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BGU7007,115 BGU7007,115 NXP USA Inc. BGU7007.pdf Description: IC RF AMP GPS 1575.42MHZ 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1575.42MHz
RF Type: GPS/GNSS
Voltage - Supply: 1.5V ~ 2.85V
Gain: 18.5dB
Current - Supply: 12.8mA
Noise Figure: 0.85dB
P1dB: -12dBm
Test Frequency: 1.559GHz ~ 1.61GHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Part Status: Active
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BGU7041,115 BGU7041,115 NXP USA Inc. BGU7041.pdf Description: IC RF AMP GPS 40MHZ-1GHZ 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 40MHz ~ 1GHz
RF Type: General Purpose
Voltage - Supply: 3.1V ~ 3.5V
Gain: 10dB
Current - Supply: 38mA
Noise Figure: 3.8dB
P1dB: 12dBm
Test Frequency: 40MHz ~ 1GHz
Supplier Device Package: 6-TSSOP
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BGU7042,115 BGU7042,115 NXP USA Inc. BGU7042.pdf Description: IC RF AMP GPS 40MHZ-1GHZ 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 40MHz ~ 1GHz
RF Type: General Purpose
Voltage - Supply: 3.1V ~ 3.5V
Gain: 10dB
Current - Supply: 38mA
Noise Figure: 3.8dB
P1dB: 12dBm
Test Frequency: 40MHz ~ 1GHz
Supplier Device Package: 6-TSSOP
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CBTL01023GM,115 CBTL01023GM,115 NXP USA Inc. CBTL01023.pdf Description: IC MUX/DEMUX 1CH 10-XQFN
Features: Bi-Directional, SATA
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: DisplayPort, PCIe, USB
On-State Resistance (Max): 6Ohm (Typ)
-3db Bandwidth: 9GHz
Supplier Device Package: 10-XQFN (1.55x2)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 1
Produkt ist nicht verfügbar
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JN5142N/001,515 JN5142N/001,515 NXP USA Inc. Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Part Status: Obsolete
RF Family/Standard: 802.15.4
Supplier Device Package: 40-HVQFN (6x6)
Current - Transmitting: 15mA
Current - Receiving: 16.5mA
Protocol: Zigbee®
Power - Output: 2.5dBm
Voltage - Supply: 2V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: TxRx + MCU
Memory Size: 128kB ROM, 32kB RAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -95dBm
Produkt ist nicht verfügbar
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JN5148/J01,515 JN5148/J01,515 NXP USA Inc. JN5148-001.pdf Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB ROM, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.75dBm
Protocol: Zigbee®
Current - Receiving: 17.5mA
Data Rate (Max): 667kbps
Current - Transmitting: 15mA
Supplier Device Package: 56-HVQFN (8x8)
GPIO: 21
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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KMA210:115 KMA210:115 NXP USA Inc. KMA210.pdf Description: SENSOR ANGLE 180DEG PC PIN
Packaging: Tape & Reel (TR)
Package / Case: 3-SIP Module
Mounting Type: Through Hole
Output: Analog Voltage
Operating Temperature: -40°C ~ 160°C
Termination Style: PC Pin
Voltage - Supply: 4.5V ~ 5.5V
Linearity: ±1.2%
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: 3-SIP
Rotation Angle - Electrical, Mechanical: 0° ~ 180°
Output Signal: Clockwise Increase
Part Status: Obsolete
Produkt ist nicht verfügbar
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KMZ60,115 KMZ60,115 NXP USA Inc. KMZ60.pdf Description: SENSOR ANGLE 360DEG SMD
Resistance: 5 kOhms
Part Status: Active
Rotation Angle - Electrical, Mechanical: 0° ~ 360°
Supplier Device Package: 8-SO
For Measuring: Angle
Technology: Magnetoresistive
Actuator Type: External Magnet, Not Included
Voltage - Supply: 2.7V ~ 5.5V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 150°C
Output: Wheatstone Bridge
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NCX2220GU,115 NCX2220GU,115 NXP USA Inc. NCX2220.pdf Description: IC COMPARATOR 2 GEN PUR 8DFN
Part Status: Obsolete
Hysteresis: 20mV
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Current - Input Bias (Max): 1pA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Quiescent (Max): 5µA
Propagation Delay (Max): 0.8µs
Supplier Device Package: DFN1714-8
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: General Purpose
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Rail-to-Rail
Package / Case: 8-XFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NTB0101GF,132 NTB0101GF,132 NXP USA Inc. NTB0101.pdf Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-XSON, SOT891 (1x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Number of Circuits: 1
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NTB0101GM,115 NTB0101GM,115 NXP USA Inc. NTB0101.pdf Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Number of Circuits: 1
Produkt ist nicht verfügbar
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NTB0104BQ,115 NTB0104BQ,115 NXP USA Inc. NTB0104.pdf Description: IC XLTR VL BIDIR 14-DHVQFN
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 14-VFQFN Exposed Pad
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 14-DHVQFN (2.5x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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NTS0104BQ,115 NTS0104BQ,115 NXP USA Inc. NTS0104.pdf Description: IC XLTR VL BIDIR 14-DHVQFN
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 14-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 14-DHVQFN (2.5x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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NTS0104GU12,115 NTS0104GU12,115 NXP USA Inc. NTS0104.pdf Description: IC XLTR VL BIDIR 12-XQFN
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 12-XFQFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 12-XQFN (2x1.7)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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NX3DV3899HR,115 NX3DV3899HR,115 NXP USA Inc. NX3DV3899.pdf Description: IC SWITCH DPDTX2 3.3OHM 16HXQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 3.3Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 4pC
Crosstalk: -90dB @ 1MHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:2
Channel-to-Channel Matching (ΔRon): 700mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 8pF
Current - Leakage (IS(off)) (Max): 5nA
Part Status: Obsolete
Number of Circuits: 2
Produkt ist nicht verfügbar
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NX3L2267GU,115 NX3L2267GU,115 NXP USA Inc. NX3L2267.pdf Description: IC SWITCH SPDTX2 750MOHM 10XQFN
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 10-XQFN (1.4x1.8)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 37pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 90mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2
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BGU7051,118 BGU7051,118 NXP USA Inc. BGU7051.pdf Description: IC AMP GP 500MHZ-1.5GHZ 10HVSON
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BGU7052,118 BGU7052,118 NXP USA Inc. BGU7052_Rev2.pdf Description: IC RF AMP WLAN 900MHZ 10HVSON
Produkt ist nicht verfügbar
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NTS0104PW,118 NTS0104PW,118 NXP USA Inc. NTS0104.pdf Description: IC XLTR VL BIDIR 14-TSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 14-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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NVT2003DP,118 NVT2003DP,118 NXP USA Inc. NVT2003_06.pdf Description: IC XLTR VL BIDIR 10-TSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 10-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 3
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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BGA7351,115 BGA7351,115 NXP USA Inc. BGA7351.pdf Description: IC AMP GPS 50MHZ-500MHZ 32HVQFN
Part Status: Obsolete
Supplier Device Package: 32-HVQFN (5x5)
Test Frequency: 250MHz
P1dB: 15.8dBm
Noise Figure: 6dB
Current - Supply: 280mA
Gain: 21.5dB
Voltage - Supply: 4.75V ~ 5.25V
RF Type: General Purpose
Frequency: 50MHz ~ 500MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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BGU7042,115 BGU7042,115 NXP USA Inc. BGU7042.pdf Description: IC RF AMP GPS 40MHZ-1GHZ 6TSSOP
Supplier Device Package: 6-TSSOP
Test Frequency: 40MHz ~ 1GHz
P1dB: 12dBm
Noise Figure: 3.8dB
Current - Supply: 38mA
Gain: 10dB
Voltage - Supply: 3.1V ~ 3.5V
RF Type: General Purpose
Frequency: 40MHz ~ 1GHz
Mounting Type: Surface Mount
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Cut Tape (CT)
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CBTL01023GM,115 CBTL01023GM,115 NXP USA Inc. CBTL01023.pdf Description: IC MUX/DEMUX 1CH 10-XQFN
Features: Bi-Directional, SATA
Packaging: Cut Tape (CT)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: DisplayPort, PCIe, USB
On-State Resistance (Max): 6Ohm (Typ)
-3db Bandwidth: 9GHz
Supplier Device Package: 10-XQFN (1.55x2)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 1
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KMZ60,115 KMZ60,115 NXP USA Inc. KMZ60.pdf Description: SENSOR ANGLE 360DEG SMD
Resistance: 5 kOhms
Part Status: Active
Rotation Angle - Electrical, Mechanical: 0° ~ 360°
Supplier Device Package: 8-SO
For Measuring: Angle
Technology: Magnetoresistive
Actuator Type: External Magnet, Not Included
Voltage - Supply: 2.7V ~ 5.5V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 150°C
Output: Wheatstone Bridge
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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NCX2220GU,115 NCX2220GU,115 NXP USA Inc. NCX2220.pdf Description: IC COMPARATOR 2 GEN PUR 8DFN
Part Status: Obsolete
Hysteresis: 20mV
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Current - Input Bias (Max): 1pA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Quiescent (Max): 5µA
Propagation Delay (Max): 0.8µs
Supplier Device Package: DFN1714-8
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: General Purpose
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Rail-to-Rail
Package / Case: 8-XFDFN Exposed Pad
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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NTB0101GM,115 NTB0101GM,115 NXP USA Inc. NTB0101.pdf Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Number of Circuits: 1
Voltage - VCCB: 1.65 V ~ 5.5 V
Voltage - VCCA: 1.2 V ~ 3.6 V
Channels per Circuit: 1
Translator Type: Voltage Level
Channel Type: Bidirectional
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Data Rate: 100Mbps
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 6-XFDFN
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
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NTB0104BQ,115 NTB0104BQ,115 NXP USA Inc. NTB0104.pdf Description: IC XLTR VL BIDIR 14-DHVQFN
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 14-VFQFN Exposed Pad
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 14-DHVQFN (2.5x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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NTS0104BQ,115 NTS0104BQ,115 NXP USA Inc. NTS0104.pdf Description: IC XLTR VL BIDIR 14-DHVQFN
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 14-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 14-DHVQFN (2.5x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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NTS0104GU12,115 NTS0104GU12,115 NXP USA Inc. NTS0104.pdf Description: IC XLTR VL BIDIR 12-XQFN
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 12-XFQFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 12-XQFN (2x1.7)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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TWR-MC-LV3PH TWR-MC-LV3PH NXP USA Inc. TWRLV3PHQSG.pdf Description: KIT TOWER SYST 3PH MOTR CTRL MOD
Contents: Board(s)
Embedded: Yes, MCU, 16-Bit
Supplied Contents: Board(s)
Utilized IC / Part: MC56F8257
Type: Power Management
Function: Motor Controller/Driver
Packaging: Box
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1+1103.31 EUR
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TWRPI-TOUCH-STR TWRPI-TOUCH-STR NXP USA Inc. TWRPISTRQSG.pdf Description: KIT TOUCH TOWER PLUG-IN STARTER
Packaging: Box
Contents: Board(s)
Sensor Type: Touch, Capacitive
Utilized IC / Part: MPR121
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MPC8308-NSG NXP USA Inc. MPC8308-NSG_QSG.pdf Description: REF DESIGN SMART GATEWAY MPC8308
Produkt ist nicht verfügbar
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TWRPI-MMA845XQ TWRPI-MMA845XQ NXP USA Inc. Tower-Mech-Brd_Robot_FS.pdf Description: TOWER SYST XTRINSIC ACCELEROMETR
Part Status: Active
Sensing Range: ±2g, 4g, 8g
Embedded: No
Supplied Contents: Board(s)
Utilized IC / Part: MMA8451
Sensor Type: Accelerometer, 3 Axis
Voltage - Supply: 1.95V ~ 3.6V
Interface: I2C
Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g
Packaging: Box
Produkt ist nicht verfügbar
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MM912I637AM2EPR2 MM912I637AM2EPR2 NXP USA Inc. www.nxp.com Description: IC MCU LIN BATT MONITOR 48QFN
DigiKey Programmable: Not Verified
Number of I/O: 8
Supplier Device Package: 48-QFN-EP (7x7)
Core Processor: S12
Applications: Battery Monitor
Program Memory Type: FLASH (96KB)
Controller Series: HCS12
Voltage - Supply: 2.25V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
RAM Size: 6K x 8
Interface: LIN, SCI, SPI
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MM912I637AV1EPR2 MM912I637AV1EPR2 NXP USA Inc. MM912x637.pdf Description: IC MCU LIN BATT MONITOR 48QFN
DigiKey Programmable: Not Verified
Number of I/O: 8
Supplier Device Package: 48-QFN-EP (7x7)
Core Processor: S12
Applications: Battery Monitor
Program Memory Type: FLASH (96KB)
Controller Series: HCS12
Voltage - Supply: 2.25V ~ 5.5V
Operating Temperature: -40°C ~ 105°C
RAM Size: 6K x 8
Interface: LIN, SCI, SPI
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MM912J637AV1EPR2 MM912J637AV1EPR2 NXP USA Inc. Description: IC MCU LIN BATT MONITOR 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI, SPI
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (128kB)
Applications: Battery Monitor
Core Processor: S12
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MRFE6VP8600HR6 MRFE6VP8600HR6 NXP USA Inc. Description: RF MOSFET LDMOS 50V NI1230
Current - Test: 1.4 A
Voltage - Test: 50 V
Voltage - Rated: 130 V
Supplier Device Package: NI-1230
Technology: LDMOS
Gain: 19.3dB
Power - Output: 125W
Configuration: Dual
Frequency: 860MHz
Mounting Type: Chassis Mount
Package / Case: NI-1230
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MRFE6VP8600HSR6 MRFE6VP8600HSR6 NXP USA Inc. Description: RF MOSFET LDMOS 50V NI1230
Technology: LDMOS
Gain: 19.3dB
Power - Output: 125W
Configuration: Dual
Frequency: 860MHz
Mounting Type: Chassis Mount
Package / Case: NI-1230S
Packaging: Tape & Reel (TR)
Current - Test: 1.4 A
Voltage - Test: 50 V
Voltage - Rated: 130 V
Supplier Device Package: NI-1230S
Produkt ist nicht verfügbar
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MMA20312BVT1 MMA20312BVT1 NXP USA Inc. Description: IC AMP LTE 1.8GHZ-2.2GHZ 12QFN
Supplier Device Package: 12-QFN (3x3)
Test Frequency: 2.14GHz
P1dB: 28.2dBm
Noise Figure: 3.3dB
Current - Supply: 70mA
Gain: 27.2dB
Voltage - Supply: 5V
RF Type: LTE, PCS, TD-SCDMA, UMTS
Frequency: 1.8GHz ~ 2.2GHz
Mounting Type: Surface Mount
Package / Case: 12-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MML20211HT1 MML20211HT1 NXP USA Inc. MML20211H.pdf Description: IC RF AMP LTE 1.4GHZ-2.8GHZ 8DFN
Produkt ist nicht verfügbar
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SPC5604BF2MLQ6 SPC5604BF2MLQ6 NXP USA Inc. MPC5604BC.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
Produkt ist nicht verfügbar
 Mindestbestellmenge: 300 Stücke
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MPC8377CVRAJFA MPC8377CVRAJFA NXP USA Inc. MPC8377E.pdf Description: IC MPU MPC83XX 533MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
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MPC8377CVRANGA MPC8377CVRANGA NXP USA Inc. MPC8377E.pdf Description: IC MPU MPC83XX 800MHZ PBGA689
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Part Status: Obsolete
SATA: SATA 3Gbps (2)
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 689-TEPBGA II (31x31)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c4s
Operating Temperature: -40°C ~ 125°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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MPC8377ECVRAGDA MPC8377ECVRAGDA NXP USA Inc. MPC8377E.pdf Description: IC MPU MPC83XX 400MHZ PBGA689
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
SATA: SATA 3Gbps (2)
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 3.0
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 689-TEPBGA II (31x31)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c4s
Operating Temperature: -40°C ~ 125°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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MPC8377ECVRAJFA MPC8377ECVRAJFA NXP USA Inc. MPC8377E.pdf Description: IC MPU MPC83XX 533MHZ 689TEBGA
Produkt ist nicht verfügbar
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MPC8377ECVRALGA MPC8377ECVRALGA NXP USA Inc. MPC8377E.pdf Description: IC MPU MPC83XX 667MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
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MPC8377ECVRANGA MPC8377ECVRANGA NXP USA Inc. MPC8377E.pdf Description: IC MPU MPC83XX 800MHZ PBGA689
SATA: SATA 3Gbps (2)
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 3.0
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 689-TEPBGA II (31x31)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c4s
Operating Temperature: -40°C ~ 125°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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MPC8377EVRAGDA MPC8377EVRAGDA NXP USA Inc. MPC8377E.pdf Description: IC MPU MPC83XX 400MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)
1+160.53 EUR
10+133.83 EUR
27+126.68 EUR
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MPC8378CVRALGA MPC8378CVRALGA NXP USA Inc. MPC837XFFS.pdf Description: IC MPU MPC83XX 667MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
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MPC8378CVRANGA MPC8378CVRANGA NXP USA Inc. MPC837XFFS.pdf Description: IC MPU MPC83XX 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Part Status: Obsolete
Produkt ist nicht verfügbar
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MPC8378ECVRAJFA MPC8378ECVRAJFA NXP USA Inc. MPC837XFFS.pdf Description: IC MPU MPC83XX 533MHZ PBGA689
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 689-TEPBGA II (31x31)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c4s
Operating Temperature: -40°C ~ 125°C (TA)
Speed: 533MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Co-Processors/DSP: Security; SEC 3.0
Number of Cores/Bus Width: 1 Core, 32-Bit
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Produkt ist nicht verfügbar
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MPC8378ECVRANGA MPC8378ECVRANGA NXP USA Inc. MPC837XFFS.pdf Description: IC MPU MPC83XX 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
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MPC8378EVRAGDA MPC8378EVRAGDA NXP USA Inc. MPC837XFFS.pdf Description: IC MPU MPC83XX 400MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
 Mindestbestellmenge: 81 Stücke
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MPC8378VRAGDA MPC8378VRAGDA NXP USA Inc. MPC837XFFS.pdf Description: IC MPU MPC83XX 400MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
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MPC8379CVRANGA MPC8379CVRANGA NXP USA Inc. MPC837XFFS.pdf Description: IC MPU MPC83XX 800MHZ 689TEBGA
Part Status: Obsolete
SATA: SATA 3Gbps (4)
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 689-TEPBGA II (31x31)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c4s
Operating Temperature: -40°C ~ 125°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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MPC8379ECVRALGA MPC8379ECVRALGA NXP USA Inc. MPC837XFFS.pdf Description: IC MPU MPC83XX 667MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (4)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
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MPC8379ECVRANGA MPC8379ECVRANGA NXP USA Inc. MPC837XFFS.pdf Description: IC MPU MPC83XX 800MHZ 689TEBGA
Produkt ist nicht verfügbar
 Mindestbestellmenge: 27 Stücke
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MPC8379EVRAJFA MPC8379EVRAJFA NXP USA Inc. Description: MPU POWERQUICC II 533MHZ 689PBGA
Produkt ist nicht verfügbar
 Mindestbestellmenge: 27 Stücke
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MPC8379EVRANGA MPC8379EVRANGA NXP USA Inc. MPC837XFFS.pdf Description: IC MPU MPC83XX 800MHZ 689TEBGA
Produkt ist nicht verfügbar
 Mindestbestellmenge: 27 Stücke
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MPC8379VRAJFA MPC8379VRAJFA NXP USA Inc. MPC837XFFS.pdf Description: IC MPU MPC83XX 533MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (4)
Part Status: Obsolete
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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Lieferzeit 10-14 Tag (e)
1+190.2 EUR
10+159.32 EUR
27+151.03 EUR
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BGU7007,115 BGU7007.pdf
BGU7007,115
Hersteller: NXP USA Inc.
Description: IC RF AMP GPS 1575.42MHZ 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1575.42MHz
RF Type: GPS/GNSS
Voltage - Supply: 1.5V ~ 2.85V
Gain: 18.5dB
Current - Supply: 12.8mA
Noise Figure: 0.85dB
P1dB: -12dBm
Test Frequency: 1.559GHz ~ 1.61GHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Part Status: Active
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Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
5000+1.27 EUR
10000+1.23 EUR
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BGU7041,115 BGU7041.pdf
BGU7041,115
Hersteller: NXP USA Inc.
Description: IC RF AMP GPS 40MHZ-1GHZ 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 40MHz ~ 1GHz
RF Type: General Purpose
Voltage - Supply: 3.1V ~ 3.5V
Gain: 10dB
Current - Supply: 38mA
Noise Figure: 3.8dB
P1dB: 12dBm
Test Frequency: 40MHz ~ 1GHz
Supplier Device Package: 6-TSSOP
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AnzahlPrivatkunde
3000+0.45 EUR
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BGU7042,115 BGU7042.pdf
BGU7042,115
Hersteller: NXP USA Inc.
Description: IC RF AMP GPS 40MHZ-1GHZ 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 40MHz ~ 1GHz
RF Type: General Purpose
Voltage - Supply: 3.1V ~ 3.5V
Gain: 10dB
Current - Supply: 38mA
Noise Figure: 3.8dB
P1dB: 12dBm
Test Frequency: 40MHz ~ 1GHz
Supplier Device Package: 6-TSSOP
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Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3000+0.51 EUR
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CBTL01023GM,115 CBTL01023.pdf
CBTL01023GM,115
Hersteller: NXP USA Inc.
Description: IC MUX/DEMUX 1CH 10-XQFN
Features: Bi-Directional, SATA
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: DisplayPort, PCIe, USB
On-State Resistance (Max): 6Ohm (Typ)
-3db Bandwidth: 9GHz
Supplier Device Package: 10-XQFN (1.55x2)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 1
Produkt ist nicht verfügbar
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JN5142N/001,515
JN5142N/001,515
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Part Status: Obsolete
RF Family/Standard: 802.15.4
Supplier Device Package: 40-HVQFN (6x6)
Current - Transmitting: 15mA
Current - Receiving: 16.5mA
Protocol: Zigbee®
Power - Output: 2.5dBm
Voltage - Supply: 2V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: TxRx + MCU
Memory Size: 128kB ROM, 32kB RAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -95dBm
Produkt ist nicht verfügbar
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JN5148/J01,515 JN5148-001.pdf
JN5148/J01,515
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB ROM, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.75dBm
Protocol: Zigbee®
Current - Receiving: 17.5mA
Data Rate (Max): 667kbps
Current - Transmitting: 15mA
Supplier Device Package: 56-HVQFN (8x8)
GPIO: 21
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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KMA210:115 KMA210.pdf
KMA210:115
Hersteller: NXP USA Inc.
Description: SENSOR ANGLE 180DEG PC PIN
Packaging: Tape & Reel (TR)
Package / Case: 3-SIP Module
Mounting Type: Through Hole
Output: Analog Voltage
Operating Temperature: -40°C ~ 160°C
Termination Style: PC Pin
Voltage - Supply: 4.5V ~ 5.5V
Linearity: ±1.2%
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: 3-SIP
Rotation Angle - Electrical, Mechanical: 0° ~ 180°
Output Signal: Clockwise Increase
Part Status: Obsolete
Produkt ist nicht verfügbar
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KMZ60,115 KMZ60.pdf
KMZ60,115
Hersteller: NXP USA Inc.
Description: SENSOR ANGLE 360DEG SMD
Resistance: 5 kOhms
Part Status: Active
Rotation Angle - Electrical, Mechanical: 0° ~ 360°
Supplier Device Package: 8-SO
For Measuring: Angle
Technology: Magnetoresistive
Actuator Type: External Magnet, Not Included
Voltage - Supply: 2.7V ~ 5.5V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 150°C
Output: Wheatstone Bridge
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NCX2220GU,115 NCX2220.pdf
NCX2220GU,115
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 2 GEN PUR 8DFN
Part Status: Obsolete
Hysteresis: 20mV
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Current - Input Bias (Max): 1pA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Quiescent (Max): 5µA
Propagation Delay (Max): 0.8µs
Supplier Device Package: DFN1714-8
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: General Purpose
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Rail-to-Rail
Package / Case: 8-XFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NTB0101GF,132 NTB0101.pdf
NTB0101GF,132
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-XSON, SOT891 (1x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Number of Circuits: 1
Produkt ist nicht verfügbar
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NTB0101GM,115 NTB0101.pdf
NTB0101GM,115
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Number of Circuits: 1
Produkt ist nicht verfügbar
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NTB0104BQ,115 NTB0104.pdf
NTB0104BQ,115
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 14-DHVQFN
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 14-VFQFN Exposed Pad
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 14-DHVQFN (2.5x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
auf Bestellung 15000 Stücke:
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NTS0104BQ,115 NTS0104.pdf
NTS0104BQ,115
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 14-DHVQFN
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 14-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 14-DHVQFN (2.5x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
auf Bestellung 6000 Stücke:
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NTS0104GU12,115 NTS0104.pdf
NTS0104GU12,115
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 12-XQFN
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 12-XFQFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 12-XQFN (2x1.7)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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NX3DV3899HR,115 NX3DV3899.pdf
NX3DV3899HR,115
Hersteller: NXP USA Inc.
Description: IC SWITCH DPDTX2 3.3OHM 16HXQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 3.3Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 4pC
Crosstalk: -90dB @ 1MHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:2
Channel-to-Channel Matching (ΔRon): 700mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 8pF
Current - Leakage (IS(off)) (Max): 5nA
Part Status: Obsolete
Number of Circuits: 2
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NX3L2267GU,115 NX3L2267.pdf
NX3L2267GU,115
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDTX2 750MOHM 10XQFN
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 10-XQFN (1.4x1.8)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 37pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 90mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2
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4000+0.88 EUR
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BGU7051,118 BGU7051.pdf
BGU7051,118
Hersteller: NXP USA Inc.
Description: IC AMP GP 500MHZ-1.5GHZ 10HVSON
Produkt ist nicht verfügbar
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BGU7052,118 BGU7052_Rev2.pdf
BGU7052,118
Hersteller: NXP USA Inc.
Description: IC RF AMP WLAN 900MHZ 10HVSON
Produkt ist nicht verfügbar
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NTS0104PW,118 NTS0104.pdf
NTS0104PW,118
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 14-TSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 14-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
auf Bestellung 14211 Stücke:
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NVT2003DP,118 NVT2003_06.pdf
NVT2003DP,118
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 10-TSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 10-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 3
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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BGA7351,115 BGA7351.pdf
BGA7351,115
Hersteller: NXP USA Inc.
Description: IC AMP GPS 50MHZ-500MHZ 32HVQFN
Part Status: Obsolete
Supplier Device Package: 32-HVQFN (5x5)
Test Frequency: 250MHz
P1dB: 15.8dBm
Noise Figure: 6dB
Current - Supply: 280mA
Gain: 21.5dB
Voltage - Supply: 4.75V ~ 5.25V
RF Type: General Purpose
Frequency: 50MHz ~ 500MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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BGU7042,115 BGU7042.pdf
BGU7042,115
Hersteller: NXP USA Inc.
Description: IC RF AMP GPS 40MHZ-1GHZ 6TSSOP
Supplier Device Package: 6-TSSOP
Test Frequency: 40MHz ~ 1GHz
P1dB: 12dBm
Noise Figure: 3.8dB
Current - Supply: 38mA
Gain: 10dB
Voltage - Supply: 3.1V ~ 3.5V
RF Type: General Purpose
Frequency: 40MHz ~ 1GHz
Mounting Type: Surface Mount
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Cut Tape (CT)
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CBTL01023GM,115 CBTL01023.pdf
CBTL01023GM,115
Hersteller: NXP USA Inc.
Description: IC MUX/DEMUX 1CH 10-XQFN
Features: Bi-Directional, SATA
Packaging: Cut Tape (CT)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: DisplayPort, PCIe, USB
On-State Resistance (Max): 6Ohm (Typ)
-3db Bandwidth: 9GHz
Supplier Device Package: 10-XQFN (1.55x2)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 1
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KMZ60,115 KMZ60.pdf
KMZ60,115
Hersteller: NXP USA Inc.
Description: SENSOR ANGLE 360DEG SMD
Resistance: 5 kOhms
Part Status: Active
Rotation Angle - Electrical, Mechanical: 0° ~ 360°
Supplier Device Package: 8-SO
For Measuring: Angle
Technology: Magnetoresistive
Actuator Type: External Magnet, Not Included
Voltage - Supply: 2.7V ~ 5.5V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 150°C
Output: Wheatstone Bridge
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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NCX2220GU,115 NCX2220.pdf
NCX2220GU,115
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 2 GEN PUR 8DFN
Part Status: Obsolete
Hysteresis: 20mV
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Current - Input Bias (Max): 1pA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Quiescent (Max): 5µA
Propagation Delay (Max): 0.8µs
Supplier Device Package: DFN1714-8
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: General Purpose
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Rail-to-Rail
Package / Case: 8-XFDFN Exposed Pad
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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NTB0101GM,115 NTB0101.pdf
NTB0101GM,115
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Number of Circuits: 1
Voltage - VCCB: 1.65 V ~ 5.5 V
Voltage - VCCA: 1.2 V ~ 3.6 V
Channels per Circuit: 1
Translator Type: Voltage Level
Channel Type: Bidirectional
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Data Rate: 100Mbps
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 6-XFDFN
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
auf Bestellung 1292 Stücke:
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19+1.11 EUR
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NTB0104BQ,115 NTB0104.pdf
NTB0104BQ,115
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 14-DHVQFN
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 14-VFQFN Exposed Pad
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 14-DHVQFN (2.5x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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NTS0104BQ,115 NTS0104.pdf
NTS0104BQ,115
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 14-DHVQFN
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 14-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 14-DHVQFN (2.5x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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NTS0104GU12,115 NTS0104.pdf
NTS0104GU12,115
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 12-XQFN
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 12-XFQFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 12-XQFN (2x1.7)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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TWR-MC-LV3PH TWRLV3PHQSG.pdf
TWR-MC-LV3PH
Hersteller: NXP USA Inc.
Description: KIT TOWER SYST 3PH MOTR CTRL MOD
Contents: Board(s)
Embedded: Yes, MCU, 16-Bit
Supplied Contents: Board(s)
Utilized IC / Part: MC56F8257
Type: Power Management
Function: Motor Controller/Driver
Packaging: Box
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TWRPI-TOUCH-STR TWRPISTRQSG.pdf
TWRPI-TOUCH-STR
Hersteller: NXP USA Inc.
Description: KIT TOUCH TOWER PLUG-IN STARTER
Packaging: Box
Contents: Board(s)
Sensor Type: Touch, Capacitive
Utilized IC / Part: MPR121
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MPC8308-NSG MPC8308-NSG_QSG.pdf
Hersteller: NXP USA Inc.
Description: REF DESIGN SMART GATEWAY MPC8308
Produkt ist nicht verfügbar
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TWRPI-MMA845XQ Tower-Mech-Brd_Robot_FS.pdf
TWRPI-MMA845XQ
Hersteller: NXP USA Inc.
Description: TOWER SYST XTRINSIC ACCELEROMETR
Part Status: Active
Sensing Range: ±2g, 4g, 8g
Embedded: No
Supplied Contents: Board(s)
Utilized IC / Part: MMA8451
Sensor Type: Accelerometer, 3 Axis
Voltage - Supply: 1.95V ~ 3.6V
Interface: I2C
Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g
Packaging: Box
Produkt ist nicht verfügbar
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MM912I637AM2EPR2 www.nxp.com
MM912I637AM2EPR2
Hersteller: NXP USA Inc.
Description: IC MCU LIN BATT MONITOR 48QFN
DigiKey Programmable: Not Verified
Number of I/O: 8
Supplier Device Package: 48-QFN-EP (7x7)
Core Processor: S12
Applications: Battery Monitor
Program Memory Type: FLASH (96KB)
Controller Series: HCS12
Voltage - Supply: 2.25V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
RAM Size: 6K x 8
Interface: LIN, SCI, SPI
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MM912I637AV1EPR2 MM912x637.pdf
MM912I637AV1EPR2
Hersteller: NXP USA Inc.
Description: IC MCU LIN BATT MONITOR 48QFN
DigiKey Programmable: Not Verified
Number of I/O: 8
Supplier Device Package: 48-QFN-EP (7x7)
Core Processor: S12
Applications: Battery Monitor
Program Memory Type: FLASH (96KB)
Controller Series: HCS12
Voltage - Supply: 2.25V ~ 5.5V
Operating Temperature: -40°C ~ 105°C
RAM Size: 6K x 8
Interface: LIN, SCI, SPI
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MM912J637AV1EPR2
MM912J637AV1EPR2
Hersteller: NXP USA Inc.
Description: IC MCU LIN BATT MONITOR 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI, SPI
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (128kB)
Applications: Battery Monitor
Core Processor: S12
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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MRFE6VP8600HR6
MRFE6VP8600HR6
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Current - Test: 1.4 A
Voltage - Test: 50 V
Voltage - Rated: 130 V
Supplier Device Package: NI-1230
Technology: LDMOS
Gain: 19.3dB
Power - Output: 125W
Configuration: Dual
Frequency: 860MHz
Mounting Type: Chassis Mount
Package / Case: NI-1230
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MRFE6VP8600HSR6
MRFE6VP8600HSR6
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Technology: LDMOS
Gain: 19.3dB
Power - Output: 125W
Configuration: Dual
Frequency: 860MHz
Mounting Type: Chassis Mount
Package / Case: NI-1230S
Packaging: Tape & Reel (TR)
Current - Test: 1.4 A
Voltage - Test: 50 V
Voltage - Rated: 130 V
Supplier Device Package: NI-1230S
Produkt ist nicht verfügbar
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MMA20312BVT1
MMA20312BVT1
Hersteller: NXP USA Inc.
Description: IC AMP LTE 1.8GHZ-2.2GHZ 12QFN
Supplier Device Package: 12-QFN (3x3)
Test Frequency: 2.14GHz
P1dB: 28.2dBm
Noise Figure: 3.3dB
Current - Supply: 70mA
Gain: 27.2dB
Voltage - Supply: 5V
RF Type: LTE, PCS, TD-SCDMA, UMTS
Frequency: 1.8GHz ~ 2.2GHz
Mounting Type: Surface Mount
Package / Case: 12-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MML20211HT1 MML20211H.pdf
MML20211HT1
Hersteller: NXP USA Inc.
Description: IC RF AMP LTE 1.4GHZ-2.8GHZ 8DFN
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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SPC5604BF2MLQ6 MPC5604BC.pdf
SPC5604BF2MLQ6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Produkt ist nicht verfügbar
Mindestbestellmenge: 300 Stücke
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MPC8377CVRAJFA MPC8377E.pdf
MPC8377CVRAJFA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
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MPC8377CVRANGA MPC8377E.pdf
MPC8377CVRANGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 800MHZ PBGA689
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Part Status: Obsolete
SATA: SATA 3Gbps (2)
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 689-TEPBGA II (31x31)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c4s
Operating Temperature: -40°C ~ 125°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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MPC8377ECVRAGDA MPC8377E.pdf
MPC8377ECVRAGDA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ PBGA689
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
SATA: SATA 3Gbps (2)
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 3.0
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 689-TEPBGA II (31x31)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c4s
Operating Temperature: -40°C ~ 125°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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MPC8377ECVRAJFA MPC8377E.pdf
MPC8377ECVRAJFA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 689TEBGA
Produkt ist nicht verfügbar
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MPC8377ECVRALGA MPC8377E.pdf
MPC8377ECVRALGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 667MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MPC8377ECVRANGA MPC8377E.pdf
MPC8377ECVRANGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 800MHZ PBGA689
SATA: SATA 3Gbps (2)
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 3.0
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 689-TEPBGA II (31x31)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c4s
Operating Temperature: -40°C ~ 125°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MPC8377EVRAGDA MPC8377E.pdf
MPC8377EVRAGDA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+160.53 EUR
10+133.83 EUR
27+126.68 EUR
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MPC8378CVRALGA MPC837XFFS.pdf
MPC8378CVRALGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 667MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MPC8378CVRANGA MPC837XFFS.pdf
MPC8378CVRANGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MPC8378ECVRAJFA MPC837XFFS.pdf
MPC8378ECVRAJFA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ PBGA689
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 689-TEPBGA II (31x31)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c4s
Operating Temperature: -40°C ~ 125°C (TA)
Speed: 533MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Co-Processors/DSP: Security; SEC 3.0
Number of Cores/Bus Width: 1 Core, 32-Bit
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MPC8378ECVRANGA MPC837XFFS.pdf
MPC8378ECVRANGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MPC8378EVRAGDA MPC837XFFS.pdf
MPC8378EVRAGDA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
Mindestbestellmenge: 81 Stücke
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MPC8378VRAGDA MPC837XFFS.pdf
MPC8378VRAGDA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
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MPC8379CVRANGA MPC837XFFS.pdf
MPC8379CVRANGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 800MHZ 689TEBGA
Part Status: Obsolete
SATA: SATA 3Gbps (4)
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 689-TEPBGA II (31x31)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c4s
Operating Temperature: -40°C ~ 125°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MPC8379ECVRALGA MPC837XFFS.pdf
MPC8379ECVRALGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 667MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (4)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MPC8379ECVRANGA MPC837XFFS.pdf
MPC8379ECVRANGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 800MHZ 689TEBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 27 Stücke
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MPC8379EVRAJFA
MPC8379EVRAJFA
Hersteller: NXP USA Inc.
Description: MPU POWERQUICC II 533MHZ 689PBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 27 Stücke
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MPC8379EVRANGA MPC837XFFS.pdf
MPC8379EVRANGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 800MHZ 689TEBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 27 Stücke
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MPC8379VRAJFA MPC837XFFS.pdf
MPC8379VRAJFA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
SATA: SATA 3Gbps (4)
Part Status: Obsolete
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+190.2 EUR
10+159.32 EUR
27+151.03 EUR
Im Einkaufswagen  Stück im Wert von  UAH
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