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MPC8308-NSG NXP USA Inc. MPC8308-NSG_QSG.pdf Description: REF DESIGN SMART GATEWAY MPC8308
Produkt ist nicht verfügbar
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TWRPI-MMA845XQ TWRPI-MMA845XQ NXP USA Inc. Tower-Mech-Brd_Robot_FS.pdf Description: TOWER SYST XTRINSIC ACCELEROMETR
Packaging: Box
Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g
Interface: I2C
Voltage - Supply: 1.95V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA8451
Supplied Contents: Board(s)
Embedded: No
Sensing Range: ±2g, 4g, 8g
Part Status: Active
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MM912I637AM2EPR2 MM912I637AM2EPR2 NXP USA Inc. www.nxp.com Description: IC MCU LIN BATT MONITOR 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI, SPI
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (96KB)
Applications: Battery Monitor
Core Processor: S12
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 8
DigiKey Programmable: Not Verified
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MM912I637AV1EPR2 MM912I637AV1EPR2 NXP USA Inc. MM912x637.pdf Description: IC MCU LIN BATT MONITOR 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI, SPI
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (96KB)
Applications: Battery Monitor
Core Processor: S12
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 8
DigiKey Programmable: Not Verified
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MM912J637AV1EPR2 MM912J637AV1EPR2 NXP USA Inc. Description: IC MCU LIN BATT MONITOR 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI, SPI
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (128kB)
Applications: Battery Monitor
Core Processor: S12
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 8
DigiKey Programmable: Not Verified
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MRFE6VP8600HR6 MRFE6VP8600HR6 NXP USA Inc. Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 860MHz
Configuration: Dual
Power - Output: 125W
Gain: 19.3dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 1.4 A
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MRFE6VP8600HSR6 MRFE6VP8600HSR6 NXP USA Inc. Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230S
Mounting Type: Chassis Mount
Frequency: 860MHz
Configuration: Dual
Power - Output: 125W
Gain: 19.3dB
Technology: LDMOS
Supplier Device Package: NI-1230S
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 1.4 A
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MMA20312BVT1 MMA20312BVT1 NXP USA Inc. Description: IC AMP LTE 1.8GHZ-2.2GHZ 12QFN
Packaging: Tape & Reel (TR)
Package / Case: 12-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.8GHz ~ 2.2GHz
RF Type: LTE, PCS, TD-SCDMA, UMTS
Voltage - Supply: 5V
Gain: 27.2dB
Current - Supply: 70mA
Noise Figure: 3.3dB
P1dB: 28.2dBm
Test Frequency: 2.14GHz
Supplier Device Package: 12-QFN (3x3)
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MML20211HT1 MML20211HT1 NXP USA Inc. MML20211H.pdf Description: IC RF AMP LTE 1.4GHZ-2.8GHZ 8DFN
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SPC5604BF2MLQ6 SPC5604BF2MLQ6 NXP USA Inc. MPC5604BC.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
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MPC8377CVRAJFA MPC8377CVRAJFA NXP USA Inc. MPC8377E.pdf Description: IC MPU MPC83XX 533MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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MPC8377CVRANGA MPC8377CVRANGA NXP USA Inc. MPC8377E.pdf Description: IC MPU MPC83XX 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Part Status: Obsolete
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MPC8377ECVRAGDA MPC8377ECVRAGDA NXP USA Inc. MPC8377E.pdf Description: IC MPU MPC83XX 400MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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MPC8377ECVRAJFA MPC8377ECVRAJFA NXP USA Inc. MPC8377E.pdf Description: IC MPU MPC83XX 533MHZ 689TEBGA
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MPC8377ECVRALGA MPC8377ECVRALGA NXP USA Inc. MPC8377E.pdf Description: IC MPU MPC83XX 667MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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MPC8377ECVRANGA MPC8377ECVRANGA NXP USA Inc. MPC8377E.pdf Description: IC MPU MPC83XX 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
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MPC8377EVRAGDA MPC8377EVRAGDA NXP USA Inc. MPC8377E.pdf Description: IC MPU MPC83XX 400MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)
1+127.81 EUR
10+106.56 EUR
27+100.86 EUR
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MPC8378CVRALGA MPC8378CVRALGA NXP USA Inc. MPC837XFFS.pdf Description: IC MPU MPC83XX 667MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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MPC8378CVRANGA MPC8378CVRANGA NXP USA Inc. MPC837XFFS.pdf Description: IC MPU MPC83XX 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Part Status: Obsolete
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MPC8378ECVRAJFA MPC8378ECVRAJFA NXP USA Inc. MPC837XFFS.pdf Description: IC MPU MPC83XX 533MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
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MPC8378ECVRANGA MPC8378ECVRANGA NXP USA Inc. MPC837XFFS.pdf Description: IC MPU MPC83XX 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Part Status: Obsolete
Produkt ist nicht verfügbar
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MPC8378VRAGDA MPC8378VRAGDA NXP USA Inc. MPC837XFFS.pdf Description: IC MPU MPC83XX 400MHZ 689TEBGA
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MPC8379CVRANGA MPC8379CVRANGA NXP USA Inc. MPC837XFFS.pdf Description: IC MPU MPC83XX 800MHZ 689TEBGA
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (4)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MPC8379ECVRALGA MPC8379ECVRALGA NXP USA Inc. MPC837XFFS.pdf Description: IC MPU MPC83XX 667MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (4)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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MPC8379ECVRANGA MPC8379ECVRANGA NXP USA Inc. MPC837XFFS.pdf Description: IC MPU MPC83XX 800MHZ 689TEBGA
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MPC8379EVRAJFA MPC8379EVRAJFA NXP USA Inc. Description: MPU POWERQUICC II 533MHZ 689PBGA
Produkt ist nicht verfügbar
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MPC8379EVRANGA MPC8379EVRANGA NXP USA Inc. MPC837XFFS.pdf Description: IC MPU MPC83XX 800MHZ 689TEBGA
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MPC8379VRAJFA MPC8379VRAJFA NXP USA Inc. MPC837XFFS.pdf Description: IC MPU MPC83XX 533MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (4)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Part Status: Obsolete
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10+126.85 EUR
27+120.26 EUR
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MPC8379VRALGA MPC8379VRALGA NXP USA Inc. MPC837XFFS.pdf Description: IC MPU MPC83XX 667MHZ 689TEBGA
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (4)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MM912J637AV1EP MM912J637AV1EP NXP USA Inc. Description: IC MCU LIN BATT MONITOR 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI, SPI
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (128kB)
Applications: Battery Monitor
Core Processor: S12
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC33889DPEG MC33889DPEG NXP USA Inc. MC33889.pdf Description: IC INTERFACE SPECIALIZED 28SOIC
Produkt ist nicht verfügbar
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OM13016,598 OM13016,598 NXP USA Inc. OM13016_Content.pdf Description: BOARD NGX MBED LPCXPRESSO
Packaging: Bulk
For Use With/Related Products: LPCXpresso, mBed and NGX mX-Stamp Boards
Accessory Type: Base Board
Produkt ist nicht verfügbar
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OM13021,598 OM13021,598 NXP USA Inc. LPC11U1X.pdf Description: LPC11U14 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC11U14
Part Status: Obsolete
Produkt ist nicht verfügbar
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PMN20EN,115 PMN20EN,115 NXP USA Inc. Description: MOSFET N-CH 30V 6.7A 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6.7A (Tj)
Rds On (Max) @ Id, Vgs: 20mOhm @ 6.7A, 10V
Power Dissipation (Max): 545mW (Ta)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SC-74
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 18.6 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 630 pF @ 15 V
Produkt ist nicht verfügbar
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74CBTLV3861DK,118 74CBTLV3861DK,118 NXP USA Inc. 74CBTLV3861.pdf Description: IC BUS SWITCH 10 X 1:1 24SSOP
Packaging: Tape & Reel (TR)
Package / Case: 24-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 10 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.3V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 24-SSOP
Produkt ist nicht verfügbar
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LD6806CX4/18H,315 LD6806CX4/18H,315 NXP USA Inc. LD6806_Series.pdf Description: IC REG LINEAR 1.8V 200MA 4-WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.8V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.1V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Produkt ist nicht verfügbar
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LD6806CX4/25H,315 LD6806CX4/25H,315 NXP USA Inc. LD6806_Series.pdf Description: IC REG LINEAR 2.5V 200MA 4WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.1V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
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LD6806F/23H,115 LD6806F/23H,115 NXP USA Inc. LD6806_Series.pdf Description: IC REG LINEAR 2.3V 200MA 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Output (Min/Fixed): 2.3V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
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NX1117CE33Z,115 NX1117CE33Z,115 NXP USA Inc. NX1117C(E).pdf Description: IC REG LINEAR 3.3V 1A SOT223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 1A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 6 mA
Voltage - Input (Max): 20V
Number of Regulators: 1
Supplier Device Package: SC-73
Voltage - Output (Min/Fixed): 3.3V
Part Status: Obsolete
PSRR: 62dB (120Hz)
Voltage Dropout (Max): 1.2V @ 800mA
Protection Features: Over Current, Over Temperature
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NX1117CEADJZ,115 NX1117CEADJZ,115 NXP USA Inc. NX1117C(E).pdf Description: IC REG LINEAR POS ADJ 1A SC73
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Output Type: Adjustable
Mounting Type: Surface Mount
Current - Output: 1A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 120 µA
Voltage - Input (Max): 20V
Number of Regulators: 1
Supplier Device Package: SC-73
Voltage - Output (Max): 18.8V
Voltage - Output (Min/Fixed): 1.25V
Part Status: Obsolete
PSRR: 69dB (120Hz)
Voltage Dropout (Max): 1.2V @ 800mA
Protection Features: Over Current, Over Temperature
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JN5142N/001,518 JN5142N/001,518 NXP USA Inc. Description: IC RF TXRX+MCU 802.15.4 40VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB ROM, 32kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: Zigbee®
Current - Receiving: 16.5mA
Current - Transmitting: 15mA
Supplier Device Package: 40-HVQFN (6x6)
RF Family/Standard: 802.15.4
Part Status: Active
DigiKey Programmable: Not Verified
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P5020DS-PA NXP USA Inc. P5_FS.pdf Description: P5020 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e5500
Utilized IC / Part: P5020
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P2041RDB-PA NXP USA Inc. P2041RDBFS.pdf Description: P2041 EVAL BRD
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PCA8536AT/Q900/1,1 PCA8536AT/Q900/1,1 NXP USA Inc. PCA8536.pdf Description: IC DRVR 7 SEGMENT 56TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LED, LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 20 Characters, 40 Characters, 320 Elements
Supplier Device Package: 56-TSSOP
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PCA8536BT/Q900/1,1 PCA8536BT/Q900/1,1 NXP USA Inc. PCA8536.pdf Description: IC DRVR 7 SEGMENT 56TSSOP
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PCF8536AT/1,118 PCF8536AT/1,118 NXP USA Inc. PCF8536.pdf Description: IC DRVR 7 SEGMENT 56TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LED, LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 20 Characters, 40 Characters, 320 Elements
Supplier Device Package: 56-TSSOP
Part Status: Obsolete
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PCF8536BT/1,118 PCF8536BT/1,118 NXP USA Inc. PCF8536.pdf Description: IC DRVR 7 SEGMENT 56TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LED, LCD
Mounting Type: Surface Mount
Interface: SPI
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 20 Characters, 40 Characters, 320 Elements
Supplier Device Package: 56-TSSOP
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PCA8536BT/Q900/1,1 PCA8536BT/Q900/1,1 NXP USA Inc. PCA8536.pdf Description: IC DRVR 7 SEGMENT 56TSSOP
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ADC1415S125F1/DB ADC1415S125F1/DB NXP USA Inc. ADC1415S_Series.pdf Description: BOARD DEMO FOR ADC1415S125
Packaging: Box
Number of Bits: 14
Data Interface: Serial
Sampling Rate (Per Second): 125M
Utilized IC / Part: ADC1415S125
Supplied Contents: Board(s), Cable(s), Power Supply
Number of A/D Converters: 1
Input Range: 1 ~ 2Vpp
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ADC1415S125F2/DB ADC1415S125F2/DB NXP USA Inc. ADC1415S_Series.pdf Description: BOARD DEMO FOR ADC1415S125
Packaging: Box
Number of Bits: 14
Data Interface: Serial
Sampling Rate (Per Second): 125M
Utilized IC / Part: ADC1415S125
Supplied Contents: Board(s), Cable(s), Power Supply
Number of A/D Converters: 1
Input Range: 1 ~ 2Vpp
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MMA1220KEG MMA1220KEG NXP USA Inc. MMA1220KEG.pdf Description: IC SENSOR ACCEL +/-8G 16-SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: Z
Acceleration Range: ±8G
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 250Hz
Supplier Device Package: 16-SOIC
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BFU660F,115 BFU660F,115 NXP USA Inc. BFU660F.pdf Description: RF TRANS NPN 5.5V 21GHZ 4-DFP
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 12dB ~ 21dB
Power - Max: 225mW
Current - Collector (Ic) (Max): 60mA
Voltage - Collector Emitter Breakdown (Max): 5.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 90 @ 10mA, 2V
Frequency - Transition: 21GHz
Noise Figure (dB Typ @ f): 0.6dB ~ 1.2dB @ 1.5GHz ~ 5.8GHz
Supplier Device Package: 4-DFP
Part Status: Active
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BFU690F,115 BFU690F,115 NXP USA Inc. BFU690F.pdf Description: RF TRANS NPN 5.5V 18GHZ 4-DFP
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 15.5dB ~ 18.5dB
Power - Max: 230mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 5.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 90 @ 20mA, 2V
Frequency - Transition: 18GHz
Noise Figure (dB Typ @ f): 0.6dB ~ 0.7dG @ 1.5GHz ~ 2.4GHz
Supplier Device Package: 4-DFP
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BFU710F,115 BFU710F,115 NXP USA Inc. BFU710F.pdf Description: RF TRANS NPN 2.8V 43GHZ 4DFP
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Power - Max: 136mW
Current - Collector (Ic) (Max): 10mA
Voltage - Collector Emitter Breakdown (Max): 2.8V
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 1mA, 2V
Frequency - Transition: 43GHz
Noise Figure (dB Typ @ f): 0.85dB ~ 1.45dB @ 5.8GHz ~ 12GHz
Supplier Device Package: 4-DFP
Part Status: Active
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BFU730F,115 BFU730F,115 NXP USA Inc. BFU730F.pdf Description: RF TRANS NPN 2.8V 55GHZ 4-DFP
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Power - Max: 197mW
Current - Collector (Ic) (Max): 30mA
Voltage - Collector Emitter Breakdown (Max): 2.8V
DC Current Gain (hFE) (Min) @ Ic, Vce: 205 @ 2mA, 2V
Frequency - Transition: 55GHz
Noise Figure (dB Typ @ f): 0.8dB ~ 1.3dB @ 5.8GHz ~ 12GHz
Supplier Device Package: 4-DFP
Part Status: Active
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BFU760F,115 BFU760F,115 NXP USA Inc. BFU760F.pdf Description: RF TRANS NPN 2.8V 45GHZ 4-DFP
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Power - Max: 220mW
Current - Collector (Ic) (Max): 70mA
Voltage - Collector Emitter Breakdown (Max): 2.8V
DC Current Gain (hFE) (Min) @ Ic, Vce: 155 @ 10mA, 2V
Frequency - Transition: 45GHz
Noise Figure (dB Typ @ f): 0.4dB ~ 0.5dB @ 1.5GHz ~ 2.4GHz
Supplier Device Package: 4-DFP
Part Status: Active
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LPC11U24FBD48/401, LPC11U24FBD48/401, NXP USA Inc. LPC11U2X.pdf Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
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LPC11U24FBD64/401, LPC11U24FBD64/401, NXP USA Inc. LPC11U2X.pdf Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
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LPC11U24FHN33/401, LPC11U24FHN33/401, NXP USA Inc. LPC11U2X.pdf Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
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LPC11U23FBD48/301, LPC11U23FBD48/301, NXP USA Inc. LPC11U6X.pdf Description: IC MCU 32BIT 24KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
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MPC8308-NSG MPC8308-NSG_QSG.pdf
Hersteller: NXP USA Inc.
Description: REF DESIGN SMART GATEWAY MPC8308
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TWRPI-MMA845XQ Tower-Mech-Brd_Robot_FS.pdf
TWRPI-MMA845XQ
Hersteller: NXP USA Inc.
Description: TOWER SYST XTRINSIC ACCELEROMETR
Packaging: Box
Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g
Interface: I2C
Voltage - Supply: 1.95V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA8451
Supplied Contents: Board(s)
Embedded: No
Sensing Range: ±2g, 4g, 8g
Part Status: Active
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MM912I637AM2EPR2 www.nxp.com
MM912I637AM2EPR2
Hersteller: NXP USA Inc.
Description: IC MCU LIN BATT MONITOR 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI, SPI
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (96KB)
Applications: Battery Monitor
Core Processor: S12
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 8
DigiKey Programmable: Not Verified
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MM912I637AV1EPR2 MM912x637.pdf
MM912I637AV1EPR2
Hersteller: NXP USA Inc.
Description: IC MCU LIN BATT MONITOR 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI, SPI
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (96KB)
Applications: Battery Monitor
Core Processor: S12
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 8
DigiKey Programmable: Not Verified
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MM912J637AV1EPR2
MM912J637AV1EPR2
Hersteller: NXP USA Inc.
Description: IC MCU LIN BATT MONITOR 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI, SPI
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (128kB)
Applications: Battery Monitor
Core Processor: S12
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 8
DigiKey Programmable: Not Verified
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MRFE6VP8600HR6
MRFE6VP8600HR6
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 860MHz
Configuration: Dual
Power - Output: 125W
Gain: 19.3dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 1.4 A
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MRFE6VP8600HSR6
MRFE6VP8600HSR6
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230S
Mounting Type: Chassis Mount
Frequency: 860MHz
Configuration: Dual
Power - Output: 125W
Gain: 19.3dB
Technology: LDMOS
Supplier Device Package: NI-1230S
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 1.4 A
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MMA20312BVT1
MMA20312BVT1
Hersteller: NXP USA Inc.
Description: IC AMP LTE 1.8GHZ-2.2GHZ 12QFN
Packaging: Tape & Reel (TR)
Package / Case: 12-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.8GHz ~ 2.2GHz
RF Type: LTE, PCS, TD-SCDMA, UMTS
Voltage - Supply: 5V
Gain: 27.2dB
Current - Supply: 70mA
Noise Figure: 3.3dB
P1dB: 28.2dBm
Test Frequency: 2.14GHz
Supplier Device Package: 12-QFN (3x3)
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MML20211HT1 MML20211H.pdf
MML20211HT1
Hersteller: NXP USA Inc.
Description: IC RF AMP LTE 1.4GHZ-2.8GHZ 8DFN
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SPC5604BF2MLQ6 MPC5604BC.pdf
SPC5604BF2MLQ6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
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MPC8377CVRAJFA MPC8377E.pdf
MPC8377CVRAJFA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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MPC8377CVRANGA MPC8377E.pdf
MPC8377CVRANGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Part Status: Obsolete
Produkt ist nicht verfügbar
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MPC8377ECVRAGDA MPC8377E.pdf
MPC8377ECVRAGDA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
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MPC8377ECVRAJFA MPC8377E.pdf
MPC8377ECVRAJFA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 689TEBGA
Produkt ist nicht verfügbar
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MPC8377ECVRALGA MPC8377E.pdf
MPC8377ECVRALGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 667MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
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MPC8377ECVRANGA MPC8377E.pdf
MPC8377ECVRANGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Produkt ist nicht verfügbar
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MPC8377EVRAGDA MPC8377E.pdf
MPC8377EVRAGDA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+127.81 EUR
10+106.56 EUR
27+100.86 EUR
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MPC8378CVRALGA MPC837XFFS.pdf
MPC8378CVRALGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 667MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
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MPC8378CVRANGA MPC837XFFS.pdf
MPC8378CVRANGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Part Status: Obsolete
Produkt ist nicht verfügbar
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MPC8378ECVRAJFA MPC837XFFS.pdf
MPC8378ECVRAJFA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
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MPC8378ECVRANGA MPC837XFFS.pdf
MPC8378ECVRANGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Part Status: Obsolete
Produkt ist nicht verfügbar
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MPC8378VRAGDA MPC837XFFS.pdf
MPC8378VRAGDA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 689TEBGA
Produkt ist nicht verfügbar
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MPC8379CVRANGA MPC837XFFS.pdf
MPC8379CVRANGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 800MHZ 689TEBGA
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (4)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MPC8379ECVRALGA MPC837XFFS.pdf
MPC8379ECVRALGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 667MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (4)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
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MPC8379ECVRANGA MPC837XFFS.pdf
MPC8379ECVRANGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 800MHZ 689TEBGA
Produkt ist nicht verfügbar
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MPC8379EVRAJFA
MPC8379EVRAJFA
Hersteller: NXP USA Inc.
Description: MPU POWERQUICC II 533MHZ 689PBGA
Produkt ist nicht verfügbar
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MPC8379EVRANGA MPC837XFFS.pdf
MPC8379EVRANGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 800MHZ 689TEBGA
Produkt ist nicht verfügbar
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MPC8379VRAJFA MPC837XFFS.pdf
MPC8379VRAJFA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (4)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Part Status: Obsolete
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+151.43 EUR
10+126.85 EUR
27+120.26 EUR
Im Einkaufswagen  Stück im Wert von  UAH
MPC8379VRALGA MPC837XFFS.pdf
MPC8379VRALGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 667MHZ 689TEBGA
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (4)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MM912J637AV1EP
MM912J637AV1EP
Hersteller: NXP USA Inc.
Description: IC MCU LIN BATT MONITOR 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI, SPI
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (128kB)
Applications: Battery Monitor
Core Processor: S12
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC33889DPEG MC33889.pdf
MC33889DPEG
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SOIC
Produkt ist nicht verfügbar
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OM13016,598 OM13016_Content.pdf
OM13016,598
Hersteller: NXP USA Inc.
Description: BOARD NGX MBED LPCXPRESSO
Packaging: Bulk
For Use With/Related Products: LPCXpresso, mBed and NGX mX-Stamp Boards
Accessory Type: Base Board
Produkt ist nicht verfügbar
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OM13021,598 LPC11U1X.pdf
OM13021,598
Hersteller: NXP USA Inc.
Description: LPC11U14 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC11U14
Part Status: Obsolete
Produkt ist nicht verfügbar
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PMN20EN,115
PMN20EN,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 6.7A 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6.7A (Tj)
Rds On (Max) @ Id, Vgs: 20mOhm @ 6.7A, 10V
Power Dissipation (Max): 545mW (Ta)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SC-74
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 18.6 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 630 pF @ 15 V
Produkt ist nicht verfügbar
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74CBTLV3861DK,118 74CBTLV3861.pdf
74CBTLV3861DK,118
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 10 X 1:1 24SSOP
Packaging: Tape & Reel (TR)
Package / Case: 24-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 10 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.3V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 24-SSOP
Produkt ist nicht verfügbar
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LD6806CX4/18H,315 LD6806_Series.pdf
LD6806CX4/18H,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.8V 200MA 4-WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.8V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.1V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Produkt ist nicht verfügbar
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LD6806CX4/25H,315 LD6806_Series.pdf
LD6806CX4/25H,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.5V 200MA 4WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.1V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Produkt ist nicht verfügbar
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LD6806F/23H,115 LD6806_Series.pdf
LD6806F/23H,115
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.3V 200MA 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Output (Min/Fixed): 2.3V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Produkt ist nicht verfügbar
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NX1117CE33Z,115 NX1117C(E).pdf
NX1117CE33Z,115
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 3.3V 1A SOT223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 1A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 6 mA
Voltage - Input (Max): 20V
Number of Regulators: 1
Supplier Device Package: SC-73
Voltage - Output (Min/Fixed): 3.3V
Part Status: Obsolete
PSRR: 62dB (120Hz)
Voltage Dropout (Max): 1.2V @ 800mA
Protection Features: Over Current, Over Temperature
Produkt ist nicht verfügbar
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NX1117CEADJZ,115 NX1117C(E).pdf
NX1117CEADJZ,115
Hersteller: NXP USA Inc.
Description: IC REG LINEAR POS ADJ 1A SC73
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Output Type: Adjustable
Mounting Type: Surface Mount
Current - Output: 1A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 120 µA
Voltage - Input (Max): 20V
Number of Regulators: 1
Supplier Device Package: SC-73
Voltage - Output (Max): 18.8V
Voltage - Output (Min/Fixed): 1.25V
Part Status: Obsolete
PSRR: 69dB (120Hz)
Voltage Dropout (Max): 1.2V @ 800mA
Protection Features: Over Current, Over Temperature
Produkt ist nicht verfügbar
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JN5142N/001,518
JN5142N/001,518
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB ROM, 32kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: Zigbee®
Current - Receiving: 16.5mA
Current - Transmitting: 15mA
Supplier Device Package: 40-HVQFN (6x6)
RF Family/Standard: 802.15.4
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P5020DS-PA P5_FS.pdf
Hersteller: NXP USA Inc.
Description: P5020 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e5500
Utilized IC / Part: P5020
Produkt ist nicht verfügbar
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P2041RDB-PA P2041RDBFS.pdf
Hersteller: NXP USA Inc.
Description: P2041 EVAL BRD
Produkt ist nicht verfügbar
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PCA8536AT/Q900/1,1 PCA8536.pdf
PCA8536AT/Q900/1,1
Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 56TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LED, LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 20 Characters, 40 Characters, 320 Elements
Supplier Device Package: 56-TSSOP
Produkt ist nicht verfügbar
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PCA8536BT/Q900/1,1 PCA8536.pdf
PCA8536BT/Q900/1,1
Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 56TSSOP
Produkt ist nicht verfügbar
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PCF8536AT/1,118 PCF8536.pdf
PCF8536AT/1,118
Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 56TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LED, LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 20 Characters, 40 Characters, 320 Elements
Supplier Device Package: 56-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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PCF8536BT/1,118 PCF8536.pdf
PCF8536BT/1,118
Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 56TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LED, LCD
Mounting Type: Surface Mount
Interface: SPI
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 20 Characters, 40 Characters, 320 Elements
Supplier Device Package: 56-TSSOP
Produkt ist nicht verfügbar
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PCA8536BT/Q900/1,1 PCA8536.pdf
PCA8536BT/Q900/1,1
Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 56TSSOP
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ADC1415S125F1/DB ADC1415S_Series.pdf
ADC1415S125F1/DB
Hersteller: NXP USA Inc.
Description: BOARD DEMO FOR ADC1415S125
Packaging: Box
Number of Bits: 14
Data Interface: Serial
Sampling Rate (Per Second): 125M
Utilized IC / Part: ADC1415S125
Supplied Contents: Board(s), Cable(s), Power Supply
Number of A/D Converters: 1
Input Range: 1 ~ 2Vpp
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1+586.75 EUR
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ADC1415S125F2/DB ADC1415S_Series.pdf
ADC1415S125F2/DB
Hersteller: NXP USA Inc.
Description: BOARD DEMO FOR ADC1415S125
Packaging: Box
Number of Bits: 14
Data Interface: Serial
Sampling Rate (Per Second): 125M
Utilized IC / Part: ADC1415S125
Supplied Contents: Board(s), Cable(s), Power Supply
Number of A/D Converters: 1
Input Range: 1 ~ 2Vpp
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1+586.75 EUR
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MMA1220KEG MMA1220KEG.pdf
MMA1220KEG
Hersteller: NXP USA Inc.
Description: IC SENSOR ACCEL +/-8G 16-SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: Z
Acceleration Range: ±8G
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 250Hz
Supplier Device Package: 16-SOIC
Produkt ist nicht verfügbar
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BFU660F,115 BFU660F.pdf
BFU660F,115
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 5.5V 21GHZ 4-DFP
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 12dB ~ 21dB
Power - Max: 225mW
Current - Collector (Ic) (Max): 60mA
Voltage - Collector Emitter Breakdown (Max): 5.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 90 @ 10mA, 2V
Frequency - Transition: 21GHz
Noise Figure (dB Typ @ f): 0.6dB ~ 1.2dB @ 1.5GHz ~ 5.8GHz
Supplier Device Package: 4-DFP
Part Status: Active
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11+1.67 EUR
17+1.05 EUR
100+0.68 EUR
500+0.53 EUR
1000+0.48 EUR
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BFU690F,115 BFU690F.pdf
BFU690F,115
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 5.5V 18GHZ 4-DFP
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 15.5dB ~ 18.5dB
Power - Max: 230mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 5.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 90 @ 20mA, 2V
Frequency - Transition: 18GHz
Noise Figure (dB Typ @ f): 0.6dB ~ 0.7dG @ 1.5GHz ~ 2.4GHz
Supplier Device Package: 4-DFP
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12+1.57 EUR
19+0.98 EUR
100+0.64 EUR
500+0.49 EUR
1000+0.44 EUR
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BFU710F,115 BFU710F.pdf
BFU710F,115
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 2.8V 43GHZ 4DFP
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Power - Max: 136mW
Current - Collector (Ic) (Max): 10mA
Voltage - Collector Emitter Breakdown (Max): 2.8V
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 1mA, 2V
Frequency - Transition: 43GHz
Noise Figure (dB Typ @ f): 0.85dB ~ 1.45dB @ 5.8GHz ~ 12GHz
Supplier Device Package: 4-DFP
Part Status: Active
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Anzahl Preis
12+1.58 EUR
18+0.99 EUR
100+0.64 EUR
500+0.49 EUR
1000+0.45 EUR
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BFU730F,115 BFU730F.pdf
BFU730F,115
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 2.8V 55GHZ 4-DFP
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Power - Max: 197mW
Current - Collector (Ic) (Max): 30mA
Voltage - Collector Emitter Breakdown (Max): 2.8V
DC Current Gain (hFE) (Min) @ Ic, Vce: 205 @ 2mA, 2V
Frequency - Transition: 55GHz
Noise Figure (dB Typ @ f): 0.8dB ~ 1.3dB @ 5.8GHz ~ 12GHz
Supplier Device Package: 4-DFP
Part Status: Active
auf Bestellung 11682 Stücke:
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12+1.53 EUR
19+0.95 EUR
100+0.62 EUR
500+0.48 EUR
1000+0.43 EUR
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BFU760F,115 BFU760F.pdf
BFU760F,115
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 2.8V 45GHZ 4-DFP
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Power - Max: 220mW
Current - Collector (Ic) (Max): 70mA
Voltage - Collector Emitter Breakdown (Max): 2.8V
DC Current Gain (hFE) (Min) @ Ic, Vce: 155 @ 10mA, 2V
Frequency - Transition: 45GHz
Noise Figure (dB Typ @ f): 0.4dB ~ 0.5dB @ 1.5GHz ~ 2.4GHz
Supplier Device Package: 4-DFP
Part Status: Active
auf Bestellung 5780 Stücke:
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14+1.28 EUR
22+0.81 EUR
100+0.52 EUR
500+0.4 EUR
1000+0.36 EUR
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LPC11U24FBD48/401, LPC11U2X.pdf
LPC11U24FBD48/401,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC11U24FBD64/401, LPC11U2X.pdf
LPC11U24FBD64/401,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 31 Stücke:
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3+7.09 EUR
10+5.32 EUR
25+4.99 EUR
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LPC11U24FHN33/401, LPC11U2X.pdf
LPC11U24FHN33/401,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 4085 Stücke:
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5+3.66 EUR
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LPC11U23FBD48/301, LPC11U6X.pdf
LPC11U23FBD48/301,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 126 Stücke:
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Anzahl Preis
3+6.72 EUR
10+5.1 EUR
25+4.69 EUR
100+4.25 EUR
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