS2305BMBA0EPR2 FS23DS.pdf
Hersteller: NXP USA Inc.
Description: MFS2305BMBA0EPR2
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 120°C
Voltage - Supply: 3.3V, 5V
Applications: System Basis Chip
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MFS2304BMBA0EP FS23_SBC.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Bulk
Produkt ist nicht verfügbar
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MFS2323BMMA0EP
MFS2323BMMA0EP
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MFS2305BMBA0EP FS23DS.pdf
Hersteller: NXP USA Inc.
Description: MFS2305BMBA0EP
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 120°C
Voltage - Supply: 3.3V, 5V
Applications: System Basis Chip
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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SPC5643LFK0MLL6
SPC5643LFK0MLL6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 32x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5645CCF0VLU8
SPC5645CCF0VLU8
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz, 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74HC7403D,512 74HC%28T%297403.pdf
74HC7403D,512
Hersteller: NXP USA Inc.
Description: IC FIFO ASYNC/SYNC 64X4 16SO
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Function: Asynchronous, Synchronous
Memory Size: 256 (64 x 4)
Operating Temperature: -40°C ~ 125°C
Data Rate: 30MHz
Access Time: 49ns
Current - Supply (Max): 1mA
Supplier Device Package: 16-SO
Bus Directional: Uni-Directional
Expansion Type: Depth, Width
Programmable Flags Support: No
Retransmit Capability: No
FWFT Support: No
Voltage - Supply: 2 V ~ 6 V
DigiKey Programmable: Not Verified
auf Bestellung 1442 Stücke:
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Anzahl Preis
256+1.99 EUR
Mindestbestellmenge: 256
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FC32K148UAT0VLLR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCF52213AE50 MCF52211.pdf
MCF52213AE50
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 56
DigiKey Programmable: Not Verified
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Anzahl Preis
29+17.89 EUR
Mindestbestellmenge: 29
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MCF52213AE50 MCF52211.pdf
MCF52213AE50
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 56
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCF52223CVM80 MCF52223DS.pdf
MCF52223CVM80
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 81MAPBGA
Packaging: Bulk
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Number of I/O: 56
DigiKey Programmable: Not Verified
auf Bestellung 36 Stücke:
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Anzahl Preis
23+19.9 EUR
Mindestbestellmenge: 23
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MCF52223CVM80 MCF52223DS.pdf
MCF52223CVM80
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 81MAPBGA
Packaging: Tray
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Number of I/O: 56
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCF52223CVM66
MCF52223CVM66
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 81MAPBGA
Packaging: Tray
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Number of I/O: 56
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCF52221CAE66 FSCLS07443-1.pdf?t.download=true&u=5oefqw
MCF52221CAE66
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 56
DigiKey Programmable: Not Verified
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Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+28.02 EUR
10+22.39 EUR
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MCF5272CVM66R2 MCF5272UM.pdf
MCF5272CVM66R2
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB ROM 196PBGA
Packaging: Tape & Reel (TR)
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 16KB (4K x 32)
RAM Size: 1K x 32
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROM
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, WDT
Supplier Device Package: 196-LBGA (15x15)
Number of I/O: 32
DigiKey Programmable: Not Verified
auf Bestellung 2129 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+150.13 EUR
Mindestbestellmenge: 6
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MCF52211CAE80 MCF52211.pdf
MCF52211CAE80
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 43
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68HC705C9ACFB MC68HC705C9A.pdf
MC68HC705C9ACFB
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB OTP 44QFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 352 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-QFP (10x10)
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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