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MCXN547VDFT MCXN547VDFT NXP USA Inc. MCXNx4xDS.pdf Description: IC MCX N54 150MHZ DUAL CORE NPU
Packaging: Tray
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 2x16b; D/A 1x12b, 1x14b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CAN, Ethernet, Flexcomm, FlexSPI, I3C, SAI, SCI, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 184-VFBGA (9x9)
Number of I/O: 124
auf Bestellung 1285 Stücke:
Lieferzeit 10-14 Tag (e)
1+27.72 EUR
10+21.99 EUR
25+20.56 EUR
80+19.20 EUR
230+18.30 EUR
440+17.86 EUR
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MCXN946VDFT MCXN946VDFT NXP USA Inc. MCXNx4xDS.pdf Description: IC MCX N94 150MHZ DUAL CORE NPU
Packaging: Tray
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 352K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 2x16b; D/A 2x12b, 1x14b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CAN, Ethernet, Flexcomm, FlexSPI, I3C, SAI, SCI, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 184-VFBGA (9x9)
Number of I/O: 124
auf Bestellung 1300 Stücke:
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1+23.16 EUR
10+18.41 EUR
25+17.22 EUR
80+16.86 EUR
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MCXN947VDFT MCXN947VDFT NXP USA Inc. MCXNx4xDS.pdf Description: IC MCX N94 150MHZ DUAL CORE NPU
Packaging: Tray
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 2x16b; D/A 2x12b, 1x14b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CAN, Ethernet, Flexcomm, FlexSPI, I3C, SAI, SCI, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 184-VFBGA (9x9)
Number of I/O: 124
auf Bestellung 1194 Stücke:
Lieferzeit 10-14 Tag (e)
1+25.77 EUR
10+20.38 EUR
25+19.04 EUR
80+17.77 EUR
260+16.84 EUR
520+16.42 EUR
1040+16.07 EUR
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S9S08RNA8W2MLF S9S08RNA8W2MLF NXP USA Inc. Description: IC MCU 8BIT 8KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1171DVMAAR MIMXRT1171DVMAAR NXP USA Inc. IMXRT1170CEC.pdf Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 13
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
1000+18.40 EUR
Mindestbestellmenge: 1000
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MIMXRT1171DVMAAR MIMXRT1171DVMAAR NXP USA Inc. IMXRT1170CEC.pdf Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 13
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
1+28.92 EUR
10+25.66 EUR
25+24.47 EUR
50+23.60 EUR
100+22.77 EUR
250+21.71 EUR
500+20.94 EUR
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MIMXRT117CDVMAA MIMXRT117CDVMAA NXP USA Inc. IMXRT1170IEC.pdf Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 13
auf Bestellung 152 Stücke:
Lieferzeit 10-14 Tag (e)
1+29.25 EUR
10+23.40 EUR
25+21.94 EUR
152+21.73 EUR
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MIMXRT1172CVM8AR MIMXRT1172CVM8AR NXP USA Inc. IMXRT1170IEC.pdf Description: MIMXRT1172CVM8AR
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Speed: 800MHz
RAM Size: 2MB
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM Cortex-M7
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Architecture: MPU
auf Bestellung 1000 Stücke:
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1000+21.76 EUR
Mindestbestellmenge: 1000
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MIMXRT1172CVM8AR MIMXRT1172CVM8AR NXP USA Inc. IMXRT1170IEC.pdf Description: MIMXRT1172CVM8AR
Packaging: Cut Tape (CT)
Package / Case: 289-LFBGA
Speed: 800MHz
RAM Size: 2MB
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM Cortex-M7
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Architecture: MPU
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
1+36.57 EUR
10+29.27 EUR
25+27.45 EUR
100+25.44 EUR
250+24.49 EUR
500+23.91 EUR
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MIMXRT117CCVM8A NXP USA Inc. IMXRT1170IEC.pdf Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 13
Produkt ist nicht verfügbar
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MIMXRT117TDVMAA MIMXRT117TDVMAA NXP USA Inc. IMXRT1170IEC.pdf Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
RAM Size: 2M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 13
auf Bestellung 150 Stücke:
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1+39.37 EUR
10+36.32 EUR
25+34.69 EUR
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MIMXRT117TCVM8A MIMXRT117TCVM8A NXP USA Inc. IMXRT1170IEC.pdf Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 13
auf Bestellung 152 Stücke:
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1+42.29 EUR
10+39.01 EUR
25+37.25 EUR
152+33.31 EUR
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MIMXRT117TAVM8A NXP USA Inc. Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 13
Produkt ist nicht verfügbar
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BF904AWR,115 BF904AWR,115 NXP USA Inc. BF904A%2CAR%2CAWR.pdf Description: RF MOSFET 5V CMPAK-4
Packaging: Bulk
Package / Case: SC-82A, SOT-343
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 200MHz
Configuration: N-Channel Dual Gate
Technology: MOSFET (Metal Oxide)
Noise Figure: 1dB
Supplier Device Package: CMPAK-4
Voltage - Rated: 7 V
Voltage - Test: 5 V
Current - Test: 10 mA
auf Bestellung 12000 Stücke:
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1480+0.33 EUR
Mindestbestellmenge: 1480
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MC9328MX1CVM15 MC9328MX1CVM15 NXP USA Inc. MC9328MX1.pdf Description: IC MPU I.MX1 150MHZ 256MAPBGA
Packaging: Tray
Package / Case: 256-MAPBGA
Mounting Type: Surface Mount
Speed: 150MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3.0V
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
Produkt ist nicht verfügbar
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MC68LC302AF16VCT MC68LC302AF16VCT NXP USA Inc. MC68LC302.pdf Description: IC MPU M683XX 16MHZ 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: M68000
Voltage - I/O: 3.3V
Supplier Device Package: 100-LQFP (14x14)
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
auf Bestellung 56 Stücke:
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1+106.44 EUR
10+86.95 EUR
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BC856T,115 BC856T,115 NXP USA Inc. BC856T_857T_Rev_Feb2017.pdf Description: TRANS PNP 65V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 125 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SC-75
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 65 V
Power - Max: 150 mW
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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MC34SB0800AER2 MC34SB0800AER2 NXP USA Inc. Description: IC MOTOR DRIVER 36V 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 36V
Applications: Pump, Valve Controller
Supplier Device Package: 64-LQFP (10x10)
Produkt ist nicht verfügbar
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MC34SB0800AER2 MC34SB0800AER2 NXP USA Inc. Description: IC MOTOR DRIVER 36V 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 36V
Applications: Pump, Valve Controller
Supplier Device Package: 64-LQFP (10x10)
Produkt ist nicht verfügbar
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MC34SB0800AER2 MC34SB0800AER2 NXP USA Inc. Description: IC MOTOR DRIVER 36V 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 36V
Applications: Pump, Valve Controller
Supplier Device Package: 64-LQFP (10x10)
auf Bestellung 1500 Stücke:
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16+32.47 EUR
Mindestbestellmenge: 16
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74AHCT244PW,112 74AHCT244PW,112 NXP USA Inc. 74AHC_AHCT244.pdf Description: IC BUFF/DVR TRI-ST DUAL 20TSSOP
Packaging: Bulk
auf Bestellung 12120 Stücke:
Lieferzeit 10-14 Tag (e)
1722+0.29 EUR
Mindestbestellmenge: 1722
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S912B32E4CFUE8 S912B32E4CFUE8 NXP USA Inc. M68HC12B.pdf Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 768 x 8
Core Processor: CPU12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC912D60AMFUE8 MC912D60AMFUE8 NXP USA Inc. MC68HC912D60A.pdf Description: IC MCU 16BIT 60KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: CPU12
Data Converters: A/D 8x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, MI Bus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 48
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCHC912B32VFUE8 MCHC912B32VFUE8 NXP USA Inc. M68HC12B.pdf Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 768 x 8
Core Processor: CPU12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC68C812A4PVE5 XC68C812A4PVE5 NXP USA Inc. MC68HC812A4.pdf Description: IC MCU 16BIT 4KB EEPROM 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 5MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 1K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: EEPROM
Core Processor: CPU12
Data Converters: A/D 8x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912B32E4MFUE8R S912B32E4MFUE8R NXP USA Inc. Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 768 x 8
Core Processor: CPU12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912DG12AE0CPVE S912DG12AE0CPVE NXP USA Inc. Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Bulk
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 69
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1313FBD48,151 LPC1313FBD48,151 NXP USA Inc. LPC1311_13_42_43.pdf Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
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80+5.35 EUR
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500+4.87 EUR
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S912XD64F2CAA S912XD64F2CAA NXP USA Inc. Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74AHCT373PW,118 74AHCT373PW,118 NXP USA Inc. 74AHC373.pdf Description: IC OCT D TRANSP LTCH 3ST 20TSSOP
Packaging: Bulk
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74LVU04D,118 74LVU04D,118 NXP USA Inc. 74LVU04.pdf Description: IC HEX INVERTER 14SOIC
Packaging: Bulk
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MC908KX8MDWE MC908KX8MDWE NXP USA Inc. MC68HC908KX8.pdf Description: IC MCU 8BIT 8KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74HCT373D-Q100,118 74HCT373D-Q100,118 NXP USA Inc. PHGLS25322-1.pdf?t.download=true&u=5oefqw Description: IC D-TYPE TRANSP SGL 8:8 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 6mA, 6mA
Delay Time - Propagation: 14ns
Supplier Device Package: 20-SO
Grade: Automotive
Qualification: AEC-Q100
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74ALVT16823DGG,118 74ALVT16823DGG,118 NXP USA Inc. PHGLS01410-1.pdf?t.download=true&u=5oefqw Description: IC FF D-TYPE DUAL 9BIT 56TSSOP
Packaging: Bulk
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V
Current - Quiescent (Iq): 100 µA
Current - Output High, Low: 8mA, 24mA; 32mA, 64mA
Trigger Type: Positive Edge
Clock Frequency: 250 MHz
Input Capacitance: 3 pF
Supplier Device Package: 56-TSSOP
Max Propagation Delay @ V, Max CL: 3.1ns @ 3.3V, 50pF
Number of Bits per Element: 9
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MFS2323BMBA1EPR2 MFS2323BMBA1EPR2 NXP USA Inc. FS23_SBC.pdf Description: MFS2323BMBA1EPR2
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MPF5200AMBA1ESR2 MPF5200AMBA1ESR2 NXP USA Inc. PF5200.pdf Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tape & Reel (TR)
Package / Case: 32-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 32-HWQFN (5x5)
Produkt ist nicht verfügbar
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MFS2323BMBA1EP MFS2323BMBA1EP NXP USA Inc. FS23_SBC.pdf Description: MFS2323BMBA1EP
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MPF5200AMBA1ES MPF5200AMBA1ES NXP USA Inc. PF5200.pdf Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 32-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Current - Supply: 40µA
Supplier Device Package: 32-HWQFN (5x5)
Grade: Automotive
Produkt ist nicht verfügbar
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S9S12ZVL16ACLC NXP USA Inc. Description: S12Z CPU, 16K FLASH
Packaging: Tray
Produkt ist nicht verfügbar
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S9S12ZVL16AVLC S9S12ZVL16AVLC NXP USA Inc. Description: S12Z CPU, 16K FLASH
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 19
Produkt ist nicht verfügbar
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S9S12ZVL16ACLFR NXP USA Inc. Description: S12Z CPU, 16K FLASH
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S9S12ZVL16ACLF NXP USA Inc. Description: S12Z CPU, 16K FLASH
Packaging: Tray
Produkt ist nicht verfügbar
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MPC8343EVRAGDB MPC8343EVRAGDB NXP USA Inc. Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
Produkt ist nicht verfügbar
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MIMXRT1180-EVK NXP USA Inc. Description: IC
Packaging: Box
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: ARM® Cortex®-M7, Cortex®-M33
Utilized IC / Part: RT1180
Produkt ist nicht verfügbar
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FS32K142URT0VLHT FS32K142URT0VLHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC16374ADGG,112 74LVC16374ADGG,112 NXP USA Inc. 74LVC_LVCH16374A.pdf Description: IC FF D-TYPE DUAL 8BIT 48TSSOP
Packaging: Bulk
auf Bestellung 7476 Stücke:
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74LVT16373ADGG,112 74LVT16373ADGG,112 NXP USA Inc. 74LVT16373A.pdf Description: IC 16BIT TRANSP LATCH D 48TSSOP
Packaging: Bulk
auf Bestellung 8775 Stücke:
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74ABT16244ADGG,112 74ABT16244ADGG,112 NXP USA Inc. 74ABT16244A.pdf Description: IC BUFF NON-INVERT 5.5V 48TSSOP
Packaging: Bulk
auf Bestellung 2822 Stücke:
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74LVC16240ADGG,112 74LVC16240ADGG,112 NXP USA Inc. 74LVC16240A.pdf Description: IC INVERTER QUAD 4-INPUT 48TSSOP
Packaging: Bulk
auf Bestellung 1850 Stücke:
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LPC1114LVFHN24/303 LPC1114LVFHN24/303 NXP USA Inc. LPC111XLV_LPC11XXLVUK.pdf Description: IC MCU 32BIT 32KB FLASH 24HVQFN
Packaging: Bulk
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 24-HVQFN (4x4)
Number of I/O: 20
DigiKey Programmable: Not Verified
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LPC1114FHN33/302:5 LPC1114FHN33/302:5 NXP USA Inc. UM10398.pdf Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Bulk
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
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LPC1114LVFHI33/303 LPC1114LVFHI33/303 NXP USA Inc. LPC111XLV_LPC11XXLVUK.pdf Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 27
DigiKey Programmable: Not Verified
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LPC1114JHN33/303E LPC1114JHN33/303E NXP USA Inc. LPC111X.pdf Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Bulk
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
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146+3.19 EUR
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KW45B41Z-LOC NXP USA Inc. KW45.pdf Description: KW45B41Z-LOC
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Utilized IC / Part: KW45B41Z
Produkt ist nicht verfügbar
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MC32PF1550A4EPR2 MC32PF1550A4EPR2 NXP USA Inc. Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MC9S08LC60LH MC9S08LC60LH NXP USA Inc. MC9S08LC60.pdf Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SL2S2602FTBX SL2S2602FTBX NXP USA Inc. SL2S2602.pdf Description: ICODE
Packaging: Cut Tape (CT)
Package / Case: 3-XDFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: ISO 15693
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 1.3V
Standards: ISO 15693, ISO 18000-3
Supplier Device Package: 3-XSON (1x1.45)
auf Bestellung 648 Stücke:
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31+0.58 EUR
35+0.51 EUR
38+0.47 EUR
100+0.43 EUR
250+0.41 EUR
500+0.39 EUR
Mindestbestellmenge: 31
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NX5DV330DS,118 NX5DV330DS,118 NXP USA Inc. NX5DV330.pdf Description: IC VIDEO MUX/DEMUX 1X2 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 300MHz
Supplier Device Package: 16-SSOP
Voltage - Supply, Single (V+): 4V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 4
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MPC7410VS500LE MPC7410VS500LE NXP USA Inc. DS_568_MPC7410.pdf Description: IC MPU MPC74XX 500MHZ 360FCCLGA
Packaging: Tray
Package / Case: 360-CLGA, FCCLGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 360-FCCLGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MCF5481CVR166 MCF5481CVR166 NXP USA Inc. MCF5485EC.pdf Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 166MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V4E
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.43V ~ 1.58V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 99
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCXN547VDFT MCXNx4xDS.pdf
MCXN547VDFT
Hersteller: NXP USA Inc.
Description: IC MCX N54 150MHZ DUAL CORE NPU
Packaging: Tray
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 2x16b; D/A 1x12b, 1x14b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CAN, Ethernet, Flexcomm, FlexSPI, I3C, SAI, SCI, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 184-VFBGA (9x9)
Number of I/O: 124
auf Bestellung 1285 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+27.72 EUR
10+21.99 EUR
25+20.56 EUR
80+19.20 EUR
230+18.30 EUR
440+17.86 EUR
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MCXN946VDFT MCXNx4xDS.pdf
MCXN946VDFT
Hersteller: NXP USA Inc.
Description: IC MCX N94 150MHZ DUAL CORE NPU
Packaging: Tray
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 352K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 2x16b; D/A 2x12b, 1x14b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CAN, Ethernet, Flexcomm, FlexSPI, I3C, SAI, SCI, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 184-VFBGA (9x9)
Number of I/O: 124
auf Bestellung 1300 Stücke:
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Anzahl Preis
1+23.16 EUR
10+18.41 EUR
25+17.22 EUR
80+16.86 EUR
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MCXN947VDFT MCXNx4xDS.pdf
MCXN947VDFT
Hersteller: NXP USA Inc.
Description: IC MCX N94 150MHZ DUAL CORE NPU
Packaging: Tray
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 2x16b; D/A 2x12b, 1x14b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CAN, Ethernet, Flexcomm, FlexSPI, I3C, SAI, SCI, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 184-VFBGA (9x9)
Number of I/O: 124
auf Bestellung 1194 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+25.77 EUR
10+20.38 EUR
25+19.04 EUR
80+17.77 EUR
260+16.84 EUR
520+16.42 EUR
1040+16.07 EUR
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S9S08RNA8W2MLF
S9S08RNA8W2MLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT1171DVMAAR IMXRT1170CEC.pdf
MIMXRT1171DVMAAR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 13
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+18.40 EUR
Mindestbestellmenge: 1000
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MIMXRT1171DVMAAR IMXRT1170CEC.pdf
MIMXRT1171DVMAAR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 13
auf Bestellung 1000 Stücke:
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Anzahl Preis
1+28.92 EUR
10+25.66 EUR
25+24.47 EUR
50+23.60 EUR
100+22.77 EUR
250+21.71 EUR
500+20.94 EUR
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MIMXRT117CDVMAA IMXRT1170IEC.pdf
MIMXRT117CDVMAA
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 13
auf Bestellung 152 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+29.25 EUR
10+23.40 EUR
25+21.94 EUR
152+21.73 EUR
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MIMXRT1172CVM8AR IMXRT1170IEC.pdf
MIMXRT1172CVM8AR
Hersteller: NXP USA Inc.
Description: MIMXRT1172CVM8AR
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Speed: 800MHz
RAM Size: 2MB
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM Cortex-M7
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Architecture: MPU
auf Bestellung 1000 Stücke:
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1000+21.76 EUR
Mindestbestellmenge: 1000
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MIMXRT1172CVM8AR IMXRT1170IEC.pdf
MIMXRT1172CVM8AR
Hersteller: NXP USA Inc.
Description: MIMXRT1172CVM8AR
Packaging: Cut Tape (CT)
Package / Case: 289-LFBGA
Speed: 800MHz
RAM Size: 2MB
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM Cortex-M7
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Architecture: MPU
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+36.57 EUR
10+29.27 EUR
25+27.45 EUR
100+25.44 EUR
250+24.49 EUR
500+23.91 EUR
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MIMXRT117CCVM8A IMXRT1170IEC.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 13
Produkt ist nicht verfügbar
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MIMXRT117TDVMAA IMXRT1170IEC.pdf
MIMXRT117TDVMAA
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
RAM Size: 2M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 13
auf Bestellung 150 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+39.37 EUR
10+36.32 EUR
25+34.69 EUR
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MIMXRT117TCVM8A IMXRT1170IEC.pdf
MIMXRT117TCVM8A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 13
auf Bestellung 152 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+42.29 EUR
10+39.01 EUR
25+37.25 EUR
152+33.31 EUR
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MIMXRT117TAVM8A
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 13
Produkt ist nicht verfügbar
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BF904AWR,115 BF904A%2CAR%2CAWR.pdf
BF904AWR,115
Hersteller: NXP USA Inc.
Description: RF MOSFET 5V CMPAK-4
Packaging: Bulk
Package / Case: SC-82A, SOT-343
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 200MHz
Configuration: N-Channel Dual Gate
Technology: MOSFET (Metal Oxide)
Noise Figure: 1dB
Supplier Device Package: CMPAK-4
Voltage - Rated: 7 V
Voltage - Test: 5 V
Current - Test: 10 mA
auf Bestellung 12000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1480+0.33 EUR
Mindestbestellmenge: 1480
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MC9328MX1CVM15 MC9328MX1.pdf
MC9328MX1CVM15
Hersteller: NXP USA Inc.
Description: IC MPU I.MX1 150MHZ 256MAPBGA
Packaging: Tray
Package / Case: 256-MAPBGA
Mounting Type: Surface Mount
Speed: 150MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3.0V
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
Produkt ist nicht verfügbar
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MC68LC302AF16VCT MC68LC302.pdf
MC68LC302AF16VCT
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 16MHZ 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: M68000
Voltage - I/O: 3.3V
Supplier Device Package: 100-LQFP (14x14)
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
auf Bestellung 56 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+106.44 EUR
10+86.95 EUR
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BC856T,115 BC856T_857T_Rev_Feb2017.pdf
BC856T,115
Hersteller: NXP USA Inc.
Description: TRANS PNP 65V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 125 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SC-75
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 65 V
Power - Max: 150 mW
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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MC34SB0800AER2
MC34SB0800AER2
Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 36V 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 36V
Applications: Pump, Valve Controller
Supplier Device Package: 64-LQFP (10x10)
Produkt ist nicht verfügbar
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MC34SB0800AER2
MC34SB0800AER2
Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 36V 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 36V
Applications: Pump, Valve Controller
Supplier Device Package: 64-LQFP (10x10)
Produkt ist nicht verfügbar
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MC34SB0800AER2
MC34SB0800AER2
Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 36V 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 36V
Applications: Pump, Valve Controller
Supplier Device Package: 64-LQFP (10x10)
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
16+32.47 EUR
Mindestbestellmenge: 16
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74AHCT244PW,112 74AHC_AHCT244.pdf
74AHCT244PW,112
Hersteller: NXP USA Inc.
Description: IC BUFF/DVR TRI-ST DUAL 20TSSOP
Packaging: Bulk
auf Bestellung 12120 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1722+0.29 EUR
Mindestbestellmenge: 1722
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S912B32E4CFUE8 M68HC12B.pdf
S912B32E4CFUE8
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 768 x 8
Core Processor: CPU12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC912D60AMFUE8 MC68HC912D60A.pdf
MC912D60AMFUE8
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 60KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: CPU12
Data Converters: A/D 8x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, MI Bus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 48
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCHC912B32VFUE8 M68HC12B.pdf
MCHC912B32VFUE8
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 768 x 8
Core Processor: CPU12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC68C812A4PVE5 MC68HC812A4.pdf
XC68C812A4PVE5
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 4KB EEPROM 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 5MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 1K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: EEPROM
Core Processor: CPU12
Data Converters: A/D 8x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912B32E4MFUE8R
S912B32E4MFUE8R
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 768 x 8
Core Processor: CPU12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912DG12AE0CPVE
S912DG12AE0CPVE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Bulk
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 69
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1313FBD48,151 LPC1311_13_42_43.pdf
LPC1313FBD48,151
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 3261 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+8.31 EUR
10+6.32 EUR
25+5.82 EUR
80+5.35 EUR
250+5.02 EUR
500+4.87 EUR
1000+4.74 EUR
2500+4.60 EUR
Mindestbestellmenge: 3
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S912XD64F2CAA
S912XD64F2CAA
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74AHCT373PW,118 74AHC373.pdf
74AHCT373PW,118
Hersteller: NXP USA Inc.
Description: IC OCT D TRANSP LTCH 3ST 20TSSOP
Packaging: Bulk
auf Bestellung 33538 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2959+0.17 EUR
Mindestbestellmenge: 2959
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74LVU04D,118 74LVU04.pdf
74LVU04D,118
Hersteller: NXP USA Inc.
Description: IC HEX INVERTER 14SOIC
Packaging: Bulk
auf Bestellung 5200 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2420+0.19 EUR
Mindestbestellmenge: 2420
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MC908KX8MDWE MC68HC908KX8.pdf
MC908KX8MDWE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74HCT373D-Q100,118 PHGLS25322-1.pdf?t.download=true&u=5oefqw
74HCT373D-Q100,118
Hersteller: NXP USA Inc.
Description: IC D-TYPE TRANSP SGL 8:8 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 6mA, 6mA
Delay Time - Propagation: 14ns
Supplier Device Package: 20-SO
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2479 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1374+0.36 EUR
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74ALVT16823DGG,118 PHGLS01410-1.pdf?t.download=true&u=5oefqw
74ALVT16823DGG,118
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE DUAL 9BIT 56TSSOP
Packaging: Bulk
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V
Current - Quiescent (Iq): 100 µA
Current - Output High, Low: 8mA, 24mA; 32mA, 64mA
Trigger Type: Positive Edge
Clock Frequency: 250 MHz
Input Capacitance: 3 pF
Supplier Device Package: 56-TSSOP
Max Propagation Delay @ V, Max CL: 3.1ns @ 3.3V, 50pF
Number of Bits per Element: 9
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
207+2.46 EUR
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MFS2323BMBA1EPR2 FS23_SBC.pdf
MFS2323BMBA1EPR2
Hersteller: NXP USA Inc.
Description: MFS2323BMBA1EPR2
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MPF5200AMBA1ESR2 PF5200.pdf
MPF5200AMBA1ESR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tape & Reel (TR)
Package / Case: 32-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 32-HWQFN (5x5)
Produkt ist nicht verfügbar
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MFS2323BMBA1EP FS23_SBC.pdf
MFS2323BMBA1EP
Hersteller: NXP USA Inc.
Description: MFS2323BMBA1EP
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MPF5200AMBA1ES PF5200.pdf
MPF5200AMBA1ES
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 32-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Current - Supply: 40µA
Supplier Device Package: 32-HWQFN (5x5)
Grade: Automotive
Produkt ist nicht verfügbar
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S9S12ZVL16ACLC
Hersteller: NXP USA Inc.
Description: S12Z CPU, 16K FLASH
Packaging: Tray
Produkt ist nicht verfügbar
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S9S12ZVL16AVLC
S9S12ZVL16AVLC
Hersteller: NXP USA Inc.
Description: S12Z CPU, 16K FLASH
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 19
Produkt ist nicht verfügbar
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S9S12ZVL16ACLFR
Hersteller: NXP USA Inc.
Description: S12Z CPU, 16K FLASH
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S9S12ZVL16ACLF
Hersteller: NXP USA Inc.
Description: S12Z CPU, 16K FLASH
Packaging: Tray
Produkt ist nicht verfügbar
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MPC8343EVRAGDB
MPC8343EVRAGDB
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
Produkt ist nicht verfügbar
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MIMXRT1180-EVK
Hersteller: NXP USA Inc.
Description: IC
Packaging: Box
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: ARM® Cortex®-M7, Cortex®-M33
Utilized IC / Part: RT1180
Produkt ist nicht verfügbar
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FS32K142URT0VLHT S32K1xx.pdf
FS32K142URT0VLHT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC16374ADGG,112 74LVC_LVCH16374A.pdf
74LVC16374ADGG,112
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE DUAL 8BIT 48TSSOP
Packaging: Bulk
auf Bestellung 7476 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1066+0.47 EUR
Mindestbestellmenge: 1066
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74LVT16373ADGG,112 74LVT16373A.pdf
74LVT16373ADGG,112
Hersteller: NXP USA Inc.
Description: IC 16BIT TRANSP LATCH D 48TSSOP
Packaging: Bulk
auf Bestellung 8775 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
703+0.72 EUR
Mindestbestellmenge: 703
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74ABT16244ADGG,112 74ABT16244A.pdf
74ABT16244ADGG,112
Hersteller: NXP USA Inc.
Description: IC BUFF NON-INVERT 5.5V 48TSSOP
Packaging: Bulk
auf Bestellung 2822 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
556+0.91 EUR
Mindestbestellmenge: 556
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74LVC16240ADGG,112 74LVC16240A.pdf
74LVC16240ADGG,112
Hersteller: NXP USA Inc.
Description: IC INVERTER QUAD 4-INPUT 48TSSOP
Packaging: Bulk
auf Bestellung 1850 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
552+0.91 EUR
Mindestbestellmenge: 552
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LPC1114LVFHN24/303 LPC111XLV_LPC11XXLVUK.pdf
LPC1114LVFHN24/303
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 24HVQFN
Packaging: Bulk
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 24-HVQFN (4x4)
Number of I/O: 20
DigiKey Programmable: Not Verified
auf Bestellung 1969 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
162+2.88 EUR
Mindestbestellmenge: 162
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LPC1114FHN33/302:5 UM10398.pdf
LPC1114FHN33/302:5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Bulk
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 308 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
151+3.09 EUR
Mindestbestellmenge: 151
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LPC1114LVFHI33/303 LPC111XLV_LPC11XXLVUK.pdf
LPC1114LVFHI33/303
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 27
DigiKey Programmable: Not Verified
auf Bestellung 350 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
143+3.25 EUR
Mindestbestellmenge: 143
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LPC1114JHN33/303E LPC111X.pdf
LPC1114JHN33/303E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Bulk
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 12185 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
146+3.19 EUR
Mindestbestellmenge: 146
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KW45B41Z-LOC KW45.pdf
Hersteller: NXP USA Inc.
Description: KW45B41Z-LOC
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Utilized IC / Part: KW45B41Z
Produkt ist nicht verfügbar
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MC32PF1550A4EPR2
MC32PF1550A4EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MC9S08LC60LH MC9S08LC60.pdf
MC9S08LC60LH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SL2S2602FTBX SL2S2602.pdf
SL2S2602FTBX
Hersteller: NXP USA Inc.
Description: ICODE
Packaging: Cut Tape (CT)
Package / Case: 3-XDFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: ISO 15693
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 1.3V
Standards: ISO 15693, ISO 18000-3
Supplier Device Package: 3-XSON (1x1.45)
auf Bestellung 648 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
31+0.58 EUR
35+0.51 EUR
38+0.47 EUR
100+0.43 EUR
250+0.41 EUR
500+0.39 EUR
Mindestbestellmenge: 31
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NX5DV330DS,118 NX5DV330.pdf
NX5DV330DS,118
Hersteller: NXP USA Inc.
Description: IC VIDEO MUX/DEMUX 1X2 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 300MHz
Supplier Device Package: 16-SSOP
Voltage - Supply, Single (V+): 4V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 4
auf Bestellung 318919 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
477+1.03 EUR
Mindestbestellmenge: 477
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MPC7410VS500LE DS_568_MPC7410.pdf
MPC7410VS500LE
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 500MHZ 360FCCLGA
Packaging: Tray
Package / Case: 360-CLGA, FCCLGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 360-FCCLGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MCF5481CVR166 MCF5485EC.pdf
MCF5481CVR166
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 166MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V4E
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.43V ~ 1.58V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 99
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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