Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36920) > Seite 533 nach 616
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| LFBGARBZ1BO | NXP USA Inc. |
Description: NXP LEAD FREE 522 PIN 1.0 MM PIT Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| PNEV5190BP | NXP USA Inc. |
 Description: EVAL BOARD FOR PN5190Packaging: Bulk Type: Near Field Communication (NFC) Contents: Board(s) Utilized IC / Part: PN5190 Supplied Contents: Board(s) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| LFTAS32K3H1H2A | NXP USA Inc. |
Description: IC Packaging: Box For Use With/Related Products: S32K3 Module/Board Type: Adapter Board |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| LFVBBK77CWA | NXP USA Inc. |
Description: QORIVVA MPC5777C 416 PIN 1.0MM V Packaging: Bulk For Use With/Related Products: MPC5777C Accessory Type: Base Board |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| RDWWAB-8897-S1 | NXP USA Inc. |
Description: RDWWAB-8897-S1 Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| XS32K388EVB-Q289 | NXP USA Inc. |
Description: IC Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
 |
T4241NXE7TTB | NXP USA Inc. |
Description: IC MPU QORIQ T4 1.8GHZ 1932BGA Packaging: Bulk Package / Case: 1932-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.8GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e6500 Voltage - I/O: 1.8V, 2.5V Supplier Device Package: 1932-FCPBGA (45x45) Ethernet: 1Gbps (13), 10Gbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 24 Core, 64-Bit RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
|
|
T4241NXE7TTB | NXP USA Inc. |
Description: IC MPU QORIQ T4 1.8GHZ 1932BGA Packaging: Tray Package / Case: 1932-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.8GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e6500 Voltage - I/O: 1.8V, 2.5V Supplier Device Package: 1932-FCPBGA (45x45) Ethernet: 1Gbps (13), 10Gbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 24 Core, 64-Bit RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 12 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
MFS2300BMBA0EP | NXP USA Inc. |
Description: MFS2300BMBA0EP Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 5.5V ~ 40V Applications: System Basis Chip Current - Supply: 40µA Supplier Device Package: 48-HVQFN (7x7) |
auf Bestellung 520 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
|
|
MFS2300BMBA0EP | NXP USA Inc. |
Description: MFS2300BMBA0EP Packaging: Cut Tape (CT) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 5.5V ~ 40V Applications: System Basis Chip Current - Supply: 40µA Supplier Device Package: 48-HVQFN (7x7) |
auf Bestellung 744 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
|
|
MFS2303BMBA3EP | NXP USA Inc. |
Description: MFS2303BMBA3EP Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 5.5V ~ 40V Applications: System Basis Chip Current - Supply: 40µA Supplier Device Package: 48-HVQFN (7x7) |
auf Bestellung 216 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
 |
MFS2400AVMA1ES | NXP USA Inc. |
Description: Safety Mini CAN FD SBC Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 115°C (TA) Voltage - Supply: 5.5V ~ 40V Applications: System Basis Chip Supplier Device Package: 32-HVQFN (5x5) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 402 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
 |
MFS5600AMEA0ES | NXP USA Inc. |
Description: DUAL 36V AUTOMOTIVE DC-DC CONTRO Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.7V ~ 36V Current - Supply: 140µA Supplier Device Package: 32-HVQFN (5x5) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 490 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
|
|
MFS2320BMBA0EP | NXP USA Inc. |
Description: MFS2320BMBA0EP Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 5.5V ~ 40V Applications: System Basis Chip Current - Supply: 30µA Supplier Device Package: 48-HVQFN (7x7) |
auf Bestellung 90 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
|
|
MFS2401AVBA0ES | NXP USA Inc. |
Description: MFS2401AVBA0ES Packaging: Bulk Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 115°C (TA) Voltage - Supply: 5.5V ~ 40V Applications: System Basis Chip Supplier Device Package: 32-HVQFN (5x5) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 490 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
|
|
MFS2401AVBA1ES | NXP USA Inc. |
Description: Safety Mini CAN FD SBC Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 115°C (TA) Voltage - Supply: 5.5V ~ 40V Applications: System Basis Chip Supplier Device Package: 32-HVQFN (5x5) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 127 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
 |
MFS2621AMDABAD | NXP USA Inc. |
Description: SAFETY SYSTEM BASIS CHIP WITH LO Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3.2V ~ 40V Supplier Device Package: 48-LQFP-EP (7x7) Grade: Automotive |
auf Bestellung 249 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
|
|
MFS2633AMBA0AD | NXP USA Inc. |
Description: SAFETY SYSTEM BASIS CHIP WITH LO Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3.2V ~ 40V Current - Supply: 29µA Supplier Device Package: 48-LQFP-EP (7x7) Grade: Automotive |
auf Bestellung 153 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
 |
MFS8610BMBA0ES | NXP USA Inc. |
Description: IC FS86 SYSTEM BASIS CHIP ASIL Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 60V Applications: Camera Supplier Device Package: 48-QFN (7x7) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 260 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
|
|
MFS2613AMDA6AD | NXP USA Inc. |
Description: SAFETY SYSTEM BASIS CHIP WITH LO Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3.2V ~ 40V Supplier Device Package: 48-LQFP-EP (7x7) Grade: Automotive |
auf Bestellung 60 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
|
|
MFS2613AMDDCAD | NXP USA Inc. |
Description: SAFETY SYSTEM BASIS CHIP WITH LO Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3.2V ~ 40V Supplier Device Package: 48-LQFP-EP (7x7) Grade: Automotive |
auf Bestellung 220 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
|
|
MFS8633BMDA0ES | NXP USA Inc. |
Description: IC FS86 SYSTEM BASIS CHIP ASIL Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 36V Applications: Camera Supplier Device Package: 48-QFN (7x7) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 260 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
|
|
MFS8610BMDA0ES | NXP USA Inc. |
Description: IC FS86 SYSTEM BASIS CHIP ASIL Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 60V Applications: Camera Supplier Device Package: 48-QFN (7x7) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 250 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
|
|
MFS8613BMBA0ES | NXP USA Inc. |
Description: IC FS86 SYSTEM BASIS CHIP ASIL Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 60V Applications: Camera Supplier Device Package: 48-QFN (7x7) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 260 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
| S9S12GN48J0VLH | NXP USA Inc. |
Description: S12 CORE,48K FLASH Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1.5K x 8 Core Processor: S12 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 800 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| MGD3162AM580EKR2 | NXP USA Inc. |
Description: IC Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| MGD3162AM580EKT | NXP USA Inc. |
Description: IC Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 176 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
 |
PVF60NN151CMK50 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 364BGA Packaging: Tray Package / Case: 364-LFBGA Mounting Type: Surface Mount Speed: 500MHz RAM Size: 1.5MB Operating Temperature: -40°C ~ 85°C Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-A5 + Cortex®-M4 Data Converters: A/D 12bit SAR; D/A 12bit Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, SCI, SD, SPI, UART/USART, USB OTG Peripherals: DMA, LVD, WDT Supplier Device Package: 364-LFBGA (17x17) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
MC9328MXLVP15 | NXP USA Inc. |
Description: IC MPU I.MXL 150MHZ 225MAPBGA Packaging: Tray Package / Case: 225-LFBGA Mounting Type: Surface Mount Speed: 150MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: ARM920T Voltage - I/O: 1.8V, 3.0V Supplier Device Package: 225-MAPBGA (13x13) USB: USB 1.x (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
S32K396EHT1MJBST | NXP USA Inc. |
Description: S32K396 Arm Cortex-M7 Packaging: Tray |
auf Bestellung 672 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
|
|
S32K394NHT1MJBSR | NXP USA Inc. |
Description: S32K394NHT1MJBSR Packaging: Tape & Reel (TR) Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 320MHz Program Memory Size: 4MB (4M x 8) RAM Size: 800K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 69x12b SAR, Sigma-Delta Core Size: 32-Bit Quad-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, QSPI, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 289-LFBGA (14x14) Grade: Automotive Number of I/O: 209 Qualification: AEC-Q100 |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
|
|
S32K396NHT1MJBSR | NXP USA Inc. |
Description: S32K396NHT1MJBSR Packaging: Tape & Reel (TR) Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 320MHz Program Memory Size: 6MB (6M x 8) RAM Size: 800K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 69x12b SAR, Sigma-Delta Core Size: 32-Bit Quad-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, QSPI, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 289-LFBGA (14x14) Grade: Automotive Number of I/O: 209 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
S32K396EHT1MJBSR | NXP USA Inc. |
Description: S32K396EHT1MJBSR Packaging: Tape & Reel (TR) Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 320MHz Program Memory Size: 6MB (6M x 8) RAM Size: 800K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 69x12b SAR, Sigma-Delta Core Size: 32-Bit Quad-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 289-LFBGA (14x14) Grade: Automotive Number of I/O: 209 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
MPC8245TVV266D | NXP USA Inc. |
Description: IC MPU MPC82XX 266MHZ 352TBGA Packaging: Tray Package / Case: 352-LBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC 603e Voltage - I/O: 3.3V Supplier Device Package: 352-TBGA (35x35) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: SDRAM Graphics Acceleration: No Additional Interfaces: I2C, I²O, PCI, UART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
MPC8245TVV300D | NXP USA Inc. |
Description: IC MPU MPC82XX 300MHZ 352TBGA Packaging: Tray Package / Case: 352-LBGA Mounting Type: Surface Mount Speed: 300MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC 603e Voltage - I/O: 3.3V Supplier Device Package: 352-TBGA (35x35) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: SDRAM Graphics Acceleration: No Additional Interfaces: I2C, I²O, PCI, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 24 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
S9S12G48J0CLF | NXP USA Inc. |
Description: S12 CORE,64K FLASH,AU Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1.5K x 8 Core Processor: S12 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
S9S12G64J0MLF | NXP USA Inc. |
Description: S12 CORE,64K FLASH,AU Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
S9S12G48J0CLFR | NXP USA Inc. |
Description: S12 CORE,64K FLASH, Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1.5K x 8 Core Processor: S12 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
S9S12G64J0CLFR | NXP USA Inc. |
Description: S12 CORE,64K FLASH,AU Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
S9S12G64J0CLF | NXP USA Inc. |
Description: S12 CORE,64K FLASH,AU Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
S9S12G48J0MLFR | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1.5K x 8 Core Processor: S12 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
S9S12G48J0MLF | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1.5K x 8 Core Processor: S12 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
MIMXRT555SFAWCR | NXP USA Inc. |
Description: IC MCU 32BIT 192KB ROM 141WLCSP Packaging: Cut Tape (CT) Package / Case: 141-XFBGA, WLCSP Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 192KB (192K x 8) RAM Size: 5M x 8 Operating Temperature: -20°C ~ 70°C (TA) Oscillator Type: External, Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB Peripherals: DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 141-WLCSP (4.53x4.53) Number of I/O: 136 DigiKey Programmable: Not Verified |
auf Bestellung 5418 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
| MIMXRT555SFFOCR | NXP USA Inc. |
Description: IC MCU 32BIT 192KB ROM 249FOWLP Packaging: Cut Tape (CT) Package / Case: 249-WFBGA Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 192KB (192K x 8) RAM Size: 5M x 8 Operating Temperature: -20°C ~ 70°C (TA) Oscillator Type: External, Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB Peripherals: DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 249-FOWLP (7x7) Number of I/O: 136 DigiKey Programmable: Not Verified |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||
 |
MIMXRT595SFFOCR | NXP USA Inc. |
Description: IC MCU 32BIT 192KB ROM 249WFBGA Packaging: Cut Tape (CT) Package / Case: 249-WFBGA Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 192KB (192K x 8) RAM Size: 5M x 8 Operating Temperature: -20°C ~ 70°C (TA) Oscillator Type: External, Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB Peripherals: DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 249-FOWLP (7x7) Number of I/O: 136 DigiKey Programmable: Not Verified |
auf Bestellung 323 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
 |
MCHC908GR8MFAE | NXP USA Inc. |
Description: IC MCU 8BIT 7.5KB FLASH 32LQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 7.5KB (7.5K x 8) RAM Size: 384 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 6x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 32-LQFP (7x7) Number of I/O: 21 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
SE051C2HQ1/Z01XDZ | NXP USA Inc. |
Description: SE051C2HQ1 Packaging: Tape & Reel (TR) Package / Case: 20-XFQFN Exposed Pad Mounting Type: Surface Mount Type: IoT Secure Element Supplier Device Package: 20-HX2QFN (3x3) |
auf Bestellung 54000 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
| MPF5301AMDA0ESR2 | NXP USA Inc. |
Description: IC REG BUCK ADJ 8A 24HWQFN Packaging: Tape & Reel (TR) Package / Case: 24-PowerWFQFN Output Type: Adjustable Mounting Type: Surface Mount, Wettable Flank Number of Outputs: 1 Function: Step-Down Current - Output: 8A Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: Positive Frequency - Switching: 2MHz ~ 3MHz Voltage - Input (Max): 5.5V Topology: Buck Supplier Device Package: 24-HWQFN (4.5x3.5) Synchronous Rectifier: No Voltage - Output (Max): 1.2V Voltage - Input (Min): 2.7V Voltage - Output (Min/Fixed): 0.5V |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
 |
PCAL9722HN-ARD | NXP USA Inc. |
Description: PCAL9722HN-ARD Packaging: Bulk Function: I/O Expansion Type: Interface Contents: Board(s) Utilized IC / Part: PCAL9722 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
MFS2321BMBB2EPR2 | NXP USA Inc. |
Description: MFS2321BMBB2EPR2 Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 5.5V ~ 40V Applications: System Basis Chip Supplier Device Package: 48-HVQFN (7x7) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
MFS2321BMBB2EP | NXP USA Inc. |
Description: MFS2321BMBB2EP Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 5.5V ~ 40V Applications: System Basis Chip Supplier Device Package: 48-HVQFN (7x7) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| NCF295GVHN7/0501YY | NXP USA Inc. |
Description: IC Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
 |
PN5190B2HN/C131Y | NXP USA Inc. |
Description: PN5190B2HN/C131Y Packaging: Tape & Reel (TR) Package / Case: 40-VFLGA Exposed Pad Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C, SPI, USB Type: RFID Reader/Transponder Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.4V ~ 5.5V Standards: FeliCa, ISO 14443A, ISO 14443B, Mifare, NFC Supplier Device Package: 40-VFLGA (5x5) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 6000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
PN5190B1HN/C127Y | NXP USA Inc. |
Description: PN5190B1HN/C127Y Packaging: Tape & Reel (TR) Package / Case: 40-VFLGA Exposed Pad Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C, SPI, USB Type: RFID Reader/Transponder Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.4V ~ 5.5V Standards: FeliCa, ISO 14443-A, ISO 14443-B, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, Mifare, NFC Supplier Device Package: 40-VFLGA (5x5) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 6000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
PN5190B2EV/C131Y | NXP USA Inc. |
Description: PN5190B2EV/C131Y Packaging: Tape & Reel (TR) Package / Case: 64-VFBGA Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C, SPI, USB Type: RFID Reader/Transponder Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.4V ~ 5.5V Standards: FeliCa, ISO 14443A, ISO 14443B, Mifare, NFC Supplier Device Package: 64-VFBGA (4.5x4.5) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
PN5190B1EV/C127Y | NXP USA Inc. |
Description: PN5190B1EV/C127Y Packaging: Tape & Reel (TR) Package / Case: 64-VFBGA Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C, SPI, USB Type: RFID Reader/Transponder Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.4V ~ 5.5V Standards: FeliCa, ISO 14443-A, ISO 14443-B, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, Mifare, NFC Supplier Device Package: 64-VFBGA (4.5x4.5) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
|
|
PN5190B2HN/C131K | NXP USA Inc. |
Description: PN5190B2HN/C131K Packaging: Tray Package / Case: 40-VFLGA Exposed Pad Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C, SPI, USB Type: RFID Reader/Transponder Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.4V ~ 5.5V Standards: FeliCa, ISO 14443A, ISO 14443B, Mifare, NFC Supplier Device Package: 40-VFLGA (5x5) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| PN5190B2EV/C131K | NXP USA Inc. |
Description: PN5190B2EV/C131K Packaging: Tray Package / Case: 64-VFBGA Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C, SPI, USB Type: RFID Reader/Transponder Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.4V ~ 5.5V Standards: FeliCa, ISO 14443A, ISO 14443B, Mifare, NFC Supplier Device Package: 64-VFBGA (4.5x4.5) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2450 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| PN5190B1EV/C127K | NXP USA Inc. |
Description: PN5190B1EV/C127K Packaging: Tray Package / Case: 64-VFBGA Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C, SPI, USB Type: RFID Reader/Transponder Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.4V ~ 5.5V Standards: FeliCa, ISO 14443-A, ISO 14443-B, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, Mifare, NFC Supplier Device Package: 64-VFBGA (4.5x4.5) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2450 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
|
|
PN7642EV/C101K | NXP USA Inc. |
Description: PN7642EV/C101K Packaging: Tray Package / Case: 64-VFBGA Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C, SPI, UART, USB Type: RFID Reader/Transponder Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.4V ~ 5.5V Standards: FeliCa, ISO 14443-3/4-A, ISO 14443-3/4-B, ISO 15693, ISO 18000-3, Mifare, NFC Supplier Device Package: 64-VFBGA (4.5x4.5) |
auf Bestellung 1650 Stücke: Lieferzeit 10-14 Tag (e) |
|
| PNEV5190BP |
|
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR PN5190
Packaging: Bulk
Type: Near Field Communication (NFC)
Contents: Board(s)
Utilized IC / Part: PN5190
Supplied Contents: Board(s)
Description: EVAL BOARD FOR PN5190
Packaging: Bulk
Type: Near Field Communication (NFC)
Contents: Board(s)
Utilized IC / Part: PN5190
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LFTAS32K3H1H2A |
Hersteller: NXP USA Inc.
Description: IC
Packaging: Box
For Use With/Related Products: S32K3
Module/Board Type: Adapter Board
Description: IC
Packaging: Box
For Use With/Related Products: S32K3
Module/Board Type: Adapter Board
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LFVBBK77CWA |
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5777C 416 PIN 1.0MM V
Packaging: Bulk
For Use With/Related Products: MPC5777C
Accessory Type: Base Board
Description: QORIVVA MPC5777C 416 PIN 1.0MM V
Packaging: Bulk
For Use With/Related Products: MPC5777C
Accessory Type: Base Board
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| T4241NXE7TTB |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T4 1.8GHZ 1932BGA
Packaging: Bulk
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (13), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 24 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
Description: IC MPU QORIQ T4 1.8GHZ 1932BGA
Packaging: Bulk
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (13), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 24 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 3983.54 EUR |
| T4241NXE7TTB |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T4 1.8GHZ 1932BGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (13), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 24 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
Description: IC MPU QORIQ T4 1.8GHZ 1932BGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (13), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 24 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
Produkt ist nicht verfügbar
Mindestbestellmenge: 12 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MFS2300BMBA0EP |
|
Hersteller: NXP USA Inc.
Description: MFS2300BMBA0EP
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 40µA
Supplier Device Package: 48-HVQFN (7x7)
Description: MFS2300BMBA0EP
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 40µA
Supplier Device Package: 48-HVQFN (7x7)
auf Bestellung 520 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 260+ | 5.84 EUR |
| 520+ | 5.66 EUR |
| MFS2300BMBA0EP |
|
Hersteller: NXP USA Inc.
Description: MFS2300BMBA0EP
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 40µA
Supplier Device Package: 48-HVQFN (7x7)
Description: MFS2300BMBA0EP
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 40µA
Supplier Device Package: 48-HVQFN (7x7)
auf Bestellung 744 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 9.47 EUR |
| 10+ | 7.21 EUR |
| 25+ | 6.65 EUR |
| 100+ | 6.03 EUR |
| MFS2303BMBA3EP |
|
Hersteller: NXP USA Inc.
Description: MFS2303BMBA3EP
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 40µA
Supplier Device Package: 48-HVQFN (7x7)
Description: MFS2303BMBA3EP
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 40µA
Supplier Device Package: 48-HVQFN (7x7)
auf Bestellung 216 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 11.94 EUR |
| 10+ | 9.16 EUR |
| 25+ | 8.47 EUR |
| 100+ | 7.71 EUR |
| MFS2400AVMA1ES |
|
Hersteller: NXP USA Inc.
Description: Safety Mini CAN FD SBC
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Description: Safety Mini CAN FD SBC
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 402 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 10.78 EUR |
| 10+ | 8.26 EUR |
| 25+ | 7.62 EUR |
| 100+ | 6.93 EUR |
| MFS5600AMEA0ES |
|
Hersteller: NXP USA Inc.
Description: DUAL 36V AUTOMOTIVE DC-DC CONTRO
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 36V
Current - Supply: 140µA
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Description: DUAL 36V AUTOMOTIVE DC-DC CONTRO
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 36V
Current - Supply: 140µA
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 9.81 EUR |
| 10+ | 7.5 EUR |
| 25+ | 6.91 EUR |
| 100+ | 6.28 EUR |
| 490+ | 5.8 EUR |
| MFS2320BMBA0EP |
|
Hersteller: NXP USA Inc.
Description: MFS2320BMBA0EP
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 30µA
Supplier Device Package: 48-HVQFN (7x7)
Description: MFS2320BMBA0EP
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 30µA
Supplier Device Package: 48-HVQFN (7x7)
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 10.94 EUR |
| 10+ | 8.37 EUR |
| 25+ | 7.72 EUR |
| MFS2401AVBA0ES |
|
Hersteller: NXP USA Inc.
Description: MFS2401AVBA0ES
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Description: MFS2401AVBA0ES
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 12.7 EUR |
| 10+ | 9.77 EUR |
| 25+ | 9.03 EUR |
| 100+ | 8.23 EUR |
| 490+ | 7.63 EUR |
| MFS2401AVBA1ES |
|
Hersteller: NXP USA Inc.
Description: Safety Mini CAN FD SBC
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Description: Safety Mini CAN FD SBC
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 127 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 9.65 EUR |
| 10+ | 7.37 EUR |
| 25+ | 6.79 EUR |
| 100+ | 6.16 EUR |
| MFS2621AMDABAD |
|
Hersteller: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
auf Bestellung 249 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 15.16 EUR |
| 10+ | 11.76 EUR |
| 25+ | 10.91 EUR |
| 100+ | 9.97 EUR |
| MFS2633AMBA0AD |
|
Hersteller: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 29µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 29µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
auf Bestellung 153 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 15.58 EUR |
| 10+ | 12.09 EUR |
| 25+ | 11.22 EUR |
| 100+ | 10.41 EUR |
| MFS8610BMBA0ES |
|
Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 60V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 60V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 14.41 EUR |
| 10+ | 11.15 EUR |
| 25+ | 10.33 EUR |
| 100+ | 9.44 EUR |
| 260+ | 9 EUR |
| MFS2613AMDA6AD |
|
Hersteller: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 16.09 EUR |
| 10+ | 12.5 EUR |
| 25+ | 11.6 EUR |
| MFS2613AMDDCAD |
|
Hersteller: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
auf Bestellung 220 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 16.09 EUR |
| 10+ | 12.5 EUR |
| 25+ | 11.6 EUR |
| 100+ | 10.61 EUR |
| MFS8633BMDA0ES |
|
Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 15.58 EUR |
| 10+ | 12.09 EUR |
| 25+ | 11.21 EUR |
| 100+ | 10.26 EUR |
| 260+ | 9.78 EUR |
| MFS8610BMDA0ES |
|
Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 60V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 60V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 15.87 EUR |
| 10+ | 12.33 EUR |
| 25+ | 11.44 EUR |
| 100+ | 10.46 EUR |
| MFS8613BMBA0ES |
|
Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 60V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 60V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 16.34 EUR |
| 10+ | 12.7 EUR |
| 25+ | 11.78 EUR |
| 100+ | 10.78 EUR |
| 260+ | 10.28 EUR |
| S9S12GN48J0VLH |
Hersteller: NXP USA Inc.
Description: S12 CORE,48K FLASH
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
Description: S12 CORE,48K FLASH
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
Produkt ist nicht verfügbar
Mindestbestellmenge: 800 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MGD3162AM580EKR2 |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MGD3162AM580EKT |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 176 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| PVF60NN151CMK50 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 364BGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
RAM Size: 1.5MB
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Data Converters: A/D 12bit SAR; D/A 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, SCI, SD, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, WDT
Supplier Device Package: 364-LFBGA (17x17)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 364BGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
RAM Size: 1.5MB
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Data Converters: A/D 12bit SAR; D/A 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, SCI, SD, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, WDT
Supplier Device Package: 364-LFBGA (17x17)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC9328MXLVP15 |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MXL 150MHZ 225MAPBGA
Packaging: Tray
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3.0V
Supplier Device Package: 225-MAPBGA (13x13)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
Description: IC MPU I.MXL 150MHZ 225MAPBGA
Packaging: Tray
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3.0V
Supplier Device Package: 225-MAPBGA (13x13)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S32K396EHT1MJBST |
|
auf Bestellung 672 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 90.2 EUR |
| 10+ | 73.9 EUR |
| 50+ | 67.38 EUR |
| 100+ | 65.35 EUR |
| S32K394NHT1MJBSR |
|
Hersteller: NXP USA Inc.
Description: S32K394NHT1MJBSR
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, QSPI, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
Description: S32K394NHT1MJBSR
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, QSPI, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1000+ | 47.3 EUR |
| S32K396NHT1MJBSR |
|
Hersteller: NXP USA Inc.
Description: S32K396NHT1MJBSR
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, QSPI, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
Description: S32K396NHT1MJBSR
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, QSPI, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S32K396EHT1MJBSR |
|
Hersteller: NXP USA Inc.
Description: S32K396EHT1MJBSR
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
Description: S32K396EHT1MJBSR
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MPC8245TVV266D |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 352TBGA
Packaging: Tray
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
Description: IC MPU MPC82XX 266MHZ 352TBGA
Packaging: Tray
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8245TVV300D |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 300MHZ 352TBGA
Packaging: Tray
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
Description: IC MPU MPC82XX 300MHZ 352TBGA
Packaging: Tray
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
Produkt ist nicht verfügbar
Mindestbestellmenge: 24 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S9S12G48J0CLF |
Hersteller: NXP USA Inc.
Description: S12 CORE,64K FLASH,AU
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Description: S12 CORE,64K FLASH,AU
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S9S12G64J0MLF |
|
Hersteller: NXP USA Inc.
Description: S12 CORE,64K FLASH,AU
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Description: S12 CORE,64K FLASH,AU
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S9S12G48J0CLFR |
Hersteller: NXP USA Inc.
Description: S12 CORE,64K FLASH,
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Description: S12 CORE,64K FLASH,
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S9S12G64J0CLFR |
|
Hersteller: NXP USA Inc.
Description: S12 CORE,64K FLASH,AU
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Description: S12 CORE,64K FLASH,AU
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S9S12G64J0CLF |
Hersteller: NXP USA Inc.
Description: S12 CORE,64K FLASH,AU
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Description: S12 CORE,64K FLASH,AU
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S9S12G48J0MLFR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S9S12G48J0MLF |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MIMXRT555SFAWCR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 192KB ROM 141WLCSP
Packaging: Cut Tape (CT)
Package / Case: 141-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 141-WLCSP (4.53x4.53)
Number of I/O: 136
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 192KB ROM 141WLCSP
Packaging: Cut Tape (CT)
Package / Case: 141-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 141-WLCSP (4.53x4.53)
Number of I/O: 136
DigiKey Programmable: Not Verified
auf Bestellung 5418 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 38.56 EUR |
| 10+ | 30.83 EUR |
| 25+ | 28.91 EUR |
| 100+ | 26.79 EUR |
| 250+ | 25.79 EUR |
| 500+ | 25.17 EUR |
| MIMXRT555SFFOCR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 192KB ROM 249FOWLP
Packaging: Cut Tape (CT)
Package / Case: 249-WFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 249-FOWLP (7x7)
Number of I/O: 136
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 192KB ROM 249FOWLP
Packaging: Cut Tape (CT)
Package / Case: 249-WFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 249-FOWLP (7x7)
Number of I/O: 136
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 53.13 EUR |
| 10+ | 42.61 EUR |
| 100+ | 36.39 EUR |
| 500+ | 35.91 EUR |
| MIMXRT595SFFOCR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 192KB ROM 249WFBGA
Packaging: Cut Tape (CT)
Package / Case: 249-WFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 249-FOWLP (7x7)
Number of I/O: 136
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 192KB ROM 249WFBGA
Packaging: Cut Tape (CT)
Package / Case: 249-WFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 249-FOWLP (7x7)
Number of I/O: 136
DigiKey Programmable: Not Verified
auf Bestellung 323 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 51.73 EUR |
| 10+ | 41.72 EUR |
| 25+ | 39.22 EUR |
| 100+ | 37.39 EUR |
| MCHC908GR8MFAE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 7.5KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 7.5KB (7.5K x 8)
RAM Size: 384 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 21
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 7.5KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 7.5KB (7.5K x 8)
RAM Size: 384 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 21
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SE051C2HQ1/Z01XDZ |
|
Hersteller: NXP USA Inc.
Description: SE051C2HQ1
Packaging: Tape & Reel (TR)
Package / Case: 20-XFQFN Exposed Pad
Mounting Type: Surface Mount
Type: IoT Secure Element
Supplier Device Package: 20-HX2QFN (3x3)
Description: SE051C2HQ1
Packaging: Tape & Reel (TR)
Package / Case: 20-XFQFN Exposed Pad
Mounting Type: Surface Mount
Type: IoT Secure Element
Supplier Device Package: 20-HX2QFN (3x3)
auf Bestellung 54000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3000+ | 6.6 EUR |
| MPF5301AMDA0ESR2 |
|
Hersteller: NXP USA Inc.
Description: IC REG BUCK ADJ 8A 24HWQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-PowerWFQFN
Output Type: Adjustable
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 1
Function: Step-Down
Current - Output: 8A
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Positive
Frequency - Switching: 2MHz ~ 3MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 24-HWQFN (4.5x3.5)
Synchronous Rectifier: No
Voltage - Output (Max): 1.2V
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 0.5V
Description: IC REG BUCK ADJ 8A 24HWQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-PowerWFQFN
Output Type: Adjustable
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 1
Function: Step-Down
Current - Output: 8A
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Positive
Frequency - Switching: 2MHz ~ 3MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 24-HWQFN (4.5x3.5)
Synchronous Rectifier: No
Voltage - Output (Max): 1.2V
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 0.5V
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| PCAL9722HN-ARD |
|
Hersteller: NXP USA Inc.
Description: PCAL9722HN-ARD
Packaging: Bulk
Function: I/O Expansion
Type: Interface
Contents: Board(s)
Utilized IC / Part: PCAL9722
Description: PCAL9722HN-ARD
Packaging: Bulk
Function: I/O Expansion
Type: Interface
Contents: Board(s)
Utilized IC / Part: PCAL9722
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MFS2321BMBB2EPR2 |
|
Hersteller: NXP USA Inc.
Description: MFS2321BMBB2EPR2
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 48-HVQFN (7x7)
Description: MFS2321BMBB2EPR2
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MFS2321BMBB2EP |
|
Hersteller: NXP USA Inc.
Description: MFS2321BMBB2EP
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 48-HVQFN (7x7)
Description: MFS2321BMBB2EP
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| NCF295GVHN7/0501YY |
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| PN5190B2HN/C131Y |
|
Hersteller: NXP USA Inc.
Description: PN5190B2HN/C131Y
Packaging: Tape & Reel (TR)
Package / Case: 40-VFLGA Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443A, ISO 14443B, Mifare, NFC
Supplier Device Package: 40-VFLGA (5x5)
Description: PN5190B2HN/C131Y
Packaging: Tape & Reel (TR)
Package / Case: 40-VFLGA Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443A, ISO 14443B, Mifare, NFC
Supplier Device Package: 40-VFLGA (5x5)
Produkt ist nicht verfügbar
Mindestbestellmenge: 6000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| PN5190B1HN/C127Y |
|
Hersteller: NXP USA Inc.
Description: PN5190B1HN/C127Y
Packaging: Tape & Reel (TR)
Package / Case: 40-VFLGA Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443-A, ISO 14443-B, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, Mifare, NFC
Supplier Device Package: 40-VFLGA (5x5)
Description: PN5190B1HN/C127Y
Packaging: Tape & Reel (TR)
Package / Case: 40-VFLGA Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443-A, ISO 14443-B, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, Mifare, NFC
Supplier Device Package: 40-VFLGA (5x5)
Produkt ist nicht verfügbar
Mindestbestellmenge: 6000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| PN5190B2EV/C131Y |
|
Hersteller: NXP USA Inc.
Description: PN5190B2EV/C131Y
Packaging: Tape & Reel (TR)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443A, ISO 14443B, Mifare, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Description: PN5190B2EV/C131Y
Packaging: Tape & Reel (TR)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443A, ISO 14443B, Mifare, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| PN5190B1EV/C127Y |
|
Hersteller: NXP USA Inc.
Description: PN5190B1EV/C127Y
Packaging: Tape & Reel (TR)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443-A, ISO 14443-B, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, Mifare, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Description: PN5190B1EV/C127Y
Packaging: Tape & Reel (TR)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443-A, ISO 14443-B, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, Mifare, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| PN5190B2HN/C131K |
|
Hersteller: NXP USA Inc.
Description: PN5190B2HN/C131K
Packaging: Tray
Package / Case: 40-VFLGA Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443A, ISO 14443B, Mifare, NFC
Supplier Device Package: 40-VFLGA (5x5)
Description: PN5190B2HN/C131K
Packaging: Tray
Package / Case: 40-VFLGA Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443A, ISO 14443B, Mifare, NFC
Supplier Device Package: 40-VFLGA (5x5)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PN5190B2EV/C131K |
|
Hersteller: NXP USA Inc.
Description: PN5190B2EV/C131K
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443A, ISO 14443B, Mifare, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Description: PN5190B2EV/C131K
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443A, ISO 14443B, Mifare, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2450 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| PN5190B1EV/C127K |
|
Hersteller: NXP USA Inc.
Description: PN5190B1EV/C127K
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443-A, ISO 14443-B, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, Mifare, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Description: PN5190B1EV/C127K
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443-A, ISO 14443-B, ISO 15693, ISO 18000-3, ISO 18092, ISO 21481, Mifare, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2450 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| PN7642EV/C101K |
|
Hersteller: NXP USA Inc.
Description: PN7642EV/C101K
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443-3/4-A, ISO 14443-3/4-B, ISO 15693, ISO 18000-3, Mifare, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Description: PN7642EV/C101K
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443-3/4-A, ISO 14443-3/4-B, ISO 15693, ISO 18000-3, Mifare, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
auf Bestellung 1650 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 22.96 EUR |
| 10+ | 19.93 EUR |
| 25+ | 18.89 EUR |
| 100+ | 17.46 EUR |
| 250+ | 16.6 EUR |
| 500+ | 15.99 EUR |