Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35708) > Seite 589 nach 596
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| BTA412Y-600C,127 | NXP USA Inc. |
 Description: TRIAC 600V 12A TO220AB-3Packaging: Tube |
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| BTA416Y-600B,127 | NXP USA Inc. |
Description: TRIAC 600V 16A TO220AB Packaging: Tube |
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PCA9501D,118 | NXP USA Inc. |
Description: IC XPNDR 400KHZ I2C SMBUS 20SO Features: EEPROM, POR Packaging: Tape & Reel (TR) Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Interface: I2C, SMBus Number of I/O: 8 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.5V ~ 3.6V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 20-SO Current - Output Source/Sink: 100µA, 25mA DigiKey Programmable: Not Verified |
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PEMI6QFN/HT,132 | NXP USA Inc. |
Description: FILTER RC(PI) 45 OHMS ESD SMD Packaging: Tape & Reel (TR) Package / Case: 12-XFDFN Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 45Ohms, C = 23pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 20dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 45 ESD Protection: Yes Number of Channels: 6 |
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CLRD710,599 | NXP USA Inc. |
Description: CARD READER MIFARE Packaging: Box Frequency: 13.56MHz Interface: Ethernet, RS 232, RS 422, RS 485, USB Type: Read/Write Standards: ISO 14443 |
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MPC555LFAZP40 | NXP USA Inc. |
Description: IC MCU 32BIT 448KB FLASH 272PBGA Packaging: Tray Package / Case: 272-BBGA Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 448KB (448K x 8) RAM Size: 26K x 8 Operating Temperature: -55°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: PowerPC Data Converters: A/D 32x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 272-PBGA (27x27) Number of I/O: 101 DigiKey Programmable: Not Verified |
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| SPC5747CFK0ACKU6 | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 80MHz, 160MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 48x10b, 16x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 129 DigiKey Programmable: Not Verified |
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| BCP53,115 | NXP USA Inc. |
Description: TRANSISTOR PNP 80V 1A SOT-223 Packaging: Tape & Reel (TR) |
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| MAC97A8,412 | NXP USA Inc. |
 Description: TRIAC SENS GATE 600V 0.6A TO92-3Packaging: Bulk |
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| SAF4000EL/101Q53BK | NXP USA Inc. |
Description: AUDIO DSPS SAF4000EL/101Q5342 Packaging: Tray |
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MC68HC16Z1MAG16 | NXP USA Inc. |
Description: IC MCU 16BIT ROMLESS 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 16MHz RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: CPU16 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 16 DigiKey Programmable: Not Verified |
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| BT152-600R,127 | NXP USA Inc. |
Description: THYRISTOR 20A 650V TO220AB Packaging: Tube |
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| Z0107NA,412 | NXP USA Inc. |
Description: TRIAC SENS GATE 800V 1A TO92-3 Packaging: Bulk |
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MC25XS6300BEKR2 | NXP USA Inc. |
Description: IC SWITCH HIGH SIDE 32SOIC Features: Status Flag Packaging: Tape & Reel (TR) Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Number of Outputs: 3 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 25mOhm Voltage - Load: 7V ~ 18V Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Current - Output (Max): 4.5A Supplier Device Package: 32-SOIC-EP Fault Protection: Open Load Detect, Over Temperature |
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N74F02N,602 | NXP USA Inc. |
Description: IC GATE NOR 4CH 2-INP 14DIP Packaging: Tube Package / Case: 14-DIP (0.300", 7.62mm) Mounting Type: Through Hole Logic Type: NOR Gate Operating Temperature: 0°C ~ 70°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 1mA, 20mA Number of Inputs: 2 Supplier Device Package: 14-DIP Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 5.5ns @ 5V, 50pF Number of Circuits: 4 |
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| BC846BS,115 | NXP USA Inc. |
Description: TRANS 2NPN 65V 0.1A 6TSSOP Packaging: Tape & Reel (TR) |
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| BC857BS,115 | NXP USA Inc. |
Description: TRANS 2PNP 45V 0.1A 6TSSOP Packaging: Tape & Reel (TR) |
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| BCM856BS,115 | NXP USA Inc. |
Description: TRANS 2PNP 65V 0.1A 6TSSOP Packaging: Tape & Reel (TR) |
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| BCM857BS,115 | NXP USA Inc. |
Description: TRANS 2PNP 45V 0.1A 6TSSOP Packaging: Tape & Reel (TR) |
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MFS8612BMDA0ESR2 | NXP USA Inc. |
Description: SAFETY SYSTEM BASIS CHIP FOR DOM Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: Camera Supplier Device Package: 48-HVQFN (7x7) Grade: Automotive Qualification: AEC-Q100 |
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MC68331CEH16 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 132PQFP Packaging: Tray Package / Case: 132-BQFP Bumpered Mounting Type: Surface Mount Speed: 16MHz Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: CPU32 Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 132-PQFP (24.13x24.13) Number of I/O: 18 DigiKey Programmable: Not Verified |
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74HC377D,652 | NXP USA Inc. |
Description: IC FF D-TYPE SINGLE 8-BIT 20-SO Packaging: Tube Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: Non-Inverted Mounting Type: Surface Mount Number of Elements: 1 Function: Standard Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Current - Quiescent (Iq): 8 µA Current - Output High, Low: 5.2mA, 5.2mA Trigger Type: Positive Edge Clock Frequency: 83 MHz Input Capacitance: 3.5 pF Supplier Device Package: 20-SO Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF Number of Bits per Element: 8 |
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74HC377PW,118 | NXP USA Inc. |
Description: IC FF D-TYPE SGL 8-BIT 20-TSSOP Packaging: Tape & Reel (TR) Package / Case: 20-TSSOP (0.173", 4.40mm Width) Output Type: Non-Inverted Mounting Type: Surface Mount Number of Elements: 1 Function: Standard Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Current - Quiescent (Iq): 8 µA Current - Output High, Low: 5.2mA, 5.2mA Trigger Type: Positive Edge Clock Frequency: 83 MHz Input Capacitance: 3.5 pF Supplier Device Package: 20-TSSOP Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF Number of Bits per Element: 8 |
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74HC377D,653 | NXP USA Inc. |
Description: IC FF D-TYPE SINGLE 8-BIT 20-SO Packaging: Tape & Reel (TR) Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: Non-Inverted Mounting Type: Surface Mount Number of Elements: 1 Function: Standard Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Current - Quiescent (Iq): 8 µA Current - Output High, Low: 5.2mA, 5.2mA Trigger Type: Positive Edge Clock Frequency: 83 MHz Input Capacitance: 3.5 pF Supplier Device Package: 20-SO Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF Number of Bits per Element: 8 |
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74HC377PW,112 | NXP USA Inc. |
Description: IC FF D-TYPE SGL 8-BIT 20-TSSOP Packaging: Tube Package / Case: 20-TSSOP (0.173", 4.40mm Width) Output Type: Non-Inverted Mounting Type: Surface Mount Number of Elements: 1 Function: Standard Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Current - Quiescent (Iq): 8 µA Current - Output High, Low: 5.2mA, 5.2mA Trigger Type: Positive Edge Clock Frequency: 83 MHz Input Capacitance: 3.5 pF Supplier Device Package: 20-TSSOP Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF Number of Bits per Element: 8 |
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74AHC377PW,118 | NXP USA Inc. |
Description: IC OCT D FF POS-EDG TRIG 20TSSOP Packaging: Tape & Reel (TR) |
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74AHC377D,118 | NXP USA Inc. |
Description: IC D-TYPE POS TRG SNGL 20SOIC Packaging: Tape & Reel (TR) |
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74AHC377PW,112 | NXP USA Inc. |
Description: IC OCTAL D F-F POS-EDG 20-TSSOP Packaging: Tube |
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74AHC377D,112 | NXP USA Inc. |
Description: IC D-TYPE POS TRG SNGL 20SOIC Packaging: Tube |
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74HC377DB,118 | NXP USA Inc. |
Description: IC FF D-TYPE SINGLE 8BIT 20SSOP Packaging: Tape & Reel (TR) Package / Case: 20-SSOP (0.209", 5.30mm Width) Output Type: Non-Inverted Mounting Type: Surface Mount Number of Elements: 1 Function: Standard Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Current - Quiescent (Iq): 8 µA Current - Output High, Low: 5.2mA, 5.2mA Trigger Type: Positive Edge Clock Frequency: 83 MHz Input Capacitance: 3.5 pF Supplier Device Package: 20-SSOP Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF Number of Bits per Element: 8 |
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74HC377DB,112 | NXP USA Inc. |
Description: IC FF D-TYPE SINGLE 8BIT 20SSOP Packaging: Tube Package / Case: 20-SSOP (0.209", 5.30mm Width) Output Type: Non-Inverted Mounting Type: Surface Mount Number of Elements: 1 Function: Standard Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Current - Quiescent (Iq): 8 µA Current - Output High, Low: 5.2mA, 5.2mA Trigger Type: Positive Edge Clock Frequency: 83 MHz Input Capacitance: 3.5 pF Supplier Device Package: 20-SSOP Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF Number of Bits per Element: 8 |
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74LVC4066BQ,115 | NXP USA Inc. |
Description: IC SWITCH QUAD SPST 14DHVQFN Packaging: Tape & Reel (TR) |
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74LVC4066D,118 | NXP USA Inc. |
Description: IC SWITCH QUAD SPST 14SOIC Packaging: Tape & Reel (TR) |
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74LVC4066PW,118 | NXP USA Inc. |
Description: IC SWITCH QUAD SPST 14TSSOP Packaging: Tape & Reel (TR) |
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74LVC4066PW,112 | NXP USA Inc. |
Description: IC SWITCH QUAD SPST 14TSSOP Packaging: Tube |
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OM11043,598 | NXP USA Inc. |
Description: MBED LPC176X DEV EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s) Core Processor: ARM® Cortex®-M3 Utilized IC / Part: LPC1768 Platform: mbed |
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1N4742A,113 | NXP USA Inc. |
Description: DIODE ZENER 12V 1W DO41 Packaging: Tape & Reel (TR) |
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LD6806CX4/18P,315 | NXP USA Inc. |
Description: IC REG LINEAR 1.8V 200MA 4-WLCSP Packaging: Tape & Reel (TR) Package / Case: 4-XFBGA, WLCSP Output Type: Fixed Mounting Type: Surface Mount Current - Output: 200mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 4-WLCSP (0.76x0.76) Voltage - Output (Min/Fixed): 1.8V Control Features: Enable PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.1V @ 200mA Protection Features: Over Current, Over Temperature Current - Supply (Max): 250 µA |
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TJA1041T/N1,112 | NXP USA Inc. |
Description: IC CAN TRANSCEIVER HS 14-SOIC Packaging: Tube Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Voltage - Supply: 4.75V ~ 5.25V Number of Drivers/Receivers: 1/1 Protocol: CANbus Supplier Device Package: 14-SO |
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MMBT2222A,215 | NXP USA Inc. |
Description: TRANS NPN 40V 600MA SOT23 Packaging: Tape & Reel (TR) |
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NTS0102GT,115 | NXP USA Inc. |
Description: IC XLTR VL BIDIR 8-XSON/SOT833-1 Features: Auto-Direction Sensing Packaging: Tape & Reel (TR) Package / Case: 8-XFDFN Output Type: Open Drain, Tri-State Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 50Mbps Supplier Device Package: 8-XSON, SOT833-1 (1.95x1) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 2 Voltage - VCCA: 1.65 V ~ 3.6 V Voltage - VCCB: 2.3 V ~ 5.5 V Number of Circuits: 1 |
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MC68332ACEH25 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 132PQFP Packaging: Tray Package / Case: 132-BQFP Bumpered Mounting Type: Surface Mount Speed: 25MHz RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: CPU32 Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 132-PQFP (24.13x24.13) Number of I/O: 15 DigiKey Programmable: Not Verified |
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1N4744A,113 | NXP USA Inc. |
Description: DIODE ZENER 15V 1W DO41 Packaging: Tape & Reel (TR) |
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ADC0804S030TS/C1,1 | NXP USA Inc. |
Description: IC ADC 8BIT PAR 30MHZ 28-SSOP Packaging: Tape & Reel (TR) |
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ADC0804S040TS/C1,1 | NXP USA Inc. |
Description: IC ADC 8BIT PAR 40MHZ 28-SSOP Packaging: Tape & Reel (TR) |
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ADC0804S050TS/C1,1 | NXP USA Inc. |
Description: IC ADC 8BIT PAR 50MHZ 28-SSOP Packaging: Tape & Reel (TR) |
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| ADC0804S050/DB | NXP USA Inc. |
Description: BOARD EVALUATION FOR ADC0804S050 Packaging: Box |
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KTY81/110,112 | NXP USA Inc. |
Description: SENSOR PTC 1KOHM PBCYT2 Packaging: Bulk Package / Case: TO-226-2, TO-92-2 (TO-226AC) Mounting Type: Through Hole Operating Temperature: -55°C ~ 150°C Supplier Device Package: PBCYT2 Resistance @ 25°C: 1 kOhms |
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74LVC138APW,112 | NXP USA Inc. |
Description: IC 3-8 DECOD/DEMUX INV 16TSSOP Packaging: Tube |
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74LVC138ADB,118 | NXP USA Inc. |
Description: IC 3-8 DECOD/DEMUX INV 16SSOP Packaging: Tape & Reel (TR) |
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74LVC138AD,112 | NXP USA Inc. |
Description: IC DECODER/DEMUX 3-8 INV 16SOIC Packaging: Tube |
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74LVC138APW,118 | NXP USA Inc. |
Description: IC 3-8 DECOD/DEMUX INV 16-TSSOP Packaging: Tape & Reel (TR) |
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74LVC138ADB,112 | NXP USA Inc. |
Description: IC 3-8 DECOD/DEMUX INV 16SSOP Packaging: Tube |
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BAS70-04,215 | NXP USA Inc. |
Description: DIODE SCHOTTKY 70V 70MA TO236AB Packaging: Tape & Reel (TR) |
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BAS70-04W,115 | NXP USA Inc. |
Description: DIODE SCHOTTKY 70V 70MA SOT323 Packaging: Tape & Reel (TR) |
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| BAV199,235 | NXP USA Inc. |
Description: DIODE ARRAY 75V 160MA TO236AB Packaging: Tape & Reel (TR) |
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BAV199W,115 | NXP USA Inc. |
Description: DIODE ARRAY 75V 110MA SOT323 Packaging: Tape & Reel (TR) |
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IP4283CZ10-TB,115 | NXP USA Inc. |
Description: TVS DIODE 5.5VWM 9.5VC 10XSONU Packaging: Tape & Reel (TR) Package / Case: 10-XFDFN Mounting Type: Surface Mount Type: Steering (Rail to Rail) Operating Temperature: -40°C ~ 85°C (TA) Applications: HDMI Voltage - Reverse Standoff (Typ): 5.5V Supplier Device Package: 10-XSONU (2.5x1) Unidirectional Channels: 4 Voltage - Breakdown (Min): 6V Voltage - Clamping (Max) @ Ipp: 9.5V (Typ) Power Line Protection: Yes |
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IP4283CZ10-TB,115 | NXP USA Inc. |
Description: TVS DIODE 5.5VWM 9.5VC 10XSONU Packaging: Cut Tape (CT) Package / Case: 10-XFDFN Mounting Type: Surface Mount Type: Steering (Rail to Rail) Operating Temperature: -40°C ~ 85°C (TA) Applications: HDMI Voltage - Reverse Standoff (Typ): 5.5V Supplier Device Package: 10-XSONU (2.5x1) Unidirectional Channels: 4 Voltage - Breakdown (Min): 6V Voltage - Clamping (Max) @ Ipp: 9.5V (Typ) Power Line Protection: Yes |
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LPC1115JBD48/303QL | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 42 DigiKey Programmable: Not Verified |
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| PCA9501D,118 |
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Hersteller: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C SMBUS 20SO
Features: EEPROM, POR
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 20-SO
Current - Output Source/Sink: 100µA, 25mA
DigiKey Programmable: Not Verified
Description: IC XPNDR 400KHZ I2C SMBUS 20SO
Features: EEPROM, POR
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 20-SO
Current - Output Source/Sink: 100µA, 25mA
DigiKey Programmable: Not Verified
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| PEMI6QFN/HT,132 |
|
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 45 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 20dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 6
Description: FILTER RC(PI) 45 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 20dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 6
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| CLRD710,599 |
|
Hersteller: NXP USA Inc.
Description: CARD READER MIFARE
Packaging: Box
Frequency: 13.56MHz
Interface: Ethernet, RS 232, RS 422, RS 485, USB
Type: Read/Write
Standards: ISO 14443
Description: CARD READER MIFARE
Packaging: Box
Frequency: 13.56MHz
Interface: Ethernet, RS 232, RS 422, RS 485, USB
Type: Read/Write
Standards: ISO 14443
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| MPC555LFAZP40 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 448KB FLASH 272PBGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 448KB (448K x 8)
RAM Size: 26K x 8
Operating Temperature: -55°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 272-PBGA (27x27)
Number of I/O: 101
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 448KB FLASH 272PBGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 448KB (448K x 8)
RAM Size: 26K x 8
Operating Temperature: -55°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 272-PBGA (27x27)
Number of I/O: 101
DigiKey Programmable: Not Verified
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| SPC5747CFK0ACKU6 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 48x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 48x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
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| MC68HC16Z1MAG16 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU16
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 16
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU16
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 16
DigiKey Programmable: Not Verified
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| MC25XS6300BEKR2 |
|
Hersteller: NXP USA Inc.
Description: IC SWITCH HIGH SIDE 32SOIC
Features: Status Flag
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 3
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 25mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 4.5A
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
Description: IC SWITCH HIGH SIDE 32SOIC
Features: Status Flag
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 3
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 25mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 4.5A
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
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| N74F02N,602 |
|
Hersteller: NXP USA Inc.
Description: IC GATE NOR 4CH 2-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NOR Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5.5ns @ 5V, 50pF
Number of Circuits: 4
Description: IC GATE NOR 4CH 2-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NOR Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5.5ns @ 5V, 50pF
Number of Circuits: 4
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| MFS8612BMDA0ESR2 |
|
Hersteller: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
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| MC68331CEH16 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 18
DigiKey Programmable: Not Verified
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| 74HC377D,652 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SINGLE 8-BIT 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
Description: IC FF D-TYPE SINGLE 8-BIT 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
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| 74HC377PW,118 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SGL 8-BIT 20-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
Description: IC FF D-TYPE SGL 8-BIT 20-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
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| 74HC377D,653 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SINGLE 8-BIT 20-SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
Description: IC FF D-TYPE SINGLE 8-BIT 20-SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
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| 74HC377PW,112 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SGL 8-BIT 20-TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
Description: IC FF D-TYPE SGL 8-BIT 20-TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
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| 74HC377DB,118 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SINGLE 8BIT 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
Description: IC FF D-TYPE SINGLE 8BIT 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
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| 74HC377DB,112 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SINGLE 8BIT 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
Description: IC FF D-TYPE SINGLE 8BIT 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
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| OM11043,598 |
|
Hersteller: NXP USA Inc.
Description: MBED LPC176X DEV EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M3
Utilized IC / Part: LPC1768
Platform: mbed
Description: MBED LPC176X DEV EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M3
Utilized IC / Part: LPC1768
Platform: mbed
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| LD6806CX4/18P,315 |
|
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.8V 200MA 4-WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.8V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.1V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 1.8V 200MA 4-WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.8V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.1V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
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| TJA1041T/N1,112 |
|
Hersteller: NXP USA Inc.
Description: IC CAN TRANSCEIVER HS 14-SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Description: IC CAN TRANSCEIVER HS 14-SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Produkt ist nicht verfügbar
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| NTS0102GT,115 |
|
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-XSON/SOT833-1
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Number of Circuits: 1
Description: IC XLTR VL BIDIR 8-XSON/SOT833-1
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Number of Circuits: 1
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| MC68332ACEH25 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 15
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 15
DigiKey Programmable: Not Verified
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| KTY81/110,112 |
|
Hersteller: NXP USA Inc.
Description: SENSOR PTC 1KOHM PBCYT2
Packaging: Bulk
Package / Case: TO-226-2, TO-92-2 (TO-226AC)
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: PBCYT2
Resistance @ 25°C: 1 kOhms
Description: SENSOR PTC 1KOHM PBCYT2
Packaging: Bulk
Package / Case: TO-226-2, TO-92-2 (TO-226AC)
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: PBCYT2
Resistance @ 25°C: 1 kOhms
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| IP4283CZ10-TB,115 |
|
Hersteller: NXP USA Inc.
Description: TVS DIODE 5.5VWM 9.5VC 10XSONU
Packaging: Tape & Reel (TR)
Package / Case: 10-XFDFN
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -40°C ~ 85°C (TA)
Applications: HDMI
Voltage - Reverse Standoff (Typ): 5.5V
Supplier Device Package: 10-XSONU (2.5x1)
Unidirectional Channels: 4
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 9.5V (Typ)
Power Line Protection: Yes
Description: TVS DIODE 5.5VWM 9.5VC 10XSONU
Packaging: Tape & Reel (TR)
Package / Case: 10-XFDFN
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -40°C ~ 85°C (TA)
Applications: HDMI
Voltage - Reverse Standoff (Typ): 5.5V
Supplier Device Package: 10-XSONU (2.5x1)
Unidirectional Channels: 4
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 9.5V (Typ)
Power Line Protection: Yes
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| IP4283CZ10-TB,115 |
|
Hersteller: NXP USA Inc.
Description: TVS DIODE 5.5VWM 9.5VC 10XSONU
Packaging: Cut Tape (CT)
Package / Case: 10-XFDFN
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -40°C ~ 85°C (TA)
Applications: HDMI
Voltage - Reverse Standoff (Typ): 5.5V
Supplier Device Package: 10-XSONU (2.5x1)
Unidirectional Channels: 4
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 9.5V (Typ)
Power Line Protection: Yes
Description: TVS DIODE 5.5VWM 9.5VC 10XSONU
Packaging: Cut Tape (CT)
Package / Case: 10-XFDFN
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -40°C ~ 85°C (TA)
Applications: HDMI
Voltage - Reverse Standoff (Typ): 5.5V
Supplier Device Package: 10-XSONU (2.5x1)
Unidirectional Channels: 4
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 9.5V (Typ)
Power Line Protection: Yes
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| LPC1115JBD48/303QL |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
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