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BF1118R,215 BF1118R,215 NXP USA Inc. BF1118%28R%2CW%2CWR%29.pdf Description: IC RF SWITCH 1GHZ SOT143R
Packaging: Tape & Reel (TR)
Package / Case: SOT-143R
Impedance: 50Ohm
Mounting Type: Surface Mount
RF Type: General Purpose
Insertion Loss: 2.5dB (max)
Frequency Range: 0Hz ~ 1GHz
Test Frequency: 1GHz
Isolation: 30dB (min)
Supplier Device Package: SOT-143R
Produkt ist nicht verfügbar
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BF1118W,115 BF1118W,115 NXP USA Inc. BF1118%28R%2CW%2CWR%29.pdf Description: IC RF SWITCH 1GHZ 4SO
Packaging: Tape & Reel (TR)
Package / Case: SOT-343 Reverse Pinning
Impedance: 50Ohm
Mounting Type: Surface Mount
RF Type: General Purpose
Insertion Loss: 2.5dB (max)
Frequency Range: 0Hz ~ 1GHz
Test Frequency: 1GHz
Isolation: 30dB (min)
Supplier Device Package: 4-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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BUK7Y08-40B/C,115 NXP USA Inc. BUK7Y08-40B.pdf Description: MOSFET N-CH 40V 75A LFPAK
Produkt ist nicht verfügbar
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BUK7Y25-40B/C,115 BUK7Y25-40B/C,115 NXP USA Inc. BUK7Y25-40B.pdf Description: MOSFET N-CH 40V 35.3A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 35.3A (Tc)
Rds On (Max) @ Id, Vgs: 25mOhm @ 20A, 10V
Power Dissipation (Max): 59.4W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 12.1 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 693 pF @ 25 V
Produkt ist nicht verfügbar
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HTMS1001FTK/AF,115 HTMS1001FTK/AF,115 NXP USA Inc. HTMS1X01_8X01.pdf Description: RFID TAG R/W 100-150KHZ ENCAP
Packaging: Tape & Reel (TR)
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Style: Encapsulated
Frequency: 100kHz ~ 150kHz
Memory Type: Read/Write
Technology: Passive
Standards: ISO 11784, ISO 11785
Writable Memory: 1.76kb (User)
Part Status: Obsolete
Produkt ist nicht verfügbar
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HTMS1301FTB/AF,115 HTMS1301FTB/AF,115 NXP USA Inc. H184430_HITAGu_ISO_18000_2.pdf Description: RFID TAG R/W 100-150KHZ ENCAP
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HTMS8001FTK/AF,115 NXP USA Inc. HTMS1X01_8X01.pdf Description: RFID TAG R/W 100-150KHZ ENCAP
Packaging: Tape & Reel (TR)
Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Style: Encapsulated
Frequency: 100kHz ~ 150kHz
Memory Type: Read/Write
Technology: Passive
Standards: ISO 11784, ISO 11785
Writable Memory: 1.76kb (User)
Produkt ist nicht verfügbar
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NVT2004TL,115 NVT2004TL,115 NXP USA Inc. NVT2003_06.pdf Description: IC TRNSLTR BIDIRECTIONAL 12HXSON
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 12-XFDFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: DFN2514-12
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
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TJA1028TK/3V3/10:1 TJA1028TK/3V3/10:1 NXP USA Inc. TJA1028.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 3.3V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
Produkt ist nicht verfügbar
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TJA1028TK/5V0/10:1 TJA1028TK/5V0/10:1 NXP USA Inc. TJA1028.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
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TJA1028TK/5V0/20:1 TJA1028TK/5V0/20:1 NXP USA Inc. TJA1028.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
Produkt ist nicht verfügbar
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BLF6G27LS-50BN,118 NXP USA Inc. Description: RF MOSFET LDMOS 28V CDFM6
Packaging: Tape & Reel (TR)
Package / Case: SOT-1112B
Current Rating (Amps): 12A
Mounting Type: Chassis Mount
Frequency: 2.5GHz ~ 2.7GHz
Configuration: Dual
Power - Output: 3W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: CDFM6
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 430 mA
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LPC1111FHN33/102'5 LPC1111FHN33/102'5 NXP USA Inc. LPC111X.pdf Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
4000+2 EUR
Mindestbestellmenge: 4000
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LPC1114FBD48/301:1 LPC1114FBD48/301:1 NXP USA Inc. LPC111X.pdf Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1342FBD48,118 LPC1342FBD48,118 NXP USA Inc. LPC1311_13_42_43.pdf Description: IC MCU 32BIT 16KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1342FHN33,518 LPC1342FHN33,518 NXP USA Inc. LPC1311_13_42_43.pdf Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1754FBD80,518 LPC1754FBD80,518 NXP USA Inc. LPC1759_58_56_54_52_51.pdf Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P80C32UBAA,518 P80C32UBAA,518 NXP USA Inc. 80C31_80C32.pdf Description: IC MCU 8BIT ROMLESS 44PLCC
Packaging: Tape & Reel (TR)
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 33MHz
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: UART/USART
Peripherals: POR
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P80C32UFAA,518 P80C32UFAA,518 NXP USA Inc. 80C31_80C32.pdf Description: IC MCU 8BIT ROMLESS 44PLCC
Packaging: Tape & Reel (TR)
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 33MHz
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: UART/USART
Peripherals: POR
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P80C552EBA/08,518 P80C552EBA/08,518 NXP USA Inc. 80C552_83C552.pdf Description: IC MCU 8BIT ROMLESS 68PLCC
Packaging: Tape & Reel (TR)
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 256 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: 8051
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, I²C, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 68-PLCC (24.18x24.18)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P80C552EFA/08,518 P80C552EFA/08,518 NXP USA Inc. 80C552_83C552.pdf Description: IC MCU 8BIT ROMLESS 68PLCC
Packaging: Tape & Reel (TR)
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: 8051
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, I²C, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 68-PLCC (24.18x24.18)
Part Status: Obsolete
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P80C552IBA/08,518 P80C552IBA/08,518 NXP USA Inc. 80C552_83C552.pdf Description: IC MCU 8BIT ROMLESS 68PLCC
Produkt ist nicht verfügbar
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P80C592FFA/00,518 P80C592FFA/00,518 NXP USA Inc. P8XC592.pdf Description: IC MCU 8BIT ROMLESS 68PLCC
Produkt ist nicht verfügbar
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P80CE598FFB/00,518 P80CE598FFB/00,518 NXP USA Inc. P8XCE598.pdf Description: IC MCU 8BIT ROMLESS 80QFP
Produkt ist nicht verfügbar
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P87LPC760BDH,118 P87LPC760BDH,118 NXP USA Inc. P87LPC760.pdf Description: IC MCU 8BIT 1KB OTP 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 1KB (1K x 8)
RAM Size: 128 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, WDT
Supplier Device Package: 14-TSSOP
Number of I/O: 12
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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P87LPC769HD,518 P87LPC769HD,518 NXP USA Inc. P87LPC769.pdf Description: IC MCU 8BIT 4KB OTP 20SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Data Converters: A/D 4x8b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, WDT
Supplier Device Package: 20-SO
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P89LPC921FDH,518 P89LPC921FDH,518 NXP USA Inc. P89LPC920_921_922_9221.pdf Description: IC MCU 8BIT 4KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P89LPC9221FDH,518 P89LPC9221FDH,518 NXP USA Inc. P89LPC920_921_922_9221.pdf Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P89LPC935FDH,518 P89LPC935FDH,518 NXP USA Inc. P89LPC933_934_935_936.pdf Description: IC MCU 8BIT 8KB FLASH 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 12MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 8051
Data Converters: A/D 8x8b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TDA18250HN/C1,518 TDA18250HN/C1,518 NXP USA Inc. TDA18250HN_SDS.pdf Description: IC VIDEO TUNER 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V
Applications: Consumer Video
Supplier Device Package: 48-HVQFN (7x7)
Control Interface: I2C
Produkt ist nicht verfügbar
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TDA19989AETC189,51 TDA19989AETC189,51 NXP USA Inc. TDA19989.pdf Description: IC VIDEO HDMI 1.3 TRANS 64TFBGA
Produkt ist nicht verfügbar
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TDA8296HN/C1,518 TDA8296HN/C1,518 NXP USA Inc. TDA8296.pdf Description: RF DEMODULATOR IC 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Demodulator
Voltage - Supply: 1.1V ~ 3.6V
Supplier Device Package: 40-HVQFN (6x6)
Current - Supply: 65 mA
Produkt ist nicht verfügbar
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TEA1713T/N2,518 TEA1713T/N2,518 NXP USA Inc. TEA1713T.pdf Description: IC PFC CTRLR DCM 500KHZ 24SO
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 70 ~ 276 VAC
Frequency - Switching: 500kHz
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 24-SO
Part Status: Active
Produkt ist nicht verfügbar
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TEA1733BT/N2,118 TEA1733BT/N2,118 NXP USA Inc. TEA1733BT.pdf Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 72%
Frequency - Switching: 123kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Part Status: Obsolete
Power (Watts): 75 W
Produkt ist nicht verfügbar
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TEA1733LT/N2,118 TEA1733LT/N2,118 NXP USA Inc. TEA1733LT.pdf Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 72%
Frequency - Switching: 66.5kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Part Status: Obsolete
Power (Watts): 75 W
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TEA1733MT/N2,118 TEA1733MT/N2,118 NXP USA Inc. TEA1733MT.pdf Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 72%
Frequency - Switching: 91.5kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Part Status: Obsolete
Power (Watts): 75 W
Produkt ist nicht verfügbar
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TEA1751AT/N1,518 TEA1751AT/N1,518 NXP USA Inc. Description: IC OFFLINE SWITCH FLYBACK 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Frequency - Switching: 100kHz ~ 150kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 8V ~ 38V
Supplier Device Package: 16-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 15 V
Part Status: Active
Power (Watts): 250 W
Produkt ist nicht verfügbar
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TEF6623T/V1,518 TEF6623T/V1,518 NXP USA Inc. Description: RF RCVR FM TUNER CAR RADIO 32SO
Features: RDS Demodulator + Band Pass Filter
Packaging: Tape & Reel (TR)
Package / Case: 32-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Modulation or Protocol: FM
Data Interface: PCB, Surface Mount
Operating Temperature: -20°C ~ 85°C
Voltage - Supply: 8.5V
Applications: FM Radio Receiver
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 32-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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TJA1021TK/10/C,118 TJA1021TK/10/C,118 NXP USA Inc. TJA1021.pdf Description: IC TRANSCEIVER FULL 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 175 mV
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJA1028TK/3V3/10,1 TJA1028TK/3V3/10,1 NXP USA Inc. TJA1028.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 3.3V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
Produkt ist nicht verfügbar
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TJA1028TK/3V3/20,1 TJA1028TK/3V3/20,1 NXP USA Inc. TJA1028.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 3.3V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
Produkt ist nicht verfügbar
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TJA1028TK/5V0/10,1 TJA1028TK/5V0/10,1 NXP USA Inc. TJA1028.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
Produkt ist nicht verfügbar
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TJA1028TK/5V0/20,1 TJA1028TK/5V0/20,1 NXP USA Inc. TJA1028.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
Produkt ist nicht verfügbar
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TJA1051T/E,118 TJA1051T/E,118 NXP USA Inc. TJA1051.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 120 mV
Duplex: Half
Part Status: Active
auf Bestellung 7500 Stücke:
Lieferzeit 10-14 Tag (e)
2500+1 EUR
5000+0.98 EUR
7500+0.97 EUR
Mindestbestellmenge: 2500
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TJA1051TK/3,118 TJA1051TK/3,118 NXP USA Inc. TJA1051.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 120 mV
Duplex: Half
Part Status: Active
auf Bestellung 24000 Stücke:
Lieferzeit 10-14 Tag (e)
6000+0.97 EUR
12000+0.96 EUR
Mindestbestellmenge: 6000
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NVT2004TL,115 NVT2004TL,115 NXP USA Inc. NVT2003_06.pdf Description: IC TRNSLTR BIDIRECTIONAL 12HXSON
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 12-XFDFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: DFN2514-12
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
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OM13013,598 OM13013,598 NXP USA Inc. LPC122X.pdf Description: LPC1227 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), LCD, J-Link Lite Programmer
Core Processor: ARM® Cortex®-M0
Board Type: Evaluation Platform
Utilized IC / Part: LPC1227
Part Status: Not For New Designs
Produkt ist nicht verfügbar
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DAC1408D650W2/DB,598 DAC1408D650W2/DB,598 NXP USA Inc. Description: BOARD DEMO DAC1408D650
Packaging: Box
Number of Bits: 14
Data Interface: Serial JESD204A, SPI™
Sampling Rate (Per Second): 650M
Utilized IC / Part: DAC1408D650
Supplied Contents: Board(s)
Number of DAC's: 2
DAC Type: Current
Settling Time: 20 ns
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
1+618.6 EUR
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HSDC-JAKIT1W2/DB HSDC-JAKIT1W2/DB NXP USA Inc. HSDC-JAKITW2-DB_Description%26KeyFeatures.pdf Description: EVAL BOARD FOR ADC1413D DAC1408D
Packaging: Box
Function: ADC/DAC for Lattice ECP3 FPGA
Type: Interface
Utilized IC / Part: ADC1413D, DAC1408D, ECP3 FPGA
Supplied Contents: Board(s), Cable(s)
Primary Attributes: Loop Back Demo with 2 High Speed Converters
Embedded: Yes, FPGA / CPLD
Part Status: Obsolete
Contents: Board(s), Cable(s)
Secondary Attributes: USB Powered
Produkt ist nicht verfügbar
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ADC1112D125F1/DB,598 ADC1112D125F1/DB,598 NXP USA Inc. Description: BOARD EVALUATION FOR ADC1112D125
Packaging: Box
Number of Bits: 11
Data Interface: Serial, CMOS Buffer
Sampling Rate (Per Second): 125M
Utilized IC / Part: ADC1112D125
Supplied Contents: Board(s), Cable(s), Power Supply
Number of A/D Converters: 2
Input Range: 1 ~ 2Vpp
Power (Typ) @ Conditions: 1.23W @ 125MSPS
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
1+569.73 EUR
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ADC1112D125F2/DB,5 ADC1112D125F2/DB,5 NXP USA Inc. Description: BOARD EVALUATION FOR ADC1112D125
Packaging: Box
Number of Bits: 11
Data Interface: Serial, LVDS/DDR
Sampling Rate (Per Second): 125M
Utilized IC / Part: ADC1112D125
Supplied Contents: Board(s), Cable(s), Power Supply
Number of A/D Converters: 2
Input Range: 1 ~ 2Vpp
Power (Typ) @ Conditions: 1.23W @ 125MSPS
Produkt ist nicht verfügbar
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ADC0801S040/DB ADC0801S040/DB NXP USA Inc. DS_568_ADC0801S040.pdf Description: BOARD EVALUATION FOR ADC0801S040
Packaging: Box
Number of Bits: 8
Data Interface: Parallel
Sampling Rate (Per Second): 40M
Utilized IC / Part: ADC0801S040
Supplied Contents: Board(s)
Number of A/D Converters: 1
Input Range: 1.8Vpp
Power (Typ) @ Conditions: 30mW @ 40MSPS
Contents: Board(s)
Produkt ist nicht verfügbar
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ADC0808S125/DB ADC0808S125/DB NXP USA Inc. ADC0808S125_250.pdf Description: BOARD EVALUATION FOR ADC0808S125
Packaging: Box
Number of Bits: 8
Data Interface: Parallel
Sampling Rate (Per Second): 125M
Utilized IC / Part: ADC0808S125
Supplied Contents: Board(s)
Number of A/D Converters: 1
Input Range: 2Vpp
Power (Typ) @ Conditions: 240mW @ 125MSPS
Produkt ist nicht verfügbar
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ADC1115S125/DB,598 ADC1115S125/DB,598 NXP USA Inc. Description: BOARD EVALUATION FOR ADC1115S125
Packaging: Box
Number of Bits: 11
Data Interface: SPI
Sampling Rate (Per Second): 125M
Utilized IC / Part: ADC1115S125
Supplied Contents: Board(s), Cable(s), Power Supply
Number of A/D Converters: 1
Input Range: 1 ~ 2Vpp
Power (Typ) @ Conditions: 840mW @ 125MSPS
Contents: Board(s), Cable(s), Power Supply
Produkt ist nicht verfügbar
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ADC1212D125F2/DB,598 ADC1212D125F2/DB,598 NXP USA Inc. ADC_DAC_Gde_2010.pdf Description: BOARD EVALUATION FOR ADC1212D125
Packaging: Box
Number of Bits: 12
Data Interface: Serial, LVDS/DDR
Sampling Rate (Per Second): 125M
Utilized IC / Part: ADC1212D125
Supplied Contents: Board(s), Cable(s), Power Supply
Number of A/D Converters: 2
Input Range: 1 ~ 2Vpp
Power (Typ) @ Conditions: 1.23W @ 125MSPS
Part Status: Obsolete
Produkt ist nicht verfügbar
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PBS12C128SLK NXP USA Inc. Description: MC9S12C128 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS12
Board Type: Evaluation Platform
Utilized IC / Part: MC9S12C128
Part Status: Obsolete
Produkt ist nicht verfügbar
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PSMN011-30YL,115 PSMN011-30YL,115 NXP USA Inc. Description: MOSFET N-CH 30V 51A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 51A (Tj)
Rds On (Max) @ Id, Vgs: 10.7mOhm @ 15A, 10V
Power Dissipation (Max): 49W (Tc)
Vgs(th) (Max) @ Id: 2.15V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 14.8 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 726 pF @ 15 V
Produkt ist nicht verfügbar
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PSMN8R0-30YL,115 PSMN8R0-30YL,115 NXP USA Inc. Description: MOSFET N-CH 30V 62A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 62A (Tc)
Rds On (Max) @ Id, Vgs: 8.3mOhm @ 15A, 10V
Power Dissipation (Max): 56W (Tc)
Vgs(th) (Max) @ Id: 2.15V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 18.3 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1005 pF @ 15 V
Produkt ist nicht verfügbar
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PSMN8R0-30YL,115 PSMN8R0-30YL,115 NXP USA Inc. Description: MOSFET N-CH 30V 62A LFPAK56
Packaging: Cut Tape (CT)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 62A (Tc)
Rds On (Max) @ Id, Vgs: 8.3mOhm @ 15A, 10V
Power Dissipation (Max): 56W (Tc)
Vgs(th) (Max) @ Id: 2.15V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 18.3 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1005 pF @ 15 V
Produkt ist nicht verfügbar
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PVR100AZ-B3V0,115 PVR100AZ-B3V0,115 NXP USA Inc. PVR100AZ-B_Series.pdf Description: TRANS NPN 45V 0.1A SC73
Produkt ist nicht verfügbar
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BF1118R,215 BF1118%28R%2CW%2CWR%29.pdf
BF1118R,215
Hersteller: NXP USA Inc.
Description: IC RF SWITCH 1GHZ SOT143R
Packaging: Tape & Reel (TR)
Package / Case: SOT-143R
Impedance: 50Ohm
Mounting Type: Surface Mount
RF Type: General Purpose
Insertion Loss: 2.5dB (max)
Frequency Range: 0Hz ~ 1GHz
Test Frequency: 1GHz
Isolation: 30dB (min)
Supplier Device Package: SOT-143R
Produkt ist nicht verfügbar
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BF1118W,115 BF1118%28R%2CW%2CWR%29.pdf
BF1118W,115
Hersteller: NXP USA Inc.
Description: IC RF SWITCH 1GHZ 4SO
Packaging: Tape & Reel (TR)
Package / Case: SOT-343 Reverse Pinning
Impedance: 50Ohm
Mounting Type: Surface Mount
RF Type: General Purpose
Insertion Loss: 2.5dB (max)
Frequency Range: 0Hz ~ 1GHz
Test Frequency: 1GHz
Isolation: 30dB (min)
Supplier Device Package: 4-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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BUK7Y08-40B/C,115 BUK7Y08-40B.pdf
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 40V 75A LFPAK
Produkt ist nicht verfügbar
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BUK7Y25-40B/C,115 BUK7Y25-40B.pdf
BUK7Y25-40B/C,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 40V 35.3A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 35.3A (Tc)
Rds On (Max) @ Id, Vgs: 25mOhm @ 20A, 10V
Power Dissipation (Max): 59.4W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 12.1 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 693 pF @ 25 V
Produkt ist nicht verfügbar
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HTMS1001FTK/AF,115 HTMS1X01_8X01.pdf
HTMS1001FTK/AF,115
Hersteller: NXP USA Inc.
Description: RFID TAG R/W 100-150KHZ ENCAP
Packaging: Tape & Reel (TR)
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Style: Encapsulated
Frequency: 100kHz ~ 150kHz
Memory Type: Read/Write
Technology: Passive
Standards: ISO 11784, ISO 11785
Writable Memory: 1.76kb (User)
Part Status: Obsolete
Produkt ist nicht verfügbar
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HTMS1301FTB/AF,115 H184430_HITAGu_ISO_18000_2.pdf
HTMS1301FTB/AF,115
Hersteller: NXP USA Inc.
Description: RFID TAG R/W 100-150KHZ ENCAP
Produkt ist nicht verfügbar
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HTMS8001FTK/AF,115 HTMS1X01_8X01.pdf
Hersteller: NXP USA Inc.
Description: RFID TAG R/W 100-150KHZ ENCAP
Packaging: Tape & Reel (TR)
Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Style: Encapsulated
Frequency: 100kHz ~ 150kHz
Memory Type: Read/Write
Technology: Passive
Standards: ISO 11784, ISO 11785
Writable Memory: 1.76kb (User)
Produkt ist nicht verfügbar
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NVT2004TL,115 NVT2003_06.pdf
NVT2004TL,115
Hersteller: NXP USA Inc.
Description: IC TRNSLTR BIDIRECTIONAL 12HXSON
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 12-XFDFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: DFN2514-12
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
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TJA1028TK/3V3/10:1 TJA1028.pdf
TJA1028TK/3V3/10:1
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 3.3V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
Produkt ist nicht verfügbar
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TJA1028TK/5V0/10:1 TJA1028.pdf
TJA1028TK/5V0/10:1
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
Produkt ist nicht verfügbar
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TJA1028TK/5V0/20:1 TJA1028.pdf
TJA1028TK/5V0/20:1
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
Produkt ist nicht verfügbar
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BLF6G27LS-50BN,118
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V CDFM6
Packaging: Tape & Reel (TR)
Package / Case: SOT-1112B
Current Rating (Amps): 12A
Mounting Type: Chassis Mount
Frequency: 2.5GHz ~ 2.7GHz
Configuration: Dual
Power - Output: 3W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: CDFM6
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 430 mA
Produkt ist nicht verfügbar
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LPC1111FHN33/102'5 LPC111X.pdf
LPC1111FHN33/102'5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4000+2 EUR
Mindestbestellmenge: 4000
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LPC1114FBD48/301:1 LPC111X.pdf
LPC1114FBD48/301:1
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1342FBD48,118 LPC1311_13_42_43.pdf
LPC1342FBD48,118
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1342FHN33,518 LPC1311_13_42_43.pdf
LPC1342FHN33,518
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1754FBD80,518 LPC1759_58_56_54_52_51.pdf
LPC1754FBD80,518
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P80C32UBAA,518 80C31_80C32.pdf
P80C32UBAA,518
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 44PLCC
Packaging: Tape & Reel (TR)
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 33MHz
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: UART/USART
Peripherals: POR
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P80C32UFAA,518 80C31_80C32.pdf
P80C32UFAA,518
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 44PLCC
Packaging: Tape & Reel (TR)
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 33MHz
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: UART/USART
Peripherals: POR
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P80C552EBA/08,518 80C552_83C552.pdf
P80C552EBA/08,518
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 68PLCC
Packaging: Tape & Reel (TR)
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 256 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: 8051
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, I²C, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 68-PLCC (24.18x24.18)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P80C552EFA/08,518 80C552_83C552.pdf
P80C552EFA/08,518
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 68PLCC
Packaging: Tape & Reel (TR)
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: 8051
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, I²C, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 68-PLCC (24.18x24.18)
Part Status: Obsolete
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P80C552IBA/08,518 80C552_83C552.pdf
P80C552IBA/08,518
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 68PLCC
Produkt ist nicht verfügbar
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P80C592FFA/00,518 P8XC592.pdf
P80C592FFA/00,518
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 68PLCC
Produkt ist nicht verfügbar
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P80CE598FFB/00,518 P8XCE598.pdf
P80CE598FFB/00,518
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 80QFP
Produkt ist nicht verfügbar
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P87LPC760BDH,118 P87LPC760.pdf
P87LPC760BDH,118
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1KB OTP 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 1KB (1K x 8)
RAM Size: 128 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, WDT
Supplier Device Package: 14-TSSOP
Number of I/O: 12
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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P87LPC769HD,518 P87LPC769.pdf
P87LPC769HD,518
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB OTP 20SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Data Converters: A/D 4x8b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, WDT
Supplier Device Package: 20-SO
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P89LPC921FDH,518 P89LPC920_921_922_9221.pdf
P89LPC921FDH,518
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P89LPC9221FDH,518 P89LPC920_921_922_9221.pdf
P89LPC9221FDH,518
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P89LPC935FDH,518 P89LPC933_934_935_936.pdf
P89LPC935FDH,518
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 12MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 8051
Data Converters: A/D 8x8b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TDA18250HN/C1,518 TDA18250HN_SDS.pdf
TDA18250HN/C1,518
Hersteller: NXP USA Inc.
Description: IC VIDEO TUNER 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V
Applications: Consumer Video
Supplier Device Package: 48-HVQFN (7x7)
Control Interface: I2C
Produkt ist nicht verfügbar
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TDA19989AETC189,51 TDA19989.pdf
TDA19989AETC189,51
Hersteller: NXP USA Inc.
Description: IC VIDEO HDMI 1.3 TRANS 64TFBGA
Produkt ist nicht verfügbar
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TDA8296HN/C1,518 TDA8296.pdf
TDA8296HN/C1,518
Hersteller: NXP USA Inc.
Description: RF DEMODULATOR IC 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Demodulator
Voltage - Supply: 1.1V ~ 3.6V
Supplier Device Package: 40-HVQFN (6x6)
Current - Supply: 65 mA
Produkt ist nicht verfügbar
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TEA1713T/N2,518 TEA1713T.pdf
TEA1713T/N2,518
Hersteller: NXP USA Inc.
Description: IC PFC CTRLR DCM 500KHZ 24SO
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 70 ~ 276 VAC
Frequency - Switching: 500kHz
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 24-SO
Part Status: Active
Produkt ist nicht verfügbar
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TEA1733BT/N2,118 TEA1733BT.pdf
TEA1733BT/N2,118
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 72%
Frequency - Switching: 123kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Part Status: Obsolete
Power (Watts): 75 W
Produkt ist nicht verfügbar
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TEA1733LT/N2,118 TEA1733LT.pdf
TEA1733LT/N2,118
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 72%
Frequency - Switching: 66.5kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Part Status: Obsolete
Power (Watts): 75 W
Produkt ist nicht verfügbar
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TEA1733MT/N2,118 TEA1733MT.pdf
TEA1733MT/N2,118
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 72%
Frequency - Switching: 91.5kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 12V ~ 30V
Supplier Device Package: 8-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 20.6 V
Part Status: Obsolete
Power (Watts): 75 W
Produkt ist nicht verfügbar
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TEA1751AT/N1,518
TEA1751AT/N1,518
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Frequency - Switching: 100kHz ~ 150kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 8V ~ 38V
Supplier Device Package: 16-SO
Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 15 V
Part Status: Active
Power (Watts): 250 W
Produkt ist nicht verfügbar
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TEF6623T/V1,518
TEF6623T/V1,518
Hersteller: NXP USA Inc.
Description: RF RCVR FM TUNER CAR RADIO 32SO
Features: RDS Demodulator + Band Pass Filter
Packaging: Tape & Reel (TR)
Package / Case: 32-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Modulation or Protocol: FM
Data Interface: PCB, Surface Mount
Operating Temperature: -20°C ~ 85°C
Voltage - Supply: 8.5V
Applications: FM Radio Receiver
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 32-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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TJA1021TK/10/C,118 TJA1021.pdf
TJA1021TK/10/C,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 175 mV
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJA1028TK/3V3/10,1 TJA1028.pdf
TJA1028TK/3V3/10,1
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 3.3V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
Produkt ist nicht verfügbar
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TJA1028TK/3V3/20,1 TJA1028.pdf
TJA1028TK/3V3/20,1
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 3.3V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
Produkt ist nicht verfügbar
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TJA1028TK/5V0/10,1 TJA1028.pdf
TJA1028TK/5V0/10,1
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
Produkt ist nicht verfügbar
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TJA1028TK/5V0/20,1 TJA1028.pdf
TJA1028TK/5V0/20,1
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
Produkt ist nicht verfügbar
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TJA1051T/E,118 TJA1051.pdf
TJA1051T/E,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 120 mV
Duplex: Half
Part Status: Active
auf Bestellung 7500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+1 EUR
5000+0.98 EUR
7500+0.97 EUR
Mindestbestellmenge: 2500
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TJA1051TK/3,118 TJA1051.pdf
TJA1051TK/3,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 120 mV
Duplex: Half
Part Status: Active
auf Bestellung 24000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6000+0.97 EUR
12000+0.96 EUR
Mindestbestellmenge: 6000
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NVT2004TL,115 NVT2003_06.pdf
NVT2004TL,115
Hersteller: NXP USA Inc.
Description: IC TRNSLTR BIDIRECTIONAL 12HXSON
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 12-XFDFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: DFN2514-12
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
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OM13013,598 LPC122X.pdf
OM13013,598
Hersteller: NXP USA Inc.
Description: LPC1227 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), LCD, J-Link Lite Programmer
Core Processor: ARM® Cortex®-M0
Board Type: Evaluation Platform
Utilized IC / Part: LPC1227
Part Status: Not For New Designs
Produkt ist nicht verfügbar
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DAC1408D650W2/DB,598
DAC1408D650W2/DB,598
Hersteller: NXP USA Inc.
Description: BOARD DEMO DAC1408D650
Packaging: Box
Number of Bits: 14
Data Interface: Serial JESD204A, SPI™
Sampling Rate (Per Second): 650M
Utilized IC / Part: DAC1408D650
Supplied Contents: Board(s)
Number of DAC's: 2
DAC Type: Current
Settling Time: 20 ns
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+618.6 EUR
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HSDC-JAKIT1W2/DB HSDC-JAKITW2-DB_Description%26KeyFeatures.pdf
HSDC-JAKIT1W2/DB
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR ADC1413D DAC1408D
Packaging: Box
Function: ADC/DAC for Lattice ECP3 FPGA
Type: Interface
Utilized IC / Part: ADC1413D, DAC1408D, ECP3 FPGA
Supplied Contents: Board(s), Cable(s)
Primary Attributes: Loop Back Demo with 2 High Speed Converters
Embedded: Yes, FPGA / CPLD
Part Status: Obsolete
Contents: Board(s), Cable(s)
Secondary Attributes: USB Powered
Produkt ist nicht verfügbar
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ADC1112D125F1/DB,598
ADC1112D125F1/DB,598
Hersteller: NXP USA Inc.
Description: BOARD EVALUATION FOR ADC1112D125
Packaging: Box
Number of Bits: 11
Data Interface: Serial, CMOS Buffer
Sampling Rate (Per Second): 125M
Utilized IC / Part: ADC1112D125
Supplied Contents: Board(s), Cable(s), Power Supply
Number of A/D Converters: 2
Input Range: 1 ~ 2Vpp
Power (Typ) @ Conditions: 1.23W @ 125MSPS
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+569.73 EUR
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ADC1112D125F2/DB,5
ADC1112D125F2/DB,5
Hersteller: NXP USA Inc.
Description: BOARD EVALUATION FOR ADC1112D125
Packaging: Box
Number of Bits: 11
Data Interface: Serial, LVDS/DDR
Sampling Rate (Per Second): 125M
Utilized IC / Part: ADC1112D125
Supplied Contents: Board(s), Cable(s), Power Supply
Number of A/D Converters: 2
Input Range: 1 ~ 2Vpp
Power (Typ) @ Conditions: 1.23W @ 125MSPS
Produkt ist nicht verfügbar
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ADC0801S040/DB DS_568_ADC0801S040.pdf
ADC0801S040/DB
Hersteller: NXP USA Inc.
Description: BOARD EVALUATION FOR ADC0801S040
Packaging: Box
Number of Bits: 8
Data Interface: Parallel
Sampling Rate (Per Second): 40M
Utilized IC / Part: ADC0801S040
Supplied Contents: Board(s)
Number of A/D Converters: 1
Input Range: 1.8Vpp
Power (Typ) @ Conditions: 30mW @ 40MSPS
Contents: Board(s)
Produkt ist nicht verfügbar
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ADC0808S125/DB ADC0808S125_250.pdf
ADC0808S125/DB
Hersteller: NXP USA Inc.
Description: BOARD EVALUATION FOR ADC0808S125
Packaging: Box
Number of Bits: 8
Data Interface: Parallel
Sampling Rate (Per Second): 125M
Utilized IC / Part: ADC0808S125
Supplied Contents: Board(s)
Number of A/D Converters: 1
Input Range: 2Vpp
Power (Typ) @ Conditions: 240mW @ 125MSPS
Produkt ist nicht verfügbar
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ADC1115S125/DB,598
ADC1115S125/DB,598
Hersteller: NXP USA Inc.
Description: BOARD EVALUATION FOR ADC1115S125
Packaging: Box
Number of Bits: 11
Data Interface: SPI
Sampling Rate (Per Second): 125M
Utilized IC / Part: ADC1115S125
Supplied Contents: Board(s), Cable(s), Power Supply
Number of A/D Converters: 1
Input Range: 1 ~ 2Vpp
Power (Typ) @ Conditions: 840mW @ 125MSPS
Contents: Board(s), Cable(s), Power Supply
Produkt ist nicht verfügbar
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ADC1212D125F2/DB,598 ADC_DAC_Gde_2010.pdf
ADC1212D125F2/DB,598
Hersteller: NXP USA Inc.
Description: BOARD EVALUATION FOR ADC1212D125
Packaging: Box
Number of Bits: 12
Data Interface: Serial, LVDS/DDR
Sampling Rate (Per Second): 125M
Utilized IC / Part: ADC1212D125
Supplied Contents: Board(s), Cable(s), Power Supply
Number of A/D Converters: 2
Input Range: 1 ~ 2Vpp
Power (Typ) @ Conditions: 1.23W @ 125MSPS
Part Status: Obsolete
Produkt ist nicht verfügbar
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PBS12C128SLK
Hersteller: NXP USA Inc.
Description: MC9S12C128 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS12
Board Type: Evaluation Platform
Utilized IC / Part: MC9S12C128
Part Status: Obsolete
Produkt ist nicht verfügbar
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PSMN011-30YL,115
PSMN011-30YL,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 51A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 51A (Tj)
Rds On (Max) @ Id, Vgs: 10.7mOhm @ 15A, 10V
Power Dissipation (Max): 49W (Tc)
Vgs(th) (Max) @ Id: 2.15V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 14.8 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 726 pF @ 15 V
Produkt ist nicht verfügbar
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PSMN8R0-30YL,115
PSMN8R0-30YL,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 62A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 62A (Tc)
Rds On (Max) @ Id, Vgs: 8.3mOhm @ 15A, 10V
Power Dissipation (Max): 56W (Tc)
Vgs(th) (Max) @ Id: 2.15V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 18.3 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1005 pF @ 15 V
Produkt ist nicht verfügbar
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PSMN8R0-30YL,115
PSMN8R0-30YL,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 62A LFPAK56
Packaging: Cut Tape (CT)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 62A (Tc)
Rds On (Max) @ Id, Vgs: 8.3mOhm @ 15A, 10V
Power Dissipation (Max): 56W (Tc)
Vgs(th) (Max) @ Id: 2.15V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 18.3 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1005 pF @ 15 V
Produkt ist nicht verfügbar
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PVR100AZ-B3V0,115 PVR100AZ-B_Series.pdf
PVR100AZ-B3V0,115
Hersteller: NXP USA Inc.
Description: TRANS NPN 45V 0.1A SC73
Produkt ist nicht verfügbar
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