MC33FS6500LAE NXP Semiconductors
Hersteller: NXP Semiconductors
Power Management Specialised - PMIC System Basis Chip, DCDC 0.8A Vcore CAN LIN, LQFP48EP
| Anzahl | Privatkunde |
|---|---|
| 1+ | 14.6 EUR |
| 10+ | 11.27 EUR |
| 25+ | 10.34 EUR |
| 100+ | 9.56 EUR |
| 250+ | 8.77 EUR |
| 1000+ | 8.59 EUR |
| 2500+ | 8.32 EUR |
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Technische Details MC33FS6500LAE NXP Semiconductors
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO, Packaging: Tray, Package / Case: 48-LQFP Exposed Pad, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 125°C, Voltage - Supply: 1V ~ 5V, Applications: System Basis Chip, Supplier Device Package: 48-HLQFP (7x7).
Weitere Produktangebote MC33FS6500LAE nach Preis ab 12.01 EUR bis 18.11 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||
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MC33FS6500LAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
auf Bestellung 247 Stücke: Lieferzeit 10-14 Tag (e) |
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| MC33FS6500LAE |
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Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
auf Bestellung 247 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 18.11 EUR |
| 10+ | 14.11 EUR |
| 25+ | 13.1 EUR |
| 100+ | 12.01 EUR |