Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36619) > Seite 589 nach 611
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||
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DAC1203D160HW/C1:5 | NXP USA Inc. |
 Description: IC DAC 12BIT 160MSPS 80-HTQFPPackaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 119 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| DAC1405D650HW/C1,5 | NXP USA Inc. |
Description: IC DAC 14BIT 650MSPD DL 100HTQFP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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DAC1403D160HW/C1,5 | NXP USA Inc. |
Description: IC DAC 14BIT 160MSPS 80-HTQFP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| DAC1005D650HW/C1,5 | NXP USA Inc. |
Description: IC DAC 10BIT 650MSPS DL 100HTQFP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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DAC1403D160HW/C1:5 | NXP USA Inc. |
Description: IC DAC 14BIT 160MSPS 80-HTQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 119 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| DAC1205D650HW/C1,5 | NXP USA Inc. |
Description: IC DAC 12BIT 650MSPS DL 100HTQFP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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DAC1408D750HN/C1:5 | NXP USA Inc. |
Description: IC DAC 14BIT 750MSPS DL 16HVQFN Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 260 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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DAC1405D750HW/C1,5 | NXP USA Inc. |
Description: IC DAC 14BIT SRL/SPI 100HTQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 90 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MPC857TVR66B | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (1), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74LVC240AD,112 | NXP USA Inc. |
Description: IC INVERTER DUAL 4-INPUT 20SOIC Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74LVC240APW,118 | NXP USA Inc. |
Description: IC INVERTER DUAL 4-INPUT 20TSSOP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74LVC240ADB,118 | NXP USA Inc. |
Description: IC INVERTER DUAL 4-INPUT 20SSOP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74LVC240AD,118 | NXP USA Inc. |
Description: IC INVERTER DUAL 4-INPUT 20SOIC Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC33972TEWR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Tape & Reel (TR) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 3.1V ~ 5.25V Applications: Switch Monitoring Supplier Device Package: 32-SOIC |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC33972TEWR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Cut Tape (CT) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 3.1V ~ 5.25V Applications: Switch Monitoring Supplier Device Package: 32-SOIC |
auf Bestellung 894 Stücke: Lieferzeit 10-14 Tag (e) |
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| BUK964R2-55B,118 | NXP USA Inc. |
Description: MOSFET N-CH 55V 75A D2PAK Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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74HC03D,653 | NXP USA Inc. |
Description: IC GATE NAND 4CH 2-INP 14-SO Packaging: Tape & Reel (TR) Features: Open Drain Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: -, 5.2mA Number of Inputs: 2 Supplier Device Package: 14-SO Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF Number of Circuits: 4 Current - Quiescent (Max): 2 µA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74HC03D,652 | NXP USA Inc. |
Description: IC GATE NAND 4CH 2-INP 14-SO Packaging: Tube Features: Open Drain Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: -, 5.2mA Number of Inputs: 2 Supplier Device Package: 14-SO Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF Number of Circuits: 4 Current - Quiescent (Max): 2 µA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MIMX8ML4DVNLZAB | NXP USA Inc. |
Description: IC MPU I.MX8ML 1.8GHZ 548LFBGA Packaging: Tray Package / Case: 548-LFBGA Mounting Type: Surface Mount Speed: 1.8GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A53 Supplier Device Package: 548-LFBGA (15x15) Ethernet: GbE (2) USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP RAM Controllers: DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, LVDS, MIPI-CSI, MIPI-DSI Security Features: ARM TZ, CAAM, RDC Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MIMX8MN5DVPIZDA | NXP USA Inc. |
Description: MIMX8MN5DVPIZDA Packaging: Tray Package / Case: 306-TFBGA Speed: 1.4GHz, 750MHz RAM Size: 544kB Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Connectivity: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART Peripherals: DMA, PWM, WDT Supplier Device Package: 306-TFBGA (11x11) Architecture: MPU |
auf Bestellung 168 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC160DB,112 | NXP USA Inc. |
Description: IC SYNC BCD DECADE COUNTR 16SSOP Packaging: Tube Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Counter, Decade Reset: Asynchronous Operating Temperature: -40°C ~ 125°C Direction: Up Trigger Type: Positive Edge Timing: Synchronous Supplier Device Package: 16-SSOP Voltage - Supply: 2 V ~ 6 V Count Rate: 66 MHz Number of Bits per Element: 4 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74HC160D,653 | NXP USA Inc. |
Description: IC SYNC BCD DECADE COUNT 16SOIC Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Counter, Decade Reset: Asynchronous Operating Temperature: -40°C ~ 125°C Direction: Up Trigger Type: Positive Edge Timing: Synchronous Supplier Device Package: 16-SO Voltage - Supply: 2 V ~ 6 V Count Rate: 66 MHz Number of Bits per Element: 4 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MCF51QM64VLF | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 2x16b, 12x16b; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 35 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74AHCT541PW,112 | NXP USA Inc. |
Description: IC BUFF/DVR TRI-ST 8BIT 20TSSOP Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74AHCT541D,112 | NXP USA Inc. |
Description: IC BUFF/DVR TRI-ST 8BIT 20SOIC Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74LVC1G32GW,165 | NXP USA Inc. |
Description: IC GATE OR 1CH 2-INP 5-TSSOP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74LV123DB,118 | NXP USA Inc. |
Description: IC DUAL RETRIG MULTIVIB 16SSOP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74LV123D,112 | NXP USA Inc. |
Description: IC DUAL RETRIG MULTIVIB 16SOIC Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74LV123D,118 | NXP USA Inc. |
Description: IC DUAL RETRIG MULTIVIB 16SOIC Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74LV123DB,112 | NXP USA Inc. |
Description: IC DUAL RETRIG MULTIVIB 16SSOP Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| SL3S1205FUD/HAZ | NXP USA Inc. |
Description: IC RFID TRANSP 840-960MHZ WAFER Packaging: Tray Package / Case: Die Mounting Type: Surface Mount Frequency: 840MHz ~ 960MHz Type: RFID Transponder Operating Temperature: -40°C ~ 85°C (TA) Standards: EPC Supplier Device Package: Wafer |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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74HCT4020N,652 | NXP USA Inc. |
Description: IC BINARY COUNTER 14-BIT 16DIP Packaging: Tube Package / Case: 16-DIP (0.300", 7.62mm) Mounting Type: Through Hole Number of Elements: 1 Logic Type: Binary Counter Reset: Asynchronous Operating Temperature: -40°C ~ 125°C Direction: Up Trigger Type: Negative Edge Supplier Device Package: 16-DIP Voltage - Supply: 4.5 V ~ 5.5 V Count Rate: 47 MHz Number of Bits per Element: 14 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| BC849B,215 | NXP USA Inc. |
Description: TRANSISTOR NPN 30V 100MA SOT23 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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BZV85-C75,113 | NXP USA Inc. |
Description: DIODE ZENER 75V 1.3W DO41 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74HC42D,653 | NXP USA Inc. |
Description: IC DECODER 1 X 4:10 16-SO Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 1 x 4:10 Type: Decoder Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Independent Circuits: 1 Current - Output High, Low: 5.2mA, 5.2mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SO |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74HC423D,652 | NXP USA Inc. |
Description: IC MMV 2-CIR 20-NS 16-SO Packaging: Tube Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: Monostable Operating Temperature: -40°C ~ 125°C Propagation Delay: 20 ns Independent Circuits: 2 Current - Output High, Low: 5.2mA, 5.2mA Schmitt Trigger Input: No Supplier Device Package: 16-SO Voltage - Supply: 2 V ~ 6 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| MPC8378CVRAGDA | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ PBGA689 Packaging: Bulk Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 125°C (TA) Core Processor: PowerPC e300c4s Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI |
auf Bestellung 1965 Stücke: Lieferzeit 10-14 Tag (e) |
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| DAC1005D650/DB | NXP USA Inc. |
Description: BOARD DEMO FOR DAC1005D650 Packaging: Box |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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74HCT257PW,112 | NXP USA Inc. |
Description: IC MULTIPLEXER 4 X 2:1 16-TSSOP Packaging: Tube Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Circuit: 4 x 2:1 Type: Multiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 1 Current - Output High, Low: 6mA, 6mA Voltage Supply Source: Single Supply Supplier Device Package: 16-TSSOP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74LVC1G74GN,115 | NXP USA Inc. |
Description: IC FLIP-FLOP D POS-EDGE 8XSON Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74LVC1G74GT,115 | NXP USA Inc. |
Description: IC D-TYPE POS TRG SNGL 8XSON Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74LVC1G74GD,125 | NXP USA Inc. |
Description: IC D-TYPE POS TRG SNGL 8XSON Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| BSS87,115 | NXP USA Inc. |
Description: MOSFET N-CH 200V 400MA SOT89 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| BCM62B,215 | NXP USA Inc. |
Description: TRANS PNP DBL 45V 100MA SOT-143B Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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MC908QY2AMDTE | NXP USA Inc. |
Description: IC MCU 8BIT 1.5KB FLASH 16TSSOP Packaging: Tube Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 1.5KB (1.5K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 6x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 16-TSSOP Number of I/O: 13 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74HC367D,652 | NXP USA Inc. |
Description: IC BUFF 2V/6V 16-SO Packaging: Tube Package / Case: 16-SOIC (0.154", 3.90mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Number of Bits per Element: 2, 4 (Hex) Current - Output High, Low: 7.8mA, 7.8mA Supplier Device Package: 16-SO |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74HC367DB,112 | NXP USA Inc. |
Description: IC BUFF 2V/6V 16-SSOP Packaging: Tube Package / Case: 16-SSOP (0.209", 5.30mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Number of Bits per Element: 2, 4 (Hex) Current - Output High, Low: 7.8mA, 7.8mA Supplier Device Package: 16-SSOP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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P1016NSE5FFB | NXP USA Inc. |
Description: IC MPU QORIQ P1 667MHZ 561TEPBGA Packaging: Tray Package / Case: 561-FBGA Mounting Type: Surface Mount Speed: 667MHz Operating Temperature: 0°C ~ 125°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 561-TEPBGA I (23x23) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 3.3 RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, I2C, MMC/SD, SPI |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| Z0109MA,412 | NXP USA Inc. |
Description: TRIAC SENS GATE 600V 1A TO92-3 Packaging: Bulk Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads Mounting Type: Through Hole Triac Type: Logic - Sensitive Gate Configuration: Single Operating Temperature: 125°C (TJ) Current - Hold (Ih) (Max): 10 mA Current - Gate Trigger (Igt) (Max): 10 mA Current - Non Rep. Surge 50, 60Hz (Itsm): 8A, 8.5A Voltage - Gate Trigger (Vgt) (Max): 1.3 V Supplier Device Package: TO-92-3 Current - On State (It (RMS)) (Max): 1 A Voltage - Off State: 600 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| Z0109NA,412 | NXP USA Inc. |
Description: TRIAC SENS GATE 800V 1A TO92-3 Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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MC7447AHX1000LB | NXP USA Inc. |
Description: IC MPU MPC74XX 1.0GHZ 360FCCBGA Packaging: Tray Package / Case: 360-BCBGA, FCCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G4 Voltage - I/O: 1.8V, 2.5V Supplier Device Package: 360-FCCBGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 44 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC33910G5AC | NXP USA Inc. |
Description: IC SYSTEM BASIS CHIP 32LQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 5.5V ~ 27V Applications: System Basis Chip Current - Supply: 4.5mA Supplier Device Package: 32-LQFP (7x7) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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LS2084ASN7TTB | NXP USA Inc. |
Description: IC MPU QORIQ 1.8GHZ 1292FCPBGA Packaging: Tray Package / Case: 1292-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.8GHz Operating Temperature: 0°C ~ 105°C Core Processor: ARM® Cortex®-A72 Supplier Device Package: 1292-FCPBGA (37.5x37.5) Ethernet: 10GbE (8) or 1GbE (16) & 2.5GbE (1) USB: USB 3.0 (2) + PHY Number of Cores/Bus Width: 8 Core, 64-Bit RAM Controllers: DDR4 Security Features: Secure Boot, TrustZone® SATA: SATA (2) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 21 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MPC8536EBVTAVLA | NXP USA Inc. |
Description: IC MPU MPC85XX 1.5GHZ 783FCPBGA Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.5GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Security Features: Cryptography SATA: SATA 3Gbps (2) Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MPC8536AVTAULA | NXP USA Inc. |
Description: IC MPU MPC85XX 1.333GHZ 783BGA Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.333GHz Operating Temperature: 0°C ~ 90°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (3) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, DDR3 Graphics Acceleration: No SATA: SATA 3Gbps (2) Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MFS2613HMDAAAD | NXP USA Inc. |
Description: SAFETY SYSTEM BASIS CHIP WITH LO Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3.2V ~ 36V Applications: System Basis Chip Current - Supply: 30µA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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PBSS5140T,215 | NXP USA Inc. |
Description: TRANS PNP 40V 1A SOT23 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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|
74HCT00D,652 | NXP USA Inc. |
Description: IC GATE NAND 4CH 2-INP 14-SO Packaging: Bulk Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 4mA, 4mA Number of Inputs: 2 Supplier Device Package: 14-SO Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 12ns @ 4.5V, 50pF Number of Circuits: 4 Current - Quiescent (Max): 40 µA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
74HCT00N,652 | NXP USA Inc. |
Description: IC GATE NAND 4CH 2-INP 14-DIP Packaging: Tube Package / Case: 14-DIP (0.300", 7.62mm) Mounting Type: Through Hole Logic Type: NAND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 4mA, 4mA Number of Inputs: 2 Supplier Device Package: 14-DIP Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 12ns @ 4.5V, 50pF Number of Circuits: 4 Current - Quiescent (Max): 40 µA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
74LVC16245ADGG,112 | NXP USA Inc. |
Description: IC BUS TXRX TRI-ST 16BIT 48TSSOP Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| DAC1203D160HW/C1:5 |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 119 Stücke
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| DAC1405D650HW/C1,5 |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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| DAC1403D160HW/C1,5 |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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| DAC1005D650HW/C1,5 |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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| DAC1403D160HW/C1:5 |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 119 Stücke
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| DAC1205D650HW/C1,5 |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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| DAC1408D750HN/C1:5 |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 260 Stücke
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| DAC1405D750HW/C1,5 |
|
Produkt ist nicht verfügbar
Mindestbestellmenge: 90 Stücke
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| MPC857TVR66B |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC33972TEWR2 |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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| MC33972TEWR2 |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC
auf Bestellung 894 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 9.07 EUR |
| 10+ | 6.91 EUR |
| 25+ | 6.37 EUR |
| 100+ | 5.77 EUR |
| 250+ | 5.49 EUR |
| 500+ | 5.4 EUR |
| 74HC03D,653 |
|
Hersteller: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14-SO
Packaging: Tape & Reel (TR)
Features: Open Drain
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: -, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Description: IC GATE NAND 4CH 2-INP 14-SO
Packaging: Tape & Reel (TR)
Features: Open Drain
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: -, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HC03D,652 |
|
Hersteller: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14-SO
Packaging: Tube
Features: Open Drain
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: -, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Description: IC GATE NAND 4CH 2-INP 14-SO
Packaging: Tube
Features: Open Drain
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: -, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MIMX8ML4DVNLZAB |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8ML 1.8GHZ 548LFBGA
Packaging: Tray
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
Description: IC MPU I.MX8ML 1.8GHZ 548LFBGA
Packaging: Tray
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MIMX8MN5DVPIZDA |
|
Hersteller: NXP USA Inc.
Description: MIMX8MN5DVPIZDA
Packaging: Tray
Package / Case: 306-TFBGA
Speed: 1.4GHz, 750MHz
RAM Size: 544kB
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Connectivity: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 306-TFBGA (11x11)
Architecture: MPU
Description: MIMX8MN5DVPIZDA
Packaging: Tray
Package / Case: 306-TFBGA
Speed: 1.4GHz, 750MHz
RAM Size: 544kB
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Connectivity: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 306-TFBGA (11x11)
Architecture: MPU
auf Bestellung 168 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 49.11 EUR |
| 10+ | 39.52 EUR |
| 25+ | 37.13 EUR |
| 168+ | 33.75 EUR |
| 74HC160DB,112 |
|
Hersteller: NXP USA Inc.
Description: IC SYNC BCD DECADE COUNTR 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-SSOP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 66 MHz
Number of Bits per Element: 4
Description: IC SYNC BCD DECADE COUNTR 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-SSOP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 66 MHz
Number of Bits per Element: 4
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HC160D,653 |
|
Hersteller: NXP USA Inc.
Description: IC SYNC BCD DECADE COUNT 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 66 MHz
Number of Bits per Element: 4
Description: IC SYNC BCD DECADE COUNT 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 66 MHz
Number of Bits per Element: 4
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCF51QM64VLF |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 2x16b, 12x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 35
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 2x16b, 12x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 35
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SL3S1205FUD/HAZ |
|
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 840-960MHZ WAFER
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 840MHz ~ 960MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Standards: EPC
Supplier Device Package: Wafer
Description: IC RFID TRANSP 840-960MHZ WAFER
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 840MHz ~ 960MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Standards: EPC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HCT4020N,652 |
|
Hersteller: NXP USA Inc.
Description: IC BINARY COUNTER 14-BIT 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 16-DIP
Voltage - Supply: 4.5 V ~ 5.5 V
Count Rate: 47 MHz
Number of Bits per Element: 14
Description: IC BINARY COUNTER 14-BIT 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 16-DIP
Voltage - Supply: 4.5 V ~ 5.5 V
Count Rate: 47 MHz
Number of Bits per Element: 14
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HC42D,653 |
|
Hersteller: NXP USA Inc.
Description: IC DECODER 1 X 4:10 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 4:10
Type: Decoder
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Description: IC DECODER 1 X 4:10 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 4:10
Type: Decoder
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HC423D,652 |
|
Hersteller: NXP USA Inc.
Description: IC MMV 2-CIR 20-NS 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 20 ns
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Schmitt Trigger Input: No
Supplier Device Package: 16-SO
Voltage - Supply: 2 V ~ 6 V
Description: IC MMV 2-CIR 20-NS 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 20 ns
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Schmitt Trigger Input: No
Supplier Device Package: 16-SO
Voltage - Supply: 2 V ~ 6 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8378CVRAGDA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ PBGA689
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Description: IC MPU MPC83XX 400MHZ PBGA689
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
auf Bestellung 1965 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 148.67 EUR |
| 74HCT257PW,112 |
|
Hersteller: NXP USA Inc.
Description: IC MULTIPLEXER 4 X 2:1 16-TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 6mA, 6mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
Description: IC MULTIPLEXER 4 X 2:1 16-TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 6mA, 6mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MC908QY2AMDTE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 1.5KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HC367D,652 |
|
Hersteller: NXP USA Inc.
Description: IC BUFF 2V/6V 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 16-SO
Description: IC BUFF 2V/6V 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 16-SO
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| 74HC367DB,112 |
|
Hersteller: NXP USA Inc.
Description: IC BUFF 2V/6V 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 16-SSOP
Description: IC BUFF 2V/6V 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 16-SSOP
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| P1016NSE5FFB |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 667MHZ 561TEPBGA
Packaging: Tray
Package / Case: 561-FBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 561-TEPBGA I (23x23)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Description: IC MPU QORIQ P1 667MHZ 561TEPBGA
Packaging: Tray
Package / Case: 561-FBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 561-TEPBGA I (23x23)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, SPI
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| Z0109MA,412 |
|
Hersteller: NXP USA Inc.
Description: TRIAC SENS GATE 600V 1A TO92-3
Packaging: Bulk
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Triac Type: Logic - Sensitive Gate
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 10 mA
Current - Gate Trigger (Igt) (Max): 10 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 8A, 8.5A
Voltage - Gate Trigger (Vgt) (Max): 1.3 V
Supplier Device Package: TO-92-3
Current - On State (It (RMS)) (Max): 1 A
Voltage - Off State: 600 V
Description: TRIAC SENS GATE 600V 1A TO92-3
Packaging: Bulk
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Triac Type: Logic - Sensitive Gate
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 10 mA
Current - Gate Trigger (Igt) (Max): 10 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 8A, 8.5A
Voltage - Gate Trigger (Vgt) (Max): 1.3 V
Supplier Device Package: TO-92-3
Current - On State (It (RMS)) (Max): 1 A
Voltage - Off State: 600 V
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| MC7447AHX1000LB |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 1.0GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Description: IC MPU MPC74XX 1.0GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
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| MC33910G5AC |
|
Hersteller: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
Description: IC SYSTEM BASIS CHIP 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
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| LS2084ASN7TTB |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.8GHZ 1292FCPBGA
Packaging: Tray
Package / Case: 1292-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Ethernet: 10GbE (8) or 1GbE (16) & 2.5GbE (1)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA (2)
Description: IC MPU QORIQ 1.8GHZ 1292FCPBGA
Packaging: Tray
Package / Case: 1292-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Ethernet: 10GbE (8) or 1GbE (16) & 2.5GbE (1)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA (2)
Produkt ist nicht verfügbar
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| MPC8536EBVTAVLA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.5GHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Description: IC MPU MPC85XX 1.5GHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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| MPC8536AVTAULA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 783BGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 90°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Description: IC MPU MPC85XX 1.333GHZ 783BGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 90°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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| MFS2613HMDAAAD |
|
Hersteller: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
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| 74HCT00D,652 |
|
Hersteller: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14-SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 12ns @ 4.5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
Description: IC GATE NAND 4CH 2-INP 14-SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 12ns @ 4.5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
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| 74HCT00N,652 |
|
Hersteller: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 12ns @ 4.5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
Description: IC GATE NAND 4CH 2-INP 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 12ns @ 4.5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
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