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FRDMGD3100HB8EVM NXP USA Inc. FRDMGD3100HB8EVM.pdf Description: HALF-BRIDGE EVALUATION KIT FEATU
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3100
Supplied Contents: Board(s)
Primary Attributes: 1-Channel (Single)
Embedded: Yes, MCU
Produkt ist nicht verfügbar
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MPC8280CVVQLDA MPC8280CVVQLDA NXP USA Inc. MPC8280EC.pdf Description: IC MPU MPC82XX 333MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
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MPC8349ECVVAJFB MPC8349ECVVAJFB NXP USA Inc. MPC8349EAEC.pdf Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
Produkt ist nicht verfügbar
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MPC8358CVVAGDGA MPC8358CVVAGDGA NXP USA Inc. MPC8360E%2C8358E.pdf Description: IC MPU MPC83XX 400MHZ 740TBGA
Packaging: Bulk
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
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2+245.64 EUR
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MPC8358CVVAGDGA MPC8358CVVAGDGA NXP USA Inc. MPC8360E%2C8358E.pdf Description: IC MPU MPC83XX 400MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Produkt ist nicht verfügbar
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KTY83/121,153 KTY83/121,153 NXP USA Inc. KTY83_SER.pdf Description: SENSOR PTC 990OHM DO34
Packaging: Bulk
Package / Case: DO-204AG, DO-34, Axial
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C
Supplier Device Package: DO-34
Resistance @ 25°C: 990 Ohms
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P1024NXN5DFB P1024NXN5DFB NXP USA Inc. Description: IC MPU QORIQ P1 667MHZ 561TEPBGA
Packaging: Tray
Package / Case: 561-FBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 561-TEPBGA I (23x23)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR3
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
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S912XEP100BVAGR S912XEP100BVAGR NXP USA Inc. Description: IC MCU 16BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEP100BVAL S912XEP100BVAL NXP USA Inc. Description: IC MCU 16BIT 1MB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5644BF0VLU1R SPC5644BF0VLU1R NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5675KFAVMS2 SPC5675KFAVMS2 NXP USA Inc. MPC5675K.pdf Description: IC MCU 32BIT 2MB FLASH 473MAPBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 34x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 473-MAPBGA (19x19)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5675KFAVMS2R SPC5675KFAVMS2R NXP USA Inc. MPC5675K.pdf Description: IC MCU 32BIT 2MB FLASH 473MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 34x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 473-MAPBGA (19x19)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5673FF3MVR3 SPC5673FF3MVR3 NXP USA Inc. MPC5674F.pdf Description: IC MCU 32BIT 3MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MK10DX128VLQ10 MK10DX128VLQ10 NXP USA Inc. K10P81M72SF1.pdf Description: IC MCU 32BIT 128KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 46x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 104
DigiKey Programmable: Not Verified
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2+14.45 EUR
10+11.62 EUR
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MC9S08AC128CFUE MC9S08AC128CFUE NXP USA Inc. MC9S08AC60AD.pdf Description: IC MCU 8BIT 128KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
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42+10.86 EUR
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LFMAJ04PLHT NXP USA Inc. Description: QORIVVA MPC5604P 144 PIN 0.5MM L
Packaging: Bulk
For Use With/Related Products: MPC5604P
Type: Debugger
Contents: Board(s)
Produkt ist nicht verfügbar
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PEMI4CSP/RW135 PEMI4CSP/RW135 NXP USA Inc. PEMIXCSP_FAM.pdf Description: DATA LINE FILTER
Packaging: Bulk
Package / Case: 10-UFBGA, WLCSP
Size / Dimension: 0.062" L x 0.046" W (1.57mm x 1.17mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohm, C = 30pF (Total)
Height: 0.024" (0.60mm)
Attenuation Value: 32dB
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Center / Cutoff Frequency: 98MHz (Cutoff)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 4
Current: 33 mA
Produkt ist nicht verfügbar
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PEMI6CSP/RW135 PEMI6CSP/RW135 NXP USA Inc. PEMIXCSP_FAM.pdf Description: DATA LINE FILTER
Packaging: Bulk
Package / Case: 15-UFBGA, WLCSP
Size / Dimension: 0.093" L x 0.046" W (2.37mm x 1.17mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohm, C = 30pF (Total)
Height: 0.024" (0.60mm)
Attenuation Value: 32dB
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Center / Cutoff Frequency: 98MHz (Cutoff)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 6
Current: 33 mA
Produkt ist nicht verfügbar
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PBSS3515E,135 PBSS3515E,135 NXP USA Inc. DS_568_PBSS3515E.pdf Description: TRANS PNP 15V 0.5A SC-75
Packaging: Bulk
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 250mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 100mA, 2V
Frequency - Transition: 280MHz
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 15 V
Power - Max: 250 mW
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9997+0.051 EUR
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MCF51JU32VHS MCF51JU32VHS NXP USA Inc. MCF51JU128.pdf Description: IC MCU 32BIT 32KB FLASH 44MAPLGA
Packaging: Tray
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 9x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BGS8L5X BGS8L5X NXP USA Inc. RFSAS20EDRM.pdf Description: IC RF AMP CELL 703-960MHZ 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 703MHz ~ 960MHz
RF Type: Cellular, LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 13.6dB
Current - Supply: 4.5mA
Noise Figure: 0.7dB
P1dB: 6dBm
Supplier Device Package: 6-XSON (1.1x0.7)
Produkt ist nicht verfügbar
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FX32K142HAT0MLHR NXP USA Inc. S32K1xx.pdf Description: S32K142 ARM CORTEX-M4F, 80 MHZ,
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC68302AG25C MC68302AG25C NXP USA Inc. MC68302TIMING.pdf Description: IC MPU M683XX 25MHZ 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: M68000
Voltage - I/O: 5.0V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Produkt ist nicht verfügbar
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MC9S08JE64CLH MC9S08JE64CLH NXP USA Inc. Description: IC MCU 8BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI, USB
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 33
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908GZ16CFAE MC908GZ16CFAE NXP USA Inc. MC68HC908GZ60.pdf Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 37
DigiKey Programmable: Verified
auf Bestellung 987 Stücke:
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1+26.95 EUR
10+21.42 EUR
25+20.03 EUR
100+18.51 EUR
250+17.79 EUR
500+17.35 EUR
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LS1012AXN7HKB LS1012AXN7HKB NXP USA Inc. LS1012AFS.pdf Description: IC MPU QORIQ 800MHZ 211FCLGA
Packaging: Bulk
Package / Case: 211-VFLGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 211-FCLGA (9.6x9.6)
Ethernet: GbE (2)
USB: USB 2.0 (1), USB 3.0 + PHY
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
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15+32.18 EUR
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LS1043AXE7MQB LS1043AXE7MQB NXP USA Inc. LS1043AFS.pdf Description: IC MPU QORIQ 1.2GHZ 621FCPBGA
Packaging: Bulk
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
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5+106.34 EUR
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74HC4511N,652 74HC4511N,652 NXP USA Inc. 74HC%28T%294511_Rev_Feb2017.pdf Description: IC DRVR 7 SEGMENT 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Display Type: LED, LCD
Mounting Type: Through Hole
Interface: BCD
Configuration: 7 Segment
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-DIP
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322+1.51 EUR
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BF1216,115 BF1216,115 NXP USA Inc. BF1216_Rev1.pdf Description: RF MOSFET 5V 6TSSOP
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 30dB
Technology: MOSFET (Metal Oxide)
Noise Figure: 1dB
Supplier Device Package: 6-TSSOP
Voltage - Rated: 6 V
Voltage - Test: 5 V
Current - Test: 19 mA
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1567+0.32 EUR
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MFS2301BMMA0EPR2 NXP USA Inc. Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MFS2301BMBA0EPR2 NXP USA Inc. Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MFS2301BMMA0EP NXP USA Inc. Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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MFS2301BMBA0EP NXP USA Inc. Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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P3S0210BQAZ P3S0210BQAZ NXP USA Inc. P3S0210BQ.pdf Description: IC BUS SW 1X2:1/1X1:2 14-DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 14-VFQFN Exposed Pad
Mounting Type: Surface Mount
Circuit: 1 x 2:1, 1 x 1:2
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.72V ~ 3.63V
Independent Circuits: 1
Current - Output High, Low: 10µA, 10µA
Voltage Supply Source: Single Supply
Supplier Device Package: 14-DHVQFN (2.5x3)
Produkt ist nicht verfügbar
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MPF5200AMBA0ES MPF5200AMBA0ES NXP USA Inc. PF5200.pdf Description: PMIC FOR AUTO 2-CH 32-QFN
Packaging: Tray
Package / Case: 32-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Current - Supply: 40µA
Supplier Device Package: 32-HWQFN (5x5)
Grade: Automotive
auf Bestellung 488 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.38 EUR
10+8.48 EUR
25+8.09 EUR
80+7.02 EUR
230+6.95 EUR
Mindestbestellmenge: 2
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BSH205,215 BSH205,215 NXP USA Inc. BSH205.pdf Description: MOSFET P-CH 12V 750MA TO236AB
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 750mA (Ta)
Rds On (Max) @ Id, Vgs: 400mOhm @ 430mA, 4.5V
Power Dissipation (Max): 417mW (Ta)
Vgs(th) (Max) @ Id: 680mV @ 1mA (Typ)
Supplier Device Package: SOT-23 (TO-236AB)
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 12 V
Gate Charge (Qg) (Max) @ Vgs: 3.8 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 200 pF @ 9.6 V
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MK51DX256CLL7 MK51DX256CLL7 NXP USA Inc. K51P100M72SF1.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 35x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
DigiKey Programmable: Not Verified
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74HCT4075N,652 74HCT4075N,652 NXP USA Inc. 74HC_HCT4075.pdf Description: IC GATE OR 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
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74HC75N,652 74HC75N,652 NXP USA Inc. 74HC75_Rev3.pdf Description: IC LATCH QUAD BISTABLE 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Differential
Mounting Type: Through Hole
Circuit: 2:2
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Delay Time - Propagation: 11ns
Supplier Device Package: 16-DIP
auf Bestellung 7629 Stücke:
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74HCT251DB,112 74HCT251DB,112 NXP USA Inc. 74HC%28T%29251.pdf Description: IC 8-INPUT MUX 3ST 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 8:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
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74LVC1G125GN,132 74LVC1G125GN,132 NXP USA Inc. PHGLS28878-1.pdf?t.download=true&u=5oefqw Description: IC BUFF NON-INVERT 5.5V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 32mA
Supplier Device Package: 6-XSON (0.9x1)
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PCF8584T/2,518 PCF8584T/2,518 NXP USA Inc. PCF8584.pdf Description: IC CTRL PARALLEL/I2C BUS 20-SOIC
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Function: Controller
Interface: Parallel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Supply: 1.5mA
Protocol: I2C
Supplier Device Package: 20-SO
DigiKey Programmable: Not Verified
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74HC251N,652 74HC251N,652 NXP USA Inc. 74HC_HCT251.pdf Description: IC MULTIPLEXER 1 X 8:1 16-DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Circuit: 1 x 8:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-DIP
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SVF512R3K2CMK4 SVF512R3K2CMK4 NXP USA Inc. VYBRIDRSERIESEC.pdf Description: IC MPU VYBRID 400MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Produkt ist nicht verfügbar
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SVF532R3K2CMK4 SVF532R3K2CMK4 NXP USA Inc. VYBRIDRSERIESEC.pdf Description: IC MPU VYBRID 133MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Produkt ist nicht verfügbar
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SVF522R2K2CMK4 SVF522R2K2CMK4 NXP USA Inc. VYBRIDRSERIESEC.pdf Description: IC MPU VYBRID 133MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Produkt ist nicht verfügbar
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MKM33Z128CLL5 MKM33Z128CLL5 NXP USA Inc. MKMxxZxxCxx5.pdf Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 68
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P3T2030CUKAZ NXP USA Inc. P3T1035XUK_P3T2030XUK.pdf Description: P3T2030CUKAZ
Packaging: Tape & Reel (TR)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
Produkt ist nicht verfügbar
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P3T2030CUKAZ NXP USA Inc. P3T1035XUK_P3T2030XUK.pdf Description: P3T2030CUKAZ
Packaging: Cut Tape (CT)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
auf Bestellung 3490 Stücke:
Lieferzeit 10-14 Tag (e)
8+2.2 EUR
13+1.39 EUR
25+1.17 EUR
100+0.93 EUR
250+0.81 EUR
500+0.73 EUR
1000+0.67 EUR
Mindestbestellmenge: 8
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LPC2109FBD64/01,15 LPC2109FBD64/01,15 NXP USA Inc. LPC2109_2119_2129.pdf Description: IC MCU 16/32BIT 64KB FLSH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 4x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 46
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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WLAN7201HCZ NXP USA Inc. Description: WLAN7201HC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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WLAN7202CCZ NXP USA Inc. Description: WLAN7202CC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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WLAN7201CCZ NXP USA Inc. TIP-NXP-FEIC-WIFI6-WIFI7.pdf Description: WLAN7201CC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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WLAN7207HY NXP USA Inc. Description: QFN MODULE
Packaging: Tape & Reel (TR)
Package / Case: 18-WFLGA Exposed Pad
Frequency: 2.4GHz
RF Type: WLAN
Supplier Device Package: 18-HWFLGA (2x2.4)
Produkt ist nicht verfügbar
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WLAN7207CY NXP USA Inc. Description: QFN MODULE
Packaging: Tape & Reel (TR)
Package / Case: 16-WFLGA Exposed Pad
Frequency: 5.15GHz ~ 7.125GHz
RF Type: WLAN
Supplier Device Package: 16-HWFLGA (2x2)
Produkt ist nicht verfügbar
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WLAN7209HY NXP USA Inc. Description: WLAN7209H
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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WLAN7209CY NXP USA Inc. Description: WLAN7209C
Packaging: Tape & Reel (TR)
Package / Case: 16-WFLGA Exposed Pad
Supplier Device Package: 16-HWFLGA (2x2)
Produkt ist nicht verfügbar
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WLAN7202CY NXP USA Inc. Description: WI-FI 6E FRONT-END IC, 5-7 GHZ
Packaging: Tape & Reel (TR)
Package / Case: 16-WFLGA Exposed Pad
Frequency: 5GHz ~ 7GHz
RF Type: WLAN
Supplier Device Package: 16-HWFLGA (2x2)
Produkt ist nicht verfügbar
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WLAN7204HMP NXP USA Inc. Description: WI-FI 6 FRONT-END IC, 2.4 GHZ
Packaging: Tape & Reel (TR)
Package / Case: 18-WFLGA Exposed Pad
Frequency: 2.4GHz
RF Type: WLAN
Supplier Device Package: 18-HWFLGA (2.4x2)
Produkt ist nicht verfügbar
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FS32V232CKN2VUB FS32V232CKN2VUB NXP USA Inc. S32V234.pdf Description: IC MPU FS32V23 1GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 2 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
Produkt ist nicht verfügbar
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FRDMGD3100HB8EVM FRDMGD3100HB8EVM.pdf
Hersteller: NXP USA Inc.
Description: HALF-BRIDGE EVALUATION KIT FEATU
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3100
Supplied Contents: Board(s)
Primary Attributes: 1-Channel (Single)
Embedded: Yes, MCU
Produkt ist nicht verfügbar
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MPC8280CVVQLDA MPC8280EC.pdf
MPC8280CVVQLDA
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 333MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
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MPC8349ECVVAJFB MPC8349EAEC.pdf
MPC8349ECVVAJFB
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
Produkt ist nicht verfügbar
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MPC8358CVVAGDGA MPC8360E%2C8358E.pdf
MPC8358CVVAGDGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 740TBGA
Packaging: Bulk
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+245.64 EUR
Mindestbestellmenge: 2
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MPC8358CVVAGDGA MPC8360E%2C8358E.pdf
MPC8358CVVAGDGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Produkt ist nicht verfügbar
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KTY83/121,153 KTY83_SER.pdf
KTY83/121,153
Hersteller: NXP USA Inc.
Description: SENSOR PTC 990OHM DO34
Packaging: Bulk
Package / Case: DO-204AG, DO-34, Axial
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C
Supplier Device Package: DO-34
Resistance @ 25°C: 990 Ohms
auf Bestellung 70565 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
268+1.82 EUR
Mindestbestellmenge: 268
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P1024NXN5DFB
P1024NXN5DFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 667MHZ 561TEPBGA
Packaging: Tray
Package / Case: 561-FBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 561-TEPBGA I (23x23)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR3
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
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S912XEP100BVAGR
S912XEP100BVAGR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEP100BVAL
S912XEP100BVAL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 1MB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5644BF0VLU1R
SPC5644BF0VLU1R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5675KFAVMS2 MPC5675K.pdf
SPC5675KFAVMS2
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 473MAPBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 34x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 473-MAPBGA (19x19)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5675KFAVMS2R MPC5675K.pdf
SPC5675KFAVMS2R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 473MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 34x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 473-MAPBGA (19x19)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SPC5673FF3MVR3 MPC5674F.pdf
SPC5673FF3MVR3
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MK10DX128VLQ10 K10P81M72SF1.pdf
MK10DX128VLQ10
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 46x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 104
DigiKey Programmable: Not Verified
auf Bestellung 290 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+14.45 EUR
10+11.62 EUR
Mindestbestellmenge: 2
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MC9S08AC128CFUE MC9S08AC60AD.pdf
MC9S08AC128CFUE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 64QFP
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 423 Stücke:
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Anzahl Preis
42+10.86 EUR
Mindestbestellmenge: 42
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LFMAJ04PLHT
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5604P 144 PIN 0.5MM L
Packaging: Bulk
For Use With/Related Products: MPC5604P
Type: Debugger
Contents: Board(s)
Produkt ist nicht verfügbar
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PEMI4CSP/RW135 PEMIXCSP_FAM.pdf
PEMI4CSP/RW135
Hersteller: NXP USA Inc.
Description: DATA LINE FILTER
Packaging: Bulk
Package / Case: 10-UFBGA, WLCSP
Size / Dimension: 0.062" L x 0.046" W (1.57mm x 1.17mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohm, C = 30pF (Total)
Height: 0.024" (0.60mm)
Attenuation Value: 32dB
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Center / Cutoff Frequency: 98MHz (Cutoff)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 4
Current: 33 mA
Produkt ist nicht verfügbar
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PEMI6CSP/RW135 PEMIXCSP_FAM.pdf
PEMI6CSP/RW135
Hersteller: NXP USA Inc.
Description: DATA LINE FILTER
Packaging: Bulk
Package / Case: 15-UFBGA, WLCSP
Size / Dimension: 0.093" L x 0.046" W (2.37mm x 1.17mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohm, C = 30pF (Total)
Height: 0.024" (0.60mm)
Attenuation Value: 32dB
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Center / Cutoff Frequency: 98MHz (Cutoff)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 6
Current: 33 mA
Produkt ist nicht verfügbar
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PBSS3515E,135 DS_568_PBSS3515E.pdf
PBSS3515E,135
Hersteller: NXP USA Inc.
Description: TRANS PNP 15V 0.5A SC-75
Packaging: Bulk
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 250mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 100mA, 2V
Frequency - Transition: 280MHz
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 15 V
Power - Max: 250 mW
auf Bestellung 9997 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
9997+0.051 EUR
Mindestbestellmenge: 9997
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MCF51JU32VHS MCF51JU128.pdf
MCF51JU32VHS
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 44MAPLGA
Packaging: Tray
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 9x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BGS8L5X RFSAS20EDRM.pdf
BGS8L5X
Hersteller: NXP USA Inc.
Description: IC RF AMP CELL 703-960MHZ 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 703MHz ~ 960MHz
RF Type: Cellular, LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 13.6dB
Current - Supply: 4.5mA
Noise Figure: 0.7dB
P1dB: 6dBm
Supplier Device Package: 6-XSON (1.1x0.7)
Produkt ist nicht verfügbar
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FX32K142HAT0MLHR S32K1xx.pdf
Hersteller: NXP USA Inc.
Description: S32K142 ARM CORTEX-M4F, 80 MHZ,
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC68302AG25C MC68302TIMING.pdf
MC68302AG25C
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: M68000
Voltage - I/O: 5.0V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Produkt ist nicht verfügbar
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MC9S08JE64CLH
MC9S08JE64CLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI, USB
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 33
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908GZ16CFAE MC68HC908GZ60.pdf
MC908GZ16CFAE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 37
DigiKey Programmable: Verified
auf Bestellung 987 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+26.95 EUR
10+21.42 EUR
25+20.03 EUR
100+18.51 EUR
250+17.79 EUR
500+17.35 EUR
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LS1012AXN7HKB LS1012AFS.pdf
LS1012AXN7HKB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 211FCLGA
Packaging: Bulk
Package / Case: 211-VFLGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 211-FCLGA (9.6x9.6)
Ethernet: GbE (2)
USB: USB 2.0 (1), USB 3.0 + PHY
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
auf Bestellung 51 Stücke:
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Anzahl Preis
15+32.18 EUR
Mindestbestellmenge: 15
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LS1043AXE7MQB LS1043AFS.pdf
LS1043AXE7MQB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.2GHZ 621FCPBGA
Packaging: Bulk
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
auf Bestellung 16 Stücke:
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Anzahl Preis
5+106.34 EUR
Mindestbestellmenge: 5
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74HC4511N,652 74HC%28T%294511_Rev_Feb2017.pdf
74HC4511N,652
Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Display Type: LED, LCD
Mounting Type: Through Hole
Interface: BCD
Configuration: 7 Segment
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-DIP
auf Bestellung 5932 Stücke:
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Anzahl Preis
322+1.51 EUR
Mindestbestellmenge: 322
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BF1216,115 BF1216_Rev1.pdf
BF1216,115
Hersteller: NXP USA Inc.
Description: RF MOSFET 5V 6TSSOP
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 30dB
Technology: MOSFET (Metal Oxide)
Noise Figure: 1dB
Supplier Device Package: 6-TSSOP
Voltage - Rated: 6 V
Voltage - Test: 5 V
Current - Test: 19 mA
auf Bestellung 3151 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1567+0.32 EUR
Mindestbestellmenge: 1567
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MFS2301BMMA0EPR2
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MFS2301BMBA0EPR2
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MFS2301BMMA0EP
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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MFS2301BMBA0EP
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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P3S0210BQAZ P3S0210BQ.pdf
P3S0210BQAZ
Hersteller: NXP USA Inc.
Description: IC BUS SW 1X2:1/1X1:2 14-DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 14-VFQFN Exposed Pad
Mounting Type: Surface Mount
Circuit: 1 x 2:1, 1 x 1:2
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.72V ~ 3.63V
Independent Circuits: 1
Current - Output High, Low: 10µA, 10µA
Voltage Supply Source: Single Supply
Supplier Device Package: 14-DHVQFN (2.5x3)
Produkt ist nicht verfügbar
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MPF5200AMBA0ES PF5200.pdf
MPF5200AMBA0ES
Hersteller: NXP USA Inc.
Description: PMIC FOR AUTO 2-CH 32-QFN
Packaging: Tray
Package / Case: 32-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Current - Supply: 40µA
Supplier Device Package: 32-HWQFN (5x5)
Grade: Automotive
auf Bestellung 488 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.38 EUR
10+8.48 EUR
25+8.09 EUR
80+7.02 EUR
230+6.95 EUR
Mindestbestellmenge: 2
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BSH205,215 BSH205.pdf
BSH205,215
Hersteller: NXP USA Inc.
Description: MOSFET P-CH 12V 750MA TO236AB
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 750mA (Ta)
Rds On (Max) @ Id, Vgs: 400mOhm @ 430mA, 4.5V
Power Dissipation (Max): 417mW (Ta)
Vgs(th) (Max) @ Id: 680mV @ 1mA (Typ)
Supplier Device Package: SOT-23 (TO-236AB)
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 12 V
Gate Charge (Qg) (Max) @ Vgs: 3.8 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 200 pF @ 9.6 V
auf Bestellung 118914 Stücke:
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Anzahl Preis
1567+0.31 EUR
Mindestbestellmenge: 1567
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MK51DX256CLL7 K51P100M72SF1.pdf
MK51DX256CLL7
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 35x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
DigiKey Programmable: Not Verified
auf Bestellung 180 Stücke:
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Anzahl Preis
28+17.81 EUR
Mindestbestellmenge: 28
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74HCT4075N,652 74HC_HCT4075.pdf
74HCT4075N,652
Hersteller: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
auf Bestellung 8453 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1902+0.26 EUR
Mindestbestellmenge: 1902
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74HC75N,652 74HC75_Rev3.pdf
74HC75N,652
Hersteller: NXP USA Inc.
Description: IC LATCH QUAD BISTABLE 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Differential
Mounting Type: Through Hole
Circuit: 2:2
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Delay Time - Propagation: 11ns
Supplier Device Package: 16-DIP
auf Bestellung 7629 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
784+0.62 EUR
Mindestbestellmenge: 784
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74HCT251DB,112 74HC%28T%29251.pdf
74HCT251DB,112
Hersteller: NXP USA Inc.
Description: IC 8-INPUT MUX 3ST 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 8:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
auf Bestellung 4372 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1066+0.45 EUR
Mindestbestellmenge: 1066
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74LVC1G125GN,132 PHGLS28878-1.pdf?t.download=true&u=5oefqw
74LVC1G125GN,132
Hersteller: NXP USA Inc.
Description: IC BUFF NON-INVERT 5.5V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 32mA
Supplier Device Package: 6-XSON (0.9x1)
auf Bestellung 178953 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2882+0.17 EUR
Mindestbestellmenge: 2882
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PCF8584T/2,518 PCF8584.pdf
PCF8584T/2,518
Hersteller: NXP USA Inc.
Description: IC CTRL PARALLEL/I2C BUS 20-SOIC
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Function: Controller
Interface: Parallel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Supply: 1.5mA
Protocol: I2C
Supplier Device Package: 20-SO
DigiKey Programmable: Not Verified
auf Bestellung 3355 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
86+5.73 EUR
Mindestbestellmenge: 86
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74HC251N,652 74HC_HCT251.pdf
74HC251N,652
Hersteller: NXP USA Inc.
Description: IC MULTIPLEXER 1 X 8:1 16-DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Circuit: 1 x 8:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-DIP
auf Bestellung 62834 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
508+0.96 EUR
Mindestbestellmenge: 508
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SVF512R3K2CMK4 VYBRIDRSERIESEC.pdf
SVF512R3K2CMK4
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 400MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Produkt ist nicht verfügbar
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SVF532R3K2CMK4 VYBRIDRSERIESEC.pdf
SVF532R3K2CMK4
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 133MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Produkt ist nicht verfügbar
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SVF522R2K2CMK4 VYBRIDRSERIESEC.pdf
SVF522R2K2CMK4
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 133MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Produkt ist nicht verfügbar
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MKM33Z128CLL5 MKMxxZxxCxx5.pdf
MKM33Z128CLL5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 68
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P3T2030CUKAZ P3T1035XUK_P3T2030XUK.pdf
Hersteller: NXP USA Inc.
Description: P3T2030CUKAZ
Packaging: Tape & Reel (TR)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
Produkt ist nicht verfügbar
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P3T2030CUKAZ P3T1035XUK_P3T2030XUK.pdf
Hersteller: NXP USA Inc.
Description: P3T2030CUKAZ
Packaging: Cut Tape (CT)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
auf Bestellung 3490 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.2 EUR
13+1.39 EUR
25+1.17 EUR
100+0.93 EUR
250+0.81 EUR
500+0.73 EUR
1000+0.67 EUR
Mindestbestellmenge: 8
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LPC2109FBD64/01,15 LPC2109_2119_2129.pdf
LPC2109FBD64/01,15
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT 64KB FLSH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 4x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 46
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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WLAN7201HCZ
Hersteller: NXP USA Inc.
Description: WLAN7201HC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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WLAN7202CCZ
Hersteller: NXP USA Inc.
Description: WLAN7202CC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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WLAN7201CCZ TIP-NXP-FEIC-WIFI6-WIFI7.pdf
Hersteller: NXP USA Inc.
Description: WLAN7201CC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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WLAN7207HY
Hersteller: NXP USA Inc.
Description: QFN MODULE
Packaging: Tape & Reel (TR)
Package / Case: 18-WFLGA Exposed Pad
Frequency: 2.4GHz
RF Type: WLAN
Supplier Device Package: 18-HWFLGA (2x2.4)
Produkt ist nicht verfügbar
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WLAN7207CY
Hersteller: NXP USA Inc.
Description: QFN MODULE
Packaging: Tape & Reel (TR)
Package / Case: 16-WFLGA Exposed Pad
Frequency: 5.15GHz ~ 7.125GHz
RF Type: WLAN
Supplier Device Package: 16-HWFLGA (2x2)
Produkt ist nicht verfügbar
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WLAN7209HY
Hersteller: NXP USA Inc.
Description: WLAN7209H
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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WLAN7209CY
Hersteller: NXP USA Inc.
Description: WLAN7209C
Packaging: Tape & Reel (TR)
Package / Case: 16-WFLGA Exposed Pad
Supplier Device Package: 16-HWFLGA (2x2)
Produkt ist nicht verfügbar
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WLAN7202CY
Hersteller: NXP USA Inc.
Description: WI-FI 6E FRONT-END IC, 5-7 GHZ
Packaging: Tape & Reel (TR)
Package / Case: 16-WFLGA Exposed Pad
Frequency: 5GHz ~ 7GHz
RF Type: WLAN
Supplier Device Package: 16-HWFLGA (2x2)
Produkt ist nicht verfügbar
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WLAN7204HMP
Hersteller: NXP USA Inc.
Description: WI-FI 6 FRONT-END IC, 2.4 GHZ
Packaging: Tape & Reel (TR)
Package / Case: 18-WFLGA Exposed Pad
Frequency: 2.4GHz
RF Type: WLAN
Supplier Device Package: 18-HWFLGA (2.4x2)
Produkt ist nicht verfügbar
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FS32V232CKN2VUB S32V234.pdf
FS32V232CKN2VUB
Hersteller: NXP USA Inc.
Description: IC MPU FS32V23 1GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 2 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
Produkt ist nicht verfügbar
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