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MIMXRT1015CAF4BR MIMXRT1015CAF4BR NXP USA Inc. IMXRT1015IEC.pdf Description: IC MCU 32BIT 96KB ROM 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
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10+11.02 EUR
25+10.21 EUR
100+9.32 EUR
250+8.9 EUR
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BUK9607-30B,118 NXP USA Inc. BUK9607-30B.pdf Description: MOSFET N-CH 30V 75A D2PAK
Packaging: Bulk
auf Bestellung 1087 Stücke:
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720+0.84 EUR
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MGD3160AM315EKR2 MGD3160AM315EKR2 NXP USA Inc. GD3160.pdf Description: EV INVERTER CONTROL; IGBT & SIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: PWM, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge
Voltage - Supply: 4.5V ~ 40V
Rds On (Typ): 500mOhm LS, 500mOhm HS
Applications: General Purpose
Current - Output / Channel: 15A
Current - Peak Output: 15A
Technology: IGBT
Voltage - Load: 4.5V ~ 40V
Supplier Device Package: 32-SOIC
Fault Protection: Over Temperature, Short Circuit
Load Type: Inductive
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1000+10.45 EUR
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MGD3160AM315EKR2 MGD3160AM315EKR2 NXP USA Inc. GD3160.pdf Description: EV INVERTER CONTROL; IGBT & SIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: PWM, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge
Voltage - Supply: 4.5V ~ 40V
Rds On (Typ): 500mOhm LS, 500mOhm HS
Applications: General Purpose
Current - Output / Channel: 15A
Current - Peak Output: 15A
Technology: IGBT
Voltage - Load: 4.5V ~ 40V
Supplier Device Package: 32-SOIC
Fault Protection: Over Temperature, Short Circuit
Load Type: Inductive
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250+11 EUR
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MPC5200CBV400 MPC5200CBV400 NXP USA Inc. MPC5200.pdf Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
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MPC555LFCZP40 MPC555LFCZP40 NXP USA Inc. MPC555PB.pdf Description: IC MCU 32BIT 448KB FLASH 272PBGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 448KB (448K x 8)
RAM Size: 26K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 272-PBGA (27x27)
Number of I/O: 101
DigiKey Programmable: Not Verified
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MPC562CZP40 MPC562CZP40 NXP USA Inc. MPC561RM.pdf Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 40MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPC8241LVR166D MPC8241LVR166D NXP USA Inc. MPC8241.pdf Description: IC MPU MPC82XX 166MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 166MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
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MC9S08PL8SCTJR MC9S08PL8SCTJR NXP USA Inc. MC9S08AC60.pdf Description: PL16S, 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 12x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 18
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LPC11E68JBD64K LPC11E68JBD64K NXP USA Inc. LPC11E1X.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
auf Bestellung 451 Stücke:
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2+13.45 EUR
10+10.36 EUR
25+9.59 EUR
100+8.75 EUR
250+8.35 EUR
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MCF52221CVM80 MCF52221CVM80 NXP USA Inc. Description: IC MCU 32BIT 128KB FLSH 81MAPBGA
Packaging: Tray
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Number of I/O: 56
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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88W8782-B0-NAPC/DZ NXP USA Inc. Description: IC RF 68HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 68-HVQFN (8x8)
Produkt ist nicht verfügbar
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P3T2030DUKAZ NXP USA Inc. P3T1035XUK_P3T2030XUK.pdf Description: P3T2030DUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
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P3T2030DUKAZ NXP USA Inc. P3T1035XUK_P3T2030XUK.pdf Description: P3T2030DUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
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500+0.87 EUR
1000+0.8 EUR
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P3T2030EUKAZ P3T2030EUKAZ NXP USA Inc. P3T1035XUK_P3T2030XUK.pdf Description: P3T2030EUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
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3500+0.68 EUR
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P3T2030EUKAZ P3T2030EUKAZ NXP USA Inc. P3T1035XUK_P3T2030XUK.pdf Description: P3T2030EUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
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15+1.49 EUR
20+1.06 EUR
25+0.95 EUR
100+0.83 EUR
250+0.79 EUR
500+0.75 EUR
1000+0.71 EUR
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P3T2030BUKAZ P3T2030BUKAZ NXP USA Inc. P3T1035XUK_P3T2030XUK.pdf Description: P3T2030BUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
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15+1.46 EUR
20+1.06 EUR
25+0.95 EUR
100+0.83 EUR
250+0.77 EUR
500+0.74 EUR
1000+0.71 EUR
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P3T2030FUKAZ P3T2030FUKAZ NXP USA Inc. P3T1035XUK_P3T2030XUK.pdf Description: P3T2030FUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
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P3T2030FUKAZ P3T2030FUKAZ NXP USA Inc. P3T1035XUK_P3T2030XUK.pdf Description: P3T2030FUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
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15+1.49 EUR
20+1.06 EUR
25+0.95 EUR
100+0.83 EUR
250+0.79 EUR
500+0.75 EUR
1000+0.71 EUR
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P3T1035AUKAZ P3T1035AUKAZ NXP USA Inc. P3T1035XUK_P3T2030XUK.pdf Description: P3T1035AUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5%
Sensing Temperature - Local: -40°C ~ 125°C
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P3T1035AUKAZ P3T1035AUKAZ NXP USA Inc. P3T1035XUK_P3T2030XUK.pdf Description: P3T1035AUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5%
Sensing Temperature - Local: -40°C ~ 125°C
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13+1.71 EUR
14+1.51 EUR
15+1.44 EUR
25+1.34 EUR
50+1.29 EUR
100+1.23 EUR
500+1.11 EUR
1000+1.06 EUR
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MC68360ZQ25VL MC68360ZQ25VL NXP USA Inc. MC68360.pdf Description: IC MPU M683XX 25MHZ 357BGA
Additional Interfaces: SCC, SMC, SPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: CPU32+
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5606SF2CLU6 SPC5606SF2CLU6 NXP USA Inc. MPC5606S.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 136
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LCD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 48K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tray
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NT2H1511G0DUDZ NXP USA Inc. NTAG213_215_216.pdf Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 75°C
Standards: ISO 14443
Supplier Device Package: Die
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NT2H1511G0DUDV NXP USA Inc. NTAG213_215_216.pdf Description: NFC FORUM TYPE 2 TAG COMPLIANT I
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
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ON5088,115 ON5088,115 NXP USA Inc. ON5088.pdf Description: RF TRANS NPN 10V 55GHZ 4DFP
Supplier Device Package: 4-DFP
Noise Figure (dB Typ @ f): 1.1dB @ 12GHz
Frequency - Transition: 55GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 10mA, 2V
Voltage - Collector Emitter Breakdown (Max): 10V
Current - Collector (Ic) (Max): 40mA
Power - Max: 136mW
Gain: 13dB
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SOT-343F
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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ON5088,115 ON5088,115 NXP USA Inc. ON5088.pdf Description: RF TRANS NPN 10V 55GHZ 4DFP
Supplier Device Package: 4-DFP
Noise Figure (dB Typ @ f): 1.1dB @ 12GHz
Frequency - Transition: 55GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 10mA, 2V
Voltage - Collector Emitter Breakdown (Max): 10V
Current - Collector (Ic) (Max): 40mA
Power - Max: 136mW
Gain: 13dB
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SOT-343F
Packaging: Cut Tape (CT)
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27+0.8 EUR
36+0.6 EUR
40+0.52 EUR
100+0.45 EUR
250+0.4 EUR
500+0.38 EUR
1000+0.36 EUR
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LPC11U14FET48/201, LPC11U14FET48/201, NXP USA Inc. LPC11U6X.pdf Description: IC MCU 32BIT 32KB FLASH 48TFBGA
Packaging: Tray
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-TFBGA (4.5x4.5)
Number of I/O: 40
DigiKey Programmable: Not Verified
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FS32R294HFK0MJDT NXP USA Inc. S32R29XFS.pdf Description: IC MCU 32BIT 2.5MB CRAM 269LFBGA
Packaging: Tray
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FS32R294HFK0MJDR NXP USA Inc. S32R29XFS.pdf Description: IC MCU 32BIT 2.5MB CRAM 269LFBGA
Packaging: Tape & Reel (TR)
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PR5331C3HN/C350,55 PR5331C3HN/C350,55 NXP USA Inc. PR533.pdf Description: IC RFID READER 13.56MHZ 40HVQFN
Supplier Device Package: 40-HVQFN (6x6)
Standards: FeliCa, ISO 14443, MIFARE, NFC
Voltage - Supply: 2.5V ~ 3.6V
Operating Temperature: -30°C ~ 85°C
Type: RFID Reader
Interface: I2C, UART
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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MCF51EM128CLL MCF51EM128CLL NXP USA Inc. MCF51EM256.pdf Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
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MCF51EM128CLL MCF51EM128CLL NXP USA Inc. MCF51EM256.pdf Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
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FX32K118LAT0MLHT NXP USA Inc. S32K1xx.pdf Description: S32K118 ARM CORTEX-M0+, 48 MHZ,
Packaging: Tray
Produkt ist nicht verfügbar
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MVR5510AVMANEP MVR5510AVMANEP NXP USA Inc. VR5510.pdf Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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FC32K116LAT0MLFT NXP USA Inc. Description: S32K116 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
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MCXC144VFT MCXC144VFT NXP USA Inc. MCXC24XP64M48SF2.pdf Description: 48MHz, Cortex-M0+
Packaging: Tray
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 40
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4+6.28 EUR
10+4.84 EUR
25+4.5 EUR
100+3.94 EUR
250+3.78 EUR
500+3.42 EUR
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SAF775CHN/N208W/DK NXP USA Inc. Description: CAR DISP
Packaging: Tray
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MPC8245LZU350D MPC8245LZU350D NXP USA Inc. MPC8245.pdf Description: IC MPU MPC82XX 350MHZ 352TBGA
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 352-TBGA (35x35)
Voltage - I/O: 3.3V
Core Processor: PowerPC 603e
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 350MHz
Mounting Type: Surface Mount
Package / Case: 352-LBGA
Packaging: Tray
Additional Interfaces: I2C, I²O, PCI, UART
Graphics Acceleration: No
RAM Controllers: SDRAM
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S9S08SL16F1VTL S9S08SL16F1VTL NXP USA Inc. Description: IC MCU 8BIT 16KB FLASH 28TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 22
Supplier Device Package: 28-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 512 x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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MC9S08AC8MFDE MC9S08AC8MFDE NXP USA Inc. MC9S08AC16.pdf Description: IC MCU 8BIT 8KB FLASH 48QFN
DigiKey Programmable: Not Verified
Number of I/O: 38
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 768 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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MC33FS8510A0KS MC33FS8510A0KS NXP USA Inc. FS84_FS85C_DS.pdf Description: SAFETY POWER MANAGEMENT IC, QFN5
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Applications: System Basis Chip
Voltage - Supply: 60V
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S912ZVL96AVFM NXP USA Inc. Description: S12Z CPU, 96K FLASH
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 19
Produkt ist nicht verfügbar
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MFS2630AMBA0AD NXP USA Inc. PB_FS26.pdf Description: AUTO SBC
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Produkt ist nicht verfügbar
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S32K310NHT0MLFSR NXP USA Inc. S32K3xx.pdf Description: IC MCU
Packaging: Bulk
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2000 Stücke
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S32K310NHT0MLFST S32K310NHT0MLFST NXP USA Inc. S32K3xx.pdf Description: S32K310NHT0MLFST
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 24x12b SAR
Core Processor: ARM® Cortex®-M7
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 112K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Qualification: AEC-Q100
Number of I/O: 42
Grade: Automotive
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, I2S, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Produkt ist nicht verfügbar
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S32K310NHT0MPAST S32K310NHT0MPAST NXP USA Inc. S32K3xx.pdf Description: S32K310NHT0MPAST
Qualification: AEC-Q100
Number of I/O: 84
Grade: Automotive
Supplier Device Package: 100-MaxQFP (10x10)
Peripherals: DMA, I2S, WDT
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 24x12b SAR
Core Processor: ARM® Cortex®-M7
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 112K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 100-QFP
Packaging: Tray
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
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MMA5224KW NXP USA Inc. MMA52xxKW.pdf Description: ACCELEROMETER 240G PCM/SPI 16QFN
Qualification: AEC-Q100
Grade: Automotive
Sensitivity (LSB/g): 2
Supplier Device Package: 16-QFN (6x6)
Voltage - Supply: 4.2V ~ 17V
Operating Temperature: -40°C ~ 125°C
Acceleration Range: ±240g
Axis: X
Type: Digital
Mounting Type: Surface Mount
Output Type: PCM, SPI
Package / Case: 16-QFN Exposed Pad
Features: Selectable Low Pass Filter
Packaging: Tube
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MC9S08QE96CFT MC9S08QE96CFT NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 96KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S32K314NHT1MPBSR S32K314NHT1MPBSR NXP USA Inc. S32K3xx.pdf Description: S32K314NHT1MPBSR
Qualification: AEC-Q100
Number of I/O: 142
Grade: Automotive
Supplier Device Package: 172-QFP (16x16)
Peripherals: DMA, I2S, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 24x12b SAR
Core Processor: ARM® Cortex®-M7
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 172-QFP
Packaging: Bulk
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S32K314NHT1VPBSR S32K314NHT1VPBSR NXP USA Inc. S32K3xx.pdf Description: S32K314 ARM CORTEX-M7, 160 MHZ,
Qualification: AEC-Q100
Number of I/O: 218
Grade: Automotive
Supplier Device Package: 172-QFP (16x16)
Peripherals: DMA, I2S, Serial Audio, WDT
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 24x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C
RAM Size: 512K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 172-QFP
Packaging: Tape & Reel (TR)
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 Mindestbestellmenge: 300 Stücke
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MCZ33903C5EK MCZ33903C5EK NXP USA Inc. MC33903%2C4%2C5.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Produkt ist nicht verfügbar
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MBMI7018TA1AER2 NXP USA Inc. Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1500 Stücke
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MBMI7018SA1AER2 NXP USA Inc. BMI7018.pdf Description: BMS1BCC18 100V
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1500 Stücke
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NXLS96733AESR2 NXP USA Inc. Description: PSI5 YZ DUAL-AXIS HIGH-G INERTI
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NXLS96333AESR2 NXP USA Inc. Description: PSI5 XY DUAL-AXIS HIGH-G INERTI
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MMA1200KEG MMA1200KEG NXP USA Inc. MMA1200KEG.pdf Description: ACCELEROMETER 281G ANALOG 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±281g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 8
auf Bestellung 7683 Stücke:
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MMA1250EGR2 MMA1250EGR2 NXP USA Inc. MMA1250KEG.pdf Description: ACCELEROMETER 5G ANALOG 16SOIC
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Sensitivity (mV/g): 400
Supplier Device Package: 16-SOIC
Bandwidth: 50Hz
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 105°C
Acceleration Range: ±5g
Axis: Z
Type: Analog
Produkt ist nicht verfügbar
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MMA1270KEG MMA1270KEG NXP USA Inc. MMA1270KEG.pdf Description: ACCELEROMETER 2.5G ANALOG 16SOIC
Grade: Automotive
Sensitivity (mV/g): 750
Supplier Device Package: 16-SOIC
Bandwidth: 50Hz
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 105°C
Acceleration Range: ±2.5g
Axis: Z
Type: Analog
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TEA1999DB1504UL NXP USA Inc. TEA1999TK.pdf Description: TEA1999 DEMOBOARD 1504
Packaging: Box
Function: Battery Charger
Type: Power Management
Contents: Board(s)
Utilized IC / Part: TEA1999
Produkt ist nicht verfügbar
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MIMXRT1015CAF4BR IMXRT1015IEC.pdf
MIMXRT1015CAF4BR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 96KB ROM 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
auf Bestellung 898 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+14.28 EUR
10+11.02 EUR
25+10.21 EUR
100+9.32 EUR
250+8.9 EUR
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BUK9607-30B,118 BUK9607-30B.pdf
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 75A D2PAK
Packaging: Bulk
auf Bestellung 1087 Stücke:
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AnzahlPrivatkunde
720+0.84 EUR
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MGD3160AM315EKR2 GD3160.pdf
MGD3160AM315EKR2
Hersteller: NXP USA Inc.
Description: EV INVERTER CONTROL; IGBT & SIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: PWM, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge
Voltage - Supply: 4.5V ~ 40V
Rds On (Typ): 500mOhm LS, 500mOhm HS
Applications: General Purpose
Current - Output / Channel: 15A
Current - Peak Output: 15A
Technology: IGBT
Voltage - Load: 4.5V ~ 40V
Supplier Device Package: 32-SOIC
Fault Protection: Over Temperature, Short Circuit
Load Type: Inductive
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1000+10.45 EUR
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MGD3160AM315EKR2 GD3160.pdf
MGD3160AM315EKR2
Hersteller: NXP USA Inc.
Description: EV INVERTER CONTROL; IGBT & SIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: PWM, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge
Voltage - Supply: 4.5V ~ 40V
Rds On (Typ): 500mOhm LS, 500mOhm HS
Applications: General Purpose
Current - Output / Channel: 15A
Current - Peak Output: 15A
Technology: IGBT
Voltage - Load: 4.5V ~ 40V
Supplier Device Package: 32-SOIC
Fault Protection: Over Temperature, Short Circuit
Load Type: Inductive
auf Bestellung 1143 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+17.34 EUR
10+13.52 EUR
25+12.55 EUR
100+11.51 EUR
250+11 EUR
500+10.7 EUR
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MPC5200CBV400 MPC5200.pdf
MPC5200CBV400
Hersteller: NXP USA Inc.
Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
Produkt ist nicht verfügbar
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MPC555LFCZP40 MPC555PB.pdf
MPC555LFCZP40
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 448KB FLASH 272PBGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 448KB (448K x 8)
RAM Size: 26K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 272-PBGA (27x27)
Number of I/O: 101
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPC562CZP40 MPC561RM.pdf
MPC562CZP40
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 40MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPC8241LVR166D MPC8241.pdf
MPC8241LVR166D
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 166MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 166MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
Produkt ist nicht verfügbar
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MC9S08PL8SCTJR MC9S08AC60.pdf
MC9S08PL8SCTJR
Hersteller: NXP USA Inc.
Description: PL16S, 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 12x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 18
Produkt ist nicht verfügbar
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LPC11E68JBD64K LPC11E1X.pdf
LPC11E68JBD64K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
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Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+13.45 EUR
10+10.36 EUR
25+9.59 EUR
100+8.75 EUR
250+8.35 EUR
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MCF52221CVM80
MCF52221CVM80
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 81MAPBGA
Packaging: Tray
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Number of I/O: 56
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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88W8782-B0-NAPC/DZ
Hersteller: NXP USA Inc.
Description: IC RF 68HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 68-HVQFN (8x8)
Produkt ist nicht verfügbar
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P3T2030DUKAZ P3T1035XUK_P3T2030XUK.pdf
Hersteller: NXP USA Inc.
Description: P3T2030DUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
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P3T2030DUKAZ P3T1035XUK_P3T2030XUK.pdf
Hersteller: NXP USA Inc.
Description: P3T2030DUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
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8+2.62 EUR
13+1.65 EUR
25+1.39 EUR
100+1.11 EUR
250+0.96 EUR
500+0.87 EUR
1000+0.8 EUR
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P3T2030EUKAZ P3T1035XUK_P3T2030XUK.pdf
P3T2030EUKAZ
Hersteller: NXP USA Inc.
Description: P3T2030EUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
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3500+0.68 EUR
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P3T2030EUKAZ P3T1035XUK_P3T2030XUK.pdf
P3T2030EUKAZ
Hersteller: NXP USA Inc.
Description: P3T2030EUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
auf Bestellung 3500 Stücke:
Lieferzeit 10-14 Tag (e)
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15+1.49 EUR
20+1.06 EUR
25+0.95 EUR
100+0.83 EUR
250+0.79 EUR
500+0.75 EUR
1000+0.71 EUR
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P3T2030BUKAZ P3T1035XUK_P3T2030XUK.pdf
P3T2030BUKAZ
Hersteller: NXP USA Inc.
Description: P3T2030BUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
auf Bestellung 3500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
15+1.46 EUR
20+1.06 EUR
25+0.95 EUR
100+0.83 EUR
250+0.77 EUR
500+0.74 EUR
1000+0.71 EUR
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P3T2030FUKAZ P3T1035XUK_P3T2030XUK.pdf
P3T2030FUKAZ
Hersteller: NXP USA Inc.
Description: P3T2030FUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
Produkt ist nicht verfügbar
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P3T2030FUKAZ P3T1035XUK_P3T2030XUK.pdf
P3T2030FUKAZ
Hersteller: NXP USA Inc.
Description: P3T2030FUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
auf Bestellung 3497 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
15+1.49 EUR
20+1.06 EUR
25+0.95 EUR
100+0.83 EUR
250+0.79 EUR
500+0.75 EUR
1000+0.71 EUR
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P3T1035AUKAZ P3T1035XUK_P3T2030XUK.pdf
P3T1035AUKAZ
Hersteller: NXP USA Inc.
Description: P3T1035AUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5%
Sensing Temperature - Local: -40°C ~ 125°C
Produkt ist nicht verfügbar
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P3T1035AUKAZ P3T1035XUK_P3T2030XUK.pdf
P3T1035AUKAZ
Hersteller: NXP USA Inc.
Description: P3T1035AUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5%
Sensing Temperature - Local: -40°C ~ 125°C
auf Bestellung 3303 Stücke:
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13+1.71 EUR
14+1.51 EUR
15+1.44 EUR
25+1.34 EUR
50+1.29 EUR
100+1.23 EUR
500+1.11 EUR
1000+1.06 EUR
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MC68360ZQ25VL MC68360.pdf
MC68360ZQ25VL
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
Additional Interfaces: SCC, SMC, SPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: CPU32+
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5606SF2CLU6 MPC5606S.pdf
SPC5606SF2CLU6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 136
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LCD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 48K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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NT2H1511G0DUDZ NTAG213_215_216.pdf
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 75°C
Standards: ISO 14443
Supplier Device Package: Die
Produkt ist nicht verfügbar
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NT2H1511G0DUDV NTAG213_215_216.pdf
Hersteller: NXP USA Inc.
Description: NFC FORUM TYPE 2 TAG COMPLIANT I
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
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ON5088,115 ON5088.pdf
ON5088,115
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 10V 55GHZ 4DFP
Supplier Device Package: 4-DFP
Noise Figure (dB Typ @ f): 1.1dB @ 12GHz
Frequency - Transition: 55GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 10mA, 2V
Voltage - Collector Emitter Breakdown (Max): 10V
Current - Collector (Ic) (Max): 40mA
Power - Max: 136mW
Gain: 13dB
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SOT-343F
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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ON5088,115 ON5088.pdf
ON5088,115
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 10V 55GHZ 4DFP
Supplier Device Package: 4-DFP
Noise Figure (dB Typ @ f): 1.1dB @ 12GHz
Frequency - Transition: 55GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 10mA, 2V
Voltage - Collector Emitter Breakdown (Max): 10V
Current - Collector (Ic) (Max): 40mA
Power - Max: 136mW
Gain: 13dB
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SOT-343F
Packaging: Cut Tape (CT)
auf Bestellung 1704 Stücke:
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27+0.8 EUR
36+0.6 EUR
40+0.52 EUR
100+0.45 EUR
250+0.4 EUR
500+0.38 EUR
1000+0.36 EUR
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LPC11U14FET48/201, LPC11U6X.pdf
LPC11U14FET48/201,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48TFBGA
Packaging: Tray
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-TFBGA (4.5x4.5)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32R294HFK0MJDT S32R29XFS.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB CRAM 269LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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FS32R294HFK0MJDR S32R29XFS.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB CRAM 269LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PR5331C3HN/C350,55 PR533.pdf
PR5331C3HN/C350,55
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 40HVQFN
Supplier Device Package: 40-HVQFN (6x6)
Standards: FeliCa, ISO 14443, MIFARE, NFC
Voltage - Supply: 2.5V ~ 3.6V
Operating Temperature: -30°C ~ 85°C
Type: RFID Reader
Interface: I2C, UART
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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MCF51EM128CLL MCF51EM256.pdf
MCF51EM128CLL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
auf Bestellung 2324 Stücke:
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34+17.29 EUR
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MCF51EM128CLL MCF51EM256.pdf
MCF51EM128CLL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
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FX32K118LAT0MLHT S32K1xx.pdf
Hersteller: NXP USA Inc.
Description: S32K118 ARM CORTEX-M0+, 48 MHZ,
Packaging: Tray
Produkt ist nicht verfügbar
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MVR5510AVMANEP VR5510.pdf
MVR5510AVMANEP
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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FC32K116LAT0MLFT
Hersteller: NXP USA Inc.
Description: S32K116 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
Produkt ist nicht verfügbar
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MCXC144VFT MCXC24XP64M48SF2.pdf
MCXC144VFT
Hersteller: NXP USA Inc.
Description: 48MHz, Cortex-M0+
Packaging: Tray
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 40
auf Bestellung 1150 Stücke:
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4+6.28 EUR
10+4.84 EUR
25+4.5 EUR
100+3.94 EUR
250+3.78 EUR
500+3.42 EUR
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SAF775CHN/N208W/DK
Hersteller: NXP USA Inc.
Description: CAR DISP
Packaging: Tray
Produkt ist nicht verfügbar
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MPC8245LZU350D MPC8245.pdf
MPC8245LZU350D
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 350MHZ 352TBGA
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 352-TBGA (35x35)
Voltage - I/O: 3.3V
Core Processor: PowerPC 603e
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 350MHz
Mounting Type: Surface Mount
Package / Case: 352-LBGA
Packaging: Tray
Additional Interfaces: I2C, I²O, PCI, UART
Graphics Acceleration: No
RAM Controllers: SDRAM
Produkt ist nicht verfügbar
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S9S08SL16F1VTL
S9S08SL16F1VTL
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 28TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 22
Supplier Device Package: 28-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 512 x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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MC9S08AC8MFDE MC9S08AC16.pdf
MC9S08AC8MFDE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 48QFN
DigiKey Programmable: Not Verified
Number of I/O: 38
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 768 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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MC33FS8510A0KS FS84_FS85C_DS.pdf
MC33FS8510A0KS
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Applications: System Basis Chip
Voltage - Supply: 60V
Produkt ist nicht verfügbar
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S912ZVL96AVFM
Hersteller: NXP USA Inc.
Description: S12Z CPU, 96K FLASH
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 19
Produkt ist nicht verfügbar
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MFS2630AMBA0AD PB_FS26.pdf
Hersteller: NXP USA Inc.
Description: AUTO SBC
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Produkt ist nicht verfügbar
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S32K310NHT0MLFSR S32K3xx.pdf
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Produkt ist nicht verfügbar
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S32K310NHT0MLFST S32K3xx.pdf
S32K310NHT0MLFST
Hersteller: NXP USA Inc.
Description: S32K310NHT0MLFST
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 24x12b SAR
Core Processor: ARM® Cortex®-M7
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 112K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Qualification: AEC-Q100
Number of I/O: 42
Grade: Automotive
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, I2S, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Produkt ist nicht verfügbar
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S32K310NHT0MPAST S32K3xx.pdf
S32K310NHT0MPAST
Hersteller: NXP USA Inc.
Description: S32K310NHT0MPAST
Qualification: AEC-Q100
Number of I/O: 84
Grade: Automotive
Supplier Device Package: 100-MaxQFP (10x10)
Peripherals: DMA, I2S, WDT
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 24x12b SAR
Core Processor: ARM® Cortex®-M7
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 112K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 100-QFP
Packaging: Tray
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Produkt ist nicht verfügbar
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MMA5224KW MMA52xxKW.pdf
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 240G PCM/SPI 16QFN
Qualification: AEC-Q100
Grade: Automotive
Sensitivity (LSB/g): 2
Supplier Device Package: 16-QFN (6x6)
Voltage - Supply: 4.2V ~ 17V
Operating Temperature: -40°C ~ 125°C
Acceleration Range: ±240g
Axis: X
Type: Digital
Mounting Type: Surface Mount
Output Type: PCM, SPI
Package / Case: 16-QFN Exposed Pad
Features: Selectable Low Pass Filter
Packaging: Tube
Produkt ist nicht verfügbar
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MC9S08QE96CFT MC9S08AC60.pdf
MC9S08QE96CFT
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 96KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S32K314NHT1MPBSR S32K3xx.pdf
S32K314NHT1MPBSR
Hersteller: NXP USA Inc.
Description: S32K314NHT1MPBSR
Qualification: AEC-Q100
Number of I/O: 142
Grade: Automotive
Supplier Device Package: 172-QFP (16x16)
Peripherals: DMA, I2S, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 24x12b SAR
Core Processor: ARM® Cortex®-M7
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 172-QFP
Packaging: Bulk
Produkt ist nicht verfügbar
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S32K314NHT1VPBSR S32K3xx.pdf
S32K314NHT1VPBSR
Hersteller: NXP USA Inc.
Description: S32K314 ARM CORTEX-M7, 160 MHZ,
Qualification: AEC-Q100
Number of I/O: 218
Grade: Automotive
Supplier Device Package: 172-QFP (16x16)
Peripherals: DMA, I2S, Serial Audio, WDT
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 24x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C
RAM Size: 512K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 172-QFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCZ33903C5EK MC33903%2C4%2C5.pdf
MCZ33903C5EK
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Produkt ist nicht verfügbar
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MBMI7018TA1AER2
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MBMI7018SA1AER2 BMI7018.pdf
Hersteller: NXP USA Inc.
Description: BMS1BCC18 100V
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NXLS96733AESR2
Hersteller: NXP USA Inc.
Description: PSI5 YZ DUAL-AXIS HIGH-G INERTI
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NXLS96333AESR2
Hersteller: NXP USA Inc.
Description: PSI5 XY DUAL-AXIS HIGH-G INERTI
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MMA1200KEG MMA1200KEG.pdf
MMA1200KEG
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 281G ANALOG 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±281g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 8
auf Bestellung 7683 Stücke:
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AnzahlPrivatkunde
39+13.52 EUR
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MMA1250EGR2 MMA1250KEG.pdf
MMA1250EGR2
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 5G ANALOG 16SOIC
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Sensitivity (mV/g): 400
Supplier Device Package: 16-SOIC
Bandwidth: 50Hz
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 105°C
Acceleration Range: ±5g
Axis: Z
Type: Analog
Produkt ist nicht verfügbar
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MMA1270KEG MMA1270KEG.pdf
MMA1270KEG
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 2.5G ANALOG 16SOIC
Grade: Automotive
Sensitivity (mV/g): 750
Supplier Device Package: 16-SOIC
Bandwidth: 50Hz
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 105°C
Acceleration Range: ±2.5g
Axis: Z
Type: Analog
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TEA1999DB1504UL TEA1999TK.pdf
Hersteller: NXP USA Inc.
Description: TEA1999 DEMOBOARD 1504
Packaging: Box
Function: Battery Charger
Type: Power Management
Contents: Board(s)
Utilized IC / Part: TEA1999
Produkt ist nicht verfügbar
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