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Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37

Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37

Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37

Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37

Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37

Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37

Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37

Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37

Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 500MHZ 457TEPBGA
Packaging: Tray
Package / Case: 457-FBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 457-TEPBGA-1 (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.2
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, SPI

Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100

Hersteller: NXP USA Inc.
Description: IC AUDIO SWITCH 1-CH 9-WLCSP
Packaging: Bulk
Package / Case: 9-UFBGA, WLCSP
Mounting Type: Surface Mount
Function: Audio Switch
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.6V ~ 3.6V
Applications: Consumer Audio
Supplier Device Package: 9-WLCSP (1.22x1.22)
Number of Channels: 1

Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 533MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI

Hersteller: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half

Hersteller: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half

Hersteller: NXP USA Inc.
Description: IC TXRX 14-SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 50 mV
Duplex: Half

Hersteller: NXP USA Inc.
Description: IC TXRX 14-SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 50 mV
Duplex: Half

Hersteller: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Tape & Reel (TR)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half

Hersteller: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Cut Tape (CT)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half

Hersteller: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Tape & Reel (TR)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100

Hersteller: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Cut Tape (CT)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100

Hersteller: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Tape & Reel (TR)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100

Hersteller: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Cut Tape (CT)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100

Hersteller: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Tape & Reel (TR)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100

Hersteller: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Cut Tape (CT)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100

Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100

Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16HVQFN
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-HVQFN (3x3)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16HVQFN
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-HVQFN (3x3)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16HVQFN
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-HVQFN (3x3)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: MIFAREA PLUS EV2
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: PLLMC

Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2V 300MA 5-TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 2V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.2V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA

Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 32K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V4E
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.43V ~ 1.58V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 99
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR MC33772, MC33774
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC33772, MC33774
Embedded: Yes, MCU

Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR MC33772, MC33774
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC33772, MC33774
Embedded: Yes, MCU

Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR FS26
Packaging: Box
Function: Battery Charger
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: FS26, MC33772C, S32K344
Embedded: Yes, MCU

Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR MC33772, MC33774
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC33772, MC33774
Embedded: Yes, MCU

Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR MC33772, MC33774
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC33772, MC33774
Embedded: Yes, MCU

Hersteller: NXP USA Inc.
Description: IC BAROMETRIC SENSOR I2C 8-TSON
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-TLGA
Output Type: I2C
Mounting Type: Surface Mount
Operating Pressure: 7.25PSI ~ 16.68PSI (50kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±0.145PSI (±1kPa)
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 2.375V ~ 5.5V
Applications: Board Mount
Supplier Device Package: 8-LGA (5x3)
Port Style: No Port

Hersteller: NXP USA Inc.
Description: IC BAROMETRIC SENSOR I2C 8-TSON
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: 8-TLGA
Output Type: I2C
Mounting Type: Surface Mount
Operating Pressure: 7.25PSI ~ 16.68PSI (50kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±0.145PSI (±1kPa)
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 2.375V ~ 5.5V
Applications: Board Mount
Supplier Device Package: 8-LGA (5x3)
Port Style: No Port

Hersteller: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive

Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: System Basis Chip
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100

Hersteller: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive

Hersteller: NXP USA Inc.
Description: MFS2633AMDAJAD
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)

Hersteller: NXP USA Inc.
Description: MFS2633AMDAKAD
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)

Hersteller: NXP USA Inc.
Description: MFS2633AMDC3AD
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)

Hersteller: NXP USA Inc.
Description: MFS2633AMDAMAD
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)

Hersteller: NXP USA Inc.
Description: MFS2633AMDE4AD
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)

Hersteller: NXP USA Inc.
Description: MCU KINETIS BT5/FSK/THREAD WLCSP
Packaging: Cut Tape (CT)
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 1.25MB (1.25M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D - 12bit; D/A - 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals: Bluetooth, DMA, PWM, WDT
Supplier Device Package: 191-WLCSP (5.97x5.85)
Number of I/O: 104
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: MCU KINETIS THREAD 176-VFBGA
Packaging: Tray
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 1.25MB (1.25M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D - 12bit; D/A - 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals: Bluetooth, DMA, PWM, WDT
Supplier Device Package: 176-VFBGA
Number of I/O: 104
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC AMP GSM 865MHZ-960MHZ TO272WB
Packaging: Tape & Reel (TR)
Package / Case: TO-272-14 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 865MHz ~ 960MHz
RF Type: GSM, EDGE
Voltage - Supply: 28V
Gain: 28.8dB
P1dB: 90W
Supplier Device Package: TO-272 WB-14

Hersteller: NXP USA Inc.
Description: AFSC5G26E39 2496-2690 MHZ REFERE
Packaging: Bulk
Frequency: 2.49GHz ~ 2.69GHz
Type: Power Amplifier
Contents: Board(s)
Utilized IC / Part: AFSC5G26E39

Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-TSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 8-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Number of Circuits: 1

Hersteller: NXP USA Inc.
Description: ACCEL 1.5-6G ANALOG 14LGA
Features: Selectable Scale, Sleep Mode
Packaging: Tape & Reel (TR)
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±1.5g, 6g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 800 (±1.5g) ~ 206 (±6g)

Hersteller: NXP USA Inc.
Description: WLAN7002CC
Packaging: Tape & Reel (TR)
Package / Case: 36-BGA, WLCSP
Mounting Type: Surface Mount
Function: Switch
Frequency: 5GHz ~ 6GHz
RF Type: 802.11ac
Secondary Attributes: 3V ~ 4.8V Supply
Supplier Device Package: 36-WLCSP (1.63x1.53)

Hersteller: NXP USA Inc.
Description: NFC/RFID TAGS & TRANSPONDERS SL3
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: AUTOMOTIVE SAFETY PRESSURE SENSO
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Pressure: 5.8PSI ~ 20.31PSI (40kPa ~ 140kPa)
Pressure Type: Absolute
Operating Temperature: -40°C ~ 125°C
Applications: Board Mount
Supplier Device Package: 16-HQFN (4x4)
Port Style: No Port

Hersteller: NXP USA Inc.
Description: S12Z CPU, 96K FLASH
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: S12Z CPU, 96K FLASH
Packaging: Tray

Hersteller: NXP USA Inc.
Description: RF MOSFET HEMT 50V NI360
Packaging: Tape & Reel (TR)
Package / Case: NI-360H-2SB
Mounting Type: Chassis Mount
Frequency: 2.5GHz
Power - Output: 125W
Gain: 18dB
Technology: HEMT
Supplier Device Package: NI-360H-2SB
Voltage - Rated: 125 V
Voltage - Test: 50 V
Current - Test: 350 mA