Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35486) > Seite 592 nach 592
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MFS2401AVMAFESR2 | NXP USA Inc. |
 Description: ICPackaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 115°C (TA) Voltage - Supply: 5.5V ~ 40V Applications: System Basis Chip Supplier Device Package: 32-HVQFN (5x5) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MFS2401AVMAFES | NXP USA Inc. |
Description: IC Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 115°C (TA) Voltage - Supply: 5.5V ~ 40V Applications: System Basis Chip Supplier Device Package: 32-HVQFN (5x5) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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| MBMI7014TA2AER2 | NXP USA Inc. |
Description: IC Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| SFS2633AMDDZADR2 | NXP USA Inc. |
Description: AUTO SBC Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| SFS2633AMDDZAD | NXP USA Inc. |
Description: AUTO SBC Packaging: Tray |
Produkt ist nicht verfügbar |
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MBMI7014TA2AE | NXP USA Inc. |
Description: IC Packaging: Tray Package / Case: 64-LQFP Exposed Pad Number of Cells: 7 ~ 14 Mounting Type: Surface Mount Function: Multi-Function Controller Interface: I2C, SPI Operating Temperature: -40°C ~ 150°C (TJ) Battery Chemistry: Lithium Ion Supplier Device Package: 64-LQFP (10x10) Fault Protection: Over Temperature, Over/Under Voltage |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| MCXN235VDFR | NXP USA Inc. |
Description: IC Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| SC33FS8520DVKSR2 | NXP USA Inc. |
Description: FS8500 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| MIMX9101DVXXCAB | NXP USA Inc. |
Description: IC MCU Packaging: Bulk Package / Case: 208-VFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A55 Supplier Device Package: 208-FCBGA (15x15) Ethernet: GbE (1) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: RGB Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| MIMX9101CVXXCAB | NXP USA Inc. |
Description: IC MCU Packaging: Bulk Package / Case: 208-VFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A55 Supplier Device Package: 208-FCBGA (15x15) Ethernet: GbE (1) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: RGB Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| MIMX9121DVVXCAB | NXP USA Inc. |
Description: IC MCU Packaging: Bulk Package / Case: 306-LFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A55 Supplier Device Package: 306-LFBGA (11x11) Ethernet: GbE (2) USB: USB 2.0 (2) Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: RGB Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| MIMX9121CVVXCAB | NXP USA Inc. |
Description: IC MCU Packaging: Bulk Package / Case: 306-LFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A55 Supplier Device Package: 306-LFBGA (11x11) Ethernet: GbE (2) USB: USB 2.0 (2) Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: RGB Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| MIMX9111DVXXJAB | NXP USA Inc. |
Description: IC MCU Packaging: Bulk Package / Case: 208-VFBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A55 Supplier Device Package: 208-FCBGA (15x15) Ethernet: GbE (1) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: RGB Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| MIMX9111CVXXJAB | NXP USA Inc. |
Description: IC MCU Packaging: Bulk Package / Case: 208-VFBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A55 Supplier Device Package: 208-FCBGA (15x15) Ethernet: GbE (1) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: RGB Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART |
Produkt ist nicht verfügbar |
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| MIMX9131DVVXJAB | NXP USA Inc. |
Description: IC MCU Packaging: Bulk Package / Case: 306-LFBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A55 Supplier Device Package: 306-LFBGA (11x11) Ethernet: GbE (2) USB: USB 2.0 (2) Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: RGB Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| MIMX9131CVVXJAB | NXP USA Inc. |
Description: IC MCU Packaging: Bulk Package / Case: 306-LFBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A55 Supplier Device Package: 306-LFBGA (11x11) Ethernet: GbE (2) USB: USB 2.0 (2) Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: RGB Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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MFS2300BMBA0EPR2 | NXP USA Inc. |
Description: MFS2300BMBA0EPR2 Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 5.5V ~ 40V Applications: System Basis Chip Current - Supply: 40µA Supplier Device Package: 48-HVQFN (7x7) |
Produkt ist nicht verfügbar |
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74HC273N,652 | NXP USA Inc. |
Description: IC FF D-TYPE SINGLE 8BIT 20-DIP Packaging: Tube Package / Case: 20-DIP (0.300", 7.62mm) Output Type: Non-Inverted Mounting Type: Through Hole Number of Elements: 1 Function: Master Reset Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Current - Quiescent (Iq): 8 µA Current - Output High, Low: 5.2mA, 5.2mA Trigger Type: Positive Edge Clock Frequency: 122 MHz Input Capacitance: 3.5 pF Supplier Device Package: 20-DIP Max Propagation Delay @ V, Max CL: 26ns @ 6V, 50pF Number of Bits per Element: 8 |
Produkt ist nicht verfügbar |
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MC9S12E256VPVE | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 256KB (256K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HCS12 Data Converters: A/D 16x10b; D/A 2x8b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V Connectivity: EBI/EMI, I2C, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MIMX8UD7DVP08SC | NXP USA Inc. |
Description: I.MX8ULP, DUAL 800MHZ Packaging: Tray Package / Case: 485-LFBGA Mounting Type: Surface Mount Supplier Device Package: 485-LFBGA (15x15) |
auf Bestellung 568 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMX8MN2DVTJZAA | NXP USA Inc. |
Description: IC MPU I.MX8MN 1.5GHZ 486LFBGA Packaging: Tray Package / Case: 486-LFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.5GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A53 Supplier Device Package: 486-LFBGA (14x14) Ethernet: GbE USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M7 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Additional Interfaces: I2C, PCIe, SDHC, SPI, UART |
auf Bestellung 122 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA9460AUKZ | NXP USA Inc. |
Description: POWER MANAGE IC (PMIC) FOR I.MX Packaging: Tape & Reel (TR) Package / Case: 42-UFBGA, WLCSP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 2.7V ~ 5.5V Applications: Microcontroller, MCU Supplier Device Package: 42-WLCSP (2.86x2.46) |
Produkt ist nicht verfügbar |
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PCA9460AUKZ | NXP USA Inc. |
Description: POWER MANAGE IC (PMIC) FOR I.MX Packaging: Cut Tape (CT) Package / Case: 42-UFBGA, WLCSP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 2.7V ~ 5.5V Applications: Microcontroller, MCU Supplier Device Package: 42-WLCSP (2.86x2.46) |
auf Bestellung 3408 Stücke: Lieferzeit 10-14 Tag (e) |
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MC32PF4210A4ESR2 | NXP USA Inc. |
Description: PF4210 Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: 0°C ~ 85°C (TA) Voltage - Supply: 2.8V ~ 4.5V Applications: Audio, Video Supplier Device Package: 56-QFN-EP (8x8) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MC32PF4210A4ES | NXP USA Inc. |
Description: PF4210 Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: 0°C ~ 85°C (TA) Voltage - Supply: 2.8V ~ 4.5V Applications: Audio, Video Supplier Device Package: 56-QFN-EP (8x8) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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PCAL9539AHF,128 | NXP USA Inc. |
Description: IC XPNDR 400KHZ I2C 24HWQFN Features: POR Packaging: Tape & Reel (TR) Package / Case: 24-WFQFN Exposed Pad Output Type: Open Drain, Push-Pull Mounting Type: Surface Mount Interface: I2C Number of I/O: 16 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.65V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 24-HWQFN (4x4) Current - Output Source/Sink: 10mA, 25mA DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| MFS2401AVMAFESR2 |
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Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MFS2401AVMAFES |
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Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Description: IC
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MBMI7014TA2AE |
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Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Multi-Function Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Temperature, Over/Under Voltage
Description: IC
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Multi-Function Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Temperature, Over/Under Voltage
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MIMX9101DVXXCAB |
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Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MIMX9101CVXXCAB |
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Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MIMX9121DVVXCAB |
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Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MIMX9121CVVXCAB |
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Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MIMX9111DVXXJAB |
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Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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| MIMX9111CVXXJAB |
|
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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| MIMX9131DVVXJAB |
|
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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| MIMX9131CVVXJAB |
|
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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| MFS2300BMBA0EPR2 |
|
Hersteller: NXP USA Inc.
Description: MFS2300BMBA0EPR2
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 40µA
Supplier Device Package: 48-HVQFN (7x7)
Description: MFS2300BMBA0EPR2
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 40µA
Supplier Device Package: 48-HVQFN (7x7)
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| 74HC273N,652 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SINGLE 8BIT 20-DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: Non-Inverted
Mounting Type: Through Hole
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 122 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-DIP
Max Propagation Delay @ V, Max CL: 26ns @ 6V, 50pF
Number of Bits per Element: 8
Description: IC FF D-TYPE SINGLE 8BIT 20-DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: Non-Inverted
Mounting Type: Through Hole
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 122 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-DIP
Max Propagation Delay @ V, Max CL: 26ns @ 6V, 50pF
Number of Bits per Element: 8
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| MC9S12E256VPVE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 16x10b; D/A 2x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: EBI/EMI, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 16x10b; D/A 2x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: EBI/EMI, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
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| MIMX8UD7DVP08SC |
|
Hersteller: NXP USA Inc.
Description: I.MX8ULP, DUAL 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
Description: I.MX8ULP, DUAL 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
auf Bestellung 568 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 29.81 EUR |
| 10+ | 23.78 EUR |
| 25+ | 22.28 EUR |
| 100+ | 20.63 EUR |
| 250+ | 19.84 EUR |
| MIMX8MN2DVTJZAA |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MN 1.5GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
Description: IC MPU I.MX8MN 1.5GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 122 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 40.5 EUR |
| 10+ | 32.64 EUR |
| 25+ | 30.67 EUR |
| PCA9460AUKZ |
|
Hersteller: NXP USA Inc.
Description: POWER MANAGE IC (PMIC) FOR I.MX
Packaging: Tape & Reel (TR)
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Microcontroller, MCU
Supplier Device Package: 42-WLCSP (2.86x2.46)
Description: POWER MANAGE IC (PMIC) FOR I.MX
Packaging: Tape & Reel (TR)
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Microcontroller, MCU
Supplier Device Package: 42-WLCSP (2.86x2.46)
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| PCA9460AUKZ |
|
Hersteller: NXP USA Inc.
Description: POWER MANAGE IC (PMIC) FOR I.MX
Packaging: Cut Tape (CT)
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Microcontroller, MCU
Supplier Device Package: 42-WLCSP (2.86x2.46)
Description: POWER MANAGE IC (PMIC) FOR I.MX
Packaging: Cut Tape (CT)
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Microcontroller, MCU
Supplier Device Package: 42-WLCSP (2.86x2.46)
auf Bestellung 3408 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 6.07 EUR |
| 10+ | 4.59 EUR |
| 25+ | 4.22 EUR |
| 100+ | 3.81 EUR |
| 250+ | 3.62 EUR |
| 500+ | 3.5 EUR |
| 1000+ | 3.41 EUR |
| 2500+ | 3.31 EUR |
| MC32PF4210A4ESR2 |
|
Hersteller: NXP USA Inc.
Description: PF4210
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
Description: PF4210
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
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| MC32PF4210A4ES |
|
Hersteller: NXP USA Inc.
Description: PF4210
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
Description: PF4210
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
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| PCAL9539AHF,128 |
|
Hersteller: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C 24HWQFN
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 24-WFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
Description: IC XPNDR 400KHZ I2C 24HWQFN
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 24-WFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
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