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ON5200,118 NXP USA Inc. Description: RF MOSFET D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-5, D2PAK (4 Leads + Tab), TO-263BB
Mounting Type: Surface Mount
Supplier Device Package: D2PAK
Produkt ist nicht verfügbar
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S912XEP100J5CAG S912XEP100J5CAG NXP USA Inc. Description: IC MCU 16BIT 1MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 119
Supplier Device Package: 144-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 24x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MC35FS6507NAER2 MC35FS6507NAER2 NXP USA Inc. 35FS4500-35FS6500-ASILD.pdf Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
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MC35FS6507NAE MC35FS6507NAE NXP USA Inc. 35FS4500-35FS6500-ASILD.pdf Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
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MC33AR6000BGT MC33AR6000BGT NXP USA Inc. AR6000.pdf Description: IC REG ALTERNATOR 1OUT TO220-5
Grade: Automotive
Supplier Device Package: TO-220-5
Applications: Alternator, 3-Phase
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Input: 5V ~ 16.5V
Number of Outputs: 1
Mounting Type: Through Hole
Voltage - Output: 10.6V ~ 16V
Package / Case: TO-220-5
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MK20DX256VLK10R MK20DX256VLK10R NXP USA Inc. K20P81M100SF2V2.pdf Description: IC MCU 32BIT 256KB FLASH 80FQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 52
DigiKey Programmable: Not Verified
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MK20DX256VLK10R MK20DX256VLK10R NXP USA Inc. K20P81M100SF2V2.pdf Description: IC MCU 32BIT 256KB FLASH 80FQFP
Packaging: Cut Tape (CT)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 52
DigiKey Programmable: Not Verified
auf Bestellung 500 Stücke:
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1+22.46 EUR
10+17.62 EUR
25+16.42 EUR
100+15.09 EUR
250+14.84 EUR
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A3T21H456W23SR6 NXP USA Inc. A3T21H456W23S.pdf Description: RF MOSFET LDMOS
Packaging: Tape & Reel (TR)
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RDA777T2 NXP USA Inc. Description: RDA777T2
Packaging: Bulk
Produkt ist nicht verfügbar
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MF1PH4230DA4/00J NXP USA Inc. MF1P(H)x2.pdf Description: MIFAREA PLUS EV2
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: MOA4, Smart Card Module
Packaging: Tape & Reel (TR)
Supplier Device Package: PLLMC
Standards: Mifare, NFC
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SPC5643AF0MVZ2 SPC5643AF0MVZ2 NXP USA Inc. MPC5644A.pdf Description: IC MCU 32BIT 3MB FLASH 324PBGA
DigiKey Programmable: Not Verified
Number of I/O: 151
Supplier Device Package: 324-PBGA (23x23)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.25V
Core Size: 32-Bit Single-Core
Data Converters: A/D 40x12b
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 324-BBGA
Packaging: Tray
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S32G233ASBK0VUCT NXP USA Inc. S32G2.pdf Description: S32G233A ARM CORTEX-M7 AND -A53,
Package / Case: 525-FBGA, FCBGA
Packaging: Tray
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Graphics Acceleration: No
RAM Controllers: DDR3L, LPDDR4
Co-Processors/DSP: Multimedia; NEON
Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit
USB: USB 2.0 OTG (1)
Ethernet: GbE (4)
Supplier Device Package: 525-FCPBGA (19x19)
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz, 1GHz
Mounting Type: Surface Mount
Qualification: AEC-Q100
Grade: Automotive
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SLS1046ASN8T1A NXP USA Inc. Description: SLS1046A ST 1.8GHZ DDR 2100 MT/
Packaging: Tray
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TDA8034T/C1,112 TDA8034T/C1,112 NXP USA Inc. TDA8034T_TDA8034AT.pdf Description: IC INTERFACE SPECIALIZED 16SO
Supplier Device Package: 16-SO
Voltage - Supply: 3V, 5V
Interface: Analog
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tube
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10+2.23 EUR
14+1.61 EUR
50+1.36 EUR
100+1.29 EUR
250+1.2 EUR
500+1.15 EUR
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MC9S12GC64MFUE MC9S12GC64MFUE NXP USA Inc. MC9S12C128V1.pdf Description: IC MCU 16BIT 64KB FLASH 80QFP
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 60
Supplier Device Package: 80-QFP (14x14)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
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MC35FS6518CAER2 MC35FS6518CAER2 NXP USA Inc. 35FS4500-35FS6500-ASILD.pdf Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
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S32G234MSBK1VUCR NXP USA Inc. S32G2.pdf Description: S32G234M ARM CORTEX-M7, HSE W/PR
Qualification: AEC-Q100
Grade: Automotive
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; NEON
Number of Cores/Bus Width: 3 Core, 32/64-Bit
Ethernet: 1/2.5Gbps (4)
Supplier Device Package: 525-FCPBGA (19x19)
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Core Processor: ARM® Cortex®-M7
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 525-FBGA, FCBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NCK2982RHN/10101Y NXP USA Inc. Description: NCK2982RHN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MIMX8UD7CVP08SC MIMX8UD7CVP08SC NXP USA Inc. AN13914.pdf Description: I.MX8ULP, DUAL 800MHZ
Supplier Device Package: 485-LFBGA (15x15)
Mounting Type: Surface Mount
Package / Case: 485-LFBGA
Packaging: Tray
auf Bestellung 170 Stücke:
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1+47.34 EUR
10+38.1 EUR
25+35.8 EUR
100+33.26 EUR
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MPF5020CMBA0ES MPF5020CMBA0ES NXP USA Inc. PF5020.pdf Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
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2+13.4 EUR
10+10.34 EUR
25+9.57 EUR
100+8.73 EUR
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MPF5024CMBA0ES MPF5024CMBA0ES NXP USA Inc. PF5024.pdf Description: POWER MANAGEMENT IC, PRE-PROG, 4
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 40-HVQFN (6x6)
Applications: High Performance i.MX 8 Processor Based
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 480 Stücke:
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2+13.26 EUR
10+10.23 EUR
25+9.48 EUR
100+8.65 EUR
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MPF7100BVMA3ES MPF7100BVMA3ES NXP USA Inc. PF7100.pdf Description: PF7100 PMIC I.MX8DXP/DX
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HVQFN (7x7)
Current - Supply: 10µA
Applications: i.MX Processors
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
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2+14.3 EUR
10+11.08 EUR
25+10.27 EUR
100+9.38 EUR
260+8.94 EUR
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MIMX8US5DVP08SC MIMX8US5DVP08SC NXP USA Inc. IMX8ULPIEC.pdf Description: I.MX8ULP, SOLO 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
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1+34.58 EUR
10+27.51 EUR
25+25.75 EUR
100+23.82 EUR
250+22.9 EUR
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MSC8157TAG1000A MSC8157TAG1000A NXP USA Inc. MSC8157.pdf Description: IC DSP 6X 1GHZ SC3850 783FCBGA
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
Supplier Device Package: 783-FCPBGA (29x29)
Clock Rate: 1GHz
Voltage - Core: 1.00V
Voltage - I/O: 1.0V, 1.5V, 2.5V
On-Chip RAM: 6.375MB
Non-Volatile Memory: ROM (96KB)
Operating Temperature: -40°C ~ 105°C (TJ)
Type: SC3850 Six Core
Produkt ist nicht verfügbar
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CBT3306D,118 CBT3306D,118 NXP USA Inc. PHGLS24512-1.pdf?t.download=true&u=5oefqw Description: IC BUS SWITCH 1 X 1:1 8SO
Supplier Device Package: 8-SO
Voltage Supply Source: Single Supply
Independent Circuits: 2
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Bus Switch
Circuit: 1 x 1:1
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
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1268+0.48 EUR
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PEMH7,115 PEMH7,115 NXP USA Inc. PEMH7_PUMH7.pdf Description: TRANS 2NPN PREBIAS 0.3W SOT666
Packaging: Bulk
auf Bestellung 132000 Stücke:
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6772+0.08 EUR
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MRF6VP11KHR5 NXP USA Inc. FSCLS07342-1.pdf?t.download=true&u=5oefqw Description: RF MOSFET LDMOS 50V NI1230
Voltage - Test: 50 V
Voltage - Rated: 110 V
Supplier Device Package: NI-1230
Technology: LDMOS (Dual)
Gain: 26dB
Power - Output: 1000W
Configuration: 2 N-Channel
Frequency: 1.8MHz ~ 150MHz
Mounting Type: Chassis Mount
Package / Case: NI-1230
Packaging: Bulk
Current - Test: 6 A
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1+648.53 EUR
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MC35FS4500NAE MC35FS4500NAE NXP USA Inc. FS6500-FS4500-ASILD.pdf Description: FS4500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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2+15.98 EUR
10+12.4 EUR
25+11.51 EUR
100+10.52 EUR
250+10.06 EUR
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SPC5742PK1MLQ5R SPC5742PK1MLQ5R NXP USA Inc. MPC574xP_FS.pdf Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 64x12b
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
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SPC5742PK1MLQ5 SPC5742PK1MLQ5 NXP USA Inc. MPC574xP_FS.pdf Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 64x12b
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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SPC5744BK1AMMH2 SPC5744BK1AMMH2 NXP USA Inc. MPC5746C.pdf Description: IC MCU 32B 1.5MB FLASH 100MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: DMA, I2S, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 36x10b, 16x12b
Core Processor: e200z4
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MC33937APEK MC33937APEK NXP USA Inc. MC33937.pdf Description: IC MOTOR DRIVER 6V-58V 54SOIC
Grade: Automotive
Motor Type - AC, DC: Brushless DC (BLDC)
Supplier Device Package: 54-SOIC-EP
Technology: NMOS
Voltage - Supply: 6V ~ 58V
Output Configuration: Pre-Driver - Half Bridge (3)
Operating Temperature: -40°C ~ 135°C (TA)
Interface: SPI
Function: Controller - Commutation, Direction Management
Mounting Type: Surface Mount
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
auf Bestellung 4 Stücke:
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2+12.13 EUR
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PCA9958HNY PCA9958HNY NXP USA Inc. PCA9958.pdf Description: PCA9958HNY
Type: Linear
Frequency: 31.25kHz
Number of Outputs: 24
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 2.7V
Dimming: PWM, SPI
Supplier Device Package: 40-HVQFN (6x6)
Topology: Constant Current
Internal Switch(s): No
Current - Output / Channel: 63mA
Applications: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
auf Bestellung 4000 Stücke:
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4+5.51 EUR
10+4.11 EUR
25+3.76 EUR
100+3.37 EUR
250+3.19 EUR
500+3.08 EUR
1000+2.99 EUR
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MCXC243VFT NXP USA Inc. MCXCFS.pdf Description: 48MHz, Cortex-M0+, USB
Number of I/O: 36
Supplier Device Package: 48-QFN (7x7)
Peripherals: DMA, PWM, WDT
Connectivity: I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 16b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 48-UFQFN Exposed Pad
Packaging: Tray
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MPC8315ECVRAGDA MPC8315ECVRAGDA NXP USA Inc. MPC8315EEC.pdf Description: IC MPU MPC83XX 400MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI, TDM
SATA: SATA 3Gbps (2)
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 3.3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
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S9S12VRP64F0MLFR NXP USA Inc. Description: MAGNIV 16-BIT MCU, S12 CORE, 64K
Packaging: Tape & Reel (TR)
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MC908AP16ACFBE557 MC908AP16ACFBE557 NXP USA Inc. MC68HC908AP64A.pdf Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TDA19988AET/C1,151 NXP USA Inc. PHGL-S-A0002555885-1.pdf?t.download=true&u=5oefqw Description: IC VIDEO HDMI TRANS 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Function: Transmitter
Applications: Consumer Video
Standards: HDMI 1.4a, ITU656
Supplier Device Package: 64-TFBGA (4.5x4.5)
Control Interface: I2S
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TDA19988BET/C1,151 NXP USA Inc. PHGL-S-A0002555885-1.pdf?t.download=true&u=5oefqw Description: IC VIDEO HDMI TRANS 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Function: Transmitter
Applications: Consumer Video
Standards: HDMI 1.4a, ITU656
Supplier Device Package: 64-TFBGA (4.5x4.5)
Control Interface: I2S
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MC56F84550VLF MC56F84550VLF NXP USA Inc. MC56F8458X.pdf Description: IC MCU 32BIT 96KB FLASH 48LQFP
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b; D/A 1x12b
Core Processor: 56800EX
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
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MC56F84550VLFR MC56F84550VLFR NXP USA Inc. MC56F8455X.pdf Description: IC MCU 32BIT 96KB FLASH 48LQFP
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b; D/A 1x12b
Core Processor: 56800EX
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
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UJA1079ATW/3/2Z UJA1079ATW/3/2Z NXP USA Inc. Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 75µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
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UJA1079ATW/5/2Z UJA1079ATW/5/2Z NXP USA Inc. Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 75µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
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UJA1079ATW/3W/2Z UJA1079ATW/3W/2Z NXP USA Inc. Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 75µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
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A7101CHTK2/T0BC2VJ A7101CHTK2/T0BC2VJ NXP USA Inc. A71CH.pdf Description: SECURE AUTHENTICATION
Operating Temperature: -25°C ~ 90°C (TA)
Interface: I2C
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Bulk
DigiKey Programmable: Not Verified
Supplier Device Package: 8-HVSON (4x4)
Core Processor: MX51
Applications: Authentication
Voltage - Supply: 2.5V ~ 3.6V
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MKW31Z256VHT4 MKW31Z256VHT4 NXP USA Inc. MKW41Z512.pdf Description: IC RF TXRX+MCU BLE 64VFLGA
DigiKey Programmable: Not Verified
Serial Interfaces: I2C, SPI, UART
RF Family/Standard: Bluetooth
Modulation: FSK, GFSK, MSK, O-QPSK
Supplier Device Package: 64-VFLGA (7x7)
Current - Transmitting: 6mA
Data Rate (Max): 1Mbps
Current - Receiving: 6.2mA
Protocol: Bluetooth v4.2
Power - Output: 3.5dBm
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -95dBm
Package / Case: 64-VFLGA
Packaging: Tray
Type: TxRx + MCU
Memory Size: 256kB Flash, 64kB RAM
Voltage - Supply: 1.71V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
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MPC8347VRADDB MPC8347VRADDB NXP USA Inc. MPC8347EEC.pdf Description: IC MPU MPC83XX 266MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Graphics Acceleration: No
RAM Controllers: DDR
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
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MRF8P20100HSR3 MRF8P20100HSR3 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI780
Technology: LDMOS
Gain: 16dB
Power - Output: 20W
Configuration: Dual
Frequency: 2.03GHz
Mounting Type: Surface Mount
Package / Case: NI-780S-4L
Packaging: Tape & Reel (TR)
Current - Test: 400 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780S-4L
Produkt ist nicht verfügbar
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SPC5605BF1MLU6R SPC5605BF1MLU6R NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 768KB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 149
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 29x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 768KB (768K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tape & Reel (TR)
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FRDM-MCXC444 FRDM-MCXC444 NXP USA Inc. MCXCFS.pdf Description: FREEDOM MCXC444 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: MCXC444
Platform: Freedom
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K32W032S1M2CAVAR NXP USA Inc. Description: MCU KINETIS BT5/FSK WLCSP
Packaging: Cut Tape (CT)
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 1.25MB (1.25M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D - 12bit; D/A - 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals: Bluetooth, DMA, PWM, WDT
Supplier Device Package: 191-WLCSP (5.97x5.85)
Number of I/O: 104
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74AUP2G132GD,125 74AUP2G132GD,125 NXP USA Inc. 74AUP2G132.pdf Description: IC GATE NAND 2CH 2-INP 8-XSON
Max Propagation Delay @ V, Max CL: 7.8ns @ 3.3V, 30pF
Input Logic Level - Low: 0.1V ~ 0.88V
Input Logic Level - High: 0.6V ~ 2.29V
Supplier Device Package: 8-XSON (2x3)
Number of Inputs: 2
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Logic Type: NAND Gate
Mounting Type: Surface Mount
Package / Case: 8-XFDFN
Features: Schmitt Trigger
Packaging: Bulk
Current - Quiescent (Max): 500 nA
Number of Circuits: 2
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74AUP2G126GD,125 74AUP2G126GD,125 NXP USA Inc. 74AUP2G126.pdf Description: IC BUFFER/LINEDVR DUAL XSON8U
Supplier Device Package: 8-XSON (2x3)
Current - Output High, Low: 4mA, 4mA
Number of Bits per Element: 1
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 8-XFDFN
Packaging: Bulk
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SC900719BAFR2 NXP USA Inc. Description: SOLENOID DRIVER, 12 DRVR, 3A, MO
Packaging: Tape & Reel (TR)
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SC900719BAF NXP USA Inc. Description: SOLENOID DRIVER, 12 DRVR, 3A, MO
Packaging: Tray
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S912XET256BCAAR S912XET256BCAAR NXP USA Inc. MC9S12XEP100RMV1.pdf Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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S912XEG384BCAAR S912XEG384BCAAR NXP USA Inc. MC9S12XEP100RMV1.pdf Description: IC MCU 16BIT 384KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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MC33PF8200A0ESR2 MC33PF8200A0ESR2 NXP USA Inc. PF8100_PF8200.pdf Description: POWER MANAGEMENT IC I.MX8 NON-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
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FXPS71407BPST1 NXP USA Inc. Description: FXPS71407BPST1
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S32K322NHT0VPBSR S32K322NHT0VPBSR NXP USA Inc. S32K3xx.pdf Description: S32K322NHT0VPBSR
Packaging: Bulk
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 142
Qualification: AEC-Q100
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ON5200,118
Hersteller: NXP USA Inc.
Description: RF MOSFET D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-5, D2PAK (4 Leads + Tab), TO-263BB
Mounting Type: Surface Mount
Supplier Device Package: D2PAK
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S912XEP100J5CAG
S912XEP100J5CAG
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 1MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 119
Supplier Device Package: 144-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 24x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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MC35FS6507NAER2 35FS4500-35FS6500-ASILD.pdf
MC35FS6507NAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC35FS6507NAE 35FS4500-35FS6500-ASILD.pdf
MC35FS6507NAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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MC33AR6000BGT AR6000.pdf
MC33AR6000BGT
Hersteller: NXP USA Inc.
Description: IC REG ALTERNATOR 1OUT TO220-5
Grade: Automotive
Supplier Device Package: TO-220-5
Applications: Alternator, 3-Phase
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Input: 5V ~ 16.5V
Number of Outputs: 1
Mounting Type: Through Hole
Voltage - Output: 10.6V ~ 16V
Package / Case: TO-220-5
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MK20DX256VLK10R K20P81M100SF2V2.pdf
MK20DX256VLK10R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80FQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MK20DX256VLK10R K20P81M100SF2V2.pdf
MK20DX256VLK10R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80FQFP
Packaging: Cut Tape (CT)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 52
DigiKey Programmable: Not Verified
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AnzahlPrivatkunde
1+22.46 EUR
10+17.62 EUR
25+16.42 EUR
100+15.09 EUR
250+14.84 EUR
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A3T21H456W23SR6 A3T21H456W23S.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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RDA777T2
Hersteller: NXP USA Inc.
Description: RDA777T2
Packaging: Bulk
Produkt ist nicht verfügbar
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MF1PH4230DA4/00J MF1P(H)x2.pdf
Hersteller: NXP USA Inc.
Description: MIFAREA PLUS EV2
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: MOA4, Smart Card Module
Packaging: Tape & Reel (TR)
Supplier Device Package: PLLMC
Standards: Mifare, NFC
Produkt ist nicht verfügbar
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SPC5643AF0MVZ2 MPC5644A.pdf
SPC5643AF0MVZ2
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 324PBGA
DigiKey Programmable: Not Verified
Number of I/O: 151
Supplier Device Package: 324-PBGA (23x23)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.25V
Core Size: 32-Bit Single-Core
Data Converters: A/D 40x12b
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 324-BBGA
Packaging: Tray
Produkt ist nicht verfügbar
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S32G233ASBK0VUCT S32G2.pdf
Hersteller: NXP USA Inc.
Description: S32G233A ARM CORTEX-M7 AND -A53,
Package / Case: 525-FBGA, FCBGA
Packaging: Tray
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Graphics Acceleration: No
RAM Controllers: DDR3L, LPDDR4
Co-Processors/DSP: Multimedia; NEON
Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit
USB: USB 2.0 OTG (1)
Ethernet: GbE (4)
Supplier Device Package: 525-FCPBGA (19x19)
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz, 1GHz
Mounting Type: Surface Mount
Qualification: AEC-Q100
Grade: Automotive
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SLS1046ASN8T1A
Hersteller: NXP USA Inc.
Description: SLS1046A ST 1.8GHZ DDR 2100 MT/
Packaging: Tray
Produkt ist nicht verfügbar
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TDA8034T/C1,112 TDA8034T_TDA8034AT.pdf
TDA8034T/C1,112
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 16SO
Supplier Device Package: 16-SO
Voltage - Supply: 3V, 5V
Interface: Analog
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tube
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10+2.23 EUR
14+1.61 EUR
50+1.36 EUR
100+1.29 EUR
250+1.2 EUR
500+1.15 EUR
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MC9S12GC64MFUE MC9S12C128V1.pdf
MC9S12GC64MFUE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 60
Supplier Device Package: 80-QFP (14x14)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Produkt ist nicht verfügbar
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MC35FS6518CAER2 35FS4500-35FS6500-ASILD.pdf
MC35FS6518CAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
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S32G234MSBK1VUCR S32G2.pdf
Hersteller: NXP USA Inc.
Description: S32G234M ARM CORTEX-M7, HSE W/PR
Qualification: AEC-Q100
Grade: Automotive
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; NEON
Number of Cores/Bus Width: 3 Core, 32/64-Bit
Ethernet: 1/2.5Gbps (4)
Supplier Device Package: 525-FCPBGA (19x19)
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Core Processor: ARM® Cortex®-M7
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 525-FBGA, FCBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NCK2982RHN/10101Y
Hersteller: NXP USA Inc.
Description: NCK2982RHN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MIMX8UD7CVP08SC AN13914.pdf
MIMX8UD7CVP08SC
Hersteller: NXP USA Inc.
Description: I.MX8ULP, DUAL 800MHZ
Supplier Device Package: 485-LFBGA (15x15)
Mounting Type: Surface Mount
Package / Case: 485-LFBGA
Packaging: Tray
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1+47.34 EUR
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MPF5020CMBA0ES PF5020.pdf
MPF5020CMBA0ES
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
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2+13.4 EUR
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MPF5024CMBA0ES PF5024.pdf
MPF5024CMBA0ES
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 4
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 40-HVQFN (6x6)
Applications: High Performance i.MX 8 Processor Based
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
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2+13.26 EUR
10+10.23 EUR
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MPF7100BVMA3ES PF7100.pdf
MPF7100BVMA3ES
Hersteller: NXP USA Inc.
Description: PF7100 PMIC I.MX8DXP/DX
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HVQFN (7x7)
Current - Supply: 10µA
Applications: i.MX Processors
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
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2+14.3 EUR
10+11.08 EUR
25+10.27 EUR
100+9.38 EUR
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MIMX8US5DVP08SC IMX8ULPIEC.pdf
MIMX8US5DVP08SC
Hersteller: NXP USA Inc.
Description: I.MX8ULP, SOLO 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
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1+34.58 EUR
10+27.51 EUR
25+25.75 EUR
100+23.82 EUR
250+22.9 EUR
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MSC8157TAG1000A MSC8157.pdf
MSC8157TAG1000A
Hersteller: NXP USA Inc.
Description: IC DSP 6X 1GHZ SC3850 783FCBGA
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
Supplier Device Package: 783-FCPBGA (29x29)
Clock Rate: 1GHz
Voltage - Core: 1.00V
Voltage - I/O: 1.0V, 1.5V, 2.5V
On-Chip RAM: 6.375MB
Non-Volatile Memory: ROM (96KB)
Operating Temperature: -40°C ~ 105°C (TJ)
Type: SC3850 Six Core
Produkt ist nicht verfügbar
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CBT3306D,118 PHGLS24512-1.pdf?t.download=true&u=5oefqw
CBT3306D,118
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 1 X 1:1 8SO
Supplier Device Package: 8-SO
Voltage Supply Source: Single Supply
Independent Circuits: 2
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Bus Switch
Circuit: 1 x 1:1
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
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PEMH7,115 PEMH7_PUMH7.pdf
PEMH7,115
Hersteller: NXP USA Inc.
Description: TRANS 2NPN PREBIAS 0.3W SOT666
Packaging: Bulk
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MRF6VP11KHR5 FSCLS07342-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Voltage - Test: 50 V
Voltage - Rated: 110 V
Supplier Device Package: NI-1230
Technology: LDMOS (Dual)
Gain: 26dB
Power - Output: 1000W
Configuration: 2 N-Channel
Frequency: 1.8MHz ~ 150MHz
Mounting Type: Chassis Mount
Package / Case: NI-1230
Packaging: Bulk
Current - Test: 6 A
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MC35FS4500NAE FS6500-FS4500-ASILD.pdf
MC35FS4500NAE
Hersteller: NXP USA Inc.
Description: FS4500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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2+15.98 EUR
10+12.4 EUR
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SPC5742PK1MLQ5R MPC574xP_FS.pdf
SPC5742PK1MLQ5R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 64x12b
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SPC5742PK1MLQ5 MPC574xP_FS.pdf
SPC5742PK1MLQ5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 64x12b
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5744BK1AMMH2 MPC5746C.pdf
SPC5744BK1AMMH2
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 100MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: DMA, I2S, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 36x10b, 16x12b
Core Processor: e200z4
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MC33937APEK MC33937.pdf
MC33937APEK
Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 6V-58V 54SOIC
Grade: Automotive
Motor Type - AC, DC: Brushless DC (BLDC)
Supplier Device Package: 54-SOIC-EP
Technology: NMOS
Voltage - Supply: 6V ~ 58V
Output Configuration: Pre-Driver - Half Bridge (3)
Operating Temperature: -40°C ~ 135°C (TA)
Interface: SPI
Function: Controller - Commutation, Direction Management
Mounting Type: Surface Mount
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
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2+12.13 EUR
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PCA9958HNY PCA9958.pdf
PCA9958HNY
Hersteller: NXP USA Inc.
Description: PCA9958HNY
Type: Linear
Frequency: 31.25kHz
Number of Outputs: 24
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 2.7V
Dimming: PWM, SPI
Supplier Device Package: 40-HVQFN (6x6)
Topology: Constant Current
Internal Switch(s): No
Current - Output / Channel: 63mA
Applications: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
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4+5.51 EUR
10+4.11 EUR
25+3.76 EUR
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250+3.19 EUR
500+3.08 EUR
1000+2.99 EUR
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MCXC243VFT MCXCFS.pdf
Hersteller: NXP USA Inc.
Description: 48MHz, Cortex-M0+, USB
Number of I/O: 36
Supplier Device Package: 48-QFN (7x7)
Peripherals: DMA, PWM, WDT
Connectivity: I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 16b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 48-UFQFN Exposed Pad
Packaging: Tray
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5+5.11 EUR
10+4.77 EUR
25+4.4 EUR
80+4.07 EUR
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MPC8315ECVRAGDA MPC8315EEC.pdf
MPC8315ECVRAGDA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI, TDM
SATA: SATA 3Gbps (2)
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 3.3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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S9S12VRP64F0MLFR
Hersteller: NXP USA Inc.
Description: MAGNIV 16-BIT MCU, S12 CORE, 64K
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC908AP16ACFBE557 MC68HC908AP64A.pdf
MC908AP16ACFBE557
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TDA19988AET/C1,151 PHGL-S-A0002555885-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC VIDEO HDMI TRANS 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Function: Transmitter
Applications: Consumer Video
Standards: HDMI 1.4a, ITU656
Supplier Device Package: 64-TFBGA (4.5x4.5)
Control Interface: I2S
Produkt ist nicht verfügbar
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TDA19988BET/C1,151 PHGL-S-A0002555885-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC VIDEO HDMI TRANS 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Function: Transmitter
Applications: Consumer Video
Standards: HDMI 1.4a, ITU656
Supplier Device Package: 64-TFBGA (4.5x4.5)
Control Interface: I2S
Produkt ist nicht verfügbar
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MC56F84550VLF MC56F8458X.pdf
MC56F84550VLF
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 96KB FLASH 48LQFP
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b; D/A 1x12b
Core Processor: 56800EX
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Produkt ist nicht verfügbar
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MC56F84550VLFR MC56F8455X.pdf
MC56F84550VLFR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 96KB FLASH 48LQFP
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b; D/A 1x12b
Core Processor: 56800EX
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Produkt ist nicht verfügbar
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UJA1079ATW/3/2Z
UJA1079ATW/3/2Z
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 75µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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UJA1079ATW/5/2Z
UJA1079ATW/5/2Z
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 75µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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UJA1079ATW/3W/2Z
UJA1079ATW/3W/2Z
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 75µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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A7101CHTK2/T0BC2VJ A71CH.pdf
A7101CHTK2/T0BC2VJ
Hersteller: NXP USA Inc.
Description: SECURE AUTHENTICATION
Operating Temperature: -25°C ~ 90°C (TA)
Interface: I2C
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Bulk
DigiKey Programmable: Not Verified
Supplier Device Package: 8-HVSON (4x4)
Core Processor: MX51
Applications: Authentication
Voltage - Supply: 2.5V ~ 3.6V
auf Bestellung 1897 Stücke:
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183+3.28 EUR
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MKW31Z256VHT4 MKW41Z512.pdf
MKW31Z256VHT4
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 64VFLGA
DigiKey Programmable: Not Verified
Serial Interfaces: I2C, SPI, UART
RF Family/Standard: Bluetooth
Modulation: FSK, GFSK, MSK, O-QPSK
Supplier Device Package: 64-VFLGA (7x7)
Current - Transmitting: 6mA
Data Rate (Max): 1Mbps
Current - Receiving: 6.2mA
Protocol: Bluetooth v4.2
Power - Output: 3.5dBm
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -95dBm
Package / Case: 64-VFLGA
Packaging: Tray
Type: TxRx + MCU
Memory Size: 256kB Flash, 64kB RAM
Voltage - Supply: 1.71V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
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2+15.27 EUR
10+11.83 EUR
25+10.96 EUR
100+10.01 EUR
260+9.54 EUR
520+9.27 EUR
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MPC8347VRADDB MPC8347EEC.pdf
MPC8347VRADDB
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Graphics Acceleration: No
RAM Controllers: DDR
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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MRF8P20100HSR3
MRF8P20100HSR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Technology: LDMOS
Gain: 16dB
Power - Output: 20W
Configuration: Dual
Frequency: 2.03GHz
Mounting Type: Surface Mount
Package / Case: NI-780S-4L
Packaging: Tape & Reel (TR)
Current - Test: 400 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780S-4L
Produkt ist nicht verfügbar
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SPC5605BF1MLU6R MPC560XBFAMFS.pdf
SPC5605BF1MLU6R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 149
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 29x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 768KB (768K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FRDM-MCXC444 MCXCFS.pdf
FRDM-MCXC444
Hersteller: NXP USA Inc.
Description: FREEDOM MCXC444 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: MCXC444
Platform: Freedom
auf Bestellung 54 Stücke:
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2+20.15 EUR
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K32W032S1M2CAVAR
Hersteller: NXP USA Inc.
Description: MCU KINETIS BT5/FSK WLCSP
Packaging: Cut Tape (CT)
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 1.25MB (1.25M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D - 12bit; D/A - 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals: Bluetooth, DMA, PWM, WDT
Supplier Device Package: 191-WLCSP (5.97x5.85)
Number of I/O: 104
DigiKey Programmable: Not Verified
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74AUP2G132GD,125 74AUP2G132.pdf
74AUP2G132GD,125
Hersteller: NXP USA Inc.
Description: IC GATE NAND 2CH 2-INP 8-XSON
Max Propagation Delay @ V, Max CL: 7.8ns @ 3.3V, 30pF
Input Logic Level - Low: 0.1V ~ 0.88V
Input Logic Level - High: 0.6V ~ 2.29V
Supplier Device Package: 8-XSON (2x3)
Number of Inputs: 2
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Logic Type: NAND Gate
Mounting Type: Surface Mount
Package / Case: 8-XFDFN
Features: Schmitt Trigger
Packaging: Bulk
Current - Quiescent (Max): 500 nA
Number of Circuits: 2
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2049+0.3 EUR
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74AUP2G126GD,125 74AUP2G126.pdf
74AUP2G126GD,125
Hersteller: NXP USA Inc.
Description: IC BUFFER/LINEDVR DUAL XSON8U
Supplier Device Package: 8-XSON (2x3)
Current - Output High, Low: 4mA, 4mA
Number of Bits per Element: 1
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 8-XFDFN
Packaging: Bulk
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2049+0.29 EUR
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SC900719BAFR2
Hersteller: NXP USA Inc.
Description: SOLENOID DRIVER, 12 DRVR, 3A, MO
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SC900719BAF
Hersteller: NXP USA Inc.
Description: SOLENOID DRIVER, 12 DRVR, 3A, MO
Packaging: Tray
Produkt ist nicht verfügbar
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S912XET256BCAAR MC9S12XEP100RMV1.pdf
S912XET256BCAAR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEG384BCAAR MC9S12XEP100RMV1.pdf
S912XEG384BCAAR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC33PF8200A0ESR2 PF8100_PF8200.pdf
MC33PF8200A0ESR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX8 NON-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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FXPS71407BPST1
Hersteller: NXP USA Inc.
Description: FXPS71407BPST1
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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S32K322NHT0VPBSR S32K3xx.pdf
S32K322NHT0VPBSR
Hersteller: NXP USA Inc.
Description: S32K322NHT0VPBSR
Packaging: Bulk
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 142
Qualification: AEC-Q100
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