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RW612CET/A2IK RW612CET/A2IK NXP USA Inc. RW61XFS.pdf Description: RW612CET/A2IK
Packaging: Bulk
Produkt ist nicht verfügbar
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74LVC1G384GXH 74LVC1G384GXH NXP USA Inc. 74LVC1G384.pdf Description: IC SWITCH SPST-NCX1 10OHM 5X2SON
Number of Circuits: 1
Current - Leakage (IS(off)) (Max): 5µA
Channel Capacitance (CS(off), CD(off)): 5pF
Switch Time (Ton, Toff) (Max): 4.2ns, 5ns
Multiplexer/Demultiplexer Circuit: 1:1
Switch Circuit: SPST - NC
Charge Injection: 7.5pC
Voltage - Supply, Single (V+): 1.65V ~ 5.5V
Supplier Device Package: 5-X2SON (0.80x0.80)
-3db Bandwidth: 500MHz
On-State Resistance (Max): 10Ohm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 4-XFDFN Exposed Pad
Packaging: Bulk
auf Bestellung 833262 Stücke:
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2953+0.16 EUR
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SE051C2HQ1/Z01XDZ SE051C2HQ1/Z01XDZ NXP USA Inc. AN13013.pdf Description: SE051C2HQ1
Packaging: Cut Tape (CT)
Package / Case: 20-XFQFN Exposed Pad
Mounting Type: Surface Mount
Type: IoT Secure Element
Supplier Device Package: 20-HX2QFN (3x3)
auf Bestellung 1478 Stücke:
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3+7.87 EUR
10+5.99 EUR
25+5.52 EUR
100+5.01 EUR
250+4.78 EUR
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BGU8019X BGU8019X NXP USA Inc. BGU8019.pdf Description: IC AMP GALI 1.559-1.61GHZ 6XSON
Packaging: Tape & Reel (TR)
Supplier Device Package: 6-XSON (1.1x0.7)
Test Frequency: 1.575GHz
P1dB: -7dBm
Noise Figure: 0.55dB
Current - Supply: 4.6mA
Gain: 18.5dB
Voltage - Supply: 1.5V ~ 3.1V
RF Type: Galileo, GLONASS, GPS
Frequency: 1.559GHz ~ 1.61GHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
auf Bestellung 45000 Stücke:
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5000+0.3 EUR
10000+0.29 EUR
15000+0.28 EUR
25000+0.27 EUR
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BGU8019X BGU8019X NXP USA Inc. BGU8019.pdf Description: IC AMP GALI 1.559-1.61GHZ 6XSON
Supplier Device Package: 6-XSON (1.1x0.7)
Test Frequency: 1.575GHz
P1dB: -7dBm
Noise Figure: 0.55dB
Current - Supply: 4.6mA
Gain: 18.5dB
Voltage - Supply: 1.5V ~ 3.1V
RF Type: Galileo, GLONASS, GPS
Frequency: 1.559GHz ~ 1.61GHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Cut Tape (CT)
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35+0.51 EUR
40+0.44 EUR
43+0.42 EUR
100+0.38 EUR
250+0.36 EUR
500+0.34 EUR
1000+0.33 EUR
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PZU8.2B,115 PZU8.2B,115 NXP USA Inc. PHGLS19743-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 8.2V 310MW SOD323F
Packaging: Bulk
auf Bestellung 25464 Stücke:
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10804+0.051 EUR
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S9S08QD2J1MSC S9S08QD2J1MSC NXP USA Inc. MC9S08QD4.pdf Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
DigiKey Programmable: Not Verified
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MC68020CRC25E MC68020CRC25E NXP USA Inc. MC68020UM.pdf Description: IC MPU M680X0 25MHZ 114PGA
Packaging: Tray
Package / Case: 114-BPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: 68020
Voltage - I/O: 5.0V
Supplier Device Package: 114-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
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S912ZVC64ACLFR NXP USA Inc. Description: IC MCU 16BIT 64KB FLASH 48LQFP
Grade: Automotive
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x10b SAR
Core Processor: S12Z
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Number of I/O: 28
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S912ZVC64ACLF NXP USA Inc. Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 28
Qualification: AEC-Q100
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FH32K144HAT0MLFT NXP USA Inc. Description: S32K144, 512K FLASH, 64K RAM
Packaging: Tray
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LPC11U37HFBD64/4QL LPC11U37HFBD64/4QL NXP USA Inc. LPC11U1X.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC7448HX1250ND MC7448HX1250ND NXP USA Inc. MPC7448ECS01AD.pdf Description: IC MPU MPC74XX 1.25GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.25GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
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P3A9606JK-EVB P3A9606JK-EVB NXP USA Inc. UM11385.pdf Description: EVAL BOARD FOR P3A9606
Embedded: No
Primary Attributes: 2-Channel (Dual)
Utilized IC / Part: P3A9606
Contents: Board(s)
Type: Interface
Function: Level Shifter
Packaging: Bulk
Produkt ist nicht verfügbar
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74AUP1G07GX,125 74AUP1G07GX,125 NXP USA Inc. PHGLS25181-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 3.6V 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 5-X2SON (0.80x0.80)
auf Bestellung 9500 Stücke:
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4661+0.1 EUR
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MC9S08LC36LH MC9S08LC36LH NXP USA Inc. MC9S08LC60.pdf Description: IC MCU 8BIT 36KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 36KB (36K x 8)
RAM Size: 2.5K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08LC36LH MC9S08LC36LH NXP USA Inc. FSCLS03842-1.pdf?t.download=true&u=5oefqw Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 36KB (36K x 8)
RAM Size: 2.5K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 18
DigiKey Programmable: Not Verified
auf Bestellung 700 Stücke:
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49+10.5 EUR
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ON5200,118 NXP USA Inc. Description: RF MOSFET D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-5, D2PAK (4 Leads + Tab), TO-263BB
Mounting Type: Surface Mount
Supplier Device Package: D2PAK
Produkt ist nicht verfügbar
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S912XEP100J5CAG S912XEP100J5CAG NXP USA Inc. Description: IC MCU 16BIT 1MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 119
Supplier Device Package: 144-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 24x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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74LVC623AD,118 74LVC623AD,118 NXP USA Inc. 74lvc623a_3.pdf Description: IC TXRX NON-INVERT 3.6V 20SO
Supplier Device Package: 20-SO
Current - Output High, Low: 24mA, 24mA
Number of Bits per Element: 8
Voltage - Supply: 1.2V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
auf Bestellung 3220 Stücke:
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720+0.71 EUR
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MC35FS6507NAER2 MC35FS6507NAER2 NXP USA Inc. 35FS4500-35FS6500-ASILD.pdf Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC35FS6507NAE MC35FS6507NAE NXP USA Inc. 35FS4500-35FS6500-ASILD.pdf Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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MC33AR6000BGT MC33AR6000BGT NXP USA Inc. AR6000.pdf Description: IC REG ALTERNATOR 1OUT TO220-5
Grade: Automotive
Supplier Device Package: TO-220-5
Applications: Alternator, 3-Phase
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Input: 5V ~ 16.5V
Number of Outputs: 1
Mounting Type: Through Hole
Voltage - Output: 10.6V ~ 16V
Package / Case: TO-220-5
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MK20DX256VLK10R MK20DX256VLK10R NXP USA Inc. K20P81M100SF2V2.pdf Description: IC MCU 32BIT 256KB FLASH 80FQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 52
DigiKey Programmable: Not Verified
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MK20DX256VLK10R MK20DX256VLK10R NXP USA Inc. K20P81M100SF2V2.pdf Description: IC MCU 32BIT 256KB FLASH 80FQFP
Packaging: Cut Tape (CT)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 52
DigiKey Programmable: Not Verified
auf Bestellung 500 Stücke:
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1+18.71 EUR
10+14.69 EUR
25+13.69 EUR
100+12.58 EUR
250+12.37 EUR
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A3T21H456W23SR6 NXP USA Inc. A3T21H456W23S.pdf Description: RF MOSFET LDMOS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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RDA777T2 NXP USA Inc. Description: RDA777T2
Packaging: Bulk
Produkt ist nicht verfügbar
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MF1PH4230DA4/00J NXP USA Inc. MF1P(H)x2.pdf Description: MIFAREA PLUS EV2
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: MOA4, Smart Card Module
Packaging: Tape & Reel (TR)
Supplier Device Package: PLLMC
Standards: Mifare, NFC
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SPC5643AF0MVZ2 SPC5643AF0MVZ2 NXP USA Inc. MPC5644A.pdf Description: IC MCU 32BIT 3MB FLASH 324PBGA
DigiKey Programmable: Not Verified
Number of I/O: 151
Supplier Device Package: 324-PBGA (23x23)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.25V
Core Size: 32-Bit Single-Core
Data Converters: A/D 40x12b
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 324-BBGA
Packaging: Tray
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S32G233ASBK0VUCT NXP USA Inc. S32G2.pdf Description: S32G233A ARM CORTEX-M7 AND -A53,
Package / Case: 525-FBGA, FCBGA
Packaging: Tray
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Graphics Acceleration: No
RAM Controllers: DDR3L, LPDDR4
Co-Processors/DSP: Multimedia; NEON
Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit
USB: USB 2.0 OTG (1)
Ethernet: GbE (4)
Supplier Device Package: 525-FCPBGA (19x19)
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz, 1GHz
Mounting Type: Surface Mount
Qualification: AEC-Q100
Grade: Automotive
Produkt ist nicht verfügbar
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SLS1046ASN8T1A NXP USA Inc. Description: SLS1046A ST 1.8GHZ DDR 2100 MT/
Packaging: Tray
Produkt ist nicht verfügbar
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TDA8034T/C1,112 TDA8034T/C1,112 NXP USA Inc. TDA8034T_TDA8034AT.pdf Description: IC INTERFACE SPECIALIZED 16SO
Supplier Device Package: 16-SO
Voltage - Supply: 3V, 5V
Interface: Analog
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tube
auf Bestellung 653 Stücke:
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10+1.87 EUR
14+1.35 EUR
50+1.14 EUR
100+1.08 EUR
250+1.01 EUR
500+0.97 EUR
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MC9S12GC64MFUE MC9S12GC64MFUE NXP USA Inc. MC9S12C128V1.pdf Description: IC MCU 16BIT 64KB FLASH 80QFP
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 60
Supplier Device Package: 80-QFP (14x14)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
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MC35FS6518CAER2 MC35FS6518CAER2 NXP USA Inc. 35FS4500-35FS6500-ASILD.pdf Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
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S32G234MSBK1VUCR NXP USA Inc. S32G2.pdf Description: S32G234M ARM CORTEX-M7, HSE W/PR
Qualification: AEC-Q100
Grade: Automotive
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; NEON
Number of Cores/Bus Width: 3 Core, 32/64-Bit
Ethernet: 1/2.5Gbps (4)
Supplier Device Package: 525-FCPBGA (19x19)
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Core Processor: ARM® Cortex®-M7
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 525-FBGA, FCBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NCK2982RHN/10101Y NXP USA Inc. Description: NCK2982RHN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MIMX8UD7CVP08SC MIMX8UD7CVP08SC NXP USA Inc. AN13914.pdf Description: I.MX8ULP, DUAL 800MHZ
Supplier Device Package: 485-LFBGA (15x15)
Mounting Type: Surface Mount
Package / Case: 485-LFBGA
Packaging: Tray
auf Bestellung 170 Stücke:
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1+39.78 EUR
10+32.02 EUR
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100+27.95 EUR
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MPF5020CMBA0ES MPF5020CMBA0ES NXP USA Inc. PF5020.pdf Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
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2+11.26 EUR
10+8.69 EUR
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MPF5024CMBA0ES MPF5024CMBA0ES NXP USA Inc. PF5024.pdf Description: POWER MANAGEMENT IC, PRE-PROG, 4
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 40-HVQFN (6x6)
Applications: High Performance i.MX 8 Processor Based
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
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100+7.27 EUR
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MPF7100BVMA3ES MPF7100BVMA3ES NXP USA Inc. PF7100.pdf Description: PF7100 PMIC I.MX8DXP/DX
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HVQFN (7x7)
Current - Supply: 10µA
Applications: i.MX Processors
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
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2+12.02 EUR
10+9.31 EUR
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100+7.88 EUR
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MIMX8US5DVP08SC MIMX8US5DVP08SC NXP USA Inc. IMX8ULPIEC.pdf Description: I.MX8ULP, SOLO 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
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MSC8157TAG1000A MSC8157TAG1000A NXP USA Inc. MSC8157.pdf Description: IC DSP 6X 1GHZ SC3850 783FCBGA
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
Supplier Device Package: 783-FCPBGA (29x29)
Clock Rate: 1GHz
Voltage - Core: 1.00V
Voltage - I/O: 1.0V, 1.5V, 2.5V
On-Chip RAM: 6.375MB
Non-Volatile Memory: ROM (96KB)
Operating Temperature: -40°C ~ 105°C (TJ)
Type: SC3850 Six Core
Produkt ist nicht verfügbar
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CBT3306D,118 CBT3306D,118 NXP USA Inc. PHGLS24512-1.pdf?t.download=true&u=5oefqw Description: IC BUS SWITCH 1 X 1:1 8SO
Supplier Device Package: 8-SO
Voltage Supply Source: Single Supply
Independent Circuits: 2
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Bus Switch
Circuit: 1 x 1:1
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
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PEMH7,115 PEMH7,115 NXP USA Inc. PEMH7_PUMH7.pdf Description: TRANS 2NPN PREBIAS 0.3W SOT666
Packaging: Bulk
auf Bestellung 132000 Stücke:
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MRF6VP11KHR5 NXP USA Inc. FSCLS07342-1.pdf?t.download=true&u=5oefqw Description: RF MOSFET LDMOS 50V NI1230
Voltage - Test: 50 V
Voltage - Rated: 110 V
Supplier Device Package: NI-1230
Technology: LDMOS (Dual)
Gain: 26dB
Power - Output: 1000W
Configuration: 2 N-Channel
Frequency: 1.8MHz ~ 150MHz
Mounting Type: Chassis Mount
Package / Case: NI-1230
Packaging: Bulk
Current - Test: 6 A
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MC35FS4500NAE MC35FS4500NAE NXP USA Inc. FS6500-FS4500-ASILD.pdf Description: FS4500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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2+13.43 EUR
10+10.42 EUR
25+9.67 EUR
100+8.84 EUR
250+8.45 EUR
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SPC5742PK1MLQ5R SPC5742PK1MLQ5R NXP USA Inc. MPC574xP_FS.pdf Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 64x12b
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
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SPC5742PK1MLQ5 SPC5742PK1MLQ5 NXP USA Inc. MPC574xP_FS.pdf Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 64x12b
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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SPC5744BK1AMMH2 SPC5744BK1AMMH2 NXP USA Inc. MPC5746C.pdf Description: IC MCU 32B 1.5MB FLASH 100MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: DMA, I2S, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 36x10b, 16x12b
Core Processor: e200z4
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tray
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MC33937APEK MC33937APEK NXP USA Inc. MC33937.pdf Description: IC MOTOR DRIVER 6V-58V 54SOIC
Grade: Automotive
Motor Type - AC, DC: Brushless DC (BLDC)
Supplier Device Package: 54-SOIC-EP
Technology: NMOS
Voltage - Supply: 6V ~ 58V
Output Configuration: Pre-Driver - Half Bridge (3)
Operating Temperature: -40°C ~ 135°C (TA)
Interface: SPI
Function: Controller - Commutation, Direction Management
Mounting Type: Surface Mount
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
auf Bestellung 34 Stücke:
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2+9.57 EUR
10+7.36 EUR
26+6.78 EUR
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PCA9958HNY PCA9958HNY NXP USA Inc. PCA9958.pdf Description: PCA9958HNY
Type: Linear
Frequency: 31.25kHz
Number of Outputs: 24
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 2.7V
Dimming: PWM, SPI
Supplier Device Package: 40-HVQFN (6x6)
Topology: Constant Current
Internal Switch(s): No
Current - Output / Channel: 63mA
Applications: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
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4+4.63 EUR
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250+2.68 EUR
500+2.59 EUR
1000+2.51 EUR
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MCXC243VFT NXP USA Inc. MCXCFS.pdf Description: 48MHz, Cortex-M0+, USB
Number of I/O: 36
Supplier Device Package: 48-QFN (7x7)
Peripherals: DMA, PWM, WDT
Connectivity: I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 16b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 48-UFQFN Exposed Pad
Packaging: Tray
auf Bestellung 1300 Stücke:
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5+4.29 EUR
10+4.01 EUR
25+3.7 EUR
80+3.42 EUR
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MPC8315ECVRAGDA MPC8315ECVRAGDA NXP USA Inc. MPC8315EEC.pdf Description: IC MPU MPC83XX 400MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI, TDM
SATA: SATA 3Gbps (2)
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 3.3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
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S9S12VRP64F0MLFR NXP USA Inc. Description: MAGNIV 16-BIT MCU, S12 CORE, 64K
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC908AP8ACFBE MC908AP8ACFBE NXP USA Inc. MC68HC908AP64A.pdf Description: IC MCU 8BIT 8KB FLASH 44QFP
DigiKey Programmable: Not Verified
Number of I/O: 32
Supplier Device Package: 44-QFP (10x10)
Peripherals: LED, LVD, POR, PWM
Connectivity: I2C, IRSCI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 44-QFP
Packaging: Tray
Produkt ist nicht verfügbar
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MC908AP16ACFBE557 MC908AP16ACFBE557 NXP USA Inc. MC68HC908AP64A.pdf Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74AUP1T34GM,132 74AUP1T34GM,132 NXP USA Inc. PHGLS28626-1.pdf?t.download=true&u=5oefqw Description: IC TRANSLTR UNIDIRECTIONAL 6XSON
Supplier Device Package: 6-XSON (1.45x1)
Current - Output High, Low: 4mA, 4mA
Number of Bits per Element: 1
Voltage - Supply: 1.1V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 6-XFDFN
Packaging: Bulk
auf Bestellung 470000 Stücke:
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2551+0.2 EUR
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74AUP1T34GN,132 74AUP1T34GN,132 NXP USA Inc. 74AUP1T34.pdf Description: IC TRANSLTR UNIDIRECTIONAL 6XSON
Supplier Device Package: 6-XSON (0.9x1)
Current - Output High, Low: 4mA, 4mA
Number of Bits per Element: 1
Voltage - Supply: 1.1V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 6-XFDFN
Packaging: Bulk
auf Bestellung 57632 Stücke:
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1800+0.29 EUR
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TDA19988AET/C1,151 NXP USA Inc. PHGL-S-A0002555885-1.pdf?t.download=true&u=5oefqw Description: IC VIDEO HDMI TRANS 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Function: Transmitter
Applications: Consumer Video
Standards: HDMI 1.4a, ITU656
Supplier Device Package: 64-TFBGA (4.5x4.5)
Control Interface: I2S
Produkt ist nicht verfügbar
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TDA19988BET/C1,151 NXP USA Inc. PHGL-S-A0002555885-1.pdf?t.download=true&u=5oefqw Description: IC VIDEO HDMI TRANS 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Function: Transmitter
Applications: Consumer Video
Standards: HDMI 1.4a, ITU656
Supplier Device Package: 64-TFBGA (4.5x4.5)
Control Interface: I2S
Produkt ist nicht verfügbar
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RW612CET/A2IK RW61XFS.pdf
RW612CET/A2IK
Hersteller: NXP USA Inc.
Description: RW612CET/A2IK
Packaging: Bulk
Produkt ist nicht verfügbar
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74LVC1G384GXH 74LVC1G384.pdf
74LVC1G384GXH
Hersteller: NXP USA Inc.
Description: IC SWITCH SPST-NCX1 10OHM 5X2SON
Number of Circuits: 1
Current - Leakage (IS(off)) (Max): 5µA
Channel Capacitance (CS(off), CD(off)): 5pF
Switch Time (Ton, Toff) (Max): 4.2ns, 5ns
Multiplexer/Demultiplexer Circuit: 1:1
Switch Circuit: SPST - NC
Charge Injection: 7.5pC
Voltage - Supply, Single (V+): 1.65V ~ 5.5V
Supplier Device Package: 5-X2SON (0.80x0.80)
-3db Bandwidth: 500MHz
On-State Resistance (Max): 10Ohm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 4-XFDFN Exposed Pad
Packaging: Bulk
auf Bestellung 833262 Stücke:
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2953+0.16 EUR
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SE051C2HQ1/Z01XDZ AN13013.pdf
SE051C2HQ1/Z01XDZ
Hersteller: NXP USA Inc.
Description: SE051C2HQ1
Packaging: Cut Tape (CT)
Package / Case: 20-XFQFN Exposed Pad
Mounting Type: Surface Mount
Type: IoT Secure Element
Supplier Device Package: 20-HX2QFN (3x3)
auf Bestellung 1478 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3+7.87 EUR
10+5.99 EUR
25+5.52 EUR
100+5.01 EUR
250+4.78 EUR
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BGU8019X BGU8019.pdf
BGU8019X
Hersteller: NXP USA Inc.
Description: IC AMP GALI 1.559-1.61GHZ 6XSON
Packaging: Tape & Reel (TR)
Supplier Device Package: 6-XSON (1.1x0.7)
Test Frequency: 1.575GHz
P1dB: -7dBm
Noise Figure: 0.55dB
Current - Supply: 4.6mA
Gain: 18.5dB
Voltage - Supply: 1.5V ~ 3.1V
RF Type: Galileo, GLONASS, GPS
Frequency: 1.559GHz ~ 1.61GHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
auf Bestellung 45000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
5000+0.3 EUR
10000+0.29 EUR
15000+0.28 EUR
25000+0.27 EUR
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BGU8019X BGU8019.pdf
BGU8019X
Hersteller: NXP USA Inc.
Description: IC AMP GALI 1.559-1.61GHZ 6XSON
Supplier Device Package: 6-XSON (1.1x0.7)
Test Frequency: 1.575GHz
P1dB: -7dBm
Noise Figure: 0.55dB
Current - Supply: 4.6mA
Gain: 18.5dB
Voltage - Supply: 1.5V ~ 3.1V
RF Type: Galileo, GLONASS, GPS
Frequency: 1.559GHz ~ 1.61GHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Cut Tape (CT)
auf Bestellung 45192 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
35+0.51 EUR
40+0.44 EUR
43+0.42 EUR
100+0.38 EUR
250+0.36 EUR
500+0.34 EUR
1000+0.33 EUR
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PZU8.2B,115 PHGLS19743-1.pdf?t.download=true&u=5oefqw
PZU8.2B,115
Hersteller: NXP USA Inc.
Description: DIODE ZENER 8.2V 310MW SOD323F
Packaging: Bulk
auf Bestellung 25464 Stücke:
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AnzahlPreis
10804+0.051 EUR
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S9S08QD2J1MSC MC9S08QD4.pdf
S9S08QD2J1MSC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68020CRC25E MC68020UM.pdf
MC68020CRC25E
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 25MHZ 114PGA
Packaging: Tray
Package / Case: 114-BPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: 68020
Voltage - I/O: 5.0V
Supplier Device Package: 114-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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S912ZVC64ACLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Grade: Automotive
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x10b SAR
Core Processor: S12Z
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Number of I/O: 28
Produkt ist nicht verfügbar
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S912ZVC64ACLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 28
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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FH32K144HAT0MLFT
Hersteller: NXP USA Inc.
Description: S32K144, 512K FLASH, 64K RAM
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
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LPC11U37HFBD64/4QL LPC11U1X.pdf
LPC11U37HFBD64/4QL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC7448HX1250ND MPC7448ECS01AD.pdf
MC7448HX1250ND
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 1.25GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.25GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
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P3A9606JK-EVB UM11385.pdf
P3A9606JK-EVB
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR P3A9606
Embedded: No
Primary Attributes: 2-Channel (Dual)
Utilized IC / Part: P3A9606
Contents: Board(s)
Type: Interface
Function: Level Shifter
Packaging: Bulk
Produkt ist nicht verfügbar
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74AUP1G07GX,125 PHGLS25181-1.pdf?t.download=true&u=5oefqw
74AUP1G07GX,125
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 5-X2SON (0.80x0.80)
auf Bestellung 9500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
4661+0.1 EUR
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MC9S08LC36LH MC9S08LC60.pdf
MC9S08LC36LH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 36KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 36KB (36K x 8)
RAM Size: 2.5K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08LC36LH FSCLS03842-1.pdf?t.download=true&u=5oefqw
MC9S08LC36LH
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 36KB (36K x 8)
RAM Size: 2.5K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 18
DigiKey Programmable: Not Verified
auf Bestellung 700 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
49+10.5 EUR
Mindestbestellmenge: 49 Stücke
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ON5200,118
Hersteller: NXP USA Inc.
Description: RF MOSFET D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-5, D2PAK (4 Leads + Tab), TO-263BB
Mounting Type: Surface Mount
Supplier Device Package: D2PAK
Produkt ist nicht verfügbar
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S912XEP100J5CAG
S912XEP100J5CAG
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 1MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 119
Supplier Device Package: 144-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 24x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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74LVC623AD,118 74lvc623a_3.pdf
74LVC623AD,118
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 20SO
Supplier Device Package: 20-SO
Current - Output High, Low: 24mA, 24mA
Number of Bits per Element: 8
Voltage - Supply: 1.2V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
auf Bestellung 3220 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
720+0.71 EUR
Mindestbestellmenge: 720 Stücke
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MC35FS6507NAER2 35FS4500-35FS6500-ASILD.pdf
MC35FS6507NAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC35FS6507NAE 35FS4500-35FS6500-ASILD.pdf
MC35FS6507NAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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MC33AR6000BGT AR6000.pdf
MC33AR6000BGT
Hersteller: NXP USA Inc.
Description: IC REG ALTERNATOR 1OUT TO220-5
Grade: Automotive
Supplier Device Package: TO-220-5
Applications: Alternator, 3-Phase
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Input: 5V ~ 16.5V
Number of Outputs: 1
Mounting Type: Through Hole
Voltage - Output: 10.6V ~ 16V
Package / Case: TO-220-5
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MK20DX256VLK10R K20P81M100SF2V2.pdf
MK20DX256VLK10R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80FQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MK20DX256VLK10R K20P81M100SF2V2.pdf
MK20DX256VLK10R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80FQFP
Packaging: Cut Tape (CT)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 52
DigiKey Programmable: Not Verified
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+18.71 EUR
10+14.69 EUR
25+13.69 EUR
100+12.58 EUR
250+12.37 EUR
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A3T21H456W23SR6 A3T21H456W23S.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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RDA777T2
Hersteller: NXP USA Inc.
Description: RDA777T2
Packaging: Bulk
Produkt ist nicht verfügbar
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MF1PH4230DA4/00J MF1P(H)x2.pdf
Hersteller: NXP USA Inc.
Description: MIFAREA PLUS EV2
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: MOA4, Smart Card Module
Packaging: Tape & Reel (TR)
Supplier Device Package: PLLMC
Standards: Mifare, NFC
Produkt ist nicht verfügbar
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SPC5643AF0MVZ2 MPC5644A.pdf
SPC5643AF0MVZ2
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 324PBGA
DigiKey Programmable: Not Verified
Number of I/O: 151
Supplier Device Package: 324-PBGA (23x23)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.25V
Core Size: 32-Bit Single-Core
Data Converters: A/D 40x12b
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 324-BBGA
Packaging: Tray
Produkt ist nicht verfügbar
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S32G233ASBK0VUCT S32G2.pdf
Hersteller: NXP USA Inc.
Description: S32G233A ARM CORTEX-M7 AND -A53,
Package / Case: 525-FBGA, FCBGA
Packaging: Tray
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Graphics Acceleration: No
RAM Controllers: DDR3L, LPDDR4
Co-Processors/DSP: Multimedia; NEON
Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit
USB: USB 2.0 OTG (1)
Ethernet: GbE (4)
Supplier Device Package: 525-FCPBGA (19x19)
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz, 1GHz
Mounting Type: Surface Mount
Qualification: AEC-Q100
Grade: Automotive
Produkt ist nicht verfügbar
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SLS1046ASN8T1A
Hersteller: NXP USA Inc.
Description: SLS1046A ST 1.8GHZ DDR 2100 MT/
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
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TDA8034T/C1,112 TDA8034T_TDA8034AT.pdf
TDA8034T/C1,112
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 16SO
Supplier Device Package: 16-SO
Voltage - Supply: 3V, 5V
Interface: Analog
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tube
auf Bestellung 653 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
10+1.87 EUR
14+1.35 EUR
50+1.14 EUR
100+1.08 EUR
250+1.01 EUR
500+0.97 EUR
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MC9S12GC64MFUE MC9S12C128V1.pdf
MC9S12GC64MFUE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 60
Supplier Device Package: 80-QFP (14x14)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Produkt ist nicht verfügbar
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MC35FS6518CAER2 35FS4500-35FS6500-ASILD.pdf
MC35FS6518CAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
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S32G234MSBK1VUCR S32G2.pdf
Hersteller: NXP USA Inc.
Description: S32G234M ARM CORTEX-M7, HSE W/PR
Qualification: AEC-Q100
Grade: Automotive
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; NEON
Number of Cores/Bus Width: 3 Core, 32/64-Bit
Ethernet: 1/2.5Gbps (4)
Supplier Device Package: 525-FCPBGA (19x19)
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Core Processor: ARM® Cortex®-M7
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 525-FBGA, FCBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NCK2982RHN/10101Y
Hersteller: NXP USA Inc.
Description: NCK2982RHN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MIMX8UD7CVP08SC AN13914.pdf
MIMX8UD7CVP08SC
Hersteller: NXP USA Inc.
Description: I.MX8ULP, DUAL 800MHZ
Supplier Device Package: 485-LFBGA (15x15)
Mounting Type: Surface Mount
Package / Case: 485-LFBGA
Packaging: Tray
auf Bestellung 170 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+39.78 EUR
10+32.02 EUR
25+30.08 EUR
100+27.95 EUR
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MPF5020CMBA0ES PF5020.pdf
MPF5020CMBA0ES
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 487 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+11.26 EUR
10+8.69 EUR
25+8.04 EUR
100+7.34 EUR
Mindestbestellmenge: 2 Stücke
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MPF5024CMBA0ES PF5024.pdf
MPF5024CMBA0ES
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 4
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 40-HVQFN (6x6)
Applications: High Performance i.MX 8 Processor Based
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 480 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+11.14 EUR
10+8.6 EUR
25+7.97 EUR
100+7.27 EUR
Mindestbestellmenge: 2 Stücke
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MPF7100BVMA3ES PF7100.pdf
MPF7100BVMA3ES
Hersteller: NXP USA Inc.
Description: PF7100 PMIC I.MX8DXP/DX
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HVQFN (7x7)
Current - Supply: 10µA
Applications: i.MX Processors
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+12.02 EUR
10+9.31 EUR
25+8.63 EUR
100+7.88 EUR
260+7.51 EUR
Mindestbestellmenge: 2 Stücke
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MIMX8US5DVP08SC IMX8ULPIEC.pdf
MIMX8US5DVP08SC
Hersteller: NXP USA Inc.
Description: I.MX8ULP, SOLO 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
auf Bestellung 530 Stücke:
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1+29.06 EUR
10+23.12 EUR
25+21.64 EUR
100+20.02 EUR
250+19.24 EUR
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MSC8157TAG1000A MSC8157.pdf
MSC8157TAG1000A
Hersteller: NXP USA Inc.
Description: IC DSP 6X 1GHZ SC3850 783FCBGA
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
Supplier Device Package: 783-FCPBGA (29x29)
Clock Rate: 1GHz
Voltage - Core: 1.00V
Voltage - I/O: 1.0V, 1.5V, 2.5V
On-Chip RAM: 6.375MB
Non-Volatile Memory: ROM (96KB)
Operating Temperature: -40°C ~ 105°C (TJ)
Type: SC3850 Six Core
Produkt ist nicht verfügbar
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CBT3306D,118 PHGLS24512-1.pdf?t.download=true&u=5oefqw
CBT3306D,118
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 1 X 1:1 8SO
Supplier Device Package: 8-SO
Voltage Supply Source: Single Supply
Independent Circuits: 2
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Bus Switch
Circuit: 1 x 1:1
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
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1268+0.4 EUR
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PEMH7,115 PEMH7_PUMH7.pdf
PEMH7,115
Hersteller: NXP USA Inc.
Description: TRANS 2NPN PREBIAS 0.3W SOT666
Packaging: Bulk
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6772+0.067 EUR
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MRF6VP11KHR5 FSCLS07342-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Voltage - Test: 50 V
Voltage - Rated: 110 V
Supplier Device Package: NI-1230
Technology: LDMOS (Dual)
Gain: 26dB
Power - Output: 1000W
Configuration: 2 N-Channel
Frequency: 1.8MHz ~ 150MHz
Mounting Type: Chassis Mount
Package / Case: NI-1230
Packaging: Bulk
Current - Test: 6 A
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MC35FS4500NAE FS6500-FS4500-ASILD.pdf
MC35FS4500NAE
Hersteller: NXP USA Inc.
Description: FS4500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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2+13.43 EUR
10+10.42 EUR
25+9.67 EUR
100+8.84 EUR
250+8.45 EUR
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SPC5742PK1MLQ5R MPC574xP_FS.pdf
SPC5742PK1MLQ5R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 64x12b
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SPC5742PK1MLQ5 MPC574xP_FS.pdf
SPC5742PK1MLQ5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 64x12b
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5744BK1AMMH2 MPC5746C.pdf
SPC5744BK1AMMH2
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 100MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: DMA, I2S, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 36x10b, 16x12b
Core Processor: e200z4
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MC33937APEK MC33937.pdf
MC33937APEK
Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 6V-58V 54SOIC
Grade: Automotive
Motor Type - AC, DC: Brushless DC (BLDC)
Supplier Device Package: 54-SOIC-EP
Technology: NMOS
Voltage - Supply: 6V ~ 58V
Output Configuration: Pre-Driver - Half Bridge (3)
Operating Temperature: -40°C ~ 135°C (TA)
Interface: SPI
Function: Controller - Commutation, Direction Management
Mounting Type: Surface Mount
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
auf Bestellung 34 Stücke:
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2+9.57 EUR
10+7.36 EUR
26+6.78 EUR
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PCA9958HNY PCA9958.pdf
PCA9958HNY
Hersteller: NXP USA Inc.
Description: PCA9958HNY
Type: Linear
Frequency: 31.25kHz
Number of Outputs: 24
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 2.7V
Dimming: PWM, SPI
Supplier Device Package: 40-HVQFN (6x6)
Topology: Constant Current
Internal Switch(s): No
Current - Output / Channel: 63mA
Applications: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
auf Bestellung 4000 Stücke:
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4+4.63 EUR
10+3.45 EUR
25+3.16 EUR
100+2.83 EUR
250+2.68 EUR
500+2.59 EUR
1000+2.51 EUR
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MCXC243VFT MCXCFS.pdf
Hersteller: NXP USA Inc.
Description: 48MHz, Cortex-M0+, USB
Number of I/O: 36
Supplier Device Package: 48-QFN (7x7)
Peripherals: DMA, PWM, WDT
Connectivity: I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 16b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 48-UFQFN Exposed Pad
Packaging: Tray
auf Bestellung 1300 Stücke:
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AnzahlPreis
5+4.29 EUR
10+4.01 EUR
25+3.7 EUR
80+3.42 EUR
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MPC8315ECVRAGDA MPC8315EEC.pdf
MPC8315ECVRAGDA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI, TDM
SATA: SATA 3Gbps (2)
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 3.3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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S9S12VRP64F0MLFR
Hersteller: NXP USA Inc.
Description: MAGNIV 16-BIT MCU, S12 CORE, 64K
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC908AP8ACFBE MC68HC908AP64A.pdf
MC908AP8ACFBE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 44QFP
DigiKey Programmable: Not Verified
Number of I/O: 32
Supplier Device Package: 44-QFP (10x10)
Peripherals: LED, LVD, POR, PWM
Connectivity: I2C, IRSCI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 44-QFP
Packaging: Tray
Produkt ist nicht verfügbar
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MC908AP16ACFBE557 MC68HC908AP64A.pdf
MC908AP16ACFBE557
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74AUP1T34GM,132 PHGLS28626-1.pdf?t.download=true&u=5oefqw
74AUP1T34GM,132
Hersteller: NXP USA Inc.
Description: IC TRANSLTR UNIDIRECTIONAL 6XSON
Supplier Device Package: 6-XSON (1.45x1)
Current - Output High, Low: 4mA, 4mA
Number of Bits per Element: 1
Voltage - Supply: 1.1V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 6-XFDFN
Packaging: Bulk
auf Bestellung 470000 Stücke:
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2551+0.2 EUR
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74AUP1T34GN,132 74AUP1T34.pdf
74AUP1T34GN,132
Hersteller: NXP USA Inc.
Description: IC TRANSLTR UNIDIRECTIONAL 6XSON
Supplier Device Package: 6-XSON (0.9x1)
Current - Output High, Low: 4mA, 4mA
Number of Bits per Element: 1
Voltage - Supply: 1.1V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 6-XFDFN
Packaging: Bulk
auf Bestellung 57632 Stücke:
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1800+0.29 EUR
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TDA19988AET/C1,151 PHGL-S-A0002555885-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC VIDEO HDMI TRANS 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Function: Transmitter
Applications: Consumer Video
Standards: HDMI 1.4a, ITU656
Supplier Device Package: 64-TFBGA (4.5x4.5)
Control Interface: I2S
Produkt ist nicht verfügbar
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TDA19988BET/C1,151 PHGL-S-A0002555885-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC VIDEO HDMI TRANS 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Function: Transmitter
Applications: Consumer Video
Standards: HDMI 1.4a, ITU656
Supplier Device Package: 64-TFBGA (4.5x4.5)
Control Interface: I2S
Produkt ist nicht verfügbar
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