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FS32K142URT0VLHT FS32K142URT0VLHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC16374ADGG,112 74LVC16374ADGG,112 NXP USA Inc. 74LVC_LVCH16374A.pdf Description: IC FF D-TYPE DUAL 8BIT 48TSSOP
Packaging: Bulk
auf Bestellung 7476 Stücke:
Lieferzeit 10-14 Tag (e)
1066+0.47 EUR
Mindestbestellmenge: 1066
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74LVT16373ADGG,112 74LVT16373ADGG,112 NXP USA Inc. 74LVT16373A.pdf Description: IC 16BIT TRANSP LATCH D 48TSSOP
Packaging: Bulk
auf Bestellung 8775 Stücke:
Lieferzeit 10-14 Tag (e)
703+0.72 EUR
Mindestbestellmenge: 703
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74ABT16244ADGG,112 74ABT16244ADGG,112 NXP USA Inc. 74ABT16244A.pdf Description: IC BUFF NON-INVERT 5.5V 48TSSOP
Packaging: Bulk
auf Bestellung 2822 Stücke:
Lieferzeit 10-14 Tag (e)
556+0.91 EUR
Mindestbestellmenge: 556
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74LVC16240ADGG,112 74LVC16240ADGG,112 NXP USA Inc. 74LVC16240A.pdf Description: IC INVERTER QUAD 4-INPUT 48TSSOP
Packaging: Bulk
auf Bestellung 1850 Stücke:
Lieferzeit 10-14 Tag (e)
552+0.91 EUR
Mindestbestellmenge: 552
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LPC1114LVFHN24/303 LPC1114LVFHN24/303 NXP USA Inc. LPC111XLV_LPC11XXLVUK.pdf Description: IC MCU 32BIT 32KB FLASH 24HVQFN
Packaging: Bulk
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 24-HVQFN (4x4)
Number of I/O: 20
DigiKey Programmable: Not Verified
auf Bestellung 1969 Stücke:
Lieferzeit 10-14 Tag (e)
162+2.88 EUR
Mindestbestellmenge: 162
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LPC1114FHN33/302:5 LPC1114FHN33/302:5 NXP USA Inc. UM10398.pdf Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Bulk
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 308 Stücke:
Lieferzeit 10-14 Tag (e)
151+3.09 EUR
Mindestbestellmenge: 151
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LPC1114LVFHI33/303 LPC1114LVFHI33/303 NXP USA Inc. LPC111XLV_LPC11XXLVUK.pdf Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 27
DigiKey Programmable: Not Verified
auf Bestellung 350 Stücke:
Lieferzeit 10-14 Tag (e)
143+3.25 EUR
Mindestbestellmenge: 143
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LPC1114JHN33/303E LPC1114JHN33/303E NXP USA Inc. LPC111X.pdf Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Bulk
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 12185 Stücke:
Lieferzeit 10-14 Tag (e)
146+3.19 EUR
Mindestbestellmenge: 146
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KW45B41Z-LOC NXP USA Inc. KW45.pdf Description: KW45B41Z-LOC
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Utilized IC / Part: KW45B41Z
Produkt ist nicht verfügbar
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MC32PF1550A4EPR2 MC32PF1550A4EPR2 NXP USA Inc. PF1550.pdf Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MC9S08LC60LH MC9S08LC60LH NXP USA Inc. MC9S08LC60.pdf Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SL2S2602FTBX SL2S2602FTBX NXP USA Inc. SL2S2602.pdf Description: ICODE
Packaging: Cut Tape (CT)
Package / Case: 3-XDFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: ISO 15693
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 1.3V
Standards: ISO 15693, ISO 18000-3
Supplier Device Package: 3-XSON (1x1.45)
auf Bestellung 648 Stücke:
Lieferzeit 10-14 Tag (e)
31+0.58 EUR
35+0.51 EUR
38+0.47 EUR
100+0.43 EUR
250+0.41 EUR
500+0.39 EUR
Mindestbestellmenge: 31
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NX5DV330DS,118 NX5DV330DS,118 NXP USA Inc. NX5DV330.pdf Description: IC VIDEO MUX/DEMUX 1X2 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 300MHz
Supplier Device Package: 16-SSOP
Voltage - Supply, Single (V+): 4V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 4
auf Bestellung 318919 Stücke:
Lieferzeit 10-14 Tag (e)
477+1.03 EUR
Mindestbestellmenge: 477
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MPC7410VS500LE MPC7410VS500LE NXP USA Inc. DS_568_MPC7410.pdf Description: IC MPU MPC74XX 500MHZ 360FCCLGA
Packaging: Tray
Package / Case: 360-CLGA, FCCLGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 360-FCCLGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MCF5481CVR166 MCF5481CVR166 NXP USA Inc. MCF5485EC.pdf Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 166MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V4E
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.43V ~ 1.58V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 99
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMX8MM6DVTLZAAR MIMX8MM6DVTLZAAR NXP USA Inc. IMX8MMCEC.pdf Description: IC MPU I.MX8MM 1.8GHZ 486LFBGA
Packaging: Cut Tape (CT)
Package / Case: 486-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-CSI, MIPI-DSI
Security Features: A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS
Additional Interfaces: I2C, I2S, eMMC/SDIO, PCIe, SPI, UART
auf Bestellung 730 Stücke:
Lieferzeit 10-14 Tag (e)
1+57.55 EUR
10+46.83 EUR
25+44.15 EUR
100+41.21 EUR
250+39.81 EUR
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S9KEAZN32AVLH S9KEAZN32AVLH NXP USA Inc. Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MR-CANHUBK344MIN NXP USA Inc. Description: MR-CANHUBK344MIN
Packaging: Box
Produkt ist nicht verfügbar
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MR-CANHUBK3 NXP USA Inc. Description: MOBILE ROBOTICS S32K3 T1 6XCAN H
Packaging: Bulk
Produkt ist nicht verfügbar
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74HCT138PW,112 74HCT138PW,112 NXP USA Inc. 74HC_HCT138.pdf Description: IC DECOD/DEMUX 3-8 LINE 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
auf Bestellung 15435 Stücke:
Lieferzeit 10-14 Tag (e)
1647+0.29 EUR
Mindestbestellmenge: 1647
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IMXEBOOKDC5 NXP USA Inc. IMXEBOOKDC5-UM.pdf Description: EPD DISPLAY PARALLEL INTERFACE
Packaging: Box
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
1+1366.94 EUR
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MC7410VU500LE MC7410VU500LE NXP USA Inc. DS_568_MPC7410.pdf Description: IC MPU MPC74XX 500MHZ 360CBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 360-CBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC7447AHX600NB MC7447AHX600NB NXP USA Inc. MPC7447AEC.pdf Description: IC MPU MPC74XX 600MHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC7447AHX867NB MC7447AHX867NB NXP USA Inc. MPC7447AEC.pdf Description: IC MPU MPC74XX 867MHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 867MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC7447ATHX1000NB MC7447ATHX1000NB NXP USA Inc. MPC7447AEC.pdf Description: IC MPU MPC74XX 1.0GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MIMX8ML8DVNLZCB MIMX8ML8DVNLZCB NXP USA Inc. MIMX8ML.pdf Description: MIMX8ML8DVNLZCB
Packaging: Tray
Package / Case: 548-LFBGA
Speed: 1.8GHz, 800MHz
RAM Size: 868KB
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7, Hi-Fi4 DSP
Connectivity: CANbus, Ethernet, I2C, I2S, PCIe, SD/SDIO, SPI, UART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 548-LFBGA (15x15)
Architecture: DSP, MCU, MPU
auf Bestellung 630 Stücke:
Lieferzeit 10-14 Tag (e)
1+73.39 EUR
10+60.39 EUR
25+59.04 EUR
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MIMX8ML8DVNLZDB MIMX8ML8DVNLZDB NXP USA Inc. MIMX8ML.pdf Description: MIMX8ML8DVNLZDB
Packaging: Tray
Package / Case: 548-LFBGA
Speed: 1.8GHz, 800MHz
RAM Size: 868KB
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7, Hi-Fi4 DSP
Connectivity: CANbus, Ethernet, I2C, I2S, PCIe, SD/SDIO, SPI, UART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 548-LFBGA (15x15)
Architecture: DSP, MCU, MPU
auf Bestellung 628 Stücke:
Lieferzeit 10-14 Tag (e)
1+73.39 EUR
10+60.39 EUR
25+59.04 EUR
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LFBGAMU3A NXP USA Inc. Description: 324 PIN 1.0MM PGA SOCKET SPACER
Packaging: Bulk
Module/Board Type: Socket Module - PGA
Produkt ist nicht verfügbar
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LFK77CINTPWC NXP USA Inc. Description: NXP MPC5777C 300MHZ416-PIN 1.0
Packaging: Bulk
Produkt ist nicht verfügbar
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PESD3V3V4UG,115 PESD3V3V4UG,115 NXP USA Inc. PESDXV4UF_G_W.pdf Description: TVS DIODE 3.3VWM 11VC 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 15pF @ 1MHz
Current - Peak Pulse (10/1000µs): 1.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 3.3V (Max)
Supplier Device Package: 5-TSSOP
Unidirectional Channels: 4
Voltage - Breakdown (Min): 5.3V
Voltage - Clamping (Max) @ Ipp: 11V
Power - Peak Pulse: 16W
Power Line Protection: No
Produkt ist nicht verfügbar
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PESD3V3V4UG,115 PESD3V3V4UG,115 NXP USA Inc. PESDXV4UF_G_W.pdf Description: TVS DIODE 3.3VWM 11VC 5TSSOP
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 15pF @ 1MHz
Current - Peak Pulse (10/1000µs): 1.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 3.3V (Max)
Supplier Device Package: 5-TSSOP
Unidirectional Channels: 4
Voltage - Breakdown (Min): 5.3V
Voltage - Clamping (Max) @ Ipp: 11V
Power - Peak Pulse: 16W
Power Line Protection: No
Produkt ist nicht verfügbar
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74HC652D,112 74HC652D,112 NXP USA Inc. 74HC%28T%29652.pdf Description: IC TXRX NON-INVERT 6V 24SO
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 8
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 24-SO
Produkt ist nicht verfügbar
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PCA9482UKZ NXP USA Inc. SDS_PCA9482UK.pdf Description: SWITCHED CAPACITOR CHARGER
Packaging: Tape & Reel (TR)
Package / Case: 42-UFBGA, WLCSP
Number of Cells: 1
Mounting Type: Surface Mount
Interface: I2C, USB
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 42-WLCSP (3.02x2.72)
Charge Current - Max: 7A
Programmable Features: Current, Timer, Voltage
Fault Protection: Over Temperature, Over-Under Voltage
Voltage - Supply (Max): 20V
Battery Pack Voltage: 7V (Max)
Current - Charging: Constant
Produkt ist nicht verfügbar
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LD6806CX4/25P,315 LD6806CX4/25P,315 NXP USA Inc. LD6806_Series.pdf Description: IC REG LINEAR 2.5V 200MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.1V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 9000 Stücke:
Lieferzeit 10-14 Tag (e)
3328+0.15 EUR
Mindestbestellmenge: 3328
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NCK2912AHN/T0B/UY NCK2912AHN/T0B/UY NXP USA Inc. Description: IC RF TXRX+MCU 48HVQFN
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC55S69JBD64Y LPC55S69JBD64Y NXP USA Inc. LPC55S6x.pdf Description: IC MCU 32BIT 640KB FLASH 64HTQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
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Lieferzeit 10-14 Tag (e)
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100+8.47 EUR
250+8.09 EUR
500+7.86 EUR
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LPC55S69JEV98Y LPC55S69JEV98Y NXP USA Inc. LPC55S6x.pdf Description: IC MCU 32BIT 640KB FLASH
Packaging: Cut Tape (CT)
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Number of I/O: 64
auf Bestellung 1976 Stücke:
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500+9.5 EUR
1000+9.16 EUR
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LPC55S69JBD100Y LPC55S69JBD100Y NXP USA Inc. LPC55S6x.pdf Description: IC MCU 32BIT 640KB FLSH 100HLQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
DigiKey Programmable: Not Verified
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74LVC1G332GXZ 74LVC1G332GXZ NXP USA Inc. 74LVC1G332.pdf Description: IC GATE OR 1CH 3-INP 6X2SON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 3
Supplier Device Package: 6-X2SON (1.0x0.8)
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 3.5ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
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74LVC1G332GF,132 74LVC1G332GF,132 NXP USA Inc. PHGLS23885-1.pdf?t.download=true&u=5oefqw Description: IC GATE OR 1CH 3-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 3
Supplier Device Package: 6-XSON (1x1)
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 3.5ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
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MW7IC2240NR1 MW7IC2240NR1 NXP USA Inc. MW7IC2040N.pdf Description: IC AMP W-CDMA 2.11-2.17GHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-16 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 2.11GHz ~ 2.17GHz
RF Type: W-CDMA
Voltage - Supply: 32V
Gain: 30dB
Current - Supply: 420mA
P1dB: 46dBm
Test Frequency: 2.14GHz
Supplier Device Package: TO-270 WBL-16
Produkt ist nicht verfügbar
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MPXHZ6400A6T1 MPXHZ6400A6T1 NXP USA Inc. MPXH6400A.pdf Description: SENSOR 58.02PSIA 4.8V 8SSOP
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.8 V
Operating Pressure: 2.9PSI ~ 58.02PSI (20kPa ~ 400kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.64V ~ 5.36V
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: No Port
Maximum Pressure: 232.06PSI (1600kPa)
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Lieferzeit 10-14 Tag (e)
1000+15.4 EUR
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MPXHZ6400A6T1 MPXHZ6400A6T1 NXP USA Inc. MPXH6400A.pdf Description: SENSOR 58.02PSIA 4.8V 8SSOP
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.8 V
Operating Pressure: 2.9PSI ~ 58.02PSI (20kPa ~ 400kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.64V ~ 5.36V
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: No Port
Maximum Pressure: 232.06PSI (1600kPa)
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
1+23.53 EUR
5+21.4 EUR
10+20.61 EUR
25+19.66 EUR
50+19.01 EUR
100+18.41 EUR
500+17.21 EUR
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MIMXRT1021CAG4BR MIMXRT1021CAG4BR NXP USA Inc. IMXRT1020IEC.pdf Description: IC MCU 32BIT 96KB ROM 144LQFP
Packaging: Cut Tape (CT)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 19x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.3V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 96
auf Bestellung 202 Stücke:
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2+14.33 EUR
10+12.44 EUR
25+11.57 EUR
100+10.62 EUR
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74ALVC14PW,112 74ALVC14PW,112 NXP USA Inc. 74ALVC14.pdf Description: IC HEX INV SCHMITT TRIG 14TSSOP
Packaging: Bulk
auf Bestellung 6007 Stücke:
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PCA9534PW,112 PCA9534PW,112 NXP USA Inc. PCA9534.pdf Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Features: POR
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
auf Bestellung 1089 Stücke:
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S912XEG256BVALR S912XEG256BVALR NXP USA Inc. Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XET256W1VALR S912XET256W1VALR NXP USA Inc. Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEG384BVALR S912XEG384BVALR NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEG384J2VALR S912XEG384J2VALR NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEQ512BVALR S912XEQ512BVALR NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEQ512BVALR S912XEQ512BVALR NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Cut Tape (CT)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEQ512F1VALR S912XEQ512F1VALR NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEP768BVALR NXP USA Inc. Description: IC MCU 16BIT 768KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 1.98V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
Produkt ist nicht verfügbar
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MPC8247CZQTIEA MPC8247CZQTIEA NXP USA Inc. MPC8272EC.pdf Description: IC MPU MPC82XX 400MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
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MMG20271H9T1 MMG20271H9T1 NXP USA Inc. Description: IC AMP LTE 1.5GHZ-2.7GHZ SOT89A
Packaging: Cut Tape (CT)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 1.5GHz ~ 2.7GHz
RF Type: LTE, TDS-CDMA, W-CDMA
Voltage - Supply: 5V
Gain: 16dB
Current - Supply: 215mA
Noise Figure: 1.7dB
P1dB: 27.5dBm
Test Frequency: 2.14GHz
Supplier Device Package: SOT-89A
Produkt ist nicht verfügbar
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BZA868AVL,115 BZA868AVL,115 NXP USA Inc. BZA800AVL_SERIES.pdf Description: TVS DIODE 6.8VWM 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Type: Zener
Applications: General Purpose
Capacitance @ Frequency: 180pF @ 1MHz
Voltage - Reverse Standoff (Typ): 6.8V
Supplier Device Package: SOT-353
Unidirectional Channels: 4
Power - Peak Pulse: 6W
Power Line Protection: No
Produkt ist nicht verfügbar
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BZA868AVL,115 BZA868AVL,115 NXP USA Inc. BZA800AVL_SERIES.pdf Description: TVS DIODE 6.8VWM 5TSSOP
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Type: Zener
Applications: General Purpose
Capacitance @ Frequency: 180pF @ 1MHz
Voltage - Reverse Standoff (Typ): 6.8V
Supplier Device Package: SOT-353
Unidirectional Channels: 4
Power - Peak Pulse: 6W
Power Line Protection: No
Produkt ist nicht verfügbar
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LFDBGK46MT4A NXP USA Inc. Description: 292 PIN 0.8MM PGA ADAPTER WITH A
Packaging: Bulk
For Use With/Related Products: MPC5746M
Module/Board Type: Socket Module - BGA
Utilized IC / Part: MPC5746M
Produkt ist nicht verfügbar
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FS32K142URT0VLHT S32K1xx.pdf
FS32K142URT0VLHT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC16374ADGG,112 74LVC_LVCH16374A.pdf
74LVC16374ADGG,112
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE DUAL 8BIT 48TSSOP
Packaging: Bulk
auf Bestellung 7476 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1066+0.47 EUR
Mindestbestellmenge: 1066
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74LVT16373ADGG,112 74LVT16373A.pdf
74LVT16373ADGG,112
Hersteller: NXP USA Inc.
Description: IC 16BIT TRANSP LATCH D 48TSSOP
Packaging: Bulk
auf Bestellung 8775 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
703+0.72 EUR
Mindestbestellmenge: 703
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74ABT16244ADGG,112 74ABT16244A.pdf
74ABT16244ADGG,112
Hersteller: NXP USA Inc.
Description: IC BUFF NON-INVERT 5.5V 48TSSOP
Packaging: Bulk
auf Bestellung 2822 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
556+0.91 EUR
Mindestbestellmenge: 556
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74LVC16240ADGG,112 74LVC16240A.pdf
74LVC16240ADGG,112
Hersteller: NXP USA Inc.
Description: IC INVERTER QUAD 4-INPUT 48TSSOP
Packaging: Bulk
auf Bestellung 1850 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
552+0.91 EUR
Mindestbestellmenge: 552
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LPC1114LVFHN24/303 LPC111XLV_LPC11XXLVUK.pdf
LPC1114LVFHN24/303
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 24HVQFN
Packaging: Bulk
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 24-HVQFN (4x4)
Number of I/O: 20
DigiKey Programmable: Not Verified
auf Bestellung 1969 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
162+2.88 EUR
Mindestbestellmenge: 162
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LPC1114FHN33/302:5 UM10398.pdf
LPC1114FHN33/302:5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Bulk
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 308 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
151+3.09 EUR
Mindestbestellmenge: 151
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LPC1114LVFHI33/303 LPC111XLV_LPC11XXLVUK.pdf
LPC1114LVFHI33/303
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 27
DigiKey Programmable: Not Verified
auf Bestellung 350 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
143+3.25 EUR
Mindestbestellmenge: 143
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LPC1114JHN33/303E LPC111X.pdf
LPC1114JHN33/303E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Bulk
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 12185 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
146+3.19 EUR
Mindestbestellmenge: 146
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KW45B41Z-LOC KW45.pdf
Hersteller: NXP USA Inc.
Description: KW45B41Z-LOC
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Utilized IC / Part: KW45B41Z
Produkt ist nicht verfügbar
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MC32PF1550A4EPR2 PF1550.pdf
MC32PF1550A4EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MC9S08LC60LH MC9S08LC60.pdf
MC9S08LC60LH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SL2S2602FTBX SL2S2602.pdf
SL2S2602FTBX
Hersteller: NXP USA Inc.
Description: ICODE
Packaging: Cut Tape (CT)
Package / Case: 3-XDFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: ISO 15693
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 1.3V
Standards: ISO 15693, ISO 18000-3
Supplier Device Package: 3-XSON (1x1.45)
auf Bestellung 648 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
31+0.58 EUR
35+0.51 EUR
38+0.47 EUR
100+0.43 EUR
250+0.41 EUR
500+0.39 EUR
Mindestbestellmenge: 31
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NX5DV330DS,118 NX5DV330.pdf
NX5DV330DS,118
Hersteller: NXP USA Inc.
Description: IC VIDEO MUX/DEMUX 1X2 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 300MHz
Supplier Device Package: 16-SSOP
Voltage - Supply, Single (V+): 4V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 4
auf Bestellung 318919 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
477+1.03 EUR
Mindestbestellmenge: 477
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MPC7410VS500LE DS_568_MPC7410.pdf
MPC7410VS500LE
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 500MHZ 360FCCLGA
Packaging: Tray
Package / Case: 360-CLGA, FCCLGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 360-FCCLGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MCF5481CVR166 MCF5485EC.pdf
MCF5481CVR166
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 166MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V4E
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.43V ~ 1.58V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 99
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMX8MM6DVTLZAAR IMX8MMCEC.pdf
MIMX8MM6DVTLZAAR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MM 1.8GHZ 486LFBGA
Packaging: Cut Tape (CT)
Package / Case: 486-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-CSI, MIPI-DSI
Security Features: A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS
Additional Interfaces: I2C, I2S, eMMC/SDIO, PCIe, SPI, UART
auf Bestellung 730 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+57.55 EUR
10+46.83 EUR
25+44.15 EUR
100+41.21 EUR
250+39.81 EUR
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S9KEAZN32AVLH
S9KEAZN32AVLH
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MR-CANHUBK344MIN
Hersteller: NXP USA Inc.
Description: MR-CANHUBK344MIN
Packaging: Box
Produkt ist nicht verfügbar
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MR-CANHUBK3
Hersteller: NXP USA Inc.
Description: MOBILE ROBOTICS S32K3 T1 6XCAN H
Packaging: Bulk
Produkt ist nicht verfügbar
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74HCT138PW,112 74HC_HCT138.pdf
74HCT138PW,112
Hersteller: NXP USA Inc.
Description: IC DECOD/DEMUX 3-8 LINE 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
auf Bestellung 15435 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1647+0.29 EUR
Mindestbestellmenge: 1647
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IMXEBOOKDC5 IMXEBOOKDC5-UM.pdf
Hersteller: NXP USA Inc.
Description: EPD DISPLAY PARALLEL INTERFACE
Packaging: Box
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+1366.94 EUR
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MC7410VU500LE DS_568_MPC7410.pdf
MC7410VU500LE
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 500MHZ 360CBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 360-CBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC7447AHX600NB MPC7447AEC.pdf
MC7447AHX600NB
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 600MHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC7447AHX867NB MPC7447AEC.pdf
MC7447AHX867NB
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 867MHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 867MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MC7447ATHX1000NB MPC7447AEC.pdf
MC7447ATHX1000NB
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 1.0GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MIMX8ML8DVNLZCB MIMX8ML.pdf
MIMX8ML8DVNLZCB
Hersteller: NXP USA Inc.
Description: MIMX8ML8DVNLZCB
Packaging: Tray
Package / Case: 548-LFBGA
Speed: 1.8GHz, 800MHz
RAM Size: 868KB
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7, Hi-Fi4 DSP
Connectivity: CANbus, Ethernet, I2C, I2S, PCIe, SD/SDIO, SPI, UART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 548-LFBGA (15x15)
Architecture: DSP, MCU, MPU
auf Bestellung 630 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+73.39 EUR
10+60.39 EUR
25+59.04 EUR
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MIMX8ML8DVNLZDB MIMX8ML.pdf
MIMX8ML8DVNLZDB
Hersteller: NXP USA Inc.
Description: MIMX8ML8DVNLZDB
Packaging: Tray
Package / Case: 548-LFBGA
Speed: 1.8GHz, 800MHz
RAM Size: 868KB
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7, Hi-Fi4 DSP
Connectivity: CANbus, Ethernet, I2C, I2S, PCIe, SD/SDIO, SPI, UART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 548-LFBGA (15x15)
Architecture: DSP, MCU, MPU
auf Bestellung 628 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+73.39 EUR
10+60.39 EUR
25+59.04 EUR
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LFBGAMU3A
Hersteller: NXP USA Inc.
Description: 324 PIN 1.0MM PGA SOCKET SPACER
Packaging: Bulk
Module/Board Type: Socket Module - PGA
Produkt ist nicht verfügbar
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LFK77CINTPWC
Hersteller: NXP USA Inc.
Description: NXP MPC5777C 300MHZ416-PIN 1.0
Packaging: Bulk
Produkt ist nicht verfügbar
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PESD3V3V4UG,115 PESDXV4UF_G_W.pdf
PESD3V3V4UG,115
Hersteller: NXP USA Inc.
Description: TVS DIODE 3.3VWM 11VC 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 15pF @ 1MHz
Current - Peak Pulse (10/1000µs): 1.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 3.3V (Max)
Supplier Device Package: 5-TSSOP
Unidirectional Channels: 4
Voltage - Breakdown (Min): 5.3V
Voltage - Clamping (Max) @ Ipp: 11V
Power - Peak Pulse: 16W
Power Line Protection: No
Produkt ist nicht verfügbar
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PESD3V3V4UG,115 PESDXV4UF_G_W.pdf
PESD3V3V4UG,115
Hersteller: NXP USA Inc.
Description: TVS DIODE 3.3VWM 11VC 5TSSOP
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 15pF @ 1MHz
Current - Peak Pulse (10/1000µs): 1.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 3.3V (Max)
Supplier Device Package: 5-TSSOP
Unidirectional Channels: 4
Voltage - Breakdown (Min): 5.3V
Voltage - Clamping (Max) @ Ipp: 11V
Power - Peak Pulse: 16W
Power Line Protection: No
Produkt ist nicht verfügbar
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74HC652D,112 74HC%28T%29652.pdf
74HC652D,112
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 6V 24SO
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 8
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 24-SO
Produkt ist nicht verfügbar
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PCA9482UKZ SDS_PCA9482UK.pdf
Hersteller: NXP USA Inc.
Description: SWITCHED CAPACITOR CHARGER
Packaging: Tape & Reel (TR)
Package / Case: 42-UFBGA, WLCSP
Number of Cells: 1
Mounting Type: Surface Mount
Interface: I2C, USB
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 42-WLCSP (3.02x2.72)
Charge Current - Max: 7A
Programmable Features: Current, Timer, Voltage
Fault Protection: Over Temperature, Over-Under Voltage
Voltage - Supply (Max): 20V
Battery Pack Voltage: 7V (Max)
Current - Charging: Constant
Produkt ist nicht verfügbar
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LD6806CX4/25P,315 LD6806_Series.pdf
LD6806CX4/25P,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.5V 200MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.1V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 9000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3328+0.15 EUR
Mindestbestellmenge: 3328
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NCK2912AHN/T0B/UY
NCK2912AHN/T0B/UY
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 48HVQFN
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC55S69JBD64Y LPC55S6x.pdf
LPC55S69JBD64Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 640KB FLASH 64HTQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
auf Bestellung 875 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+12.87 EUR
10+9.99 EUR
25+9.26 EUR
100+8.47 EUR
250+8.09 EUR
500+7.86 EUR
Mindestbestellmenge: 2
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LPC55S69JEV98Y LPC55S6x.pdf
LPC55S69JEV98Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 640KB FLASH
Packaging: Cut Tape (CT)
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Number of I/O: 64
auf Bestellung 1976 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+13.11 EUR
10+11.63 EUR
25+11.09 EUR
50+10.7 EUR
100+10.33 EUR
250+9.85 EUR
500+9.5 EUR
1000+9.16 EUR
Mindestbestellmenge: 2
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LPC55S69JBD100Y LPC55S6x.pdf
LPC55S69JBD100Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 640KB FLSH 100HLQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+14.94 EUR
10+11.62 EUR
25+10.79 EUR
100+9.88 EUR
250+9.44 EUR
500+9.18 EUR
Mindestbestellmenge: 2
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74LVC1G332GXZ 74LVC1G332.pdf
74LVC1G332GXZ
Hersteller: NXP USA Inc.
Description: IC GATE OR 1CH 3-INP 6X2SON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 3
Supplier Device Package: 6-X2SON (1.0x0.8)
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 3.5ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
auf Bestellung 128700 Stücke:
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Anzahl Preis
4543+0.12 EUR
Mindestbestellmenge: 4543
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74LVC1G332GF,132 PHGLS23885-1.pdf?t.download=true&u=5oefqw
74LVC1G332GF,132
Hersteller: NXP USA Inc.
Description: IC GATE OR 1CH 3-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 3
Supplier Device Package: 6-XSON (1x1)
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 3.5ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
auf Bestellung 329005 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2613+0.18 EUR
Mindestbestellmenge: 2613
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MW7IC2240NR1 MW7IC2040N.pdf
MW7IC2240NR1
Hersteller: NXP USA Inc.
Description: IC AMP W-CDMA 2.11-2.17GHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-16 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 2.11GHz ~ 2.17GHz
RF Type: W-CDMA
Voltage - Supply: 32V
Gain: 30dB
Current - Supply: 420mA
P1dB: 46dBm
Test Frequency: 2.14GHz
Supplier Device Package: TO-270 WBL-16
Produkt ist nicht verfügbar
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MPXHZ6400A6T1 MPXH6400A.pdf
MPXHZ6400A6T1
Hersteller: NXP USA Inc.
Description: SENSOR 58.02PSIA 4.8V 8SSOP
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.8 V
Operating Pressure: 2.9PSI ~ 58.02PSI (20kPa ~ 400kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.64V ~ 5.36V
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: No Port
Maximum Pressure: 232.06PSI (1600kPa)
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+15.4 EUR
Mindestbestellmenge: 1000
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MPXHZ6400A6T1 MPXH6400A.pdf
MPXHZ6400A6T1
Hersteller: NXP USA Inc.
Description: SENSOR 58.02PSIA 4.8V 8SSOP
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.8 V
Operating Pressure: 2.9PSI ~ 58.02PSI (20kPa ~ 400kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.64V ~ 5.36V
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: No Port
Maximum Pressure: 232.06PSI (1600kPa)
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+23.53 EUR
5+21.4 EUR
10+20.61 EUR
25+19.66 EUR
50+19.01 EUR
100+18.41 EUR
500+17.21 EUR
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MIMXRT1021CAG4BR IMXRT1020IEC.pdf
MIMXRT1021CAG4BR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 96KB ROM 144LQFP
Packaging: Cut Tape (CT)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 19x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.3V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 96
auf Bestellung 202 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+14.33 EUR
10+12.44 EUR
25+11.57 EUR
100+10.62 EUR
Mindestbestellmenge: 2
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74ALVC14PW,112 74ALVC14.pdf
74ALVC14PW,112
Hersteller: NXP USA Inc.
Description: IC HEX INV SCHMITT TRIG 14TSSOP
Packaging: Bulk
auf Bestellung 6007 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2153+0.24 EUR
Mindestbestellmenge: 2153
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PCA9534PW,112 PCA9534.pdf
PCA9534PW,112
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Features: POR
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
auf Bestellung 1089 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
333+1.52 EUR
Mindestbestellmenge: 333
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S912XEG256BVALR
S912XEG256BVALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XET256W1VALR
S912XET256W1VALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEG384BVALR
S912XEG384BVALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEG384J2VALR
S912XEG384J2VALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEQ512BVALR MC9S12XEPB.pdf
S912XEQ512BVALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEQ512BVALR MC9S12XEPB.pdf
S912XEQ512BVALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Cut Tape (CT)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEQ512F1VALR MC9S12XEPB.pdf
S912XEQ512F1VALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEP768BVALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 768KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 1.98V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
Produkt ist nicht verfügbar
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MPC8247CZQTIEA MPC8272EC.pdf
MPC8247CZQTIEA
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 400MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
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MMG20271H9T1
MMG20271H9T1
Hersteller: NXP USA Inc.
Description: IC AMP LTE 1.5GHZ-2.7GHZ SOT89A
Packaging: Cut Tape (CT)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 1.5GHz ~ 2.7GHz
RF Type: LTE, TDS-CDMA, W-CDMA
Voltage - Supply: 5V
Gain: 16dB
Current - Supply: 215mA
Noise Figure: 1.7dB
P1dB: 27.5dBm
Test Frequency: 2.14GHz
Supplier Device Package: SOT-89A
Produkt ist nicht verfügbar
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BZA868AVL,115 BZA800AVL_SERIES.pdf
BZA868AVL,115
Hersteller: NXP USA Inc.
Description: TVS DIODE 6.8VWM 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Type: Zener
Applications: General Purpose
Capacitance @ Frequency: 180pF @ 1MHz
Voltage - Reverse Standoff (Typ): 6.8V
Supplier Device Package: SOT-353
Unidirectional Channels: 4
Power - Peak Pulse: 6W
Power Line Protection: No
Produkt ist nicht verfügbar
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BZA868AVL,115 BZA800AVL_SERIES.pdf
BZA868AVL,115
Hersteller: NXP USA Inc.
Description: TVS DIODE 6.8VWM 5TSSOP
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Type: Zener
Applications: General Purpose
Capacitance @ Frequency: 180pF @ 1MHz
Voltage - Reverse Standoff (Typ): 6.8V
Supplier Device Package: SOT-353
Unidirectional Channels: 4
Power - Peak Pulse: 6W
Power Line Protection: No
Produkt ist nicht verfügbar
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LFDBGK46MT4A
Hersteller: NXP USA Inc.
Description: 292 PIN 0.8MM PGA ADAPTER WITH A
Packaging: Bulk
For Use With/Related Products: MPC5746M
Module/Board Type: Socket Module - BGA
Utilized IC / Part: MPC5746M
Produkt ist nicht verfügbar
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