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C9KEAZ128AMLH C9KEAZ128AMLH NXP USA Inc. Description: C9KEAZ128AMLH
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: LVD, PMC, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 71
Produkt ist nicht verfügbar
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NCF2951MTT/T0E08AJ NXP USA Inc. KeylessEntry%2CGo_Leaflet_Apr2012.pdf Description: IC PASS ENTRY 125KHZ
Packaging: Tape & Reel (TR)
Frequency: 125kHz
Interface: SPI
Type: Passive Entry/Start
Produkt ist nicht verfügbar
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K32W041AY K32W041AY NXP USA Inc. K32W041AM.pdf Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
auf Bestellung 4000 Stücke:
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3+8.01 EUR
10+6.92 EUR
25+6.55 EUR
100+6.03 EUR
250+5.72 EUR
500+5.5 EUR
1000+5.3 EUR
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K32W041AMY K32W041AMY NXP USA Inc. K32W041AM.pdf Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
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10+7.93 EUR
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100+6.92 EUR
250+6.57 EUR
500+6.32 EUR
1000+6.08 EUR
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S912ZVMAL1F0WLFR S912ZVMAL1F0WLFR NXP USA Inc. Description: VMA16, 16K FLASH, 1K RAM, 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 7x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 20V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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SPC5603BAMLH6R NXP USA Inc. Description: IC MCU 32BIT 384KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0
Data Converters: A/D 36x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, FlexRay, LINbus, SCI, SPI
Peripherals: POR, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
Produkt ist nicht verfügbar
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SPC5603BAMLH6 NXP USA Inc. Description: IC MCU 32BIT 384KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0
Data Converters: A/D 36x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, FlexRay, LINbus, SCI, SPI
Peripherals: POR, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
Produkt ist nicht verfügbar
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MK22FX512VMC12R MK22FX512VMC12R NXP USA Inc. Description: IC MCU 32B 512KB FLASH 121MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MK22FX512VMC12 MK22FX512VMC12 NXP USA Inc. K22P121M120SF5.pdf Description: IC MCU 32B 512KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA1999DB1546 NXP USA Inc. TEA1999TS.pdf Description: TEA1999DB1546
Packaging: Box
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S32G234MSBK0VUCT S32G234MSBK0VUCT NXP USA Inc. S32G2.pdf Description: S32G234M ARM CORTEX-M7, HSE W/PR
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-M7
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (4)
Number of Cores/Bus Width: 3 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32G234MSBK0VUCR NXP USA Inc. Description: S32G234M ARM CORTEX-M7, HSE W/PR
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-M7
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (4)
Number of Cores/Bus Width: 3 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MCXA142VFM MCXA142VFM NXP USA Inc. MCXAP64M96FS3.pdf Description: IC MCX 48MHZ SGL CORE 64KB QFN32
Packaging: Tray
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 1x12b; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
auf Bestellung 485 Stücke:
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10+3.26 EUR
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100+2.86 EUR
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MCXA142VFT MCXA142VFT NXP USA Inc. MCXAP64M96FS3.pdf Description: IC MCX 48MHZ SGL CORE 64KB QFN48
Packaging: Tray
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 1x12b; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 41
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MCXA152VFM MCXA152VFM NXP USA Inc. MCXAP64M96FS3.pdf Description: IC MCX 96MHZ SGL CORE 64KB QFN32
Packaging: Tray
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 1x12b; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
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MCXA152VFT MCXA152VFT NXP USA Inc. MCXAP64M96FS3.pdf Description: IC MCX 96MHZ SGL CORE 64KB QFN48
Packaging: Tray
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 1x12b; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 41
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SPC5517EBMLQ66R SPC5517EBMLQ66R NXP USA Inc. MPC5510PB.pdf Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0, e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 111
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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A5M34TG140TC-EVB NXP USA Inc. TSCEVBFS.pdf Description: A5M34TG140TC RF REFERENCE CIRCUI
Packaging: Bulk
For Use With/Related Products: A5M34TG140-TC
Frequency: 3.3GHz ~ 3.67GHz
Type: Power Amplifier
Contents: Board(s)
Utilized IC / Part: A5M34TG140-TC
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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PCA9421UK-EVM NXP USA Inc. UM11987.pdf Description: EVAL BOARD FOR PCA9421
Packaging: Bulk
Function: Power Supply
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: PCA9421
Supplied Contents: Board(s), Cable(s)
Secondary Attributes: I2C Interface(s)
Embedded: Yes, MCU
auf Bestellung 9 Stücke:
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MPF5020CMMACES MPF5020CMMACES NXP USA Inc. PF5020.pdf Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 269 Stücke:
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2+8.96 EUR
10+6.86 EUR
25+6.33 EUR
100+5.76 EUR
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MC33FS6527KAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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QN9090THN/001Y QN9090THN/001Y NXP USA Inc. QN9090(T)QN9030(T).pdf Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
auf Bestellung 4000 Stücke:
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10+7.93 EUR
25+7.14 EUR
100+6.5 EUR
250+5.87 EUR
500+5.27 EUR
1000+4.44 EUR
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MC9S08DN60ACLH MC9S08DN60ACLH NXP USA Inc. MC9S08DN60.pdf Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NAFE11348B40BSMP NXP USA Inc. NAFE11388.pdf Description: NAFE11348B40BSMP
Packaging: Tape & Reel (TR)
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
1000+17.13 EUR
Mindestbestellmenge: 1000
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NAFE11348B40BSMP NXP USA Inc. NAFE11388.pdf Description: NAFE11348B40BSMP
Packaging: Cut Tape (CT)
auf Bestellung 1000 Stücke:
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1+27.14 EUR
10+21.57 EUR
25+20.19 EUR
100+18.66 EUR
250+17.93 EUR
500+17.49 EUR
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MC9RS08KB2CSCR MC9RS08KB2CSCR NXP USA Inc. MC9RS08KB12.pdf Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 126 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 6
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P3T1035GUKZ NXP USA Inc. P3T1035XUK_P3T2030XUK.pdf Description: P3T1035GUK
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TJA1042BTK/0J TJA1042BTK/0J NXP USA Inc. TJA1042.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TFA8200HN/N1J NXP USA Inc. TFA8200.pdf Description: LOW POWER CLASS D AMP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TJA1057BTK/0J TJA1057BTK/0J NXP USA Inc. TJA1057.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJA1057CTK/0J TJA1057CTK/0J NXP USA Inc. TJA1057.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
6000+0.48 EUR
Mindestbestellmenge: 6000
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MPF5020CMMA0ESR2 NXP USA Inc. PF5020.pdf Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MPF5020CMMA0ES NXP USA Inc. PF5020.pdf Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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NHS3100SENSORDB NXP USA Inc. NTAGSENSORFS.pdf Description: NHS3100SENSORDB
Packaging: Bulk
For Use With/Related Products: NHS3100
Type: Data Logger
Supplied Contents: Board(s), Cable(s)
Produkt ist nicht verfügbar
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74AUP1G18GM,115 74AUP1G18GM,115 NXP USA Inc. 74AUP1G18.pdf Description: IC DEMUX 3-ST LP 6-XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Circuit: 1 x 1:2
Type: Demultiplexer
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
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MGD3100BM58EK MGD3100BM58EK NXP USA Inc. MC33GD3100_SDS.pdf Description: IC GATE DRVR HALF-BRIDGE 32BSSOP
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5V
Supplier Device Package: 32-SOIC
Channel Type: Single
Driven Configuration: Half-Bridge
Number of Drivers: 1
Gate Type: IGBT, MOSFET (N-Channel)
Current - Peak Output (Source, Sink): 15A, 15A
Grade: Automotive
Qualification: AEC-Q100
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FS32K142HAT0VLFR NXP USA Inc. S32K1xx.pdf Description: S32K142, 256K FLASH, 32K RAM
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FS32K142HAT0VLFT NXP USA Inc. S32K1xx.pdf Description: S32K142, 256K FLASH, 32K RAM
Packaging: Tray
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MCIMX6Y0CVM05AB MCIMX6Y0CVM05AB NXP USA Inc. IMX6ULLIEC.pdf Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: I2C, SPI, UART
Produkt ist nicht verfügbar
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S9S12VR64AF0VLF S9S12VR64AF0VLF NXP USA Inc. 15944_MC9S12VRRMV3.pdf Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT595SFAWCR MIMXRT595SFAWCR NXP USA Inc. IMXRT500EC.pdf Description: IC MCU 32BIT 192KB ROM 141WLCSP
Packaging: Cut Tape (CT)
Package / Case: 141-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 141-WLCSP (4.53x4.53)
Number of I/O: 136
DigiKey Programmable: Not Verified
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Lieferzeit 10-14 Tag (e)
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LFBGAMT4A NXP USA Inc. Description: 292 PIN 0.8 MM PGA SOCKET SPACER
Packaging: Bulk
Module/Board Type: Socket Module - PGA
Produkt ist nicht verfügbar
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74AUP1G240GM,115 74AUP1G240GM,115 NXP USA Inc. 74AUP1G240.pdf Description: IC BUFFER/LINE DVR 3ST 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
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S32K376NHT1MJBST S32K376NHT1MJBST NXP USA Inc. S32K39%2C%20S32K37.pdf Description: IC MCU 32BIT 6MB FLASH 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 96x12b SAR, 4x16b Sigma-Delta
Core Size: 32-Bit 3-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINBus, SPI, UART/USART, Zipwire
Peripherals: DMA, Ethernet, I2S, PWM
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 237
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S32K366NHT1MJBST NXP USA Inc. Description: IC
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
Operating Temperature: -40°C ~ 125°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: PWM
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
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S32K366EHT1MJBST S32K366EHT1MJBST NXP USA Inc. S32K39-S32K37-DS.pdf Description: S32K366EHT1MJBST
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
Operating Temperature: -40°C ~ 125°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: PWM
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
RAM Size: 704K x 8
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART
Produkt ist nicht verfügbar
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LPC845M301JHI48Y LPC845M301JHI48Y NXP USA Inc. LPC84x.pdf Description: IC MCU 32BIT 64KB FLASH 48HVQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, Capacitive Touch, DMA, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 3876 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.81 EUR
10+4.51 EUR
25+3.91 EUR
100+3.23 EUR
250+2.91 EUR
500+2.71 EUR
1000+2.54 EUR
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MFS8630BMDA0ES MFS8630BMDA0ES NXP USA Inc. Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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SAF4000EL/102Z22AY NXP USA Inc. Description: SAF4000EL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF4000EL/102Z22AK NXP USA Inc. Description: SAF4000EL
Packaging: Tray
Produkt ist nicht verfügbar
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AFT18H357-24NR6 NXP USA Inc. RF_%20Gde.pdf Description: RF MOSFET LDMOS 28V OM1230-42
Packaging: Tape & Reel (TR)
Package / Case: OM-1230-4L2L
Mounting Type: Chassis Mount
Frequency: 1.81GHz
Configuration: Dual
Power - Output: 63W
Gain: 17.5dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L2L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 800 mA
Produkt ist nicht verfügbar
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MC9S08LG16CLF MC9S08LG16CLF NXP USA Inc. MC9S08LG32.pdf Description: IC MCU 8BIT 18KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 18KB (18K x 8)
RAM Size: 1.9K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 9x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 613 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.33 EUR
10+4 EUR
25+3.67 EUR
80+3.35 EUR
230+3.14 EUR
440+3.04 EUR
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FS32K142WAT0WLFR NXP USA Inc. S32K1xx.pdf Description: S32K142W ARM CORTEX-M4F, UP TO 8
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 23x12b SAR; D/A 6x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
Produkt ist nicht verfügbar
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FS32K142WAT0WLHR NXP USA Inc. S32K1xx.pdf Description: S32K142W ARM CORTEX-M4F, UP TO 8
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 29x12b SAR; D/A 8x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
Produkt ist nicht verfügbar
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FS32K144WAT0WLFR FS32K144WAT0WLFR NXP USA Inc. S32K1xx.pdf Description: S32K144W ARM CORTEX-M4F, UP TO 8
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 23x12b SAR; D/A 6x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
Produkt ist nicht verfügbar
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MCF51QU32VHS MCF51QU32VHS NXP USA Inc. MCF51QW256.pdf Description: IC MCU 32BIT 32KB FLASH 44MAPLGA
Packaging: Tray
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 11x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DZ128CLLR MC9S08DZ128CLLR NXP USA Inc. MC9S08DZ128.pdf Description: IC MCU 8BIT 128KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 87
DigiKey Programmable: Not Verified
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Lieferzeit 10-14 Tag (e)
1000+18.2 EUR
Mindestbestellmenge: 1000
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MC9S08DZ128CLLR MC9S08DZ128CLLR NXP USA Inc. MC9S08DZ128.pdf Description: IC MCU 8BIT 128KB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 87
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
1+28.72 EUR
10+22.96 EUR
100+19.39 EUR
500+19.27 EUR
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MC9S08DZ128CLL MC9S08DZ128CLL NXP USA Inc. MC9S08DZ128.pdf Description: IC MCU 8BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 87
DigiKey Programmable: Verified
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1+28.72 EUR
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450+19.27 EUR
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LFBGARBZ1BO NXP USA Inc. Description: NXP LEAD FREE 522 PIN 1.0 MM PIT
Packaging: Bulk
Produkt ist nicht verfügbar
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C9KEAZ128AMLH
C9KEAZ128AMLH
Hersteller: NXP USA Inc.
Description: C9KEAZ128AMLH
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: LVD, PMC, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 71
Produkt ist nicht verfügbar
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NCF2951MTT/T0E08AJ KeylessEntry%2CGo_Leaflet_Apr2012.pdf
Hersteller: NXP USA Inc.
Description: IC PASS ENTRY 125KHZ
Packaging: Tape & Reel (TR)
Frequency: 125kHz
Interface: SPI
Type: Passive Entry/Start
Produkt ist nicht verfügbar
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K32W041AY K32W041AM.pdf
K32W041AY
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+8.01 EUR
10+6.92 EUR
25+6.55 EUR
100+6.03 EUR
250+5.72 EUR
500+5.5 EUR
1000+5.3 EUR
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K32W041AMY K32W041AM.pdf
K32W041AMY
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
auf Bestellung 3930 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.17 EUR
10+7.93 EUR
25+7.51 EUR
100+6.92 EUR
250+6.57 EUR
500+6.32 EUR
1000+6.08 EUR
Mindestbestellmenge: 2
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S912ZVMAL1F0WLFR
S912ZVMAL1F0WLFR
Hersteller: NXP USA Inc.
Description: VMA16, 16K FLASH, 1K RAM, 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 7x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 20V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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SPC5603BAMLH6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0
Data Converters: A/D 36x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, FlexRay, LINbus, SCI, SPI
Peripherals: POR, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
Produkt ist nicht verfügbar
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SPC5603BAMLH6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0
Data Converters: A/D 36x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, FlexRay, LINbus, SCI, SPI
Peripherals: POR, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
Produkt ist nicht verfügbar
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MK22FX512VMC12R
MK22FX512VMC12R
Hersteller: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 121MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MK22FX512VMC12 K22P121M120SF5.pdf
MK22FX512VMC12
Hersteller: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA1999DB1546 TEA1999TS.pdf
Hersteller: NXP USA Inc.
Description: TEA1999DB1546
Packaging: Box
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S32G234MSBK0VUCT S32G2.pdf
S32G234MSBK0VUCT
Hersteller: NXP USA Inc.
Description: S32G234M ARM CORTEX-M7, HSE W/PR
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-M7
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (4)
Number of Cores/Bus Width: 3 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32G234MSBK0VUCR
Hersteller: NXP USA Inc.
Description: S32G234M ARM CORTEX-M7, HSE W/PR
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-M7
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (4)
Number of Cores/Bus Width: 3 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MCXA142VFM MCXAP64M96FS3.pdf
MCXA142VFM
Hersteller: NXP USA Inc.
Description: IC MCX 48MHZ SGL CORE 64KB QFN32
Packaging: Tray
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 1x12b; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
auf Bestellung 485 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.19 EUR
10+3.26 EUR
25+3.01 EUR
100+2.86 EUR
Mindestbestellmenge: 4
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MCXA142VFT MCXAP64M96FS3.pdf
MCXA142VFT
Hersteller: NXP USA Inc.
Description: IC MCX 48MHZ SGL CORE 64KB QFN48
Packaging: Tray
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 1x12b; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 41
auf Bestellung 254 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.6 EUR
10+5.15 EUR
80+4.22 EUR
Mindestbestellmenge: 3
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MCXA152VFM MCXAP64M96FS3.pdf
MCXA152VFM
Hersteller: NXP USA Inc.
Description: IC MCX 96MHZ SGL CORE 64KB QFN32
Packaging: Tray
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 1x12b; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.61 EUR
10+3.6 EUR
Mindestbestellmenge: 4
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MCXA152VFT MCXAP64M96FS3.pdf
MCXA152VFT
Hersteller: NXP USA Inc.
Description: IC MCX 96MHZ SGL CORE 64KB QFN48
Packaging: Tray
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 1x12b; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 41
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+8.84 EUR
10+6.89 EUR
80+5.65 EUR
Mindestbestellmenge: 2
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SPC5517EBMLQ66R MPC5510PB.pdf
SPC5517EBMLQ66R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0, e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 111
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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A5M34TG140TC-EVB TSCEVBFS.pdf
Hersteller: NXP USA Inc.
Description: A5M34TG140TC RF REFERENCE CIRCUI
Packaging: Bulk
For Use With/Related Products: A5M34TG140-TC
Frequency: 3.3GHz ~ 3.67GHz
Type: Power Amplifier
Contents: Board(s)
Utilized IC / Part: A5M34TG140-TC
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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PCA9421UK-EVM UM11987.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR PCA9421
Packaging: Bulk
Function: Power Supply
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: PCA9421
Supplied Contents: Board(s), Cable(s)
Secondary Attributes: I2C Interface(s)
Embedded: Yes, MCU
auf Bestellung 9 Stücke:
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Anzahl Preis
1+355.5 EUR
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MPF5020CMMACES PF5020.pdf
MPF5020CMMACES
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 269 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+8.96 EUR
10+6.86 EUR
25+6.33 EUR
100+5.76 EUR
Mindestbestellmenge: 2
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MC33FS6527KAE FS6500-FS4500SDS-ASILB.pdf
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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QN9090THN/001Y QN9090(T)QN9030(T).pdf
QN9090THN/001Y
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+8.89 EUR
10+7.93 EUR
25+7.14 EUR
100+6.5 EUR
250+5.87 EUR
500+5.27 EUR
1000+4.44 EUR
Mindestbestellmenge: 2
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MC9S08DN60ACLH MC9S08DN60.pdf
MC9S08DN60ACLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NAFE11348B40BSMP NAFE11388.pdf
Hersteller: NXP USA Inc.
Description: NAFE11348B40BSMP
Packaging: Tape & Reel (TR)
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+17.13 EUR
Mindestbestellmenge: 1000
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NAFE11348B40BSMP NAFE11388.pdf
Hersteller: NXP USA Inc.
Description: NAFE11348B40BSMP
Packaging: Cut Tape (CT)
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+27.14 EUR
10+21.57 EUR
25+20.19 EUR
100+18.66 EUR
250+17.93 EUR
500+17.49 EUR
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MC9RS08KB2CSCR MC9RS08KB12.pdf
MC9RS08KB2CSCR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 126 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 6
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P3T1035GUKZ P3T1035XUK_P3T2030XUK.pdf
Hersteller: NXP USA Inc.
Description: P3T1035GUK
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TJA1042BTK/0J TJA1042.pdf
TJA1042BTK/0J
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TFA8200HN/N1J TFA8200.pdf
Hersteller: NXP USA Inc.
Description: LOW POWER CLASS D AMP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TJA1057BTK/0J TJA1057.pdf
TJA1057BTK/0J
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJA1057CTK/0J TJA1057.pdf
TJA1057CTK/0J
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6000+0.48 EUR
Mindestbestellmenge: 6000
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MPF5020CMMA0ESR2 PF5020.pdf
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MPF5020CMMA0ES PF5020.pdf
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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NHS3100SENSORDB NTAGSENSORFS.pdf
Hersteller: NXP USA Inc.
Description: NHS3100SENSORDB
Packaging: Bulk
For Use With/Related Products: NHS3100
Type: Data Logger
Supplied Contents: Board(s), Cable(s)
Produkt ist nicht verfügbar
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74AUP1G18GM,115 74AUP1G18.pdf
74AUP1G18GM,115
Hersteller: NXP USA Inc.
Description: IC DEMUX 3-ST LP 6-XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Circuit: 1 x 1:2
Type: Demultiplexer
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
auf Bestellung 220000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2160+0.23 EUR
Mindestbestellmenge: 2160
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MGD3100BM58EK MC33GD3100_SDS.pdf
MGD3100BM58EK
Hersteller: NXP USA Inc.
Description: IC GATE DRVR HALF-BRIDGE 32BSSOP
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5V
Supplier Device Package: 32-SOIC
Channel Type: Single
Driven Configuration: Half-Bridge
Number of Drivers: 1
Gate Type: IGBT, MOSFET (N-Channel)
Current - Peak Output (Source, Sink): 15A, 15A
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 42 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+15.24 EUR
10+11.9 EUR
42+10.67 EUR
Mindestbestellmenge: 2
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FS32K142HAT0VLFR S32K1xx.pdf
Hersteller: NXP USA Inc.
Description: S32K142, 256K FLASH, 32K RAM
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FS32K142HAT0VLFT S32K1xx.pdf
Hersteller: NXP USA Inc.
Description: S32K142, 256K FLASH, 32K RAM
Packaging: Tray
Produkt ist nicht verfügbar
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MCIMX6Y0CVM05AB IMX6ULLIEC.pdf
MCIMX6Y0CVM05AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: I2C, SPI, UART
Produkt ist nicht verfügbar
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S9S12VR64AF0VLF 15944_MC9S12VRRMV3.pdf
S9S12VR64AF0VLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MIMXRT595SFAWCR IMXRT500EC.pdf
MIMXRT595SFAWCR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 192KB ROM 141WLCSP
Packaging: Cut Tape (CT)
Package / Case: 141-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 141-WLCSP (4.53x4.53)
Number of I/O: 136
DigiKey Programmable: Not Verified
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+39.48 EUR
10+31.66 EUR
25+29.71 EUR
100+27.57 EUR
250+26.54 EUR
500+25.93 EUR
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LFBGAMT4A
Hersteller: NXP USA Inc.
Description: 292 PIN 0.8 MM PGA SOCKET SPACER
Packaging: Bulk
Module/Board Type: Socket Module - PGA
Produkt ist nicht verfügbar
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74AUP1G240GM,115 74AUP1G240.pdf
74AUP1G240GM,115
Hersteller: NXP USA Inc.
Description: IC BUFFER/LINE DVR 3ST 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
auf Bestellung 141875 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2885+0.17 EUR
Mindestbestellmenge: 2885
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S32K376NHT1MJBST S32K39%2C%20S32K37.pdf
S32K376NHT1MJBST
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 96x12b SAR, 4x16b Sigma-Delta
Core Size: 32-Bit 3-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINBus, SPI, UART/USART, Zipwire
Peripherals: DMA, Ethernet, I2S, PWM
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 237
auf Bestellung 760 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+58.91 EUR
10+48.17 EUR
25+46.57 EUR
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S32K366NHT1MJBST
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
Operating Temperature: -40°C ~ 125°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: PWM
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S32K366EHT1MJBST S32K39-S32K37-DS.pdf
S32K366EHT1MJBST
Hersteller: NXP USA Inc.
Description: S32K366EHT1MJBST
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
Operating Temperature: -40°C ~ 125°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: PWM
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
RAM Size: 704K x 8
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART
Produkt ist nicht verfügbar
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LPC845M301JHI48Y LPC84x.pdf
LPC845M301JHI48Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48HVQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, Capacitive Touch, DMA, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 3876 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.81 EUR
10+4.51 EUR
25+3.91 EUR
100+3.23 EUR
250+2.91 EUR
500+2.71 EUR
1000+2.54 EUR
Mindestbestellmenge: 3
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MFS8630BMDA0ES
MFS8630BMDA0ES
Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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SAF4000EL/102Z22AY
Hersteller: NXP USA Inc.
Description: SAF4000EL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF4000EL/102Z22AK
Hersteller: NXP USA Inc.
Description: SAF4000EL
Packaging: Tray
Produkt ist nicht verfügbar
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AFT18H357-24NR6 RF_%20Gde.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM1230-42
Packaging: Tape & Reel (TR)
Package / Case: OM-1230-4L2L
Mounting Type: Chassis Mount
Frequency: 1.81GHz
Configuration: Dual
Power - Output: 63W
Gain: 17.5dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L2L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 800 mA
Produkt ist nicht verfügbar
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MC9S08LG16CLF MC9S08LG32.pdf
MC9S08LG16CLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 18KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 18KB (18K x 8)
RAM Size: 1.9K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 9x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 613 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.33 EUR
10+4 EUR
25+3.67 EUR
80+3.35 EUR
230+3.14 EUR
440+3.04 EUR
Mindestbestellmenge: 4
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FS32K142WAT0WLFR S32K1xx.pdf
Hersteller: NXP USA Inc.
Description: S32K142W ARM CORTEX-M4F, UP TO 8
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 23x12b SAR; D/A 6x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
Produkt ist nicht verfügbar
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FS32K142WAT0WLHR S32K1xx.pdf
Hersteller: NXP USA Inc.
Description: S32K142W ARM CORTEX-M4F, UP TO 8
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 29x12b SAR; D/A 8x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
Produkt ist nicht verfügbar
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FS32K144WAT0WLFR S32K1xx.pdf
FS32K144WAT0WLFR
Hersteller: NXP USA Inc.
Description: S32K144W ARM CORTEX-M4F, UP TO 8
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 23x12b SAR; D/A 6x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
Produkt ist nicht verfügbar
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MCF51QU32VHS MCF51QW256.pdf
MCF51QU32VHS
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 44MAPLGA
Packaging: Tray
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 11x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DZ128CLLR MC9S08DZ128.pdf
MC9S08DZ128CLLR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 87
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+18.2 EUR
Mindestbestellmenge: 1000
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MC9S08DZ128CLLR MC9S08DZ128.pdf
MC9S08DZ128CLLR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 87
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+28.72 EUR
10+22.96 EUR
100+19.39 EUR
500+19.27 EUR
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MC9S08DZ128CLL MC9S08DZ128.pdf
MC9S08DZ128CLL
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 87
DigiKey Programmable: Verified
auf Bestellung 450 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+28.72 EUR
10+22.96 EUR
80+19.39 EUR
450+19.27 EUR
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LFBGARBZ1BO
Hersteller: NXP USA Inc.
Description: NXP LEAD FREE 522 PIN 1.0 MM PIT
Packaging: Bulk
Produkt ist nicht verfügbar
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