Technische Details MFS2320BMBA0EPR2 NXP Semiconductors
Description: MFS2320BMBA0EPR2, Packaging: Tape & Reel (TR), Package / Case: 48-VFQFN Exposed Pad, Mounting Type: Surface Mount, Wettable Flank, Operating Temperature: -40°C ~ 125°C (TA), Voltage - Supply: 5.5V ~ 40V, Applications: System Basis Chip, Current - Supply: 30µA, Supplier Device Package: 48-HVQFN (7x7).
Weitere Produktangebote MFS2320BMBA0EPR2
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MFS2320BMBA0EPR2 | Hersteller : NXP USA Inc. |
 Description: MFS2320BMBA0EPR2Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 5.5V ~ 40V Applications: System Basis Chip Current - Supply: 30µA Supplier Device Package: 48-HVQFN (7x7) |
Produkt ist nicht verfügbar |
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MFS2320BMBA0EPR2 | Hersteller : NXP Semiconductors |
Power Management Specialised - PMIC Safety SBC with Power Management, CAN and LIN |
Produkt ist nicht verfügbar |