Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (37053) > Seite 570 nach 618

Hersteller: NXP USA Inc.
Description: TRANSISTOR PNP 20V 1A SOT223
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: TRIAC LOGIC 800V 1A 5MA TO-92
Packaging: Bulk

Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 300MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART

Hersteller: NXP USA Inc.
Description: TRIAC SENS GATE 600V 1A TO92-3
Packaging: Bulk
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Triac Type: Logic - Sensitive Gate
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 10 mA
Current - Gate Trigger (Igt) (Max): 5 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 8A, 8.5A
Voltage - Gate Trigger (Vgt) (Max): 1.3 V
Supplier Device Package: TO-92-3
Current - On State (It (RMS)) (Max): 1 A
Voltage - Off State: 600 V

Hersteller: NXP USA Inc.
Description: IC MODULATOR AUDIO/VIDEO 20-QFN
Packaging: Bulk

Hersteller: NXP USA Inc.
Description: DIODE SCHOTTKY 50V 200MA SOD80C
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 105
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 105
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 20 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 16dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Number of Channels: 4

Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 20 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 21pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 14dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Number of Channels: 8

Hersteller: NXP USA Inc.
Description: DIODE ZENER 4.7V 300MW SOD323
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: AW693PHNB/A1ZDB
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: TRIAC SENS GATE 800V 4A TO220-3
Packaging: Bulk

Hersteller: NXP USA Inc.
Description: TRIAC SENS GATE 600V 4A TO220-3
Packaging: Bulk

Hersteller: NXP USA Inc.
Description: TRIAC 600V 4A D2PAK
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: IC BUFF 2V/6V 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 6
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 16-SO

Hersteller: NXP USA Inc.
Description: IC HEX INV SCHMITT TRIG 14TSSOP
Packaging: Tube

Hersteller: NXP USA Inc.
Description: IC HEX INV SCHMITT TRIG 14DHVQFN
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: IC NAND 4-CIR 2-IN 14-TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 12ns @ 4.5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 40 µA

Hersteller: NXP USA Inc.
Description: IC MMV 2-CIR 77-NS 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 77 ns
Independent Circuits: 2
Current - Output High, Low: 4mA, 4mA
Schmitt Trigger Input: Yes
Supplier Device Package: 16-SO
Voltage - Supply: 4.5 V ~ 5.5 V

Hersteller: NXP USA Inc.
Description: IC MMV 2-CIR 77-NS 16-TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 77 ns
Independent Circuits: 2
Current - Output High, Low: 4mA, 4mA
Schmitt Trigger Input: No
Supplier Device Package: 16-TSSOP
Voltage - Supply: 4.5 V ~ 5.5 V

Hersteller: NXP USA Inc.
Description: IC MMV 2-CIR 77-NS 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 77 ns
Independent Circuits: 2
Current - Output High, Low: 4mA, 4mA
Schmitt Trigger Input: Yes
Supplier Device Package: 16-SSOP
Voltage - Supply: 4.5 V ~ 5.5 V

Hersteller: NXP USA Inc.
Description: IC BUFFER TRPL N-INVERT 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 32mA
Supplier Device Package: 8-XSON (2x3)

Hersteller: NXP USA Inc.
Description: DIODE ZENER 10V 1W DO41
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: DIODE ZENER 10V 1W DO41
Packaging: Tape & Box (TB)

Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI

Hersteller: NXP USA Inc.
Description: FET RF 65V 2GHZ SOT538A
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 21pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 25dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 8

Hersteller: NXP USA Inc.
Description: IC TELECOM INTERFACE 625BGA
Packaging: Tray

Hersteller: NXP USA Inc.
Description: DIODE ZENER 6.2V 1W DO41
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 42DIP
Packaging: Tube
Package / Case: 42-SDIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 42-PDIP
Number of I/O: 33
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32QFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 24
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 24
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 64KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x16b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LCD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 45
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC MMV 2-CIR 65-NS 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 65 ns
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Schmitt Trigger Input: No
Supplier Device Package: 16-SO
Voltage - Supply: 2 V ~ 6 V

Hersteller: NXP USA Inc.
Description: IC MMV 2-CIR 65-NS 16-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 65 ns
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Schmitt Trigger Input: No
Supplier Device Package: 16-SSOP
Voltage - Supply: 2 V ~ 6 V

Hersteller: NXP USA Inc.
Description: IC MMV 2-CIR 65-NS 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 65 ns
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Schmitt Trigger Input: No
Supplier Device Package: 16-SSOP
Voltage - Supply: 2 V ~ 6 V

Hersteller: NXP USA Inc.
Description: IC D-TYPE POS TRG DUAL 14SOIC
Packaging: Tube

Hersteller: NXP USA Inc.
Description: FET RF 110V 225MHZ SOT467C
Packaging: Tray

Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 20WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 20-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 7x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 20-WLCSP (2x1.61)
Number of I/O: 18
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: MOSFET N-CH 100V 500MA SOT23
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: TRANS PREBIAS NPN 250MW TO236AB
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: DIODE SCHOTTKY 30V 0.2A DO34
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: DIODE ZENER 4.7V 400MW SOD323
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: MOSFET RF N-CH 40W NI780H-4
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 2.03GHz
Configuration: Dual
Power - Output: 10W
Gain: 18.2dB
Technology: LDMOS
Supplier Device Package: NI-780-4
Voltage - Rated: 65 V
Voltage - Test: 32 V
Current - Test: 150 mA

Hersteller: NXP USA Inc.
Description: MOSFET RF N-CH 28V 23W NI780S
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.51GHz
Power - Output: 23W
Gain: 19.5dB
Technology: LDMOS
Supplier Device Package: NI-780S
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 600 mA

Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 30V NI400
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
Power - Output: 2W
Gain: 15dB
Technology: LDMOS
Supplier Device Package: NI-400S-2S
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 160 mA

Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 30V NI400
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
Power - Output: 8W
Gain: 14dB
Technology: LDMOS
Supplier Device Package: NI-400S-2S
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 450 mA

Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.6GHz ~ 1.66GHz
Power - Output: 32W
Gain: 19.7dB
Technology: LDMOS
Supplier Device Package: NI-780S
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.5 A

Hersteller: NXP USA Inc.
Description: TRIAC 600V 1A TO92-3
Packaging: Bulk

Hersteller: NXP USA Inc.
Description: TRIAC SENS GATE 600V 1A TO92-3
Packaging: Tape & Reel (TR)

Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 45 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 16pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 15dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 6

Hersteller: NXP USA Inc.
Description: IC NAND 4-CIR 2-IN 14-SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 7ns @ 6V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 40 µA

Hersteller: NXP USA Inc.
Description: IC NAND 4-CIR 2-IN 14-SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 7ns @ 6V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 40 µA

Hersteller: NXP USA Inc.
Description: PRESSURE SENSOR GAUGE AXL 6SIP
Packaging: Tray
Package / Case: 6-SIP Module
Mounting Type: Through Hole
Termination Style: PCB

Hersteller: NXP USA Inc.
Description: IC SWITCH QUAD 1X1 14SOIC
Packaging: Tube

Hersteller: NXP USA Inc.
Description: IC TRANSLTR TRX 4BIT 12-WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Number of Bits: 4
Logic Type: Translating Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V
Supplier Device Package: 12-WLCSP (1.42x1.97)

Hersteller: NXP USA Inc.
Description: IC TRANSLTR TRX 4BIT 12-WLCSP
Packaging: Cut Tape (CT)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Number of Bits: 4
Logic Type: Translating Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V
Supplier Device Package: 12-WLCSP (1.42x1.97)