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MC33FS8430G1KS MC33FS8430G1KS NXP USA Inc. FS84_FS85C_DS.pdf Description: SAFETY POWER MANAGEMENT IC, QFN5
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Applications: System Basis Chip
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
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S32G274ASBK1VUCT NXP USA Inc. S32G2.pdf Description: S32G274A ARM CORTEX-M7 AND -A53,
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz, 1GHz
Mounting Type: Surface Mount
Package / Case: 525-FBGA, FCBGA
Packaging: Tray
Graphics Acceleration: No
RAM Controllers: DDR3L, LPDDR4
Co-Processors/DSP: Multimedia; NEON
Number of Cores/Bus Width: 3 Core, 64-Bit/4 Core, 32-Bit
USB: USB 2.0 OTG (1)
Ethernet: 1/2.5Gbps (4)
Supplier Device Package: 525-FCPBGA (19x19)
Qualification: AEC-Q100
Grade: Automotive
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
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LPC55S16JEV98K LPC55S16JEV98K NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Number of I/O: 64
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100+8.82 EUR
250+8.41 EUR
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FS32K148HAT0VLLT FS32K148HAT0VLLT NXP USA Inc. S32K1xx.pdf Description: S32K148 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 156
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S912ZVLA64F0VFM S912ZVLA64F0VFM NXP USA Inc. Description: S912ZVLA64F0VFM
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 6x10b SAR; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Grade: Automotive
Number of I/O: 19
Qualification: AEC-Q100
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S912ZVLA64F0VFMR S912ZVLA64F0VFMR NXP USA Inc. Description: S912ZVLA64F0VFMR
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 6x10b SAR; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Grade: Automotive
Number of I/O: 19
Qualification: AEC-Q100
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MW7IC2220NR1 MW7IC2220NR1 NXP USA Inc. MW7IC2220.pdf Description: IC AMP W-CDMA 2.11-2.17GHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-16 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 2.11GHz ~ 2.17GHz
RF Type: W-CDMA
Voltage - Supply: 28V
Gain: 31dB
Current - Supply: 300mA
P1dB: 43dBm
Test Frequency: 2.14GHz
Supplier Device Package: TO-270 WBL-16
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MM908E626AVPEK MM908E626AVPEK NXP USA Inc. 908E626.pdf Description: IC STEPPER MOTOR DRVR 54SOIC
Packaging: Tube
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SCI, SPI
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 115°C
Voltage - Supply: 8V ~ 18V
Controller Series: 908E
Program Memory Type: FLASH (16kB)
Applications: Mirror Control
Core Processor: HC08
Supplier Device Package: 54-SOIC-EP
Grade: Automotive
Number of I/O: 13
DigiKey Programmable: Not Verified
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MPC8260AZUPJDB MPC8260AZUPJDB NXP USA Inc. MPC8260A.pdf Description: IC MPU MPC82XX 300MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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P3T1035BUKAZ P3T1035BUKAZ NXP USA Inc. P3T1035XUK_P3T2030XUK.pdf Description: P3T1035BUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5%
Sensing Temperature - Local: -40°C ~ 125°C
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P3T1035BUKAZ P3T1035BUKAZ NXP USA Inc. P3T1035XUK_P3T2030XUK.pdf Description: P3T1035BUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5%
Sensing Temperature - Local: -40°C ~ 125°C
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14+1.51 EUR
15+1.43 EUR
25+1.33 EUR
50+1.27 EUR
100+1.21 EUR
500+1.11 EUR
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S9S12ZVLS3AVFMR NXP USA Inc. Description: S12Z CPU, 32K FLASH
Packaging: Tape & Reel (TR)
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KITFS2400FRDMEVM NXP USA Inc. getting-started-with-the-kitfs2400frdmevm-evaluation-board:GS-KITFS2400FRDMEVM Description: EVAL BOARD FOR FS2400
Packaging: Tray
Function: System Basis Chip (SBC)
Type: Interface
Contents: Board(s), Cable(s), Accessories
Utilized IC / Part: FS2400
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 40V Supply
Secondary Attributes: On-Board LEDs, Test Points
Embedded: Yes, MCU
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SPC5604CACLL6 SPC5604CACLL6 NXP USA Inc. MPC5604BC.pdf Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 28x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
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MC33FS6507NAER2 MC33FS6507NAER2 NXP USA Inc. FS6500-FS4500-ASILD.pdf Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC33FS6507NAE MC33FS6507NAE NXP USA Inc. FS6500-FS4500-ASILD.pdf Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC33FS6506NAE MC33FS6506NAE NXP USA Inc. FS6500-FS4500-ASILD.pdf Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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C912ZVML31L0MKFR NXP USA Inc. Description: 16-BIT MICROCONTROLLERS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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XC56309VF100A XC56309VF100A NXP USA Inc. DSP56309UM.pdf Description: IC DSP 24BIT FIXED-POINT 196-BGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Interface: Host Interface, SSI, SCI
Type: Fixed Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (576B)
On-Chip RAM: 24kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 196-LBGA (15x15)
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LFJ44INTPU1A NXP USA Inc. Description: QORIVVA MPC5644A ON A 324 PIN BG
Packaging: Bulk
For Use With/Related Products: MPC5644A
Module/Board Type: Socket Adapter
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LFJ44INTPQA NXP USA Inc. Description: QORIVVA MPC5644A ON A 208 PIN 1.
Packaging: Bulk
For Use With/Related Products: MPC5644A
Module/Board Type: Socket Adapter
Utilized IC / Part: MPC5644A
Produkt ist nicht verfügbar
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LFVCAL32SYNC2 NXP USA Inc. Description: 32-BIT 2 MB VERTICAL CALIBRATION
Packaging: Bulk
For Use With/Related Products: MPC5644A
Accessory Type: Daughter Board
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SPC5644CF0VLU8R SPC5644CF0VLU8R NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
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SPC5644CF0CLU8 SPC5644CF0CLU8 NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
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SPC5644CF0CLU8R SPC5644CF0CLU8R NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
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SPC5644CF0VLT1 SPC5644CF0VLT1 NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 208TQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-TQFP (28x28)
Number of I/O: 177
DigiKey Programmable: Not Verified
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SPC5644CF0VLT1R SPC5644CF0VLT1R NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 208TQFP
Packaging: Tape & Reel (TR)
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-TQFP (28x28)
Number of I/O: 177
DigiKey Programmable: Not Verified
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SPC5644CF0MMJ1 SPC5644CF0MMJ1 NXP USA Inc. Description: IC MCU 32B 1.5MB FLASH 256MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 199
Supplier Device Package: 256-MAPBGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 33x10b, 10x12b
Core Processor: e200z4d, e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 80MHz/120MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
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P82B96DP,118 P82B96DP,118 NXP USA Inc. P82B96.pdf Description: IC REDRIVER I2C 2CH 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 15V
Applications: I2C
Current - Supply: 900µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Capacitance - Input: 7 pF
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A5G19H605W19NR3 NXP USA Inc. A5G19H605W19N.pdf Description: A5G19H605W19NR3
Packaging: Bulk
Package / Case: OM-780-4S4S
Mounting Type: Surface Mount
Frequency: 1.93GHz ~ 1.995GHz
Power - Output: 85W
Gain: 15.1dB
Technology: GaN
Supplier Device Package: OM-780-4S4S
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 300 mA
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A5G21H605W19NR3 NXP USA Inc. A5G21H605W19N.pdf Description: RF MOSFET LDMOS 30V ACP1230S-4
Packaging: Tape & Reel (TR)
Package / Case: OM-780-4S4S
Mounting Type: Surface Mount
Frequency: 2.11GHz ~ 2.2GHz
Power - Output: 85W
Gain: 15.1dB
Technology: GaN
Supplier Device Package: OM-780-4S4S
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 300 mA
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FD32K144HRT0VLFT NXP USA Inc. Description: S32K144, 512K FLASH, 64K RAM
Packaging: Tray
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PMV16UN,215 PMV16UN,215 NXP USA Inc. PMV16UN.pdf Description: MOSFET N-CH 20V 5.8A TO236AB
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 5.8A (Ta)
Rds On (Max) @ Id, Vgs: 18mOhm @ 5.8A, 4.5V
Power Dissipation (Max): 510mW (Ta)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: SOT-23 (TO-236AB)
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 11 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 670 pF @ 10 V
Produkt ist nicht verfügbar
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LFK77CIDBZ2W1A NXP USA Inc. Description: MPC5777C INTEGRATED DEBUG BOARD
Packaging: Bulk
For Use With/Related Products: MPC5777C
Type: Debugger
Contents: Board(s)
Produkt ist nicht verfügbar
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LFK77CIDBZ2W1E NXP USA Inc. Description: MPC5777C INTEGRATED DEBUG BOARD
Packaging: Bulk
For Use With/Related Products: MPC5777C
Type: Debugger
Contents: Board(s)
Produkt ist nicht verfügbar
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LFK77CIDBZ2W1D NXP USA Inc. Description: MPC5777C INTEGRATED DEBUG BOARD
Packaging: Bulk
For Use With/Related Products: MPC5777C
Type: Debugger
Contents: Board(s)
Produkt ist nicht verfügbar
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PN7220EV/C101K NXP USA Inc. PN7220.pdf Description: IC
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443A, ISO 14443B, ISO 15693, Mifare, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
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74LV373DB,112 74LV373DB,112 NXP USA Inc. 74LV373.pdf Description: IC D-TYPE TRANSP 8:8 20-SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 16mA, 16mA
Delay Time - Propagation: 20ns
Supplier Device Package: 20-SSOP
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MPF5023CMBA0ES MPF5023CMBA0ES NXP USA Inc. PF5023.pdf Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
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100+8.01 EUR
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MPF5023CMMA0ESR2 NXP USA Inc. PF5023.pdf Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
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MPF5023CVNA0ESR2 NXP USA Inc. PF5023.pdf Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
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MPF5023CVNA0ES NXP USA Inc. PF5023.pdf Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
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MPF5023CMMA0ES NXP USA Inc. PF5023.pdf Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
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MC33FS4500NAE MC33FS4500NAE NXP USA Inc. 35FS4500-35FS6500-ASILD.pdf Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
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MC9S08GW64CLH MC9S08GW64CLH NXP USA Inc. MC9S08GW64.pdf Description: IC MCU 8BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x16b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LCD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
DigiKey Programmable: Not Verified
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PESD2NFC-SFYL PESD2NFC-SFYL NXP USA Inc. PESD5V0F1BL.pdf Description: TVS DIODE 24VWM DSN0603-2
Packaging: Bulk
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Type: Zener
Voltage - Reverse Standoff (Typ): 24V (Max)
Supplier Device Package: DSN0603-2
Bidirectional Channels: 1
Power Line Protection: No
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IW416HN/A1IMP IW416HN/A1IMP NXP USA Inc. IW416.pdf Description: IC RF TXRX 802.15.4 68HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.05V, 1.8V, 2.2V
Power - Output: 21dBm
Protocol: 802.11a/b/g/n, Bluetooth v5.1, Class 2, GPS, GSM, LTE, WCDMA
Current - Receiving: 5µA ~ 60mA
Data Rate (Max): 150Mbps
Current - Transmitting: 240µA ~ 325mA
Supplier Device Package: 68-HVQFN (8x8)
Modulation: 4-DQPSK, 8-DPSK, 16-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: 802.15.4, Bluetooth, Cellular, WiFi
Serial Interfaces: GPIO, I2S, JTAG, PCM, SDIO, UART
Produkt ist nicht verfügbar
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IW416HN/A1IK IW416HN/A1IK NXP USA Inc. IW416.pdf Description: IC RF TXRX 802.15.4 68HVQFN
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.05V, 1.8V, 2.2V
Power - Output: 21dBm
Protocol: 802.11a/b/g/n, Bluetooth v5.1, Class 2, GPS, GSM, LTE, WCDMA
Current - Receiving: 5µA ~ 60mA
Data Rate (Max): 150Mbps
Current - Transmitting: 240µA ~ 325mA
Supplier Device Package: 68-HVQFN (8x8)
Modulation: 4-DQPSK, 8-DPSK, 16-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: 802.15.4, Bluetooth, Cellular, WiFi
Serial Interfaces: GPIO, I2S, JTAG, PCM, SDIO, UART
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BB187,335 BB187,335 NXP USA Inc. BB187_Rev5.pdf Description: DIODE VHF VAR CAP 32V SOD523
Packaging: Tape & Reel (TR)
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.92pF @ 25V, 1MHz
Capacitance Ratio Condition: C2/C25
Supplier Device Package: SOD-523
Voltage - Peak Reverse (Max): 32 V
Capacitance Ratio: 11.0
Produkt ist nicht verfügbar
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S912ZVC12F0VKHR S912ZVC12F0VKHR NXP USA Inc. S12ZVCFS.pdf Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 16x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 42
DigiKey Programmable: Not Verified
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S912ZVC12F0VKH S912ZVC12F0VKH NXP USA Inc. S12ZVCFS.pdf Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 16x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 42
DigiKey Programmable: Not Verified
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74AHC541PW,112 74AHC541PW,112 NXP USA Inc. 74AHC_AHCT541.pdf Description: IC BUFF/DVR TRI-ST 8BIT 20TSSOP
Packaging: Bulk
auf Bestellung 6000 Stücke:
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C9KEAZN64AMLCR C9KEAZN64AMLCR NXP USA Inc. Description: C9KEAZN64AMLCR
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PMC, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 57
Produkt ist nicht verfügbar
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74LVT04DB,112 74LVT04DB,112 NXP USA Inc. 74LVT04.pdf Description: IC HEX INVERTER 3.3V 14-SSOP
Packaging: Tube
auf Bestellung 631 Stücke:
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LPC1111FHN33/103 NXP USA Inc. LPC111X.pdf Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCZ33990EF MCZ33990EF NXP USA Inc. MC33990.pdf Description: IC INTERFACE SPECIALIZED 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Voltage - Supply: 9V ~ 16V
Supplier Device Package: 8-SOIC
Produkt ist nicht verfügbar
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MCZ33990EFR2 MCZ33990EFR2 NXP USA Inc. MC33990.pdf Description: IC INTERFACE SPECIALIZED 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Voltage - Supply: 9V ~ 16V
Supplier Device Package: 8-SOIC
Produkt ist nicht verfügbar
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LPC2132FBD64/01,15 LPC2132FBD64/01,15 NXP USA Inc. LPC2131_32_34_36_38.pdf Description: IC MCU 16/32BIT 64KB FLSH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 47
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC5534JBD64MP NXP USA Inc. LPC553x.pdf Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 13x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 39
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10+13.97 EUR
25+13.33 EUR
50+12.85 EUR
100+12.4 EUR
250+11.82 EUR
500+11.4 EUR
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LPC1113JBD48/303QL LPC1113JBD48/303QL NXP USA Inc. LPC1102_1104.pdf Description: IC MCU 32BIT 24KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 24KB (24K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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10+3.76 EUR
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MC33FS8430G1KS FS84_FS85C_DS.pdf
MC33FS8430G1KS
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Applications: System Basis Chip
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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S32G274ASBK1VUCT S32G2.pdf
Hersteller: NXP USA Inc.
Description: S32G274A ARM CORTEX-M7 AND -A53,
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz, 1GHz
Mounting Type: Surface Mount
Package / Case: 525-FBGA, FCBGA
Packaging: Tray
Graphics Acceleration: No
RAM Controllers: DDR3L, LPDDR4
Co-Processors/DSP: Multimedia; NEON
Number of Cores/Bus Width: 3 Core, 64-Bit/4 Core, 32-Bit
USB: USB 2.0 OTG (1)
Ethernet: 1/2.5Gbps (4)
Supplier Device Package: 525-FCPBGA (19x19)
Qualification: AEC-Q100
Grade: Automotive
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
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LPC55S16JEV98K LPC55S1x_LPC551x_DS.pdf
LPC55S16JEV98K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Number of I/O: 64
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Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+13.53 EUR
10+10.44 EUR
25+9.66 EUR
100+8.82 EUR
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500+8.16 EUR
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FS32K148HAT0VLLT S32K1xx.pdf
FS32K148HAT0VLLT
Hersteller: NXP USA Inc.
Description: S32K148 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 156
Produkt ist nicht verfügbar
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S912ZVLA64F0VFM
S912ZVLA64F0VFM
Hersteller: NXP USA Inc.
Description: S912ZVLA64F0VFM
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 6x10b SAR; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Grade: Automotive
Number of I/O: 19
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S912ZVLA64F0VFMR
S912ZVLA64F0VFMR
Hersteller: NXP USA Inc.
Description: S912ZVLA64F0VFMR
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 6x10b SAR; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Grade: Automotive
Number of I/O: 19
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MW7IC2220NR1 MW7IC2220.pdf
MW7IC2220NR1
Hersteller: NXP USA Inc.
Description: IC AMP W-CDMA 2.11-2.17GHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-16 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 2.11GHz ~ 2.17GHz
RF Type: W-CDMA
Voltage - Supply: 28V
Gain: 31dB
Current - Supply: 300mA
P1dB: 43dBm
Test Frequency: 2.14GHz
Supplier Device Package: TO-270 WBL-16
Produkt ist nicht verfügbar
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MM908E626AVPEK 908E626.pdf
MM908E626AVPEK
Hersteller: NXP USA Inc.
Description: IC STEPPER MOTOR DRVR 54SOIC
Packaging: Tube
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SCI, SPI
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 115°C
Voltage - Supply: 8V ~ 18V
Controller Series: 908E
Program Memory Type: FLASH (16kB)
Applications: Mirror Control
Core Processor: HC08
Supplier Device Package: 54-SOIC-EP
Grade: Automotive
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPC8260AZUPJDB MPC8260A.pdf
MPC8260AZUPJDB
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 300MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
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P3T1035BUKAZ P3T1035XUK_P3T2030XUK.pdf
P3T1035BUKAZ
Hersteller: NXP USA Inc.
Description: P3T1035BUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5%
Sensing Temperature - Local: -40°C ~ 125°C
Produkt ist nicht verfügbar
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P3T1035BUKAZ P3T1035XUK_P3T2030XUK.pdf
P3T1035BUKAZ
Hersteller: NXP USA Inc.
Description: P3T1035BUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5%
Sensing Temperature - Local: -40°C ~ 125°C
auf Bestellung 3159 Stücke:
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AnzahlPrivatkunde
13+1.71 EUR
14+1.51 EUR
15+1.43 EUR
25+1.33 EUR
50+1.27 EUR
100+1.21 EUR
500+1.11 EUR
1000+1.06 EUR
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S9S12ZVLS3AVFMR
Hersteller: NXP USA Inc.
Description: S12Z CPU, 32K FLASH
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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KITFS2400FRDMEVM getting-started-with-the-kitfs2400frdmevm-evaluation-board:GS-KITFS2400FRDMEVM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR FS2400
Packaging: Tray
Function: System Basis Chip (SBC)
Type: Interface
Contents: Board(s), Cable(s), Accessories
Utilized IC / Part: FS2400
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 40V Supply
Secondary Attributes: On-Board LEDs, Test Points
Embedded: Yes, MCU
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+916.43 EUR
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SPC5604CACLL6 MPC5604BC.pdf
SPC5604CACLL6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 28x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
Produkt ist nicht verfügbar
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MC33FS6507NAER2 FS6500-FS4500-ASILD.pdf
MC33FS6507NAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS6507NAE FS6500-FS4500-ASILD.pdf
MC33FS6507NAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS6506NAE FS6500-FS4500-ASILD.pdf
MC33FS6506NAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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C912ZVML31L0MKFR
Hersteller: NXP USA Inc.
Description: 16-BIT MICROCONTROLLERS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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XC56309VF100A DSP56309UM.pdf
XC56309VF100A
Hersteller: NXP USA Inc.
Description: IC DSP 24BIT FIXED-POINT 196-BGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Interface: Host Interface, SSI, SCI
Type: Fixed Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (576B)
On-Chip RAM: 24kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 196-LBGA (15x15)
Produkt ist nicht verfügbar
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LFJ44INTPU1A
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5644A ON A 324 PIN BG
Packaging: Bulk
For Use With/Related Products: MPC5644A
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
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LFJ44INTPQA
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5644A ON A 208 PIN 1.
Packaging: Bulk
For Use With/Related Products: MPC5644A
Module/Board Type: Socket Adapter
Utilized IC / Part: MPC5644A
Produkt ist nicht verfügbar
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LFVCAL32SYNC2
Hersteller: NXP USA Inc.
Description: 32-BIT 2 MB VERTICAL CALIBRATION
Packaging: Bulk
For Use With/Related Products: MPC5644A
Accessory Type: Daughter Board
Produkt ist nicht verfügbar
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SPC5644CF0VLU8R
SPC5644CF0VLU8R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5644CF0CLU8
SPC5644CF0CLU8
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5644CF0CLU8R
SPC5644CF0CLU8R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5644CF0VLT1
SPC5644CF0VLT1
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 208TQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-TQFP (28x28)
Number of I/O: 177
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5644CF0VLT1R
SPC5644CF0VLT1R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 208TQFP
Packaging: Tape & Reel (TR)
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-TQFP (28x28)
Number of I/O: 177
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5644CF0MMJ1
SPC5644CF0MMJ1
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 256MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 199
Supplier Device Package: 256-MAPBGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 33x10b, 10x12b
Core Processor: e200z4d, e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 80MHz/120MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
Produkt ist nicht verfügbar
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P82B96DP,118 P82B96.pdf
P82B96DP,118
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 15V
Applications: I2C
Current - Supply: 900µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Capacitance - Input: 7 pF
Produkt ist nicht verfügbar
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A5G19H605W19NR3 A5G19H605W19N.pdf
Hersteller: NXP USA Inc.
Description: A5G19H605W19NR3
Packaging: Bulk
Package / Case: OM-780-4S4S
Mounting Type: Surface Mount
Frequency: 1.93GHz ~ 1.995GHz
Power - Output: 85W
Gain: 15.1dB
Technology: GaN
Supplier Device Package: OM-780-4S4S
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 300 mA
Produkt ist nicht verfügbar
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A5G21H605W19NR3 A5G21H605W19N.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 30V ACP1230S-4
Packaging: Tape & Reel (TR)
Package / Case: OM-780-4S4S
Mounting Type: Surface Mount
Frequency: 2.11GHz ~ 2.2GHz
Power - Output: 85W
Gain: 15.1dB
Technology: GaN
Supplier Device Package: OM-780-4S4S
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 300 mA
Produkt ist nicht verfügbar
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FD32K144HRT0VLFT
Hersteller: NXP USA Inc.
Description: S32K144, 512K FLASH, 64K RAM
Packaging: Tray
Produkt ist nicht verfügbar
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PMV16UN,215 PMV16UN.pdf
PMV16UN,215
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 20V 5.8A TO236AB
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 5.8A (Ta)
Rds On (Max) @ Id, Vgs: 18mOhm @ 5.8A, 4.5V
Power Dissipation (Max): 510mW (Ta)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: SOT-23 (TO-236AB)
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 11 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 670 pF @ 10 V
Produkt ist nicht verfügbar
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LFK77CIDBZ2W1A
Hersteller: NXP USA Inc.
Description: MPC5777C INTEGRATED DEBUG BOARD
Packaging: Bulk
For Use With/Related Products: MPC5777C
Type: Debugger
Contents: Board(s)
Produkt ist nicht verfügbar
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LFK77CIDBZ2W1E
Hersteller: NXP USA Inc.
Description: MPC5777C INTEGRATED DEBUG BOARD
Packaging: Bulk
For Use With/Related Products: MPC5777C
Type: Debugger
Contents: Board(s)
Produkt ist nicht verfügbar
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LFK77CIDBZ2W1D
Hersteller: NXP USA Inc.
Description: MPC5777C INTEGRATED DEBUG BOARD
Packaging: Bulk
For Use With/Related Products: MPC5777C
Type: Debugger
Contents: Board(s)
Produkt ist nicht verfügbar
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PN7220EV/C101K PN7220.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443A, ISO 14443B, ISO 15693, Mifare, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Produkt ist nicht verfügbar
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74LV373DB,112 74LV373.pdf
74LV373DB,112
Hersteller: NXP USA Inc.
Description: IC D-TYPE TRANSP 8:8 20-SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 16mA, 16mA
Delay Time - Propagation: 20ns
Supplier Device Package: 20-SSOP
Produkt ist nicht verfügbar
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MPF5023CMBA0ES PF5023.pdf
MPF5023CMBA0ES
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
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2+12.35 EUR
10+9.51 EUR
25+8.79 EUR
100+8.01 EUR
490+7.41 EUR
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MPF5023CMMA0ESR2 PF5023.pdf
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MPF5023CVNA0ESR2 PF5023.pdf
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MPF5023CVNA0ES PF5023.pdf
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MPF5023CMMA0ES PF5023.pdf
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS4500NAE 35FS4500-35FS6500-ASILD.pdf
MC33FS4500NAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
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2+10.56 EUR
10+8.14 EUR
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100+7.02 EUR
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MC9S08GW64CLH MC9S08GW64.pdf
MC9S08GW64CLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x16b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LCD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PESD2NFC-SFYL PESD5V0F1BL.pdf
PESD2NFC-SFYL
Hersteller: NXP USA Inc.
Description: TVS DIODE 24VWM DSN0603-2
Packaging: Bulk
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Type: Zener
Voltage - Reverse Standoff (Typ): 24V (Max)
Supplier Device Package: DSN0603-2
Bidirectional Channels: 1
Power Line Protection: No
auf Bestellung 9000 Stücke:
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3523+0.18 EUR
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IW416HN/A1IMP IW416.pdf
IW416HN/A1IMP
Hersteller: NXP USA Inc.
Description: IC RF TXRX 802.15.4 68HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.05V, 1.8V, 2.2V
Power - Output: 21dBm
Protocol: 802.11a/b/g/n, Bluetooth v5.1, Class 2, GPS, GSM, LTE, WCDMA
Current - Receiving: 5µA ~ 60mA
Data Rate (Max): 150Mbps
Current - Transmitting: 240µA ~ 325mA
Supplier Device Package: 68-HVQFN (8x8)
Modulation: 4-DQPSK, 8-DPSK, 16-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: 802.15.4, Bluetooth, Cellular, WiFi
Serial Interfaces: GPIO, I2S, JTAG, PCM, SDIO, UART
Produkt ist nicht verfügbar
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IW416HN/A1IK IW416.pdf
IW416HN/A1IK
Hersteller: NXP USA Inc.
Description: IC RF TXRX 802.15.4 68HVQFN
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.05V, 1.8V, 2.2V
Power - Output: 21dBm
Protocol: 802.11a/b/g/n, Bluetooth v5.1, Class 2, GPS, GSM, LTE, WCDMA
Current - Receiving: 5µA ~ 60mA
Data Rate (Max): 150Mbps
Current - Transmitting: 240µA ~ 325mA
Supplier Device Package: 68-HVQFN (8x8)
Modulation: 4-DQPSK, 8-DPSK, 16-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: 802.15.4, Bluetooth, Cellular, WiFi
Serial Interfaces: GPIO, I2S, JTAG, PCM, SDIO, UART
Produkt ist nicht verfügbar
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BB187,335 BB187_Rev5.pdf
BB187,335
Hersteller: NXP USA Inc.
Description: DIODE VHF VAR CAP 32V SOD523
Packaging: Tape & Reel (TR)
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.92pF @ 25V, 1MHz
Capacitance Ratio Condition: C2/C25
Supplier Device Package: SOD-523
Voltage - Peak Reverse (Max): 32 V
Capacitance Ratio: 11.0
Produkt ist nicht verfügbar
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S912ZVC12F0VKHR S12ZVCFS.pdf
S912ZVC12F0VKHR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 16x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 42
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912ZVC12F0VKH S12ZVCFS.pdf
S912ZVC12F0VKH
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 16x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 42
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74AHC541PW,112 74AHC_AHCT541.pdf
74AHC541PW,112
Hersteller: NXP USA Inc.
Description: IC BUFF/DVR TRI-ST 8BIT 20TSSOP
Packaging: Bulk
auf Bestellung 6000 Stücke:
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1817+0.33 EUR
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C9KEAZN64AMLCR
C9KEAZN64AMLCR
Hersteller: NXP USA Inc.
Description: C9KEAZN64AMLCR
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PMC, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 57
Produkt ist nicht verfügbar
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74LVT04DB,112 74LVT04.pdf
74LVT04DB,112
Hersteller: NXP USA Inc.
Description: IC HEX INVERTER 3.3V 14-SSOP
Packaging: Tube
auf Bestellung 631 Stücke:
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468+1.2 EUR
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LPC1111FHN33/103 LPC111X.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCZ33990EF MC33990.pdf
MCZ33990EF
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Voltage - Supply: 9V ~ 16V
Supplier Device Package: 8-SOIC
Produkt ist nicht verfügbar
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MCZ33990EFR2 MC33990.pdf
MCZ33990EFR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Voltage - Supply: 9V ~ 16V
Supplier Device Package: 8-SOIC
Produkt ist nicht verfügbar
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LPC2132FBD64/01,15 LPC2131_32_34_36_38.pdf
LPC2132FBD64/01,15
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT 64KB FLSH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 47
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC5534JBD64MP LPC553x.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 13x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 39
auf Bestellung 1260 Stücke:
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2+15.76 EUR
10+13.97 EUR
25+13.33 EUR
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250+11.82 EUR
500+11.4 EUR
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LPC1113JBD48/303QL LPC1102_1104.pdf
LPC1113JBD48/303QL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 24KB (24K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
auf Bestellung 198 Stücke:
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4+6.66 EUR
10+3.76 EUR
25+3.69 EUR
100+3.59 EUR
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