Technische Details MGD3162AM550EKR2 NXP Semiconductors
Description: GATE DRIVER, Packaging: Tape & Reel (TR), Package / Case: 32-BSSOP (0.295", 7.50mm Width), Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 150°C, Technology: Magnetic Coupling, Voltage - Isolation: 8000Vrms, Approval Agency: UL, VDE, Supplier Device Package: 32-SOIC, Common Mode Transient Immunity (Min): 100V/ns, Grade: Automotive, Number of Channels: 1, Voltage - Output Supply: 12V ~ 25V, Qualification: AEC-Q100.
Weitere Produktangebote MGD3162AM550EKR2
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MGD3162AM550EKR2 | Hersteller : NXP USA Inc. |
 Description: GATE DRIVERPackaging: Tape & Reel (TR) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C Technology: Magnetic Coupling Voltage - Isolation: 8000Vrms Approval Agency: UL, VDE Supplier Device Package: 32-SOIC Common Mode Transient Immunity (Min): 100V/ns Grade: Automotive Number of Channels: 1 Voltage - Output Supply: 12V ~ 25V Qualification: AEC-Q100 |
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MGD3162AM550EKR2 | Hersteller : NXP USA Inc. |
Description: GATE DRIVER Packaging: Cut Tape (CT) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C Technology: Magnetic Coupling Voltage - Isolation: 8000Vrms Approval Agency: UL, VDE Supplier Device Package: 32-SOIC Common Mode Transient Immunity (Min): 100V/ns Grade: Automotive Number of Channels: 1 Voltage - Output Supply: 12V ~ 25V Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MGD3162AM550EKR2 | Hersteller : NXP Semiconductors |
Galvanically Isolated Gate Drivers Optimised SiC & IGBT GDIC for xEV traction inverters |
Produkt ist nicht verfügbar |