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TWR-MCF51JF-KIT TWR-MCF51JF-KIT NXP USA Inc. MCF51JFQSG.pdf Description: TOWER SYSTEM MCF51JF EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: Coldfire V1
Utilized IC / Part: MCF51JF
Platform: Tower System
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
1+187.42 EUR
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MCIMX233DAG4C MCIMX233DAG4C NXP USA Inc. FLYRIMXPRDCMPR.pdf Description: IC MPU I.MX23 454MHZ 128LQFP
Packaging: Tray
Package / Case: 128-LQFP
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 128-LQFP (14x14)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
auf Bestellung 510 Stücke:
Lieferzeit 10-14 Tag (e)
1+28.25 EUR
10+22.42 EUR
25+20.96 EUR
80+19.58 EUR
230+18.66 EUR
450+18.20 EUR
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MCIMX233DJM4C MCIMX233DJM4C NXP USA Inc. FLYRIMXPRDCMPR.pdf Description: IC MPU I.MX23 454MHZ 169MAPBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 169-MAPBGA (11x11)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
auf Bestellung 1457 Stücke:
Lieferzeit 10-14 Tag (e)
1+32.79 EUR
10+26.15 EUR
25+24.49 EUR
80+22.92 EUR
230+21.87 EUR
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MCZ33905BD5EK MCZ33905BD5EK NXP USA Inc. MC33903,4,5.pdf Description: IC INTERFACE SPECIALIZED 54SOIC
Produkt ist nicht verfügbar
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MC34827A1EPR2 MC34827A1EPR2 NXP USA Inc. Description: IC USB POWER MANAGER 20-QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: OR Controller, UART/USB Data, Audio Management
Current - Supply: 9µA
Supplier Device Package: 20-QFN-EP (3x3)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC34827A2EPR2 MC34827A2EPR2 NXP USA Inc. Description: IC USB POWER MANAGER 20-QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: OR Controller, UART/USB Data, Audio Management
Current - Supply: 9µA
Supplier Device Package: 20-QFN-EP (3x4)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MCIMX233CAG4C MCIMX233CAG4C NXP USA Inc. IMX233FS.pdf Description: IC MPU I.MX23 454MHZ 128LQFP
Packaging: Tray
Package / Case: 128-LQFP
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 128-LQFP (14x14)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
auf Bestellung 375 Stücke:
Lieferzeit 10-14 Tag (e)
1+25.70 EUR
10+20.47 EUR
25+19.17 EUR
100+18.87 EUR
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MPC8309CVMAHFCA MPC8309CVMAHFCA NXP USA Inc. MPC8309EC.pdf Description: IC MPU MPC83XX 417MHZ 489BGA
Packaging: Tray
Package / Case: 489-LFBGA
Mounting Type: Surface Mount
Speed: 417MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 489-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
Produkt ist nicht verfügbar
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MSC8156ETVT1000B MSC8156ETVT1000B NXP USA Inc. MSC8156E.pdf Description: IC DSP 6 CORE 1GHZ 783FCBGA
Produkt ist nicht verfügbar
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MSC8156ESVT1000B MSC8156ESVT1000B NXP USA Inc. MSC8156E.pdf Description: IC DSP 6 CORE 1GHZ 783FCBGA
Produkt ist nicht verfügbar
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MSC8154TVT1000B MSC8154TVT1000B NXP USA Inc. MSC8154.pdf Description: IC DSP QUAD 1GHZ 783FCBGA
Produkt ist nicht verfügbar
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MSC8154ETVT1000B MSC8154ETVT1000B NXP USA Inc. MSC8154E.pdf Description: IC DSP QUAD 1GHZ 783FCBGA
Produkt ist nicht verfügbar
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SSL4101/1,518 SSL4101/1,518 NXP USA Inc. SSL4101T.pdf Description: IC LED DRIVER OFFL SWITCHER 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 380kHz
Type: AC DC Offline Switcher
Operating Temperature: -40°C ~ 150°C (TJ)
Applications: Lighting
Internal Switch(s): No
Topology: Flyback
Supplier Device Package: 16-SO
Voltage - Supply (Min): 15V
Voltage - Supply (Max): 38V
Produkt ist nicht verfügbar
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OM13001,598 OM13001,598 NXP USA Inc. Description: LPC1788 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Accessories
Core Processor: ARM® Cortex®-M3
Board Type: Evaluation Platform
Utilized IC / Part: LPC1788
Part Status: Active
Produkt ist nicht verfügbar
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TWR-RS08DC-KA8 TWR-RS08DC-KA8 NXP USA Inc. Description: TOWER SYSTEM MC9RS08KA8 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: RS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9RS08KA8
Platform: Tower System
Part Status: Active
Produkt ist nicht verfügbar
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TWR-S08DC-AC60 TWR-S08DC-AC60 NXP USA Inc. Description: TOWER SYSTEM MC9S08AC60 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08AC60
Platform: Tower System
Part Status: Active
Produkt ist nicht verfügbar
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TWR-S08DC-QD4 TWR-S08DC-QD4 NXP USA Inc. Description: TOWER SYSTEM MC9S08QD4 EVAL BRD
Produkt ist nicht verfügbar
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TWR-S08DC-QE64 TWR-S08DC-QE64 NXP USA Inc. Description: TOWER SYSTEM MC9S08QE64 EVAL BRD
Produkt ist nicht verfügbar
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TWR-S08DC-QG8 TWR-S08DC-QG8 NXP USA Inc. Description: TOWER SYSTEM MC9S08QG8 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08QG8
Platform: Tower System
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
1+32.03 EUR
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TWR-S08DC-SH8 TWR-S08DC-SH8 NXP USA Inc. Description: TOWER SYSTEM MC9S08SH8 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08SH8
Platform: Tower System
Part Status: Active
Produkt ist nicht verfügbar
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1323XUSB NXP USA Inc. Description: RF EVAL FOR MC1323X
Produkt ist nicht verfügbar
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TWR-S08UNIV TWR-S08UNIV NXP USA Inc. TWRUNIVQSG.pdf Description: TOWER SYST TWR-RS08DC/TWR-S08DC
Produkt ist nicht verfügbar
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1323XDSK 1323XDSK NXP USA Inc. Description: RF EVAL FOR MC1323X
Packaging: Box
For Use With/Related Products: MC1323x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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1323XDSK-BDM 1323XDSK-BDM NXP USA Inc. MC1323x.pdf Description: RF EVAL FOR MC1323X
Packaging: Box
For Use With/Related Products: MC1323x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4
Supplied Contents: Board(s)
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
1+413.48 EUR
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MCIMX50EVK MCIMX50EVK NXP USA Inc. IMX50EVKFS.pdf Description: I.MX50 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A8
Board Type: Evaluation Platform
Utilized IC / Part: i.MX50
Operating System: Linux
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
1+951.26 EUR
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MC13850EPR2 MC13850EPR2 NXP USA Inc. MC13850.pdf Description: IC AMP GPS 400MHZ-2.5GHZ 8MLPD
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 2.5GHz
RF Type: General Purpose
Voltage - Supply: 2.3V ~ 3V
Gain: 13dB
Current - Supply: 9.9mA
Noise Figure: 1.85dB
P1dB: 2.2dBm
Test Frequency: 2.4GHz
Supplier Device Package: 8-MLPD (2x2)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC13852EPR2 MC13852EPR2 NXP USA Inc. MC13852.pdf Description: IC RF AMP GPS 400MHZ-1GHZ 8MLPD
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 1GHz
RF Type: General Purpose
Voltage - Supply: 2.3V ~ 3V
Gain: 18.3dB
Current - Supply: 5.5mA
Noise Figure: 1.2dB
P1dB: 9.6dBm
Test Frequency: 900MHz
Supplier Device Package: 8-MLPD (2x2)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MRF8P20165WHSR5 MRF8P20165WHSR5 NXP USA Inc. MRF8P20165WH.pdf Description: FET RF 2CH 65V 2.01GHZ NI780S4
Produkt ist nicht verfügbar
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MC9S08GW32CLK MC9S08GW32CLK NXP USA Inc. Description: IC MCU 8BIT 32KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x16b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LCD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MMA6805AKW NXP USA Inc. Description: ACCELEROMETER 16QFN
Produkt ist nicht verfügbar
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MMA6555KW MMA6555KW NXP USA Inc. Description: ACCELEROMETER 105G SPI 16QFN
Packaging: Tray
Features: Selectable Low Pass Filter
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X
Acceleration Range: ±105g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 18.2
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MMA6823AKW MMA6823AKW NXP USA Inc. Description: ACCELEROMETER 50G SPI 16QFN
Produkt ist nicht verfügbar
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MCIMX534AVV8CR2 MCIMX534AVV8CR2 NXP USA Inc. Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX536AVV8CR2 MCIMX536AVV8CR2 NXP USA Inc. Description: IC MPU 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Supplier Device Package: 529-FBGA (19x19)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MCIMX537CVV8CR2 MCIMX537CVV8CR2 NXP USA Inc. IMX53IEC.pdf Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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MRF8P20165WHSR3 MRF8P20165WHSR3 NXP USA Inc. MRF8P20165WH.pdf Description: FET RF 2CH 65V 2.01GHZ NI780S4
Produkt ist nicht verfügbar
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P3041DS-PA NXP USA Inc. P3041DSFS.pdf Description: P3041 EVAL BRD
Produkt ist nicht verfügbar
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DEMO9S12XHY256 DEMO9S12XHY256 NXP USA Inc. Description: MC9S12XHY256 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s), LCD
Core Processor: HCS12X
Utilized IC / Part: MC9S12XHY256
Part Status: Active
Produkt ist nicht verfügbar
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TRK-MPC5604P TRK-MPC5604P NXP USA Inc. MPC5604P.pdf Description: STARTERTRAK MPC5604P EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: e200
Utilized IC / Part: MPC5604P
Platform: StarterTRAK
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
1+255.59 EUR
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TRK-MPC5634M TRK-MPC5634M NXP USA Inc. MPC5634M.pdf Description: STARTERTRAK MPC5634M EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: e200
Utilized IC / Part: MPC5634M
Platform: StarterTRAK
auf Bestellung 17 Stücke:
Lieferzeit 10-14 Tag (e)
1+278.63 EUR
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DSPAUDIOEVMMB1E NXP USA Inc. Description: DSP563XX EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: DSP
Contents: Board(s)
Utilized IC / Part: DSP563xx
Produkt ist nicht verfügbar
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MX50EBOOKDC1 MX50EBOOKDC1 NXP USA Inc. IMX50FS.pdf Description: HARDWARE MX50EBOOKDC1
Packaging: Box
For Use With/Related Products: i.MX50
Accessory Type: Electronic Paper Display (EPD)
Part Status: Active
Produkt ist nicht verfügbar
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LFDA8451 NXP USA Inc. TWRMECHFS.pdf Description: MMA8451 DEVICE ADPTR BRD
Packaging: Box
For Use With/Related Products: Freescale Tower System, MMA8451Q
Accessory Type: Adapter Board
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC13850-900HEVK NXP USA Inc. MC13850.pdf Description: IC MC13850_900_HIIP3_EVK
Produkt ist nicht verfügbar
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MC13851-2400EVK NXP USA Inc. MC13851.pdf Description: IC MC13851 EVB 2400MHZ
Produkt ist nicht verfügbar
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MC13852-434EVK NXP USA Inc. MC13852.pdf Description: IC MC13852 EVB 434MHZ
Packaging: Box
For Use With/Related Products: MC13852
Frequency: 434MHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC13917-1900EVK NXP USA Inc. MBC13917.pdf Description: IC MC13917_1900_EVK
Packaging: Box
For Use With/Related Products: MC13917
Frequency: 1.9GHz
Type: Amplifier
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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MC13917-350EVK NXP USA Inc. MBC13917.pdf Description: IC MC13917_350_EVK
Packaging: Box
For Use With/Related Products: MC13917
Frequency: 350MHz
Type: Amplifier
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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MC13917-434EVK NXP USA Inc. MBC13917.pdf Description: IC MC13917 EVB 434MHZ
Packaging: Box
For Use With/Related Products: MC13917
Frequency: 434MHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC13917-900EVK NXP USA Inc. MBC13917.pdf Description: IC MC13917_900_EVK
Packaging: Box
For Use With/Related Products: MC13917
Frequency: 900MHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MCIMX535DVV1CR2 MCIMX535DVV1CR2 NXP USA Inc. IMX53CEC.pdf Description: IC MPU I.MX53 1.0GHZ 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 85°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Part Status: Obsolete
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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PSMN3R7-25YLC,115 PSMN3R7-25YLC,115 NXP USA Inc. PSMN3R7-25YLC.pdf Description: MOSFET N-CH 25V 97A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 97A (Tc)
Rds On (Max) @ Id, Vgs: 3.9mOhm @ 20A, 10V
Power Dissipation (Max): 64W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 21.6 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1585 pF @ 12 V
Produkt ist nicht verfügbar
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PSMN3R7-30YLC,115 PSMN3R7-30YLC,115 NXP USA Inc. Description: MOSFET N-CH 30V 100A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 3.95mOhm @ 20A, 10V
Power Dissipation (Max): 79W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 29 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1848 pF @ 15 V
Produkt ist nicht verfügbar
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IP4283CZ10-TB,115 IP4283CZ10-TB,115 NXP USA Inc. IP4283CZ10.pdf Description: TVS DIODE 5.5VWM 9.5VC 10XSONU
Packaging: Cut Tape (CT)
Package / Case: 10-XFDFN
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -40°C ~ 85°C (TA)
Applications: HDMI
Voltage - Reverse Standoff (Typ): 5.5V
Supplier Device Package: 10-XSONU (2.5x1)
Unidirectional Channels: 4
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 9.5V (Typ)
Power Line Protection: Yes
Part Status: Obsolete
Produkt ist nicht verfügbar
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PESD5V0L6UAS,118 PESD5V0L6UAS,118 NXP USA Inc. Description: TVS DIODE 5VWM 15VC 8-TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 16pF @ 1MHz
Current - Peak Pulse (10/1000µs): 2.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: 8-TSSOP
Unidirectional Channels: 6
Voltage - Breakdown (Min): 6.4V
Voltage - Clamping (Max) @ Ipp: 15V
Power - Peak Pulse: 35W
Power Line Protection: No
Produkt ist nicht verfügbar
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PBSS3540E,115 PBSS3540E,115 NXP USA Inc. PBSS3540E.pdf Description: TRANS PNP 40V 0.5A SC-75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 350mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 100mA, 2V
Frequency - Transition: 300MHz
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 250 mW
Produkt ist nicht verfügbar
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PESD3V3L1UA,115 PESD3V3L1UA,115 NXP USA Inc. PESD3V3L1UA_UB_UL.pdf Description: TVS DIODE 3.3VWM 11VC SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TA)
Capacitance @ Frequency: 34pF @ 1MHz
Current - Peak Pulse (10/1000µs): 4.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 3.3V (Max)
Supplier Device Package: SOD-323
Unidirectional Channels: 1
Voltage - Breakdown (Min): 5.3V
Voltage - Clamping (Max) @ Ipp: 11V
Power - Peak Pulse: 45W
Power Line Protection: No
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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PBSS2540E,115 PBSS2540E,115 NXP USA Inc. PBSS2540E.pdf Description: TRANS NPN 40V 0.5A SC-75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 250mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 100mA, 2V
Frequency - Transition: 450MHz
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 250 mW
Produkt ist nicht verfügbar
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BZA862AL,115 BZA862AL,115 NXP USA Inc. BZA862AL.pdf Description: TVS DIODE 6.2VWM SOT353
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Type: Zener
Applications: General Purpose
Capacitance @ Frequency: 200pF @ 1MHz
Voltage - Reverse Standoff (Typ): 6.2V
Supplier Device Package: SOT-353
Unidirectional Channels: 4
Power - Peak Pulse: 15W
Power Line Protection: No
Produkt ist nicht verfügbar
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PMF290XN,115 PMF290XN,115 NXP USA Inc. Description: MOSFET N-CH 20V 1A SOT323-3
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1A (Tc)
Rds On (Max) @ Id, Vgs: 350mOhm @ 200mA, 4.5V
Power Dissipation (Max): 560mW (Tc)
Vgs(th) (Max) @ Id: 1.5V @ 250µA
Supplier Device Package: SC-70
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 0.72 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 34 pF @ 20 V
Produkt ist nicht verfügbar
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TWR-MCF51JF-KIT MCF51JFQSG.pdf
TWR-MCF51JF-KIT
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MCF51JF EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: Coldfire V1
Utilized IC / Part: MCF51JF
Platform: Tower System
auf Bestellung 10 Stücke:
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Anzahl Preis
1+187.42 EUR
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MCIMX233DAG4C FLYRIMXPRDCMPR.pdf
MCIMX233DAG4C
Hersteller: NXP USA Inc.
Description: IC MPU I.MX23 454MHZ 128LQFP
Packaging: Tray
Package / Case: 128-LQFP
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 128-LQFP (14x14)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
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Anzahl Preis
1+28.25 EUR
10+22.42 EUR
25+20.96 EUR
80+19.58 EUR
230+18.66 EUR
450+18.20 EUR
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MCIMX233DJM4C FLYRIMXPRDCMPR.pdf
MCIMX233DJM4C
Hersteller: NXP USA Inc.
Description: IC MPU I.MX23 454MHZ 169MAPBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -10°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 169-MAPBGA (11x11)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
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Anzahl Preis
1+32.79 EUR
10+26.15 EUR
25+24.49 EUR
80+22.92 EUR
230+21.87 EUR
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MCZ33905BD5EK MC33903,4,5.pdf
MCZ33905BD5EK
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 54SOIC
Produkt ist nicht verfügbar
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MC34827A1EPR2
MC34827A1EPR2
Hersteller: NXP USA Inc.
Description: IC USB POWER MANAGER 20-QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: OR Controller, UART/USB Data, Audio Management
Current - Supply: 9µA
Supplier Device Package: 20-QFN-EP (3x3)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC34827A2EPR2
MC34827A2EPR2
Hersteller: NXP USA Inc.
Description: IC USB POWER MANAGER 20-QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: OR Controller, UART/USB Data, Audio Management
Current - Supply: 9µA
Supplier Device Package: 20-QFN-EP (3x4)
Part Status: Obsolete
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MCIMX233CAG4C IMX233FS.pdf
MCIMX233CAG4C
Hersteller: NXP USA Inc.
Description: IC MPU I.MX23 454MHZ 128LQFP
Packaging: Tray
Package / Case: 128-LQFP
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 128-LQFP (14x14)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
auf Bestellung 375 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+25.70 EUR
10+20.47 EUR
25+19.17 EUR
100+18.87 EUR
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MPC8309CVMAHFCA MPC8309EC.pdf
MPC8309CVMAHFCA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 417MHZ 489BGA
Packaging: Tray
Package / Case: 489-LFBGA
Mounting Type: Surface Mount
Speed: 417MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 489-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
Produkt ist nicht verfügbar
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MSC8156ETVT1000B MSC8156E.pdf
MSC8156ETVT1000B
Hersteller: NXP USA Inc.
Description: IC DSP 6 CORE 1GHZ 783FCBGA
Produkt ist nicht verfügbar
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MSC8156ESVT1000B MSC8156E.pdf
MSC8156ESVT1000B
Hersteller: NXP USA Inc.
Description: IC DSP 6 CORE 1GHZ 783FCBGA
Produkt ist nicht verfügbar
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MSC8154TVT1000B MSC8154.pdf
MSC8154TVT1000B
Hersteller: NXP USA Inc.
Description: IC DSP QUAD 1GHZ 783FCBGA
Produkt ist nicht verfügbar
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MSC8154ETVT1000B MSC8154E.pdf
MSC8154ETVT1000B
Hersteller: NXP USA Inc.
Description: IC DSP QUAD 1GHZ 783FCBGA
Produkt ist nicht verfügbar
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SSL4101/1,518 SSL4101T.pdf
SSL4101/1,518
Hersteller: NXP USA Inc.
Description: IC LED DRIVER OFFL SWITCHER 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 380kHz
Type: AC DC Offline Switcher
Operating Temperature: -40°C ~ 150°C (TJ)
Applications: Lighting
Internal Switch(s): No
Topology: Flyback
Supplier Device Package: 16-SO
Voltage - Supply (Min): 15V
Voltage - Supply (Max): 38V
Produkt ist nicht verfügbar
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OM13001,598
OM13001,598
Hersteller: NXP USA Inc.
Description: LPC1788 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Accessories
Core Processor: ARM® Cortex®-M3
Board Type: Evaluation Platform
Utilized IC / Part: LPC1788
Part Status: Active
Produkt ist nicht verfügbar
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TWR-RS08DC-KA8
TWR-RS08DC-KA8
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MC9RS08KA8 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: RS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9RS08KA8
Platform: Tower System
Part Status: Active
Produkt ist nicht verfügbar
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TWR-S08DC-AC60
TWR-S08DC-AC60
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MC9S08AC60 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08AC60
Platform: Tower System
Part Status: Active
Produkt ist nicht verfügbar
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TWR-S08DC-QD4
TWR-S08DC-QD4
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MC9S08QD4 EVAL BRD
Produkt ist nicht verfügbar
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TWR-S08DC-QE64
TWR-S08DC-QE64
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MC9S08QE64 EVAL BRD
Produkt ist nicht verfügbar
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TWR-S08DC-QG8
TWR-S08DC-QG8
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MC9S08QG8 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08QG8
Platform: Tower System
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+32.03 EUR
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TWR-S08DC-SH8
TWR-S08DC-SH8
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MC9S08SH8 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08SH8
Platform: Tower System
Part Status: Active
Produkt ist nicht verfügbar
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1323XUSB
Hersteller: NXP USA Inc.
Description: RF EVAL FOR MC1323X
Produkt ist nicht verfügbar
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TWR-S08UNIV TWRUNIVQSG.pdf
TWR-S08UNIV
Hersteller: NXP USA Inc.
Description: TOWER SYST TWR-RS08DC/TWR-S08DC
Produkt ist nicht verfügbar
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1323XDSK
1323XDSK
Hersteller: NXP USA Inc.
Description: RF EVAL FOR MC1323X
Packaging: Box
For Use With/Related Products: MC1323x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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1323XDSK-BDM MC1323x.pdf
1323XDSK-BDM
Hersteller: NXP USA Inc.
Description: RF EVAL FOR MC1323X
Packaging: Box
For Use With/Related Products: MC1323x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4
Supplied Contents: Board(s)
auf Bestellung 3 Stücke:
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Anzahl Preis
1+413.48 EUR
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MCIMX50EVK IMX50EVKFS.pdf
MCIMX50EVK
Hersteller: NXP USA Inc.
Description: I.MX50 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A8
Board Type: Evaluation Platform
Utilized IC / Part: i.MX50
Operating System: Linux
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+951.26 EUR
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MC13850EPR2 MC13850.pdf
MC13850EPR2
Hersteller: NXP USA Inc.
Description: IC AMP GPS 400MHZ-2.5GHZ 8MLPD
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 2.5GHz
RF Type: General Purpose
Voltage - Supply: 2.3V ~ 3V
Gain: 13dB
Current - Supply: 9.9mA
Noise Figure: 1.85dB
P1dB: 2.2dBm
Test Frequency: 2.4GHz
Supplier Device Package: 8-MLPD (2x2)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC13852EPR2 MC13852.pdf
MC13852EPR2
Hersteller: NXP USA Inc.
Description: IC RF AMP GPS 400MHZ-1GHZ 8MLPD
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 1GHz
RF Type: General Purpose
Voltage - Supply: 2.3V ~ 3V
Gain: 18.3dB
Current - Supply: 5.5mA
Noise Figure: 1.2dB
P1dB: 9.6dBm
Test Frequency: 900MHz
Supplier Device Package: 8-MLPD (2x2)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MRF8P20165WHSR5 MRF8P20165WH.pdf
MRF8P20165WHSR5
Hersteller: NXP USA Inc.
Description: FET RF 2CH 65V 2.01GHZ NI780S4
Produkt ist nicht verfügbar
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MC9S08GW32CLK
MC9S08GW32CLK
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x16b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LCD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MMA6805AKW
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 16QFN
Produkt ist nicht verfügbar
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MMA6555KW
MMA6555KW
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 105G SPI 16QFN
Packaging: Tray
Features: Selectable Low Pass Filter
Package / Case: 16-QFN Exposed Pad
Output Type: SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X
Acceleration Range: ±105g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.135V ~ 5.25V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 18.2
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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MMA6823AKW
MMA6823AKW
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 50G SPI 16QFN
Produkt ist nicht verfügbar
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MCIMX534AVV8CR2
MCIMX534AVV8CR2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX536AVV8CR2
MCIMX536AVV8CR2
Hersteller: NXP USA Inc.
Description: IC MPU 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Supplier Device Package: 529-FBGA (19x19)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MCIMX537CVV8CR2 IMX53IEC.pdf
MCIMX537CVV8CR2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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MRF8P20165WHSR3 MRF8P20165WH.pdf
MRF8P20165WHSR3
Hersteller: NXP USA Inc.
Description: FET RF 2CH 65V 2.01GHZ NI780S4
Produkt ist nicht verfügbar
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P3041DS-PA P3041DSFS.pdf
Hersteller: NXP USA Inc.
Description: P3041 EVAL BRD
Produkt ist nicht verfügbar
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DEMO9S12XHY256
DEMO9S12XHY256
Hersteller: NXP USA Inc.
Description: MC9S12XHY256 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s), LCD
Core Processor: HCS12X
Utilized IC / Part: MC9S12XHY256
Part Status: Active
Produkt ist nicht verfügbar
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TRK-MPC5604P MPC5604P.pdf
TRK-MPC5604P
Hersteller: NXP USA Inc.
Description: STARTERTRAK MPC5604P EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: e200
Utilized IC / Part: MPC5604P
Platform: StarterTRAK
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+255.59 EUR
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TRK-MPC5634M MPC5634M.pdf
TRK-MPC5634M
Hersteller: NXP USA Inc.
Description: STARTERTRAK MPC5634M EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: e200
Utilized IC / Part: MPC5634M
Platform: StarterTRAK
auf Bestellung 17 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+278.63 EUR
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DSPAUDIOEVMMB1E
Hersteller: NXP USA Inc.
Description: DSP563XX EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: DSP
Contents: Board(s)
Utilized IC / Part: DSP563xx
Produkt ist nicht verfügbar
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MX50EBOOKDC1 IMX50FS.pdf
MX50EBOOKDC1
Hersteller: NXP USA Inc.
Description: HARDWARE MX50EBOOKDC1
Packaging: Box
For Use With/Related Products: i.MX50
Accessory Type: Electronic Paper Display (EPD)
Part Status: Active
Produkt ist nicht verfügbar
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LFDA8451 TWRMECHFS.pdf
Hersteller: NXP USA Inc.
Description: MMA8451 DEVICE ADPTR BRD
Packaging: Box
For Use With/Related Products: Freescale Tower System, MMA8451Q
Accessory Type: Adapter Board
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC13850-900HEVK MC13850.pdf
Hersteller: NXP USA Inc.
Description: IC MC13850_900_HIIP3_EVK
Produkt ist nicht verfügbar
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MC13851-2400EVK MC13851.pdf
Hersteller: NXP USA Inc.
Description: IC MC13851 EVB 2400MHZ
Produkt ist nicht verfügbar
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MC13852-434EVK MC13852.pdf
Hersteller: NXP USA Inc.
Description: IC MC13852 EVB 434MHZ
Packaging: Box
For Use With/Related Products: MC13852
Frequency: 434MHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC13917-1900EVK MBC13917.pdf
Hersteller: NXP USA Inc.
Description: IC MC13917_1900_EVK
Packaging: Box
For Use With/Related Products: MC13917
Frequency: 1.9GHz
Type: Amplifier
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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MC13917-350EVK MBC13917.pdf
Hersteller: NXP USA Inc.
Description: IC MC13917_350_EVK
Packaging: Box
For Use With/Related Products: MC13917
Frequency: 350MHz
Type: Amplifier
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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MC13917-434EVK MBC13917.pdf
Hersteller: NXP USA Inc.
Description: IC MC13917 EVB 434MHZ
Packaging: Box
For Use With/Related Products: MC13917
Frequency: 434MHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC13917-900EVK MBC13917.pdf
Hersteller: NXP USA Inc.
Description: IC MC13917_900_EVK
Packaging: Box
For Use With/Related Products: MC13917
Frequency: 900MHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MCIMX535DVV1CR2 IMX53CEC.pdf
MCIMX535DVV1CR2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX53 1.0GHZ 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 85°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Part Status: Obsolete
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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PSMN3R7-25YLC,115 PSMN3R7-25YLC.pdf
PSMN3R7-25YLC,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 25V 97A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 97A (Tc)
Rds On (Max) @ Id, Vgs: 3.9mOhm @ 20A, 10V
Power Dissipation (Max): 64W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 21.6 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1585 pF @ 12 V
Produkt ist nicht verfügbar
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PSMN3R7-30YLC,115
PSMN3R7-30YLC,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 100A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 3.95mOhm @ 20A, 10V
Power Dissipation (Max): 79W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 29 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1848 pF @ 15 V
Produkt ist nicht verfügbar
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IP4283CZ10-TB,115 IP4283CZ10.pdf
IP4283CZ10-TB,115
Hersteller: NXP USA Inc.
Description: TVS DIODE 5.5VWM 9.5VC 10XSONU
Packaging: Cut Tape (CT)
Package / Case: 10-XFDFN
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -40°C ~ 85°C (TA)
Applications: HDMI
Voltage - Reverse Standoff (Typ): 5.5V
Supplier Device Package: 10-XSONU (2.5x1)
Unidirectional Channels: 4
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 9.5V (Typ)
Power Line Protection: Yes
Part Status: Obsolete
Produkt ist nicht verfügbar
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PESD5V0L6UAS,118
PESD5V0L6UAS,118
Hersteller: NXP USA Inc.
Description: TVS DIODE 5VWM 15VC 8-TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 16pF @ 1MHz
Current - Peak Pulse (10/1000µs): 2.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: 8-TSSOP
Unidirectional Channels: 6
Voltage - Breakdown (Min): 6.4V
Voltage - Clamping (Max) @ Ipp: 15V
Power - Peak Pulse: 35W
Power Line Protection: No
Produkt ist nicht verfügbar
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PBSS3540E,115 PBSS3540E.pdf
PBSS3540E,115
Hersteller: NXP USA Inc.
Description: TRANS PNP 40V 0.5A SC-75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 350mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 100mA, 2V
Frequency - Transition: 300MHz
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 250 mW
Produkt ist nicht verfügbar
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PESD3V3L1UA,115 PESD3V3L1UA_UB_UL.pdf
PESD3V3L1UA,115
Hersteller: NXP USA Inc.
Description: TVS DIODE 3.3VWM 11VC SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TA)
Capacitance @ Frequency: 34pF @ 1MHz
Current - Peak Pulse (10/1000µs): 4.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 3.3V (Max)
Supplier Device Package: SOD-323
Unidirectional Channels: 1
Voltage - Breakdown (Min): 5.3V
Voltage - Clamping (Max) @ Ipp: 11V
Power - Peak Pulse: 45W
Power Line Protection: No
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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PBSS2540E,115 PBSS2540E.pdf
PBSS2540E,115
Hersteller: NXP USA Inc.
Description: TRANS NPN 40V 0.5A SC-75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 250mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 100mA, 2V
Frequency - Transition: 450MHz
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 40 V
Power - Max: 250 mW
Produkt ist nicht verfügbar
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BZA862AL,115 BZA862AL.pdf
BZA862AL,115
Hersteller: NXP USA Inc.
Description: TVS DIODE 6.2VWM SOT353
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Type: Zener
Applications: General Purpose
Capacitance @ Frequency: 200pF @ 1MHz
Voltage - Reverse Standoff (Typ): 6.2V
Supplier Device Package: SOT-353
Unidirectional Channels: 4
Power - Peak Pulse: 15W
Power Line Protection: No
Produkt ist nicht verfügbar
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PMF290XN,115
PMF290XN,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 20V 1A SOT323-3
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1A (Tc)
Rds On (Max) @ Id, Vgs: 350mOhm @ 200mA, 4.5V
Power Dissipation (Max): 560mW (Tc)
Vgs(th) (Max) @ Id: 1.5V @ 250µA
Supplier Device Package: SC-70
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 0.72 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 34 pF @ 20 V
Produkt ist nicht verfügbar
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