Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36402) > Seite 550 nach 607
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
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MCF51EM128CLL | NXP USA Inc. |
 Description: IC MCU 32BIT 128KB FLASH 100LQFPPackaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LCD, LVD, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 63 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| FX32K118LAT0MLHT | NXP USA Inc. |
Description: S32K118 ARM CORTEX-M0+, 48 MHZ, Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 800 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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MVR5510AVMANEP | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN5 Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| FC32K116LAT0MLFT | NXP USA Inc. |
Description: S32K116 32-BIT MCU, ARM CORTEX-M Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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MCXC144VFT | NXP USA Inc. |
Description: 48MHz, Cortex-M0+ Packaging: Tray Package / Case: 48-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TJ) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16b; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 48-QFN (7x7) Number of I/O: 40 |
auf Bestellung 1150 Stücke: Lieferzeit 10-14 Tag (e) |
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| SAF775CHN/N208W/DK | NXP USA Inc. |
Description: CAR DISP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 840 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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MPC8245LZU350D | NXP USA Inc. |
Description: IC MPU MPC82XX 350MHZ 352TBGA Number of Cores/Bus Width: 1 Core, 32-Bit Supplier Device Package: 352-TBGA (35x35) Voltage - I/O: 3.3V Core Processor: PowerPC 603e Operating Temperature: 0°C ~ 105°C (TA) Speed: 350MHz Mounting Type: Surface Mount Package / Case: 352-LBGA Packaging: Tray Additional Interfaces: I2C, I²O, PCI, UART Graphics Acceleration: No RAM Controllers: SDRAM |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 24 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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S9S08SL16F1VTL | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 28TSSOP DigiKey Programmable: Not Verified Number of I/O: 22 Supplier Device Package: 28-TSSOP Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 16x10b Core Processor: S08 EEPROM Size: 256 x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 512 x 8 Program Memory Size: 16KB (16K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 28-TSSOP (0.173", 4.40mm Width) Packaging: Tube |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC9S08AC8MFDE | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 48QFN DigiKey Programmable: Not Verified Number of I/O: 38 Supplier Device Package: 48-QFN-EP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 8x10b Core Processor: S08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 768 x 8 Program Memory Size: 8KB (8K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC33FS8510A0KS | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN5 Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Packaging: Tray Qualification: AEC-Q100 Grade: Automotive Supplier Device Package: 56-HVQFN (8x8) Current - Supply: 15mA Applications: System Basis Chip Voltage - Supply: 60V |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| S912ZVL96AVFM | NXP USA Inc. |
Description: S12Z CPU, 96K FLASH Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 32MHz Program Memory Size: 96KB (96K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 6x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-QFN-EP (5x5) Number of I/O: 19 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2450 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| MFS2630AMBA0AD | NXP USA Inc. |
Description: AUTO SBC Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3.2V ~ 40V Current - Supply: 30µA Supplier Device Package: 48-LQFP-EP (7x7) Grade: Automotive |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| S32K310NHT0MLFSR | NXP USA Inc. |
Description: IC MCU Packaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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S32K310NHT0MLFST | NXP USA Inc. |
Description: S32K310NHT0MLFST Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 24x12b SAR Core Processor: ARM® Cortex®-M7 EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 112K x 8 Program Memory Size: 512KB (512K x 8) Speed: 120MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray Qualification: AEC-Q100 Number of I/O: 42 Grade: Automotive Supplier Device Package: 48-LQFP (7x7) Peripherals: DMA, I2S, WDT Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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S32K310NHT0MPAST | NXP USA Inc. |
Description: S32K310NHT0MPAST Qualification: AEC-Q100 Number of I/O: 84 Grade: Automotive Supplier Device Package: 100-MaxQFP (10x10) Peripherals: DMA, I2S, WDT Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 24x12b SAR Core Processor: ARM® Cortex®-M7 EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 112K x 8 Program Memory Size: 512KB (512K x 8) Speed: 120MHz Mounting Type: Surface Mount Package / Case: 100-QFP Packaging: Tray Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 480 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| MMA5224KW | NXP USA Inc. |
Description: ACCELEROMETER 240G PCM/SPI 16QFN Qualification: AEC-Q100 Grade: Automotive Sensitivity (LSB/g): 2 Supplier Device Package: 16-QFN (6x6) Voltage - Supply: 4.2V ~ 17V Operating Temperature: -40°C ~ 125°C Acceleration Range: ±240g Axis: X Type: Digital Mounting Type: Surface Mount Output Type: PCM, SPI Package / Case: 16-QFN Exposed Pad Features: Selectable Low Pass Filter Packaging: Tube |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 75 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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MC9S08QE96CFT | NXP USA Inc. |
Description: IC MCU 8BIT 96KB FLASH 48QFN Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 96KB (96K x 8) RAM Size: 6K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 10x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Supplier Device Package: 48-QFN-EP (7x7) Number of I/O: 38 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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S32K314NHT1MPBSR | NXP USA Inc. |
Description: S32K314NHT1MPBSR Qualification: AEC-Q100 Number of I/O: 142 Grade: Automotive Supplier Device Package: 172-QFP (16x16) Peripherals: DMA, I2S, WDT Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 24x12b SAR Core Processor: ARM® Cortex®-M7 EEPROM Size: 128K x 8 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 512K x 8 Program Memory Size: 4MB (4M x 8) Speed: 160MHz Mounting Type: Surface Mount Package / Case: 172-QFP Packaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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S32K314NHT1VPBSR | NXP USA Inc. |
Description: S32K314 ARM CORTEX-M7, 160 MHZ, Qualification: AEC-Q100 Number of I/O: 218 Grade: Automotive Supplier Device Package: 172-QFP (16x16) Peripherals: DMA, I2S, Serial Audio, WDT Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 24x12b Core Processor: ARM® Cortex®-M7 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C RAM Size: 512K x 8 Program Memory Size: 4MB (4M x 8) Speed: 160MHz Mounting Type: Surface Mount Package / Case: 172-QFP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MCZ33903C5EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Tube Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Applications: System Basis Chip Supplier Device Package: 32-SOIC-EP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| MBMI7018TA1AER2 | NXP USA Inc. |
Description: IC Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| MBMI7018SA1AER2 | NXP USA Inc. |
Description: BMS1BCC18 100V Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| NXLS95333AESR2 | NXP USA Inc. |
Description: XY DUAL-AXIS HIGH-G INERTIAL SE Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| NXLS95733AESR2 | NXP USA Inc. |
Description: YZ DUAL-AXIS HIGH-G INERTIAL SE Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| NXLS96433AESR2 | NXP USA Inc. |
Description: PSI5 XZ DUAL-AXIS HIGH-G INERTI Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| NXLS95433AESR2 | NXP USA Inc. |
Description: XZ DUAL-AXIS HIGH-G INERTIAL SE Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| NXLS96733AESR2 | NXP USA Inc. |
Description: PSI5 YZ DUAL-AXIS HIGH-G INERTI Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| NXLS96333AESR2 | NXP USA Inc. |
Description: PSI5 XY DUAL-AXIS HIGH-G INERTI Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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MMA1200KEG | NXP USA Inc. |
Description: ACCELEROMETER 281G ANALOG 16SOIC Packaging: Bulk Package / Case: 16-SOIC (0.295", 7.50mm Width) Output Type: Analog Voltage Mounting Type: Surface Mount Type: Analog Axis: Z Acceleration Range: ±281g Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.75V ~ 5.25V Bandwidth: 400Hz Supplier Device Package: 16-SOIC Sensitivity (mV/g): 8 |
auf Bestellung 7683 Stücke: Lieferzeit 10-14 Tag (e) |
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MMA1250EGR2 | NXP USA Inc. |
Description: ACCELEROMETER 5G ANALOG 16SOIC Mounting Type: Surface Mount Output Type: Analog Voltage Package / Case: 16-SOIC (0.295", 7.50mm Width) Packaging: Tape & Reel (TR) Qualification: AEC-Q100 Grade: Automotive Sensitivity (mV/g): 400 Supplier Device Package: 16-SOIC Bandwidth: 50Hz Voltage - Supply: 4.75V ~ 5.25V Operating Temperature: -40°C ~ 105°C Acceleration Range: ±5g Axis: Z Type: Analog |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MMA1270KEG | NXP USA Inc. |
Description: ACCELEROMETER 2.5G ANALOG 16SOIC Grade: Automotive Sensitivity (mV/g): 750 Supplier Device Package: 16-SOIC Bandwidth: 50Hz Voltage - Supply: 4.75V ~ 5.25V Operating Temperature: -40°C ~ 105°C Acceleration Range: ±2.5g Axis: Z Type: Analog Mounting Type: Surface Mount Output Type: Analog Voltage Package / Case: 16-SOIC (0.295", 7.50mm Width) Packaging: Tube Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| TEA1999DB1504UL | NXP USA Inc. |
Description: TEA1999 DEMOBOARD 1504 Packaging: Box Function: Battery Charger Type: Power Management Contents: Board(s) Utilized IC / Part: TEA1999 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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MPC860SRCZQ50D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 357BGA Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART Graphics Acceleration: No RAM Controllers: DRAM Co-Processors/DSP: Communications; CPM Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10Mbps (4) Supplier Device Package: 357-PBGA (25x25) Voltage - I/O: 3.3V Core Processor: MPC8xx Operating Temperature: -40°C ~ 95°C (TA) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 357-BBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MFS2613AMDHKAD | NXP USA Inc. |
Description: System Basis Chip ASIL-D LQFP-48 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Applications: System Basis Chip Supplier Device Package: 48-LQFP-EP (7x7) Voltage - Supply: 3.2V ~ 36V |
auf Bestellung 75 Stücke: Lieferzeit 10-14 Tag (e) |
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MFS8416AMBP5ESR2 | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN4 Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: System Basis Chip Current - Supply: 15mA Supplier Device Package: 48-HVQFN (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MFS8416AMBP5ES | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN4 Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: System Basis Chip Current - Supply: 15mA Supplier Device Package: 48-HVQFN (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC33FS6523NAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO Supplier Device Package: 48-HLQFP (7x7) Applications: System Basis Chip Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tray |
auf Bestellung 250 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6G3DVK05AB | NXP USA Inc. |
Description: IC MPU I.MX6UL 528MHZ 272MAPBGA Packaging: Tray Package / Case: 272-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 272-MAPBGA (9x9) Ethernet: 10/100Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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T1024NSN7MQA | NXP USA Inc. |
Description: IC MPU QORIQ T1 1.2GHZ 780FBGA Packaging: Tray Package / Case: 780-FBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e5500 Supplier Device Package: 780-FBGA (23x23) Ethernet: GbE (8) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| T4161NSE7PQB | NXP USA Inc. |
Description: IC MPU QORIQ T4 1.5GHZ 1932BGA Packaging: Tray Package / Case: 1932-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.5GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e6500 Voltage - I/O: 1.8V, 2.5V Supplier Device Package: 1932-FCPBGA (45x45) Ethernet: 1Gbps (13), 10Gbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 16 Core, 64-Bit RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 12 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| T4241NSN7PQB | NXP USA Inc. |
Description: IC MPU QORIQ T4 1.5GHZ 1932BGA Packaging: Tray Package / Case: 1932-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.5GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e6500 Voltage - I/O: 1.8V, 2.5V Supplier Device Package: 1932-FCPBGA (45x45) Ethernet: 1Gbps (13), 10Gbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 24 Core, 64-Bit RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 12 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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MCF52110CAF80 | NXP USA Inc. |
Description: RISC MICROCONTROLLER, 32-BIT, FL Packaging: Bulk Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 66MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: Coldfire V2 Data Converters: A/D 8x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 63 DigiKey Programmable: Not Verified |
auf Bestellung 473 Stücke: Lieferzeit 10-14 Tag (e) |
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| S9S12G48J1VLC | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 32LQFP Number of I/O: 26 Supplier Device Package: 32-LQFP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, IrDA, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 12x10b Core Processor: S12 EEPROM Size: 1.5K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 4K x 8 Program Memory Size: 48KB (48K x 8) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 32-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| FD32K146HAT0VLHT | NXP USA Inc. |
Description: S32K146 32-BIT MCU, ARM CORTEX-M Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 800 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| SAF776D/20S0000K | NXP USA Inc. |
Description: SAF776D/20S0000 Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 630 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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MC705C8ACFBE | NXP USA Inc. |
Description: IC MCU 8BIT 8KB OTP 44QFP DigiKey Programmable: Not Verified Number of I/O: 24 Supplier Device Package: 44-QFP (10x10) Peripherals: POR, WDT Connectivity: SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 8-Bit Core Processor: HC05 Program Memory Type: OTP Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 304 x 8 Program Memory Size: 8KB (8K x 8) Speed: 2.1MHz Mounting Type: Surface Mount Package / Case: 44-QFP Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74LVC1GU04GF,132 | NXP USA Inc. |
Description: IC INVERTER 1CH 1-INP 6XSON Packaging: Bulk Package / Case: 6-XFDFN Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.65V ~ 5.5V Current - Output High, Low: 32mA, 32mA Number of Inputs: 1 Supplier Device Package: 6-XSON (1x1) Input Logic Level - High: 1.32V ~ 4.4V Input Logic Level - Low: 0.33V ~ 1.1V Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF Number of Circuits: 1 Current - Quiescent (Max): 4 µA |
auf Bestellung 189970 Stücke: Lieferzeit 10-14 Tag (e) |
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MC7448VU1400ND | NXP USA Inc. |
Description: IC MPU MPC74XX 1.4GHZ 360FCCBGA Packaging: Tray Package / Case: 360-CBGA, FCCBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G4 Voltage - I/O: 1.5V, 1.8V, 2.5V Supplier Device Package: 360-FCCBGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC7457RX867NC | NXP USA Inc. |
Description: IC MPU MPC74XX 867MHZ 483FCCBGA Graphics Acceleration: No Co-Processors/DSP: Multimedia; SIMD Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 0°C ~ 105°C (TA) Speed: 867MHz Mounting Type: Surface Mount Package / Case: 483-BCBGA, FCCBGA Packaging: Tray Supplier Device Package: 483-FCCBGA (29x29) Voltage - I/O: 1.5V, 1.8V, 2.5V Core Processor: PowerPC G4 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC7457VG1000LC | NXP USA Inc. |
Description: IC MPU MPC74XX 1.0GHZ 483FCCBGA Packaging: Tray Package / Case: 483-BCBGA, FCCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G4 Voltage - I/O: 1.5V, 1.8V, 2.5V Supplier Device Package: 483-FCCBGA (29x29) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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KMC7448THX1400ND | NXP USA Inc. |
Description: IC MPU MPC74XX 1.4GHZ 360FCCBGA Packaging: Tray Package / Case: 360-BCBGA, FCCBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC G4 Voltage - I/O: 1.5V, 1.8V, 2.5V Supplier Device Package: 360-FCCBGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC7448VU867ND | NXP USA Inc. |
Description: IC MPU MPC74XX 867MHZ 360FCCBGA Packaging: Tray Package / Case: 360-CBGA, FCCBGA Mounting Type: Surface Mount Speed: 867MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G4 Voltage - I/O: 1.5V, 1.8V, 2.5V Supplier Device Package: 360-FCCBGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC7448VU1700LD | NXP USA Inc. |
Description: IC MPU MPC74XX 1.7GHZ 360FCCBGA Packaging: Tray Graphics Acceleration: No Co-Processors/DSP: Multimedia; SIMD Number of Cores/Bus Width: 1 Core, 32-Bit Supplier Device Package: 360-FCCBGA (25x25) Voltage - I/O: 1.5V, 1.8V, 2.5V Core Processor: PowerPC G4 Operating Temperature: 0°C ~ 105°C (TA) Speed: 1.7GHz Mounting Type: Surface Mount Package / Case: 360-CBGA, FCCBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC7448VU1600LD | NXP USA Inc. |
Description: IC MPU MPC74XX 1.6GHZ 360FCCBGA Packaging: Tray Graphics Acceleration: No Co-Processors/DSP: Multimedia; SIMD Number of Cores/Bus Width: 1 Core, 32-Bit Supplier Device Package: 360-FCCBGA (25x25) Voltage - I/O: 1.5V, 1.8V, 2.5V Core Processor: PowerPC G4 Operating Temperature: 0°C ~ 105°C (TA) Speed: 1.6GHz Mounting Type: Surface Mount Package / Case: 360-CBGA, FCCBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC7448VU1000LD | NXP USA Inc. |
Description: IC MPU MPC74XX 1.0GHZ 360FCCBGA Voltage - I/O: 1.5V, 1.8V, 2.5V Core Processor: PowerPC G4 Operating Temperature: 0°C ~ 105°C (TA) Speed: 1.0GHz Mounting Type: Surface Mount Package / Case: 360-CBGA, FCCBGA Packaging: Tray Graphics Acceleration: No Co-Processors/DSP: Multimedia; SIMD Number of Cores/Bus Width: 1 Core, 32-Bit Supplier Device Package: 360-FCCBGA (25x25) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC7448VS1400ND | NXP USA Inc. |
Description: IC MPU MPC74XX 1.4GHZ 360FCCLGA Graphics Acceleration: No Co-Processors/DSP: Multimedia; SIMD Number of Cores/Bus Width: 1 Core, 32-Bit Supplier Device Package: 360-FCCLGA (25x25) Voltage - I/O: 1.5V, 1.8V, 2.5V Core Processor: PowerPC G4 Operating Temperature: 0°C ~ 105°C (TA) Speed: 1.4GHz Mounting Type: Surface Mount Package / Case: 360-CLGA, FCCLGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC7448HX1000ND | NXP USA Inc. |
Description: IC MPU MPC74XX 1.0GHZ 360FCCBGA Packaging: Tray Package / Case: 360-BCBGA, FCCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G4 Voltage - I/O: 1.5V, 1.8V, 2.5V Supplier Device Package: 360-FCCBGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| MIMXRT1181JVP2B | NXP USA Inc. |
Description: IC MCU Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 240 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| MIMXRT1182JVP2B | NXP USA Inc. |
Description: IC MCU Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 240 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| MFS2633AMBA0ADR2 | NXP USA Inc. |
Description: SAFETY SYSTEM BASIS CHIP WITH LO Grade: Automotive Supplier Device Package: 48-LQFP-EP (7x7) Current - Supply: 29µA Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH |
| MCF51EM128CLL |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 450 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| FX32K118LAT0MLHT |
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Produkt ist nicht verfügbar
Mindestbestellmenge: 800 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MVR5510AVMANEP |
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Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| FC32K116LAT0MLFT |
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MCXC144VFT |
|
Hersteller: NXP USA Inc.
Description: 48MHz, Cortex-M0+
Packaging: Tray
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 40
Description: 48MHz, Cortex-M0+
Packaging: Tray
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 40
auf Bestellung 1150 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 4+ | 5.28 EUR |
| 10+ | 4.07 EUR |
| 25+ | 3.78 EUR |
| 100+ | 3.31 EUR |
| 250+ | 3.18 EUR |
| 500+ | 2.87 EUR |
| SAF775CHN/N208W/DK |
Produkt ist nicht verfügbar
Mindestbestellmenge: 840 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MPC8245LZU350D |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 350MHZ 352TBGA
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 352-TBGA (35x35)
Voltage - I/O: 3.3V
Core Processor: PowerPC 603e
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 350MHz
Mounting Type: Surface Mount
Package / Case: 352-LBGA
Packaging: Tray
Additional Interfaces: I2C, I²O, PCI, UART
Graphics Acceleration: No
RAM Controllers: SDRAM
Description: IC MPU MPC82XX 350MHZ 352TBGA
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 352-TBGA (35x35)
Voltage - I/O: 3.3V
Core Processor: PowerPC 603e
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 350MHz
Mounting Type: Surface Mount
Package / Case: 352-LBGA
Packaging: Tray
Additional Interfaces: I2C, I²O, PCI, UART
Graphics Acceleration: No
RAM Controllers: SDRAM
Produkt ist nicht verfügbar
Mindestbestellmenge: 24 Stücke
Im Einkaufswagen
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| S9S08SL16F1VTL |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 28TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 22
Supplier Device Package: 28-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 512 x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Description: IC MCU 8BIT 16KB FLASH 28TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 22
Supplier Device Package: 28-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 512 x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
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Stück im Wert von UAH
| MC9S08AC8MFDE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 48QFN
DigiKey Programmable: Not Verified
Number of I/O: 38
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 768 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Description: IC MCU 8BIT 8KB FLASH 48QFN
DigiKey Programmable: Not Verified
Number of I/O: 38
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 768 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 1300 Stücke
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| MC33FS8510A0KS |
|
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Applications: System Basis Chip
Voltage - Supply: 60V
Description: SAFETY POWER MANAGEMENT IC, QFN5
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Applications: System Basis Chip
Voltage - Supply: 60V
Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
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| S912ZVL96AVFM |
Hersteller: NXP USA Inc.
Description: S12Z CPU, 96K FLASH
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 19
Description: S12Z CPU, 96K FLASH
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 19
Produkt ist nicht verfügbar
Mindestbestellmenge: 2450 Stücke
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| MFS2630AMBA0AD |
|
Hersteller: NXP USA Inc.
Description: AUTO SBC
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Description: AUTO SBC
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Produkt ist nicht verfügbar
Mindestbestellmenge: 250 Stücke
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| S32K310NHT0MLFSR |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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Stück im Wert von UAH
| S32K310NHT0MLFST |
|
Hersteller: NXP USA Inc.
Description: S32K310NHT0MLFST
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 24x12b SAR
Core Processor: ARM® Cortex®-M7
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 112K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Qualification: AEC-Q100
Number of I/O: 42
Grade: Automotive
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, I2S, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Description: S32K310NHT0MLFST
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 24x12b SAR
Core Processor: ARM® Cortex®-M7
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 112K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Qualification: AEC-Q100
Number of I/O: 42
Grade: Automotive
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, I2S, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
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| S32K310NHT0MPAST |
|
Hersteller: NXP USA Inc.
Description: S32K310NHT0MPAST
Qualification: AEC-Q100
Number of I/O: 84
Grade: Automotive
Supplier Device Package: 100-MaxQFP (10x10)
Peripherals: DMA, I2S, WDT
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 24x12b SAR
Core Processor: ARM® Cortex®-M7
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 112K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 100-QFP
Packaging: Tray
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Description: S32K310NHT0MPAST
Qualification: AEC-Q100
Number of I/O: 84
Grade: Automotive
Supplier Device Package: 100-MaxQFP (10x10)
Peripherals: DMA, I2S, WDT
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 24x12b SAR
Core Processor: ARM® Cortex®-M7
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 112K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 100-QFP
Packaging: Tray
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Produkt ist nicht verfügbar
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| MMA5224KW |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 240G PCM/SPI 16QFN
Qualification: AEC-Q100
Grade: Automotive
Sensitivity (LSB/g): 2
Supplier Device Package: 16-QFN (6x6)
Voltage - Supply: 4.2V ~ 17V
Operating Temperature: -40°C ~ 125°C
Acceleration Range: ±240g
Axis: X
Type: Digital
Mounting Type: Surface Mount
Output Type: PCM, SPI
Package / Case: 16-QFN Exposed Pad
Features: Selectable Low Pass Filter
Packaging: Tube
Description: ACCELEROMETER 240G PCM/SPI 16QFN
Qualification: AEC-Q100
Grade: Automotive
Sensitivity (LSB/g): 2
Supplier Device Package: 16-QFN (6x6)
Voltage - Supply: 4.2V ~ 17V
Operating Temperature: -40°C ~ 125°C
Acceleration Range: ±240g
Axis: X
Type: Digital
Mounting Type: Surface Mount
Output Type: PCM, SPI
Package / Case: 16-QFN Exposed Pad
Features: Selectable Low Pass Filter
Packaging: Tube
Produkt ist nicht verfügbar
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| MC9S08QE96CFT |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 96KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 96KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| S32K314NHT1MPBSR |
|
Hersteller: NXP USA Inc.
Description: S32K314NHT1MPBSR
Qualification: AEC-Q100
Number of I/O: 142
Grade: Automotive
Supplier Device Package: 172-QFP (16x16)
Peripherals: DMA, I2S, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 24x12b SAR
Core Processor: ARM® Cortex®-M7
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 172-QFP
Packaging: Bulk
Description: S32K314NHT1MPBSR
Qualification: AEC-Q100
Number of I/O: 142
Grade: Automotive
Supplier Device Package: 172-QFP (16x16)
Peripherals: DMA, I2S, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 24x12b SAR
Core Processor: ARM® Cortex®-M7
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 172-QFP
Packaging: Bulk
Produkt ist nicht verfügbar
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| S32K314NHT1VPBSR |
|
Hersteller: NXP USA Inc.
Description: S32K314 ARM CORTEX-M7, 160 MHZ,
Qualification: AEC-Q100
Number of I/O: 218
Grade: Automotive
Supplier Device Package: 172-QFP (16x16)
Peripherals: DMA, I2S, Serial Audio, WDT
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 24x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C
RAM Size: 512K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 172-QFP
Packaging: Tape & Reel (TR)
Description: S32K314 ARM CORTEX-M7, 160 MHZ,
Qualification: AEC-Q100
Number of I/O: 218
Grade: Automotive
Supplier Device Package: 172-QFP (16x16)
Peripherals: DMA, I2S, Serial Audio, WDT
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 24x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C
RAM Size: 512K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 172-QFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| MCZ33903C5EK |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Produkt ist nicht verfügbar
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| MBMI7018TA1AER2 |
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
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| MBMI7018SA1AER2 |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
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| MMA1200KEG |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 281G ANALOG 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±281g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 8
Description: ACCELEROMETER 281G ANALOG 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±281g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 8
auf Bestellung 7683 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 39+ | 11.36 EUR |
| MMA1250EGR2 |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 5G ANALOG 16SOIC
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Sensitivity (mV/g): 400
Supplier Device Package: 16-SOIC
Bandwidth: 50Hz
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 105°C
Acceleration Range: ±5g
Axis: Z
Type: Analog
Description: ACCELEROMETER 5G ANALOG 16SOIC
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Sensitivity (mV/g): 400
Supplier Device Package: 16-SOIC
Bandwidth: 50Hz
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 105°C
Acceleration Range: ±5g
Axis: Z
Type: Analog
Produkt ist nicht verfügbar
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| MMA1270KEG |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 2.5G ANALOG 16SOIC
Grade: Automotive
Sensitivity (mV/g): 750
Supplier Device Package: 16-SOIC
Bandwidth: 50Hz
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 105°C
Acceleration Range: ±2.5g
Axis: Z
Type: Analog
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Qualification: AEC-Q100
Description: ACCELEROMETER 2.5G ANALOG 16SOIC
Grade: Automotive
Sensitivity (mV/g): 750
Supplier Device Package: 16-SOIC
Bandwidth: 50Hz
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 105°C
Acceleration Range: ±2.5g
Axis: Z
Type: Analog
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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| TEA1999DB1504UL |
|
Hersteller: NXP USA Inc.
Description: TEA1999 DEMOBOARD 1504
Packaging: Box
Function: Battery Charger
Type: Power Management
Contents: Board(s)
Utilized IC / Part: TEA1999
Description: TEA1999 DEMOBOARD 1504
Packaging: Box
Function: Battery Charger
Type: Power Management
Contents: Board(s)
Utilized IC / Part: TEA1999
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MPC860SRCZQ50D4 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Description: IC MPU MPC8XX 50MHZ 357BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MFS2613AMDHKAD |
|
Hersteller: NXP USA Inc.
Description: System Basis Chip ASIL-D LQFP-48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)
Voltage - Supply: 3.2V ~ 36V
Description: System Basis Chip ASIL-D LQFP-48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)
Voltage - Supply: 3.2V ~ 36V
auf Bestellung 75 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 13.18 EUR |
| 10+ | 10.23 EUR |
| 25+ | 9.5 EUR |
| MFS8416AMBP5ESR2 |
|
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN4
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY POWER MANAGEMENT IC, QFN4
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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| MFS8416AMBP5ES |
|
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN4
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY POWER MANAGEMENT IC, QFN4
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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| MC33FS6523NAE |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 13.53 EUR |
| 10+ | 10.55 EUR |
| 25+ | 9.81 EUR |
| 80+ | 9.32 EUR |
| MCIMX6G3DVK05AB |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6UL 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6UL 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Produkt ist nicht verfügbar
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| T1024NSN7MQA |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.2GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Description: IC MPU QORIQ T1 1.2GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
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| T4161NSE7PQB |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T4 1.5GHZ 1932BGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (13), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
Description: IC MPU QORIQ T4 1.5GHZ 1932BGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (13), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
Produkt ist nicht verfügbar
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| T4241NSN7PQB |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T4 1.5GHZ 1932BGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (13), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 24 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
Description: IC MPU QORIQ T4 1.5GHZ 1932BGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (13), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 24 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
Produkt ist nicht verfügbar
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| MCF52110CAF80 |
|
Hersteller: NXP USA Inc.
Description: RISC MICROCONTROLLER, 32-BIT, FL
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
Description: RISC MICROCONTROLLER, 32-BIT, FL
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
auf Bestellung 473 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 31+ | 15.71 EUR |
| S9S12G48J1VLC |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Number of I/O: 26
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: S12
EEPROM Size: 1.5K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Number of I/O: 26
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: S12
EEPROM Size: 1.5K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
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| FD32K146HAT0VLHT |
Produkt ist nicht verfügbar
Mindestbestellmenge: 800 Stücke
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| SAF776D/20S0000K |
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| MC705C8ACFBE |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB OTP 44QFP
DigiKey Programmable: Not Verified
Number of I/O: 24
Supplier Device Package: 44-QFP (10x10)
Peripherals: POR, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 8-Bit
Core Processor: HC05
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 304 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 2.1MHz
Mounting Type: Surface Mount
Package / Case: 44-QFP
Packaging: Tray
Description: IC MCU 8BIT 8KB OTP 44QFP
DigiKey Programmable: Not Verified
Number of I/O: 24
Supplier Device Package: 44-QFP (10x10)
Peripherals: POR, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 8-Bit
Core Processor: HC05
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 304 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 2.1MHz
Mounting Type: Surface Mount
Package / Case: 44-QFP
Packaging: Tray
Produkt ist nicht verfügbar
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| 74LVC1GU04GF,132 |
|
Hersteller: NXP USA Inc.
Description: IC INVERTER 1CH 1-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 1
Supplier Device Package: 6-XSON (1x1)
Input Logic Level - High: 1.32V ~ 4.4V
Input Logic Level - Low: 0.33V ~ 1.1V
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
Description: IC INVERTER 1CH 1-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 1
Supplier Device Package: 6-XSON (1x1)
Input Logic Level - High: 1.32V ~ 4.4V
Input Logic Level - Low: 0.33V ~ 1.1V
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
auf Bestellung 189970 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 3129+ | 0.17 EUR |
| MC7448VU1400ND |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 1.4GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-CBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Description: IC MPU MPC74XX 1.4GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-CBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
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| MC7457RX867NC |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 867MHZ 483FCCBGA
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 867MHz
Mounting Type: Surface Mount
Package / Case: 483-BCBGA, FCCBGA
Packaging: Tray
Supplier Device Package: 483-FCCBGA (29x29)
Voltage - I/O: 1.5V, 1.8V, 2.5V
Core Processor: PowerPC G4
Description: IC MPU MPC74XX 867MHZ 483FCCBGA
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 867MHz
Mounting Type: Surface Mount
Package / Case: 483-BCBGA, FCCBGA
Packaging: Tray
Supplier Device Package: 483-FCCBGA (29x29)
Voltage - I/O: 1.5V, 1.8V, 2.5V
Core Processor: PowerPC G4
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MC7457VG1000LC |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 1.0GHZ 483FCCBGA
Packaging: Tray
Package / Case: 483-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 483-FCCBGA (29x29)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Description: IC MPU MPC74XX 1.0GHZ 483FCCBGA
Packaging: Tray
Package / Case: 483-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 483-FCCBGA (29x29)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| KMC7448THX1400ND |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 1.4GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Description: IC MPU MPC74XX 1.4GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
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Stück im Wert von UAH
| MC7448VU867ND |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 867MHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-CBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 867MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Description: IC MPU MPC74XX 867MHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-CBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 867MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC7448VU1700LD |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 1.7GHZ 360FCCBGA
Packaging: Tray
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 360-FCCBGA (25x25)
Voltage - I/O: 1.5V, 1.8V, 2.5V
Core Processor: PowerPC G4
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.7GHz
Mounting Type: Surface Mount
Package / Case: 360-CBGA, FCCBGA
Description: IC MPU MPC74XX 1.7GHZ 360FCCBGA
Packaging: Tray
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 360-FCCBGA (25x25)
Voltage - I/O: 1.5V, 1.8V, 2.5V
Core Processor: PowerPC G4
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.7GHz
Mounting Type: Surface Mount
Package / Case: 360-CBGA, FCCBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC7448VU1600LD |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 1.6GHZ 360FCCBGA
Packaging: Tray
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 360-FCCBGA (25x25)
Voltage - I/O: 1.5V, 1.8V, 2.5V
Core Processor: PowerPC G4
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.6GHz
Mounting Type: Surface Mount
Package / Case: 360-CBGA, FCCBGA
Description: IC MPU MPC74XX 1.6GHZ 360FCCBGA
Packaging: Tray
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 360-FCCBGA (25x25)
Voltage - I/O: 1.5V, 1.8V, 2.5V
Core Processor: PowerPC G4
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.6GHz
Mounting Type: Surface Mount
Package / Case: 360-CBGA, FCCBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC7448VU1000LD |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 1.0GHZ 360FCCBGA
Voltage - I/O: 1.5V, 1.8V, 2.5V
Core Processor: PowerPC G4
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 360-CBGA, FCCBGA
Packaging: Tray
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 360-FCCBGA (25x25)
Description: IC MPU MPC74XX 1.0GHZ 360FCCBGA
Voltage - I/O: 1.5V, 1.8V, 2.5V
Core Processor: PowerPC G4
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 360-CBGA, FCCBGA
Packaging: Tray
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 360-FCCBGA (25x25)
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MC7448VS1400ND |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 1.4GHZ 360FCCLGA
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 360-FCCLGA (25x25)
Voltage - I/O: 1.5V, 1.8V, 2.5V
Core Processor: PowerPC G4
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.4GHz
Mounting Type: Surface Mount
Package / Case: 360-CLGA, FCCLGA
Packaging: Tray
Description: IC MPU MPC74XX 1.4GHZ 360FCCLGA
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 360-FCCLGA (25x25)
Voltage - I/O: 1.5V, 1.8V, 2.5V
Core Processor: PowerPC G4
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.4GHz
Mounting Type: Surface Mount
Package / Case: 360-CLGA, FCCLGA
Packaging: Tray
Produkt ist nicht verfügbar
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| MC7448HX1000ND |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 1.0GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Description: IC MPU MPC74XX 1.0GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
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| MIMXRT1181JVP2B |
Produkt ist nicht verfügbar
Mindestbestellmenge: 240 Stücke
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| MIMXRT1182JVP2B |
Produkt ist nicht verfügbar
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| MFS2633AMBA0ADR2 |
|
Hersteller: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Current - Supply: 29µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Current - Supply: 29µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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