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TEF7092AHN/V205Y NXP USA Inc. Description: TEF7092AHN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TEF3100HN/V205Y TEF3100HN/V205Y NXP USA Inc. Description: IC 64HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 64-HVQFN (9x9)
Produkt ist nicht verfügbar
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ZK-HC08LX-A NXP USA Inc. Description: MC68HC908LJ/LK EVAL BRD
Packaging: Box
Mounting Type: Socket
Type: MCU 8-Bit
Contents: Board(s), Cable(s), Power Supply
Core Processor: HC08
Utilized IC / Part: MC68HC908LJ/LK
Produkt ist nicht verfügbar
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MMPF0200F0ANES MMPF0200F0ANES NXP USA Inc. MMPF0200.pdf Description: IC REG CONV I.MX6 11OUT 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 11
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
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MPF5302AMDA0ES NXP USA Inc. PF5300_SDS.pdf Description: IC REG BUCK ADJ 15A 24HWQFN
Packaging: Tray
Package / Case: 24-PowerWFQFN
Output Type: Adjustable
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 1
Function: Step-Down
Current - Output: 15A
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Positive
Frequency - Switching: 2MHz ~ 3MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 24-HWQFN (4.5x3.5)
Synchronous Rectifier: No
Voltage - Output (Max): 1.2V
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 0.5V
auf Bestellung 450 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.72 EUR
10+10.58 EUR
25+10.09 EUR
80+8.76 EUR
230+8.36 EUR
Mindestbestellmenge: 2
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MC33FS4506NAER2 NXP USA Inc. Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS4506NAE NXP USA Inc. Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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KIT-A1006-SHIELD NXP USA Inc. A1006_Demo-Dev_Kit.pdf Description: KIT-A1006-SHIELD
Packaging: Bulk
For Use With/Related Products: A1006
Accessory Type: Shield
Produkt ist nicht verfügbar
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FS32K148HFT0VLLR NXP USA Inc. S32K1xx.pdf Description: S32K148 32-BIT MCU, ARM CORTEX-M
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 156
Produkt ist nicht verfügbar
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FS32K144HAT0MLFR NXP USA Inc. S32K1xx.pdf Description: S32K144 ARM CORTEX-M4F, 80 MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
Produkt ist nicht verfügbar
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1PS75SB45,115 1PS75SB45,115 NXP USA Inc. PHGL-S-A0000721047-1.pdf?t.download=true&u=5oefqw Description: DIODE ARR SCHOTT 40V 120MA SC75
Packaging: Bulk
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 120mA (DC)
Supplier Device Package: SC-75
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 40 mA
Current - Reverse Leakage @ Vr: 10 µA @ 40 V
auf Bestellung 29467 Stücke:
Lieferzeit 10-14 Tag (e)
6662+0.084 EUR
Mindestbestellmenge: 6662
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1PS75SB45,135 1PS75SB45,135 NXP USA Inc. BAS40_1PSxxSB4x_Series_Rev9.pdf Description: DIODE ARR SCHOTT 40V 120MA SC75
Packaging: Bulk
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 120mA (DC)
Supplier Device Package: SC-75
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 40 mA
Current - Reverse Leakage @ Vr: 10 µA @ 40 V
auf Bestellung 9000 Stücke:
Lieferzeit 10-14 Tag (e)
6662+0.084 EUR
Mindestbestellmenge: 6662
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S9S12GN32J0VFTR S9S12GN32J0VFTR NXP USA Inc. Description: IC MCU 16BIT 32KB FLASH 48TFQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
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S9S12GN32J0VFT S9S12GN32J0VFT NXP USA Inc. Description: IC MCU 16BIT 32KB FLASH 48TFQFN
Packaging: Tray
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
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S912ZVMAL1F0MLF S912ZVMAL1F0MLF NXP USA Inc. Description: VMA16, 16K FLASH, 1K RAM, 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 7x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 20V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS8420G0KS MC33FS8420G0KS NXP USA Inc. FS84_FS85C_DS.pdf Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC9S08AC96CFGE MC9S08AC96CFGE NXP USA Inc. MC9S08AC60AD.pdf Description: IC MCU 8BIT 96KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5602BF2MLL4 SPC5602BF2MLL4 NXP USA Inc. MPC5602D.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K148HFT0MMHT FS32K148HFT0MMHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 2MB FLASH 100LFBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 156
Produkt ist nicht verfügbar
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PXLS70733AES NXP USA Inc. Description: SENSOR ACCELEROMETER UTA P2.0
Packaging: Tube
Produkt ist nicht verfügbar
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BAP70-05,215 BAP70-05,215 NXP USA Inc. BAP70-05.pdf Description: RF DIODE PIN 50V 250MW SOT-23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: PIN - 1 Pair Common Cathode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOT-23 (TO-236AB)
Current - Max: 100 mA
Power Dissipation (Max): 250 mW
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
3000+0.38 EUR
Mindestbestellmenge: 3000
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BAP70-05,215 BAP70-05,215 NXP USA Inc. BAP70-05.pdf Description: RF DIODE PIN 50V 250MW SOT-23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: PIN - 1 Pair Common Cathode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOT-23 (TO-236AB)
Current - Max: 100 mA
Power Dissipation (Max): 250 mW
auf Bestellung 5689 Stücke:
Lieferzeit 10-14 Tag (e)
21+0.86 EUR
30+0.61 EUR
33+0.54 EUR
100+0.47 EUR
250+0.44 EUR
500+0.42 EUR
1000+0.4 EUR
Mindestbestellmenge: 21
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S9S12GN16BMLCR S9S12GN16BMLCR NXP USA Inc. S12G%20Family%20Fact%20Sheet.pdf Description: IC MCU 16BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12GN16BMLC S9S12GN16BMLC NXP USA Inc. Description: IC MCU 16BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AW690HNK/A2WMP NXP USA Inc. Description: AW690HNK/A2WMP
Packaging: Bulk
Produkt ist nicht verfügbar
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AW690HNK/A2WK NXP USA Inc. Description: IC
Packaging: Bulk
Produkt ist nicht verfügbar
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S9S12GN32J1MTJ NXP USA Inc. Description: IC MCU 16BIT 32KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 14
Produkt ist nicht verfügbar
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NCF29AEXHN4/0100ZY NXP USA Inc. Description: NCF29AEXHN4
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 40-HVQFN (6x6)
Produkt ist nicht verfügbar
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MFS5600AMMA7ESR2 NXP USA Inc. FS5600.pdf Description: DUAL 36V AUTOMOTIVE DC-DC CONTRO
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 36V
Current - Supply: 140µA
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MPF5023CMBA0ESR2 NXP USA Inc. PF5023.pdf Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC34PF3001A5EPR2 MC34PF3001A5EPR2 NXP USA Inc. PF3001.pdf Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MC35FS6505NAER2 NXP USA Inc. 35FS4500-35FS6500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MFS2602AMDA0ADR2 NXP USA Inc. PB_FS26.pdf Description: AUTO SBC
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Produkt ist nicht verfügbar
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MPF7100BVBA2ESR2 MPF7100BVBA2ESR2 NXP USA Inc. PF7100.pdf Description: POWER MANAGEMENT IC, I.MX 8XL WI
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 10µA
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S912ZVCA19F1WLFR S912ZVCA19F1WLFR NXP USA Inc. Description: S12Z, 48LQFP, 192K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x12b SAR; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
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MC33FS8435G0ESR2 MC33FS8435G0ESR2 NXP USA Inc. FS84_FS85C_DS.pdf Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MKV46F128VLL16R NXP USA Inc. KV4XP100M168.pdf Description: KINETIS KV46: 168MHZ M4F REAL-TI
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MWCT2014SHVPAR NXP USA Inc. Description: MAXQFP100,512KB
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S912XET256W1MAAR S912XET256W1MAAR NXP USA Inc. Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AW690HNK/A2AMP NXP USA Inc. Description: IC
Packaging: Bulk
Produkt ist nicht verfügbar
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SCBGARBU1AO NXP USA Inc. Description: BGA RECEIVER/ADAPTER, 324 PIN, 1
Packaging: Bulk
Module/Board Type: Socket Module - BGA
Produkt ist nicht verfügbar
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8MPNAVQ-8GB-G 8MPNAVQ-8GB-G NXP USA Inc. 8MPNAVQQSG.pdf Description: DEV KIT
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53
Utilized IC / Part: i.MX 8M Plus
auf Bestellung 16 Stücke:
Lieferzeit 10-14 Tag (e)
1+510.86 EUR
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WCT-15WTXAUTO NXP USA Inc. WCT15WTXAUTOFS.pdf Description: WCT-15WTXAUTO
Packaging: Bulk
Function: Wireless Power Supply/Charging
Type: Power Management
Contents: Board(s)
Supplied Contents: Board(s)
Primary Attributes: Transmitter
Produkt ist nicht verfügbar
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MKE02Z32VLC2R MKE02Z32VLC2R NXP USA Inc. MKE02P64M20SF0.pdf Description: IC MCU 32BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKE02Z32VLC2R MKE02Z32VLC2R NXP USA Inc. MKE02P64M20SF0.pdf Description: IC MCU 32BIT 32KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.17 EUR
10+3.89 EUR
25+3.57 EUR
100+3.21 EUR
250+3.05 EUR
500+2.94 EUR
1000+2.86 EUR
Mindestbestellmenge: 4
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NCK2910AHN/10204Y NXP USA Inc. Description: NCK2910AHN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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KITPF5030FRDMEVM NXP USA Inc. UM11853.pdf Description: KITPF5030FRDMEVM
Packaging: Bulk
Function: Power Supply
Type: Power Management
Utilized IC / Part: PF5030
Supplied Contents: Board(s), Cable(s), Accessories
Embedded: Yes, MCU
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
1+427.06 EUR
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MPC8358VRAGDGA MPC8358VRAGDGA NXP USA Inc. MPC8358EEC.pdf Description: IC MPU MPC83XX 400MHZ 668BGA
Packaging: Tray
Package / Case: 668-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 668-PBGA-PGE (29x29)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Produkt ist nicht verfügbar
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LFK46MINTPT4A NXP USA Inc. Description: QORIVVA MPC5746M ON A 292 PIN 0.
Packaging: Bulk
For Use With/Related Products: MPC5746M
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
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TEA1998TS/1Z TEA1998TS/1Z NXP USA Inc. TEA1998TS.pdf Description: IC SYNC RECT CONTROLLER 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 60V
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: SC-74
Current - Supply: 250 µA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA1993TS/1Z TEA1993TS/1Z NXP USA Inc. TEA1993TS.pdf Description: IC SYNC RECT CONTROLLER 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: SC-74
Current - Supply: 200 µA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12GN16J0VLF S9S12GN16J0VLF NXP USA Inc. Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
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MC908JB8JDWE MC908JB8JDWE NXP USA Inc. MC68HC908JB8.pdf Description: IC MCU 8BIT 8KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 3MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4V ~ 5.5V
Connectivity: USB
Peripherals: LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
2+8.82 EUR
10+6.72 EUR
Mindestbestellmenge: 2
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MWCT2016SHVPBR NXP USA Inc. MWCT2xxxS.pdf Description: MWCT2016S,MAXQFP172
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MWCT2016SHVPB NXP USA Inc. MWCT2xxxS.pdf Description: MWCT2016S,MAXQFP172
Packaging: Tray
Produkt ist nicht verfügbar
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SSL3250AHN/C1,528 SSL3250AHN/C1,528 NXP USA Inc. SSL3250A.pdf Description: IC LED DRVR RGLTR I2C 16HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Voltage - Output: 9.5V
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 1.2MHz
Type: DC DC Regulator
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Camera Flash
Current - Output / Channel: 500mA
Internal Switch(s): Yes
Topology: Step-Up (Boost)
Supplier Device Package: 16-HVQFN (3x3)
Dimming: I2C
Voltage - Supply (Min): 2.7V
Voltage - Supply (Max): 5.5V
Produkt ist nicht verfügbar
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SSL3250AHN/C1,528 SSL3250AHN/C1,528 NXP USA Inc. SSL3250A.pdf Description: IC LED DRVR RGLTR I2C 16HVQFN
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Voltage - Output: 9.5V
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 1.2MHz
Type: DC DC Regulator
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Camera Flash
Current - Output / Channel: 500mA
Internal Switch(s): Yes
Topology: Step-Up (Boost)
Supplier Device Package: 16-HVQFN (3x3)
Dimming: I2C
Voltage - Supply (Min): 2.7V
Voltage - Supply (Max): 5.5V
Produkt ist nicht verfügbar
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MC32PF1550A8EPR2 MC32PF1550A8EPR2 NXP USA Inc. PF1550.pdf Description: POWER MANAGEMENT IC 3 BUCK REGS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.1V ~ 6V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MCIMX6S8DVM10AB MCIMX6S8DVM10AB NXP USA Inc. IMX6SDLAEC.pdf Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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DSPB56374AE DSPB56374AE NXP USA Inc. DSP56374.pdf Description: IC DSP 24BIT 150MHZ 52-LQFP
Packaging: Tray
Package / Case: 52-LQFP
Mounting Type: Surface Mount
Interface: Host Interface, I2C, SAI, SPI
Type: Audio Processor
Operating Temperature: 0°C ~ 70°C (TA)
Non-Volatile Memory: ROM (84kB)
On-Chip RAM: 54kB
Voltage - I/O: 3.30V
Voltage - Core: 1.25V
Clock Rate: 150MHz
Supplier Device Package: 52-TQFP (10x10)
Produkt ist nicht verfügbar
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TEF7092AHN/V205Y
Hersteller: NXP USA Inc.
Description: TEF7092AHN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TEF3100HN/V205Y
TEF3100HN/V205Y
Hersteller: NXP USA Inc.
Description: IC 64HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 64-HVQFN (9x9)
Produkt ist nicht verfügbar
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ZK-HC08LX-A
Hersteller: NXP USA Inc.
Description: MC68HC908LJ/LK EVAL BRD
Packaging: Box
Mounting Type: Socket
Type: MCU 8-Bit
Contents: Board(s), Cable(s), Power Supply
Core Processor: HC08
Utilized IC / Part: MC68HC908LJ/LK
Produkt ist nicht verfügbar
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MMPF0200F0ANES MMPF0200.pdf
MMPF0200F0ANES
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 11OUT 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 11
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
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MPF5302AMDA0ES PF5300_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC REG BUCK ADJ 15A 24HWQFN
Packaging: Tray
Package / Case: 24-PowerWFQFN
Output Type: Adjustable
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 1
Function: Step-Down
Current - Output: 15A
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Positive
Frequency - Switching: 2MHz ~ 3MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 24-HWQFN (4.5x3.5)
Synchronous Rectifier: No
Voltage - Output (Max): 1.2V
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 0.5V
auf Bestellung 450 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+11.72 EUR
10+10.58 EUR
25+10.09 EUR
80+8.76 EUR
230+8.36 EUR
Mindestbestellmenge: 2
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MC33FS4506NAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS4506NAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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KIT-A1006-SHIELD A1006_Demo-Dev_Kit.pdf
Hersteller: NXP USA Inc.
Description: KIT-A1006-SHIELD
Packaging: Bulk
For Use With/Related Products: A1006
Accessory Type: Shield
Produkt ist nicht verfügbar
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FS32K148HFT0VLLR S32K1xx.pdf
Hersteller: NXP USA Inc.
Description: S32K148 32-BIT MCU, ARM CORTEX-M
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 156
Produkt ist nicht verfügbar
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FS32K144HAT0MLFR S32K1xx.pdf
Hersteller: NXP USA Inc.
Description: S32K144 ARM CORTEX-M4F, 80 MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
Produkt ist nicht verfügbar
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1PS75SB45,115 PHGL-S-A0000721047-1.pdf?t.download=true&u=5oefqw
1PS75SB45,115
Hersteller: NXP USA Inc.
Description: DIODE ARR SCHOTT 40V 120MA SC75
Packaging: Bulk
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 120mA (DC)
Supplier Device Package: SC-75
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 40 mA
Current - Reverse Leakage @ Vr: 10 µA @ 40 V
auf Bestellung 29467 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6662+0.084 EUR
Mindestbestellmenge: 6662
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1PS75SB45,135 BAS40_1PSxxSB4x_Series_Rev9.pdf
1PS75SB45,135
Hersteller: NXP USA Inc.
Description: DIODE ARR SCHOTT 40V 120MA SC75
Packaging: Bulk
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 120mA (DC)
Supplier Device Package: SC-75
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 40 mA
Current - Reverse Leakage @ Vr: 10 µA @ 40 V
auf Bestellung 9000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6662+0.084 EUR
Mindestbestellmenge: 6662
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S9S12GN32J0VFTR
S9S12GN32J0VFTR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48TFQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
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S9S12GN32J0VFT
S9S12GN32J0VFT
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48TFQFN
Packaging: Tray
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
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S912ZVMAL1F0MLF
S912ZVMAL1F0MLF
Hersteller: NXP USA Inc.
Description: VMA16, 16K FLASH, 1K RAM, 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 7x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 20V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC33FS8420G0KS FS84_FS85C_DS.pdf
MC33FS8420G0KS
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC9S08AC96CFGE MC9S08AC60AD.pdf
MC9S08AC96CFGE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 96KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5602BF2MLL4 MPC5602D.pdf
SPC5602BF2MLL4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS32K148HFT0MMHT S32K1xx.pdf
FS32K148HFT0MMHT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100LFBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 156
Produkt ist nicht verfügbar
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PXLS70733AES
Hersteller: NXP USA Inc.
Description: SENSOR ACCELEROMETER UTA P2.0
Packaging: Tube
Produkt ist nicht verfügbar
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BAP70-05,215 BAP70-05.pdf
BAP70-05,215
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 250MW SOT-23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: PIN - 1 Pair Common Cathode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOT-23 (TO-236AB)
Current - Max: 100 mA
Power Dissipation (Max): 250 mW
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3000+0.38 EUR
Mindestbestellmenge: 3000
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BAP70-05,215 BAP70-05.pdf
BAP70-05,215
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 250MW SOT-23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: PIN - 1 Pair Common Cathode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOT-23 (TO-236AB)
Current - Max: 100 mA
Power Dissipation (Max): 250 mW
auf Bestellung 5689 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
21+0.86 EUR
30+0.61 EUR
33+0.54 EUR
100+0.47 EUR
250+0.44 EUR
500+0.42 EUR
1000+0.4 EUR
Mindestbestellmenge: 21
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S9S12GN16BMLCR S12G%20Family%20Fact%20Sheet.pdf
S9S12GN16BMLCR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12GN16BMLC
S9S12GN16BMLC
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AW690HNK/A2WMP
Hersteller: NXP USA Inc.
Description: AW690HNK/A2WMP
Packaging: Bulk
Produkt ist nicht verfügbar
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AW690HNK/A2WK
Hersteller: NXP USA Inc.
Description: IC
Packaging: Bulk
Produkt ist nicht verfügbar
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S9S12GN32J1MTJ
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 14
Produkt ist nicht verfügbar
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NCF29AEXHN4/0100ZY
Hersteller: NXP USA Inc.
Description: NCF29AEXHN4
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 40-HVQFN (6x6)
Produkt ist nicht verfügbar
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MFS5600AMMA7ESR2 FS5600.pdf
Hersteller: NXP USA Inc.
Description: DUAL 36V AUTOMOTIVE DC-DC CONTRO
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 36V
Current - Supply: 140µA
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MPF5023CMBA0ESR2 PF5023.pdf
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MC34PF3001A5EPR2 PF3001.pdf
MC34PF3001A5EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MC35FS6505NAER2 35FS4500-35FS6500SDS-ASILB.pdf
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MFS2602AMDA0ADR2 PB_FS26.pdf
Hersteller: NXP USA Inc.
Description: AUTO SBC
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Produkt ist nicht verfügbar
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MPF7100BVBA2ESR2 PF7100.pdf
MPF7100BVBA2ESR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, I.MX 8XL WI
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 10µA
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S912ZVCA19F1WLFR
S912ZVCA19F1WLFR
Hersteller: NXP USA Inc.
Description: S12Z, 48LQFP, 192K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x12b SAR; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
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MC33FS8435G0ESR2 FS84_FS85C_DS.pdf
MC33FS8435G0ESR2
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MKV46F128VLL16R KV4XP100M168.pdf
Hersteller: NXP USA Inc.
Description: KINETIS KV46: 168MHZ M4F REAL-TI
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MWCT2014SHVPAR
Hersteller: NXP USA Inc.
Description: MAXQFP100,512KB
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S912XET256W1MAAR
S912XET256W1MAAR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AW690HNK/A2AMP
Hersteller: NXP USA Inc.
Description: IC
Packaging: Bulk
Produkt ist nicht verfügbar
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SCBGARBU1AO
Hersteller: NXP USA Inc.
Description: BGA RECEIVER/ADAPTER, 324 PIN, 1
Packaging: Bulk
Module/Board Type: Socket Module - BGA
Produkt ist nicht verfügbar
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8MPNAVQ-8GB-G 8MPNAVQQSG.pdf
8MPNAVQ-8GB-G
Hersteller: NXP USA Inc.
Description: DEV KIT
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53
Utilized IC / Part: i.MX 8M Plus
auf Bestellung 16 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+510.86 EUR
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WCT-15WTXAUTO WCT15WTXAUTOFS.pdf
Hersteller: NXP USA Inc.
Description: WCT-15WTXAUTO
Packaging: Bulk
Function: Wireless Power Supply/Charging
Type: Power Management
Contents: Board(s)
Supplied Contents: Board(s)
Primary Attributes: Transmitter
Produkt ist nicht verfügbar
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MKE02Z32VLC2R MKE02P64M20SF0.pdf
MKE02Z32VLC2R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKE02Z32VLC2R MKE02P64M20SF0.pdf
MKE02Z32VLC2R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.17 EUR
10+3.89 EUR
25+3.57 EUR
100+3.21 EUR
250+3.05 EUR
500+2.94 EUR
1000+2.86 EUR
Mindestbestellmenge: 4
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NCK2910AHN/10204Y
Hersteller: NXP USA Inc.
Description: NCK2910AHN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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KITPF5030FRDMEVM UM11853.pdf
Hersteller: NXP USA Inc.
Description: KITPF5030FRDMEVM
Packaging: Bulk
Function: Power Supply
Type: Power Management
Utilized IC / Part: PF5030
Supplied Contents: Board(s), Cable(s), Accessories
Embedded: Yes, MCU
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+427.06 EUR
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MPC8358VRAGDGA MPC8358EEC.pdf
MPC8358VRAGDGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 668BGA
Packaging: Tray
Package / Case: 668-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 668-PBGA-PGE (29x29)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Produkt ist nicht verfügbar
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LFK46MINTPT4A
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5746M ON A 292 PIN 0.
Packaging: Bulk
For Use With/Related Products: MPC5746M
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
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TEA1998TS/1Z TEA1998TS.pdf
TEA1998TS/1Z
Hersteller: NXP USA Inc.
Description: IC SYNC RECT CONTROLLER 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 60V
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: SC-74
Current - Supply: 250 µA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TEA1993TS/1Z TEA1993TS.pdf
TEA1993TS/1Z
Hersteller: NXP USA Inc.
Description: IC SYNC RECT CONTROLLER 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: SC-74
Current - Supply: 200 µA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12GN16J0VLF
S9S12GN16J0VLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Produkt ist nicht verfügbar
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MC908JB8JDWE MC68HC908JB8.pdf
MC908JB8JDWE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 3MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4V ~ 5.5V
Connectivity: USB
Peripherals: LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+8.82 EUR
10+6.72 EUR
Mindestbestellmenge: 2
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MWCT2016SHVPBR MWCT2xxxS.pdf
Hersteller: NXP USA Inc.
Description: MWCT2016S,MAXQFP172
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MWCT2016SHVPB MWCT2xxxS.pdf
Hersteller: NXP USA Inc.
Description: MWCT2016S,MAXQFP172
Packaging: Tray
Produkt ist nicht verfügbar
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SSL3250AHN/C1,528 SSL3250A.pdf
SSL3250AHN/C1,528
Hersteller: NXP USA Inc.
Description: IC LED DRVR RGLTR I2C 16HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Voltage - Output: 9.5V
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 1.2MHz
Type: DC DC Regulator
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Camera Flash
Current - Output / Channel: 500mA
Internal Switch(s): Yes
Topology: Step-Up (Boost)
Supplier Device Package: 16-HVQFN (3x3)
Dimming: I2C
Voltage - Supply (Min): 2.7V
Voltage - Supply (Max): 5.5V
Produkt ist nicht verfügbar
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SSL3250AHN/C1,528 SSL3250A.pdf
SSL3250AHN/C1,528
Hersteller: NXP USA Inc.
Description: IC LED DRVR RGLTR I2C 16HVQFN
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Voltage - Output: 9.5V
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 1.2MHz
Type: DC DC Regulator
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Camera Flash
Current - Output / Channel: 500mA
Internal Switch(s): Yes
Topology: Step-Up (Boost)
Supplier Device Package: 16-HVQFN (3x3)
Dimming: I2C
Voltage - Supply (Min): 2.7V
Voltage - Supply (Max): 5.5V
Produkt ist nicht verfügbar
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MC32PF1550A8EPR2 PF1550.pdf
MC32PF1550A8EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC 3 BUCK REGS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.1V ~ 6V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MCIMX6S8DVM10AB IMX6SDLAEC.pdf
MCIMX6S8DVM10AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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DSPB56374AE DSP56374.pdf
DSPB56374AE
Hersteller: NXP USA Inc.
Description: IC DSP 24BIT 150MHZ 52-LQFP
Packaging: Tray
Package / Case: 52-LQFP
Mounting Type: Surface Mount
Interface: Host Interface, I2C, SAI, SPI
Type: Audio Processor
Operating Temperature: 0°C ~ 70°C (TA)
Non-Volatile Memory: ROM (84kB)
On-Chip RAM: 54kB
Voltage - I/O: 3.30V
Voltage - Core: 1.25V
Clock Rate: 150MHz
Supplier Device Package: 52-TQFP (10x10)
Produkt ist nicht verfügbar
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