Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (34434) > Seite 555 nach 574
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LPC1768FET100Y | NXP USA Inc. |
 Description: IC MCU 32BIT 512KB FLSH 100TFBGAPackaging: Tape & Reel (TR) Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 100-TFBGA (9x9) Number of I/O: 70 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC1768FET100Y | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 100TFBGA Packaging: Cut Tape (CT) Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 100-TFBGA (9x9) Number of I/O: 70 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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BTA204W-600E,135 | NXP USA Inc. |
Description: TRIAC SENS GATE 600V 1A SOT223 Packaging: Bulk Package / Case: TO-261-4, TO-261AA Mounting Type: Surface Mount Triac Type: Logic - Sensitive Gate Configuration: Single Operating Temperature: 125°C (TJ) Current - Hold (Ih) (Max): 12 mA Current - Gate Trigger (Igt) (Max): 10 mA Current - Non Rep. Surge 50, 60Hz (Itsm): 10A, 11A Voltage - Gate Trigger (Vgt) (Max): 1.5 V Supplier Device Package: SOT-223 Current - On State (It (RMS)) (Max): 1 A Voltage - Off State: 600 V |
auf Bestellung 53568 Stücke: Lieferzeit 10-14 Tag (e) |
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| SAF4000EL/101Q23DY | NXP USA Inc. |
Description: AUDIO DSPS SAF4000EL/101Q2330 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| SAF4000EL/101Q23DK | NXP USA Inc. |
Description: AUDIO DSPS SAF4000EL/101Q2330 Packaging: Tray |
Produkt ist nicht verfügbar |
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SPC5603BK0CLL4 | NXP USA Inc. |
Description: IC MCU 32BIT 384KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 384KB (384K x 8) RAM Size: 28K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 28x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 79 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| TJA1028BT/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SO Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V Number of Drivers/Receivers: 1/1 Data Rate: 20kBaud Protocol: LIN Supplier Device Package: 8-SO Duplex: Half Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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| TJA1028BT/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SO Packaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V Number of Drivers/Receivers: 1/1 Data Rate: 20kBaud Protocol: LIN Supplier Device Package: 8-SO Duplex: Half Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 2113 Stücke: Lieferzeit 10-14 Tag (e) |
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KMI23/2Z | NXP USA Inc. |
Description: SENSOR ROTARY PC PIN Packaging: Tape & Reel (TR) Package / Case: SOT-477A Mounting Type: Through Hole Output: Analog Voltage Operating Temperature: -40°C ~ 150°C Termination Style: PC Pin Actuator Type: External Magnet, Not Included Technology: Magnetoresistive For Measuring: Rotary Position Supplier Device Package: 3-SIP Output Signal: Clockwise Increase Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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KMI23/2Z | NXP USA Inc. |
Description: SENSOR ROTARY PC PIN Packaging: Cut Tape (CT) Package / Case: SOT-477A Mounting Type: Through Hole Output: Analog Voltage Operating Temperature: -40°C ~ 150°C Termination Style: PC Pin Actuator Type: External Magnet, Not Included Technology: Magnetoresistive For Measuring: Rotary Position Supplier Device Package: 3-SIP Output Signal: Clockwise Increase Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 1215 Stücke: Lieferzeit 10-14 Tag (e) |
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| SPC5643LAMLQ8 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: e200z4 Data Converters: A/D 32x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.63V Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) |
Produkt ist nicht verfügbar |
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| SPC5643LAMLQ1R | NXP USA Inc. |
Description: NXP 32-BIT MCU, DUAL POWER ARCH, Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: e200z4 Data Converters: A/D 32x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.63V Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) |
Produkt ist nicht verfügbar |
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| SPC5643LFAMLL6R | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: e200z4 Data Converters: A/D 32x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.63V Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) |
Produkt ist nicht verfügbar |
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| SPC5643LFAMLL6 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: e200z4 Data Converters: A/D 32x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.63V Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) |
Produkt ist nicht verfügbar |
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N74F244N,602 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 5.5V 20DIP Packaging: Tube Package / Case: 20-DIP (0.300", 7.62mm) Output Type: 3-State Mounting Type: Through Hole Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 4 Current - Output High, Low: 15mA, 64mA Supplier Device Package: 20-DIP |
auf Bestellung 7117 Stücke: Lieferzeit 10-14 Tag (e) |
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| S32K328GHT1VPCSR | NXP USA Inc. |
Description: IC Packaging: Bulk Package / Case: 172-QFP Exposed Pad Mounting Type: Surface Mount Speed: 240MHz Program Memory Size: 8MB (8M x 8) RAM Size: 1.125M x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 172-QFP-EP Number of I/O: 142 |
Produkt ist nicht verfügbar |
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| LFMAK48GU3U3A | NXP USA Inc. |
Description: QORIVVA MPC5748G NEXUS DEBUG BOA Packaging: Bulk For Use With/Related Products: MPC5748G Type: Debugger Contents: Board(s) |
Produkt ist nicht verfügbar |
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| LFMAK48GU3M | NXP USA Inc. |
Description: QORIVVA MPC5748G NEXUS DEBUG BOA Packaging: Bulk For Use With/Related Products: MPC5748G Type: Debugger Contents: Board(s) |
Produkt ist nicht verfügbar |
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| LFGTWSEM | NXP USA Inc. |
Description: LEAD FREE GATEWAY SYSTEM EVALUAT Packaging: Bulk Mounting Type: Fixed Type: MCU Contents: Board(s) Core Processor: ARM® Cortex®-A53, e200 Utilized IC / Part: LS1043A, MPC5748G |
Produkt ist nicht verfügbar |
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| FXLS90722AESR2 | NXP USA Inc. |
Description: YZ DUAL-AXIS MEDIUM-G INERTIAL Packaging: Tape & Reel (TR) Package / Case: 16-LQFN Exposed Pad Output Type: I2C, SPI Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C Supplier Device Package: 16-HLQFNR (4x4) |
Produkt ist nicht verfügbar |
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PEMI6QFN/WE,132 | NXP USA Inc. |
Description: FILTER RC(PI) 200 OHM/8.5PF SMD Packaging: Bulk Package / Case: 12-XFDFN Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 200Ohms, C = 8.5pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 18dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 200 ESD Protection: Yes Number of Channels: 6 |
auf Bestellung 20000 Stücke: Lieferzeit 10-14 Tag (e) |
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BTA208-800F,127 | NXP USA Inc. |
Description: TRIAC 800V 8A TO220AB Packaging: Bulk Package / Case: TO-220-3 Mounting Type: Through Hole Triac Type: Standard Configuration: Single Operating Temperature: 125°C (TJ) Current - Hold (Ih) (Max): 30 mA Current - Gate Trigger (Igt) (Max): 25 mA Current - Non Rep. Surge 50, 60Hz (Itsm): 65A, 71A Voltage - Gate Trigger (Vgt) (Max): 1.5 V Supplier Device Package: TO-220AB Current - On State (It (RMS)) (Max): 8 A Voltage - Off State: 800 V |
auf Bestellung 39000 Stücke: Lieferzeit 10-14 Tag (e) |
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| LPC5512JBD64Y | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 64TQFP Packaging: Cut Tape (CT) Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 64KB (64K x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 64-HTQFP (10x10) Number of I/O: 36 |
auf Bestellung 1500 Stücke: Lieferzeit 10-14 Tag (e) |
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S912ZVFP64F1VLQ | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12Z Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, LCD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 100 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MKE04Z8VTG4R | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 16TSSOP Packaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 8KB (8K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 6x12b; D/A 2x6b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PWM, WDT Supplier Device Package: 16-TSSOP Number of I/O: 14 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MKE04Z8VTG4R | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 16TSSOP Packaging: Cut Tape (CT) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 8KB (8K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 6x12b; D/A 2x6b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PWM, WDT Supplier Device Package: 16-TSSOP Number of I/O: 14 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PLVA2662A,215 | NXP USA Inc. |
Description: DIODE ZENER DUAL 6.2V TO236AB Packaging: Bulk |
auf Bestellung 13750 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC54101J512UK49Z | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 49WLCSP Packaging: Tape & Reel (TR) Package / Case: 49-UFBGA, WLCSP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 512KB (512K x 8) RAM Size: 104K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 49-WLCSP (3.29x3.29) Number of I/O: 39 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC54101J512UK49Z | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 49WLCSP Packaging: Cut Tape (CT) Package / Case: 49-UFBGA, WLCSP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 512KB (512K x 8) RAM Size: 104K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 49-WLCSP (3.29x3.29) Number of I/O: 39 DigiKey Programmable: Not Verified |
auf Bestellung 140 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC54101J256BD64QL | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 256KB (256K x 8) RAM Size: 104K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 50 DigiKey Programmable: Not Verified |
auf Bestellung 125 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC54101J512BD64QL | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 512KB (512K x 8) RAM Size: 104K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 50 DigiKey Programmable: Not Verified |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC54101J256UK49Z | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 49WLCSP Packaging: Tape & Reel (TR) Package / Case: 49-UFBGA, WLCSP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 256KB (256K x 8) RAM Size: 104K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 49-WLCSP (3.29x3.29) Number of I/O: 39 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC54101J256UK49Z | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 49WLCSP Packaging: Cut Tape (CT) Package / Case: 49-UFBGA, WLCSP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 256KB (256K x 8) RAM Size: 104K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 49-WLCSP (3.29x3.29) Number of I/O: 39 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC54113J128BD64Y | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 128KB (128K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V Connectivity: I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 48 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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74LVC138APW,112 | NXP USA Inc. |
Description: IC 3-8 DECOD/DEMUX INV 16TSSOP Packaging: Bulk |
auf Bestellung 42430 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC138AD,112 | NXP USA Inc. |
Description: IC DECODER/DEMUX 3-8 INV 16SOIC Packaging: Bulk |
auf Bestellung 44022 Stücke: Lieferzeit 10-14 Tag (e) |
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PDTA143EM,315 | NXP USA Inc. |
Description: TRANS PNP W/RES 50V SOT-883 Packaging: Bulk |
auf Bestellung 189945 Stücke: Lieferzeit 10-14 Tag (e) |
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PDTA143XM,315 | NXP USA Inc. |
Description: TRANS PREBIAS PNP 250MW SOT883 Packaging: Bulk |
auf Bestellung 20000 Stücke: Lieferzeit 10-14 Tag (e) |
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SPC5742PK1MLQ8 | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP Packaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 192K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z4 Data Converters: A/D 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 144-LQFP (20x20) DigiKey Programmable: Not Verified |
auf Bestellung 5702 Stücke: Lieferzeit 10-14 Tag (e) |
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BZV55-B5V6,135 | NXP USA Inc. |
Description: DIODE ZENER 5.6V 500MW LLDS Packaging: Bulk |
auf Bestellung 60000 Stücke: Lieferzeit 10-14 Tag (e) |
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| KITPF5103FRDMEVM | NXP USA Inc. |
Description: PF51 EVB FOR INTERNAL USE AND CU Packaging: Bulk |
Produkt ist nicht verfügbar |
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PZU3.3B,115 | NXP USA Inc. |
Description: DIODE ZENER 3.3V 310MW SOD323F Packaging: Bulk |
auf Bestellung 1193547 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC860PVR50D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 357BGA Packaging: Bulk Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
auf Bestellung 450 Stücke: Lieferzeit 10-14 Tag (e) |
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PEMI2STD/RE,115 | NXP USA Inc. |
Description: FILTER RC(PI) 100 OHM/8.5PF SMD Packaging: Tape & Reel (TR) Package / Case: SOT-665 Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 100Ohms, C = 8.5pF (Total) Height: 0.024" (0.60mm) Filter Order: 2nd Applications: Data Lines for Mobile Devices Technology: RC (Pi) Resistance - Channel (Ohms): 100 ESD Protection: Yes Number of Channels: 2 |
Produkt ist nicht verfügbar |
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CBT3244AD,118 | NXP USA Inc. |
Description: IC BUS SWITCH OCTAL 8BIT 20SOIC Packaging: Bulk |
auf Bestellung 4000 Stücke: Lieferzeit 10-14 Tag (e) |
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CBT3244AD,112 | NXP USA Inc. |
Description: IC BUS SWITCH OCT 20-SOIC Packaging: Tube |
auf Bestellung 27744 Stücke: Lieferzeit 10-14 Tag (e) |
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CBT3384D,112 | NXP USA Inc. |
Description: IC BUS SWITCH 10BIT 24SOIC Packaging: Tube |
auf Bestellung 2400 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1054T/N1,518 | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 14SO Packaging: Bulk Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 4.75V ~ 5.25V Number of Drivers/Receivers: 1/1 Protocol: CANbus Supplier Device Package: 14-SO Duplex: Half |
auf Bestellung 13022 Stücke: Lieferzeit 10-14 Tag (e) |
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| AFSC5G35E38-EVB | NXP USA Inc. |
Description: AFSC5G35E38 3400-3700 MHZ REFERE Packaging: Bulk For Use With/Related Products: AFSC5G35E38 Frequency: 3.4GHz ~ 3.6GHz Type: Power Amplifier Supplied Contents: Board(s) |
Produkt ist nicht verfügbar |
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CBTL05023BS,118 | NXP USA Inc. |
Description: DIFFERENTIAL MULTIPLEXER, PQCC24 Packaging: Bulk |
auf Bestellung 150160 Stücke: Lieferzeit 10-14 Tag (e) |
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| S32K358GHT1MJBST | NXP USA Inc. |
Description: S32K MCU M7 240MHZ 8MB HSE-B 289 Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Supplier Device Package: 289-LFBGA (14x14) |
Produkt ist nicht verfügbar |
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| S32K358GHT1MPCST | NXP USA Inc. |
Description: S32K MCU M7 240MHZ 8MB HSE-B 172 Packaging: Tray |
Produkt ist nicht verfügbar |
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| S32K328GHT1VPCST | NXP USA Inc. |
Description: IC Packaging: Bulk Package / Case: 172-QFP Exposed Pad Mounting Type: Surface Mount Speed: 240MHz Program Memory Size: 8MB (8M x 8) RAM Size: 1.125M x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 172-QFP-EP Number of I/O: 142 |
Produkt ist nicht verfügbar |
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| FD32K144HNT0MLHR | NXP USA Inc. |
Description: S32K144 32-BIT MCU, ARM CORTEX-M Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| FD32K144HNT0MLHT | NXP USA Inc. |
Description: S32K144 32-BIT MCU, ARM CORTEX-M Packaging: Tray |
Produkt ist nicht verfügbar |
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BZX884-C5V6,315 | NXP USA Inc. |
Description: NOW NEXPERIA BZX884-C5V6 - ZENER Packaging: Bulk Tolerance: ±5% Package / Case: SOD-882 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 5.6 V Impedance (Max) (Zzt): 40 Ohms Supplier Device Package: DFN1006-2 Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 1 µA @ 2 V |
auf Bestellung 571724 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC2214FBD144/01,5 | NXP USA Inc. |
Description: IC MCU 16/32B 256KB FLSH 144LQFP Packaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 256KB (256K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 8x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 112 DigiKey Programmable: Not Verified |
auf Bestellung 23 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC2214FBD144/01,5 | NXP USA Inc. |
Description: IC MCU 16/32B 256KB FLSH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 256KB (256K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 8x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 112 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MIMXRT1062CVL5BR | NXP USA Inc. |
Description: IC MCU 32BIT 128MB ROM 196LFBGA Packaging: Cut Tape (CT) Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 528MHz Program Memory Size: 128KB (128K x 8) RAM Size: 1M x 8 Operating Temperature: -40°C ~ 105°C (TJ) Oscillator Type: External, Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V, 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Supplier Device Package: 196-MAPBGA (10x10) Number of I/O: 127 |
auf Bestellung 1500 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT1062CVJ5BR | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 196LFBGA Packaging: Cut Tape (CT) Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 528MHz RAM Size: 1M x 8 Operating Temperature: -40°C ~ 105°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Supplier Device Package: 196-LFBGA (12x12) Number of I/O: 127 DigiKey Programmable: Not Verified |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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| LPC1768FET100Y |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 70
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 70
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| LPC1768FET100Y |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Cut Tape (CT)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 70
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Cut Tape (CT)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 70
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| BTA204W-600E,135 |
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Hersteller: NXP USA Inc.
Description: TRIAC SENS GATE 600V 1A SOT223
Packaging: Bulk
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Triac Type: Logic - Sensitive Gate
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 12 mA
Current - Gate Trigger (Igt) (Max): 10 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 10A, 11A
Voltage - Gate Trigger (Vgt) (Max): 1.5 V
Supplier Device Package: SOT-223
Current - On State (It (RMS)) (Max): 1 A
Voltage - Off State: 600 V
Description: TRIAC SENS GATE 600V 1A SOT223
Packaging: Bulk
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Triac Type: Logic - Sensitive Gate
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 12 mA
Current - Gate Trigger (Igt) (Max): 10 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 10A, 11A
Voltage - Gate Trigger (Vgt) (Max): 1.5 V
Supplier Device Package: SOT-223
Current - On State (It (RMS)) (Max): 1 A
Voltage - Off State: 600 V
auf Bestellung 53568 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1302+ | 0.37 EUR |
| SAF4000EL/101Q23DY |
Produkt ist nicht verfügbar
| SAF4000EL/101Q23DK |
Produkt ist nicht verfügbar
| SPC5603BK0CLL4 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 384KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| TJA1028BT/0Z |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-SO
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-SO
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| TJA1028BT/0Z |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-SO
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-SO
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2113 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 9+ | 2.13 EUR |
| 10+ | 1.9 EUR |
| 25+ | 1.81 EUR |
| 100+ | 1.48 EUR |
| 250+ | 1.39 EUR |
| 500+ | 1.22 EUR |
| 1000+ | 0.97 EUR |
| KMI23/2Z |
|
Hersteller: NXP USA Inc.
Description: SENSOR ROTARY PC PIN
Packaging: Tape & Reel (TR)
Package / Case: SOT-477A
Mounting Type: Through Hole
Output: Analog Voltage
Operating Temperature: -40°C ~ 150°C
Termination Style: PC Pin
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Rotary Position
Supplier Device Package: 3-SIP
Output Signal: Clockwise Increase
Grade: Automotive
Qualification: AEC-Q100
Description: SENSOR ROTARY PC PIN
Packaging: Tape & Reel (TR)
Package / Case: SOT-477A
Mounting Type: Through Hole
Output: Analog Voltage
Operating Temperature: -40°C ~ 150°C
Termination Style: PC Pin
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Rotary Position
Supplier Device Package: 3-SIP
Output Signal: Clockwise Increase
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| KMI23/2Z |
|
Hersteller: NXP USA Inc.
Description: SENSOR ROTARY PC PIN
Packaging: Cut Tape (CT)
Package / Case: SOT-477A
Mounting Type: Through Hole
Output: Analog Voltage
Operating Temperature: -40°C ~ 150°C
Termination Style: PC Pin
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Rotary Position
Supplier Device Package: 3-SIP
Output Signal: Clockwise Increase
Grade: Automotive
Qualification: AEC-Q100
Description: SENSOR ROTARY PC PIN
Packaging: Cut Tape (CT)
Package / Case: SOT-477A
Mounting Type: Through Hole
Output: Analog Voltage
Operating Temperature: -40°C ~ 150°C
Termination Style: PC Pin
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Rotary Position
Supplier Device Package: 3-SIP
Output Signal: Clockwise Increase
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 1215 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 5.17 EUR |
| 10+ | 3.88 EUR |
| 25+ | 3.45 EUR |
| 50+ | 3.27 EUR |
| 100+ | 3.19 EUR |
| 500+ | 2.67 EUR |
| SPC5643LAMLQ8 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 32x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.63V
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 32x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.63V
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Produkt ist nicht verfügbar
| SPC5643LAMLQ1R |
Hersteller: NXP USA Inc.
Description: NXP 32-BIT MCU, DUAL POWER ARCH,
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 32x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.63V
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Description: NXP 32-BIT MCU, DUAL POWER ARCH,
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 32x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.63V
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Produkt ist nicht verfügbar
| SPC5643LFAMLL6R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 32x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.63V
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 32x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.63V
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Produkt ist nicht verfügbar
| SPC5643LFAMLL6 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 32x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.63V
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 32x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.63V
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Produkt ist nicht verfügbar
| N74F244N,602 |
|
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-DIP
Description: IC BUFFER NON-INVERT 5.5V 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-DIP
auf Bestellung 7117 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 592+ | 0.84 EUR |
| S32K328GHT1VPCSR |
Hersteller: NXP USA Inc.
Description: IC
Packaging: Bulk
Package / Case: 172-QFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 1.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP-EP
Number of I/O: 142
Description: IC
Packaging: Bulk
Package / Case: 172-QFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 1.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP-EP
Number of I/O: 142
Produkt ist nicht verfügbar
| LFMAK48GU3U3A |
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5748G NEXUS DEBUG BOA
Packaging: Bulk
For Use With/Related Products: MPC5748G
Type: Debugger
Contents: Board(s)
Description: QORIVVA MPC5748G NEXUS DEBUG BOA
Packaging: Bulk
For Use With/Related Products: MPC5748G
Type: Debugger
Contents: Board(s)
Produkt ist nicht verfügbar
| LFMAK48GU3M |
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5748G NEXUS DEBUG BOA
Packaging: Bulk
For Use With/Related Products: MPC5748G
Type: Debugger
Contents: Board(s)
Description: QORIVVA MPC5748G NEXUS DEBUG BOA
Packaging: Bulk
For Use With/Related Products: MPC5748G
Type: Debugger
Contents: Board(s)
Produkt ist nicht verfügbar
| LFGTWSEM |
Hersteller: NXP USA Inc.
Description: LEAD FREE GATEWAY SYSTEM EVALUAT
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53, e200
Utilized IC / Part: LS1043A, MPC5748G
Description: LEAD FREE GATEWAY SYSTEM EVALUAT
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53, e200
Utilized IC / Part: LS1043A, MPC5748G
Produkt ist nicht verfügbar
| FXLS90722AESR2 |
|
Hersteller: NXP USA Inc.
Description: YZ DUAL-AXIS MEDIUM-G INERTIAL
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Description: YZ DUAL-AXIS MEDIUM-G INERTIAL
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Produkt ist nicht verfügbar
| PEMI6QFN/WE,132 |
|
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/8.5PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 8.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 18dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Number of Channels: 6
Description: FILTER RC(PI) 200 OHM/8.5PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 8.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 18dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Number of Channels: 6
auf Bestellung 20000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1902+ | 0.26 EUR |
| BTA208-800F,127 |
|
Hersteller: NXP USA Inc.
Description: TRIAC 800V 8A TO220AB
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Triac Type: Standard
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 30 mA
Current - Gate Trigger (Igt) (Max): 25 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 65A, 71A
Voltage - Gate Trigger (Vgt) (Max): 1.5 V
Supplier Device Package: TO-220AB
Current - On State (It (RMS)) (Max): 8 A
Voltage - Off State: 800 V
Description: TRIAC 800V 8A TO220AB
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Triac Type: Standard
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 30 mA
Current - Gate Trigger (Igt) (Max): 25 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 65A, 71A
Voltage - Gate Trigger (Vgt) (Max): 1.5 V
Supplier Device Package: TO-220AB
Current - On State (It (RMS)) (Max): 8 A
Voltage - Off State: 800 V
auf Bestellung 39000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 787+ | 0.62 EUR |
| LPC5512JBD64Y |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
Description: IC MCU 32BIT 64KB FLASH 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 6.09 EUR |
| 10+ | 5.53 EUR |
| 25+ | 5.41 EUR |
| 50+ | 5.38 EUR |
| 100+ | 4.82 EUR |
| 250+ | 4.8 EUR |
| 500+ | 4.63 EUR |
| S912ZVFP64F1VLQ |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MKE04Z8VTG4R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 6x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 8KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 6x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MKE04Z8VTG4R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 6x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 8KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 6x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| PLVA2662A,215 |
|
auf Bestellung 13750 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3328+ | 0.15 EUR |
| LPC54101J512UK49Z |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 49WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 49-WLCSP (3.29x3.29)
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 49WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 49-WLCSP (3.29x3.29)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| LPC54101J512UK49Z |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 49WLCSP
Packaging: Cut Tape (CT)
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 49-WLCSP (3.29x3.29)
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 49WLCSP
Packaging: Cut Tape (CT)
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 49-WLCSP (3.29x3.29)
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 140 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 15.36 EUR |
| 10+ | 12.07 EUR |
| 100+ | 9.99 EUR |
| LPC54101J256BD64QL |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
auf Bestellung 125 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 15.7 EUR |
| 10+ | 12.33 EUR |
| LPC54101J512BD64QL |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 18.06 EUR |
| LPC54101J256UK49Z |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 49WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 49-WLCSP (3.29x3.29)
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 49WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 49-WLCSP (3.29x3.29)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| LPC54101J256UK49Z |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 49WLCSP
Packaging: Cut Tape (CT)
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 49-WLCSP (3.29x3.29)
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 49WLCSP
Packaging: Cut Tape (CT)
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 49-WLCSP (3.29x3.29)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| LPC54113J128BD64Y |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 48
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 48
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 74LVC138APW,112 |
|
auf Bestellung 42430 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2284+ | 0.21 EUR |
| 74LVC138AD,112 |
|
auf Bestellung 44022 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2125+ | 0.23 EUR |
| PDTA143EM,315 |
|
auf Bestellung 189945 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 11871+ | 0.049 EUR |
| PDTA143XM,315 |
|
auf Bestellung 20000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 11871+ | 0.049 EUR |
| SPC5742PK1MLQ8 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
auf Bestellung 5702 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 23+ | 22.12 EUR |
| BZV55-B5V6,135 |
|
auf Bestellung 60000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 13172+ | 0.033 EUR |
| KITPF5103FRDMEVM |
Produkt ist nicht verfügbar
| PZU3.3B,115 |
|
auf Bestellung 1193547 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 10804+ | 0.049 EUR |
| MPC860PVR50D4 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
auf Bestellung 450 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 362.69 EUR |
| PEMI2STD/RE,115 |
|
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHM/8.5PF SMD
Packaging: Tape & Reel (TR)
Package / Case: SOT-665
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 8.5pF (Total)
Height: 0.024" (0.60mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 2
Description: FILTER RC(PI) 100 OHM/8.5PF SMD
Packaging: Tape & Reel (TR)
Package / Case: SOT-665
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 8.5pF (Total)
Height: 0.024" (0.60mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 2
Produkt ist nicht verfügbar
| CBT3244AD,118 |
|
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1709+ | 0.29 EUR |
| CBT3244AD,112 |
|
auf Bestellung 27744 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1480+ | 0.33 EUR |
| CBT3384D,112 |
|
auf Bestellung 2400 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1110+ | 0.44 EUR |
| TJA1054T/N1,518 |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Duplex: Half
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Duplex: Half
auf Bestellung 13022 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 243+ | 2.02 EUR |
| AFSC5G35E38-EVB |
|
Hersteller: NXP USA Inc.
Description: AFSC5G35E38 3400-3700 MHZ REFERE
Packaging: Bulk
For Use With/Related Products: AFSC5G35E38
Frequency: 3.4GHz ~ 3.6GHz
Type: Power Amplifier
Supplied Contents: Board(s)
Description: AFSC5G35E38 3400-3700 MHZ REFERE
Packaging: Bulk
For Use With/Related Products: AFSC5G35E38
Frequency: 3.4GHz ~ 3.6GHz
Type: Power Amplifier
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
| CBTL05023BS,118 |
|
auf Bestellung 150160 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 147+ | 3.33 EUR |
| S32K358GHT1MJBST |
Hersteller: NXP USA Inc.
Description: S32K MCU M7 240MHZ 8MB HSE-B 289
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 289-LFBGA (14x14)
Description: S32K MCU M7 240MHZ 8MB HSE-B 289
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 289-LFBGA (14x14)
Produkt ist nicht verfügbar
| S32K358GHT1MPCST |
Produkt ist nicht verfügbar
| S32K328GHT1VPCST |
Hersteller: NXP USA Inc.
Description: IC
Packaging: Bulk
Package / Case: 172-QFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 1.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP-EP
Number of I/O: 142
Description: IC
Packaging: Bulk
Package / Case: 172-QFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 1.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP-EP
Number of I/O: 142
Produkt ist nicht verfügbar
| FD32K144HNT0MLHR |
Produkt ist nicht verfügbar
| FD32K144HNT0MLHT |
Produkt ist nicht verfügbar
| BZX884-C5V6,315 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZX884-C5V6 - ZENER
Packaging: Bulk
Tolerance: ±5%
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 40 Ohms
Supplier Device Package: DFN1006-2
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 1 µA @ 2 V
Description: NOW NEXPERIA BZX884-C5V6 - ZENER
Packaging: Bulk
Tolerance: ±5%
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 40 Ohms
Supplier Device Package: DFN1006-2
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 1 µA @ 2 V
auf Bestellung 571724 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 13053+ | 0.033 EUR |
| LPC2214FBD144/01,5 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 256KB FLSH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 112
DigiKey Programmable: Not Verified
Description: IC MCU 16/32B 256KB FLSH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 112
DigiKey Programmable: Not Verified
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 16+ | 30.49 EUR |
| LPC2214FBD144/01,5 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 256KB FLSH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 112
DigiKey Programmable: Not Verified
Description: IC MCU 16/32B 256KB FLSH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 112
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MIMXRT1062CVL5BR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128MB ROM 196LFBGA
Packaging: Cut Tape (CT)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Number of I/O: 127
Description: IC MCU 32BIT 128MB ROM 196LFBGA
Packaging: Cut Tape (CT)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Number of I/O: 127
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 20.7 EUR |
| 10+ | 19.17 EUR |
| 25+ | 18.73 EUR |
| 50+ | 18.63 EUR |
| 100+ | 16.4 EUR |
| 250+ | 15.59 EUR |
| 500+ | 15.43 EUR |
| MIMXRT1062CVJ5BR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196LFBGA
Packaging: Cut Tape (CT)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 196LFBGA
Packaging: Cut Tape (CT)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 28.76 EUR |
| 10+ | 22.98 EUR |
| 100+ | 19.41 EUR |
| 500+ | 19.29 EUR |