Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36266) > Seite 596 nach 605

Wählen Sie Seite:   [  << Vorherige Seite ]  1 60 120 180 240 300 360 420 480 540 591 592 593 594 595 596 597 598 599 600 601 605  [ Nächste Seite >> ]
Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis
PLVA665A,215 NXP USA Inc. PLVA6XXA_SER.pdf Description: DIODE ZENER 6.5V 250MW TO236AB
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
PBLS2001S,115 PBLS2001S,115 NXP USA Inc. PBLS2001S.pdf Description: TRANS PREBIAS 1NPN 1PNP 8-SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Transistor Type: 1 NPN Pre-Biased, 1 PNP
Power - Max: 1.5W
Current - Collector (Ic) (Max): 100mA, 3A
Voltage - Collector Emitter Breakdown (Max): 50V, 20V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 355mV @ 300mA, 3A
Current - Collector Cutoff (Max): 1µA, 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20mA, 5V / 150 @ 2A, 2V
Frequency - Transition: 100MHz
Resistor - Base (R1): 2.2kOhms
Resistor - Emitter Base (R2): 2.2kOhms
Supplier Device Package: 8-SO
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
74HCT259PW,112 74HCT259PW,112 NXP USA Inc. 74HC_HCT259.pdf Description: IC D-TYPE ADDR 1:8 16-TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Standard
Mounting Type: Surface Mount
Circuit: 1:8
Logic Type: D-Type, Addressable
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Delay Time - Propagation: 20ns
Supplier Device Package: 16-TSSOP
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
74HCT259D,652 74HCT259D,652 NXP USA Inc. 74HC_HCT259.pdf Description: IC D-TYPE ADDR 1:8 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Standard
Mounting Type: Surface Mount
Circuit: 1:8
Logic Type: D-Type, Addressable
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Delay Time - Propagation: 20ns
Supplier Device Package: 16-SO
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
74HCT259D,653 74HCT259D,653 NXP USA Inc. 74HC_HCT259.pdf Description: IC D-TYPE ADDR 1:8 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Standard
Mounting Type: Surface Mount
Circuit: 1:8
Logic Type: D-Type, Addressable
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Delay Time - Propagation: 20ns
Supplier Device Package: 16-SO
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MPC8280VVQLDA MPC8280VVQLDA NXP USA Inc. FSCLS05948-1.pdf?t.download=true&u=5oefqw Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
auf Bestellung 177 Stücke:
Lieferzeit 10-14 Tag (e)
1+580.24 EUR
Im Einkaufswagen  Stück im Wert von  UAH
PCF8566T PCF8566T NXP USA Inc. PCF8566.pdf Description: IC LCD DVR UNVRSL LOW-MUX 40VSOP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BCX17,215 NXP USA Inc. BCX17_BCX18.pdf Description: TRANS PNP 500MA 45V SOT23
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BC860C,215 NXP USA Inc. BC859_BC860.pdf Description: TRANSISTOR PNP 45V 100MA SOT23
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BC860B,215 NXP USA Inc. BC859_BC860.pdf Description: TRANSISTOR PNP 45V 100MA SOT23
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
NT2H1311G0DUDZ NXP USA Inc. NTAG213_215_216.pdf Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443
Supplier Device Package: Die
auf Bestellung 78856 Stücke:
Lieferzeit 10-14 Tag (e)
78856+0.21 EUR
Mindestbestellmenge: 78856
Im Einkaufswagen  Stück im Wert von  UAH
NT2H1311G0DUDV NXP USA Inc. NTAG213_215_216.pdf Description: NFC FORUM TYPE 2 TAG COMPLIANT I
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
PBSS4350X,135 PBSS4350X,135 NXP USA Inc. PBSS4350X.pdf Description: TRANS NPN 50V 3A SOT89
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
1N4736A,113 1N4736A,113 NXP USA Inc. 1N4728A_SER.pdf Description: DIODE ZENER 6.8V 1W DO41
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
1N4737A,113 1N4737A,113 NXP USA Inc. 1N4728A_SER.pdf Description: DIODE ZENER 7.5V 1W DO41
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC33596FJAER2 MC33596FJAER2 NXP USA Inc. mc33596.pdf Description: RF RX FSK/OOK 304/315/426 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Sensitivity: -104dBm
Mounting Type: Surface Mount
Frequency: 304MHz, 315MHz, 426MHz, 434MHz, 868MHz, 915MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -20°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V, 4.5V ~ 5.5V
Applications: General Data Transfer
Current - Receiving: 10.3mA
Data Rate (Max): 22.4kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 32-LQFP (5x5)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
PTVS3V3S1UR,115 PTVS3V3S1UR,115 NXP USA Inc. PHGLS22186-1.pdf?t.download=true&u=5oefqw Description: TVS DIODE 3.3VWM 8VC SOD123W
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BLF872,112 NXP USA Inc. BLF872.pdf Description: TRANSISTOR RF LDMOS SOT800
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BZX84-C3V0,215 BZX84-C3V0,215 NXP USA Inc. BZX84_Series.pdf Description: DIODE ZENER 3V 250MW SOT23
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
P2010NXE2KHC NXP USA Inc. FSCLS11436-1.pdf?t.download=true&u=5oefqw Description: QORIQ, 32-BIT POWER ARCH SOC, 1G
Packaging: Bulk
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)
2+248.84 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
PDZ8.2B,115 PDZ8.2B,115 NXP USA Inc. PHGLS19616-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 8.2V 400MW SOD323
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BTA204S-800C,118 NXP USA Inc. BTA204S-800C.pdf Description: TRIAC 800V 4A DPAK
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BT258U-600R,127 NXP USA Inc. bt258u-600r.pdf Description: THYRISTOR 600V 8A IPAK
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BT258X-500R,127 NXP USA Inc. bt258x-500r.pdf Description: THYRISTOR 500V 8A SOT186A
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BT258X-800R,127 NXP USA Inc. bt258x-500r.pdf Description: THYRISTOR 800V 8A SOT186A
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BT258X-600R,127 NXP USA Inc. bt258x-500r.pdf Description: THYRISTOR 600V 8A SOT186A
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BT136S-600D,118 NXP USA Inc. BT136S-600D.pdf Description: TRIAC 600V 4A DPAK
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BT136-600D,127 NXP USA Inc. BT136-600D.pdf Description: TRIAC SENS GATE 600V 4A TO220AB
Packaging: Tube
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BZX84J-B36,115 BZX84J-B36,115 NXP USA Inc. BZX84J_SER.pdf Description: DIODE ZENER 36V 550MW SOD323F
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC9RS08KA8CPJ MC9RS08KA8CPJ NXP USA Inc. MC9RS08KA%284%2C8%29.pdf Description: IC MCU 8BIT 8KB FLASH 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 254 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-DIP
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC9RS08KA8CPG NXP USA Inc. FSCL-S-A0001282037-1.pdf?t.download=true&u=5oefqw Description: IC MCU 8BIT 8KB FLASH 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 254 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-PDIP
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC9S08AC48CFDE MC9S08AC48CFDE NXP USA Inc. MC9S08AC60AD.pdf Description: IC MCU 8BIT 48KB FLASH 48QFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 38
DigiKey Programmable: Not Verified
auf Bestellung 600 Stücke:
Lieferzeit 10-14 Tag (e)
51+8.95 EUR
Mindestbestellmenge: 51
Im Einkaufswagen  Stück im Wert von  UAH
MC9S08AC48CFDE MC9S08AC48CFDE NXP USA Inc. MC9S08AC60AD.pdf Description: IC MCU 8BIT 48KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC11E1CPBE2 MC11E1CPBE2 NXP USA Inc. M68HC11E.pdf Description: IC MCU 8BIT ROMLESS 52TQFP
Packaging: Tray
Package / Case: 52-LQFP
Mounting Type: Surface Mount
Speed: 2MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-TQFP (10x10)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
74HC4049D,653 74HC4049D,653 NXP USA Inc. 74HC4049.pdf Description: IC HEX INV LEVEL SHIFTER 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 16-SO
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
74HC4049D,652 74HC4049D,652 NXP USA Inc. 74HC4049.pdf Description: IC HEX INV LEVEL SHIFTER 16-SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 16-SO
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
74HC4049DB,112 74HC4049DB,112 NXP USA Inc. 74HC4049.pdf Description: IC HEX INV LEVEL SHIFTER 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 16-SSOP
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
74HC4046AD,652 74HC4046AD,652 NXP USA Inc. 74HC_HCT4046A.pdf Description: IC PHASE LOCK LOOP W/VCO 16SOIC
Packaging: Tube
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
74HC4046ADB,112 74HC4046ADB,112 NXP USA Inc. 74HC_HCT4046A.pdf Description: IC PLL W/VCO 16-SSOP
Packaging: Tube
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
74HC4046ADB,118 74HC4046ADB,118 NXP USA Inc. 74HC_HCT4046A.pdf Description: IC PHASE LOCK LOOP W/VCO 16SSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 21MHz
Type: Phase Lock Loop (PLL)
Input: Clock
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 6V
Differential - Input:Output: No/No
Supplier Device Package: 16-SSOP
PLL: Yes
Divider/Multiplier: No/No
Number of Circuits: 1
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LFVBBK77CWC NXP USA Inc. Description: NXP LEAD FREE MPC5777C CSE 2.08
Packaging: Bulk
Accessory Type: Calibration Unit
Utilized IC / Part: MPCxxxx
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC33385DH NXP USA Inc. Description: IC SWITCH QUAD L-SIDE 20-HSOP
Packaging: Tube
Output Type: N-Channel
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Low Side
Rds On (Typ): 250mOhm
Voltage - Load: 4.5V ~ 5.5V
Current - Output (Max): 2A
Ratio - Input:Output: 1:1
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BSC9131NJN1HHHB BSC9131NJN1HHHB NXP USA Inc. BSC9131.pdf Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Bulk
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
auf Bestellung 120 Stücke:
Lieferzeit 10-14 Tag (e)
4+103.6 EUR
Mindestbestellmenge: 4
Im Einkaufswagen  Stück im Wert von  UAH
BSC9131NJN1HHHB BSC9131NJN1HHHB NXP USA Inc. BSC9131.pdf Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Box
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TDF8534HH/N3Y TDF8534HH/N3Y NXP USA Inc. 939775017613.pdf Description: IC AMPLIFIER CLASS D 100HLQFP
Packaging: Cut Tape (CT)
Package / Case: 100-FQFP Exposed Pad
Output Type: 5-Channel
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 5.5V ~ 25V
Max Output Power x Channels @ Load: 80W x 5 @ 4Ohm
Supplier Device Package: 100-HLQFP (14x14)
auf Bestellung 483 Stücke:
Lieferzeit 10-14 Tag (e)
1+63.06 EUR
10+51.42 EUR
25+48.51 EUR
100+46.12 EUR
Im Einkaufswagen  Stück im Wert von  UAH
MC34PF8100CCEP MC34PF8100CCEP NXP USA Inc. PF8100_PF8200.pdf Description: IC POWER MANAGEMENT I.MX8QXP
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC34PF8100CCEPR2 MC34PF8100CCEPR2 NXP USA Inc. PF8100_PF8200.pdf Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
74HC85D,652 74HC85D,652 NXP USA Inc. 74HC_HCT85.pdf Description: IC MAG COMPARATOR 4BIT 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: Active High
Type: Magnitude Comparator
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 16-SO
Max Propagation Delay @ V, Max CL: 33ns @ 6V, 50pF
Output Function: AB
Number of Bits: 4
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
74HC85D,653 74HC85D,653 NXP USA Inc. 74HC_HCT85.pdf Description: IC MAG COMPARATOR 4BIT 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: Active High
Type: Magnitude Comparator
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 16-SO
Max Propagation Delay @ V, Max CL: 33ns @ 6V, 50pF
Output Function: AB
Number of Bits: 4
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
74HC85DB,118 74HC85DB,118 NXP USA Inc. 74HC_HCT85.pdf Description: IC MAG COMPARATOR 4BIT 16-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Output: Active High
Type: Magnitude Comparator
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 16-SSOP
Max Propagation Delay @ V, Max CL: 33ns @ 6V, 50pF
Output Function: AB
Number of Bits: 4
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC33FS4508NAE MC33FS4508NAE NXP USA Inc. FS6500-FS4500-ASILD.pdf Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
2+14.24 EUR
10+11.07 EUR
25+10.28 EUR
100+9.41 EUR
250+8.99 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
MCIMX6L2DVN10AA MCIMX6L2DVN10AA NXP USA Inc. IMX6SLCEC.pdf Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MCIMX6L3DVN10AA MCIMX6L3DVN10AA NXP USA Inc. IMX6SLCEC.pdf Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MCIMX6L7DVN10AA MCIMX6L7DVN10AA NXP USA Inc. IMX6SLCEC.pdf Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MCIMX6L2EVN10AA MCIMX6L2EVN10AA NXP USA Inc. IMX6SLCEC.pdf Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MCIMX6L3EVN10AA MCIMX6L3EVN10AA NXP USA Inc. IMX6SLCEC.pdf Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
NE5234N,602 NE5234N,602 NXP USA Inc. ne5234_sa5234_3.pdf Description: IC OPAMP MATCHED QUAD HP 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: Rail-to-Rail
Mounting Type: Through Hole
Amplifier Type: Standard (General Purpose)
Operating Temperature: 0°C ~ 70°C
Current - Supply: 2.8mA (x4 Channels)
Slew Rate: 0.8V/µs
Current - Input Bias: 25 nA
Voltage - Input Offset: 200 µV
Supplier Device Package: 14-DIP
Number of Circuits: 4
Current - Output / Channel: 12 mA
-3db Bandwidth: 2.5 MHz
Voltage - Supply Span (Min): 2 V
Voltage - Supply Span (Max): 5.5 V
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
NE5234N,602 NE5234N,602 NXP USA Inc. ne5234_sa5234_3.pdf Description: IC OPAMP MATCHED QUAD HP 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: Rail-to-Rail
Mounting Type: Through Hole
Amplifier Type: Standard (General Purpose)
Operating Temperature: 0°C ~ 70°C
Current - Supply: 2.8mA (x4 Channels)
Slew Rate: 0.8V/µs
Current - Input Bias: 25 nA
Voltage - Input Offset: 200 µV
Supplier Device Package: 14-DIP
Number of Circuits: 4
Current - Output / Channel: 12 mA
-3db Bandwidth: 2.5 MHz
Voltage - Supply Span (Min): 2 V
Voltage - Supply Span (Max): 5.5 V
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BCP69-16/DG,115 BCP69-16/DG,115 NXP USA Inc. BCP69%2CBC869%2CBC69A.pdf Description: TRANS PNP SC73
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Supplier Device Package: SC-73
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BT151-800C,127 NXP USA Inc. Description: THYRISTOR 12A 800V TO-220AB
Packaging: Tube
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
PLVA665A,215 PLVA6XXA_SER.pdf
Hersteller: NXP USA Inc.
Description: DIODE ZENER 6.5V 250MW TO236AB
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
PBLS2001S,115 PBLS2001S.pdf
PBLS2001S,115
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS 1NPN 1PNP 8-SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Transistor Type: 1 NPN Pre-Biased, 1 PNP
Power - Max: 1.5W
Current - Collector (Ic) (Max): 100mA, 3A
Voltage - Collector Emitter Breakdown (Max): 50V, 20V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 355mV @ 300mA, 3A
Current - Collector Cutoff (Max): 1µA, 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20mA, 5V / 150 @ 2A, 2V
Frequency - Transition: 100MHz
Resistor - Base (R1): 2.2kOhms
Resistor - Emitter Base (R2): 2.2kOhms
Supplier Device Package: 8-SO
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
74HCT259PW,112 74HC_HCT259.pdf
74HCT259PW,112
Hersteller: NXP USA Inc.
Description: IC D-TYPE ADDR 1:8 16-TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Standard
Mounting Type: Surface Mount
Circuit: 1:8
Logic Type: D-Type, Addressable
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Delay Time - Propagation: 20ns
Supplier Device Package: 16-TSSOP
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
74HCT259D,652 74HC_HCT259.pdf
74HCT259D,652
Hersteller: NXP USA Inc.
Description: IC D-TYPE ADDR 1:8 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Standard
Mounting Type: Surface Mount
Circuit: 1:8
Logic Type: D-Type, Addressable
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Delay Time - Propagation: 20ns
Supplier Device Package: 16-SO
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
74HCT259D,653 74HC_HCT259.pdf
74HCT259D,653
Hersteller: NXP USA Inc.
Description: IC D-TYPE ADDR 1:8 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Standard
Mounting Type: Surface Mount
Circuit: 1:8
Logic Type: D-Type, Addressable
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Delay Time - Propagation: 20ns
Supplier Device Package: 16-SO
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MPC8280VVQLDA FSCLS05948-1.pdf?t.download=true&u=5oefqw
MPC8280VVQLDA
Hersteller: NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
auf Bestellung 177 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+580.24 EUR
Im Einkaufswagen  Stück im Wert von  UAH
PCF8566T PCF8566.pdf
PCF8566T
Hersteller: NXP USA Inc.
Description: IC LCD DVR UNVRSL LOW-MUX 40VSOP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BCX17,215 BCX17_BCX18.pdf
Hersteller: NXP USA Inc.
Description: TRANS PNP 500MA 45V SOT23
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BC860C,215 BC859_BC860.pdf
Hersteller: NXP USA Inc.
Description: TRANSISTOR PNP 45V 100MA SOT23
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BC860B,215 BC859_BC860.pdf
Hersteller: NXP USA Inc.
Description: TRANSISTOR PNP 45V 100MA SOT23
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
NT2H1311G0DUDZ NTAG213_215_216.pdf
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443
Supplier Device Package: Die
auf Bestellung 78856 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
78856+0.21 EUR
Mindestbestellmenge: 78856
Im Einkaufswagen  Stück im Wert von  UAH
NT2H1311G0DUDV NTAG213_215_216.pdf
Hersteller: NXP USA Inc.
Description: NFC FORUM TYPE 2 TAG COMPLIANT I
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
PBSS4350X,135 PBSS4350X.pdf
PBSS4350X,135
Hersteller: NXP USA Inc.
Description: TRANS NPN 50V 3A SOT89
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
1N4736A,113 1N4728A_SER.pdf
1N4736A,113
Hersteller: NXP USA Inc.
Description: DIODE ZENER 6.8V 1W DO41
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
1N4737A,113 1N4728A_SER.pdf
1N4737A,113
Hersteller: NXP USA Inc.
Description: DIODE ZENER 7.5V 1W DO41
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC33596FJAER2 mc33596.pdf
MC33596FJAER2
Hersteller: NXP USA Inc.
Description: RF RX FSK/OOK 304/315/426 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Sensitivity: -104dBm
Mounting Type: Surface Mount
Frequency: 304MHz, 315MHz, 426MHz, 434MHz, 868MHz, 915MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -20°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V, 4.5V ~ 5.5V
Applications: General Data Transfer
Current - Receiving: 10.3mA
Data Rate (Max): 22.4kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 32-LQFP (5x5)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
PTVS3V3S1UR,115 PHGLS22186-1.pdf?t.download=true&u=5oefqw
PTVS3V3S1UR,115
Hersteller: NXP USA Inc.
Description: TVS DIODE 3.3VWM 8VC SOD123W
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BLF872,112 BLF872.pdf
Hersteller: NXP USA Inc.
Description: TRANSISTOR RF LDMOS SOT800
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BZX84-C3V0,215 BZX84_Series.pdf
BZX84-C3V0,215
Hersteller: NXP USA Inc.
Description: DIODE ZENER 3V 250MW SOT23
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
P2010NXE2KHC FSCLS11436-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: QORIQ, 32-BIT POWER ARCH SOC, 1G
Packaging: Bulk
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+248.84 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
PDZ8.2B,115 PHGLS19616-1.pdf?t.download=true&u=5oefqw
PDZ8.2B,115
Hersteller: NXP USA Inc.
Description: DIODE ZENER 8.2V 400MW SOD323
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BTA204S-800C,118 BTA204S-800C.pdf
Hersteller: NXP USA Inc.
Description: TRIAC 800V 4A DPAK
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BT258U-600R,127 bt258u-600r.pdf
Hersteller: NXP USA Inc.
Description: THYRISTOR 600V 8A IPAK
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BT258X-500R,127 bt258x-500r.pdf
Hersteller: NXP USA Inc.
Description: THYRISTOR 500V 8A SOT186A
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BT258X-800R,127 bt258x-500r.pdf
Hersteller: NXP USA Inc.
Description: THYRISTOR 800V 8A SOT186A
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BT258X-600R,127 bt258x-500r.pdf
Hersteller: NXP USA Inc.
Description: THYRISTOR 600V 8A SOT186A
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BT136S-600D,118 BT136S-600D.pdf
Hersteller: NXP USA Inc.
Description: TRIAC 600V 4A DPAK
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BT136-600D,127 BT136-600D.pdf
Hersteller: NXP USA Inc.
Description: TRIAC SENS GATE 600V 4A TO220AB
Packaging: Tube
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BZX84J-B36,115 BZX84J_SER.pdf
BZX84J-B36,115
Hersteller: NXP USA Inc.
Description: DIODE ZENER 36V 550MW SOD323F
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC9RS08KA8CPJ MC9RS08KA%284%2C8%29.pdf
MC9RS08KA8CPJ
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 254 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-DIP
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC9RS08KA8CPG FSCL-S-A0001282037-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 254 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-PDIP
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC9S08AC48CFDE MC9S08AC60AD.pdf
MC9S08AC48CFDE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 48QFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 38
DigiKey Programmable: Not Verified
auf Bestellung 600 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
51+8.95 EUR
Mindestbestellmenge: 51
Im Einkaufswagen  Stück im Wert von  UAH
MC9S08AC48CFDE MC9S08AC60AD.pdf
MC9S08AC48CFDE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC11E1CPBE2 M68HC11E.pdf
MC11E1CPBE2
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52TQFP
Packaging: Tray
Package / Case: 52-LQFP
Mounting Type: Surface Mount
Speed: 2MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-TQFP (10x10)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
74HC4049D,653 74HC4049.pdf
74HC4049D,653
Hersteller: NXP USA Inc.
Description: IC HEX INV LEVEL SHIFTER 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 16-SO
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
74HC4049D,652 74HC4049.pdf
74HC4049D,652
Hersteller: NXP USA Inc.
Description: IC HEX INV LEVEL SHIFTER 16-SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 16-SO
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
74HC4049DB,112 74HC4049.pdf
74HC4049DB,112
Hersteller: NXP USA Inc.
Description: IC HEX INV LEVEL SHIFTER 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 16-SSOP
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
74HC4046AD,652 74HC_HCT4046A.pdf
74HC4046AD,652
Hersteller: NXP USA Inc.
Description: IC PHASE LOCK LOOP W/VCO 16SOIC
Packaging: Tube
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
74HC4046ADB,112 74HC_HCT4046A.pdf
74HC4046ADB,112
Hersteller: NXP USA Inc.
Description: IC PLL W/VCO 16-SSOP
Packaging: Tube
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
74HC4046ADB,118 74HC_HCT4046A.pdf
74HC4046ADB,118
Hersteller: NXP USA Inc.
Description: IC PHASE LOCK LOOP W/VCO 16SSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 21MHz
Type: Phase Lock Loop (PLL)
Input: Clock
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 6V
Differential - Input:Output: No/No
Supplier Device Package: 16-SSOP
PLL: Yes
Divider/Multiplier: No/No
Number of Circuits: 1
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LFVBBK77CWC
Hersteller: NXP USA Inc.
Description: NXP LEAD FREE MPC5777C CSE 2.08
Packaging: Bulk
Accessory Type: Calibration Unit
Utilized IC / Part: MPCxxxx
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC33385DH
Hersteller: NXP USA Inc.
Description: IC SWITCH QUAD L-SIDE 20-HSOP
Packaging: Tube
Output Type: N-Channel
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Low Side
Rds On (Typ): 250mOhm
Voltage - Load: 4.5V ~ 5.5V
Current - Output (Max): 2A
Ratio - Input:Output: 1:1
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BSC9131NJN1HHHB BSC9131.pdf
BSC9131NJN1HHHB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Bulk
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
auf Bestellung 120 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+103.6 EUR
Mindestbestellmenge: 4
Im Einkaufswagen  Stück im Wert von  UAH
BSC9131NJN1HHHB BSC9131.pdf
BSC9131NJN1HHHB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Box
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TDF8534HH/N3Y 939775017613.pdf
TDF8534HH/N3Y
Hersteller: NXP USA Inc.
Description: IC AMPLIFIER CLASS D 100HLQFP
Packaging: Cut Tape (CT)
Package / Case: 100-FQFP Exposed Pad
Output Type: 5-Channel
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 5.5V ~ 25V
Max Output Power x Channels @ Load: 80W x 5 @ 4Ohm
Supplier Device Package: 100-HLQFP (14x14)
auf Bestellung 483 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+63.06 EUR
10+51.42 EUR
25+48.51 EUR
100+46.12 EUR
Im Einkaufswagen  Stück im Wert von  UAH
MC34PF8100CCEP PF8100_PF8200.pdf
MC34PF8100CCEP
Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT I.MX8QXP
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC34PF8100CCEPR2 PF8100_PF8200.pdf
MC34PF8100CCEPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
74HC85D,652 74HC_HCT85.pdf
74HC85D,652
Hersteller: NXP USA Inc.
Description: IC MAG COMPARATOR 4BIT 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: Active High
Type: Magnitude Comparator
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 16-SO
Max Propagation Delay @ V, Max CL: 33ns @ 6V, 50pF
Output Function: AB
Number of Bits: 4
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
74HC85D,653 74HC_HCT85.pdf
74HC85D,653
Hersteller: NXP USA Inc.
Description: IC MAG COMPARATOR 4BIT 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: Active High
Type: Magnitude Comparator
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 16-SO
Max Propagation Delay @ V, Max CL: 33ns @ 6V, 50pF
Output Function: AB
Number of Bits: 4
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
74HC85DB,118 74HC_HCT85.pdf
74HC85DB,118
Hersteller: NXP USA Inc.
Description: IC MAG COMPARATOR 4BIT 16-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Output: Active High
Type: Magnitude Comparator
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: 16-SSOP
Max Propagation Delay @ V, Max CL: 33ns @ 6V, 50pF
Output Function: AB
Number of Bits: 4
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC33FS4508NAE FS6500-FS4500-ASILD.pdf
MC33FS4508NAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+14.24 EUR
10+11.07 EUR
25+10.28 EUR
100+9.41 EUR
250+8.99 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
MCIMX6L2DVN10AA IMX6SLCEC.pdf
MCIMX6L2DVN10AA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MCIMX6L3DVN10AA IMX6SLCEC.pdf
MCIMX6L3DVN10AA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MCIMX6L7DVN10AA IMX6SLCEC.pdf
MCIMX6L7DVN10AA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MCIMX6L2EVN10AA IMX6SLCEC.pdf
MCIMX6L2EVN10AA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MCIMX6L3EVN10AA IMX6SLCEC.pdf
MCIMX6L3EVN10AA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
NE5234N,602 ne5234_sa5234_3.pdf
NE5234N,602
Hersteller: NXP USA Inc.
Description: IC OPAMP MATCHED QUAD HP 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: Rail-to-Rail
Mounting Type: Through Hole
Amplifier Type: Standard (General Purpose)
Operating Temperature: 0°C ~ 70°C
Current - Supply: 2.8mA (x4 Channels)
Slew Rate: 0.8V/µs
Current - Input Bias: 25 nA
Voltage - Input Offset: 200 µV
Supplier Device Package: 14-DIP
Number of Circuits: 4
Current - Output / Channel: 12 mA
-3db Bandwidth: 2.5 MHz
Voltage - Supply Span (Min): 2 V
Voltage - Supply Span (Max): 5.5 V
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
NE5234N,602 ne5234_sa5234_3.pdf
NE5234N,602
Hersteller: NXP USA Inc.
Description: IC OPAMP MATCHED QUAD HP 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: Rail-to-Rail
Mounting Type: Through Hole
Amplifier Type: Standard (General Purpose)
Operating Temperature: 0°C ~ 70°C
Current - Supply: 2.8mA (x4 Channels)
Slew Rate: 0.8V/µs
Current - Input Bias: 25 nA
Voltage - Input Offset: 200 µV
Supplier Device Package: 14-DIP
Number of Circuits: 4
Current - Output / Channel: 12 mA
-3db Bandwidth: 2.5 MHz
Voltage - Supply Span (Min): 2 V
Voltage - Supply Span (Max): 5.5 V
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BCP69-16/DG,115 BCP69%2CBC869%2CBC69A.pdf
BCP69-16/DG,115
Hersteller: NXP USA Inc.
Description: TRANS PNP SC73
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Supplier Device Package: SC-73
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
BT151-800C,127
Hersteller: NXP USA Inc.
Description: THYRISTOR 12A 800V TO-220AB
Packaging: Tube
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
Wählen Sie Seite:   [  << Vorherige Seite ]  1 60 120 180 240 300 360 420 480 540 591 592 593 594 595 596 597 598 599 600 601 605  [ Nächste Seite >> ]