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MKE17Z512VLL9 MKE17Z512VLL9 NXP USA Inc. KE1xZP100M96SF0.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
auf Bestellung 398 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.22 EUR
10+6.65 EUR
25+6.43 EUR
100+6.25 EUR
Mindestbestellmenge: 3
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MCF52258VN80 MCF52258VN80 NXP USA Inc. MCF52259.pdf Description: IC MCU 32B 512KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Number of I/O: 96
DigiKey Programmable: Not Verified
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
1+29.34 EUR
10+23.5 EUR
25+22.04 EUR
100+21.88 EUR
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PCA9958HNY PCA9958HNY NXP USA Inc. PCA9958.pdf Description: PCA9958HNY
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 24
Frequency: 31.25kHz
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: General Purpose
Current - Output / Channel: 63mA
Internal Switch(s): No
Topology: Constant Current
Supplier Device Package: 40-HVQFN (6x6)
Dimming: PWM, SPI
Voltage - Supply (Min): 2.7V
Voltage - Supply (Max): 5.5V
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
4000+2.21 EUR
Mindestbestellmenge: 4000
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74LVT126DB,118 74LVT126DB,118 NXP USA Inc. 74LVT126.pdf Description: IC BUFF TRI-ST QD N-INV 14SSOP
Packaging: Bulk
auf Bestellung 18000 Stücke:
Lieferzeit 10-14 Tag (e)
1448+0.34 EUR
Mindestbestellmenge: 1448
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74LVT16373ADGG,518 74LVT16373ADGG,518 NXP USA Inc. PHGLS16242-1.pdf?t.download=true&u=5oefqw Description: BUS DRIVER
Packaging: Bulk
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Independent Circuits: 2
Current - Output High, Low: 32mA, 64mA
Delay Time - Propagation: 2.1ns
Supplier Device Package: 48-TSSOP
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
807+0.61 EUR
Mindestbestellmenge: 807
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S9S12XS64J1VAE S9S12XS64J1VAE NXP USA Inc. MC9S12XS256RMV1.pdf Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3DH2301DUD/00Z NXP USA Inc. MF3D_H_X3_SDS.pdf Description: MF3DH2301DUD
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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BY459X-1500,127 BY459X-1500,127 NXP USA Inc. BY459X-1500%28S%29.pdf Description: DIODE STANDARD 1500V 12A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 350 ns
Technology: Standard
Current - Average Rectified (Io): 12A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 1500 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 6.5 A
Current - Reverse Leakage @ Vr: 250 µA @ 1300 V
Produkt ist nicht verfügbar
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BY459X-1500S,127 BY459X-1500S,127 NXP USA Inc. BY459X-1500%28S%29.pdf Description: DIODE STANDARD 1500V 10A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 220 ns
Technology: Standard
Current - Average Rectified (Io): 10A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 1500 V
Voltage - Forward (Vf) (Max) @ If: 1.35 V @ 6.5 A
Current - Reverse Leakage @ Vr: 250 µA @ 1300 V
Produkt ist nicht verfügbar
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FS32K148UGT0VLQR FS32K148UGT0VLQR NXP USA Inc. S32K1xx.pdf Description: S32K148 ARM CORTEX-M4F, 112 MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
Produkt ist nicht verfügbar
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SVF312R3K2CKU2 SVF312R3K2CKU2 NXP USA Inc. VYBRIDRSERIESEC.pdf Description: IC MPU VYBRID 266MHZ 176HLQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Produkt ist nicht verfügbar
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SVF321R3K2CKU2 SVF321R3K2CKU2 NXP USA Inc. VYBRIDRSERIESEC.pdf Description: IC MPU VYBRID 133MHZ 176HLQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: No
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Produkt ist nicht verfügbar
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MVF50NS151CMK40 MVF50NS151CMK40 NXP USA Inc. VYBRIDFSERIESEC.pdf Description: IC MPU VYBRID 400MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
Produkt ist nicht verfügbar
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MVF30NN151CKU26 MVF30NN151CKU26 NXP USA Inc. VYBRIDFSERIESEC.pdf Description: IC MPU VYBRID 266MHZ 176HLQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)
1+55.12 EUR
10+44.82 EUR
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SVF332R3K1CKU2 SVF332R3K1CKU2 NXP USA Inc. VF3xxR%2C_VF5xxR_WEB.pdf Description: IC MPU VYBRID 133MHZ 176HLQFP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
auf Bestellung 40 Stücke:
Lieferzeit 10-14 Tag (e)
10+50.97 EUR
Mindestbestellmenge: 10
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SVF332R3K1CKU2 SVF332R3K1CKU2 NXP USA Inc. VF3xxR%2C_VF5xxR_WEB.pdf Description: IC MPU VYBRID 133MHZ 176HLQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Produkt ist nicht verfügbar
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BGS8U5X BGS8U5X NXP USA Inc. RFSAS20EDRM.pdf Description: IC AMP CELL 3.4GHZ-3.8GHZ 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: Cellular, LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 15.5dB
Current - Supply: 4.5mA
Noise Figure: 1dB
P1dB: 11dBm
Supplier Device Package: 6-XSON (1.1x0.7)
Produkt ist nicht verfügbar
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74LVT273DB,118 74LVT273DB,118 NXP USA Inc. 74LVT273.pdf Description: IC FF D-TYPE SNGL 8BIT 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Current - Quiescent (Iq): 190 µA
Current - Output High, Low: 32mA, 64mA
Trigger Type: Positive Edge
Clock Frequency: 150 MHz
Input Capacitance: 4 pF
Supplier Device Package: 20-SSOP
Max Propagation Delay @ V, Max CL: 5.5ns @ 3.3V, 50pF
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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MC33PF8100EQES MC33PF8100EQES NXP USA Inc. PF8100_PF8200.pdf Description: IC POWER MANAGEMENT I.MX8QM
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
auf Bestellung 278 Stücke:
Lieferzeit 10-14 Tag (e)
2+15.4 EUR
10+12.02 EUR
25+11.18 EUR
100+10.25 EUR
260+9.79 EUR
Mindestbestellmenge: 2
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BUK7E2R7-30B,127 BUK7E2R7-30B,127 NXP USA Inc. BUK7E2R7-30B.pdf Description: MOSFET N-CH 30V 75A I2PAK
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 2.7mOhm @ 25A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 91 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6212 pF @ 25 V
Produkt ist nicht verfügbar
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BUK663R5-55C,118 NXP USA Inc. BUK663R5-55C.pdf Description: MOSFET N-CH 55V 120A D2PAK
Packaging: Bulk
auf Bestellung 1589 Stücke:
Lieferzeit 10-14 Tag (e)
417+1.18 EUR
Mindestbestellmenge: 417
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MKL24Z32VLH4 MKL24Z32VLH4 NXP USA Inc. KL24P80M48SF0.pdf Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCF51AC256BCLKE MCF51AC256BCLKE NXP USA Inc. MCF51AC256.pdf Description: IC MCU 32BIT 256KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 69
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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OM6733J NXP USA Inc. Description: DUMMY MODULE
Packaging: Bulk
Produkt ist nicht verfügbar
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OM6736/NXD61P-FJAJ NXP USA Inc. Description: 6-PIN DIF MODULE NXD6.1
Packaging: Bulk
Produkt ist nicht verfügbar
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MC34825EPR2 MC34825EPR2 NXP USA Inc. PHGL-S-A0002259932-1.pdf?t.download=true&u=5oefqw Description: MICRO-USB INTERFACE IC, UNIVERSA
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 4600 Stücke:
Lieferzeit 10-14 Tag (e)
124+3.66 EUR
Mindestbestellmenge: 124
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S9S12G240F0MLL S9S12G240F0MLL NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 240KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 240KB (240K x 8)
RAM Size: 11K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 86
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PNEV5190MB PNEV5190MB NXP USA Inc. RM00264.pdf Description: EVAL BOARD FOR PN5190
Packaging: Bulk
Type: Near Field Communication (NFC)
Contents: Board(s)
Utilized IC / Part: PN5190
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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MCIMX6Z0DVM09ABR MCIMX6Z0DVM09ABR NXP USA Inc. IMX6ULZCEC.pdf Description: I.MX6ULZ, 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 289-MAPBGA (14x14)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: eCSPI, ESAI, I2C, MMC/SD/SDIO, SAI, SPI, UART, USB
Produkt ist nicht verfügbar
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SA56004ETK,118 SA56004ETK,118 NXP USA Inc. SA56004X.pdf Description: SENSOR DIGITAL -40C-125C 8HVSON
Features: Output Switch, Programmable Limit
Packaging: Bulk
Package / Case: 8-VDFN Exposed Pad
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 10 b
Supplier Device Package: 8-HVSON (3x3)
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -40°C ~ 125°C
Sensing Temperature - Remote: -40°C ~ 125°C
auf Bestellung 1710 Stücke:
Lieferzeit 10-14 Tag (e)
520+0.94 EUR
Mindestbestellmenge: 520
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A3V07H600-2STG NXP USA Inc. Description: RF REFERENCE CIRCUIT 600W 758-80
Packaging: Bulk
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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PDTA143XM,315 PDTA143XM,315 NXP USA Inc. PDTA143X_SER.pdf Description: TRANS PREBIAS PNP 250MW SOT883
Packaging: Bulk
auf Bestellung 20000 Stücke:
Lieferzeit 10-14 Tag (e)
9713+0.049 EUR
Mindestbestellmenge: 9713
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MK10DX64VMC7 MK10DX64VMC7 NXP USA Inc. K10P100M72SF1.pdf Description: IC MCU 32BIT 64KB FLSH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 39x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 74
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA8546BTT/AY NXP USA Inc. Description: 4 X 44 AUTOMOTIVE LCD DRIVER
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: SPI
Configuration: 176 Segment
Operating Temperature: -40°C ~ 95°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 11 Characters, 22 Characters, 176 Elements
Supplier Device Package: 56-TSSOP
Grade: Automotive
Current - Supply: 30 µA
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MIMX8QM6AVUFFABR MIMX8QM6AVUFFABR NXP USA Inc. IMX8QMAEC.pdf Description: I.MX 8QUADMAX
Packaging: Tape & Reel (TR)
Package / Case: 1313-BFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz, 1.2GHz, 264MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1313-BGA (29x29)
Ethernet: 1Gbps (2)
USB: USB 2.0 + HSIC (1), USB 2.0 + PHY (1), USB 3.0 + PHY (1)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: DP, eDP, HDMI, LVDS, MIPI-CSI, MIPI-DSI
Security Features: A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS
Additional Interfaces: CANbus, I2C, SPI, UART
Produkt ist nicht verfügbar
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BUK9507-30B,127 NXP USA Inc. Description: MOSFET N-CH 30V 75A TO220AB
Packaging: Tube
auf Bestellung 11973 Stücke:
Lieferzeit 10-14 Tag (e)
761+0.63 EUR
Mindestbestellmenge: 761
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MFS2320BMMA0EPR2 NXP USA Inc. FS23_SBC.pdf Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MFS2320BMMA0EP NXP USA Inc. FS23_SBC.pdf Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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74AHCT08D,112 74AHCT08D,112 NXP USA Inc. 74AHC_AHCT08.pdf Description: IC GATE AND 4CH 2-INP 14-SO
Packaging: Bulk
auf Bestellung 23129 Stücke:
Lieferzeit 10-14 Tag (e)
2674+0.18 EUR
Mindestbestellmenge: 2674
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MC33VR5500V1ES MC33VR5500V1ES NXP USA Inc. VR5500.pdf Description: VR5500
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Switching Regulator
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
auf Bestellung 240 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.13 EUR
10+9.36 EUR
25+8.68 EUR
100+7.92 EUR
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MPC855TVR50D4 MPC855TVR50D4 NXP USA Inc. FSCL-S-A0001125202-1.pdf?t.download=true&u=5oefqw Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
auf Bestellung 11039 Stücke:
Lieferzeit 10-14 Tag (e)
3+210.53 EUR
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MPC855TCVR50D4-NXP NXP USA Inc. Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
auf Bestellung 1758 Stücke:
Lieferzeit 10-14 Tag (e)
3+210.53 EUR
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MPC875VR66 MPC875VR66 NXP USA Inc. MPC875EC.pdf Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
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MPC860TVR66D4 MPC860TVR66D4 NXP USA Inc. FSCL-S-A0001125202-1.pdf?t.download=true&u=5oefqw Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
auf Bestellung 91 Stücke:
Lieferzeit 10-14 Tag (e)
2+315.84 EUR
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MPC860DPVR66D4 MPC860DPVR66D4 NXP USA Inc. MPC860EC.pdf Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
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MPC860DTVR66D4 MPC860DTVR66D4 NXP USA Inc. MPC860EC.pdf Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
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MPC860ENVR66D4 MPC860ENVR66D4 NXP USA Inc. MPC860EC.pdf Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
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MPC860PCVR66D4 MPC860PCVR66D4 NXP USA Inc. MPC860EC.pdf Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
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MPC860PVR66D4 MPC860PVR66D4 NXP USA Inc. MPC860EC.pdf Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
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MPC860SRCVR66D4 MPC860SRCVR66D4 NXP USA Inc. MPC860EC.pdf Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
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TDA8035HN/C1/S1EL TDA8035HN/C1/S1EL NXP USA Inc. TDA8035.pdf Description: IC INTFACE SPECIALIZED 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 32-HVQFN (5x5)
Produkt ist nicht verfügbar
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UJA1075ATW/5V0/WDJ UJA1075ATW/5V0/WDJ NXP USA Inc. UJA1075A.pdf Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 4.5V ~ 28V
Supplier Device Package: 32-HTSSOP
Grade: Automotive
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
2000+4.12 EUR
Mindestbestellmenge: 2000
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UJA1075ATW/5V0/WDJ UJA1075ATW/5V0/WDJ NXP USA Inc. UJA1075A.pdf Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Cut Tape (CT)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 4.5V ~ 28V
Supplier Device Package: 32-HTSSOP
Grade: Automotive
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.39 EUR
10+5.62 EUR
25+5.18 EUR
100+4.7 EUR
250+4.46 EUR
500+4.33 EUR
1000+4.21 EUR
Mindestbestellmenge: 3
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MRFE6S9060GNR1 MRFE6S9060GNR1 NXP USA Inc. Description: RF MOSFET LDMOS 28V TO270-4
Packaging: Tape & Reel (TR)
Package / Case: TO-270BB
Mounting Type: Surface Mount
Frequency: 880MHz
Power - Output: 14W
Gain: 21.1dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4 Gull
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 450 mA
Produkt ist nicht verfügbar
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MRFE6S9200HR3 MRFE6S9200HR3 NXP USA Inc. MRFE6S9200H.pdf Description: RF MOSFET LDMOS 28V NI880H
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 880MHz
Power - Output: 58W
Gain: 21dB
Technology: LDMOS
Supplier Device Package: NI-880H-2L
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 1.4 A
Produkt ist nicht verfügbar
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S9S12ZVL32AWLF NXP USA Inc. S12ZVLFS.pdf?fsrch=1&sr=1&pageNum=1 Description: S12Z CPU, 32K FLASH
Packaging: Tray
Produkt ist nicht verfügbar
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UJA1132AHW/5F0/0Y NXP USA Inc. UJA113X_SER.pdf Description: UJA1132AHW/5F0/0Y
Packaging: Bulk
Produkt ist nicht verfügbar
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UJA1131AHW/5F4/0Y NXP USA Inc. UJA113X_SER.pdf Description: UJA1131AHW/5F4/0Y
Packaging: Bulk
Produkt ist nicht verfügbar
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UJA1131AHW/3F4/0Y NXP USA Inc. UJA113X_SER.pdf Description: UJA1131AHW/3F4/0Y
Packaging: Bulk
Produkt ist nicht verfügbar
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MC33FS6505KAE MC33FS6505KAE NXP USA Inc. 35FS4500-35FS6500-ASILB.pdf Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MKE17Z512VLL9 KE1xZP100M96SF0.pdf
MKE17Z512VLL9
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
auf Bestellung 398 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+8.22 EUR
10+6.65 EUR
25+6.43 EUR
100+6.25 EUR
Mindestbestellmenge: 3
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MCF52258VN80 MCF52259.pdf
MCF52258VN80
Hersteller: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Number of I/O: 96
DigiKey Programmable: Not Verified
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+29.34 EUR
10+23.5 EUR
25+22.04 EUR
100+21.88 EUR
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PCA9958HNY PCA9958.pdf
PCA9958HNY
Hersteller: NXP USA Inc.
Description: PCA9958HNY
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 24
Frequency: 31.25kHz
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: General Purpose
Current - Output / Channel: 63mA
Internal Switch(s): No
Topology: Constant Current
Supplier Device Package: 40-HVQFN (6x6)
Dimming: PWM, SPI
Voltage - Supply (Min): 2.7V
Voltage - Supply (Max): 5.5V
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4000+2.21 EUR
Mindestbestellmenge: 4000
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74LVT126DB,118 74LVT126.pdf
74LVT126DB,118
Hersteller: NXP USA Inc.
Description: IC BUFF TRI-ST QD N-INV 14SSOP
Packaging: Bulk
auf Bestellung 18000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1448+0.34 EUR
Mindestbestellmenge: 1448
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74LVT16373ADGG,518 PHGLS16242-1.pdf?t.download=true&u=5oefqw
74LVT16373ADGG,518
Hersteller: NXP USA Inc.
Description: BUS DRIVER
Packaging: Bulk
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Independent Circuits: 2
Current - Output High, Low: 32mA, 64mA
Delay Time - Propagation: 2.1ns
Supplier Device Package: 48-TSSOP
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
807+0.61 EUR
Mindestbestellmenge: 807
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S9S12XS64J1VAE MC9S12XS256RMV1.pdf
S9S12XS64J1VAE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MF3DH2301DUD/00Z MF3D_H_X3_SDS.pdf
Hersteller: NXP USA Inc.
Description: MF3DH2301DUD
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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BY459X-1500,127 BY459X-1500%28S%29.pdf
BY459X-1500,127
Hersteller: NXP USA Inc.
Description: DIODE STANDARD 1500V 12A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 350 ns
Technology: Standard
Current - Average Rectified (Io): 12A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 1500 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 6.5 A
Current - Reverse Leakage @ Vr: 250 µA @ 1300 V
Produkt ist nicht verfügbar
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BY459X-1500S,127 BY459X-1500%28S%29.pdf
BY459X-1500S,127
Hersteller: NXP USA Inc.
Description: DIODE STANDARD 1500V 10A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 220 ns
Technology: Standard
Current - Average Rectified (Io): 10A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 1500 V
Voltage - Forward (Vf) (Max) @ If: 1.35 V @ 6.5 A
Current - Reverse Leakage @ Vr: 250 µA @ 1300 V
Produkt ist nicht verfügbar
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FS32K148UGT0VLQR S32K1xx.pdf
FS32K148UGT0VLQR
Hersteller: NXP USA Inc.
Description: S32K148 ARM CORTEX-M4F, 112 MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
Produkt ist nicht verfügbar
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SVF312R3K2CKU2 VYBRIDRSERIESEC.pdf
SVF312R3K2CKU2
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 266MHZ 176HLQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Produkt ist nicht verfügbar
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SVF321R3K2CKU2 VYBRIDRSERIESEC.pdf
SVF321R3K2CKU2
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 133MHZ 176HLQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: No
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Produkt ist nicht verfügbar
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MVF50NS151CMK40 VYBRIDFSERIESEC.pdf
MVF50NS151CMK40
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 400MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
Produkt ist nicht verfügbar
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MVF30NN151CKU26 VYBRIDFSERIESEC.pdf
MVF30NN151CKU26
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 266MHZ 176HLQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+55.12 EUR
10+44.82 EUR
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SVF332R3K1CKU2 VF3xxR%2C_VF5xxR_WEB.pdf
SVF332R3K1CKU2
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 133MHZ 176HLQFP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
auf Bestellung 40 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
10+50.97 EUR
Mindestbestellmenge: 10
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SVF332R3K1CKU2 VF3xxR%2C_VF5xxR_WEB.pdf
SVF332R3K1CKU2
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 133MHZ 176HLQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Produkt ist nicht verfügbar
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BGS8U5X RFSAS20EDRM.pdf
BGS8U5X
Hersteller: NXP USA Inc.
Description: IC AMP CELL 3.4GHZ-3.8GHZ 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: Cellular, LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 15.5dB
Current - Supply: 4.5mA
Noise Figure: 1dB
P1dB: 11dBm
Supplier Device Package: 6-XSON (1.1x0.7)
Produkt ist nicht verfügbar
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74LVT273DB,118 74LVT273.pdf
74LVT273DB,118
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Current - Quiescent (Iq): 190 µA
Current - Output High, Low: 32mA, 64mA
Trigger Type: Positive Edge
Clock Frequency: 150 MHz
Input Capacitance: 4 pF
Supplier Device Package: 20-SSOP
Max Propagation Delay @ V, Max CL: 5.5ns @ 3.3V, 50pF
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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MC33PF8100EQES PF8100_PF8200.pdf
MC33PF8100EQES
Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT I.MX8QM
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
auf Bestellung 278 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+15.4 EUR
10+12.02 EUR
25+11.18 EUR
100+10.25 EUR
260+9.79 EUR
Mindestbestellmenge: 2
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BUK7E2R7-30B,127 BUK7E2R7-30B.pdf
BUK7E2R7-30B,127
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 75A I2PAK
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 2.7mOhm @ 25A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 91 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6212 pF @ 25 V
Produkt ist nicht verfügbar
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BUK663R5-55C,118 BUK663R5-55C.pdf
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 55V 120A D2PAK
Packaging: Bulk
auf Bestellung 1589 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
417+1.18 EUR
Mindestbestellmenge: 417
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MKL24Z32VLH4 KL24P80M48SF0.pdf
MKL24Z32VLH4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCF51AC256BCLKE MCF51AC256.pdf
MCF51AC256BCLKE
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 69
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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OM6733J
Hersteller: NXP USA Inc.
Description: DUMMY MODULE
Packaging: Bulk
Produkt ist nicht verfügbar
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OM6736/NXD61P-FJAJ
Hersteller: NXP USA Inc.
Description: 6-PIN DIF MODULE NXD6.1
Packaging: Bulk
Produkt ist nicht verfügbar
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MC34825EPR2 PHGL-S-A0002259932-1.pdf?t.download=true&u=5oefqw
MC34825EPR2
Hersteller: NXP USA Inc.
Description: MICRO-USB INTERFACE IC, UNIVERSA
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 4600 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
124+3.66 EUR
Mindestbestellmenge: 124
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S9S12G240F0MLL MC9S12GRMV1.pdf
S9S12G240F0MLL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 240KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 240KB (240K x 8)
RAM Size: 11K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 86
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PNEV5190MB RM00264.pdf
PNEV5190MB
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR PN5190
Packaging: Bulk
Type: Near Field Communication (NFC)
Contents: Board(s)
Utilized IC / Part: PN5190
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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MCIMX6Z0DVM09ABR IMX6ULZCEC.pdf
MCIMX6Z0DVM09ABR
Hersteller: NXP USA Inc.
Description: I.MX6ULZ, 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 289-MAPBGA (14x14)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: eCSPI, ESAI, I2C, MMC/SD/SDIO, SAI, SPI, UART, USB
Produkt ist nicht verfügbar
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SA56004ETK,118 SA56004X.pdf
SA56004ETK,118
Hersteller: NXP USA Inc.
Description: SENSOR DIGITAL -40C-125C 8HVSON
Features: Output Switch, Programmable Limit
Packaging: Bulk
Package / Case: 8-VDFN Exposed Pad
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 10 b
Supplier Device Package: 8-HVSON (3x3)
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -40°C ~ 125°C
Sensing Temperature - Remote: -40°C ~ 125°C
auf Bestellung 1710 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
520+0.94 EUR
Mindestbestellmenge: 520
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A3V07H600-2STG
Hersteller: NXP USA Inc.
Description: RF REFERENCE CIRCUIT 600W 758-80
Packaging: Bulk
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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PDTA143XM,315 PDTA143X_SER.pdf
PDTA143XM,315
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 250MW SOT883
Packaging: Bulk
auf Bestellung 20000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
9713+0.049 EUR
Mindestbestellmenge: 9713
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MK10DX64VMC7 K10P100M72SF1.pdf
MK10DX64VMC7
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLSH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 39x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 74
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA8546BTT/AY
Hersteller: NXP USA Inc.
Description: 4 X 44 AUTOMOTIVE LCD DRIVER
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: SPI
Configuration: 176 Segment
Operating Temperature: -40°C ~ 95°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 11 Characters, 22 Characters, 176 Elements
Supplier Device Package: 56-TSSOP
Grade: Automotive
Current - Supply: 30 µA
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MIMX8QM6AVUFFABR IMX8QMAEC.pdf
MIMX8QM6AVUFFABR
Hersteller: NXP USA Inc.
Description: I.MX 8QUADMAX
Packaging: Tape & Reel (TR)
Package / Case: 1313-BFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz, 1.2GHz, 264MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1313-BGA (29x29)
Ethernet: 1Gbps (2)
USB: USB 2.0 + HSIC (1), USB 2.0 + PHY (1), USB 3.0 + PHY (1)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: DP, eDP, HDMI, LVDS, MIPI-CSI, MIPI-DSI
Security Features: A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS
Additional Interfaces: CANbus, I2C, SPI, UART
Produkt ist nicht verfügbar
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BUK9507-30B,127
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 75A TO220AB
Packaging: Tube
auf Bestellung 11973 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
761+0.63 EUR
Mindestbestellmenge: 761
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MFS2320BMMA0EPR2 FS23_SBC.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MFS2320BMMA0EP FS23_SBC.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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74AHCT08D,112 74AHC_AHCT08.pdf
74AHCT08D,112
Hersteller: NXP USA Inc.
Description: IC GATE AND 4CH 2-INP 14-SO
Packaging: Bulk
auf Bestellung 23129 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2674+0.18 EUR
Mindestbestellmenge: 2674
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MC33VR5500V1ES VR5500.pdf
MC33VR5500V1ES
Hersteller: NXP USA Inc.
Description: VR5500
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Switching Regulator
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
auf Bestellung 240 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+12.13 EUR
10+9.36 EUR
25+8.68 EUR
100+7.92 EUR
Mindestbestellmenge: 2
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MPC855TVR50D4 FSCL-S-A0001125202-1.pdf?t.download=true&u=5oefqw
MPC855TVR50D4
Hersteller: NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
auf Bestellung 11039 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+210.53 EUR
Mindestbestellmenge: 3
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MPC855TCVR50D4-NXP
Hersteller: NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
auf Bestellung 1758 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+210.53 EUR
Mindestbestellmenge: 3
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MPC875VR66 MPC875EC.pdf
MPC875VR66
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
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MPC860TVR66D4 FSCL-S-A0001125202-1.pdf?t.download=true&u=5oefqw
MPC860TVR66D4
Hersteller: NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
auf Bestellung 91 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+315.84 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
MPC860DPVR66D4 MPC860EC.pdf
MPC860DPVR66D4
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
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MPC860DTVR66D4 MPC860EC.pdf
MPC860DTVR66D4
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
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MPC860ENVR66D4 MPC860EC.pdf
MPC860ENVR66D4
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
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MPC860PCVR66D4 MPC860EC.pdf
MPC860PCVR66D4
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MPC860PVR66D4 MPC860EC.pdf
MPC860PVR66D4
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
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MPC860SRCVR66D4 MPC860EC.pdf
MPC860SRCVR66D4
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
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TDA8035HN/C1/S1EL TDA8035.pdf
TDA8035HN/C1/S1EL
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 32-HVQFN (5x5)
Produkt ist nicht verfügbar
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UJA1075ATW/5V0/WDJ UJA1075A.pdf
UJA1075ATW/5V0/WDJ
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 4.5V ~ 28V
Supplier Device Package: 32-HTSSOP
Grade: Automotive
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2000+4.12 EUR
Mindestbestellmenge: 2000
Im Einkaufswagen  Stück im Wert von  UAH
UJA1075ATW/5V0/WDJ UJA1075A.pdf
UJA1075ATW/5V0/WDJ
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Cut Tape (CT)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 4.5V ~ 28V
Supplier Device Package: 32-HTSSOP
Grade: Automotive
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.39 EUR
10+5.62 EUR
25+5.18 EUR
100+4.7 EUR
250+4.46 EUR
500+4.33 EUR
1000+4.21 EUR
Mindestbestellmenge: 3
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MRFE6S9060GNR1
MRFE6S9060GNR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-4
Packaging: Tape & Reel (TR)
Package / Case: TO-270BB
Mounting Type: Surface Mount
Frequency: 880MHz
Power - Output: 14W
Gain: 21.1dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4 Gull
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 450 mA
Produkt ist nicht verfügbar
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MRFE6S9200HR3 MRFE6S9200H.pdf
MRFE6S9200HR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI880H
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 880MHz
Power - Output: 58W
Gain: 21dB
Technology: LDMOS
Supplier Device Package: NI-880H-2L
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 1.4 A
Produkt ist nicht verfügbar
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S9S12ZVL32AWLF S12ZVLFS.pdf?fsrch=1&sr=1&pageNum=1
Hersteller: NXP USA Inc.
Description: S12Z CPU, 32K FLASH
Packaging: Tray
Produkt ist nicht verfügbar
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UJA1132AHW/5F0/0Y UJA113X_SER.pdf
Hersteller: NXP USA Inc.
Description: UJA1132AHW/5F0/0Y
Packaging: Bulk
Produkt ist nicht verfügbar
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UJA1131AHW/5F4/0Y UJA113X_SER.pdf
Hersteller: NXP USA Inc.
Description: UJA1131AHW/5F4/0Y
Packaging: Bulk
Produkt ist nicht verfügbar
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UJA1131AHW/3F4/0Y UJA113X_SER.pdf
Hersteller: NXP USA Inc.
Description: UJA1131AHW/3F4/0Y
Packaging: Bulk
Produkt ist nicht verfügbar
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MC33FS6505KAE 35FS4500-35FS6500-ASILB.pdf
MC33FS6505KAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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