Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36095) > Seite 544 nach 602

Wählen Sie Seite:   [  << Vorherige Seite ]  1 60 120 180 240 300 360 420 480 539 540 541 542 543 544 545 546 547 548 549 600 602  [ Nächste Seite >> ]
Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis
MRF9030LR1 MRF9030LR1 NXP USA Inc. MRF9030LR1.pdf Description: RF MOSFET LDMOS 26V NI360
Packaging: Tape & Reel (TR)
Package / Case: NI-360
Mounting Type: Chassis Mount
Frequency: 945MHz
Power - Output: 30W
Gain: 19dB
Technology: LDMOS
Supplier Device Package: NI-360
Voltage - Rated: 68 V
Voltage - Test: 26 V
Current - Test: 250 mA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MK21FX512VLQ12 MK21FX512VLQ12 NXP USA Inc. K21P121M120SF5V2.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TJA1044DTK/0J TJA1044DTK/0J NXP USA Inc. TJA1044.pdf Description: TJA1044DTK/0J
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TJA1044BTK/0J TJA1044BTK/0J NXP USA Inc. TJA1044.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TJA1044ETK/0J TJA1044ETK/0J NXP USA Inc. TJA1044.pdf Description: TJA1044ETK/0J
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TJA1044CTK/0J TJA1044CTK/0J NXP USA Inc. TJA1044.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TJA1044ET/0Z TJA1044ET/0Z NXP USA Inc. TJA1044.pdf Description: TJA1044ET/0Z
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
2500+0.55 EUR
Mindestbestellmenge: 2500
Im Einkaufswagen  Stück im Wert von  UAH
TJA1044CT/0Z TJA1044CT/0Z NXP USA Inc. TJA1044.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TJA1044DT/0Z TJA1044DT/0Z NXP USA Inc. TJA1044.pdf Description: TJA1044DT/0Z
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
2500+0.51 EUR
Mindestbestellmenge: 2500
Im Einkaufswagen  Stück im Wert von  UAH
MKM35Z256VLL7R MKM35Z256VLL7R NXP USA Inc. KM35P144M75SF0.pdf Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 72
auf Bestellung 989 Stücke:
Lieferzeit 10-14 Tag (e)
2+16.49 EUR
10+14.63 EUR
25+13.96 EUR
50+13.46 EUR
100+12.99 EUR
250+12.38 EUR
500+11.94 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
MKM35Z512VLL7R MKM35Z512VLL7R NXP USA Inc. KM35P144M75SF0.pdf Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 72
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
1+18.06 EUR
10+16.02 EUR
25+15.28 EUR
50+14.74 EUR
100+14.22 EUR
250+13.56 EUR
500+13.08 EUR
Im Einkaufswagen  Stück im Wert von  UAH
MKM35Z256VLQ7R MKM35Z256VLQ7R NXP USA Inc. KM35P144M75SF0.pdf Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Cut Tape (CT)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 99
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)
2+15.4 EUR
10+13.67 EUR
25+13.03 EUR
50+12.57 EUR
100+12.13 EUR
250+11.56 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
MKV10Z16VLF7 MKV10Z16VLF7 NXP USA Inc. Description: IC MCU 32BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MKV10Z64VLH7 MKV10Z64VLH7 NXP USA Inc. KV11P64M75.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LD6806TD/12P,125 LD6806TD/12P,125 NXP USA Inc. LD6806_Series.pdf Description: IC REG LINEAR 1.2V 200MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 1.2V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 41166 Stücke:
Lieferzeit 10-14 Tag (e)
2959+0.17 EUR
Mindestbestellmenge: 2959
Im Einkaufswagen  Stück im Wert von  UAH
GTL2034PWZ GTL2034PWZ NXP USA Inc. GTL2034.pdf Description: IC BUS BUFFER 3.6V 14TSSOP
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Bus Buffer
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: -, 40mA
Supplier Device Package: 14-TSSOP
auf Bestellung 1750 Stücke:
Lieferzeit 10-14 Tag (e)
6+3.04 EUR
10+2.24 EUR
25+2.04 EUR
100+1.81 EUR
250+1.71 EUR
500+1.64 EUR
1000+1.59 EUR
Mindestbestellmenge: 6
Im Einkaufswagen  Stück im Wert von  UAH
74AUP2G126GT,115 74AUP2G126GT,115 NXP USA Inc. 74AUP2G126.pdf Description: IC BUFF DVR 3-ST DL L PWR 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
auf Bestellung 173330 Stücke:
Lieferzeit 10-14 Tag (e)
4139+0.11 EUR
Mindestbestellmenge: 4139
Im Einkaufswagen  Stück im Wert von  UAH
MC33FS6510LAE MC33FS6510LAE NXP USA Inc. F6500%2C%20F4500%20Data%20Short.pdf Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.67 EUR
10+9.06 EUR
25+8.4 EUR
80+7.92 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
MRF8S9120NR3 MRF8S9120NR3 NXP USA Inc. MRF8S9120N.pdf Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 33W
Gain: 19.8dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 800 mA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MRF8S9120NR3 MRF8S9120NR3 NXP USA Inc. MRF8S9120N.pdf Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Cut Tape (CT)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 33W
Gain: 19.8dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 800 mA
auf Bestellung 40 Stücke:
Lieferzeit 10-14 Tag (e)
1+131.33 EUR
Im Einkaufswagen  Stück im Wert von  UAH
MCF52233CVM60 MCF52233CVM60 NXP USA Inc. MCF52235.pdf Description: IC MCU 32B 256KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LBGA
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (12x12)
Number of I/O: 73
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MCF52234CVM60 MCF52234CVM60 NXP USA Inc. MCF52235.pdf Description: IC MCU 32B 256KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LBGA
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (12x12)
Number of I/O: 80
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MCF52235CVM60 MCF52235CVM60 NXP USA Inc. MCF52235.pdf Description: IC MCU 32B 256KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LBGA
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (12x12)
Number of I/O: 73
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
UJA1136AHW/3/0Y NXP USA Inc. UJA113X_SER.pdf Description: UJA1136AHW/3/0Y
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
PVF60NS151CMK50 PVF60NS151CMK50 NXP USA Inc. VYBRIDFSERIESEC.pdf Description: IC MCU 32BIT ROMLESS 364BGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
RAM Size: 1.5MB
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Data Converters: A/D 12bit SAR; D/A 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, SCI, SD, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, WDT
Supplier Device Package: 364-LFBGA (17x17)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
PVF61NS151CMK50 PVF61NS151CMK50 NXP USA Inc. VF6xx_VF5xx_VF3xx.pdf Description: IC MCU 32BIT ROMLESS 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
RAM Size: 1.5MB
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-A5/M4
Data Converters: A/D 12bit SAR; D/A 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, SCI, SD, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, WDT
Supplier Device Package: 364-LFBGA (17x17)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC33771CTA1AE MC33771CTA1AE NXP USA Inc. MC33771C.pdf Description: BATTERY CELL CONTROLLER, ADVANCE
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 130 Stücke:
Lieferzeit 10-14 Tag (e)
1+20.8 EUR
10+16.39 EUR
25+15.29 EUR
Im Einkaufswagen  Stück im Wert von  UAH
MCXC244VFT MCXC244VFT NXP USA Inc. MCXC24XP64M48SF2.pdf Description: 48MHz, Cortex-M0+, USB
Packaging: Tray
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 36
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.02 EUR
10+4.25 EUR
25+4.08 EUR
100+3.76 EUR
250+3.67 EUR
500+3.4 EUR
1300+3.03 EUR
Mindestbestellmenge: 4
Im Einkaufswagen  Stück im Wert von  UAH
2PA1774Q,115 2PA1774Q,115 NXP USA Inc. 2PA1774_DS_Rev05.pdf Description: TRANS PNP 50V 0.15A SC75
Packaging: Bulk
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 200mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 120 @ 1mA, 6V
Frequency - Transition: 100MHz
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 150 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
auf Bestellung 21655 Stücke:
Lieferzeit 10-14 Tag (e)
13172+0.032 EUR
Mindestbestellmenge: 13172
Im Einkaufswagen  Stück im Wert von  UAH
MGD3162AM550EKR2 MGD3162AM550EKR2 NXP USA Inc. SDS_GD3162.pdf Description: GATE DRIVER
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Technology: Magnetic Coupling
Voltage - Isolation: 8000Vrms
Approval Agency: UL, VDE
Supplier Device Package: 32-SOIC
Common Mode Transient Immunity (Min): 100V/ns
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 12V ~ 25V
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MGD3162AM550EKR2 MGD3162AM550EKR2 NXP USA Inc. SDS_GD3162.pdf Description: GATE DRIVER
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Technology: Magnetic Coupling
Voltage - Isolation: 8000Vrms
Approval Agency: UL, VDE
Supplier Device Package: 32-SOIC
Common Mode Transient Immunity (Min): 100V/ns
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 12V ~ 25V
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MGD3162AM550EKT MGD3162AM550EKT NXP USA Inc. SDS_GD3162.pdf Description: GATE DRIVER
Packaging: Tray
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Technology: Magnetic Coupling
Approval Agency: VDE
Supplier Device Package: 32-SOIC
Common Mode Transient Immunity (Min): 100V/ns
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 0.3V ~ 25V
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
P3T1108UK-ARD NXP USA Inc. Description: P3T1108UK-ARD
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
FRDM-STBA-A8961 FRDM-STBA-A8961 NXP USA Inc. FRDM-STBA-A8961.pdf Description: FRDM-STBA-A8961
Packaging: Bulk
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
1+35.57 EUR
Im Einkaufswagen  Stück im Wert von  UAH
S912ZVC19AMLF S912ZVC19AMLF NXP USA Inc. Description: IC MCU 16BIT 192KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.33 EUR
10+9.89 EUR
25+9.17 EUR
100+8.4 EUR
250+8.02 EUR
500+7.78 EUR
1250+7.52 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
KITFS24SKTFDMEVM KITFS24SKTFDMEVM NXP USA Inc. getting-started-with-the-kitfs24sktfdmevm-evaluation-board:GS-KITFS24SKTFDMEVM Description: EVAL BOARD FOR FS2400
Packaging: Tray
Function: System Basis Chip (SBC)
Type: Interface
Contents: Board(s), Cable(s), Accessories
Utilized IC / Part: FS2400
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 40V Supply
Secondary Attributes: On-Board LEDs, Test Points
Embedded: Yes, MCU
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
1+724.64 EUR
Im Einkaufswagen  Stück im Wert von  UAH
LPC1345FHN33,551 LPC1345FHN33,551 NXP USA Inc. LPC1315_16_17_45_46_47.pdf Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC4330FBD144Y LPC4330FBD144Y NXP USA Inc. LPC4350_30_20_10.pdf Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M0, ARM® Cortex®-M4
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
A3G26H502W17SR3 NXP USA Inc. Description: RF MOSFET GAN 48V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4S2S
Mounting Type: Chassis Mount
Frequency: 2.496GHz ~ 2.69GHz
Configuration: 2 N-Channel
Power - Output: 80W
Gain: 13.1dB
Technology: GaN
Supplier Device Package: NI-780-4S2S
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 370 mA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MPC860DTCZQ50D4 MPC860DTCZQ50D4 NXP USA Inc. MPC860EC.pdf Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
C9KEAZ128AMLHR NXP USA Inc. Description: IC MCU
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TEA2376AT/1J TEA2376AT/1J NXP USA Inc. TEA2376AT.pdf Description: IC PFC CTRLR 25KHZ-300KHZ 10SO
Packaging: Cut Tape (CT)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Voltage - Supply: 0V ~ 22V
Frequency - Switching: 25kHz ~ 300kHz
Mode: Continuous Conduction (CCM), Discontinuous Conduction (DCM)
Supplier Device Package: 10-SO
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MX8-DSI-OLED1 MX8-DSI-OLED1 NXP USA Inc. i.MX8M_Mini_Appl_Processor.pdf Description: MIPI-DSI 1080P OLED DISPLAY
Packaging: Box
Function: OLED
Type: Display
Contents: Board(s)
Utilized IC / Part: i.MX 8M Mini
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S912ZVML12F3WKHR S912ZVML12F3WKHR NXP USA Inc. S12ZVMFS.pdf Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
88MW322-A0-NXUE/AZ 88MW322-A0-NXUE/AZ NXP USA Inc. 88MW320-88W322.pdf Description: IC RF TXRX+MCU BLE 88HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 88-VFQFN Exposed Pad
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB RAM, 128kB ROM
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 4.4V ~ 5.25V
Power - Output: 26dBm
Protocol: 802.11n/g/b, Bluetooth
Current - Receiving: 29.3mA ~ 45.2mA
Data Rate (Max): 72.2Mbps
Current - Transmitting: 27.6mA ~ 183.3mA
Supplier Device Package: 88-HVQFN (10x10)
GPIO: 50
Modulation: DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC33FS6516CAER2 MC33FS6516CAER2 NXP USA Inc. FS6500-FS4500-ASILD.pdf Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC33FS6516CAE MC33FS6516CAE NXP USA Inc. FS6500-FS4500-ASILD.pdf Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S9S12G48BMLCR S9S12G48BMLCR NXP USA Inc. S12G%20Family%20Fact%20Sheet.pdf Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S9S12G48BMLC S9S12G48BMLC NXP USA Inc. S12G%20Family%20Fact%20Sheet.pdf Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S9S12G96ACLF S9S12G96ACLF NXP USA Inc. Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S9S12G96AVLFR S9S12G96AVLFR NXP USA Inc. Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S9S12G96AVLF S9S12G96AVLF NXP USA Inc. Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IW624HN/A0ZMCSMP NXP USA Inc. Description: IW624HN/A0ZMCSMP
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LFVBSK77CZZA NXP USA Inc. Description: QORIVVA MPC5777C 516 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5777C
Accessory Type: Base Board
Utilized IC / Part: MPC5777C
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S9S12GN48AMLFR S9S12GN48AMLFR NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S9S12G64ACLF S9S12G64ACLF NXP USA Inc. Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S912ZVCA19F1WKH S912ZVCA19F1WKH NXP USA Inc. Description: S12Z, 64LQFP-EP, 192K FLASH
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 42
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S9S12G48J0CLH S9S12G48J0CLH NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LFVBSK77CZZ1A NXP USA Inc. Description: QORIVVA MPC5777C 522 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5777C
Accessory Type: Base Board
Utilized IC / Part: MPC5777C
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LFBGARBY2AO NXP USA Inc. Description: SURFACE MOUNT PGA SOCKET FOR 437
Packaging: Bulk
Module/Board Type: Socket Module - PGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MRF9030LR1 MRF9030LR1.pdf
MRF9030LR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 26V NI360
Packaging: Tape & Reel (TR)
Package / Case: NI-360
Mounting Type: Chassis Mount
Frequency: 945MHz
Power - Output: 30W
Gain: 19dB
Technology: LDMOS
Supplier Device Package: NI-360
Voltage - Rated: 68 V
Voltage - Test: 26 V
Current - Test: 250 mA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MK21FX512VLQ12 K21P121M120SF5V2.pdf
MK21FX512VLQ12
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TJA1044DTK/0J TJA1044.pdf
TJA1044DTK/0J
Hersteller: NXP USA Inc.
Description: TJA1044DTK/0J
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TJA1044BTK/0J TJA1044.pdf
TJA1044BTK/0J
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TJA1044ETK/0J TJA1044.pdf
TJA1044ETK/0J
Hersteller: NXP USA Inc.
Description: TJA1044ETK/0J
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TJA1044CTK/0J TJA1044.pdf
TJA1044CTK/0J
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TJA1044ET/0Z TJA1044.pdf
TJA1044ET/0Z
Hersteller: NXP USA Inc.
Description: TJA1044ET/0Z
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+0.55 EUR
Mindestbestellmenge: 2500
Im Einkaufswagen  Stück im Wert von  UAH
TJA1044CT/0Z TJA1044.pdf
TJA1044CT/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TJA1044DT/0Z TJA1044.pdf
TJA1044DT/0Z
Hersteller: NXP USA Inc.
Description: TJA1044DT/0Z
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+0.51 EUR
Mindestbestellmenge: 2500
Im Einkaufswagen  Stück im Wert von  UAH
MKM35Z256VLL7R KM35P144M75SF0.pdf
MKM35Z256VLL7R
Hersteller: NXP USA Inc.
Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 72
auf Bestellung 989 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+16.49 EUR
10+14.63 EUR
25+13.96 EUR
50+13.46 EUR
100+12.99 EUR
250+12.38 EUR
500+11.94 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
MKM35Z512VLL7R KM35P144M75SF0.pdf
MKM35Z512VLL7R
Hersteller: NXP USA Inc.
Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 72
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+18.06 EUR
10+16.02 EUR
25+15.28 EUR
50+14.74 EUR
100+14.22 EUR
250+13.56 EUR
500+13.08 EUR
Im Einkaufswagen  Stück im Wert von  UAH
MKM35Z256VLQ7R KM35P144M75SF0.pdf
MKM35Z256VLQ7R
Hersteller: NXP USA Inc.
Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Cut Tape (CT)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 99
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+15.4 EUR
10+13.67 EUR
25+13.03 EUR
50+12.57 EUR
100+12.13 EUR
250+11.56 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
MKV10Z16VLF7
MKV10Z16VLF7
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MKV10Z64VLH7 KV11P64M75.pdf
MKV10Z64VLH7
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LD6806TD/12P,125 LD6806_Series.pdf
LD6806TD/12P,125
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.2V 200MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 1.2V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 41166 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2959+0.17 EUR
Mindestbestellmenge: 2959
Im Einkaufswagen  Stück im Wert von  UAH
GTL2034PWZ GTL2034.pdf
GTL2034PWZ
Hersteller: NXP USA Inc.
Description: IC BUS BUFFER 3.6V 14TSSOP
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Bus Buffer
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: -, 40mA
Supplier Device Package: 14-TSSOP
auf Bestellung 1750 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+3.04 EUR
10+2.24 EUR
25+2.04 EUR
100+1.81 EUR
250+1.71 EUR
500+1.64 EUR
1000+1.59 EUR
Mindestbestellmenge: 6
Im Einkaufswagen  Stück im Wert von  UAH
74AUP2G126GT,115 74AUP2G126.pdf
74AUP2G126GT,115
Hersteller: NXP USA Inc.
Description: IC BUFF DVR 3-ST DL L PWR 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
auf Bestellung 173330 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4139+0.11 EUR
Mindestbestellmenge: 4139
Im Einkaufswagen  Stück im Wert von  UAH
MC33FS6510LAE F6500%2C%20F4500%20Data%20Short.pdf
MC33FS6510LAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+11.67 EUR
10+9.06 EUR
25+8.4 EUR
80+7.92 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
MRF8S9120NR3 MRF8S9120N.pdf
MRF8S9120NR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 33W
Gain: 19.8dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 800 mA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MRF8S9120NR3 MRF8S9120N.pdf
MRF8S9120NR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Cut Tape (CT)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 33W
Gain: 19.8dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 800 mA
auf Bestellung 40 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+131.33 EUR
Im Einkaufswagen  Stück im Wert von  UAH
MCF52233CVM60 MCF52235.pdf
MCF52233CVM60
Hersteller: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LBGA
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (12x12)
Number of I/O: 73
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MCF52234CVM60 MCF52235.pdf
MCF52234CVM60
Hersteller: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LBGA
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (12x12)
Number of I/O: 80
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MCF52235CVM60 MCF52235.pdf
MCF52235CVM60
Hersteller: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LBGA
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (12x12)
Number of I/O: 73
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
UJA1136AHW/3/0Y UJA113X_SER.pdf
Hersteller: NXP USA Inc.
Description: UJA1136AHW/3/0Y
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
PVF60NS151CMK50 VYBRIDFSERIESEC.pdf
PVF60NS151CMK50
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 364BGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
RAM Size: 1.5MB
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Data Converters: A/D 12bit SAR; D/A 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, SCI, SD, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, WDT
Supplier Device Package: 364-LFBGA (17x17)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
PVF61NS151CMK50 VF6xx_VF5xx_VF3xx.pdf
PVF61NS151CMK50
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
RAM Size: 1.5MB
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-A5/M4
Data Converters: A/D 12bit SAR; D/A 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, SCI, SD, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, WDT
Supplier Device Package: 364-LFBGA (17x17)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC33771CTA1AE MC33771C.pdf
MC33771CTA1AE
Hersteller: NXP USA Inc.
Description: BATTERY CELL CONTROLLER, ADVANCE
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 130 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+20.8 EUR
10+16.39 EUR
25+15.29 EUR
Im Einkaufswagen  Stück im Wert von  UAH
MCXC244VFT MCXC24XP64M48SF2.pdf
MCXC244VFT
Hersteller: NXP USA Inc.
Description: 48MHz, Cortex-M0+, USB
Packaging: Tray
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 36
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.02 EUR
10+4.25 EUR
25+4.08 EUR
100+3.76 EUR
250+3.67 EUR
500+3.4 EUR
1300+3.03 EUR
Mindestbestellmenge: 4
Im Einkaufswagen  Stück im Wert von  UAH
2PA1774Q,115 2PA1774_DS_Rev05.pdf
2PA1774Q,115
Hersteller: NXP USA Inc.
Description: TRANS PNP 50V 0.15A SC75
Packaging: Bulk
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 200mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 120 @ 1mA, 6V
Frequency - Transition: 100MHz
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 150 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
auf Bestellung 21655 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
13172+0.032 EUR
Mindestbestellmenge: 13172
Im Einkaufswagen  Stück im Wert von  UAH
MGD3162AM550EKR2 SDS_GD3162.pdf
MGD3162AM550EKR2
Hersteller: NXP USA Inc.
Description: GATE DRIVER
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Technology: Magnetic Coupling
Voltage - Isolation: 8000Vrms
Approval Agency: UL, VDE
Supplier Device Package: 32-SOIC
Common Mode Transient Immunity (Min): 100V/ns
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 12V ~ 25V
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MGD3162AM550EKR2 SDS_GD3162.pdf
MGD3162AM550EKR2
Hersteller: NXP USA Inc.
Description: GATE DRIVER
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Technology: Magnetic Coupling
Voltage - Isolation: 8000Vrms
Approval Agency: UL, VDE
Supplier Device Package: 32-SOIC
Common Mode Transient Immunity (Min): 100V/ns
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 12V ~ 25V
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MGD3162AM550EKT SDS_GD3162.pdf
MGD3162AM550EKT
Hersteller: NXP USA Inc.
Description: GATE DRIVER
Packaging: Tray
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Technology: Magnetic Coupling
Approval Agency: VDE
Supplier Device Package: 32-SOIC
Common Mode Transient Immunity (Min): 100V/ns
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 0.3V ~ 25V
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
P3T1108UK-ARD
Hersteller: NXP USA Inc.
Description: P3T1108UK-ARD
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
FRDM-STBA-A8961 FRDM-STBA-A8961.pdf
FRDM-STBA-A8961
Hersteller: NXP USA Inc.
Description: FRDM-STBA-A8961
Packaging: Bulk
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+35.57 EUR
Im Einkaufswagen  Stück im Wert von  UAH
S912ZVC19AMLF
S912ZVC19AMLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 192KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+11.33 EUR
10+9.89 EUR
25+9.17 EUR
100+8.4 EUR
250+8.02 EUR
500+7.78 EUR
1250+7.52 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
KITFS24SKTFDMEVM getting-started-with-the-kitfs24sktfdmevm-evaluation-board:GS-KITFS24SKTFDMEVM
KITFS24SKTFDMEVM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR FS2400
Packaging: Tray
Function: System Basis Chip (SBC)
Type: Interface
Contents: Board(s), Cable(s), Accessories
Utilized IC / Part: FS2400
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 40V Supply
Secondary Attributes: On-Board LEDs, Test Points
Embedded: Yes, MCU
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+724.64 EUR
Im Einkaufswagen  Stück im Wert von  UAH
LPC1345FHN33,551 LPC1315_16_17_45_46_47.pdf
LPC1345FHN33,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC4330FBD144Y LPC4350_30_20_10.pdf
LPC4330FBD144Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M0, ARM® Cortex®-M4
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
A3G26H502W17SR3
Hersteller: NXP USA Inc.
Description: RF MOSFET GAN 48V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4S2S
Mounting Type: Chassis Mount
Frequency: 2.496GHz ~ 2.69GHz
Configuration: 2 N-Channel
Power - Output: 80W
Gain: 13.1dB
Technology: GaN
Supplier Device Package: NI-780-4S2S
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 370 mA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MPC860DTCZQ50D4 MPC860EC.pdf
MPC860DTCZQ50D4
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
C9KEAZ128AMLHR
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TEA2376AT/1J TEA2376AT.pdf
TEA2376AT/1J
Hersteller: NXP USA Inc.
Description: IC PFC CTRLR 25KHZ-300KHZ 10SO
Packaging: Cut Tape (CT)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Voltage - Supply: 0V ~ 22V
Frequency - Switching: 25kHz ~ 300kHz
Mode: Continuous Conduction (CCM), Discontinuous Conduction (DCM)
Supplier Device Package: 10-SO
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MX8-DSI-OLED1 i.MX8M_Mini_Appl_Processor.pdf
MX8-DSI-OLED1
Hersteller: NXP USA Inc.
Description: MIPI-DSI 1080P OLED DISPLAY
Packaging: Box
Function: OLED
Type: Display
Contents: Board(s)
Utilized IC / Part: i.MX 8M Mini
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S912ZVML12F3WKHR S12ZVMFS.pdf
S912ZVML12F3WKHR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
88MW322-A0-NXUE/AZ 88MW320-88W322.pdf
88MW322-A0-NXUE/AZ
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 88HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 88-VFQFN Exposed Pad
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB RAM, 128kB ROM
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 4.4V ~ 5.25V
Power - Output: 26dBm
Protocol: 802.11n/g/b, Bluetooth
Current - Receiving: 29.3mA ~ 45.2mA
Data Rate (Max): 72.2Mbps
Current - Transmitting: 27.6mA ~ 183.3mA
Supplier Device Package: 88-HVQFN (10x10)
GPIO: 50
Modulation: DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC33FS6516CAER2 FS6500-FS4500-ASILD.pdf
MC33FS6516CAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC33FS6516CAE FS6500-FS4500-ASILD.pdf
MC33FS6516CAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S9S12G48BMLCR S12G%20Family%20Fact%20Sheet.pdf
S9S12G48BMLCR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S9S12G48BMLC S12G%20Family%20Fact%20Sheet.pdf
S9S12G48BMLC
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S9S12G96ACLF
S9S12G96ACLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S9S12G96AVLFR
S9S12G96AVLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S9S12G96AVLF
S9S12G96AVLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IW624HN/A0ZMCSMP
Hersteller: NXP USA Inc.
Description: IW624HN/A0ZMCSMP
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LFVBSK77CZZA
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5777C 516 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5777C
Accessory Type: Base Board
Utilized IC / Part: MPC5777C
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S9S12GN48AMLFR
S9S12GN48AMLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S9S12G64ACLF
S9S12G64ACLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S912ZVCA19F1WKH
S912ZVCA19F1WKH
Hersteller: NXP USA Inc.
Description: S12Z, 64LQFP-EP, 192K FLASH
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 42
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S9S12G48J0CLH
S9S12G48J0CLH
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LFVBSK77CZZ1A
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5777C 522 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5777C
Accessory Type: Base Board
Utilized IC / Part: MPC5777C
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LFBGARBY2AO
Hersteller: NXP USA Inc.
Description: SURFACE MOUNT PGA SOCKET FOR 437
Packaging: Bulk
Module/Board Type: Socket Module - PGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
Wählen Sie Seite:   [  << Vorherige Seite ]  1 60 120 180 240 300 360 420 480 539 540 541 542 543 544 545 546 547 548 549 600 602  [ Nächste Seite >> ]