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LFBGAMU3A NXP USA Inc. Description: 324 PIN 1.0MM PGA SOCKET SPACER
Packaging: Bulk
Module/Board Type: Socket Module - PGA
Produkt ist nicht verfügbar
LFK77CINTPWC NXP USA Inc. Description: NXP MPC5777C 300MHZ416-PIN 1.0
Packaging: Bulk
Produkt ist nicht verfügbar
74HC107D,652 74HC107D,652 NXP USA Inc. 74HC_HCT107.pdf Description: IC JK TYPE NEG TRG DUAL 14SOIC
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 85 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 1
auf Bestellung 5727 Stücke:
Lieferzeit 10-14 Tag (e)
1597+0.31 EUR
Mindestbestellmenge: 1597
PMP4501G,115 PMP4501G,115 NXP USA Inc. PMP4501V_G_Y.pdf Description: TRANS 2NPN 45V 0.1A 5TSSOP
Packaging: Bulk
auf Bestellung 49076 Stücke:
Lieferzeit 10-14 Tag (e)
6662+0.082 EUR
Mindestbestellmenge: 6662
PESD3V3V4UG,115 PESD3V3V4UG,115 NXP USA Inc. PESDXV4UF_G_W.pdf Description: TVS DIODE 3.3VWM 11VC 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 15pF @ 1MHz
Current - Peak Pulse (10/1000µs): 1.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 3.3V (Max)
Supplier Device Package: 5-TSSOP
Unidirectional Channels: 4
Voltage - Breakdown (Min): 5.3V
Voltage - Clamping (Max) @ Ipp: 11V
Power - Peak Pulse: 16W
Power Line Protection: No
Produkt ist nicht verfügbar
PESD3V3V4UG,115 PESD3V3V4UG,115 NXP USA Inc. PESDXV4UF_G_W.pdf Description: TVS DIODE 3.3VWM 11VC 5TSSOP
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 15pF @ 1MHz
Current - Peak Pulse (10/1000µs): 1.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 3.3V (Max)
Supplier Device Package: 5-TSSOP
Unidirectional Channels: 4
Voltage - Breakdown (Min): 5.3V
Voltage - Clamping (Max) @ Ipp: 11V
Power - Peak Pulse: 16W
Power Line Protection: No
Produkt ist nicht verfügbar
74HC652D,112 74HC652D,112 NXP USA Inc. 74HC(T)652.pdf Description: IC TXRX NON-INVERT 6V 24SO
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 8
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 24-SO
Produkt ist nicht verfügbar
74AUP1G3208GF,132 74AUP1G3208GF,132 NXP USA Inc. PHGLS25270-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA 74AUP1G3208GF - OR-
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Logic Type: AND/OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3 Input (2, 1)
Schmitt Trigger Input: No
Supplier Device Package: 6-XSON (1x1)
Number of Circuits: 1
auf Bestellung 163650 Stücke:
Lieferzeit 10-14 Tag (e)
1658+0.29 EUR
Mindestbestellmenge: 1658
PBLS6021D,115 PBLS6021D,115 NXP USA Inc. PBLS6021D.pdf Description: TRANS NPN PREBIAS/PNP 6TSOP
Packaging: Bulk
auf Bestellung 168000 Stücke:
Lieferzeit 10-14 Tag (e)
2439+0.2 EUR
Mindestbestellmenge: 2439
BLS6G2731S-120,112 NXP USA Inc. Description: FET RF 60V 3.1GHZ SOT502B
Packaging: Tube
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
2+352.07 EUR
Mindestbestellmenge: 2
PCA9482UKZ NXP USA Inc. Description: SWITCHED CAPACITOR CHARGER
Packaging: Tape & Reel (TR)
Package / Case: 42-UFBGA, WLCSP
Number of Cells: 1
Mounting Type: Surface Mount
Interface: I2C, USB
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 42-WLCSP (3.02x2.72)
Charge Current - Max: 7A
Programmable Features: Current, Timer, Voltage
Fault Protection: Over Temperature, Over-Under Voltage
Voltage - Supply (Max): 20V
Battery Pack Voltage: 7V (Max)
Current - Charging: Constant
Produkt ist nicht verfügbar
BC847W,135 BC847W,135 NXP USA Inc. PHGLS30472-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA BC847W - SMALL SIGN
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 110 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-323
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 200 mW
Qualification: AEC-Q101
auf Bestellung 650000 Stücke:
Lieferzeit 10-14 Tag (e)
15000+0.033 EUR
Mindestbestellmenge: 15000
LD6806CX4/25P,315 LD6806CX4/25P,315 NXP USA Inc. LD6806_Series.pdf Description: IC REG LINEAR 2.5V 200MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.1V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 17750 Stücke:
Lieferzeit 10-14 Tag (e)
3328+0.15 EUR
Mindestbestellmenge: 3328
NCK2912AHN/T0B/UY NCK2912AHN/T0B/UY NXP USA Inc. Description: IC RF TXRX+MCU 48HVQFN
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
74ABT241D,623 74ABT241D,623 NXP USA Inc. DS_568_74ABT241.pdf Description: IC BUFF NON-INVERT 5.5V 20SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-SO
Produkt ist nicht verfügbar
LPC55S69JBD64Y NXP USA Inc. LPC55S6x.pdf Description: IC MCU 32BIT 640KB FLASH 64HTQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.97 EUR
10+ 11.01 EUR
25+ 10.78 EUR
50+ 10.75 EUR
100+ 9.64 EUR
250+ 9.35 EUR
500+ 8.89 EUR
Mindestbestellmenge: 2
LPC55S69JEV98Y NXP USA Inc. LPC55S6x.pdf Description: IC MCU 32BIT 640KB FLASH
Packaging: Cut Tape (CT)
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Number of I/O: 64
auf Bestellung 1980 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.78 EUR
10+ 11.76 EUR
25+ 11.51 EUR
50+ 11.47 EUR
100+ 10.29 EUR
250+ 9.98 EUR
500+ 9.49 EUR
1000+ 9.16 EUR
Mindestbestellmenge: 2
LPC55S69JBD100Y LPC55S69JBD100Y NXP USA Inc. LPC55S6x.pdf Description: IC MCU 32BIT 640KB FLSH 100HLQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
1+18.18 EUR
10+ 14.28 EUR
100+ 11.82 EUR
74LVCH244APW,112 74LVCH244APW,112 NXP USA Inc. 74LVC_LVCH244A.pdf Description: IC BUFF/DVR TRI-ST DUAL 20TSSOP
Packaging: Bulk
auf Bestellung 60769 Stücke:
Lieferzeit 10-14 Tag (e)
1426+0.35 EUR
Mindestbestellmenge: 1426
BSC9131NJN1HHHB BSC9131NJN1HHHB NXP USA Inc. BSC9131.pdf Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Bulk
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
auf Bestellung 120 Stücke:
Lieferzeit 10-14 Tag (e)
5+99.75 EUR
Mindestbestellmenge: 5
BSC9131NJN1HHHB BSC9131NJN1HHHB NXP USA Inc. BSC9131.pdf Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Box
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
Produkt ist nicht verfügbar
74LVC1G332GXZ 74LVC1G332GXZ NXP USA Inc. 74LVC1G332.pdf Description: IC GATE OR 1CH 3-INP 6X2SON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 3
Supplier Device Package: 6-X2SON (1.0x0.8)
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 3.5ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
auf Bestellung 128700 Stücke:
Lieferzeit 10-14 Tag (e)
4543+0.12 EUR
Mindestbestellmenge: 4543
74LVC1G332GF,132 74LVC1G332GF,132 NXP USA Inc. PHGLS23885-1.pdf?t.download=true&u=5oefqw Description: IC GATE OR 1CH 3-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 3
Supplier Device Package: 6-XSON (1x1)
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 3.5ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
auf Bestellung 329005 Stücke:
Lieferzeit 10-14 Tag (e)
2613+0.18 EUR
Mindestbestellmenge: 2613
MW7IC2240NR1 MW7IC2240NR1 NXP USA Inc. MW7IC2040N.pdf Description: IC AMP W-CDMA 2.11-2.17GHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-16 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 2.11GHz ~ 2.17GHz
RF Type: W-CDMA
Voltage - Supply: 32V
Gain: 30dB
Current - Supply: 420mA
P1dB: 46dBm
Test Frequency: 2.14GHz
Supplier Device Package: TO-270 WBL-16
Produkt ist nicht verfügbar
MPXHZ6400A6T1 MPXHZ6400A6T1 NXP USA Inc. MPXH6400A.pdf Description: SENSOR 58.02PSIA 4.8V 8SSOP
Packaging: Tape & Reel (TR)
Features: Temperature Compensated
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.8 V
Operating Pressure: 2.9PSI ~ 58.02PSI (20kPa ~ 400kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.64V ~ 5.36V
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: No Port
Maximum Pressure: 232.06PSI (1600kPa)
Produkt ist nicht verfügbar
MPXHZ6400A6T1 MPXHZ6400A6T1 NXP USA Inc. MPXH6400A.pdf Description: SENSOR 58.02PSIA 4.8V 8SSOP
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.8 V
Operating Pressure: 2.9PSI ~ 58.02PSI (20kPa ~ 400kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.64V ~ 5.36V
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: No Port
Maximum Pressure: 232.06PSI (1600kPa)
Produkt ist nicht verfügbar
BZV90-C36,115 NXP USA Inc. BZV90.pdf Description: DIODE ZENER 36V 1.5W SC73
Packaging: Bulk
auf Bestellung 73031 Stücke:
Lieferzeit 10-14 Tag (e)
1745+0.28 EUR
Mindestbestellmenge: 1745
BZV90-C15,115 BZV90-C15,115 NXP USA Inc. BZV90.pdf Description: DIODE ZENER 15V 1.5W SC73
Packaging: Bulk
auf Bestellung 59952 Stücke:
Lieferzeit 10-14 Tag (e)
1745+0.28 EUR
Mindestbestellmenge: 1745
BZV90-C68,115 BZV90-C68,115 NXP USA Inc. BZV90.pdf Description: DIODE ZENER 68V 1.5W SC73
Packaging: Bulk
auf Bestellung 12940 Stücke:
Lieferzeit 10-14 Tag (e)
1745+0.28 EUR
Mindestbestellmenge: 1745
MIMXRT1021CAG4BR NXP USA Inc. IMXRT1020IEC.pdf Description: IC MCU 32BIT 96KB ROM 144LQFP
Packaging: Cut Tape (CT)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 19x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.3V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 96
auf Bestellung 477 Stücke:
Lieferzeit 10-14 Tag (e)
2+15.29 EUR
10+ 14.06 EUR
25+ 13.77 EUR
50+ 13.72 EUR
100+ 12.31 EUR
250+ 11.94 EUR
Mindestbestellmenge: 2
74HCU04PW,112 74HCU04PW,112 NXP USA Inc. 74HCU04.pdf Description: IC INVERT HEX 6CH 1-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 1
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.7V ~ 4.8V
Input Logic Level - Low: 0.3V ~ 1.2V
Max Propagation Delay @ V, Max CL: 12ns @ 6V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 2 µA
auf Bestellung 27895 Stücke:
Lieferzeit 10-14 Tag (e)
2542+0.2 EUR
Mindestbestellmenge: 2542
74ALVC14PW,112 74ALVC14PW,112 NXP USA Inc. 74ALVC14.pdf Description: IC HEX INV SCHMITT TRIG 14TSSOP
Packaging: Bulk
auf Bestellung 6987 Stücke:
Lieferzeit 10-14 Tag (e)
2153+0.23 EUR
Mindestbestellmenge: 2153
PCA9534PW,112 PCA9534PW,112 NXP USA Inc. PCA9534.pdf Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Packaging: Tube
Features: POR
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
auf Bestellung 1239 Stücke:
Lieferzeit 10-14 Tag (e)
333+1.46 EUR
Mindestbestellmenge: 333
PDTC144VM,315 PDTC144VM,315 NXP USA Inc. PDTC144V_SER.pdf Description: TRANS PREBIAS NPN 250MW SOT883
Packaging: Bulk
auf Bestellung 109980 Stücke:
Lieferzeit 10-14 Tag (e)
11871+0.049 EUR
Mindestbestellmenge: 11871
S912XEG256BVALR S912XEG256BVALR NXP USA Inc. Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XET256W1VALR S912XET256W1VALR NXP USA Inc. Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XEG384BVALR S912XEG384BVALR NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XEG384J2VALR S912XEG384J2VALR NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XEQ512BVALR S912XEQ512BVALR NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XEQ512BVALR S912XEQ512BVALR NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Cut Tape (CT)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XEQ512F1VALR S912XEQ512F1VALR NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XEP768BVALR NXP USA Inc. Description: IC MCU 16BIT 768KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 1.98V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
Produkt ist nicht verfügbar
MPC8247CZQTIEA MPC8247CZQTIEA NXP USA Inc. MPC8272EC.pdf Description: IC MPU MPC82XX 400MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
MMG20271H9T1 MMG20271H9T1 NXP USA Inc. Description: IC AMP LTE 1.5GHZ-2.7GHZ SOT89A
Packaging: Cut Tape (CT)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 1.5GHz ~ 2.7GHz
RF Type: LTE, TDS-CDMA, W-CDMA
Voltage - Supply: 5V
Gain: 16dB
Current - Supply: 215mA
Noise Figure: 1.7dB
P1dB: 27.5dBm
Test Frequency: 2.14GHz
Supplier Device Package: SOT-89A
Produkt ist nicht verfügbar
74HCT138D-Q100,118 74HCT138D-Q100,118 NXP USA Inc. PHGL-S-A0000249690-1.pdf?t.download=true&u=5oefqw Description: IC DECODER/DEMUX 1 X 3:8 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 4260 Stücke:
Lieferzeit 10-14 Tag (e)
2111+0.23 EUR
Mindestbestellmenge: 2111
74HC4017D,653 74HC4017D,653 NXP USA Inc. 74HC_HCT4017.pdf Description: IC DECADE COUNTER 10BIT 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C (TA)
Direction: Up
Trigger Type: Positive, Negative
Timing: Synchronous
Supplier Device Package: 16-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 83 MHz
Number of Bits per Element: 10
auf Bestellung 8223 Stücke:
Lieferzeit 10-14 Tag (e)
1438+0.34 EUR
Mindestbestellmenge: 1438
74HC4017D,652 74HC4017D,652 NXP USA Inc. 74HC_HCT4017.pdf Description: IC DECADE COUNTER 10BIT 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C (TA)
Direction: Up
Trigger Type: Positive, Negative
Timing: Synchronous
Supplier Device Package: 16-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 83 MHz
Number of Bits per Element: 10
auf Bestellung 13987 Stücke:
Lieferzeit 10-14 Tag (e)
1043+0.47 EUR
Mindestbestellmenge: 1043
BZA868AVL,115 BZA868AVL,115 NXP USA Inc. BZA800AVL_SERIES.pdf Description: TVS DIODE 6.8VWM 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Type: Zener
Applications: General Purpose
Capacitance @ Frequency: 180pF @ 1MHz
Voltage - Reverse Standoff (Typ): 6.8V
Supplier Device Package: SOT-353
Unidirectional Channels: 4
Power - Peak Pulse: 6W
Power Line Protection: No
Produkt ist nicht verfügbar
BZA868AVL,115 BZA868AVL,115 NXP USA Inc. BZA800AVL_SERIES.pdf Description: TVS DIODE 6.8VWM 5TSSOP
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Type: Zener
Applications: General Purpose
Capacitance @ Frequency: 180pF @ 1MHz
Voltage - Reverse Standoff (Typ): 6.8V
Supplier Device Package: SOT-353
Unidirectional Channels: 4
Power - Peak Pulse: 6W
Power Line Protection: No
Produkt ist nicht verfügbar
LFDBGK46MT4A NXP USA Inc. Description: 292 PIN 0.8MM PGA ADAPTER WITH A
Packaging: Bulk
For Use With/Related Products: MPC5746M
Module/Board Type: Socket Module - BGA
Produkt ist nicht verfügbar
RDWMC9064-SR2-S0 NXP USA Inc. Description: RDWMC9064-SR2-S0
Packaging: Bulk
Produkt ist nicht verfügbar
LPC5502JHI48J LPC5502JHI48J NXP USA Inc. LPC55S0x_LPC550x.pdf Description: IC MCU 32BIT 64KB FLASH 48VFQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.39 EUR
10+ 4.89 EUR
25+ 4.79 EUR
50+ 4.76 EUR
100+ 4.27 EUR
250+ 4.25 EUR
500+ 4.1 EUR
1000+ 3.9 EUR
Mindestbestellmenge: 4
LPC5502JBD64K NXP USA Inc. LPC55S0x_LPC550x.pdf Description: IC MCU 32BIT 64KB FLASH 64TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 9x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 45
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.7 EUR
10+ 5.17 EUR
25+ 5.06 EUR
40+ 5.03 EUR
80+ 4.51 EUR
230+ 4.5 EUR
800+ 4.19 EUR
Mindestbestellmenge: 4
74LVCH32374AEC,518 74LVCH32374AEC,518 NXP USA Inc. 74LVCH32374A.pdf Description: IC FF D-TYPE QUAD 8BIT 96LFBGA
Packaging: Bulk
Package / Case: 96-LFBGA
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 4
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 40 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 5 pF
Supplier Device Package: 96-LFBGA (13.5x5.5)
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF
Number of Bits per Element: 8
auf Bestellung 17500 Stücke:
Lieferzeit 10-14 Tag (e)
82+5.98 EUR
Mindestbestellmenge: 82
74LVCH32373AEC,551 74LVCH32373AEC,551 NXP USA Inc. 74LVCH32373A.pdf Description: IC 32BIT TRANSP D LATCH 96LFBGA
Packaging: Tray
Package / Case: 96-LFBGA
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.2V ~ 3.6V
Independent Circuits: 4
Current - Output High, Low: 24mA, 24mA
Delay Time - Propagation: 3ns
Supplier Device Package: 96-LFBGA (13.5x5.5)
auf Bestellung 788 Stücke:
Lieferzeit 10-14 Tag (e)
62+7.98 EUR
Mindestbestellmenge: 62
S912XEQ512BCAL S912XEQ512BCAL NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
P1010NXE5HHB P1010NXE5HHB NXP USA Inc. QP1010FS.pdf Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGA
Packaging: Tray
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
SATA: SATA 3Gbps (2)
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
MCIMX8ULP-EVK MCIMX8ULP-EVK NXP USA Inc. IMX8ULPHDG.pdf Description: I.MX 8ULP EVK (W/ 15X15)
Packaging: Box
auf Bestellung 22 Stücke:
Lieferzeit 10-14 Tag (e)
1+911.73 EUR
NTM88H145T1 NXP USA Inc. Description: IC PRESSURE SENSOR 24HQFN
Packaging: Tape & Reel (TR)
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
2000+6.02 EUR
Mindestbestellmenge: 2000
MC56F82723VLC MC56F82723VLC NXP USA Inc. MC56F827XXDS.pdf Description: IC MCU 32BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 3K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 6x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LFBGAMU3A
Hersteller: NXP USA Inc.
Description: 324 PIN 1.0MM PGA SOCKET SPACER
Packaging: Bulk
Module/Board Type: Socket Module - PGA
Produkt ist nicht verfügbar
LFK77CINTPWC
Hersteller: NXP USA Inc.
Description: NXP MPC5777C 300MHZ416-PIN 1.0
Packaging: Bulk
Produkt ist nicht verfügbar
74HC107D,652 74HC_HCT107.pdf
74HC107D,652
Hersteller: NXP USA Inc.
Description: IC JK TYPE NEG TRG DUAL 14SOIC
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 85 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 1
auf Bestellung 5727 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1597+0.31 EUR
Mindestbestellmenge: 1597
PMP4501G,115 PMP4501V_G_Y.pdf
PMP4501G,115
Hersteller: NXP USA Inc.
Description: TRANS 2NPN 45V 0.1A 5TSSOP
Packaging: Bulk
auf Bestellung 49076 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
6662+0.082 EUR
Mindestbestellmenge: 6662
PESD3V3V4UG,115 PESDXV4UF_G_W.pdf
PESD3V3V4UG,115
Hersteller: NXP USA Inc.
Description: TVS DIODE 3.3VWM 11VC 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 15pF @ 1MHz
Current - Peak Pulse (10/1000µs): 1.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 3.3V (Max)
Supplier Device Package: 5-TSSOP
Unidirectional Channels: 4
Voltage - Breakdown (Min): 5.3V
Voltage - Clamping (Max) @ Ipp: 11V
Power - Peak Pulse: 16W
Power Line Protection: No
Produkt ist nicht verfügbar
PESD3V3V4UG,115 PESDXV4UF_G_W.pdf
PESD3V3V4UG,115
Hersteller: NXP USA Inc.
Description: TVS DIODE 3.3VWM 11VC 5TSSOP
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 15pF @ 1MHz
Current - Peak Pulse (10/1000µs): 1.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 3.3V (Max)
Supplier Device Package: 5-TSSOP
Unidirectional Channels: 4
Voltage - Breakdown (Min): 5.3V
Voltage - Clamping (Max) @ Ipp: 11V
Power - Peak Pulse: 16W
Power Line Protection: No
Produkt ist nicht verfügbar
74HC652D,112 74HC(T)652.pdf
74HC652D,112
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 6V 24SO
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 8
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 24-SO
Produkt ist nicht verfügbar
74AUP1G3208GF,132 PHGLS25270-1.pdf?t.download=true&u=5oefqw
74AUP1G3208GF,132
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AUP1G3208GF - OR-
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Logic Type: AND/OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3 Input (2, 1)
Schmitt Trigger Input: No
Supplier Device Package: 6-XSON (1x1)
Number of Circuits: 1
auf Bestellung 163650 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1658+0.29 EUR
Mindestbestellmenge: 1658
PBLS6021D,115 PBLS6021D.pdf
PBLS6021D,115
Hersteller: NXP USA Inc.
Description: TRANS NPN PREBIAS/PNP 6TSOP
Packaging: Bulk
auf Bestellung 168000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2439+0.2 EUR
Mindestbestellmenge: 2439
BLS6G2731S-120,112
Hersteller: NXP USA Inc.
Description: FET RF 60V 3.1GHZ SOT502B
Packaging: Tube
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+352.07 EUR
Mindestbestellmenge: 2
PCA9482UKZ
Hersteller: NXP USA Inc.
Description: SWITCHED CAPACITOR CHARGER
Packaging: Tape & Reel (TR)
Package / Case: 42-UFBGA, WLCSP
Number of Cells: 1
Mounting Type: Surface Mount
Interface: I2C, USB
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 42-WLCSP (3.02x2.72)
Charge Current - Max: 7A
Programmable Features: Current, Timer, Voltage
Fault Protection: Over Temperature, Over-Under Voltage
Voltage - Supply (Max): 20V
Battery Pack Voltage: 7V (Max)
Current - Charging: Constant
Produkt ist nicht verfügbar
BC847W,135 PHGLS30472-1.pdf?t.download=true&u=5oefqw
BC847W,135
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BC847W - SMALL SIGN
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 110 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-323
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 200 mW
Qualification: AEC-Q101
auf Bestellung 650000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
15000+0.033 EUR
Mindestbestellmenge: 15000
LD6806CX4/25P,315 LD6806_Series.pdf
LD6806CX4/25P,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.5V 200MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.1V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 17750 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3328+0.15 EUR
Mindestbestellmenge: 3328
NCK2912AHN/T0B/UY
NCK2912AHN/T0B/UY
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 48HVQFN
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
74ABT241D,623 DS_568_74ABT241.pdf
74ABT241D,623
Hersteller: NXP USA Inc.
Description: IC BUFF NON-INVERT 5.5V 20SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-SO
Produkt ist nicht verfügbar
LPC55S69JBD64Y LPC55S6x.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 640KB FLASH 64HTQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+11.97 EUR
10+ 11.01 EUR
25+ 10.78 EUR
50+ 10.75 EUR
100+ 9.64 EUR
250+ 9.35 EUR
500+ 8.89 EUR
Mindestbestellmenge: 2
LPC55S69JEV98Y LPC55S6x.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 640KB FLASH
Packaging: Cut Tape (CT)
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Number of I/O: 64
auf Bestellung 1980 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+12.78 EUR
10+ 11.76 EUR
25+ 11.51 EUR
50+ 11.47 EUR
100+ 10.29 EUR
250+ 9.98 EUR
500+ 9.49 EUR
1000+ 9.16 EUR
Mindestbestellmenge: 2
LPC55S69JBD100Y LPC55S6x.pdf
LPC55S69JBD100Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 640KB FLSH 100HLQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
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Anzahl Preis ohne MwSt
1+18.18 EUR
10+ 14.28 EUR
100+ 11.82 EUR
74LVCH244APW,112 74LVC_LVCH244A.pdf
74LVCH244APW,112
Hersteller: NXP USA Inc.
Description: IC BUFF/DVR TRI-ST DUAL 20TSSOP
Packaging: Bulk
auf Bestellung 60769 Stücke:
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1426+0.35 EUR
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BSC9131NJN1HHHB BSC9131.pdf
BSC9131NJN1HHHB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Bulk
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
auf Bestellung 120 Stücke:
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Anzahl Preis ohne MwSt
5+99.75 EUR
Mindestbestellmenge: 5
BSC9131NJN1HHHB BSC9131.pdf
BSC9131NJN1HHHB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Box
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
Produkt ist nicht verfügbar
74LVC1G332GXZ 74LVC1G332.pdf
74LVC1G332GXZ
Hersteller: NXP USA Inc.
Description: IC GATE OR 1CH 3-INP 6X2SON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 3
Supplier Device Package: 6-X2SON (1.0x0.8)
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 3.5ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
auf Bestellung 128700 Stücke:
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4543+0.12 EUR
Mindestbestellmenge: 4543
74LVC1G332GF,132 PHGLS23885-1.pdf?t.download=true&u=5oefqw
74LVC1G332GF,132
Hersteller: NXP USA Inc.
Description: IC GATE OR 1CH 3-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 3
Supplier Device Package: 6-XSON (1x1)
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 3.5ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
auf Bestellung 329005 Stücke:
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2613+0.18 EUR
Mindestbestellmenge: 2613
MW7IC2240NR1 MW7IC2040N.pdf
MW7IC2240NR1
Hersteller: NXP USA Inc.
Description: IC AMP W-CDMA 2.11-2.17GHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-16 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 2.11GHz ~ 2.17GHz
RF Type: W-CDMA
Voltage - Supply: 32V
Gain: 30dB
Current - Supply: 420mA
P1dB: 46dBm
Test Frequency: 2.14GHz
Supplier Device Package: TO-270 WBL-16
Produkt ist nicht verfügbar
MPXHZ6400A6T1 MPXH6400A.pdf
MPXHZ6400A6T1
Hersteller: NXP USA Inc.
Description: SENSOR 58.02PSIA 4.8V 8SSOP
Packaging: Tape & Reel (TR)
Features: Temperature Compensated
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.8 V
Operating Pressure: 2.9PSI ~ 58.02PSI (20kPa ~ 400kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.64V ~ 5.36V
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: No Port
Maximum Pressure: 232.06PSI (1600kPa)
Produkt ist nicht verfügbar
MPXHZ6400A6T1 MPXH6400A.pdf
MPXHZ6400A6T1
Hersteller: NXP USA Inc.
Description: SENSOR 58.02PSIA 4.8V 8SSOP
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.8 V
Operating Pressure: 2.9PSI ~ 58.02PSI (20kPa ~ 400kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.64V ~ 5.36V
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: No Port
Maximum Pressure: 232.06PSI (1600kPa)
Produkt ist nicht verfügbar
BZV90-C36,115 BZV90.pdf
Hersteller: NXP USA Inc.
Description: DIODE ZENER 36V 1.5W SC73
Packaging: Bulk
auf Bestellung 73031 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1745+0.28 EUR
Mindestbestellmenge: 1745
BZV90-C15,115 BZV90.pdf
BZV90-C15,115
Hersteller: NXP USA Inc.
Description: DIODE ZENER 15V 1.5W SC73
Packaging: Bulk
auf Bestellung 59952 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1745+0.28 EUR
Mindestbestellmenge: 1745
BZV90-C68,115 BZV90.pdf
BZV90-C68,115
Hersteller: NXP USA Inc.
Description: DIODE ZENER 68V 1.5W SC73
Packaging: Bulk
auf Bestellung 12940 Stücke:
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Anzahl Preis ohne MwSt
1745+0.28 EUR
Mindestbestellmenge: 1745
MIMXRT1021CAG4BR IMXRT1020IEC.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 96KB ROM 144LQFP
Packaging: Cut Tape (CT)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 19x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.3V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 96
auf Bestellung 477 Stücke:
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Anzahl Preis ohne MwSt
2+15.29 EUR
10+ 14.06 EUR
25+ 13.77 EUR
50+ 13.72 EUR
100+ 12.31 EUR
250+ 11.94 EUR
Mindestbestellmenge: 2
74HCU04PW,112 74HCU04.pdf
74HCU04PW,112
Hersteller: NXP USA Inc.
Description: IC INVERT HEX 6CH 1-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 1
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.7V ~ 4.8V
Input Logic Level - Low: 0.3V ~ 1.2V
Max Propagation Delay @ V, Max CL: 12ns @ 6V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 2 µA
auf Bestellung 27895 Stücke:
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Anzahl Preis ohne MwSt
2542+0.2 EUR
Mindestbestellmenge: 2542
74ALVC14PW,112 74ALVC14.pdf
74ALVC14PW,112
Hersteller: NXP USA Inc.
Description: IC HEX INV SCHMITT TRIG 14TSSOP
Packaging: Bulk
auf Bestellung 6987 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2153+0.23 EUR
Mindestbestellmenge: 2153
PCA9534PW,112 PCA9534.pdf
PCA9534PW,112
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Packaging: Tube
Features: POR
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
auf Bestellung 1239 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
333+1.46 EUR
Mindestbestellmenge: 333
PDTC144VM,315 PDTC144V_SER.pdf
PDTC144VM,315
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS NPN 250MW SOT883
Packaging: Bulk
auf Bestellung 109980 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
11871+0.049 EUR
Mindestbestellmenge: 11871
S912XEG256BVALR
S912XEG256BVALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XET256W1VALR
S912XET256W1VALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XEG384BVALR
S912XEG384BVALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XEG384J2VALR
S912XEG384J2VALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XEQ512BVALR MC9S12XEPB.pdf
S912XEQ512BVALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XEQ512BVALR MC9S12XEPB.pdf
S912XEQ512BVALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Cut Tape (CT)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XEQ512F1VALR MC9S12XEPB.pdf
S912XEQ512F1VALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XEP768BVALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 768KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 1.98V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
Produkt ist nicht verfügbar
MPC8247CZQTIEA MPC8272EC.pdf
MPC8247CZQTIEA
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 400MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
MMG20271H9T1
MMG20271H9T1
Hersteller: NXP USA Inc.
Description: IC AMP LTE 1.5GHZ-2.7GHZ SOT89A
Packaging: Cut Tape (CT)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 1.5GHz ~ 2.7GHz
RF Type: LTE, TDS-CDMA, W-CDMA
Voltage - Supply: 5V
Gain: 16dB
Current - Supply: 215mA
Noise Figure: 1.7dB
P1dB: 27.5dBm
Test Frequency: 2.14GHz
Supplier Device Package: SOT-89A
Produkt ist nicht verfügbar
74HCT138D-Q100,118 PHGL-S-A0000249690-1.pdf?t.download=true&u=5oefqw
74HCT138D-Q100,118
Hersteller: NXP USA Inc.
Description: IC DECODER/DEMUX 1 X 3:8 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 4260 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2111+0.23 EUR
Mindestbestellmenge: 2111
74HC4017D,653 74HC_HCT4017.pdf
74HC4017D,653
Hersteller: NXP USA Inc.
Description: IC DECADE COUNTER 10BIT 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C (TA)
Direction: Up
Trigger Type: Positive, Negative
Timing: Synchronous
Supplier Device Package: 16-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 83 MHz
Number of Bits per Element: 10
auf Bestellung 8223 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1438+0.34 EUR
Mindestbestellmenge: 1438
74HC4017D,652 74HC_HCT4017.pdf
74HC4017D,652
Hersteller: NXP USA Inc.
Description: IC DECADE COUNTER 10BIT 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C (TA)
Direction: Up
Trigger Type: Positive, Negative
Timing: Synchronous
Supplier Device Package: 16-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 83 MHz
Number of Bits per Element: 10
auf Bestellung 13987 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1043+0.47 EUR
Mindestbestellmenge: 1043
BZA868AVL,115 BZA800AVL_SERIES.pdf
BZA868AVL,115
Hersteller: NXP USA Inc.
Description: TVS DIODE 6.8VWM 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Type: Zener
Applications: General Purpose
Capacitance @ Frequency: 180pF @ 1MHz
Voltage - Reverse Standoff (Typ): 6.8V
Supplier Device Package: SOT-353
Unidirectional Channels: 4
Power - Peak Pulse: 6W
Power Line Protection: No
Produkt ist nicht verfügbar
BZA868AVL,115 BZA800AVL_SERIES.pdf
BZA868AVL,115
Hersteller: NXP USA Inc.
Description: TVS DIODE 6.8VWM 5TSSOP
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Type: Zener
Applications: General Purpose
Capacitance @ Frequency: 180pF @ 1MHz
Voltage - Reverse Standoff (Typ): 6.8V
Supplier Device Package: SOT-353
Unidirectional Channels: 4
Power - Peak Pulse: 6W
Power Line Protection: No
Produkt ist nicht verfügbar
LFDBGK46MT4A
Hersteller: NXP USA Inc.
Description: 292 PIN 0.8MM PGA ADAPTER WITH A
Packaging: Bulk
For Use With/Related Products: MPC5746M
Module/Board Type: Socket Module - BGA
Produkt ist nicht verfügbar
RDWMC9064-SR2-S0
Hersteller: NXP USA Inc.
Description: RDWMC9064-SR2-S0
Packaging: Bulk
Produkt ist nicht verfügbar
LPC5502JHI48J LPC55S0x_LPC550x.pdf
LPC5502JHI48J
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48VFQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 7x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 30
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4+5.39 EUR
10+ 4.89 EUR
25+ 4.79 EUR
50+ 4.76 EUR
100+ 4.27 EUR
250+ 4.25 EUR
500+ 4.1 EUR
1000+ 3.9 EUR
Mindestbestellmenge: 4
LPC5502JBD64K LPC55S0x_LPC550x.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 9x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 45
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4+5.7 EUR
10+ 5.17 EUR
25+ 5.06 EUR
40+ 5.03 EUR
80+ 4.51 EUR
230+ 4.5 EUR
800+ 4.19 EUR
Mindestbestellmenge: 4
74LVCH32374AEC,518 74LVCH32374A.pdf
74LVCH32374AEC,518
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE QUAD 8BIT 96LFBGA
Packaging: Bulk
Package / Case: 96-LFBGA
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 4
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 40 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 5 pF
Supplier Device Package: 96-LFBGA (13.5x5.5)
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF
Number of Bits per Element: 8
auf Bestellung 17500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
82+5.98 EUR
Mindestbestellmenge: 82
74LVCH32373AEC,551 74LVCH32373A.pdf
74LVCH32373AEC,551
Hersteller: NXP USA Inc.
Description: IC 32BIT TRANSP D LATCH 96LFBGA
Packaging: Tray
Package / Case: 96-LFBGA
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.2V ~ 3.6V
Independent Circuits: 4
Current - Output High, Low: 24mA, 24mA
Delay Time - Propagation: 3ns
Supplier Device Package: 96-LFBGA (13.5x5.5)
auf Bestellung 788 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
62+7.98 EUR
Mindestbestellmenge: 62
S912XEQ512BCAL MC9S12XEPB.pdf
S912XEQ512BCAL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
P1010NXE5HHB QP1010FS.pdf
P1010NXE5HHB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGA
Packaging: Tray
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
SATA: SATA 3Gbps (2)
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
MCIMX8ULP-EVK IMX8ULPHDG.pdf
MCIMX8ULP-EVK
Hersteller: NXP USA Inc.
Description: I.MX 8ULP EVK (W/ 15X15)
Packaging: Box
auf Bestellung 22 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+911.73 EUR
NTM88H145T1
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR 24HQFN
Packaging: Tape & Reel (TR)
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2000+6.02 EUR
Mindestbestellmenge: 2000
MC56F82723VLC MC56F827XXDS.pdf
MC56F82723VLC
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 3K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 6x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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