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MCXA152VFM MCXA152VFM NXP USA Inc. MCXAP64M96FS3.pdf Description: IC MCX 96MHZ SGL CORE 64KB QFN32
Packaging: Tray
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 1x12b; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
auf Bestellung 485 Stücke:
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3+8.08 EUR
10+6.12 EUR
25+5.63 EUR
100+5.09 EUR
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MCXA152VFT MCXA152VFT NXP USA Inc. MCXAP64M96FS3.pdf Description: IC MCX 96MHZ SGL CORE 64KB QFN48
Packaging: Tray
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 1x12b; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 41
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2+10.52 EUR
10+8.2 EUR
80+6.72 EUR
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SPC5517EBMLQ66R SPC5517EBMLQ66R NXP USA Inc. MPC5510PB.pdf Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 111
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 40x12b
Core Processor: e200z0, e200z1
Program Memory Type: FLASH
Produkt ist nicht verfügbar
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A5M34TG140TC-EVB NXP USA Inc. TSCEVBFS.pdf Description: A5M34TG140TC RF REFERENCE CIRCUI
Packaging: Bulk
For Use With/Related Products: A5M34TG140-TC
Frequency: 3.3GHz ~ 3.67GHz
Type: Power Amplifier
Contents: Board(s)
Utilized IC / Part: A5M34TG140-TC
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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PCA9421UK-EVM NXP USA Inc. UM11987.pdf Description: EVAL BOARD FOR PCA9421
Packaging: Bulk
Function: Power Supply
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: PCA9421
Supplied Contents: Board(s), Cable(s)
Secondary Attributes: I2C Interface(s)
Embedded: Yes, MCU
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MPF5020CMMACES MPF5020CMMACES NXP USA Inc. PF5020.pdf Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 436 Stücke:
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2+14.6 EUR
10+11.28 EUR
25+10.46 EUR
100+9.54 EUR
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MC33FS6527KAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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QN9090THN/001Y QN9090THN/001Y NXP USA Inc. QN9090(T)QN9030(T).pdf Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
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2+10.58 EUR
10+9.44 EUR
25+8.5 EUR
100+7.74 EUR
250+6.99 EUR
500+6.27 EUR
1000+5.28 EUR
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MC9S08DN60ACLH MC9S08DN60ACLH NXP USA Inc. MC9S08DN60.pdf Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NAFE11348B40BSMP NXP USA Inc. NAFE11388.pdf Description: NAFE11348B40BSMP
Packaging: Tape & Reel (TR)
auf Bestellung 1000 Stücke:
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1000+20.38 EUR
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NAFE11348B40BSMP NXP USA Inc. NAFE11388.pdf Description: NAFE11348B40BSMP
Packaging: Cut Tape (CT)
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1+32.3 EUR
10+25.67 EUR
25+24.03 EUR
100+22.21 EUR
250+21.34 EUR
500+20.81 EUR
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MC9RS08KB2CSCR MC9RS08KB2CSCR NXP USA Inc. MC9RS08KB12.pdf Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 126 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 6
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P3T1035GUKZ NXP USA Inc. P3T1035XUK_P3T2030XUK.pdf Description: P3T1035GUK
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 4 Stücke
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TJA1042BTK/0J TJA1042BTK/0J NXP USA Inc. TJA1042.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TFA8200HN/N1J NXP USA Inc. TFA8200.pdf Description: LOW POWER CLASS D AMP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TJA1057BTK/0J TJA1057BTK/0J NXP USA Inc. TJA1057.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJA1057CTK/0J TJA1057CTK/0J NXP USA Inc. TJA1057.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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6000+0.57 EUR
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MPF5020CMMA0ESR2 NXP USA Inc. PF5020.pdf Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MPF5020CMMA0ES NXP USA Inc. PF5020.pdf Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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NHS3100SENSORDB NXP USA Inc. NTAGSENSORFS.pdf Description: NHS3100SENSORDB
Packaging: Bulk
For Use With/Related Products: NHS3100
Type: Data Logger
Supplied Contents: Board(s), Cable(s)
Produkt ist nicht verfügbar
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74AUP1G18GM,115 74AUP1G18GM,115 NXP USA Inc. 74AUP1G18.pdf Description: IC DEMUX 3-ST LP 6-XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Circuit: 1 x 1:2
Type: Demultiplexer
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
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2160+0.27 EUR
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MGD3100BM58EK MGD3100BM58EK NXP USA Inc. MC33GD3100_SDS.pdf Description: IC GATE DRVR HALF-BRIDGE 32BSSOP
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5V
Supplier Device Package: 32-SOIC
Channel Type: Single
Driven Configuration: Half-Bridge
Number of Drivers: 1
Gate Type: IGBT, MOSFET (N-Channel)
Current - Peak Output (Source, Sink): 15A, 15A
Grade: Automotive
Qualification: AEC-Q100
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2+18.14 EUR
10+14.16 EUR
42+12.7 EUR
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FS32K142HAT0VLFR NXP USA Inc. S32K1xx.pdf Description: S32K142, 256K FLASH, 32K RAM
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FS32K142HAT0VLFT NXP USA Inc. S32K1xx.pdf Description: S32K142, 256K FLASH, 32K RAM
Packaging: Tray
Produkt ist nicht verfügbar
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MCIMX6Y0CVM05AB MCIMX6Y0CVM05AB NXP USA Inc. IMX6ULLIEC.pdf Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: I2C, SPI, UART
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S9S12VR64AF0VLF S9S12VR64AF0VLF NXP USA Inc. 15944_MC9S12VRRMV3.pdf Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT595SFAWCR MIMXRT595SFAWCR NXP USA Inc. IMXRT500EC.pdf Description: IC MCU 32BIT 192KB ROM 141WLCSP
Packaging: Cut Tape (CT)
Package / Case: 141-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 141-WLCSP (4.53x4.53)
Number of I/O: 136
DigiKey Programmable: Not Verified
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1+46.98 EUR
10+37.68 EUR
25+35.35 EUR
100+32.81 EUR
250+31.58 EUR
500+30.86 EUR
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LFBGAMT4A NXP USA Inc. Description: 292 PIN 0.8 MM PGA SOCKET SPACER
Packaging: Bulk
Module/Board Type: Socket Module - PGA
Produkt ist nicht verfügbar
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74AUP1G240GM,115 74AUP1G240GM,115 NXP USA Inc. 74AUP1G240.pdf Description: IC BUFFER/LINE DVR 3ST 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
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2885+0.2 EUR
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S32K376NHT1MJBST S32K376NHT1MJBST NXP USA Inc. S32K3xx.pdf Description: IC MCU 32BIT 6MB FLASH 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 96x12b SAR, 4x16b Sigma-Delta
Core Size: 32-Bit 3-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINBus, SPI, UART/USART, Zipwire
Peripherals: DMA, Ethernet, I2S, PWM
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 237
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1+84.72 EUR
10+69.28 EUR
25+65.43 EUR
100+61.19 EUR
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S32K366NHT1MJBST NXP USA Inc. Description: IC
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
Operating Temperature: -40°C ~ 125°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: PWM
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K366EHT1MJBST S32K366EHT1MJBST NXP USA Inc. S32K39-S32K37-DS.pdf Description: S32K366EHT1MJBST
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 704K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART
Peripherals: PWM
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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LPC845M301JHI48Y LPC845M301JHI48Y NXP USA Inc. LPC84x.pdf Description: IC MCU 32BIT 64KB FLASH 48HVQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, Capacitive Touch, DMA, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 2597 Stücke:
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4+6.34 EUR
10+4.77 EUR
25+4.38 EUR
100+3.94 EUR
250+3.74 EUR
500+3.65 EUR
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MFS8630BMDA0ES MFS8630BMDA0ES NXP USA Inc. Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
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SAF4000EL/102Z22AY NXP USA Inc. Description: SAF4000EL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF4000EL/102Z22AK NXP USA Inc. Description: SAF4000EL
Packaging: Tray
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 Mindestbestellmenge: 630 Stücke
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AFT18H357-24NR6 NXP USA Inc. RF_%20Gde.pdf Description: RF MOSFET LDMOS 28V OM1230-42
Packaging: Tape & Reel (TR)
Package / Case: OM-1230-4L2L
Mounting Type: Chassis Mount
Frequency: 1.81GHz
Configuration: Dual
Power - Output: 63W
Gain: 17.5dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L2L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 800 mA
Produkt ist nicht verfügbar
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MC9S08LG16CLF MC9S08LG16CLF NXP USA Inc. MC9S08LG32.pdf Description: IC MCU 8BIT 18KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 18KB (18K x 8)
RAM Size: 1.9K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 9x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 613 Stücke:
Lieferzeit 10-14 Tag (e)
4+6.34 EUR
10+4.76 EUR
25+4.37 EUR
80+3.99 EUR
230+3.74 EUR
440+3.62 EUR
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FS32K142WAT0WLFR NXP USA Inc. S32K1xx.pdf Description: S32K142W ARM CORTEX-M4F, UP TO 8
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 23x12b SAR; D/A 6x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
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FS32K142WAT0WLHR NXP USA Inc. S32K1xx.pdf Description: S32K142W ARM CORTEX-M4F, UP TO 8
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 29x12b SAR; D/A 8x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
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FS32K144WAT0WLFR FS32K144WAT0WLFR NXP USA Inc. S32K1xx.pdf Description: S32K144W ARM CORTEX-M4F, UP TO 8
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 23x12b SAR; D/A 6x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
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MCF51QU32VHS MCF51QU32VHS NXP USA Inc. MCF51QW256.pdf Description: IC MCU 32BIT 32KB FLASH 44MAPLGA
Packaging: Tray
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 11x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Number of I/O: 31
DigiKey Programmable: Not Verified
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MC9S08DZ128CLLR MC9S08DZ128CLLR NXP USA Inc. MC9S08DZ128.pdf Description: IC MCU 8BIT 128KB FLASH 100LQFP
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 87
Supplier Device Package: 100-LQFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x12b
Core Processor: S08
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MC9S08DZ128CLLR MC9S08DZ128CLLR NXP USA Inc. MC9S08DZ128.pdf Description: IC MCU 8BIT 128KB FLASH 100LQFP
Core Size: 8-Bit
Data Converters: A/D 24x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 87
Supplier Device Package: 100-LQFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
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MC9S08DZ128CLL MC9S08DZ128CLL NXP USA Inc. MC9S08DZ128.pdf Description: IC MCU 8BIT 128KB FLASH 100LQFP
DigiKey Programmable: Verified
Number of I/O: 87
Supplier Device Package: 100-LQFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
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LFBGARBZ1BO NXP USA Inc. Description: NXP LEAD FREE 522 PIN 1.0 MM PIT
Packaging: Bulk
Produkt ist nicht verfügbar
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PNEV5190BP NXP USA Inc. RM00264.pdf Description: EVAL BOARD FOR PN5190
Utilized IC / Part: PN5190
Contents: Board(s)
Supplied Contents: Board(s)
Type: Near Field Communication (NFC)
Packaging: Bulk
Produkt ist nicht verfügbar
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LFTAS32K3H1H2A NXP USA Inc. Description: IC
Module/Board Type: Adapter Board
For Use With/Related Products: S32K3
Packaging: Box
Produkt ist nicht verfügbar
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LFVBBK77CWA NXP USA Inc. Description: QORIVVA MPC5777C 416 PIN 1.0MM V
Accessory Type: Base Board
For Use With/Related Products: MPC5777C
Packaging: Bulk
Produkt ist nicht verfügbar
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RDWWAB-8897-S1 NXP USA Inc. Description: RDWWAB-8897-S1
Packaging: Bulk
Produkt ist nicht verfügbar
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XS32K388EVB-Q289 NXP USA Inc. Description: IC
Packaging: Bulk
Produkt ist nicht verfügbar
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T4241NXE7TTB T4241NXE7TTB NXP USA Inc. T4240T4160FS.pdf Description: IC MPU QORIQ T4 1.8GHZ 1932BGA
Packaging: Bulk
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (13), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 24 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
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T4241NXE7TTB T4241NXE7TTB NXP USA Inc. T4240T4160FS.pdf Description: IC MPU QORIQ T4 1.8GHZ 1932BGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (13), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 24 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
Produkt ist nicht verfügbar
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MFS2300BMBA0EP MFS2300BMBA0EP NXP USA Inc. FS23DS.pdf Description: MFS2300BMBA0EP
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 40µA
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MFS2300BMBA0EP MFS2300BMBA0EP NXP USA Inc. FS23DS.pdf Description: MFS2300BMBA0EP
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 40µA
Supplier Device Package: 48-HVQFN (7x7)
auf Bestellung 244 Stücke:
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3+9.4 EUR
10+7.16 EUR
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MFS2303BMBA3EP MFS2303BMBA3EP NXP USA Inc. FS23DS.pdf Description: MFS2303BMBA3EP
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 40µA
Supplier Device Package: 48-HVQFN (7x7)
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10+8.91 EUR
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MFS2400AVMA1ES MFS2400AVMA1ES NXP USA Inc. FS2400.pdf Description: Safety Mini CAN FD SBC
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
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MFS5600AMEA0ES MFS5600AMEA0ES NXP USA Inc. FS5600.pdf Description: DUAL 36V AUTOMOTIVE DC-DC CONTRO
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 32-HVQFN (5x5)
Current - Supply: 140µA
Voltage - Supply: 2.7V ~ 36V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 490 Stücke:
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3+9.81 EUR
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25+6.91 EUR
100+6.28 EUR
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MFS2320BMBA0EP MFS2320BMBA0EP NXP USA Inc. FS23DS.pdf Description: MFS2320BMBA0EP
Supplier Device Package: 48-HVQFN (7x7)
Current - Supply: 30µA
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 90 Stücke:
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2+10.94 EUR
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MFS2401AVBA0ES MFS2401AVBA0ES NXP USA Inc. FS2400.pdf Description: MFS2401AVBA0ES
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 32-HVQFN (5x5)
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 40V
Operating Temperature: -40°C ~ 115°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
auf Bestellung 490 Stücke:
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3+9.65 EUR
10+7.37 EUR
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100+6.16 EUR
490+5.69 EUR
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MCXA152VFM MCXAP64M96FS3.pdf
MCXA152VFM
Hersteller: NXP USA Inc.
Description: IC MCX 96MHZ SGL CORE 64KB QFN32
Packaging: Tray
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 1x12b; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
auf Bestellung 485 Stücke:
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3+8.08 EUR
10+6.12 EUR
25+5.63 EUR
100+5.09 EUR
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MCXA152VFT MCXAP64M96FS3.pdf
MCXA152VFT
Hersteller: NXP USA Inc.
Description: IC MCX 96MHZ SGL CORE 64KB QFN48
Packaging: Tray
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 1x12b; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 41
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2+10.52 EUR
10+8.2 EUR
80+6.72 EUR
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SPC5517EBMLQ66R MPC5510PB.pdf
SPC5517EBMLQ66R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 111
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 40x12b
Core Processor: e200z0, e200z1
Program Memory Type: FLASH
Produkt ist nicht verfügbar
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A5M34TG140TC-EVB TSCEVBFS.pdf
Hersteller: NXP USA Inc.
Description: A5M34TG140TC RF REFERENCE CIRCUI
Packaging: Bulk
For Use With/Related Products: A5M34TG140-TC
Frequency: 3.3GHz ~ 3.67GHz
Type: Power Amplifier
Contents: Board(s)
Utilized IC / Part: A5M34TG140-TC
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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PCA9421UK-EVM UM11987.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR PCA9421
Packaging: Bulk
Function: Power Supply
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: PCA9421
Supplied Contents: Board(s), Cable(s)
Secondary Attributes: I2C Interface(s)
Embedded: Yes, MCU
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1+423.04 EUR
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MPF5020CMMACES PF5020.pdf
MPF5020CMMACES
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 436 Stücke:
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2+14.6 EUR
10+11.28 EUR
25+10.46 EUR
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MC33FS6527KAE FS6500-FS4500SDS-ASILB.pdf
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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QN9090THN/001Y QN9090(T)QN9030(T).pdf
QN9090THN/001Y
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
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2+10.58 EUR
10+9.44 EUR
25+8.5 EUR
100+7.74 EUR
250+6.99 EUR
500+6.27 EUR
1000+5.28 EUR
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MC9S08DN60ACLH MC9S08DN60.pdf
MC9S08DN60ACLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NAFE11348B40BSMP NAFE11388.pdf
Hersteller: NXP USA Inc.
Description: NAFE11348B40BSMP
Packaging: Tape & Reel (TR)
auf Bestellung 1000 Stücke:
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1000+20.38 EUR
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NAFE11348B40BSMP NAFE11388.pdf
Hersteller: NXP USA Inc.
Description: NAFE11348B40BSMP
Packaging: Cut Tape (CT)
auf Bestellung 1000 Stücke:
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1+32.3 EUR
10+25.67 EUR
25+24.03 EUR
100+22.21 EUR
250+21.34 EUR
500+20.81 EUR
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MC9RS08KB2CSCR MC9RS08KB12.pdf
MC9RS08KB2CSCR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 126 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 6
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P3T1035GUKZ P3T1035XUK_P3T2030XUK.pdf
Hersteller: NXP USA Inc.
Description: P3T1035GUK
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TJA1042BTK/0J TJA1042.pdf
TJA1042BTK/0J
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TFA8200HN/N1J TFA8200.pdf
Hersteller: NXP USA Inc.
Description: LOW POWER CLASS D AMP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TJA1057BTK/0J TJA1057.pdf
TJA1057BTK/0J
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJA1057CTK/0J TJA1057.pdf
TJA1057CTK/0J
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
6000+0.57 EUR
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MPF5020CMMA0ESR2 PF5020.pdf
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MPF5020CMMA0ES PF5020.pdf
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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NHS3100SENSORDB NTAGSENSORFS.pdf
Hersteller: NXP USA Inc.
Description: NHS3100SENSORDB
Packaging: Bulk
For Use With/Related Products: NHS3100
Type: Data Logger
Supplied Contents: Board(s), Cable(s)
Produkt ist nicht verfügbar
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74AUP1G18GM,115 74AUP1G18.pdf
74AUP1G18GM,115
Hersteller: NXP USA Inc.
Description: IC DEMUX 3-ST LP 6-XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Circuit: 1 x 1:2
Type: Demultiplexer
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
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2160+0.27 EUR
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MGD3100BM58EK MC33GD3100_SDS.pdf
MGD3100BM58EK
Hersteller: NXP USA Inc.
Description: IC GATE DRVR HALF-BRIDGE 32BSSOP
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5V
Supplier Device Package: 32-SOIC
Channel Type: Single
Driven Configuration: Half-Bridge
Number of Drivers: 1
Gate Type: IGBT, MOSFET (N-Channel)
Current - Peak Output (Source, Sink): 15A, 15A
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 42 Stücke:
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2+18.14 EUR
10+14.16 EUR
42+12.7 EUR
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FS32K142HAT0VLFR S32K1xx.pdf
Hersteller: NXP USA Inc.
Description: S32K142, 256K FLASH, 32K RAM
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FS32K142HAT0VLFT S32K1xx.pdf
Hersteller: NXP USA Inc.
Description: S32K142, 256K FLASH, 32K RAM
Packaging: Tray
Produkt ist nicht verfügbar
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MCIMX6Y0CVM05AB IMX6ULLIEC.pdf
MCIMX6Y0CVM05AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: I2C, SPI, UART
Produkt ist nicht verfügbar
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S9S12VR64AF0VLF 15944_MC9S12VRRMV3.pdf
S9S12VR64AF0VLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT595SFAWCR IMXRT500EC.pdf
MIMXRT595SFAWCR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 192KB ROM 141WLCSP
Packaging: Cut Tape (CT)
Package / Case: 141-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 141-WLCSP (4.53x4.53)
Number of I/O: 136
DigiKey Programmable: Not Verified
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
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1+46.98 EUR
10+37.68 EUR
25+35.35 EUR
100+32.81 EUR
250+31.58 EUR
500+30.86 EUR
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LFBGAMT4A
Hersteller: NXP USA Inc.
Description: 292 PIN 0.8 MM PGA SOCKET SPACER
Packaging: Bulk
Module/Board Type: Socket Module - PGA
Produkt ist nicht verfügbar
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74AUP1G240GM,115 74AUP1G240.pdf
74AUP1G240GM,115
Hersteller: NXP USA Inc.
Description: IC BUFFER/LINE DVR 3ST 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
auf Bestellung 141875 Stücke:
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2885+0.2 EUR
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S32K376NHT1MJBST S32K3xx.pdf
S32K376NHT1MJBST
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 96x12b SAR, 4x16b Sigma-Delta
Core Size: 32-Bit 3-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINBus, SPI, UART/USART, Zipwire
Peripherals: DMA, Ethernet, I2S, PWM
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 237
auf Bestellung 140 Stücke:
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1+84.72 EUR
10+69.28 EUR
25+65.43 EUR
100+61.19 EUR
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S32K366NHT1MJBST
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
Operating Temperature: -40°C ~ 125°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: PWM
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K366EHT1MJBST S32K39-S32K37-DS.pdf
S32K366EHT1MJBST
Hersteller: NXP USA Inc.
Description: S32K366EHT1MJBST
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 704K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART
Peripherals: PWM
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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LPC845M301JHI48Y LPC84x.pdf
LPC845M301JHI48Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48HVQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, Capacitive Touch, DMA, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 2597 Stücke:
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4+6.34 EUR
10+4.77 EUR
25+4.38 EUR
100+3.94 EUR
250+3.74 EUR
500+3.65 EUR
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MFS8630BMDA0ES
MFS8630BMDA0ES
Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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SAF4000EL/102Z22AY
Hersteller: NXP USA Inc.
Description: SAF4000EL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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SAF4000EL/102Z22AK
Hersteller: NXP USA Inc.
Description: SAF4000EL
Packaging: Tray
Produkt ist nicht verfügbar
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AFT18H357-24NR6 RF_%20Gde.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM1230-42
Packaging: Tape & Reel (TR)
Package / Case: OM-1230-4L2L
Mounting Type: Chassis Mount
Frequency: 1.81GHz
Configuration: Dual
Power - Output: 63W
Gain: 17.5dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L2L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 800 mA
Produkt ist nicht verfügbar
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MC9S08LG16CLF MC9S08LG32.pdf
MC9S08LG16CLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 18KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 18KB (18K x 8)
RAM Size: 1.9K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 9x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 613 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
4+6.34 EUR
10+4.76 EUR
25+4.37 EUR
80+3.99 EUR
230+3.74 EUR
440+3.62 EUR
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FS32K142WAT0WLFR S32K1xx.pdf
Hersteller: NXP USA Inc.
Description: S32K142W ARM CORTEX-M4F, UP TO 8
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 23x12b SAR; D/A 6x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
Produkt ist nicht verfügbar
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FS32K142WAT0WLHR S32K1xx.pdf
Hersteller: NXP USA Inc.
Description: S32K142W ARM CORTEX-M4F, UP TO 8
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 29x12b SAR; D/A 8x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
Produkt ist nicht verfügbar
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FS32K144WAT0WLFR S32K1xx.pdf
FS32K144WAT0WLFR
Hersteller: NXP USA Inc.
Description: S32K144W ARM CORTEX-M4F, UP TO 8
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 23x12b SAR; D/A 6x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
Produkt ist nicht verfügbar
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MCF51QU32VHS MCF51QW256.pdf
MCF51QU32VHS
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 44MAPLGA
Packaging: Tray
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 11x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DZ128CLLR MC9S08DZ128.pdf
MC9S08DZ128CLLR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 100LQFP
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 87
Supplier Device Package: 100-LQFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x12b
Core Processor: S08
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1000+21.66 EUR
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MC9S08DZ128CLLR MC9S08DZ128.pdf
MC9S08DZ128CLLR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 100LQFP
Core Size: 8-Bit
Data Converters: A/D 24x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 87
Supplier Device Package: 100-LQFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
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1+34.18 EUR
10+27.32 EUR
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500+22.93 EUR
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MC9S08DZ128CLL MC9S08DZ128.pdf
MC9S08DZ128CLL
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 100LQFP
DigiKey Programmable: Verified
Number of I/O: 87
Supplier Device Package: 100-LQFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
auf Bestellung 450 Stücke:
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1+34.18 EUR
10+27.32 EUR
80+23.07 EUR
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LFBGARBZ1BO
Hersteller: NXP USA Inc.
Description: NXP LEAD FREE 522 PIN 1.0 MM PIT
Packaging: Bulk
Produkt ist nicht verfügbar
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PNEV5190BP RM00264.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR PN5190
Utilized IC / Part: PN5190
Contents: Board(s)
Supplied Contents: Board(s)
Type: Near Field Communication (NFC)
Packaging: Bulk
Produkt ist nicht verfügbar
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LFTAS32K3H1H2A
Hersteller: NXP USA Inc.
Description: IC
Module/Board Type: Adapter Board
For Use With/Related Products: S32K3
Packaging: Box
Produkt ist nicht verfügbar
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LFVBBK77CWA
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5777C 416 PIN 1.0MM V
Accessory Type: Base Board
For Use With/Related Products: MPC5777C
Packaging: Bulk
Produkt ist nicht verfügbar
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RDWWAB-8897-S1
Hersteller: NXP USA Inc.
Description: RDWWAB-8897-S1
Packaging: Bulk
Produkt ist nicht verfügbar
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XS32K388EVB-Q289
Hersteller: NXP USA Inc.
Description: IC
Packaging: Bulk
Produkt ist nicht verfügbar
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T4241NXE7TTB T4240T4160FS.pdf
T4241NXE7TTB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T4 1.8GHZ 1932BGA
Packaging: Bulk
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (13), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 24 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
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T4241NXE7TTB T4240T4160FS.pdf
T4241NXE7TTB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T4 1.8GHZ 1932BGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (13), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 24 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
Produkt ist nicht verfügbar
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MFS2300BMBA0EP FS23DS.pdf
MFS2300BMBA0EP
Hersteller: NXP USA Inc.
Description: MFS2300BMBA0EP
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 40µA
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MFS2300BMBA0EP FS23DS.pdf
MFS2300BMBA0EP
Hersteller: NXP USA Inc.
Description: MFS2300BMBA0EP
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 40µA
Supplier Device Package: 48-HVQFN (7x7)
auf Bestellung 244 Stücke:
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3+9.4 EUR
10+7.16 EUR
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MFS2303BMBA3EP FS23DS.pdf
MFS2303BMBA3EP
Hersteller: NXP USA Inc.
Description: MFS2303BMBA3EP
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 40µA
Supplier Device Package: 48-HVQFN (7x7)
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2+11.6 EUR
10+8.91 EUR
25+8.23 EUR
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MFS2400AVMA1ES FS2400.pdf
MFS2400AVMA1ES
Hersteller: NXP USA Inc.
Description: Safety Mini CAN FD SBC
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
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MFS5600AMEA0ES FS5600.pdf
MFS5600AMEA0ES
Hersteller: NXP USA Inc.
Description: DUAL 36V AUTOMOTIVE DC-DC CONTRO
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 32-HVQFN (5x5)
Current - Supply: 140µA
Voltage - Supply: 2.7V ~ 36V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 490 Stücke:
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3+9.81 EUR
10+7.5 EUR
25+6.91 EUR
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MFS2320BMBA0EP FS23DS.pdf
MFS2320BMBA0EP
Hersteller: NXP USA Inc.
Description: MFS2320BMBA0EP
Supplier Device Package: 48-HVQFN (7x7)
Current - Supply: 30µA
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 90 Stücke:
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2+10.94 EUR
10+8.37 EUR
25+7.72 EUR
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MFS2401AVBA0ES FS2400.pdf
MFS2401AVBA0ES
Hersteller: NXP USA Inc.
Description: MFS2401AVBA0ES
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 32-HVQFN (5x5)
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 40V
Operating Temperature: -40°C ~ 115°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
auf Bestellung 490 Stücke:
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AnzahlPrivatkunde
3+9.65 EUR
10+7.37 EUR
25+6.79 EUR
100+6.16 EUR
490+5.69 EUR
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