LPC55S36JBD100MP NXP Semiconductors

Description: IC MCU 32BIT 256KB FLSH 100HLQFP, Packaging: Tape & Reel (TR), Package / Case: 100-LQFP, Mounting Type: Surface Mount, Speed: 150MHz, Program Memory Size: 256KB (256K x 8), RAM Size: 128K x 8, Operating Temperature: -40°C ~ 105°C (TA), Oscillator Type: External, Internal, Program Memory Type: FLASH, Core Processor: ARM® Cortex®-M33, Data Converters: A/D 23x16b; D/A 3x12b, Core Size: 32-Bit Single-Core, Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V, Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0, Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT, Supplier Device Package: 100-HLQFP (14x14), Number of I/O: 66.