Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36402) > Seite 552 nach 607
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MIMXRT106DDVL6B | NXP USA Inc. |
Description: IC MCUPackaging: Tray |
auf Bestellung 438 Stücke: Lieferzeit 10-14 Tag (e) |
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S912XEQ512BCAA | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 80QFPPackaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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S912XEQ512BCAAR | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 80QFPPackaging: Tape & Reel (TR) Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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S912XEQ512J2CAL | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 112LQFPPackaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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S912XEQ512F1CAG | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 144LQFPPackaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 24x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 119 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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S912XEQ512F1CAGR | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 144LQFPPackaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 24x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 119 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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S912XEQ512BVAL | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 112LQFPDigiKey Programmable: Not Verified Number of I/O: 91 Supplier Device Package: 112-LQFP (20x20) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 16x12b Core Processor: HCS12X EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 32K x 8 Program Memory Size: 512KB (512K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 112-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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S912XEQ512F1VAL | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 112LQFPDigiKey Programmable: Not Verified Number of I/O: 91 Supplier Device Package: 112-LQFP (20x20) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 16x12b Core Processor: HCS12X EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 32K x 8 Program Memory Size: 512KB (512K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 112-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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S912XEQ512J3MAAR | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 80QFPDigiKey Programmable: Not Verified Number of I/O: 59 Supplier Device Package: 80-QFP (14x14) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 8x12b Core Processor: HCS12X EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 32K x 8 Program Memory Size: 512KB (512K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 80-QFP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MC908LJ24CFUER | NXP USA Inc. |
Description: IC MCU 8BIT 24KB FLASH 64QFPPackaging: Tape & Reel (TR) Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 24KB (24K x 8) RAM Size: 768 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 6x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: I2C, IRSCI, SPI Peripherals: LCD, LVD, POR, PWM Supplier Device Package: 64-QFP (14x14) Number of I/O: 40 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 750 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MFS8632BMDA0ESR2 | NXP USA Inc. |
Description: SAFETY SYSTEM BASIS CHIP FOR DOMPackaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 36V Applications: Camera Supplier Device Package: 48-HVQFN (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MK12DX256VLF5 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 48LQFPDigiKey Programmable: Not Verified Number of I/O: 33 Supplier Device Package: 48-LQFP (7x7) Peripherals: DMA, I2S, LVD, POR, PWM, WDT Connectivity: I2C, IrDA, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 18x16b Core Processor: ARM® Cortex®-M4 EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 32K x 8 Program Memory Size: 256KB (256K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MKV10Z16VFM7 | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 32QFNDigiKey Programmable: Not Verified Number of I/O: 28 Supplier Device Package: 32-HVQFN (5x5) Peripherals: DMA, WDT Connectivity: I2C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 16x12b; D/A 1x12b Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 8K x 8 Program Memory Size: 16KB (16K x 8) Speed: 75MHz Mounting Type: Surface Mount, Wettable Flank Package / Case: 32-VFQFN Exposed Pad Packaging: Bulk |
auf Bestellung 139 Stücke: Lieferzeit 10-14 Tag (e) |
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MKV10Z16VFM7 | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 32QFNDigiKey Programmable: Not Verified Number of I/O: 28 Supplier Device Package: 32-HVQFN (5x5) Peripherals: DMA, WDT Connectivity: I2C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 16x12b; D/A 1x12b Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 8K x 8 Program Memory Size: 16KB (16K x 8) Speed: 75MHz Mounting Type: Surface Mount, Wettable Flank Package / Case: 32-VFQFN Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MW7IC2750NBR1 | NXP USA Inc. |
Description: IC AMP WIMAX 2.3-2.7GHZ TO272WBPackaging: Tape & Reel (TR) Package / Case: TO-272-14 Variant, Flat Leads Mounting Type: Chassis Mount Frequency: 2.3GHz ~ 2.7GHz RF Type: WiMax Voltage - Supply: 28V Gain: 26dB Current - Supply: 550mA P1dB: 47dBm Test Frequency: 2.7GHz Supplier Device Package: TO-272 WB-14 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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BFU550WF | NXP USA Inc. |
Description: RF TRANS NPN 12V 11GHZ SC-70Supplier Device Package: SC-70 Noise Figure (dB Typ @ f): 1.3dB @ 1.8GHz Frequency - Transition: 11GHz DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 8V Voltage - Collector Emitter Breakdown (Max): 12V Current - Collector (Ic) (Max): 50mA Power - Max: 450mW Gain: 12dB Operating Temperature: -40°C ~ 150°C (TJ) Transistor Type: NPN Mounting Type: Surface Mount Package / Case: SC-70, SOT-323 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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BFU550WF | NXP USA Inc. |
Description: RF TRANS NPN 12V 11GHZ SC-70Supplier Device Package: SC-70 Noise Figure (dB Typ @ f): 1.3dB @ 1.8GHz Frequency - Transition: 11GHz DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 8V Voltage - Collector Emitter Breakdown (Max): 12V Current - Collector (Ic) (Max): 50mA Power - Max: 450mW Gain: 12dB Operating Temperature: -40°C ~ 150°C (TJ) Transistor Type: NPN Mounting Type: Surface Mount Package / Case: SC-70, SOT-323 Packaging: Cut Tape (CT) |
auf Bestellung 3000 Stücke: Lieferzeit 10-14 Tag (e) |
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BFU550WX | NXP USA Inc. |
Description: RF TRANS NPN 12V 11GHZ SC-70Packaging: Tape & Reel (TR) Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: -40°C ~ 150°C (TJ) Gain: 18dB Power - Max: 450mW Current - Collector (Ic) (Max): 50mA Voltage - Collector Emitter Breakdown (Max): 12V DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 8V Frequency - Transition: 11GHz Noise Figure (dB Typ @ f): 0.6dB @ 900MHz Supplier Device Package: SC-70 Grade: Automotive Qualification: AEC-Q101 |
auf Bestellung 5000 Stücke: Lieferzeit 10-14 Tag (e) |
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BFU550WX | NXP USA Inc. |
Description: RF TRANS NPN 12V 11GHZ SC-70Packaging: Cut Tape (CT) Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: -40°C ~ 150°C (TJ) Gain: 18dB Power - Max: 450mW Current - Collector (Ic) (Max): 50mA Voltage - Collector Emitter Breakdown (Max): 12V DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 8V Frequency - Transition: 11GHz Noise Figure (dB Typ @ f): 0.6dB @ 900MHz Supplier Device Package: SC-70 Grade: Automotive Qualification: AEC-Q101 |
auf Bestellung 5499 Stücke: Lieferzeit 10-14 Tag (e) |
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| MCXA156VPJ | NXP USA Inc. |
Description: IC MCUNumber of I/O: 82 Supplier Device Package: 112-VFBGA (7x7) Peripherals: DMA, LVD/HVD, POR, PWM, WDT Connectivity: FlexIO, I2C, SPI, UART/USART, USB Core Size: 32-Bit Data Converters: D/A 1x12b Core Processor: ARM® Cortex®-M33 Program Memory Type: FLASH RAM Size: 128K x 8 Program Memory Size: 1MB (1M x 8) Speed: 96MHz Mounting Type: Surface Mount Package / Case: 112-BGA Packaging: Tray |
auf Bestellung 250 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA9421UKZ | NXP USA Inc. |
Description: IC PMIC WLCSP25Supplier Device Package: 25-WLCSP (2.09x2.09) Current - Supply: 5.5µA Applications: Microcontroller, MCU Voltage - Supply: 3.3V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 25-UFBGA, WLCSP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 3000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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PCA9421UKZ | NXP USA Inc. |
Description: IC PMIC WLCSP25Supplier Device Package: 25-WLCSP (2.09x2.09) Current - Supply: 5.5µA Applications: Microcontroller, MCU Voltage - Supply: 3.3V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 25-UFBGA, WLCSP Packaging: Cut Tape (CT) |
auf Bestellung 2144 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33FS6526CAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCOQualification: AEC-Q100 Grade: Automotive Supplier Device Package: 48-HLQFP (7x7) Applications: System Basis Chip Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| 88W8763-A1-BMKC/AK | NXP USA Inc. |
Description: 802.11 A/B/G/N 3X3 MAC/BB/RF SIN Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 945 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| TJA1104DHN/0J | NXP USA Inc. |
Description: TJA1104DHN/0J Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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NTA53321G0FHKZ | NXP USA Inc. |
Description: RFID NTAG5 XQFNPackaging: Tape & Reel (TR) Size / Dimension: 0.071" L x 0.102" W (1.80mm x 2.60mm) Frequency: 13.56MHz Memory Type: Read/Write Operating Temperature: -40°C ~ 85°C Standards: ISO 15693, NFC Writable Memory: 16kb (User) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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NTA53321G0FHKZ | NXP USA Inc. |
Description: RFID NTAG5 XQFNPackaging: Cut Tape (CT) Size / Dimension: 0.071" L x 0.102" W (1.80mm x 2.60mm) Frequency: 13.56MHz Memory Type: Read/Write Operating Temperature: -40°C ~ 85°C Standards: ISO 15693, NFC Writable Memory: 16kb (User) |
auf Bestellung 3096 Stücke: Lieferzeit 10-14 Tag (e) |
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| SL3S1206FUD2/HAA | NXP USA Inc. |
Description: SL3S1206FUD2Supplier Device Package: Wafer Operating Temperature: -40°C ~ 85°C Type: RFID Reader Mounting Type: Surface Mount Package / Case: Die Packaging: Tray |
auf Bestellung 342422 Stücke: Lieferzeit 10-14 Tag (e) |
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| SL3S1206FUD2/HAPZ | NXP USA Inc. |
Description: SL3S1206FUD2Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 390687 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| MWCT2016SHVPA | NXP USA Inc. |
Description: MWCT2016S,MAXQFP100Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 480 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| MWCT2016SHVPAR | NXP USA Inc. |
Description: MWCT2016S,MAXQFP100Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 600 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| MWCT2016SGVPAR | NXP USA Inc. |
Description: MWCT2016S,MAXQFP100Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 600 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| MWCT2016SGVPA | NXP USA Inc. |
Description: MWCT2016S,MAXQFP100Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 480 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| MWCT2016SHT0VPAR | NXP USA Inc. |
Description: MWCT2016S,MAXQFP100Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| A3G23H500W17SR3 | NXP USA Inc. |
Description: RF MOSFET GAN 48V NI780 Current - Test: 300 mA Voltage - Test: 48 V Voltage - Rated: 125 V Supplier Device Package: NI-780-4S2S Technology: GaN Gain: 14.3dB Power - Output: 80W Configuration: 2 N-Channel Frequency: 2.3GHz ~ 2.4GHz Mounting Type: Chassis Mount Package / Case: NI-780-4S2S Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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MGD3160AM315EKT | NXP USA Inc. |
Description: IC GATE DRVR HIGH-SIDE 32SOICQualification: AEC-Q100 Grade: Automotive Current - Peak Output (Source, Sink): 15A, 15A Gate Type: IGBT, SiC MOSFET Number of Drivers: 1 Driven Configuration: High-Side Channel Type: Single Supplier Device Package: 32-SOIC Input Type: Non-Inverting Voltage - Supply: 4.5V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 32-BSSOP (0.295", 7.50mm Width) Packaging: Tray |
auf Bestellung 176 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVT273PW,118 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 8BIT 20TSSOPNumber of Bits per Element: 8 Max Propagation Delay @ V, Max CL: 5.5ns @ 3.3V, 50pF Supplier Device Package: 20-TSSOP Input Capacitance: 4 pF Clock Frequency: 150 MHz Trigger Type: Positive Edge Current - Output High, Low: 32mA, 64mA Current - Quiescent (Iq): 190 µA Voltage - Supply: 2.7V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Type: D-Type Function: Master Reset Number of Elements: 1 Mounting Type: Surface Mount Output Type: Non-Inverted Package / Case: 20-TSSOP (0.173", 4.40mm Width) Packaging: Bulk |
auf Bestellung 22500 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVT574PW,118 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 8BIT 20TSSOPNumber of Bits per Element: 8 Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF Supplier Device Package: 20-TSSOP Input Capacitance: 4 pF Clock Frequency: 150 MHz Trigger Type: Positive Edge Current - Output High, Low: 32mA, 64mA Current - Quiescent (Iq): 190 µA Voltage - Supply: 2.7V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Type: D-Type Function: Standard Number of Elements: 1 Mounting Type: Surface Mount Output Type: Tri-State, Non-Inverted Package / Case: 20-TSSOP (0.173", 4.40mm Width) Packaging: Bulk |
auf Bestellung 7640 Stücke: Lieferzeit 10-14 Tag (e) |
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| SAF775DHN/N208WBMP | NXP USA Inc. |
Description: CAR DISP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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MIMXRT1061CVJ5BR | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 196LFBGAPackaging: Cut Tape (CT) Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 528MHz RAM Size: 1M x 8 Operating Temperature: -40°C ~ 105°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 196-LFBGA (12x12) Number of I/O: 127 DigiKey Programmable: Not Verified |
auf Bestellung 918 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT1061XVN5B | NXP USA Inc. |
Description: IC MCU 32BIT 128KB ROM 225MAPBGAPackaging: Tray Package / Case: 225-LFBGA Mounting Type: Surface Mount Speed: 500MHz Program Memory Size: 128KB (128K x 8) RAM Size: 1M x 8 Operating Temperature: -40°C ~ 125°C (TJ) Oscillator Type: Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Supplier Device Package: 225-MAPBGA (13x13) Number of I/O: 149 DigiKey Programmable: Not Verified |
auf Bestellung 1300 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT106FDVL6A | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 196LFBGAPackaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 600MHz RAM Size: 1M x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 196-MAPBGA (10x10) Number of I/O: 127 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MIMXRT105SCVL5B | NXP USA Inc. |
Description: IC MCU 32BIT 196MAPBGAPackaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 528MHz RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Supplier Device Package: 196-MAPBGA (10x10) Number of I/O: 127 DigiKey Programmable: Not Verified |
auf Bestellung 184 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT106CDVL6A | NXP USA Inc. |
Description: I.MXRT106C 196MAPBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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A2V09H400-04NR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 48V OM780-4Current - Test: 688 mA Voltage - Test: 48 V Voltage - Rated: 105 V Supplier Device Package: OM-780-4L Technology: LDMOS Gain: 17.9dB Power - Output: 107W Frequency: 720MHz ~ 960MHz Mounting Type: Surface Mount Current Rating (Amps): 10µA Package / Case: OM-780-4L Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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A2V09H400-04NR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 48V OM780-4Current - Test: 688 mA Voltage - Test: 48 V Voltage - Rated: 105 V Supplier Device Package: OM-780-4L Technology: LDMOS Gain: 17.9dB Power - Output: 107W Frequency: 720MHz ~ 960MHz Mounting Type: Surface Mount Current Rating (Amps): 10µA Package / Case: OM-780-4L Packaging: Cut Tape (CT) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MPC18730EP | NXP USA Inc. |
Description: IC PMIC PROGR 5-OUTPUTS 64-QFNSupplier Device Package: 64-QFN (9x9) Current - Supply: 9mA Applications: Handheld/Mobile Devices Voltage - Supply: 0.9V ~ 4.2V Operating Temperature: -10°C ~ 65°C Mounting Type: Surface Mount Package / Case: 64-VFQFN Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MC9S08AW32MFGE | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 44LQFPDigiKey Programmable: Not Verified Number of I/O: 34 Supplier Device Package: 44-LQFP (10x10) Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 8x10b Core Processor: S08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 2K x 8 Program Memory Size: 32KB (32K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 44-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 800 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MCIMX6G3DVM05AA | NXP USA Inc. |
Description: IC MPU I.MX6UL 528MHZ 289MAPBGAPackaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 152 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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LD6806TD/29P,125 | NXP USA Inc. |
Description: IC REG LINEAR 2.9V 200MA 5TSOPPackaging: Bulk Package / Case: SC-74A, SOT-753 Output Type: Fixed Mounting Type: Surface Mount Current - Output: 200mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 5-TSOP Voltage - Output (Min/Fixed): 2.9V Control Features: Enable PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.13V @ 200mA Protection Features: Over Current, Over Temperature Current - Supply (Max): 250 µA |
auf Bestellung 36000 Stücke: Lieferzeit 10-14 Tag (e) |
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LD6806TD/14P,125 | NXP USA Inc. |
Description: IC REG LINEAR 1.4V 200MA 5TSOPPackaging: Bulk Package / Case: SC-74A, SOT-753 Output Type: Fixed Mounting Type: Surface Mount Current - Output: 200mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 5-TSOP Voltage - Output (Min/Fixed): 1.4V Control Features: Enable PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.13V @ 200mA Protection Features: Over Current, Over Temperature Current - Supply (Max): 250 µA |
auf Bestellung 33000 Stücke: Lieferzeit 10-14 Tag (e) |
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LD6806TD/20P,125 | NXP USA Inc. |
Description: IC REG LINEAR 2V 200MA 5TSOPPackaging: Bulk Package / Case: SC-74A, SOT-753 Output Type: Fixed Mounting Type: Surface Mount Current - Output: 200mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 5-TSOP Voltage - Output (Min/Fixed): 2V Control Features: Enable PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.13V @ 200mA Protection Features: Over Current, Over Temperature Current - Supply (Max): 250 µA |
auf Bestellung 24000 Stücke: Lieferzeit 10-14 Tag (e) |
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LD6806TD/30P,125 | NXP USA Inc. |
Description: IC REG LINEAR 3V 200MA 5TSOPPackaging: Bulk Package / Case: SC-74A, SOT-753 Output Type: Fixed Mounting Type: Surface Mount Current - Output: 200mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 5-TSOP Voltage - Output (Min/Fixed): 3V Control Features: Enable PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.13V @ 200mA Protection Features: Over Current, Over Temperature Current - Supply (Max): 250 µA |
auf Bestellung 24000 Stücke: Lieferzeit 10-14 Tag (e) |
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KITFS23BUCKEVM | NXP USA Inc. |
Description: EVAL BOARD FOR FS2320Embedded: Yes, MCU, 32-Bit Utilized IC / Part: FS2320 Contents: Board(s) Type: Interface Function: System Basis Chip (SBC) Packaging: Bulk |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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MCF51AG128CLF | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 48LQFPDigiKey Programmable: Not Verified Number of I/O: 39 Supplier Device Package: 48-LQFP (7x7) Peripherals: DMA, LVD, PWM, WDT Connectivity: SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 12x12b Core Processor: Coldfire V1 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 16K x 8 Program Memory Size: 128KB (128K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| MF3DH23C0DA4/00J | NXP USA Inc. |
Description: MF3DH23C0DA4 Packaging: Tape & Reel (TR) Package / Case: MOA4, Smart Card Module Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader Operating Temperature: -25°C ~ 85°C Standards: ISO 14443A Supplier Device Package: PLLMC |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 17500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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MCF51MM256VLL | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 100LQFPPackaging: Bulk Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 8x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI, USB OTG Peripherals: LVD, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 65 DigiKey Programmable: Not Verified |
auf Bestellung 397 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9328MX21CVK | NXP USA Inc. |
Description: IC MPU I.MX21 266MHZ 289LFBGAPackaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 1.8V, 3.0V Supplier Device Package: 289-LFBGA (14x14) USB: USB 1.x (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD Additional Interfaces: 1-Wire, I2C, I2S, SPI, SSI, MMC/SD, UART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MC9328MX21CVK | NXP USA Inc. |
Description: MICROPROCESSOR, 32-BIT, 266MHZ,Packaging: Bulk Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 1.8V, 3V Supplier Device Package: 289-PBGA (14x14) USB: USB OTG (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD Additional Interfaces: 1-Wire, I2C, I2S, SPI, SSI, MMC/SD, UART |
auf Bestellung 461 Stücke: Lieferzeit 10-14 Tag (e) |
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2PB1219AQ,115 | NXP USA Inc. |
Description: TRANS PNP 50V 0.5A SOT-323Packaging: Bulk Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Transistor Type: PNP Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 600mV @ 30mA, 300mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 85 @ 150mA, 10V Frequency - Transition: 100MHz Supplier Device Package: SOT-323 Grade: Automotive Current - Collector (Ic) (Max): 500 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 200 mW Qualification: AEC-Q101 |
auf Bestellung 86190 Stücke: Lieferzeit 10-14 Tag (e) |
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| MIMXRT106DDVL6B |
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auf Bestellung 438 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 23.97 EUR |
| 10+ | 18.96 EUR |
| 25+ | 17.7 EUR |
| 240+ | 15.7 EUR |
| S912XEQ512BCAA |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S912XEQ512BCAAR |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S912XEQ512J2CAL |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 300 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S912XEQ512F1CAG |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S912XEQ512F1CAGR |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S912XEQ512BVAL |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
Description: IC MCU 16BIT 512KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S912XEQ512F1VAL |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
Description: IC MCU 16BIT 512KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| S912XEQ512J3MAAR |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
DigiKey Programmable: Not Verified
Number of I/O: 59
Supplier Device Package: 80-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tape & Reel (TR)
Description: IC MCU 16BIT 512KB FLASH 80QFP
DigiKey Programmable: Not Verified
Number of I/O: 59
Supplier Device Package: 80-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MC908LJ24CFUER |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 24KB FLASH 64QFP
Packaging: Tape & Reel (TR)
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: I2C, IRSCI, SPI
Peripherals: LCD, LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 24KB FLASH 64QFP
Packaging: Tape & Reel (TR)
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: I2C, IRSCI, SPI
Peripherals: LCD, LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| MFS8632BMDA0ESR2 |
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Hersteller: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 36V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 36V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
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| MK12DX256VLF5 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 33
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 18x16b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Description: IC MCU 32BIT 256KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 33
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 18x16b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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| MKV10Z16VFM7 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: DMA, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 16x12b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 75MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
Description: IC MCU 32BIT 16KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: DMA, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 16x12b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 75MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
auf Bestellung 139 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 131+ | 3.48 EUR |
| MKV10Z16VFM7 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: DMA, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 16x12b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 75MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
Description: IC MCU 32BIT 16KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: DMA, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 16x12b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 75MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MW7IC2750NBR1 |
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Hersteller: NXP USA Inc.
Description: IC AMP WIMAX 2.3-2.7GHZ TO272WB
Packaging: Tape & Reel (TR)
Package / Case: TO-272-14 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 2.3GHz ~ 2.7GHz
RF Type: WiMax
Voltage - Supply: 28V
Gain: 26dB
Current - Supply: 550mA
P1dB: 47dBm
Test Frequency: 2.7GHz
Supplier Device Package: TO-272 WB-14
Description: IC AMP WIMAX 2.3-2.7GHZ TO272WB
Packaging: Tape & Reel (TR)
Package / Case: TO-272-14 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 2.3GHz ~ 2.7GHz
RF Type: WiMax
Voltage - Supply: 28V
Gain: 26dB
Current - Supply: 550mA
P1dB: 47dBm
Test Frequency: 2.7GHz
Supplier Device Package: TO-272 WB-14
Produkt ist nicht verfügbar
Im Einkaufswagen
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| BFU550WF |
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Hersteller: NXP USA Inc.
Description: RF TRANS NPN 12V 11GHZ SC-70
Supplier Device Package: SC-70
Noise Figure (dB Typ @ f): 1.3dB @ 1.8GHz
Frequency - Transition: 11GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 8V
Voltage - Collector Emitter Breakdown (Max): 12V
Current - Collector (Ic) (Max): 50mA
Power - Max: 450mW
Gain: 12dB
Operating Temperature: -40°C ~ 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Packaging: Tape & Reel (TR)
Description: RF TRANS NPN 12V 11GHZ SC-70
Supplier Device Package: SC-70
Noise Figure (dB Typ @ f): 1.3dB @ 1.8GHz
Frequency - Transition: 11GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 8V
Voltage - Collector Emitter Breakdown (Max): 12V
Current - Collector (Ic) (Max): 50mA
Power - Max: 450mW
Gain: 12dB
Operating Temperature: -40°C ~ 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
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| BFU550WF |
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Hersteller: NXP USA Inc.
Description: RF TRANS NPN 12V 11GHZ SC-70
Supplier Device Package: SC-70
Noise Figure (dB Typ @ f): 1.3dB @ 1.8GHz
Frequency - Transition: 11GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 8V
Voltage - Collector Emitter Breakdown (Max): 12V
Current - Collector (Ic) (Max): 50mA
Power - Max: 450mW
Gain: 12dB
Operating Temperature: -40°C ~ 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Packaging: Cut Tape (CT)
Description: RF TRANS NPN 12V 11GHZ SC-70
Supplier Device Package: SC-70
Noise Figure (dB Typ @ f): 1.3dB @ 1.8GHz
Frequency - Transition: 11GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 8V
Voltage - Collector Emitter Breakdown (Max): 12V
Current - Collector (Ic) (Max): 50mA
Power - Max: 450mW
Gain: 12dB
Operating Temperature: -40°C ~ 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Packaging: Cut Tape (CT)
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 26+ | 0.69 EUR |
| 37+ | 0.48 EUR |
| 41+ | 0.43 EUR |
| 100+ | 0.37 EUR |
| 250+ | 0.35 EUR |
| 500+ | 0.33 EUR |
| 1000+ | 0.32 EUR |
| 2500+ | 0.3 EUR |
| BFU550WX |
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Hersteller: NXP USA Inc.
Description: RF TRANS NPN 12V 11GHZ SC-70
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 18dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 50mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 8V
Frequency - Transition: 11GHz
Noise Figure (dB Typ @ f): 0.6dB @ 900MHz
Supplier Device Package: SC-70
Grade: Automotive
Qualification: AEC-Q101
Description: RF TRANS NPN 12V 11GHZ SC-70
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 18dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 50mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 8V
Frequency - Transition: 11GHz
Noise Figure (dB Typ @ f): 0.6dB @ 900MHz
Supplier Device Package: SC-70
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 3000+ | 0.51 EUR |
| BFU550WX |
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Hersteller: NXP USA Inc.
Description: RF TRANS NPN 12V 11GHZ SC-70
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 18dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 50mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 8V
Frequency - Transition: 11GHz
Noise Figure (dB Typ @ f): 0.6dB @ 900MHz
Supplier Device Package: SC-70
Grade: Automotive
Qualification: AEC-Q101
Description: RF TRANS NPN 12V 11GHZ SC-70
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 18dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 50mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 8V
Frequency - Transition: 11GHz
Noise Figure (dB Typ @ f): 0.6dB @ 900MHz
Supplier Device Package: SC-70
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 5499 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 16+ | 1.11 EUR |
| 23+ | 0.79 EUR |
| 25+ | 0.71 EUR |
| 100+ | 0.62 EUR |
| 250+ | 0.58 EUR |
| 500+ | 0.55 EUR |
| 1000+ | 0.54 EUR |
| MCXA156VPJ |
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Hersteller: NXP USA Inc.
Description: IC MCU
Number of I/O: 82
Supplier Device Package: 112-VFBGA (7x7)
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Connectivity: FlexIO, I2C, SPI, UART/USART, USB
Core Size: 32-Bit
Data Converters: D/A 1x12b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
RAM Size: 128K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 96MHz
Mounting Type: Surface Mount
Package / Case: 112-BGA
Packaging: Tray
Description: IC MCU
Number of I/O: 82
Supplier Device Package: 112-VFBGA (7x7)
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Connectivity: FlexIO, I2C, SPI, UART/USART, USB
Core Size: 32-Bit
Data Converters: D/A 1x12b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
RAM Size: 128K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 96MHz
Mounting Type: Surface Mount
Package / Case: 112-BGA
Packaging: Tray
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 3+ | 8.48 EUR |
| 10+ | 6.1 EUR |
| 25+ | 5.87 EUR |
| 100+ | 5.64 EUR |
| PCA9421UKZ |
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Hersteller: NXP USA Inc.
Description: IC PMIC WLCSP25
Supplier Device Package: 25-WLCSP (2.09x2.09)
Current - Supply: 5.5µA
Applications: Microcontroller, MCU
Voltage - Supply: 3.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 25-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
Description: IC PMIC WLCSP25
Supplier Device Package: 25-WLCSP (2.09x2.09)
Current - Supply: 5.5µA
Applications: Microcontroller, MCU
Voltage - Supply: 3.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 25-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| PCA9421UKZ |
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Hersteller: NXP USA Inc.
Description: IC PMIC WLCSP25
Supplier Device Package: 25-WLCSP (2.09x2.09)
Current - Supply: 5.5µA
Applications: Microcontroller, MCU
Voltage - Supply: 3.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 25-UFBGA, WLCSP
Packaging: Cut Tape (CT)
Description: IC PMIC WLCSP25
Supplier Device Package: 25-WLCSP (2.09x2.09)
Current - Supply: 5.5µA
Applications: Microcontroller, MCU
Voltage - Supply: 3.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 25-UFBGA, WLCSP
Packaging: Cut Tape (CT)
auf Bestellung 2144 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 5+ | 4.1 EUR |
| 10+ | 3.06 EUR |
| 25+ | 2.8 EUR |
| 100+ | 2.51 EUR |
| 250+ | 2.38 EUR |
| 500+ | 2.29 EUR |
| 1000+ | 2.23 EUR |
| MC33FS6526CAE |
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Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 250 Stücke
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| 88W8763-A1-BMKC/AK |
Produkt ist nicht verfügbar
Mindestbestellmenge: 945 Stücke
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| TJA1104DHN/0J |
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
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| NTA53321G0FHKZ |
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Hersteller: NXP USA Inc.
Description: RFID NTAG5 XQFN
Packaging: Tape & Reel (TR)
Size / Dimension: 0.071" L x 0.102" W (1.80mm x 2.60mm)
Frequency: 13.56MHz
Memory Type: Read/Write
Operating Temperature: -40°C ~ 85°C
Standards: ISO 15693, NFC
Writable Memory: 16kb (User)
Description: RFID NTAG5 XQFN
Packaging: Tape & Reel (TR)
Size / Dimension: 0.071" L x 0.102" W (1.80mm x 2.60mm)
Frequency: 13.56MHz
Memory Type: Read/Write
Operating Temperature: -40°C ~ 85°C
Standards: ISO 15693, NFC
Writable Memory: 16kb (User)
Produkt ist nicht verfügbar
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| NTA53321G0FHKZ |
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Hersteller: NXP USA Inc.
Description: RFID NTAG5 XQFN
Packaging: Cut Tape (CT)
Size / Dimension: 0.071" L x 0.102" W (1.80mm x 2.60mm)
Frequency: 13.56MHz
Memory Type: Read/Write
Operating Temperature: -40°C ~ 85°C
Standards: ISO 15693, NFC
Writable Memory: 16kb (User)
Description: RFID NTAG5 XQFN
Packaging: Cut Tape (CT)
Size / Dimension: 0.071" L x 0.102" W (1.80mm x 2.60mm)
Frequency: 13.56MHz
Memory Type: Read/Write
Operating Temperature: -40°C ~ 85°C
Standards: ISO 15693, NFC
Writable Memory: 16kb (User)
auf Bestellung 3096 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 6+ | 3.13 EUR |
| 10+ | 2.71 EUR |
| 25+ | 2.56 EUR |
| 100+ | 2.35 EUR |
| 250+ | 2.23 EUR |
| 500+ | 2.14 EUR |
| 1000+ | 2.05 EUR |
| SL3S1206FUD2/HAA |
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Hersteller: NXP USA Inc.
Description: SL3S1206FUD2
Supplier Device Package: Wafer
Operating Temperature: -40°C ~ 85°C
Type: RFID Reader
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tray
Description: SL3S1206FUD2
Supplier Device Package: Wafer
Operating Temperature: -40°C ~ 85°C
Type: RFID Reader
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tray
auf Bestellung 342422 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 342422+ | 0.045 EUR |
| SL3S1206FUD2/HAPZ |
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Produkt ist nicht verfügbar
Mindestbestellmenge: 390687 Stücke
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| MWCT2016SHVPA |
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Produkt ist nicht verfügbar
Mindestbestellmenge: 480 Stücke
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| MWCT2016SHVPAR |
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Produkt ist nicht verfügbar
Mindestbestellmenge: 600 Stücke
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| MWCT2016SGVPAR |
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Produkt ist nicht verfügbar
Mindestbestellmenge: 600 Stücke
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| MWCT2016SGVPA |
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Produkt ist nicht verfügbar
Mindestbestellmenge: 480 Stücke
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| A3G23H500W17SR3 |
Hersteller: NXP USA Inc.
Description: RF MOSFET GAN 48V NI780
Current - Test: 300 mA
Voltage - Test: 48 V
Voltage - Rated: 125 V
Supplier Device Package: NI-780-4S2S
Technology: GaN
Gain: 14.3dB
Power - Output: 80W
Configuration: 2 N-Channel
Frequency: 2.3GHz ~ 2.4GHz
Mounting Type: Chassis Mount
Package / Case: NI-780-4S2S
Packaging: Tape & Reel (TR)
Description: RF MOSFET GAN 48V NI780
Current - Test: 300 mA
Voltage - Test: 48 V
Voltage - Rated: 125 V
Supplier Device Package: NI-780-4S2S
Technology: GaN
Gain: 14.3dB
Power - Output: 80W
Configuration: 2 N-Channel
Frequency: 2.3GHz ~ 2.4GHz
Mounting Type: Chassis Mount
Package / Case: NI-780-4S2S
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MGD3160AM315EKT |
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Hersteller: NXP USA Inc.
Description: IC GATE DRVR HIGH-SIDE 32SOIC
Qualification: AEC-Q100
Grade: Automotive
Current - Peak Output (Source, Sink): 15A, 15A
Gate Type: IGBT, SiC MOSFET
Number of Drivers: 1
Driven Configuration: High-Side
Channel Type: Single
Supplier Device Package: 32-SOIC
Input Type: Non-Inverting
Voltage - Supply: 4.5V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Packaging: Tray
Description: IC GATE DRVR HIGH-SIDE 32SOIC
Qualification: AEC-Q100
Grade: Automotive
Current - Peak Output (Source, Sink): 15A, 15A
Gate Type: IGBT, SiC MOSFET
Number of Drivers: 1
Driven Configuration: High-Side
Channel Type: Single
Supplier Device Package: 32-SOIC
Input Type: Non-Inverting
Voltage - Supply: 4.5V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Packaging: Tray
auf Bestellung 176 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 14.57 EUR |
| 10+ | 11.36 EUR |
| 25+ | 10.55 EUR |
| 176+ | 9.39 EUR |
| 74LVT273PW,118 |
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Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Number of Bits per Element: 8
Max Propagation Delay @ V, Max CL: 5.5ns @ 3.3V, 50pF
Supplier Device Package: 20-TSSOP
Input Capacitance: 4 pF
Clock Frequency: 150 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 32mA, 64mA
Current - Quiescent (Iq): 190 µA
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: D-Type
Function: Master Reset
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Non-Inverted
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Number of Bits per Element: 8
Max Propagation Delay @ V, Max CL: 5.5ns @ 3.3V, 50pF
Supplier Device Package: 20-TSSOP
Input Capacitance: 4 pF
Clock Frequency: 150 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 32mA, 64mA
Current - Quiescent (Iq): 190 µA
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: D-Type
Function: Master Reset
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Non-Inverted
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
auf Bestellung 22500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1902+ | 0.26 EUR |
| 74LVT574PW,118 |
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Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Number of Bits per Element: 8
Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF
Supplier Device Package: 20-TSSOP
Input Capacitance: 4 pF
Clock Frequency: 150 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 32mA, 64mA
Current - Quiescent (Iq): 190 µA
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Number of Bits per Element: 8
Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF
Supplier Device Package: 20-TSSOP
Input Capacitance: 4 pF
Clock Frequency: 150 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 32mA, 64mA
Current - Quiescent (Iq): 190 µA
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
auf Bestellung 7640 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1665+ | 0.29 EUR |
| SAF775DHN/N208WBMP |
Produkt ist nicht verfügbar
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| MIMXRT1061CVJ5BR |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196LFBGA
Packaging: Cut Tape (CT)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 196LFBGA
Packaging: Cut Tape (CT)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (12x12)
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 918 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 19.57 EUR |
| 10+ | 15.38 EUR |
| 25+ | 14.34 EUR |
| 100+ | 13.19 EUR |
| 250+ | 12.86 EUR |
| MIMXRT1061XVN5B |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB ROM 225MAPBGA
Packaging: Tray
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 225-MAPBGA (13x13)
Number of I/O: 149
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB ROM 225MAPBGA
Packaging: Tray
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 225-MAPBGA (13x13)
Number of I/O: 149
DigiKey Programmable: Not Verified
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 23.34 EUR |
| 10+ | 18.42 EUR |
| 25+ | 17.19 EUR |
| 80+ | 16.02 EUR |
| 230+ | 15.24 EUR |
| 800+ | 14.58 EUR |
| MIMXRT106FDVL6A |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Number of I/O: 127
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MIMXRT105SCVL5B |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 184 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 27 EUR |
| 10+ | 19.43 EUR |
| 25+ | 17.49 EUR |
| 80+ | 15.62 EUR |
| A2V09H400-04NR3 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 48V OM780-4
Current - Test: 688 mA
Voltage - Test: 48 V
Voltage - Rated: 105 V
Supplier Device Package: OM-780-4L
Technology: LDMOS
Gain: 17.9dB
Power - Output: 107W
Frequency: 720MHz ~ 960MHz
Mounting Type: Surface Mount
Current Rating (Amps): 10µA
Package / Case: OM-780-4L
Packaging: Tape & Reel (TR)
Description: RF MOSFET LDMOS 48V OM780-4
Current - Test: 688 mA
Voltage - Test: 48 V
Voltage - Rated: 105 V
Supplier Device Package: OM-780-4L
Technology: LDMOS
Gain: 17.9dB
Power - Output: 107W
Frequency: 720MHz ~ 960MHz
Mounting Type: Surface Mount
Current Rating (Amps): 10µA
Package / Case: OM-780-4L
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 250 Stücke
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| A2V09H400-04NR3 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 48V OM780-4
Current - Test: 688 mA
Voltage - Test: 48 V
Voltage - Rated: 105 V
Supplier Device Package: OM-780-4L
Technology: LDMOS
Gain: 17.9dB
Power - Output: 107W
Frequency: 720MHz ~ 960MHz
Mounting Type: Surface Mount
Current Rating (Amps): 10µA
Package / Case: OM-780-4L
Packaging: Cut Tape (CT)
Description: RF MOSFET LDMOS 48V OM780-4
Current - Test: 688 mA
Voltage - Test: 48 V
Voltage - Rated: 105 V
Supplier Device Package: OM-780-4L
Technology: LDMOS
Gain: 17.9dB
Power - Output: 107W
Frequency: 720MHz ~ 960MHz
Mounting Type: Surface Mount
Current Rating (Amps): 10µA
Package / Case: OM-780-4L
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC18730EP |
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Hersteller: NXP USA Inc.
Description: IC PMIC PROGR 5-OUTPUTS 64-QFN
Supplier Device Package: 64-QFN (9x9)
Current - Supply: 9mA
Applications: Handheld/Mobile Devices
Voltage - Supply: 0.9V ~ 4.2V
Operating Temperature: -10°C ~ 65°C
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tray
Description: IC PMIC PROGR 5-OUTPUTS 64-QFN
Supplier Device Package: 64-QFN (9x9)
Current - Supply: 9mA
Applications: Handheld/Mobile Devices
Voltage - Supply: 0.9V ~ 4.2V
Operating Temperature: -10°C ~ 65°C
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC9S08AW32MFGE |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44LQFP
DigiKey Programmable: Not Verified
Number of I/O: 34
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tray
Description: IC MCU 8BIT 32KB FLASH 44LQFP
DigiKey Programmable: Not Verified
Number of I/O: 34
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 800 Stücke
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| MCIMX6G3DVM05AA |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Produkt ist nicht verfügbar
Mindestbestellmenge: 152 Stücke
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| LD6806TD/29P,125 |
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Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.9V 200MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 2.9V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 2.9V 200MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 2.9V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 36000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2959+ | 0.16 EUR |
| LD6806TD/14P,125 |
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Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.4V 200MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 1.4V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 1.4V 200MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 1.4V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 33000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2959+ | 0.17 EUR |
| LD6806TD/20P,125 |
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Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2V 200MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 2V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 2V 200MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 2V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 24000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2959+ | 0.16 EUR |
| LD6806TD/30P,125 |
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Hersteller: NXP USA Inc.
Description: IC REG LINEAR 3V 200MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 3V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 3V 200MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 3V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 24000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2959+ | 0.16 EUR |
| KITFS23BUCKEVM |
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Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR FS2320
Embedded: Yes, MCU, 32-Bit
Utilized IC / Part: FS2320
Contents: Board(s)
Type: Interface
Function: System Basis Chip (SBC)
Packaging: Bulk
Description: EVAL BOARD FOR FS2320
Embedded: Yes, MCU, 32-Bit
Utilized IC / Part: FS2320
Contents: Board(s)
Type: Interface
Function: System Basis Chip (SBC)
Packaging: Bulk
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 318.74 EUR |
| MCF51AG128CLF |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, LVD, PWM, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 12x12b
Core Processor: Coldfire V1
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Description: IC MCU 32BIT 128KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, LVD, PWM, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 12x12b
Core Processor: Coldfire V1
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MF3DH23C0DA4/00J |
Hersteller: NXP USA Inc.
Description: MF3DH23C0DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Description: MF3DH23C0DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
Mindestbestellmenge: 17500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MCF51MM256VLL |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 8x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 65
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 8x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 65
DigiKey Programmable: Not Verified
auf Bestellung 397 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 31+ | 15.25 EUR |
| MC9328MX21CVK |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX21 266MHZ 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.0V
Supplier Device Package: 289-LFBGA (14x14)
USB: USB 1.x (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Additional Interfaces: 1-Wire, I2C, I2S, SPI, SSI, MMC/SD, UART
Description: IC MPU I.MX21 266MHZ 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.0V
Supplier Device Package: 289-LFBGA (14x14)
USB: USB 1.x (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Additional Interfaces: 1-Wire, I2C, I2S, SPI, SSI, MMC/SD, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC9328MX21CVK |
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Hersteller: NXP USA Inc.
Description: MICROPROCESSOR, 32-BIT, 266MHZ,
Packaging: Bulk
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3V
Supplier Device Package: 289-PBGA (14x14)
USB: USB OTG (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Additional Interfaces: 1-Wire, I2C, I2S, SPI, SSI, MMC/SD, UART
Description: MICROPROCESSOR, 32-BIT, 266MHZ,
Packaging: Bulk
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3V
Supplier Device Package: 289-PBGA (14x14)
USB: USB OTG (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Additional Interfaces: 1-Wire, I2C, I2S, SPI, SSI, MMC/SD, UART
auf Bestellung 461 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 9+ | 55.16 EUR |
| 2PB1219AQ,115 |
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Hersteller: NXP USA Inc.
Description: TRANS PNP 50V 0.5A SOT-323
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 30mA, 300mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 85 @ 150mA, 10V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-323
Grade: Automotive
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 200 mW
Qualification: AEC-Q101
Description: TRANS PNP 50V 0.5A SOT-323
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 30mA, 300mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 85 @ 150mA, 10V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-323
Grade: Automotive
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 200 mW
Qualification: AEC-Q101
auf Bestellung 86190 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 10724+ | 0.051 EUR |




























