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MC32PF1510A1EP MC32PF1510A1EP NXP USA Inc. PF1510.pdf Description: PF1510
Voltage - Supply: 3.8V ~ 7V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
Supplier Device Package: 40-HVQFN (5x5)
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Produkt ist nicht verfügbar
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LPC43S20FET180K LPC43S20FET180K NXP USA Inc. LPC43S50_30_20.pdf Description: IC MCU 32BIT ROMLESS 180TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 118
Supplier Device Package: 180-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b;D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 200K x 8
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 180-TFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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LS1017AXE7PQA LS1017AXE7PQA NXP USA Inc. LS1027A%2C%20LS1017A.pdf Description: LAYERSCAPE 64-BIT ARM CORTEX-A72
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
USB: USB 3.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Produkt ist nicht verfügbar
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LPC2917FBD144/01/, LPC2917FBD144/01/, NXP USA Inc. LPC2917_19_1.pdf Description: IC MCU 16/32B 512KB FLSH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM9®
Data Converters: A/D 16x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 108
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LD6836TD/29H,125 LD6836TD/29H,125 NXP USA Inc. LD6836.pdf Description: IC REG LINEAR 2.9V 300MA 5-TSOP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.2V @ 300mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 2.9V
Supplier Device Package: 5-TSOP
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 300mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: SC-74A, SOT-753
Packaging: Bulk
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LPC822M101JHI33Y LPC822M101JHI33Y NXP USA Inc. LPC82X.pdf Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 29
DigiKey Programmable: Not Verified
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LPC822M101JHI33Y LPC822M101JHI33Y NXP USA Inc. LPC82X.pdf Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 29
DigiKey Programmable: Not Verified
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250+1.98 EUR
500+1.9 EUR
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TEA1892ATS/1Z TEA1892ATS/1Z NXP USA Inc. TEA1892ATS.pdf Description: IC SYNC RECTIFIER CTRLR 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 8.5V ~ 38V
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: SC-74
Current - Supply: 1 mA
DigiKey Programmable: Not Verified
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TEA1892TS/1Z TEA1892TS/1Z NXP USA Inc. TEA1892TS.pdf Description: IC SYNC RECTIFIER CTRLR 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 8.5V ~ 38V
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: SC-74
Current - Supply: 1 mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P3T1750DP/Q900Z P3T1750DP/Q900Z NXP USA Inc. P3T1750DP.pdf Description: DIGITAL TEMPERATURE SENSOR
Features: One-Shot, Standby Mode
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 8-TSSOP
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C
Sensing Temperature - Local: -40°C ~ 125°C
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100+0.92 EUR
500+0.82 EUR
1000+0.8 EUR
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SPC5645BF0MLU1 SPC5645BF0MLU1 NXP USA Inc. MPC5646C.pdf Description: IC MCU 32BIT 2MB FLASH 176LQFP
Packaging: Bulk
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 160K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
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74AUP1G157GF,132 74AUP1G157GF,132 NXP USA Inc. 74AUP1G157.pdf Description: IC MUX LP 2-INPUT 6-XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Circuit: 1 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 6-XSON, SOT891 (1x1)
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MPC8247ZQTIEA MPC8247ZQTIEA NXP USA Inc. MPC8272EC.pdf Description: IC MPU MPC82XX 400MHZ PBGA516
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 516-PBGA (27x27)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2_LE
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA
Packaging: Tray
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
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TDA8020HL/C2,118 TDA8020HL/C2,118 NXP USA Inc. TDA8020HL.pdf Description: IC INTERFACE SPECIALIZED 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 3.6V
Applications: Smart Card
Supplier Device Package: 32-LQFP (7x7)
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LFLAIBK77MWA NXP USA Inc. Description: MPC5777M 416 PIN 1.0 MM PGA LOGI
Packaging: Bulk
For Use With/Related Products: MPC5777M
Module/Board Type: Socket Module - PGA
Utilized IC / Part: MPC5777M
Produkt ist nicht verfügbar
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SCBGARBQ1AO NXP USA Inc. Description: SOCKET SUPPORTING VERTICAL AUTOM
Packaging: Bulk
Module/Board Type: Socket Module - BGA
Produkt ist nicht verfügbar
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LFVBBK77CZA NXP USA Inc. Description: QORIVVA MPC5777C 516 PIN 1.0MM V
Packaging: Bulk
For Use With/Related Products: MPC5777C
Accessory Type: Base Board
Utilized IC / Part: MPC5777C
Produkt ist nicht verfügbar
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LFDAHT NXP USA Inc. Description: 100 PIN 0.5MM QFP ZIF SOCKET ADA
Module/Board Type: Socket Module - QFP
Packaging: Bulk
Produkt ist nicht verfügbar
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FXLS90630AESR2 NXP USA Inc. FXLS9xxx0.pdf Description: Y SINGLE-AXIS HIGH-G INERTIAL S
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Produkt ist nicht verfügbar
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MFS8412AMBP7ESR2 MFS8412AMBP7ESR2 NXP USA Inc. FS84QFN48EP.pdf Description: SAFETY POWER MANAGEMENT IC, QFN4
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC56F8323VFBER NXP USA Inc. MC56F8323.pdf Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, SCI, SPI
Peripherals: POR, PWM, Temp Sensor, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 27
Produkt ist nicht verfügbar
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LFDAMT NXP USA Inc. Description: 160 PIN 0.65MM QFP ZIF SOCKET AD
Packaging: Bulk
Module/Board Type: Socket Module - QFP
Produkt ist nicht verfügbar
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MPC860PZQ50D4 MPC860PZQ50D4 NXP USA Inc. MPC860EC.pdf Description: IC MPU MPC8XX 50MHZ 357BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MPC860SRZQ66D4 MPC860SRZQ66D4 NXP USA Inc. MPC860EC.pdf Description: IC MPU MPC8XX 66MHZ 357BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Produkt ist nicht verfügbar
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NT2H2421G0DUFZ NXP USA Inc. NT2H2421G0.pdf Description: NT2H2421G0DUF
Packaging: Tray
Produkt ist nicht verfügbar
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NT2H2421G0DUDZ NXP USA Inc. NT2H2421G0.pdf Description: NT2H2421G0DUD
Packaging: Tray
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NT2H2421S0DUDZ NXP USA Inc. NT2H2421G0.pdf Description: NT2H2421S0DUD
Packaging: Tray
Produkt ist nicht verfügbar
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MPC860TZQ66D4 MPC860TZQ66D4 NXP USA Inc. MPC860EC.pdf Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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mpc8360evvagdga mpc8360evvagdga NXP USA Inc. MPC8360E%2C8358E.pdf Description: IC MPU MPC83XX 400MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Produkt ist nicht verfügbar
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74LVC3G17GM,125 74LVC3G17GM,125 NXP USA Inc. PHGLS27084-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA 74LVC3G17GM - BUFFE
Packaging: Bulk
Package / Case: 8-XFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 32mA
Supplier Device Package: 8-XQFN (1.6x1.6)
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S912XEQ512AMAL S912XEQ512AMAL NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC33FS8430G2KSR2 MC33FS8430G2KSR2 NXP USA Inc. FS84_FS85C_DS.pdf Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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SPC5604BACLQ6R NXP USA Inc. Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 123
Produkt ist nicht verfügbar
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MPC8536EBVJAULA MPC8536EBVJAULA NXP USA Inc. MPC8536E.pdf Description: IC MPU MPC85XX 1.333GHZ 783BGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
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MKL26Z128VMC4 MKL26Z128VMC4 NXP USA Inc. KL26P121M48SF4.pdf Description: IC MCU 32B 128KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D - 16bit; D/A - 12bit
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 84
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PN7221EV/C100K NXP USA Inc. PN7220.pdf Description: IC
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443A, ISO 14443B, ISO 15693, Mifare, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Produkt ist nicht verfügbar
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T1024NXN7KQA NXP USA Inc. T1024FS.pdf Description: IC MPU QORIQ T1 1GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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LX2160SE72029B LX2160SE72029B NXP USA Inc. Description: IC MPU QORLQ LX2 2GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
Produkt ist nicht verfügbar
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MCF52221CAF66 MCF52221CAF66 NXP USA Inc. Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 56
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LS1043AXN8PQB LS1043AXN8PQB NXP USA Inc. LS1043AFS.pdf Description: IC MPU QORIQ 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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T2080NXN8PTB NXP USA Inc. T2080FS.pdf Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
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MPC8245LZU300D MPC8245LZU300D NXP USA Inc. MPC8245.pdf Description: IC MPU MPC82XX 300MHZ 352TBGA
Additional Interfaces: I2C, I²O, PCI, UART
Graphics Acceleration: No
RAM Controllers: SDRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 352-TBGA (35x35)
Voltage - I/O: 3.3V
Core Processor: PowerPC 603e
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 352-LBGA
Packaging: Tray
Produkt ist nicht verfügbar
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74AUP1G04GX/S500125 74AUP1G04GX/S500125 NXP USA Inc. 74AUP1G04.pdf Description: IC INVERTER 1CH 1-INP 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 1
Supplier Device Package: 5-X2SON (0.80x0.80)
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 30pF
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
Produkt ist nicht verfügbar
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MF3D43C0DA8/00J NXP USA Inc. Description: MF3D43C0DA8
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
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NT2H1511G0DUFZ NXP USA Inc. Description: NFC FORUM TYPE 2 TAG COMPLIANT I
Supplier Device Package: Wafer
Standards: ISO 14443, NFC
Operating Temperature: -25°C ~ 70°C (TA)
Type: RFID Reader/Transponder
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tray
Produkt ist nicht verfügbar
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FXLS93422AESR2 NXP USA Inc. FXLS9xxxx.pdf Description: PSI5 XZ DUAL-AXIS MEDIUM-G INER
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Produkt ist nicht verfügbar
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MRF9030LR1 MRF9030LR1 NXP USA Inc. MRF9030LR1.pdf Description: RF MOSFET LDMOS 26V NI360
Packaging: Tape & Reel (TR)
Package / Case: NI-360
Mounting Type: Chassis Mount
Frequency: 945MHz
Power - Output: 30W
Gain: 19dB
Technology: LDMOS
Supplier Device Package: NI-360
Voltage - Rated: 68 V
Voltage - Test: 26 V
Current - Test: 250 mA
Produkt ist nicht verfügbar
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MK21FX512VLQ12 MK21FX512VLQ12 NXP USA Inc. K21P121M120SF5V2.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
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TJA1044DTK/0J TJA1044DTK/0J NXP USA Inc. TJA1044.pdf Description: TJA1044DTK/0J
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1044BTK/0J TJA1044BTK/0J NXP USA Inc. TJA1044.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1044ETK/0J TJA1044ETK/0J NXP USA Inc. TJA1044.pdf Description: TJA1044ETK/0J
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1044CTK/0J TJA1044CTK/0J NXP USA Inc. TJA1044.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJA1044ET/0Z TJA1044ET/0Z NXP USA Inc. TJA1044.pdf Description: TJA1044ET/0Z
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJA1044CT/0Z TJA1044CT/0Z NXP USA Inc. TJA1044.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJA1044DT/0Z TJA1044DT/0Z NXP USA Inc. TJA1044.pdf Description: TJA1044DT/0Z
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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MKM35Z256VLL7R MKM35Z256VLL7R NXP USA Inc. KM35P144M75SF0.pdf Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 72
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MKM35Z512VLL7R MKM35Z512VLL7R NXP USA Inc. KM35P144M75SF0.pdf Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 72
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MKM35Z256VLQ7R MKM35Z256VLQ7R NXP USA Inc. KM35P144M75SF0.pdf Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Cut Tape (CT)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 99
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MKV10Z16VLF7 MKV10Z16VLF7 NXP USA Inc. Description: IC MCU 32BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
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MKV10Z64VLH7 MKV10Z64VLH7 NXP USA Inc. KV11P64M75.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC32PF1510A1EP PF1510.pdf
Hersteller: NXP USA Inc.
Description: PF1510
Voltage - Supply: 3.8V ~ 7V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
Supplier Device Package: 40-HVQFN (5x5)
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
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LPC43S20FET180K LPC43S50_30_20.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 180TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 118
Supplier Device Package: 180-TFBGA (12x12)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 8x10b;D/A 1x10b
Core Processor: ARM® Cortex®-M4/M0
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 200K x 8
Speed: 204MHz
Mounting Type: Surface Mount
Package / Case: 180-TFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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LS1017AXE7PQA LS1027A%2C%20LS1017A.pdf
Hersteller: NXP USA Inc.
Description: LAYERSCAPE 64-BIT ARM CORTEX-A72
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
USB: USB 3.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Produkt ist nicht verfügbar
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LPC2917FBD144/01/, LPC2917_19_1.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 512KB FLSH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM9®
Data Converters: A/D 16x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 108
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LD6836TD/29H,125 LD6836.pdf
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.9V 300MA 5-TSOP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.2V @ 300mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 2.9V
Supplier Device Package: 5-TSOP
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 300mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: SC-74A, SOT-753
Packaging: Bulk
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LPC822M101JHI33Y LPC82X.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 29
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC822M101JHI33Y LPC82X.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 29
DigiKey Programmable: Not Verified
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6+3.52 EUR
10+2.59 EUR
25+2.36 EUR
100+2.11 EUR
250+1.98 EUR
500+1.9 EUR
1000+1.89 EUR
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TEA1892ATS/1Z TEA1892ATS.pdf
Hersteller: NXP USA Inc.
Description: IC SYNC RECTIFIER CTRLR 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 8.5V ~ 38V
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: SC-74
Current - Supply: 1 mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA1892TS/1Z TEA1892TS.pdf
Hersteller: NXP USA Inc.
Description: IC SYNC RECTIFIER CTRLR 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 8.5V ~ 38V
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: SC-74
Current - Supply: 1 mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P3T1750DP/Q900Z P3T1750DP.pdf
Hersteller: NXP USA Inc.
Description: DIGITAL TEMPERATURE SENSOR
Features: One-Shot, Standby Mode
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 8-TSSOP
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C
Sensing Temperature - Local: -40°C ~ 125°C
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17+1.3 EUR
19+1.13 EUR
20+1.08 EUR
25+1.01 EUR
50+0.96 EUR
100+0.92 EUR
500+0.82 EUR
1000+0.8 EUR
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SPC5645BF0MLU1 MPC5646C.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Packaging: Bulk
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 160K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74AUP1G157GF,132 74AUP1G157.pdf
Hersteller: NXP USA Inc.
Description: IC MUX LP 2-INPUT 6-XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Circuit: 1 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 6-XSON, SOT891 (1x1)
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1972+0.3 EUR
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MPC8247ZQTIEA MPC8272EC.pdf
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 400MHZ PBGA516
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 516-PBGA (27x27)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2_LE
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA
Packaging: Tray
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Produkt ist nicht verfügbar
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TDA8020HL/C2,118 TDA8020HL.pdf
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 3.6V
Applications: Smart Card
Supplier Device Package: 32-LQFP (7x7)
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LFLAIBK77MWA
Hersteller: NXP USA Inc.
Description: MPC5777M 416 PIN 1.0 MM PGA LOGI
Packaging: Bulk
For Use With/Related Products: MPC5777M
Module/Board Type: Socket Module - PGA
Utilized IC / Part: MPC5777M
Produkt ist nicht verfügbar
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SCBGARBQ1AO
Hersteller: NXP USA Inc.
Description: SOCKET SUPPORTING VERTICAL AUTOM
Packaging: Bulk
Module/Board Type: Socket Module - BGA
Produkt ist nicht verfügbar
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LFVBBK77CZA
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5777C 516 PIN 1.0MM V
Packaging: Bulk
For Use With/Related Products: MPC5777C
Accessory Type: Base Board
Utilized IC / Part: MPC5777C
Produkt ist nicht verfügbar
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LFDAHT
Hersteller: NXP USA Inc.
Description: 100 PIN 0.5MM QFP ZIF SOCKET ADA
Module/Board Type: Socket Module - QFP
Packaging: Bulk
Produkt ist nicht verfügbar
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FXLS90630AESR2 FXLS9xxx0.pdf
Hersteller: NXP USA Inc.
Description: Y SINGLE-AXIS HIGH-G INERTIAL S
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Produkt ist nicht verfügbar
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MFS8412AMBP7ESR2 FS84QFN48EP.pdf
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN4
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC56F8323VFBER MC56F8323.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, SCI, SPI
Peripherals: POR, PWM, Temp Sensor, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 27
Produkt ist nicht verfügbar
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LFDAMT
Hersteller: NXP USA Inc.
Description: 160 PIN 0.65MM QFP ZIF SOCKET AD
Packaging: Bulk
Module/Board Type: Socket Module - QFP
Produkt ist nicht verfügbar
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MPC860PZQ50D4 MPC860EC.pdf
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MPC860SRZQ66D4 MPC860EC.pdf
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Produkt ist nicht verfügbar
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NT2H2421G0DUFZ NT2H2421G0.pdf
Hersteller: NXP USA Inc.
Description: NT2H2421G0DUF
Packaging: Tray
Produkt ist nicht verfügbar
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NT2H2421G0DUDZ NT2H2421G0.pdf
Hersteller: NXP USA Inc.
Description: NT2H2421G0DUD
Packaging: Tray
Produkt ist nicht verfügbar
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NT2H2421S0DUDZ NT2H2421G0.pdf
Hersteller: NXP USA Inc.
Description: NT2H2421S0DUD
Packaging: Tray
Produkt ist nicht verfügbar
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MPC860TZQ66D4 MPC860EC.pdf
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
auf Bestellung 509 Stücke:
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2+340.09 EUR
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mpc8360evvagdga MPC8360E%2C8358E.pdf
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Produkt ist nicht verfügbar
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74LVC3G17GM,125 PHGLS27084-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LVC3G17GM - BUFFE
Packaging: Bulk
Package / Case: 8-XFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 32mA
Supplier Device Package: 8-XQFN (1.6x1.6)
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2701+0.21 EUR
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S912XEQ512AMAL MC9S12XEPB.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC33FS8430G2KSR2 FS84_FS85C_DS.pdf
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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SPC5604BACLQ6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 123
Produkt ist nicht verfügbar
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MPC8536EBVJAULA MPC8536E.pdf
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 783BGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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MKL26Z128VMC4 KL26P121M48SF4.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32B 128KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D - 16bit; D/A - 12bit
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 84
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PN7221EV/C100K PN7220.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443A, ISO 14443B, ISO 15693, Mifare, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Produkt ist nicht verfügbar
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T1024NXN7KQA T1024FS.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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LX2160SE72029B
Hersteller: NXP USA Inc.
Description: IC MPU QORLQ LX2 2GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
Produkt ist nicht verfügbar
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MCF52221CAF66
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 56
DigiKey Programmable: Not Verified
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LS1043AXN8PQB LS1043AFS.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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T2080NXN8PTB T2080FS.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
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MPC8245LZU300D MPC8245.pdf
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 300MHZ 352TBGA
Additional Interfaces: I2C, I²O, PCI, UART
Graphics Acceleration: No
RAM Controllers: SDRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 352-TBGA (35x35)
Voltage - I/O: 3.3V
Core Processor: PowerPC 603e
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 352-LBGA
Packaging: Tray
Produkt ist nicht verfügbar
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74AUP1G04GX/S500125 74AUP1G04.pdf
Hersteller: NXP USA Inc.
Description: IC INVERTER 1CH 1-INP 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 1
Supplier Device Package: 5-X2SON (0.80x0.80)
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 30pF
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
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MF3D43C0DA8/00J
Hersteller: NXP USA Inc.
Description: MF3D43C0DA8
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
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NT2H1511G0DUFZ
Hersteller: NXP USA Inc.
Description: NFC FORUM TYPE 2 TAG COMPLIANT I
Supplier Device Package: Wafer
Standards: ISO 14443, NFC
Operating Temperature: -25°C ~ 70°C (TA)
Type: RFID Reader/Transponder
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tray
Produkt ist nicht verfügbar
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FXLS93422AESR2 FXLS9xxxx.pdf
Hersteller: NXP USA Inc.
Description: PSI5 XZ DUAL-AXIS MEDIUM-G INER
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Produkt ist nicht verfügbar
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MRF9030LR1 MRF9030LR1.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 26V NI360
Packaging: Tape & Reel (TR)
Package / Case: NI-360
Mounting Type: Chassis Mount
Frequency: 945MHz
Power - Output: 30W
Gain: 19dB
Technology: LDMOS
Supplier Device Package: NI-360
Voltage - Rated: 68 V
Voltage - Test: 26 V
Current - Test: 250 mA
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MK21FX512VLQ12 K21P121M120SF5V2.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TJA1044DTK/0J TJA1044.pdf
Hersteller: NXP USA Inc.
Description: TJA1044DTK/0J
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
6000+0.6 EUR
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TJA1044BTK/0J TJA1044.pdf
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJA1044ETK/0J TJA1044.pdf
Hersteller: NXP USA Inc.
Description: TJA1044ETK/0J
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJA1044CTK/0J TJA1044.pdf
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJA1044ET/0Z TJA1044.pdf
Hersteller: NXP USA Inc.
Description: TJA1044ET/0Z
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJA1044CT/0Z TJA1044.pdf
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJA1044DT/0Z TJA1044.pdf
Hersteller: NXP USA Inc.
Description: TJA1044DT/0Z
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2500+0.61 EUR
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MKM35Z256VLL7R KM35P144M75SF0.pdf
Hersteller: NXP USA Inc.
Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 72
auf Bestellung 854 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+19.94 EUR
10+15.59 EUR
25+14.51 EUR
100+13.32 EUR
250+13.04 EUR
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MKM35Z512VLL7R KM35P144M75SF0.pdf
Hersteller: NXP USA Inc.
Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 72
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2+18.54 EUR
10+14.45 EUR
25+13.44 EUR
100+12.32 EUR
250+12.02 EUR
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MKM35Z256VLQ7R KM35P144M75SF0.pdf
Hersteller: NXP USA Inc.
Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Cut Tape (CT)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 99
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AnzahlPrivatkunde
2+18.77 EUR
10+14.64 EUR
25+13.61 EUR
100+12.48 EUR
250+12.19 EUR
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MKV10Z16VLF7
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKV10Z64VLH7 KV11P64M75.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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