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MCIMX516AJM6C MCIMX516AJM6C NXP USA Inc. IMX51AEC.pdf Description: IC MPU I.MX51 600MHZ 529BGA
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR, DDR2
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-BGA (19x19)
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 600MHz
Mounting Type: Surface Mount
Package / Case: 529-LFBGA
Packaging: Tray
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MCIMX516AJM6CR2 MCIMX516AJM6CR2 NXP USA Inc. IMX51AEC.pdf Description: IC MPU I.MX51 600MHZ 529BGA
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR, DDR2
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-BGA (19x19)
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 600MHz
Mounting Type: Surface Mount
Package / Case: 529-LFBGA
Packaging: Tape & Reel (TR)
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MCIMX516AJM6CR2 MCIMX516AJM6CR2 NXP USA Inc. IMX51AEC.pdf Description: IC MPU I.MX51 600MHZ 529BGA
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR, DDR2
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-BGA (19x19)
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 600MHz
Mounting Type: Surface Mount
Package / Case: 529-LFBGA
Packaging: Bulk
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88Q9098-A2-NYGA/AK 88Q9098-A2-NYGA/AK NXP USA Inc. 2-4-5-ghz-dual-band-2x2-wi-fi-6-802-11ax-plus-bluetooth-5-3-automotive-solution:88Q9098 Description: 88Q9098-A2-NYGA/AK
Packaging: Bulk
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SE051A2HQ1/Z01XEZ SE051A2HQ1/Z01XEZ NXP USA Inc. AN13013.pdf Description: SE051A2HQ1
Packaging: Tape & Reel (TR)
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S912ZVMAL1F0WLF S912ZVMAL1F0WLF NXP USA Inc. S12ZVMAFS.pdf Description: S912ZVMAL1F0WLF
Qualification: AEC-Q100
Number of I/O: 31
Grade: Automotive
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, POR, PWM, WDT
Connectivity: LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.5V ~ 20V
Core Size: 16-Bit
Data Converters: A/D 7x12b SAR
Core Processor: S12Z
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
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PESD5V0V1USF,315 PESD5V0V1USF,315 NXP USA Inc. PHGLS25492-1.pdf?t.download=true&u=5oefqw Description: TVS DIODE 5VWM DSN0603-2
Power Line Protection: No
Voltage - Breakdown (Min): 6V
Unidirectional Channels: 1
Supplier Device Package: DSN0603-2
Voltage - Reverse Standoff (Typ): 5V (Max)
Capacitance @ Frequency: 4pF @ 1MHz
Applications: Telecom
Operating Temperature: -55°C ~ 150°C (TA)
Type: Zener
Mounting Type: Surface Mount
Package / Case: 0201 (0603 Metric)
Packaging: Bulk
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MC908MR32VFUE MC908MR32VFUE NXP USA Inc. MC68HC908MR8.pdf Description: IC MCU 8BIT 32KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 44
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x10b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 768 x 8
Program Memory Size: 32KB (32K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tray
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S32M24XEVB-L064 S32M24XEVB-L064 NXP USA Inc. S32M24xEVB-L064.pdf Description: S32M24XEVB-L064
Embedded: Yes, MCU, 32-Bit
Primary Attributes: Motors (BLDC, PMSM)
Utilized IC / Part: S32M24X
Contents: Board(s)
Type: Power Management
Function: Motor Controller/Driver
Packaging: Bulk
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FRDM-MCXN236 FRDM-MCXN236 NXP USA Inc. Description: FREEDOM MCXN236 EVAL BRD
Platform: Freedom
Utilized IC / Part: MCXN236
Core Processor: ARM® Cortex®-M33
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
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MK51DX128CMC7 MK51DX128CMC7 NXP USA Inc. K51P100M72SF1.pdf Description: IC MCU 32B 128KB FLASH 121MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 61
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 35x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tray
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MK21DX128VMC5 MK21DX128VMC5 NXP USA Inc. K20P121M100SF2.pdf Description: IC MCU 32B 128KB FLASH 121MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 64
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tray
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MK21DX128VMC5 MK21DX128VMC5 NXP USA Inc. K20P121M100SF2.pdf Description: IC MCU 32B 128KB FLASH 121MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 64
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tray
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MK40DX128VMC7 MK40DX128VMC7 NXP USA Inc. KNTSK40FMLYFS.pdf Description: IC MCU 32B 128KB FLASH 121MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 74
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 34x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tray
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MK51DX128CLK7 MK51DX128CLK7 NXP USA Inc. K51P81M72SF1.pdf Description: IC MCU 32BIT 128KB FLASH 80FQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 80-FQFP (12x12)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 30x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
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MK20DX128VFT5 MK20DX128VFT5 NXP USA Inc. K20P48M50SF0.pdf Description: IC MCU 32BIT 128KB FLASH 48QFN
DigiKey Programmable: Not Verified
Number of I/O: 29
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 11x16b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
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MK40DX128VLK7 MK40DX128VLK7 NXP USA Inc. K40P81M72SF1.pdf Description: IC MCU 32BIT 128KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 52
DigiKey Programmable: Not Verified
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TEA19051BARTK/1J NXP USA Inc. TEA19051BTK.pdf Description: SMARTCHARG PROTOC CONTR QC4
Packaging: Bulk
DigiKey Programmable: Not Verified
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P1011NXN2HFB P1011NXN2HFB NXP USA Inc. QorIQ_P1.pdf Description: IC MPU QORIQ P1 800MHZ PBGA689
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 689-TEPBGA II (31x31)
Core Processor: PowerPC e500v2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
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P1010NXN5HFB P1010NXN5HFB NXP USA Inc. QP1010FS.pdf Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGA
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI
SATA: SATA 3Gbps (2)
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 425-TEPBGA I (19x19)
Core Processor: PowerPC e500v2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 425-FBGA
Packaging: Tray
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MF4SAM3X84/9BA6AAJ NXP USA Inc. Description: MIFARE SAM AV3
Supplier Device Package: PCM1.1
Standards: ISO 7816, Mifare
Voltage - Supply: 1.62V ~ 1.98V, 2.7V ~ 3.3V, 4.5V ~ 5.5V
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Interface: I2C, UART
Mounting Type: Surface Mount
Package / Case: Module
Packaging: Bulk
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MCIMX507CVM1B MCIMX507CVM1B NXP USA Inc. IMX50CEC.pdf Description: IC MPU I.MX50 800MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, LPDDR2, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: LCD
Security Features: Boot Security, Cryptography, Secure JTAG
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
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BTA202X-600D,127 NXP USA Inc. BTA202X-600D_127.pdf Description: TRIAC SENS GATE 600V 2A TO220-3
Voltage - Off State: 600 V
Current - On State (It (RMS)) (Max): 2 A
Supplier Device Package: TO-220F
Voltage - Gate Trigger (Vgt) (Max): 1.5 V
Current - Non Rep. Surge 50, 60Hz (Itsm): 14A, 15.4A
Current - Gate Trigger (Igt) (Max): 5 mA
Current - Hold (Ih) (Max): 5 mA
Operating Temperature: 125°C (TJ)
Configuration: Single
Triac Type: Logic - Sensitive Gate
Mounting Type: Through Hole
Package / Case: TO-220-3 Full Pack, Isolated Tab
Packaging: Bulk
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S912XEG256BVAL S912XEG256BVAL NXP USA Inc. Description: IC MCU 16BIT 256KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
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NXH2004UK/A2Z NXP USA Inc. Description: NXH2004UK/A2Z
Packaging: Bulk
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S912ZVC19F1WLFR S912ZVC19F1WLFR NXP USA Inc. Description: S12Z, 48LQFP, 192K FLASH
Number of I/O: 28
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x10b SAR
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 12K x 8
Program Memory Size: 192KB (192K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
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S912ZVC19F1WLF S912ZVC19F1WLF NXP USA Inc. Description: S12Z, 48LQFP, 192K FLASH
Number of I/O: 28
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x10b SAR
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 12K x 8
Program Memory Size: 192KB (192K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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S912ZVCA19F1WLF S912ZVCA19F1WLF NXP USA Inc. Description: S12Z, 48LQFP, 192K FLASH
Number of I/O: 28
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x12b SAR; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 12K x 8
Program Memory Size: 192KB (192K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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KIT-UCANS32K1SCT NXP USA Inc. getting-started-with-the-ucans32k1sct-evaluation-board:GS-UCANS32K1SCT Description: EVAL BOARD FOR TJA1153A
Embedded: Yes, MCU, 32-Bit
Utilized IC / Part: TJA1153A
Contents: Board(s), Cable(s)
Type: Interface
Function: CAN Transceiver
Packaging: Bulk
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74AUP2G3407GMH 74AUP2G3407GMH NXP USA Inc. PHGLS28868-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 3.6V 6-XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA; 4mA, 4mA
Supplier Device Package: 6-XSON (1.45x1)
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S9S12G64ACLHR S9S12G64ACLHR NXP USA Inc. S12G%20Family%20Fact%20Sheet.pdf Description: IC MCU 16BIT 64KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
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S9S12G48AMLHR S9S12G48AMLHR NXP USA Inc. S12G%20Family%20Fact%20Sheet.pdf Description: IC MCU 16BIT 48KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 1.5K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
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S9S12G64ACLH S9S12G64ACLH NXP USA Inc. Description: IC MCU 16BIT 64KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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S9S12G48AMLH S9S12G48AMLH NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
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NCF29AGVHNF/0500ZY NXP USA Inc. Description: NCF29AGVHNF/0500ZY
Packaging: Tape & Reel (TR)
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NCF29AGXHN4/0500ZY NXP USA Inc. Description: NCF29AGXHN4/0500ZY
Packaging: Tape & Reel (TR)
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S9S12GN16J0MLFR NXP USA Inc. Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
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S9S12GN16J0MLF NXP USA Inc. Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
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S9S12G64J1VLC NXP USA Inc. Description: IC MCU 16BIT 64KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
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S9S12G64J1MLC NXP USA Inc. Description: IC MCU 16BIT 64KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
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BFU768F,115 BFU768F,115 NXP USA Inc. BFU768F.pdf Description: RF TRANS NPN 2.8V 70MA 4DFP
Packaging: Tape & Reel (TR)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13.1dB
Power - Max: 220mW
Current - Collector (Ic) (Max): 70mA
Voltage - Collector Emitter Breakdown (Max): 2.8V
DC Current Gain (hFE) (Min) @ Ic, Vce: 155 @ 10mA, 2V
Noise Figure (dB Typ @ f): 1.1dB @ 2.4GHz
Supplier Device Package: 4-DFP
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BFU768F,115 BFU768F,115 NXP USA Inc. BFU768F.pdf Description: RF TRANS NPN 2.8V 70MA 4DFP
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13.1dB
Power - Max: 220mW
Current - Collector (Ic) (Max): 70mA
Voltage - Collector Emitter Breakdown (Max): 2.8V
DC Current Gain (hFE) (Min) @ Ic, Vce: 155 @ 10mA, 2V
Noise Figure (dB Typ @ f): 1.1dB @ 2.4GHz
Supplier Device Package: 4-DFP
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BFU520XRR BFU520XRR NXP USA Inc. BFU520XR.pdf Description: RF TRANS NPN 12V 10.5GHZ SOT143R
Qualification: AEC-Q101
Grade: Automotive
Supplier Device Package: SOT-143R
Noise Figure (dB Typ @ f): 0.65dB @ 900MHz
Frequency - Transition: 10.5GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 8V
Voltage - Collector Emitter Breakdown (Max): 12V
Current - Collector (Ic) (Max): 30mA
Power - Max: 450mW
Gain: 20dB
Operating Temperature: -40°C ~ 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SOT-143R
Packaging: Tape & Reel (TR)
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BFU520XRR BFU520XRR NXP USA Inc. BFU520XR.pdf Description: RF TRANS NPN 12V 10.5GHZ SOT143R
Packaging: Cut Tape (CT)
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 20dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 30mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 8V
Frequency - Transition: 10.5GHz
Noise Figure (dB Typ @ f): 0.65dB @ 900MHz
Supplier Device Package: SOT-143R
Grade: Automotive
Qualification: AEC-Q101
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SA56004AD,112 SA56004AD,112 NXP USA Inc. SA56004X.pdf Description: SENSOR DIGITAL -40C-125C 8SO
Sensing Temperature - Remote: -40°C ~ 125°C
Sensing Temperature - Local: -40°C ~ 125°C
Accuracy - Highest (Lowest): ±2°C (±3°C)
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Supplier Device Package: 8-SO
Resolution: 10 b
Sensor Type: Digital, Local/Remote
Voltage - Supply: 3V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Output Type: I2C/SMBus
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Features: Output Switch, Programmable Limit
Packaging: Tube
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PDTC144VM,315 PDTC144VM,315 NXP USA Inc. PDTC144V_SER.pdf Description: TRANS PREBIAS NPN 250MW SOT883
Packaging: Bulk
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MCIMX6X1CVO08AC NXP USA Inc. IMX6SXIEC.pdf Description: IC MPU I.MX6SX 800MHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz, 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
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MCIMX6X3CVO08AB MCIMX6X3CVO08AB NXP USA Inc. DWF13_AMF_CON_T0060.pdf Description: IC MPU I.MX6SX 800MHZ 400MAPBGA
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (17x17)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 200MHz, 800MHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tray
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MMA2204KEGR2 NXP USA Inc. MMA2204KEG.pdf Description: ACCEL 112.5G ANALOG 16SOIC
Qualification: AEC-Q100
Grade: Automotive
Sensitivity (mV/g): 20
Supplier Device Package: 16-SOIC
Bandwidth: 400Hz
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 125°C
Acceleration Range: ±112.5g
Axis: X
Type: Analog
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
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74LVC2G02GD,125 74LVC2G02GD,125 NXP USA Inc. 74LVC2G02.pdf Description: IC GATE NOR 2CH 2-INP 8-XSON
Packaging: Bulk
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NVT4557UKAZ NVT4557UKAZ NXP USA Inc. NVT4557.pdf Description: IC XLTR VL BIDIR 9-WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 9-XFBGA, WLCSP
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 10MHz
Supplier Device Package: 9-WLCSP (0.92x0.92)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.08 V ~ 1.95 V
Voltage - VCCB: 1.65 V ~ 3.6 V
Number of Circuits: 1
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NVT4557UKAZ NVT4557UKAZ NXP USA Inc. NVT4557.pdf Description: IC XLTR VL BIDIR 9-WLCSP
Packaging: Cut Tape (CT)
Package / Case: 9-XFBGA, WLCSP
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 10MHz
Supplier Device Package: 9-WLCSP (0.92x0.92)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.08 V ~ 1.95 V
Voltage - VCCB: 1.65 V ~ 3.6 V
Number of Circuits: 1
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S908QB4E0CDTE S908QB4E0CDTE NXP USA Inc. Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: LINbus, SCI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
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SAF4000EL/102Z52AK NXP USA Inc. Description: SAF4000EL
Packaging: Tray
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SAF4001EL/101Z305Y NXP USA Inc. Description: SAF4001EL
Packaging: Tape & Reel (TR)
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SAF4001EL/101Z305K NXP USA Inc. Description: SAF4001EL
Packaging: Tray
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MPF5302AMMA0ES NXP USA Inc. PF5300_SDS.pdf Description: IC REG BUCK ADJ 15A 24HWQFN
Voltage - Output (Min/Fixed): 0.5V
Voltage - Input (Min): 2.7V
Voltage - Output (Max): 1.2V
Synchronous Rectifier: No
Supplier Device Package: 24-HWQFN (4.5x3.5)
Topology: Buck
Voltage - Input (Max): 5.5V
Frequency - Switching: 2MHz ~ 3MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C (TA)
Current - Output: 15A
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount, Wettable Flank
Output Type: Adjustable
Package / Case: 24-PowerWFQFN
Packaging: Tray
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MC35FS6513NAE MC35FS6513NAE NXP USA Inc. FS6500-FS4500-ASILD.pdf Description: FS6500
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
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100+11.4 EUR
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J3R150P1U15/0ZA2AV NXP USA Inc. Description: J3R150P1U15
Packaging: Tray
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J3R150P1U15/0ZA2BV NXP USA Inc. Description: J3R150P1U15
Packaging: Tray
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MCIMX516AJM6C IMX51AEC.pdf
MCIMX516AJM6C
Hersteller: NXP USA Inc.
Description: IC MPU I.MX51 600MHZ 529BGA
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR, DDR2
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-BGA (19x19)
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 600MHz
Mounting Type: Surface Mount
Package / Case: 529-LFBGA
Packaging: Tray
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MCIMX516AJM6CR2 IMX51AEC.pdf
MCIMX516AJM6CR2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX51 600MHZ 529BGA
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR, DDR2
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-BGA (19x19)
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 600MHz
Mounting Type: Surface Mount
Package / Case: 529-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCIMX516AJM6CR2 IMX51AEC.pdf
MCIMX516AJM6CR2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX51 600MHZ 529BGA
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR, DDR2
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-BGA (19x19)
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 600MHz
Mounting Type: Surface Mount
Package / Case: 529-LFBGA
Packaging: Bulk
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5+88.06 EUR
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88Q9098-A2-NYGA/AK 2-4-5-ghz-dual-band-2x2-wi-fi-6-802-11ax-plus-bluetooth-5-3-automotive-solution:88Q9098
88Q9098-A2-NYGA/AK
Hersteller: NXP USA Inc.
Description: 88Q9098-A2-NYGA/AK
Packaging: Bulk
Produkt ist nicht verfügbar
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SE051A2HQ1/Z01XEZ AN13013.pdf
SE051A2HQ1/Z01XEZ
Hersteller: NXP USA Inc.
Description: SE051A2HQ1
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S912ZVMAL1F0WLF S12ZVMAFS.pdf
S912ZVMAL1F0WLF
Hersteller: NXP USA Inc.
Description: S912ZVMAL1F0WLF
Qualification: AEC-Q100
Number of I/O: 31
Grade: Automotive
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, POR, PWM, WDT
Connectivity: LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.5V ~ 20V
Core Size: 16-Bit
Data Converters: A/D 7x12b SAR
Core Processor: S12Z
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PESD5V0V1USF,315 PHGLS25492-1.pdf?t.download=true&u=5oefqw
PESD5V0V1USF,315
Hersteller: NXP USA Inc.
Description: TVS DIODE 5VWM DSN0603-2
Power Line Protection: No
Voltage - Breakdown (Min): 6V
Unidirectional Channels: 1
Supplier Device Package: DSN0603-2
Voltage - Reverse Standoff (Typ): 5V (Max)
Capacitance @ Frequency: 4pF @ 1MHz
Applications: Telecom
Operating Temperature: -55°C ~ 150°C (TA)
Type: Zener
Mounting Type: Surface Mount
Package / Case: 0201 (0603 Metric)
Packaging: Bulk
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MC908MR32VFUE MC68HC908MR8.pdf
MC908MR32VFUE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 44
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x10b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 768 x 8
Program Memory Size: 32KB (32K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tray
Produkt ist nicht verfügbar
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S32M24XEVB-L064 S32M24xEVB-L064.pdf
S32M24XEVB-L064
Hersteller: NXP USA Inc.
Description: S32M24XEVB-L064
Embedded: Yes, MCU, 32-Bit
Primary Attributes: Motors (BLDC, PMSM)
Utilized IC / Part: S32M24X
Contents: Board(s)
Type: Power Management
Function: Motor Controller/Driver
Packaging: Bulk
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1+317.2 EUR
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FRDM-MCXN236
FRDM-MCXN236
Hersteller: NXP USA Inc.
Description: FREEDOM MCXN236 EVAL BRD
Platform: Freedom
Utilized IC / Part: MCXN236
Core Processor: ARM® Cortex®-M33
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
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MK51DX128CMC7 K51P100M72SF1.pdf
MK51DX128CMC7
Hersteller: NXP USA Inc.
Description: IC MCU 32B 128KB FLASH 121MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 61
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 35x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MK21DX128VMC5 K20P121M100SF2.pdf
MK21DX128VMC5
Hersteller: NXP USA Inc.
Description: IC MCU 32B 128KB FLASH 121MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 64
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tray
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53+9.53 EUR
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MK21DX128VMC5 K20P121M100SF2.pdf
MK21DX128VMC5
Hersteller: NXP USA Inc.
Description: IC MCU 32B 128KB FLASH 121MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 64
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MK40DX128VMC7 KNTSK40FMLYFS.pdf
MK40DX128VMC7
Hersteller: NXP USA Inc.
Description: IC MCU 32B 128KB FLASH 121MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 74
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 34x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MK51DX128CLK7 K51P81M72SF1.pdf
MK51DX128CLK7
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80FQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 80-FQFP (12x12)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 30x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
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AnzahlPreis
2+12.92 EUR
10+9.99 EUR
25+9.26 EUR
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MK20DX128VFT5 K20P48M50SF0.pdf
MK20DX128VFT5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48QFN
DigiKey Programmable: Not Verified
Number of I/O: 29
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 11x16b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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MK40DX128VLK7 K40P81M72SF1.pdf
MK40DX128VLK7
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA19051BARTK/1J TEA19051BTK.pdf
Hersteller: NXP USA Inc.
Description: SMARTCHARG PROTOC CONTR QC4
Packaging: Bulk
DigiKey Programmable: Not Verified
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190+2.36 EUR
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P1011NXN2HFB QorIQ_P1.pdf
P1011NXN2HFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 800MHZ PBGA689
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 689-TEPBGA II (31x31)
Core Processor: PowerPC e500v2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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P1010NXN5HFB QP1010FS.pdf
P1010NXN5HFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGA
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI
SATA: SATA 3Gbps (2)
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 425-TEPBGA I (19x19)
Core Processor: PowerPC e500v2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 425-FBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MF4SAM3X84/9BA6AAJ
Hersteller: NXP USA Inc.
Description: MIFARE SAM AV3
Supplier Device Package: PCM1.1
Standards: ISO 7816, Mifare
Voltage - Supply: 1.62V ~ 1.98V, 2.7V ~ 3.3V, 4.5V ~ 5.5V
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Interface: I2C, UART
Mounting Type: Surface Mount
Package / Case: Module
Packaging: Bulk
Produkt ist nicht verfügbar
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MCIMX507CVM1B IMX50CEC.pdf
MCIMX507CVM1B
Hersteller: NXP USA Inc.
Description: IC MPU I.MX50 800MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, LPDDR2, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: LCD
Security Features: Boot Security, Cryptography, Secure JTAG
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Produkt ist nicht verfügbar
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BTA202X-600D,127 BTA202X-600D_127.pdf
Hersteller: NXP USA Inc.
Description: TRIAC SENS GATE 600V 2A TO220-3
Voltage - Off State: 600 V
Current - On State (It (RMS)) (Max): 2 A
Supplier Device Package: TO-220F
Voltage - Gate Trigger (Vgt) (Max): 1.5 V
Current - Non Rep. Surge 50, 60Hz (Itsm): 14A, 15.4A
Current - Gate Trigger (Igt) (Max): 5 mA
Current - Hold (Ih) (Max): 5 mA
Operating Temperature: 125°C (TJ)
Configuration: Single
Triac Type: Logic - Sensitive Gate
Mounting Type: Through Hole
Package / Case: TO-220-3 Full Pack, Isolated Tab
Packaging: Bulk
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943+0.52 EUR
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S912XEG256BVAL
S912XEG256BVAL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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NXH2004UK/A2Z
Hersteller: NXP USA Inc.
Description: NXH2004UK/A2Z
Packaging: Bulk
Produkt ist nicht verfügbar
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S912ZVC19F1WLFR
S912ZVC19F1WLFR
Hersteller: NXP USA Inc.
Description: S12Z, 48LQFP, 192K FLASH
Number of I/O: 28
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x10b SAR
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 12K x 8
Program Memory Size: 192KB (192K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S912ZVC19F1WLF
S912ZVC19F1WLF
Hersteller: NXP USA Inc.
Description: S12Z, 48LQFP, 192K FLASH
Number of I/O: 28
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x10b SAR
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 12K x 8
Program Memory Size: 192KB (192K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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S912ZVCA19F1WLF
S912ZVCA19F1WLF
Hersteller: NXP USA Inc.
Description: S12Z, 48LQFP, 192K FLASH
Number of I/O: 28
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x12b SAR; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 12K x 8
Program Memory Size: 192KB (192K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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KIT-UCANS32K1SCT getting-started-with-the-ucans32k1sct-evaluation-board:GS-UCANS32K1SCT
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR TJA1153A
Embedded: Yes, MCU, 32-Bit
Utilized IC / Part: TJA1153A
Contents: Board(s), Cable(s)
Type: Interface
Function: CAN Transceiver
Packaging: Bulk
Produkt ist nicht verfügbar
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74AUP2G3407GMH PHGLS28868-1.pdf?t.download=true&u=5oefqw
74AUP2G3407GMH
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 6-XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA; 4mA, 4mA
Supplier Device Package: 6-XSON (1.45x1)
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678+0.66 EUR
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S9S12G64ACLHR S12G%20Family%20Fact%20Sheet.pdf
S9S12G64ACLHR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S9S12G48AMLHR S12G%20Family%20Fact%20Sheet.pdf
S9S12G48AMLHR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 1.5K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S9S12G64ACLH
S9S12G64ACLH
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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S9S12G48AMLH
S9S12G48AMLH
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NCF29AGVHNF/0500ZY
Hersteller: NXP USA Inc.
Description: NCF29AGVHNF/0500ZY
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NCF29AGXHN4/0500ZY
Hersteller: NXP USA Inc.
Description: NCF29AGXHN4/0500ZY
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S9S12GN16J0MLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
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S9S12GN16J0MLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
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S9S12G64J1VLC
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
Produkt ist nicht verfügbar
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S9S12G64J1MLC
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
Produkt ist nicht verfügbar
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BFU768F,115 BFU768F.pdf
BFU768F,115
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 2.8V 70MA 4DFP
Packaging: Tape & Reel (TR)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13.1dB
Power - Max: 220mW
Current - Collector (Ic) (Max): 70mA
Voltage - Collector Emitter Breakdown (Max): 2.8V
DC Current Gain (hFE) (Min) @ Ic, Vce: 155 @ 10mA, 2V
Noise Figure (dB Typ @ f): 1.1dB @ 2.4GHz
Supplier Device Package: 4-DFP
Produkt ist nicht verfügbar
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BFU768F,115 BFU768F.pdf
BFU768F,115
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 2.8V 70MA 4DFP
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13.1dB
Power - Max: 220mW
Current - Collector (Ic) (Max): 70mA
Voltage - Collector Emitter Breakdown (Max): 2.8V
DC Current Gain (hFE) (Min) @ Ic, Vce: 155 @ 10mA, 2V
Noise Figure (dB Typ @ f): 1.1dB @ 2.4GHz
Supplier Device Package: 4-DFP
auf Bestellung 268 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
14+1.3 EUR
22+0.81 EUR
100+0.52 EUR
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BFU520XRR BFU520XR.pdf
BFU520XRR
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 12V 10.5GHZ SOT143R
Qualification: AEC-Q101
Grade: Automotive
Supplier Device Package: SOT-143R
Noise Figure (dB Typ @ f): 0.65dB @ 900MHz
Frequency - Transition: 10.5GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 8V
Voltage - Collector Emitter Breakdown (Max): 12V
Current - Collector (Ic) (Max): 30mA
Power - Max: 450mW
Gain: 20dB
Operating Temperature: -40°C ~ 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SOT-143R
Packaging: Tape & Reel (TR)
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3000+0.18 EUR
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BFU520XRR BFU520XR.pdf
BFU520XRR
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 12V 10.5GHZ SOT143R
Packaging: Cut Tape (CT)
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 20dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 30mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 8V
Frequency - Transition: 10.5GHz
Noise Figure (dB Typ @ f): 0.65dB @ 900MHz
Supplier Device Package: SOT-143R
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 5924 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
40+0.44 EUR
58+0.3 EUR
66+0.27 EUR
100+0.23 EUR
250+0.21 EUR
500+0.2 EUR
1000+0.19 EUR
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SA56004AD,112 SA56004X.pdf
SA56004AD,112
Hersteller: NXP USA Inc.
Description: SENSOR DIGITAL -40C-125C 8SO
Sensing Temperature - Remote: -40°C ~ 125°C
Sensing Temperature - Local: -40°C ~ 125°C
Accuracy - Highest (Lowest): ±2°C (±3°C)
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Supplier Device Package: 8-SO
Resolution: 10 b
Sensor Type: Digital, Local/Remote
Voltage - Supply: 3V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Output Type: I2C/SMBus
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Features: Output Switch, Programmable Limit
Packaging: Tube
Produkt ist nicht verfügbar
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PDTC144VM,315 PDTC144V_SER.pdf
PDTC144VM,315
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS NPN 250MW SOT883
Packaging: Bulk
auf Bestellung 80000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
11871+0.051 EUR
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MCIMX6X1CVO08AC IMX6SXIEC.pdf
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SX 800MHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz, 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX6X3CVO08AB DWF13_AMF_CON_T0060.pdf
MCIMX6X3CVO08AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SX 800MHZ 400MAPBGA
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (17x17)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 200MHz, 800MHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MMA2204KEGR2 MMA2204KEG.pdf
Hersteller: NXP USA Inc.
Description: ACCEL 112.5G ANALOG 16SOIC
Qualification: AEC-Q100
Grade: Automotive
Sensitivity (mV/g): 20
Supplier Device Package: 16-SOIC
Bandwidth: 400Hz
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 125°C
Acceleration Range: ±112.5g
Axis: X
Type: Analog
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74LVC2G02GD,125 74LVC2G02.pdf
74LVC2G02GD,125
Hersteller: NXP USA Inc.
Description: IC GATE NOR 2CH 2-INP 8-XSON
Packaging: Bulk
auf Bestellung 130528 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2049+0.25 EUR
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NVT4557UKAZ NVT4557.pdf
NVT4557UKAZ
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 9-WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 9-XFBGA, WLCSP
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 10MHz
Supplier Device Package: 9-WLCSP (0.92x0.92)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.08 V ~ 1.95 V
Voltage - VCCB: 1.65 V ~ 3.6 V
Number of Circuits: 1
Produkt ist nicht verfügbar
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NVT4557UKAZ NVT4557.pdf
NVT4557UKAZ
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 9-WLCSP
Packaging: Cut Tape (CT)
Package / Case: 9-XFBGA, WLCSP
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 10MHz
Supplier Device Package: 9-WLCSP (0.92x0.92)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.08 V ~ 1.95 V
Voltage - VCCB: 1.65 V ~ 3.6 V
Number of Circuits: 1
auf Bestellung 6370 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
13+1.41 EUR
18+1 EUR
25+0.91 EUR
100+0.8 EUR
250+0.74 EUR
500+0.71 EUR
1000+0.69 EUR
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S908QB4E0CDTE
S908QB4E0CDTE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: LINbus, SCI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAF4000EL/102Z52AK
Hersteller: NXP USA Inc.
Description: SAF4000EL
Packaging: Tray
Produkt ist nicht verfügbar
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SAF4001EL/101Z305Y
Hersteller: NXP USA Inc.
Description: SAF4001EL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SAF4001EL/101Z305K
Hersteller: NXP USA Inc.
Description: SAF4001EL
Packaging: Tray
Produkt ist nicht verfügbar
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MPF5302AMMA0ES PF5300_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC REG BUCK ADJ 15A 24HWQFN
Voltage - Output (Min/Fixed): 0.5V
Voltage - Input (Min): 2.7V
Voltage - Output (Max): 1.2V
Synchronous Rectifier: No
Supplier Device Package: 24-HWQFN (4.5x3.5)
Topology: Buck
Voltage - Input (Max): 5.5V
Frequency - Switching: 2MHz ~ 3MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C (TA)
Current - Output: 15A
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount, Wettable Flank
Output Type: Adjustable
Package / Case: 24-PowerWFQFN
Packaging: Tray
Produkt ist nicht verfügbar
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MC35FS6513NAE FS6500-FS4500-ASILD.pdf
MC35FS6513NAE
Hersteller: NXP USA Inc.
Description: FS6500
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+17.02 EUR
10+13.33 EUR
25+12.41 EUR
100+11.4 EUR
250+10.91 EUR
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J3R150P1U15/0ZA2AV
Hersteller: NXP USA Inc.
Description: J3R150P1U15
Packaging: Tray
Produkt ist nicht verfügbar
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J3R150P1U15/0ZA2BV
Hersteller: NXP USA Inc.
Description: J3R150P1U15
Packaging: Tray
Produkt ist nicht verfügbar
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