Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (34434) > Seite 564 nach 574
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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AW690HNK/A2WK | NXP USA Inc. |
Description: IC Packaging: Bulk |
Produkt ist nicht verfügbar |
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LPC2925FBD100,551 | NXP USA Inc. |
Description: IC MCU 16/32B 512KB FLSH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 125MHz Program Memory Size: 512KB (512K x 8) RAM Size: 40K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM9® Data Converters: A/D 16x8b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, I2C, LINbus, SPI, UART/USART, USB Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 60 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S12GN32J1MTJ | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 20TSSOP Packaging: Tube Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S12 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 20-TSSOP Number of I/O: 14 |
Produkt ist nicht verfügbar |
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NCF29AEXHN4/0100ZY | NXP USA Inc. |
Description: NCF29AEXHN4 Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Supplier Device Package: 40-HVQFN (6x6) |
Produkt ist nicht verfügbar |
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MFS5600AMMA7ESR2 | NXP USA Inc. |
Description: DUAL 36V AUTOMOTIVE DC-DC CONTRO Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.7V ~ 36V Current - Supply: 140µA Supplier Device Package: 32-HVQFN (5x5) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MPF5023CMBA0ESR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC, PRE-PROG, 3 Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: 200µA Supplier Device Package: 40-HVQFN (6x6) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MC34PF3001A5EPR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC I.MX7 PRE- Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.8V ~ 5.5V Applications: Processor Supplier Device Package: 48-HVQFN (7x7) |
Produkt ist nicht verfügbar |
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MC35FS6505NAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MFS2602AMDA0ADR2 | NXP USA Inc. |
Description: AUTO SBC Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3.2V ~ 40V Current - Supply: 30µA Supplier Device Package: 48-LQFP-EP (7x7) Grade: Automotive |
Produkt ist nicht verfügbar |
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MPF7100BVBA2ESR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC, I.MX 8XL WI Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: i.MX Processors Current - Supply: 10µA Supplier Device Package: 48-HVQFN (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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S912ZVCA19F1WLFR | NXP USA Inc. |
Description: S12Z, 48LQFP, 192K FLASH Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 192KB (192K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 150°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12Z Data Converters: A/D 10x12b SAR; D/A 1x8b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V Connectivity: CANbus, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 28 |
Produkt ist nicht verfügbar |
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MC33FS8435G0ESR2 | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN5 Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: System Basis Chip Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MKV46F128VLL16R | NXP USA Inc. |
Description: KINETIS KV46: 168MHZ M4F REAL-TI Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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MWCT2014SHVPAR | NXP USA Inc. |
Description: MAXQFP100,512KB Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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S912XET256W1MAAR | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 80QFP Packaging: Tape & Reel (TR) Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 256KB (256K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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AW690HNK/A2AMP | NXP USA Inc. |
Description: IC Packaging: Bulk |
Produkt ist nicht verfügbar |
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SCBGARBU1AO | NXP USA Inc. |
Description: BGA RECEIVER/ADAPTER, 324 PIN, 1 Packaging: Bulk Module/Board Type: Socket Module - BGA |
Produkt ist nicht verfügbar |
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8MPNAVQ-8GB-G | NXP USA Inc. |
Description: DEV KIT Packaging: Bulk Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: ARM® Cortex®-A53 Utilized IC / Part: i.MX 8M Plus |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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WCT-15WTXAUTO | NXP USA Inc. |
Description: WCT-15WTXAUTO Packaging: Bulk Function: Wireless Power Supply/Charging Type: Power Management Supplied Contents: Board(s) Primary Attributes: Transmitter |
Produkt ist nicht verfügbar |
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MKE02Z32VLC2R | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32LQFP Packaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b; D/A 2x6b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 28 DigiKey Programmable: Not Verified |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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MKE02Z32VLC2R | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32LQFP Packaging: Cut Tape (CT) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b; D/A 2x6b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 28 DigiKey Programmable: Not Verified |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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NCK2910AHN/10204Y | NXP USA Inc. |
Description: NCK2910AHN Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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KITPF5030FRDMEVM | NXP USA Inc. |
Description: KITPF5030FRDMEVM Packaging: Bulk Function: Power Supply Type: Power Management Utilized IC / Part: PF5030 Supplied Contents: Board(s), Cable(s), Accessories Embedded: Yes, MCU |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC8358VRAGDGA | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 668BGA Packaging: Tray Package / Case: 668-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 668-PBGA-PGE (29x29) Ethernet: 10/100/1000Mbps (1) USB: USB 1.x (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART |
Produkt ist nicht verfügbar |
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LFK46MINTPT4A | NXP USA Inc. |
Description: QORIVVA MPC5746M ON A 292 PIN 0. Packaging: Bulk For Use With/Related Products: MPC5746M Module/Board Type: Socket Adapter |
Produkt ist nicht verfügbar |
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TEA1998TS/1Z | NXP USA Inc. |
Description: IC SYNC RECT CONTROLLER 6TSOP Packaging: Tape & Reel (TR) Package / Case: SC-74, SOT-457 Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C Voltage - Supply: 60V Applications: Secondary-Side Controller, Synchronous Rectifier Supplier Device Package: SC-74 Current - Supply: 250 µA DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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TEA1993TS/1Z | NXP USA Inc. |
Description: IC SYNC RECT CONTROLLER 6TSOP Packaging: Tape & Reel (TR) Package / Case: SC-74, SOT-457 Mounting Type: Surface Mount Applications: Secondary-Side Controller, Synchronous Rectifier Supplier Device Package: SC-74 Current - Supply: 200 µA DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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TEA19162HT/2J | NXP USA Inc. |
Description: IC PFC CONTROLLER SO8 Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C Voltage - Supply: 70 ~ 276 VAC Frequency - Switching: 134kHz Mode: Discontinuous Conduction (DCM) Supplier Device Package: 8-SO Current - Startup: 800 µA |
Produkt ist nicht verfügbar |
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S9S12GN16J0VLF | NXP USA Inc. |
Description: IC MCU 16BIT 16KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 |
Produkt ist nicht verfügbar |
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MC908JB8JDWE | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 20SOIC Packaging: Tube Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 3MHz Program Memory Size: 8KB (8K x 8) RAM Size: 256 x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4V ~ 5.5V Connectivity: USB Peripherals: LVD, POR, PWM Supplier Device Package: 20-SOIC Number of I/O: 13 DigiKey Programmable: Not Verified |
auf Bestellung 17 Stücke: Lieferzeit 10-14 Tag (e) |
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MWCT2016SHVPBR | NXP USA Inc. |
Description: MWCT2016S,MAXQFP172 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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MWCT2016SHVPB | NXP USA Inc. |
Description: MWCT2016S,MAXQFP172 Packaging: Tray |
Produkt ist nicht verfügbar |
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SSL3250AHN/C1,528 | NXP USA Inc. |
Description: IC LED DRVR RGLTR I2C 16HVQFN Packaging: Tape & Reel (TR) Package / Case: 16-VFQFN Exposed Pad Voltage - Output: 9.5V Mounting Type: Surface Mount Number of Outputs: 1 Frequency: 1.2MHz Type: DC DC Regulator Operating Temperature: -40°C ~ 85°C (TA) Applications: Camera Flash Current - Output / Channel: 500mA Internal Switch(s): Yes Topology: Step-Up (Boost) Supplier Device Package: 16-HVQFN (3x3) Dimming: I2C Voltage - Supply (Min): 2.7V Voltage - Supply (Max): 5.5V |
Produkt ist nicht verfügbar |
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SSL3250AHN/C1,528 | NXP USA Inc. |
Description: IC LED DRVR RGLTR I2C 16HVQFN Packaging: Cut Tape (CT) Package / Case: 16-VFQFN Exposed Pad Voltage - Output: 9.5V Mounting Type: Surface Mount Number of Outputs: 1 Frequency: 1.2MHz Type: DC DC Regulator Operating Temperature: -40°C ~ 85°C (TA) Applications: Camera Flash Current - Output / Channel: 500mA Internal Switch(s): Yes Topology: Step-Up (Boost) Supplier Device Package: 16-HVQFN (3x3) Dimming: I2C Voltage - Supply (Min): 2.7V Voltage - Supply (Max): 5.5V |
Produkt ist nicht verfügbar |
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MC32PF1550A8EPR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC 3 BUCK REGS Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 4.1V ~ 6V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
Produkt ist nicht verfügbar |
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MCIMX6S8DVM10AB | NXP USA Inc. |
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA Packaging: Tray Package / Case: 624-LFBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-MAPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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DSPB56374AE | NXP USA Inc. |
Description: IC DSP 24BIT 150MHZ 52-LQFP Packaging: Tray Package / Case: 52-LQFP Mounting Type: Surface Mount Interface: Host Interface, I2C, SAI, SPI Type: Audio Processor Operating Temperature: 0°C ~ 70°C (TA) Non-Volatile Memory: ROM (84kB) On-Chip RAM: 54kB Voltage - I/O: 3.30V Voltage - Core: 1.25V Clock Rate: 150MHz Supplier Device Package: 52-TQFP (10x10) |
Produkt ist nicht verfügbar |
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S912XEG384J3VAA | NXP USA Inc. |
Description: IC MCU 16BIT 384KB FLASH 80QFP Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 384KB (384K x 8) RAM Size: 24K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCF51QU64VLF | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 13x12b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 35 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC33PF8100FJESR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC, I.MX8, PRE- Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: Processor Current - Supply: 10µA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MC33PF8100FJES | NXP USA Inc. |
Description: POWER MANAGEMENT IC, I.MX8, PRE- Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: Processor Current - Supply: 10µA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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FS32K118LFT0VLFT | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 25K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 43 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S12ZVML-MINIKIT | NXP USA Inc. |
Description: S12ZVML-MINIBRD WITH A LINIX PM Packaging: Bulk Function: Motor Controller/Driver Type: Power Management Utilized IC / Part: S12ZVML128 Supplied Contents: Board(s) Primary Attributes: Motors (PMSM) Embedded: Yes, MCU, 16-Bit |
Produkt ist nicht verfügbar |
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MIMXRT106PDVL6B | NXP USA Inc. |
Description: IC MCU 32BIT 128MB ROM 196LFBGA Packaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 600MHz Program Memory Size: 128KB (128K x 8) RAM Size: 1M x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: External, Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x16b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Supplier Device Package: 196-MAPBGA (10x10) Number of I/O: 127 |
Produkt ist nicht verfügbar |
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SL3S1204FUD/HA1Z | NXP USA Inc. |
Description: IC RFID TRANSP 860-960MHZ WAFER Packaging: Tray Package / Case: Die Mounting Type: Surface Mount Frequency: 860MHz ~ 960MHz Type: RFID Transponder Operating Temperature: -40°C ~ 85°C Standards: EPC Supplier Device Package: Wafer |
Produkt ist nicht verfügbar |
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MIMXRT1011DAE5AR | NXP USA Inc. |
Description: IC MCU 32BIT 64KB ROM 80LQFP Packaging: Cut Tape (CT) Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 500MHz Program Memory Size: 64KB (64K x 8) RAM Size: 128K x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: External, Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M7 Data Converters: A/D 15x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.3V Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 80-FQFP (12x12) Number of I/O: 44 |
Produkt ist nicht verfügbar |
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74HC4066DB,118 | NXP USA Inc. |
Description: IC SWITCH QUAD 1X2 14SSOP Packaging: Bulk |
auf Bestellung 30000 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC4066DB,112 | NXP USA Inc. |
Description: IC SWITCH QUAD 1X1 14SSOP Packaging: Tube |
auf Bestellung 9230 Stücke: Lieferzeit 10-14 Tag (e) |
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FXLN8372QR1 | NXP USA Inc. |
Description: ACCELEROMETER 4-16G ANALOG 12QFN Features: Selectable Scale Packaging: Tape & Reel (TR) Package / Case: 12-VQFN Exposed Pad Output Type: Analog Voltage Mounting Type: Surface Mount Type: Analog Axis: X, Y, Z Acceleration Range: ±4g, 16g Operating Temperature: -40°C ~ 105°C Voltage - Supply: 1.71V ~ 3.6V Bandwidth: 2.7kHz (X,Y), 600Hz (Z) Supplier Device Package: 12-QFN (3x3) Sensitivity (mV/g): 114.5 (±4g) ~ 28.62 (±16g) |
Produkt ist nicht verfügbar |
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TJA1128BTK/1Z | NXP USA Inc. |
Description: LIN MINI SYSTEM BASIS CHIP WITH Packaging: Tape & Reel (TR) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Interface: SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 14-HVSON (3x4.5) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1128BTK/1Z | NXP USA Inc. |
Description: LIN MINI SYSTEM BASIS CHIP WITH Packaging: Cut Tape (CT) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Interface: SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 14-HVSON (3x4.5) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1128ATK/1Z | NXP USA Inc. |
Description: LIN MINI SYSTEM BASIS CHIP WITH Packaging: Tape & Reel (TR) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Interface: SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 14-HVSON (3x4.5) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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TJA1128ATK/1Z | NXP USA Inc. |
Description: LIN MINI SYSTEM BASIS CHIP WITH Packaging: Cut Tape (CT) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Interface: SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 14-HVSON (3x4.5) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 5000 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1128CTK/1Z | NXP USA Inc. |
Description: LIN MINI SYSTEM BASIS CHIP WITH Packaging: Tape & Reel (TR) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Interface: SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 14-HVSON (3x4.5) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1128CTK/1Z | NXP USA Inc. |
Description: LIN MINI SYSTEM BASIS CHIP WITH Packaging: Cut Tape (CT) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Interface: SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 14-HVSON (3x4.5) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1128FTK/1Z | NXP USA Inc. |
Description: LIN MINI SYSTEM BASIS CHIP WITH Packaging: Tape & Reel (TR) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Interface: SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 14-HVSON (3x4.5) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1128FTK/1Z | NXP USA Inc. |
Description: LIN MINI SYSTEM BASIS CHIP WITH Packaging: Cut Tape (CT) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Interface: SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 14-HVSON (3x4.5) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1128ETK/1Z | NXP USA Inc. |
Description: LIN MINI SYSTEM BASIS CHIP WITH Packaging: Tape & Reel (TR) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Interface: SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 14-HVSON (3x4.5) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1128ETK/1Z | NXP USA Inc. |
Description: LIN MINI SYSTEM BASIS CHIP WITH Packaging: Cut Tape (CT) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Interface: SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 14-HVSON (3x4.5) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1128DTK/1Z | NXP USA Inc. |
Description: LIN MINI SYSTEM BASIS CHIP WITH Packaging: Tape & Reel (TR) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Interface: SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 14-HVSON (3x4.5) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC2925FBD100,551 |
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 512KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM9®
Data Converters: A/D 16x8b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 60
DigiKey Programmable: Not Verified
Description: IC MCU 16/32B 512KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM9®
Data Converters: A/D 16x8b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 60
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S12GN32J1MTJ |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 14
Description: IC MCU 16BIT 32KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 14
Produkt ist nicht verfügbar
NCF29AEXHN4/0100ZY |
Hersteller: NXP USA Inc.
Description: NCF29AEXHN4
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 40-HVQFN (6x6)
Description: NCF29AEXHN4
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 40-HVQFN (6x6)
Produkt ist nicht verfügbar
MFS5600AMMA7ESR2 |
Hersteller: NXP USA Inc.
Description: DUAL 36V AUTOMOTIVE DC-DC CONTRO
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 36V
Current - Supply: 140µA
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Description: DUAL 36V AUTOMOTIVE DC-DC CONTRO
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 36V
Current - Supply: 140µA
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
MPF5023CMBA0ESR2 |
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
MC34PF3001A5EPR2 |
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
MC35FS6505NAER2 |
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
MFS2602AMDA0ADR2 |
Hersteller: NXP USA Inc.
Description: AUTO SBC
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Description: AUTO SBC
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Produkt ist nicht verfügbar
MPF7100BVBA2ESR2 |
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, I.MX 8XL WI
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 10µA
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: POWER MANAGEMENT IC, I.MX 8XL WI
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 10µA
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
S912ZVCA19F1WLFR |
Hersteller: NXP USA Inc.
Description: S12Z, 48LQFP, 192K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x12b SAR; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Description: S12Z, 48LQFP, 192K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x12b SAR; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
MC33FS8435G0ESR2 |
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
MKV46F128VLL16R |
Produkt ist nicht verfügbar
MWCT2014SHVPAR |
Produkt ist nicht verfügbar
S912XET256W1MAAR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SCBGARBU1AO |
Hersteller: NXP USA Inc.
Description: BGA RECEIVER/ADAPTER, 324 PIN, 1
Packaging: Bulk
Module/Board Type: Socket Module - BGA
Description: BGA RECEIVER/ADAPTER, 324 PIN, 1
Packaging: Bulk
Module/Board Type: Socket Module - BGA
Produkt ist nicht verfügbar
8MPNAVQ-8GB-G |
Hersteller: NXP USA Inc.
Description: DEV KIT
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53
Utilized IC / Part: i.MX 8M Plus
Description: DEV KIT
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53
Utilized IC / Part: i.MX 8M Plus
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 610.95 EUR |
WCT-15WTXAUTO |
Hersteller: NXP USA Inc.
Description: WCT-15WTXAUTO
Packaging: Bulk
Function: Wireless Power Supply/Charging
Type: Power Management
Supplied Contents: Board(s)
Primary Attributes: Transmitter
Description: WCT-15WTXAUTO
Packaging: Bulk
Function: Wireless Power Supply/Charging
Type: Power Management
Supplied Contents: Board(s)
Primary Attributes: Transmitter
Produkt ist nicht verfügbar
MKE02Z32VLC2R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2000+ | 3.39 EUR |
MKE02Z32VLC2R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 6.76 EUR |
10+ | 5.28 EUR |
100+ | 4.33 EUR |
500+ | 4.24 EUR |
1000+ | 3.57 EUR |
NCK2910AHN/10204Y |
Produkt ist nicht verfügbar
KITPF5030FRDMEVM |
Hersteller: NXP USA Inc.
Description: KITPF5030FRDMEVM
Packaging: Bulk
Function: Power Supply
Type: Power Management
Utilized IC / Part: PF5030
Supplied Contents: Board(s), Cable(s), Accessories
Embedded: Yes, MCU
Description: KITPF5030FRDMEVM
Packaging: Bulk
Function: Power Supply
Type: Power Management
Utilized IC / Part: PF5030
Supplied Contents: Board(s), Cable(s), Accessories
Embedded: Yes, MCU
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 427.06 EUR |
MPC8358VRAGDGA |
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 668BGA
Packaging: Tray
Package / Case: 668-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 668-PBGA-PGE (29x29)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Description: IC MPU MPC83XX 400MHZ 668BGA
Packaging: Tray
Package / Case: 668-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 668-PBGA-PGE (29x29)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Produkt ist nicht verfügbar
LFK46MINTPT4A |
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5746M ON A 292 PIN 0.
Packaging: Bulk
For Use With/Related Products: MPC5746M
Module/Board Type: Socket Adapter
Description: QORIVVA MPC5746M ON A 292 PIN 0.
Packaging: Bulk
For Use With/Related Products: MPC5746M
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
TEA1998TS/1Z |
Hersteller: NXP USA Inc.
Description: IC SYNC RECT CONTROLLER 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 60V
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: SC-74
Current - Supply: 250 µA
DigiKey Programmable: Not Verified
Description: IC SYNC RECT CONTROLLER 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 60V
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: SC-74
Current - Supply: 250 µA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
TEA1993TS/1Z |
Hersteller: NXP USA Inc.
Description: IC SYNC RECT CONTROLLER 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: SC-74
Current - Supply: 200 µA
DigiKey Programmable: Not Verified
Description: IC SYNC RECT CONTROLLER 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: SC-74
Current - Supply: 200 µA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
TEA19162HT/2J |
Hersteller: NXP USA Inc.
Description: IC PFC CONTROLLER SO8
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 70 ~ 276 VAC
Frequency - Switching: 134kHz
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 8-SO
Current - Startup: 800 µA
Description: IC PFC CONTROLLER SO8
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 70 ~ 276 VAC
Frequency - Switching: 134kHz
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 8-SO
Current - Startup: 800 µA
Produkt ist nicht verfügbar
S9S12GN16J0VLF |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
MC908JB8JDWE |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 3MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4V ~ 5.5V
Connectivity: USB
Peripherals: LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 3MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4V ~ 5.5V
Connectivity: USB
Peripherals: LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 17 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 10.75 EUR |
10+ | 8.41 EUR |
MWCT2016SHVPBR |
Produkt ist nicht verfügbar
MWCT2016SHVPB |
Produkt ist nicht verfügbar
SSL3250AHN/C1,528 |
Hersteller: NXP USA Inc.
Description: IC LED DRVR RGLTR I2C 16HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Voltage - Output: 9.5V
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 1.2MHz
Type: DC DC Regulator
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Camera Flash
Current - Output / Channel: 500mA
Internal Switch(s): Yes
Topology: Step-Up (Boost)
Supplier Device Package: 16-HVQFN (3x3)
Dimming: I2C
Voltage - Supply (Min): 2.7V
Voltage - Supply (Max): 5.5V
Description: IC LED DRVR RGLTR I2C 16HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Voltage - Output: 9.5V
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 1.2MHz
Type: DC DC Regulator
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Camera Flash
Current - Output / Channel: 500mA
Internal Switch(s): Yes
Topology: Step-Up (Boost)
Supplier Device Package: 16-HVQFN (3x3)
Dimming: I2C
Voltage - Supply (Min): 2.7V
Voltage - Supply (Max): 5.5V
Produkt ist nicht verfügbar
SSL3250AHN/C1,528 |
Hersteller: NXP USA Inc.
Description: IC LED DRVR RGLTR I2C 16HVQFN
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Voltage - Output: 9.5V
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 1.2MHz
Type: DC DC Regulator
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Camera Flash
Current - Output / Channel: 500mA
Internal Switch(s): Yes
Topology: Step-Up (Boost)
Supplier Device Package: 16-HVQFN (3x3)
Dimming: I2C
Voltage - Supply (Min): 2.7V
Voltage - Supply (Max): 5.5V
Description: IC LED DRVR RGLTR I2C 16HVQFN
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Voltage - Output: 9.5V
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 1.2MHz
Type: DC DC Regulator
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Camera Flash
Current - Output / Channel: 500mA
Internal Switch(s): Yes
Topology: Step-Up (Boost)
Supplier Device Package: 16-HVQFN (3x3)
Dimming: I2C
Voltage - Supply (Min): 2.7V
Voltage - Supply (Max): 5.5V
Produkt ist nicht verfügbar
MC32PF1550A8EPR2 |
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC 3 BUCK REGS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.1V ~ 6V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: POWER MANAGEMENT IC 3 BUCK REGS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.1V ~ 6V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
MCIMX6S8DVM10AB |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
DSPB56374AE |
Hersteller: NXP USA Inc.
Description: IC DSP 24BIT 150MHZ 52-LQFP
Packaging: Tray
Package / Case: 52-LQFP
Mounting Type: Surface Mount
Interface: Host Interface, I2C, SAI, SPI
Type: Audio Processor
Operating Temperature: 0°C ~ 70°C (TA)
Non-Volatile Memory: ROM (84kB)
On-Chip RAM: 54kB
Voltage - I/O: 3.30V
Voltage - Core: 1.25V
Clock Rate: 150MHz
Supplier Device Package: 52-TQFP (10x10)
Description: IC DSP 24BIT 150MHZ 52-LQFP
Packaging: Tray
Package / Case: 52-LQFP
Mounting Type: Surface Mount
Interface: Host Interface, I2C, SAI, SPI
Type: Audio Processor
Operating Temperature: 0°C ~ 70°C (TA)
Non-Volatile Memory: ROM (84kB)
On-Chip RAM: 54kB
Voltage - I/O: 3.30V
Voltage - Core: 1.25V
Clock Rate: 150MHz
Supplier Device Package: 52-TQFP (10x10)
Produkt ist nicht verfügbar
S912XEG384J3VAA |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 384KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MCF51QU64VLF |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 13x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 35
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 13x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 35
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC33PF8100FJESR2 |
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, I.MX8, PRE-
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: Processor
Current - Supply: 10µA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: POWER MANAGEMENT IC, I.MX8, PRE-
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: Processor
Current - Supply: 10µA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
MC33PF8100FJES |
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, I.MX8, PRE-
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: Processor
Current - Supply: 10µA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: POWER MANAGEMENT IC, I.MX8, PRE-
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: Processor
Current - Supply: 10µA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
FS32K118LFT0VLFT |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 25K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S12ZVML-MINIKIT |
Hersteller: NXP USA Inc.
Description: S12ZVML-MINIBRD WITH A LINIX PM
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: S12ZVML128
Supplied Contents: Board(s)
Primary Attributes: Motors (PMSM)
Embedded: Yes, MCU, 16-Bit
Description: S12ZVML-MINIBRD WITH A LINIX PM
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: S12ZVML128
Supplied Contents: Board(s)
Primary Attributes: Motors (PMSM)
Embedded: Yes, MCU, 16-Bit
Produkt ist nicht verfügbar
MIMXRT106PDVL6B |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128MB ROM 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Number of I/O: 127
Description: IC MCU 32BIT 128MB ROM 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Number of I/O: 127
Produkt ist nicht verfügbar
SL3S1204FUD/HA1Z |
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 860-960MHZ WAFER
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 860MHz ~ 960MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Standards: EPC
Supplier Device Package: Wafer
Description: IC RFID TRANSP 860-960MHZ WAFER
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 860MHz ~ 960MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Standards: EPC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
MIMXRT1011DAE5AR |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB ROM 80LQFP
Packaging: Cut Tape (CT)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 500MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 128K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 15x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.3V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 44
Description: IC MCU 32BIT 64KB ROM 80LQFP
Packaging: Cut Tape (CT)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 500MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 128K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 15x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.3V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 44
Produkt ist nicht verfügbar
74HC4066DB,118 |
auf Bestellung 30000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1794+ | 0.28 EUR |
74HC4066DB,112 |
auf Bestellung 9230 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1559+ | 0.31 EUR |
FXLN8372QR1 |
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 4-16G ANALOG 12QFN
Features: Selectable Scale
Packaging: Tape & Reel (TR)
Package / Case: 12-VQFN Exposed Pad
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±4g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 2.7kHz (X,Y), 600Hz (Z)
Supplier Device Package: 12-QFN (3x3)
Sensitivity (mV/g): 114.5 (±4g) ~ 28.62 (±16g)
Description: ACCELEROMETER 4-16G ANALOG 12QFN
Features: Selectable Scale
Packaging: Tape & Reel (TR)
Package / Case: 12-VQFN Exposed Pad
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±4g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 2.7kHz (X,Y), 600Hz (Z)
Supplier Device Package: 12-QFN (3x3)
Sensitivity (mV/g): 114.5 (±4g) ~ 28.62 (±16g)
Produkt ist nicht verfügbar
TJA1128BTK/1Z |
Hersteller: NXP USA Inc.
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
6000+ | 1.22 EUR |
TJA1128BTK/1Z |
Hersteller: NXP USA Inc.
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
7+ | 2.78 EUR |
10+ | 2.5 EUR |
25+ | 2.35 EUR |
100+ | 2.01 EUR |
250+ | 1.88 EUR |
500+ | 1.65 EUR |
1000+ | 1.36 EUR |
2500+ | 1.27 EUR |
TJA1128ATK/1Z |
Hersteller: NXP USA Inc.
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
TJA1128ATK/1Z |
Hersteller: NXP USA Inc.
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
7+ | 2.78 EUR |
10+ | 2.5 EUR |
25+ | 2.35 EUR |
100+ | 2.01 EUR |
250+ | 1.88 EUR |
500+ | 1.65 EUR |
1000+ | 1.36 EUR |
2500+ | 1.27 EUR |
TJA1128CTK/1Z |
Hersteller: NXP USA Inc.
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
6000+ | 1.35 EUR |
TJA1128CTK/1Z |
Hersteller: NXP USA Inc.
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
6+ | 3.04 EUR |
10+ | 2.74 EUR |
25+ | 2.59 EUR |
100+ | 2.21 EUR |
250+ | 2.07 EUR |
500+ | 1.81 EUR |
1000+ | 1.5 EUR |
2500+ | 1.4 EUR |
TJA1128FTK/1Z |
Hersteller: NXP USA Inc.
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
6000+ | 1.35 EUR |
TJA1128FTK/1Z |
Hersteller: NXP USA Inc.
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
6+ | 3.04 EUR |
10+ | 2.74 EUR |
25+ | 2.59 EUR |
100+ | 2.21 EUR |
250+ | 2.07 EUR |
500+ | 1.81 EUR |
1000+ | 1.5 EUR |
2500+ | 1.4 EUR |
TJA1128ETK/1Z |
Hersteller: NXP USA Inc.
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
6000+ | 1.35 EUR |
TJA1128ETK/1Z |
Hersteller: NXP USA Inc.
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
6+ | 3.04 EUR |
10+ | 2.74 EUR |
25+ | 2.59 EUR |
100+ | 2.21 EUR |
250+ | 2.07 EUR |
500+ | 1.81 EUR |
1000+ | 1.5 EUR |
2500+ | 1.4 EUR |
TJA1128DTK/1Z |
Hersteller: NXP USA Inc.
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
Description: LIN MINI SYSTEM BASIS CHIP WITH
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 14-HVSON (3x4.5)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
6000+ | 1.35 EUR |