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JN5148/J01,515 JN5148/J01,515 NXP USA Inc. JN5148-001.pdf Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB ROM, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.75dBm
Protocol: Zigbee®
Current - Receiving: 17.5mA
Data Rate (Max): 667kbps
Current - Transmitting: 15mA
Supplier Device Package: 56-HVQFN (8x8)
GPIO: 21
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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KMA210:115 KMA210:115 NXP USA Inc. KMA210.pdf Description: SENSOR ANGLE 180DEG PC PIN
Packaging: Tape & Reel (TR)
Package / Case: 3-SIP Module
Mounting Type: Through Hole
Output: Analog Voltage
Operating Temperature: -40°C ~ 160°C
Termination Style: PC Pin
Voltage - Supply: 4.5V ~ 5.5V
Linearity: ±1.2%
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: 3-SIP
Rotation Angle - Electrical, Mechanical: 0° ~ 180°
Output Signal: Clockwise Increase
Part Status: Obsolete
Produkt ist nicht verfügbar
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KMZ60,115 KMZ60,115 NXP USA Inc. KMZ60.pdf Description: SENSOR ANGLE 360DEG SMD
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: Wheatstone Bridge
Operating Temperature: -40°C ~ 150°C
Termination Style: Gull Wing
Voltage - Supply: 2.7V ~ 5.5V
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: 8-SO
Rotation Angle - Electrical, Mechanical: 0° ~ 360°
Part Status: Active
Resistance: 5 kOhms
Produkt ist nicht verfügbar
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NCX2220GU,115 NCX2220GU,115 NXP USA Inc. NCX2220.pdf Description: IC COMPARATOR 2 GEN PUR 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: DFN1714-8
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Part Status: Obsolete
Produkt ist nicht verfügbar
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NTB0101GF,132 NTB0101GF,132 NXP USA Inc. NTB0101.pdf Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-XSON, SOT891 (1x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Number of Circuits: 1
Produkt ist nicht verfügbar
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NTB0101GM,115 NTB0101GM,115 NXP USA Inc. NTB0101.pdf Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Number of Circuits: 1
Produkt ist nicht verfügbar
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NTB0104BQ,115 NTB0104BQ,115 NXP USA Inc. NTB0104.pdf Description: IC XLTR VL BIDIR 14-DHVQFN
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 14-VFQFN Exposed Pad
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 14-DHVQFN (2.5x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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NTS0104BQ,115 NTS0104BQ,115 NXP USA Inc. NTS0104.pdf Description: IC TRANSLATOR BIDIR 14DHVQFN
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 14-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 14-DHVQFN (2.5x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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NTS0104GU12,115 NTS0104GU12,115 NXP USA Inc. NTS0104.pdf Description: IC TRANSLTR BIDIRECTIONAL 12XQFN
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 12-XFQFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 12-XQFN (2x1.7)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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NX3DV3899HR,115 NX3DV3899HR,115 NXP USA Inc. NX3DV3899.pdf Description: IC SWITCH DPDTX2 3.3OHM 16HXQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 3.3Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 4pC
Crosstalk: -90dB @ 1MHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:2
Channel-to-Channel Matching (ΔRon): 700mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 8pF
Current - Leakage (IS(off)) (Max): 5nA
Part Status: Obsolete
Number of Circuits: 2
Produkt ist nicht verfügbar
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NX3L2267GU,115 NX3L2267GU,115 NXP USA Inc. NX3L2267.pdf Description: IC SWITCH SPDTX2 750MOHM 10XQFN
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 10-XQFN (1.4x1.8)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 37pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 90mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2
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BGU7051,118 BGU7051,118 NXP USA Inc. BGU7051.pdf Description: IC AMP GP 500MHZ-1.5GHZ 10HVSON
Produkt ist nicht verfügbar
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BGU7052,118 BGU7052,118 NXP USA Inc. BGU7052_Rev2.pdf Description: IC RF AMP WLAN 900MHZ 10HVSON
Produkt ist nicht verfügbar
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NTS0104PW,118 NTS0104PW,118 NXP USA Inc. NTS0104.pdf Description: IC TRANSLATOR BIDIR 14TSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 14-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
auf Bestellung 32919 Stücke:
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NVT2003DP,118 NVT2003DP,118 NXP USA Inc. NVT2003_06.pdf Description: IC TRANSLATOR BIDIR 10TSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 10-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 3
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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BB198,115 BB198,115 NXP USA Inc. BB198_Rev1.pdf Description: DIODE RF LV VARI CAP SOD-523
Packaging: Cut Tape (CT)
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 6.8pF @ 4V, 1MHz
Capacitance Ratio Condition: C1/C4
Supplier Device Package: SOD-523
Part Status: Obsolete
Voltage - Peak Reverse (Max): 20 V
Capacitance Ratio: 4.3
Produkt ist nicht verfügbar
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BGA7351,115 BGA7351,115 NXP USA Inc. BGA7351.pdf Description: IC AMP GPS 50MHZ-500MHZ 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 50MHz ~ 500MHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 21.5dB
Current - Supply: 280mA
Noise Figure: 6dB
P1dB: 15.8dBm
Test Frequency: 250MHz
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Obsolete
Produkt ist nicht verfügbar
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BGU7042,115 BGU7042,115 NXP USA Inc. BGU7042.pdf Description: IC RF AMP GPS 40MHZ-1GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 40MHz ~ 1GHz
RF Type: General Purpose
Voltage - Supply: 3.1V ~ 3.5V
Gain: 10dB
Current - Supply: 38mA
Noise Figure: 3.8dB
P1dB: 12dBm
Test Frequency: 40MHz ~ 1GHz
Supplier Device Package: 6-TSSOP
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CBTL01023GM,115 CBTL01023GM,115 NXP USA Inc. CBTL01023.pdf Description: IC MUX/DEMUX 1CH 10-XQFN
Features: Bi-Directional, SATA
Packaging: Cut Tape (CT)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: DisplayPort, PCIe, USB
On-State Resistance (Max): 6Ohm (Typ)
-3db Bandwidth: 9GHz
Supplier Device Package: 10-XQFN (1.55x2)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 1
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KMA210:115 KMA210:115 NXP USA Inc. KMA210.pdf Description: SENSOR ANGLE 180DEG PC PIN
Packaging: Cut Tape (CT)
Package / Case: 3-SIP Module
Mounting Type: Through Hole
Output: Analog Voltage
Operating Temperature: -40°C ~ 160°C
Termination Style: PC Pin
Voltage - Supply: 4.5V ~ 5.5V
Linearity: ±1.2%
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: 3-SIP
Rotation Angle - Electrical, Mechanical: 0° ~ 180°
Output Signal: Clockwise Increase
Part Status: Obsolete
Produkt ist nicht verfügbar
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KMZ60,115 KMZ60,115 NXP USA Inc. KMZ60.pdf Description: SENSOR ANGLE 360DEG SMD
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: Wheatstone Bridge
Operating Temperature: -40°C ~ 150°C
Termination Style: Gull Wing
Voltage - Supply: 2.7V ~ 5.5V
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: 8-SO
Rotation Angle - Electrical, Mechanical: 0° ~ 360°
Part Status: Active
Resistance: 5 kOhms
Produkt ist nicht verfügbar
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NCX2220GU,115 NCX2220GU,115 NXP USA Inc. NCX2220.pdf Description: IC COMPARATOR 2 GEN PUR 8DFN
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: DFN1714-8
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Part Status: Obsolete
Produkt ist nicht verfügbar
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NTB0101GM,115 NTB0101GM,115 NXP USA Inc. NTB0101.pdf Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Number of Circuits: 1
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NTB0104BQ,115 NTB0104BQ,115 NXP USA Inc. NTB0104.pdf Description: IC XLTR VL BIDIR 14-DHVQFN
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 14-VFQFN Exposed Pad
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 14-DHVQFN (2.5x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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NTS0104BQ,115 NTS0104BQ,115 NXP USA Inc. NTS0104.pdf Description: IC TRANSLATOR BIDIR 14DHVQFN
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 14-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 14-DHVQFN (2.5x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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NTS0104GU12,115 NTS0104GU12,115 NXP USA Inc. NTS0104.pdf Description: IC TRANSLTR BIDIRECTIONAL 12XQFN
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 12-XFQFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 12-XQFN (2x1.7)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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NX3DV3899HR,115 NX3DV3899HR,115 NXP USA Inc. NX3DV3899.pdf Description: IC SWITCH DPDTX2 3.3OHM 16HXQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 3.3Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 4pC
Crosstalk: -90dB @ 1MHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:2
Channel-to-Channel Matching (ΔRon): 700mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 8pF
Current - Leakage (IS(off)) (Max): 5nA
Part Status: Obsolete
Number of Circuits: 2
Produkt ist nicht verfügbar
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TWR-MC-LV3PH TWR-MC-LV3PH NXP USA Inc. TWRLV3PHQSG.pdf Description: KIT TOWER SYST 3PH MOTR CTRL MOD
Packaging: Box
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC56F8257
Supplied Contents: Board(s)
Embedded: Yes, MCU, 16-Bit
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TWRPI-TOUCH-STR TWRPI-TOUCH-STR NXP USA Inc. TWRPISTRQSG.pdf Description: KIT TOUCH TOWER PLUG-IN STARTER
Packaging: Box
Contents: Board(s)
Sensor Type: Touch, Capacitive
Utilized IC / Part: MPR121
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MPC8308-NSG NXP USA Inc. MPC8308-NSG_QSG.pdf Description: REF DESIGN SMART GATEWAY MPC8308
Produkt ist nicht verfügbar
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TWRPI-MMA845XQ TWRPI-MMA845XQ NXP USA Inc. Tower-Mech-Brd_Robot_FS.pdf Description: TOWER SYST XTRINSIC ACCELEROMETR
Packaging: Box
Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g
Interface: I2C
Voltage - Supply: 1.95V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA8451
Supplied Contents: Board(s)
Embedded: No
Sensing Range: ±2g, 4g, 8g
Part Status: Active
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MM912I637AM2EPR2 MM912I637AM2EPR2 NXP USA Inc. www.nxp.com Description: IC MCU LIN BATT MONITOR 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI, SPI
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (96KB)
Applications: Battery Monitor
Core Processor: S12
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MM912I637AV1EPR2 MM912I637AV1EPR2 NXP USA Inc. MM912x637.pdf Description: IC MCU LIN BATT MONITOR 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI, SPI
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (96KB)
Applications: Battery Monitor
Core Processor: S12
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 8
DigiKey Programmable: Not Verified
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MM912J637AV1EPR2 MM912J637AV1EPR2 NXP USA Inc. Description: IC MCU LIN BATT MONITOR 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI, SPI
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (128kB)
Applications: Battery Monitor
Core Processor: S12
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MRFE6VP8600HR6 MRFE6VP8600HR6 NXP USA Inc. Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 860MHz
Configuration: Dual
Power - Output: 125W
Gain: 19.3dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 1.4 A
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MRFE6VP8600HSR6 MRFE6VP8600HSR6 NXP USA Inc. Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230S
Mounting Type: Chassis Mount
Frequency: 860MHz
Configuration: Dual
Power - Output: 125W
Gain: 19.3dB
Technology: LDMOS
Supplier Device Package: NI-1230S
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 1.4 A
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MMA20312BVT1 MMA20312BVT1 NXP USA Inc. Description: IC AMP LTE 1.8GHZ-2.2GHZ 12QFN
Packaging: Tape & Reel (TR)
Package / Case: 12-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.8GHz ~ 2.2GHz
RF Type: LTE, PCS, TD-SCDMA, UMTS
Voltage - Supply: 5V
Gain: 27.2dB
Current - Supply: 70mA
Noise Figure: 3.3dB
P1dB: 28.2dBm
Test Frequency: 2.14GHz
Supplier Device Package: 12-QFN (3x3)
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MML20211HT1 MML20211HT1 NXP USA Inc. MML20211H.pdf Description: IC RF AMP LTE 1.4GHZ-2.8GHZ 8DFN
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SPC5604BF2MLQ6 SPC5604BF2MLQ6 NXP USA Inc. MPC5604BC.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
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MPC8377CVRAJFA MPC8377CVRAJFA NXP USA Inc. MPC8377E.pdf Description: IC MPU MPC83XX 533MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
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MPC8377CVRANGA MPC8377CVRANGA NXP USA Inc. MPC8377E.pdf Description: IC MPU MPC83XX 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Part Status: Obsolete
Produkt ist nicht verfügbar
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MPC8377ECVRAGDA MPC8377ECVRAGDA NXP USA Inc. MPC8377E.pdf Description: IC MPU MPC83XX 400MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
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MPC8377ECVRAJFA MPC8377ECVRAJFA NXP USA Inc. MPC8377E.pdf Description: IC MPU MPC83XX 533MHZ 689TEBGA
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MPC8377ECVRALGA MPC8377ECVRALGA NXP USA Inc. MPC8377E.pdf Description: IC MPU MPC83XX 667MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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MPC8377ECVRANGA MPC8377ECVRANGA NXP USA Inc. MPC8377E.pdf Description: IC MPU MPC83XX 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
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MPC8377EVRAGDA MPC8377EVRAGDA NXP USA Inc. MPC8377E.pdf Description: IC MPU MPC83XX 400MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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1+131.86 EUR
10+109.92 EUR
27+104.05 EUR
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MPC8378CVRALGA MPC8378CVRALGA NXP USA Inc. MPC837XFFS.pdf Description: IC MPU MPC83XX 667MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
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MPC8378CVRANGA MPC8378CVRANGA NXP USA Inc. MPC837XFFS.pdf Description: IC MPU MPC83XX 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Part Status: Obsolete
Produkt ist nicht verfügbar
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MPC8378ECVRAJFA MPC8378ECVRAJFA NXP USA Inc. MPC837XFFS.pdf Description: IC MPU MPC83XX 533MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
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MPC8378ECVRANGA MPC8378ECVRANGA NXP USA Inc. MPC837XFFS.pdf Description: IC MPU MPC83XX 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Part Status: Obsolete
Produkt ist nicht verfügbar
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MPC8378VRAGDA MPC8378VRAGDA NXP USA Inc. MPC837XFFS.pdf Description: IC MPU MPC83XX 400MHZ 689TEBGA
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MPC8379CVRANGA MPC8379CVRANGA NXP USA Inc. MPC837XFFS.pdf Description: IC MPU MPC83XX 800MHZ 689TEBGA
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (4)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MPC8379ECVRALGA MPC8379ECVRALGA NXP USA Inc. MPC837XFFS.pdf Description: IC MPU MPC83XX 667MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (4)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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MPC8379ECVRANGA MPC8379ECVRANGA NXP USA Inc. MPC837XFFS.pdf Description: IC MPU MPC83XX 800MHZ 689TEBGA
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MPC8379EVRAJFA MPC8379EVRAJFA NXP USA Inc. Description: MPU POWERQUICC II 533MHZ 689PBGA
Produkt ist nicht verfügbar
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MPC8379EVRANGA MPC8379EVRANGA NXP USA Inc. MPC837XFFS.pdf Description: IC MPU MPC83XX 800MHZ 689TEBGA
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MPC8379VRAJFA MPC8379VRAJFA NXP USA Inc. MPC837XFFS.pdf Description: IC MPU MPC83XX 533MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (4)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Part Status: Obsolete
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10+130.85 EUR
27+124.06 EUR
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MPC8379VRALGA MPC8379VRALGA NXP USA Inc. MPC837XFFS.pdf Description: IC MPU MPC83XX 667MHZ 689TEBGA
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (4)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MM912J637AV1EP MM912J637AV1EP NXP USA Inc. Description: IC MCU LIN BATT MONITOR 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI, SPI
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (128kB)
Applications: Battery Monitor
Core Processor: S12
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC33889DPEG MC33889DPEG NXP USA Inc. MC33889.pdf Description: IC INTERFACE SPECIALIZED 28SOIC
Produkt ist nicht verfügbar
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JN5148/J01,515 JN5148-001.pdf
JN5148/J01,515
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB ROM, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.75dBm
Protocol: Zigbee®
Current - Receiving: 17.5mA
Data Rate (Max): 667kbps
Current - Transmitting: 15mA
Supplier Device Package: 56-HVQFN (8x8)
GPIO: 21
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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KMA210:115 KMA210.pdf
KMA210:115
Hersteller: NXP USA Inc.
Description: SENSOR ANGLE 180DEG PC PIN
Packaging: Tape & Reel (TR)
Package / Case: 3-SIP Module
Mounting Type: Through Hole
Output: Analog Voltage
Operating Temperature: -40°C ~ 160°C
Termination Style: PC Pin
Voltage - Supply: 4.5V ~ 5.5V
Linearity: ±1.2%
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: 3-SIP
Rotation Angle - Electrical, Mechanical: 0° ~ 180°
Output Signal: Clockwise Increase
Part Status: Obsolete
Produkt ist nicht verfügbar
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KMZ60,115 KMZ60.pdf
KMZ60,115
Hersteller: NXP USA Inc.
Description: SENSOR ANGLE 360DEG SMD
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: Wheatstone Bridge
Operating Temperature: -40°C ~ 150°C
Termination Style: Gull Wing
Voltage - Supply: 2.7V ~ 5.5V
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: 8-SO
Rotation Angle - Electrical, Mechanical: 0° ~ 360°
Part Status: Active
Resistance: 5 kOhms
Produkt ist nicht verfügbar
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NCX2220GU,115 NCX2220.pdf
NCX2220GU,115
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 2 GEN PUR 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: DFN1714-8
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Part Status: Obsolete
Produkt ist nicht verfügbar
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NTB0101GF,132 NTB0101.pdf
NTB0101GF,132
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-XSON, SOT891 (1x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Number of Circuits: 1
Produkt ist nicht verfügbar
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NTB0101GM,115 NTB0101.pdf
NTB0101GM,115
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Number of Circuits: 1
Produkt ist nicht verfügbar
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NTB0104BQ,115 NTB0104.pdf
NTB0104BQ,115
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 14-DHVQFN
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 14-VFQFN Exposed Pad
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 14-DHVQFN (2.5x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
auf Bestellung 9000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3000+0.75 EUR
6000+0.73 EUR
Mindestbestellmenge: 3000
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NTS0104BQ,115 NTS0104.pdf
NTS0104BQ,115
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 14DHVQFN
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 14-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 14-DHVQFN (2.5x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
auf Bestellung 36000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3000+0.66 EUR
6000+0.65 EUR
9000+0.64 EUR
15000+0.63 EUR
21000+0.62 EUR
Mindestbestellmenge: 3000
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NTS0104GU12,115 NTS0104.pdf
NTS0104GU12,115
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 12XQFN
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 12-XFQFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 12-XQFN (2x1.7)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
auf Bestellung 88000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4000+0.67 EUR
Mindestbestellmenge: 4000
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NX3DV3899HR,115 NX3DV3899.pdf
NX3DV3899HR,115
Hersteller: NXP USA Inc.
Description: IC SWITCH DPDTX2 3.3OHM 16HXQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 3.3Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 4pC
Crosstalk: -90dB @ 1MHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:2
Channel-to-Channel Matching (ΔRon): 700mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 8pF
Current - Leakage (IS(off)) (Max): 5nA
Part Status: Obsolete
Number of Circuits: 2
Produkt ist nicht verfügbar
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NX3L2267GU,115 NX3L2267.pdf
NX3L2267GU,115
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDTX2 750MOHM 10XQFN
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 10-XQFN (1.4x1.8)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 37pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 90mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4000+0.6 EUR
Mindestbestellmenge: 4000
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BGU7051,118 BGU7051.pdf
BGU7051,118
Hersteller: NXP USA Inc.
Description: IC AMP GP 500MHZ-1.5GHZ 10HVSON
Produkt ist nicht verfügbar
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BGU7052,118 BGU7052_Rev2.pdf
BGU7052,118
Hersteller: NXP USA Inc.
Description: IC RF AMP WLAN 900MHZ 10HVSON
Produkt ist nicht verfügbar
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NTS0104PW,118 NTS0104.pdf
NTS0104PW,118
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 14TSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 14-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
auf Bestellung 32919 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
12+1.55 EUR
16+1.11 EUR
25+1 EUR
100+0.88 EUR
250+0.82 EUR
500+0.79 EUR
Mindestbestellmenge: 12
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NVT2003DP,118 NVT2003_06.pdf
NVT2003DP,118
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 10TSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 10-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 3
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
auf Bestellung 26545 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
11+1.62 EUR
16+1.16 EUR
25+1.04 EUR
100+0.92 EUR
250+0.86 EUR
500+0.82 EUR
1000+0.79 EUR
Mindestbestellmenge: 11
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BB198,115 BB198_Rev1.pdf
BB198,115
Hersteller: NXP USA Inc.
Description: DIODE RF LV VARI CAP SOD-523
Packaging: Cut Tape (CT)
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 6.8pF @ 4V, 1MHz
Capacitance Ratio Condition: C1/C4
Supplier Device Package: SOD-523
Part Status: Obsolete
Voltage - Peak Reverse (Max): 20 V
Capacitance Ratio: 4.3
Produkt ist nicht verfügbar
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BGA7351,115 BGA7351.pdf
BGA7351,115
Hersteller: NXP USA Inc.
Description: IC AMP GPS 50MHZ-500MHZ 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 50MHz ~ 500MHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 21.5dB
Current - Supply: 280mA
Noise Figure: 6dB
P1dB: 15.8dBm
Test Frequency: 250MHz
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Obsolete
Produkt ist nicht verfügbar
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BGU7042,115 BGU7042.pdf
BGU7042,115
Hersteller: NXP USA Inc.
Description: IC RF AMP GPS 40MHZ-1GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 40MHz ~ 1GHz
RF Type: General Purpose
Voltage - Supply: 3.1V ~ 3.5V
Gain: 10dB
Current - Supply: 38mA
Noise Figure: 3.8dB
P1dB: 12dBm
Test Frequency: 40MHz ~ 1GHz
Supplier Device Package: 6-TSSOP
auf Bestellung 5500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
18+1.02 EUR
23+0.77 EUR
26+0.69 EUR
100+0.59 EUR
250+0.54 EUR
500+0.5 EUR
1000+0.47 EUR
Mindestbestellmenge: 18
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CBTL01023GM,115 CBTL01023.pdf
CBTL01023GM,115
Hersteller: NXP USA Inc.
Description: IC MUX/DEMUX 1CH 10-XQFN
Features: Bi-Directional, SATA
Packaging: Cut Tape (CT)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: DisplayPort, PCIe, USB
On-State Resistance (Max): 6Ohm (Typ)
-3db Bandwidth: 9GHz
Supplier Device Package: 10-XQFN (1.55x2)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 1
auf Bestellung 18667 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
9+2.04 EUR
12+1.49 EUR
25+1.35 EUR
100+1.19 EUR
250+1.12 EUR
500+1.08 EUR
1000+1.04 EUR
2500+1 EUR
Mindestbestellmenge: 9
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KMA210:115 KMA210.pdf
KMA210:115
Hersteller: NXP USA Inc.
Description: SENSOR ANGLE 180DEG PC PIN
Packaging: Cut Tape (CT)
Package / Case: 3-SIP Module
Mounting Type: Through Hole
Output: Analog Voltage
Operating Temperature: -40°C ~ 160°C
Termination Style: PC Pin
Voltage - Supply: 4.5V ~ 5.5V
Linearity: ±1.2%
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: 3-SIP
Rotation Angle - Electrical, Mechanical: 0° ~ 180°
Output Signal: Clockwise Increase
Part Status: Obsolete
Produkt ist nicht verfügbar
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KMZ60,115 KMZ60.pdf
KMZ60,115
Hersteller: NXP USA Inc.
Description: SENSOR ANGLE 360DEG SMD
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: Wheatstone Bridge
Operating Temperature: -40°C ~ 150°C
Termination Style: Gull Wing
Voltage - Supply: 2.7V ~ 5.5V
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: 8-SO
Rotation Angle - Electrical, Mechanical: 0° ~ 360°
Part Status: Active
Resistance: 5 kOhms
Produkt ist nicht verfügbar
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NCX2220GU,115 NCX2220.pdf
NCX2220GU,115
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 2 GEN PUR 8DFN
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: DFN1714-8
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Part Status: Obsolete
Produkt ist nicht verfügbar
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NTB0101GM,115 NTB0101.pdf
NTB0101GM,115
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Number of Circuits: 1
auf Bestellung 1292 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
19+0.93 EUR
22+0.82 EUR
25+0.77 EUR
100+0.63 EUR
250+0.58 EUR
500+0.5 EUR
1000+0.4 EUR
Mindestbestellmenge: 19
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NTB0104BQ,115 NTB0104.pdf
NTB0104BQ,115
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 14-DHVQFN
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 14-VFQFN Exposed Pad
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 14-DHVQFN (2.5x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
auf Bestellung 11008 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
12+1.58 EUR
16+1.14 EUR
25+1.03 EUR
100+0.91 EUR
250+0.85 EUR
500+0.82 EUR
Mindestbestellmenge: 12
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NTS0104BQ,115 NTS0104.pdf
NTS0104BQ,115
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 14DHVQFN
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 14-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 14-DHVQFN (2.5x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
auf Bestellung 36586 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
13+1.41 EUR
18+1.01 EUR
25+0.91 EUR
100+0.8 EUR
250+0.75 EUR
500+0.72 EUR
Mindestbestellmenge: 13
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NTS0104GU12,115 NTS0104.pdf
NTS0104GU12,115
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 12XQFN
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 12-XFQFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 12-XQFN (2x1.7)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
auf Bestellung 94120 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
11+1.6 EUR
16+1.15 EUR
25+1.04 EUR
100+0.91 EUR
250+0.85 EUR
500+0.82 EUR
Mindestbestellmenge: 11
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NX3DV3899HR,115 NX3DV3899.pdf
NX3DV3899HR,115
Hersteller: NXP USA Inc.
Description: IC SWITCH DPDTX2 3.3OHM 16HXQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 3.3Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 4pC
Crosstalk: -90dB @ 1MHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:2
Channel-to-Channel Matching (ΔRon): 700mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 8pF
Current - Leakage (IS(off)) (Max): 5nA
Part Status: Obsolete
Number of Circuits: 2
Produkt ist nicht verfügbar
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TWR-MC-LV3PH TWRLV3PHQSG.pdf
TWR-MC-LV3PH
Hersteller: NXP USA Inc.
Description: KIT TOWER SYST 3PH MOTR CTRL MOD
Packaging: Box
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC56F8257
Supplied Contents: Board(s)
Embedded: Yes, MCU, 16-Bit
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+927.15 EUR
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TWRPI-TOUCH-STR TWRPISTRQSG.pdf
TWRPI-TOUCH-STR
Hersteller: NXP USA Inc.
Description: KIT TOUCH TOWER PLUG-IN STARTER
Packaging: Box
Contents: Board(s)
Sensor Type: Touch, Capacitive
Utilized IC / Part: MPR121
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MPC8308-NSG MPC8308-NSG_QSG.pdf
Hersteller: NXP USA Inc.
Description: REF DESIGN SMART GATEWAY MPC8308
Produkt ist nicht verfügbar
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TWRPI-MMA845XQ Tower-Mech-Brd_Robot_FS.pdf
TWRPI-MMA845XQ
Hersteller: NXP USA Inc.
Description: TOWER SYST XTRINSIC ACCELEROMETR
Packaging: Box
Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g
Interface: I2C
Voltage - Supply: 1.95V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA8451
Supplied Contents: Board(s)
Embedded: No
Sensing Range: ±2g, 4g, 8g
Part Status: Active
Produkt ist nicht verfügbar
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MM912I637AM2EPR2 www.nxp.com
MM912I637AM2EPR2
Hersteller: NXP USA Inc.
Description: IC MCU LIN BATT MONITOR 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI, SPI
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (96KB)
Applications: Battery Monitor
Core Processor: S12
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MM912I637AV1EPR2 MM912x637.pdf
MM912I637AV1EPR2
Hersteller: NXP USA Inc.
Description: IC MCU LIN BATT MONITOR 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI, SPI
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (96KB)
Applications: Battery Monitor
Core Processor: S12
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MM912J637AV1EPR2
MM912J637AV1EPR2
Hersteller: NXP USA Inc.
Description: IC MCU LIN BATT MONITOR 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI, SPI
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (128kB)
Applications: Battery Monitor
Core Processor: S12
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MRFE6VP8600HR6
MRFE6VP8600HR6
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 860MHz
Configuration: Dual
Power - Output: 125W
Gain: 19.3dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 1.4 A
Produkt ist nicht verfügbar
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MRFE6VP8600HSR6
MRFE6VP8600HSR6
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230S
Mounting Type: Chassis Mount
Frequency: 860MHz
Configuration: Dual
Power - Output: 125W
Gain: 19.3dB
Technology: LDMOS
Supplier Device Package: NI-1230S
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 1.4 A
Produkt ist nicht verfügbar
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MMA20312BVT1
MMA20312BVT1
Hersteller: NXP USA Inc.
Description: IC AMP LTE 1.8GHZ-2.2GHZ 12QFN
Packaging: Tape & Reel (TR)
Package / Case: 12-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.8GHz ~ 2.2GHz
RF Type: LTE, PCS, TD-SCDMA, UMTS
Voltage - Supply: 5V
Gain: 27.2dB
Current - Supply: 70mA
Noise Figure: 3.3dB
P1dB: 28.2dBm
Test Frequency: 2.14GHz
Supplier Device Package: 12-QFN (3x3)
Produkt ist nicht verfügbar
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MML20211HT1 MML20211H.pdf
MML20211HT1
Hersteller: NXP USA Inc.
Description: IC RF AMP LTE 1.4GHZ-2.8GHZ 8DFN
Produkt ist nicht verfügbar
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SPC5604BF2MLQ6 MPC5604BC.pdf
SPC5604BF2MLQ6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Produkt ist nicht verfügbar
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MPC8377CVRAJFA MPC8377E.pdf
MPC8377CVRAJFA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
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MPC8377CVRANGA MPC8377E.pdf
MPC8377CVRANGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Part Status: Obsolete
Produkt ist nicht verfügbar
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MPC8377ECVRAGDA MPC8377E.pdf
MPC8377ECVRAGDA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
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MPC8377ECVRAJFA MPC8377E.pdf
MPC8377ECVRAJFA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 689TEBGA
Produkt ist nicht verfügbar
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MPC8377ECVRALGA MPC8377E.pdf
MPC8377ECVRALGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 667MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
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MPC8377ECVRANGA MPC8377E.pdf
MPC8377ECVRANGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Produkt ist nicht verfügbar
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MPC8377EVRAGDA MPC8377E.pdf
MPC8377EVRAGDA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+131.86 EUR
10+109.92 EUR
27+104.05 EUR
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MPC8378CVRALGA MPC837XFFS.pdf
MPC8378CVRALGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 667MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
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MPC8378CVRANGA MPC837XFFS.pdf
MPC8378CVRANGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Part Status: Obsolete
Produkt ist nicht verfügbar
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MPC8378ECVRAJFA MPC837XFFS.pdf
MPC8378ECVRAJFA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
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MPC8378ECVRANGA MPC837XFFS.pdf
MPC8378ECVRANGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Part Status: Obsolete
Produkt ist nicht verfügbar
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MPC8378VRAGDA MPC837XFFS.pdf
MPC8378VRAGDA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 689TEBGA
Produkt ist nicht verfügbar
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MPC8379CVRANGA MPC837XFFS.pdf
MPC8379CVRANGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 800MHZ 689TEBGA
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (4)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MPC8379ECVRALGA MPC837XFFS.pdf
MPC8379ECVRALGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 667MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (4)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
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MPC8379ECVRANGA MPC837XFFS.pdf
MPC8379ECVRANGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 800MHZ 689TEBGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MPC8379EVRAJFA
MPC8379EVRAJFA
Hersteller: NXP USA Inc.
Description: MPU POWERQUICC II 533MHZ 689PBGA
Produkt ist nicht verfügbar
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MPC8379EVRANGA MPC837XFFS.pdf
MPC8379EVRANGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 800MHZ 689TEBGA
Produkt ist nicht verfügbar
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MPC8379VRAJFA MPC837XFFS.pdf
MPC8379VRAJFA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (4)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Part Status: Obsolete
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+156.22 EUR
10+130.85 EUR
27+124.06 EUR
Im Einkaufswagen  Stück im Wert von  UAH
MPC8379VRALGA MPC837XFFS.pdf
MPC8379VRALGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 667MHZ 689TEBGA
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (4)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MM912J637AV1EP
MM912J637AV1EP
Hersteller: NXP USA Inc.
Description: IC MCU LIN BATT MONITOR 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI, SPI
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (128kB)
Applications: Battery Monitor
Core Processor: S12
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC33889DPEG MC33889.pdf
MC33889DPEG
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SOIC
Produkt ist nicht verfügbar
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