MFS2321BMBB2EP NXP Semiconductors
Hersteller: NXP Semiconductors
Power Management Specialised - PMIC Safety SBC with Power Management, CAN and LIN
| Anzahl | Privatkunde |
|---|---|
| 1+ | 14.01 EUR |
| 10+ | 10.75 EUR |
| 25+ | 10.01 EUR |
| 100+ | 8.82 EUR |
| 260+ | 6.56 EUR |
| 520+ | 6.53 EUR |
| 1040+ | 6.41 EUR |
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Technische Details MFS2321BMBB2EP NXP Semiconductors
Description: MFS2321BMBB2EP, Supplier Device Package: 48-HVQFN (7x7), Applications: System Basis Chip, Voltage - Supply: 5.5V ~ 40V, Operating Temperature: -40°C ~ 125°C (TA), Mounting Type: Surface Mount, Wettable Flank, Package / Case: 48-VFQFN Exposed Pad, Packaging: Tray.
Weitere Produktangebote MFS2321BMBB2EP
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
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MFS2321BMBB2EP | NXP USA Inc. |
Description: MFS2321BMBB2EP Supplier Device Package: 48-HVQFN (7x7) Applications: System Basis Chip Voltage - Supply: 5.5V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| MFS2321BMBB2EP |
|
Hersteller: NXP USA Inc.
Description: MFS2321BMBB2EP
Supplier Device Package: 48-HVQFN (7x7)
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Description: MFS2321BMBB2EP
Supplier Device Package: 48-HVQFN (7x7)
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH