Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35328) > Seite 555 nach 589
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
MCIMX6G3CVK05AA | NXP USA Inc. |
 Description: IC MPU I.MX6UL 528MHZ 272MAPBGAPackaging: Tray Package / Case: 272-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 272-MAPBGA (9x9) Ethernet: 10/100Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| PCA9420KUKZ | NXP USA Inc. |
Description: PCA9420KUKZ Packaging: Bulk Package / Case: 25-UFBGA, WLCSP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 3.3V ~ 5.5V Applications: Microcontroller, MCU Current - Supply: 4.5µA Supplier Device Package: 25-WLCSP (2.09x2.09) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
 |
MC13892JVK | NXP USA Inc. |
Description: IC PMU I.MX51/37/35/27 139MAPBGA Packaging: Tray Package / Case: 139-TFBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply Supplier Device Package: 139-PBGA (7x7) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
|
|
MC13892VK | NXP USA Inc. |
Description: IC PMU I.MX51/37/35/27 139MAPBGA Packaging: Tray Package / Case: 139-TFBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply Supplier Device Package: 139-PBGA (7x7) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
|
|
MC13892BJVK | NXP USA Inc. |
Description: IC PMU I.MX51/37/35/27 139MAPBGA Packaging: Tray Package / Case: 139-TFBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply Supplier Device Package: 139-PBGA (7x7) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
LS1012AXE7HKA | NXP USA Inc. |
Description: IC MPU QORIQ 800MHZ 211FCLGA Packaging: Bulk Package / Case: 211-VFLGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C Core Processor: ARM® Cortex®-A53 Supplier Device Package: 211-FCLGA (9.6x9.6) Ethernet: GbE (2) USB: USB 2.0 (1), USB 3.0 + PHY Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: DDR3L Security Features: Secure Boot, TrustZone® SATA: SATA 6Gbps (1) |
auf Bestellung 137 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
 |
MC56F82743VLC | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 32LQFP Packaging: Bulk Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 64KB (32K x 16) RAM Size: 4K x 16 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800EX Data Converters: A/D 6x12b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 26 DigiKey Programmable: Not Verified |
auf Bestellung 283 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
 |
MM908E624ACPEW | NXP USA Inc. |
Description: IC SW TRPL HISIDE MCU/LIN 54SOIC Packaging: Tube Package / Case: 54-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: SCI, SPI RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 5.5V ~ 18V Controller Series: 908E Program Memory Type: FLASH (16kB) Applications: Mirror Control Core Processor: HC08 Supplier Device Package: 54-SOIC Grade: Automotive Number of I/O: 16 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
SPC5643LFF2MMM1 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA Packaging: Tray Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z4 Data Converters: A/D 32x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 257-LFBGA (14x14) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
LS1023ASN7PQB | NXP USA Inc. |
Description: IC MPU QORIQ 1.4GHZ 621FCPBGA Packaging: Tray Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: 0°C ~ 105°C Core Processor: ARM® Cortex®-A53 Supplier Device Package: 621-FCPBGA (21x21) Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5) USB: USB 3.0 (2) + PHY Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Security Features: Secure Boot, TrustZone® SATA: SATA 6Gbps (1) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
MC34PF1550A8EPR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC 3 BUCK REGS Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 4.1V ~ 6V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
|
|
MC34PF1550A8EP | NXP USA Inc. |
Description: POWER MANAGEMENT IC 3 BUCK REGS Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 4.1V ~ 6V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
SPC5646CF0MLT1 | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLASH 208TQFP Packaging: Tray Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 80MHz/120MHz Program Memory Size: 3MB (3M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4d, e200z0h Data Converters: A/D 33x10b, 10x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 208-TQFP (28x28) Number of I/O: 177 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
TEA1833LTS/1Z | NXP USA Inc. |
Description: IC FLYBACK SMPS CTLR 6TSOP Packaging: Tape & Reel (TR) Package / Case: SC-74, SOT-457 Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Duty Cycle: 90% Frequency - Switching: 65kHz Internal Switch(s): No Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 10.5V ~ 36V Supplier Device Package: SC-74 Fault Protection: Over Power, Over Temperature, Over Voltage, Short Circuit Voltage - Start Up: 22 V Control Features: Frequency Control, Soft Start |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| S32G398AAAK1VUCT | NXP USA Inc. |
Description: 3XM7 400MHZ, 8XA53 1GHZ, 525BG Packaging: Tray Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 400MHz, 1GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 3 Core, 64-Bit/8 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Security Features: ARM TZ, Boot Security, TRNG Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| S32G379AACK1VUCR | NXP USA Inc. |
Description: 4XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2 Packaging: Tape & Reel (TR) Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 400MHz, 1.3GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 4 Core, 32/64-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| S32G398AABK1VUCT | NXP USA Inc. |
Description: 8XA53 - 1.1GHZ, 3XM7 - 400MHZ, 1 Packaging: Tray Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.1GHz, 400MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 3 Core, 64-Bit/8 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| S32G379ASCK1VUCR | NXP USA Inc. |
Description: 4XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2 Packaging: Tape & Reel (TR) Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 400MHz, 1.3GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 4 Core, 32/64-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| S32G399AAAK1VUCT | NXP USA Inc. |
Description: 8XA53 - 1.0GHZ, 4XM7 - 400MHZ, 2 Packaging: Tray Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 400MHz, 1GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Security Features: ARM TZ, Boot Security, TRNG Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| S32G379ASCK1VUCT | NXP USA Inc. |
Description: 4XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2 Packaging: Tray Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 400MHz, 1.3GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 4 Core, 32/64-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| S32G399ASAK1VUCT | NXP USA Inc. |
Description: 8XA53 - 1.0GHZ, 4XM7 - 400MHZ, 2 Packaging: Tray Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 400MHz, 1GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Security Features: ARM TZ, Boot Security, TRNG Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| S32G399AABK1VUCT | NXP USA Inc. |
Description: 8XA53 - 1.1GHZ, 4XM7 - 400MHZ, 2 Packaging: Tray Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.1GHz, 400MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| S32G399AAAK1VUCR | NXP USA Inc. |
Description: IC MCU Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| S32G399AACK1VUCR | NXP USA Inc. |
Description: 8XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2 Packaging: Tape & Reel (TR) Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 400MHz, 1.3GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| S32G399ASBK1VUCT | NXP USA Inc. |
Description: 8XA53 - 1.1GHZ, 4XM7 - 400MHZ, 2 Packaging: Tray Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.1GHz, 400MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| S32G399ASCK1VUCR | NXP USA Inc. |
Description: 8XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2 Packaging: Tape & Reel (TR) Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 400MHz, 1.3GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| S32G-VNP-EVB3 | NXP USA Inc. |
Description: VEHICLE NETWORK PROCESSING EVAL Packaging: Box Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: ARM® Cortex®-A53, Cortex®-M7 Utilized IC / Part: S32G2x, S32G3x |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| SPC5604BAVLL4R | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 28x10b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 79 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| SPC5604BAVLL4 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 28x10b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 79 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
|
|
MC34PF1510A0EPR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC, 3 BUCK REGS Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.5V ~ 4.5V Applications: Processor Current - Supply: 35µA Supplier Device Package: 40-HVQFN (5x5) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
|
|
MC34PF1510A0EP | NXP USA Inc. |
Description: POWER MANAGEMENT IC, 3 BUCK REGS Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.5V ~ 4.5V Applications: Processor Current - Supply: 35µA Supplier Device Package: 40-HVQFN (5x5) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| MGD3140AM515EKR2 | NXP USA Inc. |
Description: IC MCU Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| MGD3140AM515EKT | NXP USA Inc. |
Description: IC MCU Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
 |
MC68340CAB16E | NXP USA Inc. |
Description: MICROPROCESSOR, 32-BIT, MC68000 Packaging: Bulk |
auf Bestellung 30 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
| T2080NSE8PTB | NXP USA Inc. |
Description: QORIQ, 64B POWER ARCH, 8X 1.5GHZ Packaging: Bulk |
auf Bestellung 625 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
 |
TJA1021ATK/0J | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8HVSON Packaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 5.5V ~ 27V Number of Drivers/Receivers: 1/1 Data Rate: 20kBaud Protocol: LIN Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 300 mV Duplex: Half Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
|
|
TJA1021BTK/0J | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8HVSON Packaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 5.5V ~ 27V Number of Drivers/Receivers: 1/1 Data Rate: 20kBaud Protocol: LIN Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 300 mV Duplex: Half Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
|
|
TJA1028DTK/0J | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8HVSON Packaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V Number of Drivers/Receivers: 1/1 Data Rate: 20kBaud Protocol: LIN Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 200 mV Duplex: Half Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
|
|
TJA1028ATK/0J | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8HVSON Packaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V Number of Drivers/Receivers: 1/1 Data Rate: 10.4kBaud Protocol: LIN Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 200 mV Duplex: Half Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
|
|
TJA1028BTK/0J | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8HVSON Packaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V Number of Drivers/Receivers: 1/1 Data Rate: 20kBaud Protocol: LIN Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 200 mV Duplex: Half Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
|
|
TJA1028CTK/0J | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8HVSON Packaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V Number of Drivers/Receivers: 1/1 Data Rate: 10.4kBaud Protocol: LIN Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 200 mV Duplex: Half Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| MRFE6P3300HR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 32V NI860C3 Packaging: Bulk Package / Case: NI-860C3 Mounting Type: Chassis Mount Frequency: 857MHz ~ 863MHz Power - Output: 270W Gain: 20.4dB Technology: LDMOS Supplier Device Package: NI-860C3 Voltage - Rated: 66 V Voltage - Test: 32 V Current - Test: 1.6 A |
auf Bestellung 82 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
 |
PZU24B3A,115 | NXP USA Inc. |
Description: SINGLE ZENER DIODE Tolerance: ±2% Packaging: Bulk Package / Case: SC-76, SOD-323 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C Voltage - Zener (Nom) (Vz): 24 V Impedance (Max) (Zzt): 30 Ohms Supplier Device Package: SOD-323 Power - Max: 320 mW Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA Current - Reverse Leakage @ Vr: 50 nA @ 19 V |
auf Bestellung 49600 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
| NT2L1011G0DUDZ | NXP USA Inc. |
Description: NTAG210, NFC FORUM TYPE 2 TAG CO Packaging: Tray Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader/Transponder Operating Temperature: -25°C ~ 70°C (TA) Standards: ISO 14443, NFC Supplier Device Package: Wafer |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
 |
FS32K148HFT0VLQR | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 32x12b SAR; D/A 1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: I2S, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 128 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| PCA9420AUKZ | NXP USA Inc. |
Description: PCA9420AUK Packaging: Cut Tape (CT) Package / Case: 25-UFBGA, WLCSP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 3.3V ~ 5.5V Current - Supply: 4.5µA Supplier Device Package: 25-WLCSP (2.09x2.09) |
auf Bestellung 3000 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||||
 |
FXPS71407ST1 | NXP USA Inc. |
Description: SENSOR 20.31PSIA 16HQFN Packaging: Tape & Reel (TR) Package / Case: 16-QFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Pressure: 5.8PSI ~ 20.31PSI (40kPa ~ 140kPa) Pressure Type: Absolute Accuracy: ±7% Operating Temperature: -40°C ~ 125°C Applications: Board Mount Supplier Device Package: 16-HQFN (4x4) Port Style: No Port |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| S9S08DV32F2MLHR | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| SAF4000EL/101Q204Y | NXP USA Inc. |
Description: AUDIO DSPS SAF4000EL/101Q2040 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| SAF4000EL/101Q500Y | NXP USA Inc. |
Description: AUDIO DSPS SAF4000EL/101Q5002 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| SAF4000EL/101Q200K | NXP USA Inc. |
Description: AUDIO DSPS SAF4000EL/101Q2002 Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| SAF4000EL/101Q224K | NXP USA Inc. |
Description: AUDIO DSPS SAF4000EL/101Q2240 Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| SAF4000EL/101Q500K | NXP USA Inc. |
Description: AUDIO DSPS SAF4000EL/101Q5002 Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| SAF4000EL/101Q204K | NXP USA Inc. |
Description: AUDIO DSPS SAF4000EL/101Q2040 Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| SAF4000EL/101Q233Y | NXP USA Inc. |
Description: AUDIO DSPS SAF4000EL/101Q2331 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| SAF4000EL/101Q23AY | NXP USA Inc. |
Description: AUDIO DSPS SAF4000EL/101Q2332 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| SAF4000EL/101Q233K | NXP USA Inc. |
Description: AUDIO DSPS SAF4000EL/101Q2331 Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| SAF4000EL/101Q23AK | NXP USA Inc. |
Description: AUDIO DSPS SAF4000EL/101Q2332 Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| FXLS93421AESR2 | NXP USA Inc. |
Description: 2 AXIS MED/LOW XZ PSI5 3.0 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| FXPS71407T1 | NXP USA Inc. |
Description: AUTOMOTIVE SAFETY PRESSURE SENSO Packaging: Tape & Reel (TR) Package / Case: 16-QFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Pressure: 5.8PSI ~ 20.31PSI (40kPa ~ 140kPa) Pressure Type: Absolute Operating Temperature: -40°C ~ 125°C Applications: Board Mount Supplier Device Package: 16-HQFN (4x4) Port Style: No Port |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| MCIMX6G3CVK05AA |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6UL 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6UL 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCA9420KUKZ |
|
Hersteller: NXP USA Inc.
Description: PCA9420KUKZ
Packaging: Bulk
Package / Case: 25-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V ~ 5.5V
Applications: Microcontroller, MCU
Current - Supply: 4.5µA
Supplier Device Package: 25-WLCSP (2.09x2.09)
Description: PCA9420KUKZ
Packaging: Bulk
Package / Case: 25-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V ~ 5.5V
Applications: Microcontroller, MCU
Current - Supply: 4.5µA
Supplier Device Package: 25-WLCSP (2.09x2.09)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC13892JVK |
|
Hersteller: NXP USA Inc.
Description: IC PMU I.MX51/37/35/27 139MAPBGA
Packaging: Tray
Package / Case: 139-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
Supplier Device Package: 139-PBGA (7x7)
Description: IC PMU I.MX51/37/35/27 139MAPBGA
Packaging: Tray
Package / Case: 139-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
Supplier Device Package: 139-PBGA (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC13892VK |
|
Hersteller: NXP USA Inc.
Description: IC PMU I.MX51/37/35/27 139MAPBGA
Packaging: Tray
Package / Case: 139-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
Supplier Device Package: 139-PBGA (7x7)
Description: IC PMU I.MX51/37/35/27 139MAPBGA
Packaging: Tray
Package / Case: 139-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
Supplier Device Package: 139-PBGA (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC13892BJVK |
|
Hersteller: NXP USA Inc.
Description: IC PMU I.MX51/37/35/27 139MAPBGA
Packaging: Tray
Package / Case: 139-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
Supplier Device Package: 139-PBGA (7x7)
Description: IC PMU I.MX51/37/35/27 139MAPBGA
Packaging: Tray
Package / Case: 139-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
Supplier Device Package: 139-PBGA (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LS1012AXE7HKA |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 211FCLGA
Packaging: Bulk
Package / Case: 211-VFLGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 211-FCLGA (9.6x9.6)
Ethernet: GbE (2)
USB: USB 2.0 (1), USB 3.0 + PHY
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Description: IC MPU QORIQ 800MHZ 211FCLGA
Packaging: Bulk
Package / Case: 211-VFLGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 211-FCLGA (9.6x9.6)
Ethernet: GbE (2)
USB: USB 2.0 (1), USB 3.0 + PHY
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
auf Bestellung 137 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 11+ | 39.64 EUR |
| MC56F82743VLC |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 6x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 6x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 283 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 82+ | 6.16 EUR |
| MM908E624ACPEW |
|
Hersteller: NXP USA Inc.
Description: IC SW TRPL HISIDE MCU/LIN 54SOIC
Packaging: Tube
Package / Case: 54-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SCI, SPI
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 5.5V ~ 18V
Controller Series: 908E
Program Memory Type: FLASH (16kB)
Applications: Mirror Control
Core Processor: HC08
Supplier Device Package: 54-SOIC
Grade: Automotive
Number of I/O: 16
DigiKey Programmable: Not Verified
Description: IC SW TRPL HISIDE MCU/LIN 54SOIC
Packaging: Tube
Package / Case: 54-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SCI, SPI
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 5.5V ~ 18V
Controller Series: 908E
Program Memory Type: FLASH (16kB)
Applications: Mirror Control
Core Processor: HC08
Supplier Device Package: 54-SOIC
Grade: Automotive
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5643LFF2MMM1 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 32x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 32x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LS1023ASN7PQB |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.4GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Description: IC MPU QORIQ 1.4GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC34PF1550A8EPR2 |
|
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC 3 BUCK REGS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 4.1V ~ 6V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: POWER MANAGEMENT IC 3 BUCK REGS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 4.1V ~ 6V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC34PF1550A8EP |
|
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC 3 BUCK REGS
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 4.1V ~ 6V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: POWER MANAGEMENT IC 3 BUCK REGS
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 4.1V ~ 6V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5646CF0MLT1 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 208TQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-TQFP (28x28)
Number of I/O: 177
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 3MB FLASH 208TQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-TQFP (28x28)
Number of I/O: 177
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TEA1833LTS/1Z |
|
Hersteller: NXP USA Inc.
Description: IC FLYBACK SMPS CTLR 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 90%
Frequency - Switching: 65kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 10.5V ~ 36V
Supplier Device Package: SC-74
Fault Protection: Over Power, Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 22 V
Control Features: Frequency Control, Soft Start
Description: IC FLYBACK SMPS CTLR 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 90%
Frequency - Switching: 65kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 10.5V ~ 36V
Supplier Device Package: SC-74
Fault Protection: Over Power, Over Temperature, Over Voltage, Short Circuit
Voltage - Start Up: 22 V
Control Features: Frequency Control, Soft Start
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S32G398AAAK1VUCT |
|
Hersteller: NXP USA Inc.
Description: 3XM7 400MHZ, 8XA53 1GHZ, 525BG
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 3 Core, 64-Bit/8 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Boot Security, TRNG
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Description: 3XM7 400MHZ, 8XA53 1GHZ, 525BG
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 3 Core, 64-Bit/8 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Boot Security, TRNG
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S32G379AACK1VUCR |
|
Hersteller: NXP USA Inc.
Description: 4XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Description: 4XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S32G398AABK1VUCT |
|
Hersteller: NXP USA Inc.
Description: 8XA53 - 1.1GHZ, 3XM7 - 400MHZ, 1
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.1GHz, 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 3 Core, 64-Bit/8 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Description: 8XA53 - 1.1GHZ, 3XM7 - 400MHZ, 1
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.1GHz, 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 3 Core, 64-Bit/8 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S32G379ASCK1VUCR |
|
Hersteller: NXP USA Inc.
Description: 4XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Description: 4XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S32G399AAAK1VUCT |
|
Hersteller: NXP USA Inc.
Description: 8XA53 - 1.0GHZ, 4XM7 - 400MHZ, 2
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Boot Security, TRNG
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Description: 8XA53 - 1.0GHZ, 4XM7 - 400MHZ, 2
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Boot Security, TRNG
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S32G379ASCK1VUCT |
|
Hersteller: NXP USA Inc.
Description: 4XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Description: 4XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S32G399ASAK1VUCT |
|
Hersteller: NXP USA Inc.
Description: 8XA53 - 1.0GHZ, 4XM7 - 400MHZ, 2
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Boot Security, TRNG
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Description: 8XA53 - 1.0GHZ, 4XM7 - 400MHZ, 2
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Boot Security, TRNG
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S32G399AABK1VUCT |
|
Hersteller: NXP USA Inc.
Description: 8XA53 - 1.1GHZ, 4XM7 - 400MHZ, 2
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.1GHz, 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Description: 8XA53 - 1.1GHZ, 4XM7 - 400MHZ, 2
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.1GHz, 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S32G399AACK1VUCR |
|
Hersteller: NXP USA Inc.
Description: 8XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Description: 8XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S32G399ASBK1VUCT |
|
Hersteller: NXP USA Inc.
Description: 8XA53 - 1.1GHZ, 4XM7 - 400MHZ, 2
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.1GHz, 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Description: 8XA53 - 1.1GHZ, 4XM7 - 400MHZ, 2
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.1GHz, 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S32G399ASCK1VUCR |
|
Hersteller: NXP USA Inc.
Description: 8XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Description: 8XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S32G-VNP-EVB3 |
|
Hersteller: NXP USA Inc.
Description: VEHICLE NETWORK PROCESSING EVAL
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53, Cortex®-M7
Utilized IC / Part: S32G2x, S32G3x
Description: VEHICLE NETWORK PROCESSING EVAL
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53, Cortex®-M7
Utilized IC / Part: S32G2x, S32G3x
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5604BAVLL4R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SPC5604BAVLL4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC34PF1510A0EPR2 |
|
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, 3 BUCK REGS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 4.5V
Applications: Processor
Current - Supply: 35µA
Supplier Device Package: 40-HVQFN (5x5)
Description: POWER MANAGEMENT IC, 3 BUCK REGS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 4.5V
Applications: Processor
Current - Supply: 35µA
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC34PF1510A0EP |
|
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, 3 BUCK REGS
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 4.5V
Applications: Processor
Current - Supply: 35µA
Supplier Device Package: 40-HVQFN (5x5)
Description: POWER MANAGEMENT IC, 3 BUCK REGS
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 4.5V
Applications: Processor
Current - Supply: 35µA
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC68340CAB16E |
|
auf Bestellung 30 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 5+ | 114.92 EUR |
| T2080NSE8PTB |
|
auf Bestellung 625 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 429.7 EUR |
| TJA1021ATK/0J |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TJA1021BTK/0J |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TJA1028DTK/0J |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TJA1028ATK/0J |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Data Rate: 10.4kBaud
Protocol: LIN
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Data Rate: 10.4kBaud
Protocol: LIN
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TJA1028BTK/0J |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TJA1028CTK/0J |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Data Rate: 10.4kBaud
Protocol: LIN
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Data Rate: 10.4kBaud
Protocol: LIN
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MRFE6P3300HR3 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 32V NI860C3
Packaging: Bulk
Package / Case: NI-860C3
Mounting Type: Chassis Mount
Frequency: 857MHz ~ 863MHz
Power - Output: 270W
Gain: 20.4dB
Technology: LDMOS
Supplier Device Package: NI-860C3
Voltage - Rated: 66 V
Voltage - Test: 32 V
Current - Test: 1.6 A
Description: RF MOSFET LDMOS 32V NI860C3
Packaging: Bulk
Package / Case: NI-860C3
Mounting Type: Chassis Mount
Frequency: 857MHz ~ 863MHz
Power - Output: 270W
Gain: 20.4dB
Technology: LDMOS
Supplier Device Package: NI-860C3
Voltage - Rated: 66 V
Voltage - Test: 32 V
Current - Test: 1.6 A
auf Bestellung 82 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 669.82 EUR |
| PZU24B3A,115 |
|
Hersteller: NXP USA Inc.
Description: SINGLE ZENER DIODE
Tolerance: ±2%
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: SOD-323
Power - Max: 320 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 19 V
Description: SINGLE ZENER DIODE
Tolerance: ±2%
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: SOD-323
Power - Max: 320 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 19 V
auf Bestellung 49600 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 12488+ | 0.033 EUR |
| NT2L1011G0DUDZ |
|
Hersteller: NXP USA Inc.
Description: NTAG210, NFC FORUM TYPE 2 TAG CO
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, NFC
Supplier Device Package: Wafer
Description: NTAG210, NFC FORUM TYPE 2 TAG CO
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, NFC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FS32K148HFT0VLQR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCA9420AUKZ |
Hersteller: NXP USA Inc.
Description: PCA9420AUK
Packaging: Cut Tape (CT)
Package / Case: 25-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V ~ 5.5V
Current - Supply: 4.5µA
Supplier Device Package: 25-WLCSP (2.09x2.09)
Description: PCA9420AUK
Packaging: Cut Tape (CT)
Package / Case: 25-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V ~ 5.5V
Current - Supply: 4.5µA
Supplier Device Package: 25-WLCSP (2.09x2.09)
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 5+ | 4.35 EUR |
| 10+ | 3.85 EUR |
| 25+ | 3.67 EUR |
| 50+ | 3.54 EUR |
| 100+ | 3.42 EUR |
| 250+ | 3.26 EUR |
| 500+ | 3.14 EUR |
| 1000+ | 3.03 EUR |
| FXPS71407ST1 |
|
Hersteller: NXP USA Inc.
Description: SENSOR 20.31PSIA 16HQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Pressure: 5.8PSI ~ 20.31PSI (40kPa ~ 140kPa)
Pressure Type: Absolute
Accuracy: ±7%
Operating Temperature: -40°C ~ 125°C
Applications: Board Mount
Supplier Device Package: 16-HQFN (4x4)
Port Style: No Port
Description: SENSOR 20.31PSIA 16HQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Pressure: 5.8PSI ~ 20.31PSI (40kPa ~ 140kPa)
Pressure Type: Absolute
Accuracy: ±7%
Operating Temperature: -40°C ~ 125°C
Applications: Board Mount
Supplier Device Package: 16-HQFN (4x4)
Port Style: No Port
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FXPS71407T1 |
|
Hersteller: NXP USA Inc.
Description: AUTOMOTIVE SAFETY PRESSURE SENSO
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Pressure: 5.8PSI ~ 20.31PSI (40kPa ~ 140kPa)
Pressure Type: Absolute
Operating Temperature: -40°C ~ 125°C
Applications: Board Mount
Supplier Device Package: 16-HQFN (4x4)
Port Style: No Port
Description: AUTOMOTIVE SAFETY PRESSURE SENSO
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Pressure: 5.8PSI ~ 20.31PSI (40kPa ~ 140kPa)
Pressure Type: Absolute
Operating Temperature: -40°C ~ 125°C
Applications: Board Mount
Supplier Device Package: 16-HQFN (4x4)
Port Style: No Port
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH