LPC55S66JBD100E NXP Semiconductors
auf Bestellung 90 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 12+ | 12.75 EUR |
| 15+ | 9.64 EUR |
| 50+ | 8.74 EUR |
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Technische Details LPC55S66JBD100E NXP Semiconductors
Description: IC MCU 32BIT 256KB FLSH 100LQFP, Packaging: Tray, Package / Case: 100-LQFP Exposed Pad, Mounting Type: Surface Mount, Speed: 150MHz, Program Memory Size: 256KB (256K x 8), RAM Size: 144K x 8, Operating Temperature: -40°C ~ 105°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, Core Processor: ARM® Cortex®-M33, Data Converters: A/D 10x16b SAR, Core Size: 32-Bit Dual-Core, Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V, Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB, Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT, Supplier Device Package: 100-HLQFP (14x14), Number of I/O: 64.
Weitere Produktangebote LPC55S66JBD100E nach Preis ab 8.83 EUR bis 11.09 EUR
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| LPC55S66JBD100E | Hersteller : NXP USA Inc. |
 Description: IC MCU 32BIT 256KB FLSH 100LQFPPackaging: Tray Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 144K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Number of I/O: 64 |
auf Bestellung 90 Stücke: Lieferzeit 10-14 Tag (e) |
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| LPC55S66JBD100E | Hersteller : NXP Semiconductors |
MCU 32-bit ARM Cortex M33 RISC 256KB Flash 3.3V 100-Pin HLQFP EP |
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LPC55S66JBD100E | Hersteller : NXP Semiconductors |
MCU 32-bit ARM Cortex M33 RISC 256KB Flash 3.3V 100-Pin HLQFP EP |
Produkt ist nicht verfügbar |
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| LPC55S66JBD100E | Hersteller : NXP |
Category: ARM NXP microcontrollers Description: IC: ARM microcontroller; 144kBSRAM,256kBFLASH; HLQFP100 Operating temperature: -40...105°C Integrated circuit features: Brown Out Reset (BOR); CRC; DMA; DSP; FPU; MPU; PoR; TRNG; watchdog Kind of architecture: Cortex M33 Memory: 144kB SRAM; 256kB FLASH Mounting: SMD Case: HLQFP100 Supply voltage: 1.8...3.6V DC Type of integrated circuit: ARM microcontroller Interface: GPIO; I2C; I2S; SDIO; SPI; USART; USB Number of inputs/outputs: 64 Anzahl je Verpackung: 1 Stücke |
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LPC55S66JBD100E | Hersteller : NXP Semiconductors |
ARM Microcontrollers - MCU LPC55S66JBD100 |
Produkt ist nicht verfügbar |
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| LPC55S66JBD100E | Hersteller : NXP |
Category: ARM NXP microcontrollers Description: IC: ARM microcontroller; 144kBSRAM,256kBFLASH; HLQFP100 Operating temperature: -40...105°C Integrated circuit features: Brown Out Reset (BOR); CRC; DMA; DSP; FPU; MPU; PoR; TRNG; watchdog Kind of architecture: Cortex M33 Memory: 144kB SRAM; 256kB FLASH Mounting: SMD Case: HLQFP100 Supply voltage: 1.8...3.6V DC Type of integrated circuit: ARM microcontroller Interface: GPIO; I2C; I2S; SDIO; SPI; USART; USB Number of inputs/outputs: 64 |
Produkt ist nicht verfügbar |