Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36597) > Seite 550 nach 610
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S32K310NHT0VLFST | NXP USA Inc. |
 Description: S32K310NHT0VLFSTPackaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 112K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 48-LQFP (7x7) Grade: Automotive Number of I/O: 42 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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S32K311NHT0VPASR | NXP USA Inc. |
Description: S32K311NHT0VPASR Packaging: Tape & Reel (TR) Package / Case: 100-QFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 100-MaxQFP (10x10) Grade: Automotive Number of I/O: 84 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 600 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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S32K311NHT0MPAIR | NXP USA Inc. |
Description: S32K311NHT0MPAIR Packaging: Bulk Package / Case: 100-QFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 100-MaxQFP (10x10) Grade: Automotive Number of I/O: 84 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 600 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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S32K312NHT0MPAIR | NXP USA Inc. |
Description: S32K312NHT0MPAIR Packaging: Tape & Reel (TR) Package / Case: 100-QFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 2MB (2M x 8) RAM Size: 192K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 100-MaxQFP (10x10) Grade: Automotive Number of I/O: 84 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 600 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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S32K312NHT0MPASR | NXP USA Inc. |
Description: S32K312NHT0MPASR Packaging: Tape & Reel (TR) Package / Case: 100-QFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 2MB (2M x 8) RAM Size: 192K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 100-MaxQFP (10x10) Grade: Automotive Number of I/O: 84 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 600 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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S32K394EHT1MJBSR | NXP USA Inc. |
Description: S32K394EHT1MJBSR Packaging: Tape & Reel (TR) Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 320MHz Program Memory Size: 4MB (4M x 8) RAM Size: 800K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 69x12b SAR, Sigma-Delta Core Size: 32-Bit Quad-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 289-LFBGA (14x14) Grade: Automotive Number of I/O: 209 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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S32K394NHT1MJBST | NXP USA Inc. |
Description: S32K394NHT1MJBST Qualification: AEC-Q100 Number of I/O: 209 Grade: Automotive Supplier Device Package: 289-LFBGA (14x14) Peripherals: DMA, I2S, WDT Connectivity: CANbus, I2C, QSPI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Quad-Core Data Converters: A/D 69x12b SAR, Sigma-Delta Core Processor: ARM® Cortex®-M7 EEPROM Size: 128K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 800K x 8 Program Memory Size: 4MB (4M x 8) Speed: 320MHz Mounting Type: Surface Mount Package / Case: 289-LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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S32K394EHT1MJBST | NXP USA Inc. |
Description: S32K394EHT1MJBST Qualification: AEC-Q100 Number of I/O: 209 Grade: Automotive Supplier Device Package: 289-LFBGA (14x14) Peripherals: DMA, I2S, WDT Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Quad-Core Data Converters: A/D 69x12b SAR, Sigma-Delta Core Processor: ARM® Cortex®-M7 EEPROM Size: 128K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 800K x 8 Program Memory Size: 4MB (4M x 8) Speed: 320MHz Mounting Type: Surface Mount Package / Case: 289-LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 152 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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S32K396NHT1MJBST | NXP USA Inc. |
Description: S32K396NHT1MJBST Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 320MHz Program Memory Size: 6MB (6M x 8) RAM Size: 800K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 69x12b SAR, Sigma-Delta Core Size: 32-Bit Quad-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, QSPI, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 289-LFBGA (14x14) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| S32K396NHT1MKUSR | NXP USA Inc. |
Description: S32K396NHT1MKUSR Packaging: Tape & Reel (TR) Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 320MHz Program Memory Size: 6MB (6M x 8) RAM Size: 800K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 12b SAR, Sigma-Delta Core Size: 32-Bit Quad-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, QSPI, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 176-LQFP (24x24) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| S32K396EHT1MKUSR | NXP USA Inc. |
Description: S32K396EHT1MKUSR Packaging: Tape & Reel (TR) Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 320MHz Program Memory Size: 6MB (6M x 8) RAM Size: 800K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 12b SAR, Sigma-Delta Core Size: 32-Bit Quad-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 176-LQFP (24x24) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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S32K396NHT1MKUST | NXP USA Inc. |
Description: S32K396NHT1MKUST Packaging: Tray Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 320MHz Program Memory Size: 6MB (6M x 8) RAM Size: 800K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 69x12b SAR, Sigma-Delta Core Size: 32-Bit Quad-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, QSPI, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 176-HLQFP (24x24) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 200 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| S32X-MB | NXP USA Inc. |
Description: S32X-MB Packaging: Bulk Function: I/O Expansion Type: Interface Contents: Board(s) Utilized IC / Part: S32K37, S32K39 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| S32K396BMS-EVB | NXP USA Inc. |
Description: S32K396BMS-EVB Packaging: Bulk |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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| S32K396-BGA-DC1 | NXP USA Inc. |
Description: S32K396-BGA-DC1 Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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AFV10700HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI780 Packaging: Bulk Package / Case: NI-780-4 Current Rating (Amps): 1µA Mounting Type: Chassis Mount Frequency: 1.03GHz ~ 1.09GHz Configuration: Dual Power - Output: 770W Gain: 19.2dB Technology: LDMOS Supplier Device Package: NI-780-4 Voltage - Rated: 105 V Voltage - Test: 50 V Current - Test: 100 mA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 50 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MCIMX6S4AVM08AB | NXP USA Inc. |
Description: IC MPU I.MX6S 800MHZ 624MAPBGA Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Display & Interface Controllers: Keypad, LCD Graphics Acceleration: Yes RAM Controllers: LPDDR2, LVDDR3, DDR3 Co-Processors/DSP: Multimedia; NEON™ SIMD Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (4) Ethernet: 10/100/1000Mbps (1) Supplier Device Package: 624-MAPBGA (21x21) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Core Processor: ARM® Cortex®-A9 Operating Temperature: -40°C ~ 125°C (TJ) Speed: 800MHz Mounting Type: Surface Mount Package / Case: 624-LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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SE050F2HQ1/Z018HZ | NXP USA Inc. |
Description: IC PLUG/TRUST SEC ELEM 20HX2QFN DigiKey Programmable: Not Verified Supplier Device Package: 20-HX2QFN (3x3) Type: Plug and Trust Secure Element Mounting Type: Surface Mount Package / Case: 20-XFQFN Exposed Pad Packaging: Tape & Reel (TR) |
auf Bestellung 3000 Stücke: Lieferzeit 10-14 Tag (e) |
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| PCA9481AUKZ | NXP USA Inc. |
Description: SWITCHED CAPACITOR CHARGER Packaging: Tape & Reel (TR) Package / Case: 70-UFBGA, WLCSP Number of Cells: 1 Mounting Type: Surface Mount Interface: I2C Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 70-WLCSP (4.16x2.96) Charge Current - Max: 10A Programmable Features: Timer Fault Protection: Over Temperature, Over-Under Voltage Voltage - Supply (Max): 16.5V Battery Pack Voltage: 7V (Max) Current - Charging: Constant |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 6000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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WPR1500-HVMPP | NXP USA Inc. |
Description: WPR1500-HVMPP Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| K32W042S1M2CAVAR | NXP USA Inc. |
Description: MCU KINETIS BT5/FSK/THREAD WLCSP Packaging: Tape & Reel (TR) Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 1.25MB (1.25M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 85°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D - 12bit; D/A - 12bit Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB Peripherals: Bluetooth, DMA, PWM, WDT Supplier Device Package: 191-WLCSP (5.97x5.85) Number of I/O: 104 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| K32W032S1M2VPJAT | NXP USA Inc. |
Description: MCU KINETIS BT5/FSK 176-VFBGA Packaging: Tray Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 1.25MB (1.25M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 105°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D - 12bit; D/A - 12bit Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB Peripherals: Bluetooth, DMA, PWM, WDT Supplier Device Package: 176-VFBGA Number of I/O: 104 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| MPC8343CRADDB | NXP USA Inc. |
Description: POWERQUICC II PRO PROCESSOR Packaging: Bulk Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 620-TEPBGA II (29x29) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, I2C, PCI, SPI |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC8343CVRADDB | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ 620HBGA Packaging: Tray Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 620-HBGA (29x29) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, I2C, PCI, SPI |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 36 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MPC8343EVRADDB | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ 620HBGA Packaging: Tray Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 620-HBGA (29x29) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, I2C, PCI, SPI |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 36 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MPC8343ZQADDB | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ 620HBGA Packaging: Tray Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 620-HBGA (29x29) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, I2C, PCI, SPI |
Produkt ist nicht verfügbar |
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| NTP53121G0JUAV | NXP USA Inc. |
Description: NTAG Packaging: Bulk Frequency: 13.56MHz Memory Type: Read/Write Operating Temperature: -40°C ~ 105°C Standards: ISO 15693, NFC Writable Memory: 16kb (User) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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MIMXRT106VDVL6B | NXP USA Inc. |
Description: IC MCU Packaging: Tray |
auf Bestellung 456 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT106DDVL6B | NXP USA Inc. |
Description: IC MCU Packaging: Tray |
auf Bestellung 438 Stücke: Lieferzeit 10-14 Tag (e) |
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S912XEQ512BCAA | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 80QFP Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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S912XEQ512BCAAR | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 80QFP Packaging: Tape & Reel (TR) Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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S912XEQ512J2CAL | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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S912XEQ512F1CAG | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 24x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 119 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S912XEQ512F1CAGR | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 144LQFP Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 24x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 119 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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S912XEQ512BVAL | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 112LQFP DigiKey Programmable: Not Verified Number of I/O: 91 Supplier Device Package: 112-LQFP (20x20) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 16x12b Core Processor: HCS12X EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 32K x 8 Program Memory Size: 512KB (512K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 112-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
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S912XEQ512F1VAL | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 112LQFP DigiKey Programmable: Not Verified Number of I/O: 91 Supplier Device Package: 112-LQFP (20x20) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 16x12b Core Processor: HCS12X EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 32K x 8 Program Memory Size: 512KB (512K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 112-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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S912XEQ512J3MAAR | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 80QFP DigiKey Programmable: Not Verified Number of I/O: 59 Supplier Device Package: 80-QFP (14x14) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 8x12b Core Processor: HCS12X EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 32K x 8 Program Memory Size: 512KB (512K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 80-QFP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MC908LJ24CFUER | NXP USA Inc. |
Description: IC MCU 8BIT 24KB FLASH 64QFP Packaging: Tape & Reel (TR) Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 24KB (24K x 8) RAM Size: 768 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 6x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: I2C, IRSCI, SPI Peripherals: LCD, LVD, POR, PWM Supplier Device Package: 64-QFP (14x14) Number of I/O: 40 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 750 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MFS8632BMDA0ESR2 | NXP USA Inc. |
Description: SAFETY SYSTEM BASIS CHIP FOR DOM Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 36V Applications: Camera Supplier Device Package: 48-HVQFN (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MK12DX256VLF5 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 48LQFP DigiKey Programmable: Not Verified Number of I/O: 33 Supplier Device Package: 48-LQFP (7x7) Peripherals: DMA, I2S, LVD, POR, PWM, WDT Connectivity: I2C, IrDA, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 18x16b Core Processor: ARM® Cortex®-M4 EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 32K x 8 Program Memory Size: 256KB (256K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MKV10Z16VFM7 | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 32QFN DigiKey Programmable: Not Verified Number of I/O: 28 Supplier Device Package: 32-HVQFN (5x5) Peripherals: DMA, WDT Connectivity: I2C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 16x12b; D/A 1x12b Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 8K x 8 Program Memory Size: 16KB (16K x 8) Speed: 75MHz Mounting Type: Surface Mount, Wettable Flank Package / Case: 32-VFQFN Exposed Pad Packaging: Bulk |
auf Bestellung 139 Stücke: Lieferzeit 10-14 Tag (e) |
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MKV10Z16VFM7 | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 32QFN DigiKey Programmable: Not Verified Number of I/O: 28 Supplier Device Package: 32-HVQFN (5x5) Peripherals: DMA, WDT Connectivity: I2C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 16x12b; D/A 1x12b Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 8K x 8 Program Memory Size: 16KB (16K x 8) Speed: 75MHz Mounting Type: Surface Mount, Wettable Flank Package / Case: 32-VFQFN Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MW7IC2750NBR1 | NXP USA Inc. |
Description: IC AMP WIMAX 2.3-2.7GHZ TO272WB Packaging: Tape & Reel (TR) Package / Case: TO-272-14 Variant, Flat Leads Mounting Type: Chassis Mount Frequency: 2.3GHz ~ 2.7GHz RF Type: WiMax Voltage - Supply: 28V Gain: 26dB Current - Supply: 550mA P1dB: 47dBm Test Frequency: 2.7GHz Supplier Device Package: TO-272 WB-14 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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BFU550WF | NXP USA Inc. |
Description: RF TRANS NPN 12V 11GHZ SC-70 Supplier Device Package: SC-70 Noise Figure (dB Typ @ f): 1.3dB @ 1.8GHz Frequency - Transition: 11GHz DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 8V Voltage - Collector Emitter Breakdown (Max): 12V Current - Collector (Ic) (Max): 50mA Power - Max: 450mW Gain: 12dB Operating Temperature: -40°C ~ 150°C (TJ) Transistor Type: NPN Mounting Type: Surface Mount Package / Case: SC-70, SOT-323 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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BFU550WF | NXP USA Inc. |
Description: RF TRANS NPN 12V 11GHZ SC-70 Supplier Device Package: SC-70 Noise Figure (dB Typ @ f): 1.3dB @ 1.8GHz Frequency - Transition: 11GHz DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 8V Voltage - Collector Emitter Breakdown (Max): 12V Current - Collector (Ic) (Max): 50mA Power - Max: 450mW Gain: 12dB Operating Temperature: -40°C ~ 150°C (TJ) Transistor Type: NPN Mounting Type: Surface Mount Package / Case: SC-70, SOT-323 Packaging: Cut Tape (CT) |
auf Bestellung 3000 Stücke: Lieferzeit 10-14 Tag (e) |
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BFU550WX | NXP USA Inc. |
Description: RF TRANS NPN 12V 11GHZ SC-70 Packaging: Tape & Reel (TR) Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: -40°C ~ 150°C (TJ) Gain: 18dB Power - Max: 450mW Current - Collector (Ic) (Max): 50mA Voltage - Collector Emitter Breakdown (Max): 12V DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 8V Frequency - Transition: 11GHz Noise Figure (dB Typ @ f): 0.6dB @ 900MHz Supplier Device Package: SC-70 Grade: Automotive Qualification: AEC-Q101 |
auf Bestellung 5000 Stücke: Lieferzeit 10-14 Tag (e) |
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BFU550WX | NXP USA Inc. |
Description: RF TRANS NPN 12V 11GHZ SC-70 Packaging: Cut Tape (CT) Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: -40°C ~ 150°C (TJ) Gain: 18dB Power - Max: 450mW Current - Collector (Ic) (Max): 50mA Voltage - Collector Emitter Breakdown (Max): 12V DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 8V Frequency - Transition: 11GHz Noise Figure (dB Typ @ f): 0.6dB @ 900MHz Supplier Device Package: SC-70 Grade: Automotive Qualification: AEC-Q101 |
auf Bestellung 5499 Stücke: Lieferzeit 10-14 Tag (e) |
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| MCXA156VPJ | NXP USA Inc. |
Description: IC MCU Number of I/O: 82 Supplier Device Package: 112-VFBGA (7x7) Peripherals: DMA, LVD/HVD, POR, PWM, WDT Connectivity: FlexIO, I2C, SPI, UART/USART, USB Core Size: 32-Bit Data Converters: D/A 1x12b Core Processor: ARM® Cortex®-M33 Program Memory Type: FLASH RAM Size: 128K x 8 Program Memory Size: 1MB (1M x 8) Speed: 96MHz Mounting Type: Surface Mount Package / Case: 112-BGA Packaging: Tray |
auf Bestellung 250 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA9421UKZ | NXP USA Inc. |
Description: IC PMIC WLCSP25 Supplier Device Package: 25-WLCSP (2.09x2.09) Current - Supply: 5.5µA Applications: Microcontroller, MCU Voltage - Supply: 3.3V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 25-UFBGA, WLCSP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 3000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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PCA9421UKZ | NXP USA Inc. |
Description: IC PMIC WLCSP25 Supplier Device Package: 25-WLCSP (2.09x2.09) Current - Supply: 5.5µA Applications: Microcontroller, MCU Voltage - Supply: 3.3V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 25-UFBGA, WLCSP Packaging: Cut Tape (CT) |
auf Bestellung 2144 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33FS6526CAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO Qualification: AEC-Q100 Grade: Automotive Supplier Device Package: 48-HLQFP (7x7) Applications: System Basis Chip Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| 88W8763-A1-BMKC/AK | NXP USA Inc. |
Description: 802.11 A/B/G/N 3X3 MAC/BB/RF SIN Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 945 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| TJA1104DHN/0J | NXP USA Inc. |
Description: TJA1104DHN/0J Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| SL3S1206FUD2/HAA | NXP USA Inc. |
Description: SL3S1206FUD2 Supplier Device Package: Wafer Operating Temperature: -40°C ~ 85°C Type: RFID Reader Mounting Type: Surface Mount Package / Case: Die Packaging: Tray |
auf Bestellung 342422 Stücke: Lieferzeit 10-14 Tag (e) |
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| SL3S1206FUD2/HAPZ | NXP USA Inc. |
Description: SL3S1206FUD2 Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 390687 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| MWCT2016SHVPA | NXP USA Inc. |
Description: MWCT2016S,MAXQFP100 Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 480 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| MWCT2016SHVPAR | NXP USA Inc. |
Description: MWCT2016S,MAXQFP100 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 600 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| MWCT2016SGVPAR | NXP USA Inc. |
Description: MWCT2016S,MAXQFP100 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 600 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| MWCT2016SGVPA | NXP USA Inc. |
Description: MWCT2016S,MAXQFP100 Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 480 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| MWCT2016SHT0VPAR | NXP USA Inc. |
Description: MWCT2016S,MAXQFP100 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| S32K310NHT0VLFST |
|
Hersteller: NXP USA Inc.
Description: S32K310NHT0VLFST
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 42
Qualification: AEC-Q100
Description: S32K310NHT0VLFST
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 42
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S32K311NHT0VPASR |
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Hersteller: NXP USA Inc.
Description: S32K311NHT0VPASR
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
Description: S32K311NHT0VPASR
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 600 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S32K311NHT0MPAIR |
|
Hersteller: NXP USA Inc.
Description: S32K311NHT0MPAIR
Packaging: Bulk
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
Description: S32K311NHT0MPAIR
Packaging: Bulk
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 600 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S32K312NHT0MPAIR |
|
Hersteller: NXP USA Inc.
Description: S32K312NHT0MPAIR
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
Description: S32K312NHT0MPAIR
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 600 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S32K312NHT0MPASR |
|
Hersteller: NXP USA Inc.
Description: S32K312NHT0MPASR
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
Description: S32K312NHT0MPASR
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 600 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S32K394EHT1MJBSR |
|
Hersteller: NXP USA Inc.
Description: S32K394EHT1MJBSR
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
Description: S32K394EHT1MJBSR
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S32K394NHT1MJBST |
|
Hersteller: NXP USA Inc.
Description: S32K394NHT1MJBST
Qualification: AEC-Q100
Number of I/O: 209
Grade: Automotive
Supplier Device Package: 289-LFBGA (14x14)
Peripherals: DMA, I2S, WDT
Connectivity: CANbus, I2C, QSPI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Quad-Core
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Processor: ARM® Cortex®-M7
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 800K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 320MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tray
Description: S32K394NHT1MJBST
Qualification: AEC-Q100
Number of I/O: 209
Grade: Automotive
Supplier Device Package: 289-LFBGA (14x14)
Peripherals: DMA, I2S, WDT
Connectivity: CANbus, I2C, QSPI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Quad-Core
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Processor: ARM® Cortex®-M7
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 800K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 320MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S32K394EHT1MJBST |
|
Hersteller: NXP USA Inc.
Description: S32K394EHT1MJBST
Qualification: AEC-Q100
Number of I/O: 209
Grade: Automotive
Supplier Device Package: 289-LFBGA (14x14)
Peripherals: DMA, I2S, WDT
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Quad-Core
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Processor: ARM® Cortex®-M7
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 800K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 320MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tray
Description: S32K394EHT1MJBST
Qualification: AEC-Q100
Number of I/O: 209
Grade: Automotive
Supplier Device Package: 289-LFBGA (14x14)
Peripherals: DMA, I2S, WDT
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Quad-Core
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Processor: ARM® Cortex®-M7
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 800K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 320MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 152 Stücke
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| S32K396NHT1MJBST |
|
Hersteller: NXP USA Inc.
Description: S32K396NHT1MJBST
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, QSPI, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Qualification: AEC-Q100
Description: S32K396NHT1MJBST
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, QSPI, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
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| S32K396NHT1MKUSR |
|
Hersteller: NXP USA Inc.
Description: S32K396NHT1MKUSR
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, QSPI, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 176-LQFP (24x24)
Grade: Automotive
Qualification: AEC-Q100
Description: S32K396NHT1MKUSR
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, QSPI, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 176-LQFP (24x24)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
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| S32K396EHT1MKUSR |
|
Hersteller: NXP USA Inc.
Description: S32K396EHT1MKUSR
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 176-LQFP (24x24)
Grade: Automotive
Qualification: AEC-Q100
Description: S32K396EHT1MKUSR
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 176-LQFP (24x24)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
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| S32K396NHT1MKUST |
|
Hersteller: NXP USA Inc.
Description: S32K396NHT1MKUST
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, QSPI, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 176-HLQFP (24x24)
Grade: Automotive
Qualification: AEC-Q100
Description: S32K396NHT1MKUST
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, QSPI, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 176-HLQFP (24x24)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 200 Stücke
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| S32X-MB |
Hersteller: NXP USA Inc.
Description: S32X-MB
Packaging: Bulk
Function: I/O Expansion
Type: Interface
Contents: Board(s)
Utilized IC / Part: S32K37, S32K39
Description: S32X-MB
Packaging: Bulk
Function: I/O Expansion
Type: Interface
Contents: Board(s)
Utilized IC / Part: S32K37, S32K39
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S32K396BMS-EVB |
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 1886.64 EUR |
| AFV10700HR5 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Bulk
Package / Case: NI-780-4
Current Rating (Amps): 1µA
Mounting Type: Chassis Mount
Frequency: 1.03GHz ~ 1.09GHz
Configuration: Dual
Power - Output: 770W
Gain: 19.2dB
Technology: LDMOS
Supplier Device Package: NI-780-4
Voltage - Rated: 105 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI780
Packaging: Bulk
Package / Case: NI-780-4
Current Rating (Amps): 1µA
Mounting Type: Chassis Mount
Frequency: 1.03GHz ~ 1.09GHz
Configuration: Dual
Power - Output: 770W
Gain: 19.2dB
Technology: LDMOS
Supplier Device Package: NI-780-4
Voltage - Rated: 105 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
Mindestbestellmenge: 50 Stücke
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| MCIMX6S4AVM08AB |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tray
Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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| SE050F2HQ1/Z018HZ |
|
Hersteller: NXP USA Inc.
Description: IC PLUG/TRUST SEC ELEM 20HX2QFN
DigiKey Programmable: Not Verified
Supplier Device Package: 20-HX2QFN (3x3)
Type: Plug and Trust Secure Element
Mounting Type: Surface Mount
Package / Case: 20-XFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC PLUG/TRUST SEC ELEM 20HX2QFN
DigiKey Programmable: Not Verified
Supplier Device Package: 20-HX2QFN (3x3)
Type: Plug and Trust Secure Element
Mounting Type: Surface Mount
Package / Case: 20-XFQFN Exposed Pad
Packaging: Tape & Reel (TR)
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3000+ | 5.07 EUR |
| PCA9481AUKZ |
|
Hersteller: NXP USA Inc.
Description: SWITCHED CAPACITOR CHARGER
Packaging: Tape & Reel (TR)
Package / Case: 70-UFBGA, WLCSP
Number of Cells: 1
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 70-WLCSP (4.16x2.96)
Charge Current - Max: 10A
Programmable Features: Timer
Fault Protection: Over Temperature, Over-Under Voltage
Voltage - Supply (Max): 16.5V
Battery Pack Voltage: 7V (Max)
Current - Charging: Constant
Description: SWITCHED CAPACITOR CHARGER
Packaging: Tape & Reel (TR)
Package / Case: 70-UFBGA, WLCSP
Number of Cells: 1
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 70-WLCSP (4.16x2.96)
Charge Current - Max: 10A
Programmable Features: Timer
Fault Protection: Over Temperature, Over-Under Voltage
Voltage - Supply (Max): 16.5V
Battery Pack Voltage: 7V (Max)
Current - Charging: Constant
Produkt ist nicht verfügbar
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| K32W042S1M2CAVAR |
Hersteller: NXP USA Inc.
Description: MCU KINETIS BT5/FSK/THREAD WLCSP
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 1.25MB (1.25M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D - 12bit; D/A - 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals: Bluetooth, DMA, PWM, WDT
Supplier Device Package: 191-WLCSP (5.97x5.85)
Number of I/O: 104
DigiKey Programmable: Not Verified
Description: MCU KINETIS BT5/FSK/THREAD WLCSP
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 1.25MB (1.25M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D - 12bit; D/A - 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals: Bluetooth, DMA, PWM, WDT
Supplier Device Package: 191-WLCSP (5.97x5.85)
Number of I/O: 104
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| K32W032S1M2VPJAT |
Hersteller: NXP USA Inc.
Description: MCU KINETIS BT5/FSK 176-VFBGA
Packaging: Tray
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 1.25MB (1.25M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D - 12bit; D/A - 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals: Bluetooth, DMA, PWM, WDT
Supplier Device Package: 176-VFBGA
Number of I/O: 104
DigiKey Programmable: Not Verified
Description: MCU KINETIS BT5/FSK 176-VFBGA
Packaging: Tray
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 1.25MB (1.25M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D - 12bit; D/A - 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals: Bluetooth, DMA, PWM, WDT
Supplier Device Package: 176-VFBGA
Number of I/O: 104
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MPC8343CRADDB |
|
Hersteller: NXP USA Inc.
Description: POWERQUICC II PRO PROCESSOR
Packaging: Bulk
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-TEPBGA II (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
Description: POWERQUICC II PRO PROCESSOR
Packaging: Bulk
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-TEPBGA II (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 8+ | 91.99 EUR |
| MPC8343CVRADDB |
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Produkt ist nicht verfügbar
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| MPC8343EVRADDB |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
Produkt ist nicht verfügbar
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| MPC8343ZQADDB |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Produkt ist nicht verfügbar
Im Einkaufswagen
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| NTP53121G0JUAV |
Hersteller: NXP USA Inc.
Description: NTAG
Packaging: Bulk
Frequency: 13.56MHz
Memory Type: Read/Write
Operating Temperature: -40°C ~ 105°C
Standards: ISO 15693, NFC
Writable Memory: 16kb (User)
Description: NTAG
Packaging: Bulk
Frequency: 13.56MHz
Memory Type: Read/Write
Operating Temperature: -40°C ~ 105°C
Standards: ISO 15693, NFC
Writable Memory: 16kb (User)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MIMXRT106VDVL6B |
|
auf Bestellung 456 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 25.05 EUR |
| 10+ | 22.24 EUR |
| 25+ | 21.21 EUR |
| 40+ | 20.69 EUR |
| 80+ | 19.96 EUR |
| 240+ | 18.85 EUR |
| MIMXRT106DDVL6B |
|
auf Bestellung 438 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 28.52 EUR |
| 10+ | 22.56 EUR |
| 25+ | 21.06 EUR |
| 240+ | 18.68 EUR |
| S912XEQ512BCAA |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S912XEQ512BCAAR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S912XEQ512J2CAL |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 300 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S912XEQ512F1CAG |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S912XEQ512F1CAGR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S912XEQ512BVAL |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
Description: IC MCU 16BIT 512KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S912XEQ512F1VAL |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
Description: IC MCU 16BIT 512KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S912XEQ512J3MAAR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
DigiKey Programmable: Not Verified
Number of I/O: 59
Supplier Device Package: 80-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tape & Reel (TR)
Description: IC MCU 16BIT 512KB FLASH 80QFP
DigiKey Programmable: Not Verified
Number of I/O: 59
Supplier Device Package: 80-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC908LJ24CFUER |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 24KB FLASH 64QFP
Packaging: Tape & Reel (TR)
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: I2C, IRSCI, SPI
Peripherals: LCD, LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 24KB FLASH 64QFP
Packaging: Tape & Reel (TR)
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: I2C, IRSCI, SPI
Peripherals: LCD, LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 750 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MFS8632BMDA0ESR2 |
|
Hersteller: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 36V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 36V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MK12DX256VLF5 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 33
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 18x16b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Description: IC MCU 32BIT 256KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 33
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 18x16b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MKV10Z16VFM7 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: DMA, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 16x12b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 75MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
Description: IC MCU 32BIT 16KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: DMA, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 16x12b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 75MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
auf Bestellung 139 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 131+ | 4.14 EUR |
| MKV10Z16VFM7 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: DMA, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 16x12b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 75MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
Description: IC MCU 32BIT 16KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: DMA, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 16x12b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 75MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MW7IC2750NBR1 |
|
Hersteller: NXP USA Inc.
Description: IC AMP WIMAX 2.3-2.7GHZ TO272WB
Packaging: Tape & Reel (TR)
Package / Case: TO-272-14 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 2.3GHz ~ 2.7GHz
RF Type: WiMax
Voltage - Supply: 28V
Gain: 26dB
Current - Supply: 550mA
P1dB: 47dBm
Test Frequency: 2.7GHz
Supplier Device Package: TO-272 WB-14
Description: IC AMP WIMAX 2.3-2.7GHZ TO272WB
Packaging: Tape & Reel (TR)
Package / Case: TO-272-14 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 2.3GHz ~ 2.7GHz
RF Type: WiMax
Voltage - Supply: 28V
Gain: 26dB
Current - Supply: 550mA
P1dB: 47dBm
Test Frequency: 2.7GHz
Supplier Device Package: TO-272 WB-14
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BFU550WF |
|
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 12V 11GHZ SC-70
Supplier Device Package: SC-70
Noise Figure (dB Typ @ f): 1.3dB @ 1.8GHz
Frequency - Transition: 11GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 8V
Voltage - Collector Emitter Breakdown (Max): 12V
Current - Collector (Ic) (Max): 50mA
Power - Max: 450mW
Gain: 12dB
Operating Temperature: -40°C ~ 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Packaging: Tape & Reel (TR)
Description: RF TRANS NPN 12V 11GHZ SC-70
Supplier Device Package: SC-70
Noise Figure (dB Typ @ f): 1.3dB @ 1.8GHz
Frequency - Transition: 11GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 8V
Voltage - Collector Emitter Breakdown (Max): 12V
Current - Collector (Ic) (Max): 50mA
Power - Max: 450mW
Gain: 12dB
Operating Temperature: -40°C ~ 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BFU550WF |
|
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 12V 11GHZ SC-70
Supplier Device Package: SC-70
Noise Figure (dB Typ @ f): 1.3dB @ 1.8GHz
Frequency - Transition: 11GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 8V
Voltage - Collector Emitter Breakdown (Max): 12V
Current - Collector (Ic) (Max): 50mA
Power - Max: 450mW
Gain: 12dB
Operating Temperature: -40°C ~ 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Packaging: Cut Tape (CT)
Description: RF TRANS NPN 12V 11GHZ SC-70
Supplier Device Package: SC-70
Noise Figure (dB Typ @ f): 1.3dB @ 1.8GHz
Frequency - Transition: 11GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 8V
Voltage - Collector Emitter Breakdown (Max): 12V
Current - Collector (Ic) (Max): 50mA
Power - Max: 450mW
Gain: 12dB
Operating Temperature: -40°C ~ 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Packaging: Cut Tape (CT)
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 26+ | 0.82 EUR |
| 37+ | 0.57 EUR |
| 41+ | 0.51 EUR |
| 100+ | 0.44 EUR |
| 250+ | 0.42 EUR |
| 500+ | 0.39 EUR |
| 1000+ | 0.38 EUR |
| 2500+ | 0.36 EUR |
| BFU550WX |
|
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 12V 11GHZ SC-70
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 18dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 50mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 8V
Frequency - Transition: 11GHz
Noise Figure (dB Typ @ f): 0.6dB @ 900MHz
Supplier Device Package: SC-70
Grade: Automotive
Qualification: AEC-Q101
Description: RF TRANS NPN 12V 11GHZ SC-70
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 18dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 50mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 8V
Frequency - Transition: 11GHz
Noise Figure (dB Typ @ f): 0.6dB @ 900MHz
Supplier Device Package: SC-70
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3000+ | 0.61 EUR |
| BFU550WX |
|
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 12V 11GHZ SC-70
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 18dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 50mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 8V
Frequency - Transition: 11GHz
Noise Figure (dB Typ @ f): 0.6dB @ 900MHz
Supplier Device Package: SC-70
Grade: Automotive
Qualification: AEC-Q101
Description: RF TRANS NPN 12V 11GHZ SC-70
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 18dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 50mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 8V
Frequency - Transition: 11GHz
Noise Figure (dB Typ @ f): 0.6dB @ 900MHz
Supplier Device Package: SC-70
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 5499 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 16+ | 1.32 EUR |
| 23+ | 0.94 EUR |
| 25+ | 0.84 EUR |
| 100+ | 0.74 EUR |
| 250+ | 0.69 EUR |
| 500+ | 0.65 EUR |
| 1000+ | 0.64 EUR |
| MCXA156VPJ |
|
Hersteller: NXP USA Inc.
Description: IC MCU
Number of I/O: 82
Supplier Device Package: 112-VFBGA (7x7)
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Connectivity: FlexIO, I2C, SPI, UART/USART, USB
Core Size: 32-Bit
Data Converters: D/A 1x12b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
RAM Size: 128K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 96MHz
Mounting Type: Surface Mount
Package / Case: 112-BGA
Packaging: Tray
Description: IC MCU
Number of I/O: 82
Supplier Device Package: 112-VFBGA (7x7)
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Connectivity: FlexIO, I2C, SPI, UART/USART, USB
Core Size: 32-Bit
Data Converters: D/A 1x12b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
RAM Size: 128K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 96MHz
Mounting Type: Surface Mount
Package / Case: 112-BGA
Packaging: Tray
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 10.09 EUR |
| 10+ | 7.26 EUR |
| 25+ | 6.99 EUR |
| 100+ | 6.71 EUR |
| PCA9421UKZ |
|
Hersteller: NXP USA Inc.
Description: IC PMIC WLCSP25
Supplier Device Package: 25-WLCSP (2.09x2.09)
Current - Supply: 5.5µA
Applications: Microcontroller, MCU
Voltage - Supply: 3.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 25-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
Description: IC PMIC WLCSP25
Supplier Device Package: 25-WLCSP (2.09x2.09)
Current - Supply: 5.5µA
Applications: Microcontroller, MCU
Voltage - Supply: 3.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 25-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 3000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| PCA9421UKZ |
|
Hersteller: NXP USA Inc.
Description: IC PMIC WLCSP25
Supplier Device Package: 25-WLCSP (2.09x2.09)
Current - Supply: 5.5µA
Applications: Microcontroller, MCU
Voltage - Supply: 3.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 25-UFBGA, WLCSP
Packaging: Cut Tape (CT)
Description: IC PMIC WLCSP25
Supplier Device Package: 25-WLCSP (2.09x2.09)
Current - Supply: 5.5µA
Applications: Microcontroller, MCU
Voltage - Supply: 3.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 25-UFBGA, WLCSP
Packaging: Cut Tape (CT)
auf Bestellung 2144 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5+ | 4.88 EUR |
| 10+ | 3.64 EUR |
| 25+ | 3.33 EUR |
| 100+ | 2.99 EUR |
| 250+ | 2.83 EUR |
| 500+ | 2.73 EUR |
| 1000+ | 2.65 EUR |
| MC33FS6526CAE |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
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Produkt ist nicht verfügbar
Mindestbestellmenge: 945 Stücke
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Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
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Stück im Wert von UAH
| SL3S1206FUD2/HAA |
|
Hersteller: NXP USA Inc.
Description: SL3S1206FUD2
Supplier Device Package: Wafer
Operating Temperature: -40°C ~ 85°C
Type: RFID Reader
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tray
Description: SL3S1206FUD2
Supplier Device Package: Wafer
Operating Temperature: -40°C ~ 85°C
Type: RFID Reader
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tray
auf Bestellung 342422 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 342422+ | 0.054 EUR |
| SL3S1206FUD2/HAPZ |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 390687 Stücke
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| MWCT2016SHVPA |
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Mindestbestellmenge: 480 Stücke
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| MWCT2016SHVPAR |
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Produkt ist nicht verfügbar
Mindestbestellmenge: 600 Stücke
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Stück im Wert von UAH
| MWCT2016SGVPAR |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 600 Stücke
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Stück im Wert von UAH
| MWCT2016SGVPA |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 480 Stücke
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