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S9S12D64F0CFUER S9S12D64F0CFUER NXP USA Inc. MC9S12DJ64 Guide.pdf Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Not For New Designs
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX53-START MCIMX53-START NXP USA Inc. IMX53QKSTRTFS.pdf Description: I.MX53 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply, Accessories
Core Processor: ARM® Cortex®-A8
Utilized IC / Part: i.MX53
Produkt ist nicht verfügbar
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TWR-K60N512-IAR TWR-K60N512-IAR NXP USA Inc. TWR-K60N512-IAR-GSG.pdf Description: TOWER SYSTEM K60 EVAL BRD
Produkt ist nicht verfügbar
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LPC11C22FBD48/301, LPC11C22FBD48/301, NXP USA Inc. LPC11CX2_CX4.pdf Description: IC MCU 32BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 313 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.11 EUR
10+5.06 EUR
25+5.05 EUR
100+4.75 EUR
250+4.49 EUR
Mindestbestellmenge: 3
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LPC11C24FBD48/301, LPC11C24FBD48/301, NXP USA Inc. LPC11CX2_CX4.pdf Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Discontinued at Digi-Key
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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OM13012,598 OM13012,598 NXP USA Inc. Description: LPCXPRESSO LPC11C24 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC11C24
Platform: LPCXpresso™
Produkt ist nicht verfügbar
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13226PRO-DBG 13226PRO-DBG NXP USA Inc. MC1322x_Oct2010.pdf Description: KIT DEV PRO ZIGBEE 1322X
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
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CWH-ETP-BDM-HE NXP USA Inc. CodeWarrior_Ethernet_TAP.pdf Description: KIT ETHERNET TAP PROBE BDM
Packaging: Box
For Use With/Related Products: CodeWarrior™ Tap
Type: Debugger
Contents: Board(s)
Utilized IC / Part: CodeWarrior™ Tap
Produkt ist nicht verfügbar
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CWH-GTP-JTAG-HE NXP USA Inc. Gigabit_TAP_System_Overview.pdf Description: KIT GIGABIT TAP JTAG
Packaging: Box
For Use With/Related Products: CodeWarrior™ Tap
Accessory Type: Interface Board
Produkt ist nicht verfügbar
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CWH-GTT-ARKT-YE NXP USA Inc. Description: KIT UPG GIGABITTAP+TRC
Produkt ist nicht verfügbar
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DSPB721DB1E NXP USA Inc. Description: DAUGHTER CARD B VERSION
Packaging: Bulk
For Use With/Related Products: DSPAUDIOEVM
Accessory Type: Daughter Board
Utilized IC / Part: DSPAUDIOEVM
Produkt ist nicht verfügbar
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KIT34674EPEVBE NXP USA Inc. Description: KIT EVAL BOARD 10CH LED BACKLGHT
Packaging: Box
Function: Battery Charger
Type: Power Management
Utilized IC / Part: MC34674
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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KIT34712EPEVBE NXP USA Inc. KIT34712EPEVBE.pdf Description: EVAL BOARD FOR MC34712
Packaging: Box
Voltage - Output: 0.7V ~ 1.35V
Voltage - Input: 3V ~ 6V
Current - Output: 3A
Frequency - Switching: 1MHz
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: MC34712
Supplied Contents: Board(s)
Main Purpose: Special Purpose DC/DC, DDR Memory Supply
Outputs and Type: 1 Non-Isolated Output
Contents: Board(s)
Produkt ist nicht verfügbar
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KIT34713EPEVBE NXP USA Inc. KIT34713EPEVBE.pdf Description: KIT EVAL BOARD 5A 1MHZ
Packaging: Box
Voltage - Output: 0.7V ~ 3.6V
Voltage - Input: 3V ~ 6V
Current - Output: 5A
Frequency - Switching: 1MHz
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: MC34713
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 1, Non-Isolated
Part Status: Active
Produkt ist nicht verfügbar
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KIT34716EPEVBE NXP USA Inc. Description: KIT EVAL BOARD 1MHZ DUAL SW-MODE
Packaging: Box
Voltage - Input: 3V ~ 6V
Current - Output: 5A, 3A
Frequency - Switching: 1MHz
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: MC34716
Supplied Contents: Board(s)
Main Purpose: Special Purpose DC/DC, DDR Memory Supply
Outputs and Type: 2, Non-Isolated
Produkt ist nicht verfügbar
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KIT34717EPEVBE NXP USA Inc. KIT34717EPEVBE.pdf Description: KIT EVAL BOARD 5A 1.0MHZ
Packaging: Box
Voltage - Output: 1.5V, 1.8V
Voltage - Input: 3V ~ 6V
Current - Output: 5A, 5A
Frequency - Switching: 1MHz
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: MC34717
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 2, Non-Isolated
Part Status: Active
Produkt ist nicht verfügbar
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KIT34844AEPEVBE NXP USA Inc. Description: EVAL BOARD FOR MC34844A
Packaging: Box
Voltage - Output: 47V
Voltage - Input: 21.6V ~ 26.4V
Current - Output / Channel: 60mA
Utilized IC / Part: MC34844A
Supplied Contents: Board(s), Cable(s)
Outputs and Type: 10 Non-Isolated Outputs
Part Status: Active
Contents: Board(s), Cable(s)
Produkt ist nicht verfügbar
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KIT35XS3500EVBE NXP USA Inc. MC35XS3500.pdf Description: EVAL BOARD FOR MC35XS3500
Packaging: Box
Function: Automotive
Type: Opto/Lighting
Utilized IC / Part: MC35XS3500
Supplied Contents: Board(s)
Contents: Board(s)
Produkt ist nicht verfügbar
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74AHC240D,112 74AHC240D,112 NXP USA Inc. 74AHC%28T%29240.pdf Description: IC BUFFER INVERT 5.5V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-SO
Produkt ist nicht verfügbar
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CLRD852,599 NXP USA Inc. Description: RFID READER MIFARE
Produkt ist nicht verfügbar
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HT2ICS2002W/V9F,00 NXP USA Inc. Description: IC RFID TRANSP 125KHZ UNCASED
Produkt ist nicht verfügbar
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PCF2123U/12HA/1,00 NXP USA Inc. PCF2123.pdf Description: IC RTC CLOCK/CALENDAR SPI DIE
Packaging: Bulk
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Package / Case: Die
Interface: SPI
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.6V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: Die
Current - Timekeeping (Max): 0.33µA ~ 0.38µA @ 2V ~ 5V
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCF85132U/2DA/1,02 NXP USA Inc. PCF85132.pdf Description: IC DRVR MULTIPLE DIE
Packaging: Bulk
Package / Case: Die
Display Type: LCD
Interface: I2C
Configuration: Multiple
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: Any Digit Type
Supplier Device Package: Die
Current - Supply: 60 µA
Produkt ist nicht verfügbar
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SL2ICS2001DW/V1D,3 NXP USA Inc. 058031.pdf Description: RFID TAG R/W 13.56MHZ INLAY
Produkt ist nicht verfügbar
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SL2S2002FUD,003 NXP USA Inc. SL2S2002_SL2S2102.pdf Description: IC RFID TRANSP 13.56MHZ DIE
Produkt ist nicht verfügbar
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SL2S2102FUD,003 NXP USA Inc. SL2S2002_SL2S2102.pdf Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 1.7V
Standards: ISO 15693, ISO 18000-3
Produkt ist nicht verfügbar
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SL2S5002FUD,003 NXP USA Inc. SL2S5002_SL2S5102.pdf Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 1.7V
Standards: ISO 15693, ISO 18000-3
Supplier Device Package: Die
Produkt ist nicht verfügbar
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SL2S5102FUD,003 NXP USA Inc. SL2S5002_SL2S5102.pdf Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 1.7V
Standards: ISO 15693, ISO 18000-3
Supplier Device Package: Die
Produkt ist nicht verfügbar
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SL2S5302FUD,003 NXP USA Inc. SL2S5302_SL2S5402.pdf Description: IC RFID TRANSP 13.56MHZ DIE
Produkt ist nicht verfügbar
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SL2S5402FUD,003 NXP USA Inc. SL2S5302_SL2S5402.pdf Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 1.7V
Standards: ISO 15693, ISO 18000-3
Supplier Device Package: Die
Produkt ist nicht verfügbar
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SL3ICS1001FW/V7AJ, NXP USA Inc. Description: IC I-CODE SLI UNCASED FOIL
Produkt ist nicht verfügbar
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BFG505/X,235 BFG505/X,235 NXP USA Inc. BFG505_X_Rev4.pdf Description: RF TRANS NPN 15V 9GHZ SOT-143B
Packaging: Tape & Reel (TR)
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 150mW
Current - Collector (Ic) (Max): 18mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 6V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.2dB ~ 1.9dB @ 900MHz ~ 2GHz
Supplier Device Package: SOT-143B
Produkt ist nicht verfügbar
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BFR94A,215 BFR94A,215 NXP USA Inc. BFR94A_Rev4.pdf Description: RF TRANS NPN 15V 5GHZ SOT-23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 25mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 65 @ 15mA, 10V
Frequency - Transition: 5GHz
Noise Figure (dB Typ @ f): 2.1dB ~ 3dB @ 1GHz ~ 2GHz
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Produkt ist nicht verfügbar
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IP3048CX5,135 NXP USA Inc. Description: FILTER LC(PI) 3NH/190PF ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 5-WFBGA, WLCSP
Size / Dimension: 0.059" L x 0.045" W (1.51mm x 1.14mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: L = 3nH (Total), C = 190pF (Total)
Height: 0.027" (0.69mm)
Attenuation Value: 35dB @ 800MHz ~ 2GHz
Filter Order: 3rd
Applications: GSM, LAN, PCS, WAN
Technology: LC (Pi)
Resistance - Channel (Ohms): 0.25
ESD Protection: Yes
Number of Channels: 2
Current: 625 mA
Produkt ist nicht verfügbar
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IP4305CX4/LF/P,315 IP4305CX4/LF/P,315 NXP USA Inc. DiscreteSemiconductors.pdf Description: TVS DIODE 4WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 4-UFBGA, WLCSP
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Supplier Device Package: 4-WLCSP (0.96x0.96)
Unidirectional Channels: 2
Voltage - Breakdown (Min): 15V
Produkt ist nicht verfügbar
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IP4309CX9,135 IP4309CX9,135 NXP USA Inc. IP4309CX9.pdf Description: TVS DIODE 5.5VWM 9-CSP
Packaging: Tape & Reel (TR)
Package / Case: 9-WFBGA, CSPBGA
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -35°C ~ 85°C (TA)
Applications: HDMI
Voltage - Reverse Standoff (Typ): 5.5V
Supplier Device Package: 9-CSP
Unidirectional Channels: 8
Voltage - Breakdown (Min): 6V
Power Line Protection: Yes
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IP4342CX5/LF,135 NXP USA Inc. Description: TVS DIODE 5.5VWM 5WLCSP
Produkt ist nicht verfügbar
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ADC1012D065HN/C1:5 ADC1012D065HN/C1:5 NXP USA Inc. Description: IC ADC 65MHZ SOT804-3
Produkt ist nicht verfügbar
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ADC1012D080HN/C1:5 ADC1012D080HN/C1:5 NXP USA Inc. Description: IC ADC 80MHZ SOT804-3
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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ADC1012D105HN/C1,5 ADC1012D105HN/C1,5 NXP USA Inc. Description: IC ADC 105MHZ SOT804-3
Produkt ist nicht verfügbar
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ADC1012D125HN/C1:5 ADC1012D125HN/C1:5 NXP USA Inc. Description: IC ADC 125MHZ SOT804-3
Produkt ist nicht verfügbar
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BUK6207-30C,118 BUK6207-30C,118 NXP USA Inc. Description: MOSFET N-CH 30V 90A DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 90A (Tc)
Rds On (Max) @ Id, Vgs: 5.2mOhm @ 15A, 10V
Power Dissipation (Max): 128W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: DPAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 54.8 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3470 pF @ 25 V
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BUK6208-40C,118 BUK6208-40C,118 NXP USA Inc. BUK6208-40C.pdf Description: MOSFET N-CH 40V 90A DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 90A (Tc)
Rds On (Max) @ Id, Vgs: 6.2mOhm @ 15A, 10V
Power Dissipation (Max): 128W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: DPAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 67 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3720 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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BUK6240-75C,118 BUK6240-75C,118 NXP USA Inc. BUK6240-75C.pdf Description: MOSFET N-CH 75V 22A DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 22A (Tc)
Rds On (Max) @ Id, Vgs: 46mOhm @ 10A, 10V
Power Dissipation (Max): 60W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: DPAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 75 V
Gate Charge (Qg) (Max) @ Vgs: 21.4 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1280 pF @ 25 V
Produkt ist nicht verfügbar
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CX24133-12Z,518 CX24133-12Z,518 NXP USA Inc. Description: IC SATELLITE TUNER DGTL DUAL 48H
Produkt ist nicht verfügbar
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IP3253CZ12-6,118 NXP USA Inc. IP3253_54CZ8_CZ12_CZ16.pdf Description: FILTER LC(PI) 18NH/25PF ESD SMD
Produkt ist nicht verfügbar
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IP4251CZ8-4,118 NXP USA Inc. IP4251,52,53,54-TTL.pdf Description: FILTER RC(PI) 100 OHM/10PF SMD
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Size / Dimension: 0.067" L x 0.053" W (1.70mm x 1.35mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 10pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 16dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 4
Produkt ist nicht verfügbar
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LM75ADP/DG,118 LM75ADP/DG,118 NXP USA Inc. LM75A.pdf Description: SENSOR DIGITAL -55C-125C 8TSSOP
Packaging: Tape & Reel (TR)
Features: Output Switch, Programmable Limit, Programmable Resolution, Shutdown Mode
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-TSSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Obsolete
Produkt ist nicht verfügbar
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LPC2102FBD48,118 LPC2102FBD48,118 NXP USA Inc. LPC2101_02_03.pdf Description: IC MCU 16/32BIT 16KB FLSH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 70MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2131FBD64/01,11 LPC2131FBD64/01,11 NXP USA Inc. LPC2131_32_34_36_38.pdf Description: IC MCU 16/32BIT 32KB FLSH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 47
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2132FBD64/01,11 LPC2132FBD64/01,11 NXP USA Inc. LPC2131_32_34_36_38.pdf Description: IC MCU 16/32BIT 64KB FLSH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 47
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2134FBD64/01,11 LPC2134FBD64/01,11 NXP USA Inc. LPC2131_32_34_36_38.pdf Description: IC MCU 16/32B 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 47
DigiKey Programmable: Not Verified
auf Bestellung 1500 Stücke:
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LPC2138FBD64/01,11 LPC2138FBD64/01,11 NXP USA Inc. LPC2131_32_34_36_38.pdf Description: IC MCU 16/32B 512KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 47
DigiKey Programmable: Not Verified
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LPC2220FET144/G,51 LPC2220FET144/G,51 NXP USA Inc. LPC2210_2220.pdf Description: IC MCU 16/32BIT ROMLESS 144TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 75MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-TFBGA (12x12)
Number of I/O: 76
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P5DF081HN/T1AD2060 P5DF081HN/T1AD2060 NXP USA Inc. P5CF081.pdf Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.3V
Standards: ISO 14443, MIFARE
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Obsolete
Produkt ist nicht verfügbar
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P5DF081X0/T1AD2060 NXP USA Inc. P5CF081.pdf Description: IC RFID READER 13.56MHZ DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.3V
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
Part Status: Active
Produkt ist nicht verfügbar
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P5DF081X0T1AD2060S NXP USA Inc. P5CF081.pdf Description: IC RFID READER 13.56MHZ DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.3V
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
Part Status: Active
Produkt ist nicht verfügbar
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PCA82C250T/YM,118 PCA82C250T/YM,118 NXP USA Inc. PCA82C250.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 150 mV
Duplex: Half
Part Status: Active
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2500+1.96 EUR
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PCA82C251T/YM,118 PCA82C251T/YM,118 NXP USA Inc. PCA82C251.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 1MBd
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 150 mV
Duplex: Half
Part Status: Active
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PCA9509DP/DG,118 PCA9509DP/DG,118 NXP USA Inc. PCA9509.pdf Description: IC REDRIVER I2C 2CH 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Applications: I2C
Current - Supply: 3mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
Capacitance - Input: 2 pF
Produkt ist nicht verfügbar
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S9S12D64F0CFUER MC9S12DJ64 Guide.pdf
S9S12D64F0CFUER
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Not For New Designs
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX53-START IMX53QKSTRTFS.pdf
MCIMX53-START
Hersteller: NXP USA Inc.
Description: I.MX53 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply, Accessories
Core Processor: ARM® Cortex®-A8
Utilized IC / Part: i.MX53
Produkt ist nicht verfügbar
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TWR-K60N512-IAR TWR-K60N512-IAR-GSG.pdf
TWR-K60N512-IAR
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM K60 EVAL BRD
Produkt ist nicht verfügbar
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LPC11C22FBD48/301, LPC11CX2_CX4.pdf
LPC11C22FBD48/301,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 313 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+8.11 EUR
10+5.06 EUR
25+5.05 EUR
100+4.75 EUR
250+4.49 EUR
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LPC11C24FBD48/301, LPC11CX2_CX4.pdf
LPC11C24FBD48/301,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Discontinued at Digi-Key
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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OM13012,598
OM13012,598
Hersteller: NXP USA Inc.
Description: LPCXPRESSO LPC11C24 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC11C24
Platform: LPCXpresso™
Produkt ist nicht verfügbar
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13226PRO-DBG MC1322x_Oct2010.pdf
13226PRO-DBG
Hersteller: NXP USA Inc.
Description: KIT DEV PRO ZIGBEE 1322X
auf Bestellung 1 Stücke:
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CWH-ETP-BDM-HE CodeWarrior_Ethernet_TAP.pdf
Hersteller: NXP USA Inc.
Description: KIT ETHERNET TAP PROBE BDM
Packaging: Box
For Use With/Related Products: CodeWarrior™ Tap
Type: Debugger
Contents: Board(s)
Utilized IC / Part: CodeWarrior™ Tap
Produkt ist nicht verfügbar
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CWH-GTP-JTAG-HE Gigabit_TAP_System_Overview.pdf
Hersteller: NXP USA Inc.
Description: KIT GIGABIT TAP JTAG
Packaging: Box
For Use With/Related Products: CodeWarrior™ Tap
Accessory Type: Interface Board
Produkt ist nicht verfügbar
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CWH-GTT-ARKT-YE
Hersteller: NXP USA Inc.
Description: KIT UPG GIGABITTAP+TRC
Produkt ist nicht verfügbar
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DSPB721DB1E
Hersteller: NXP USA Inc.
Description: DAUGHTER CARD B VERSION
Packaging: Bulk
For Use With/Related Products: DSPAUDIOEVM
Accessory Type: Daughter Board
Utilized IC / Part: DSPAUDIOEVM
Produkt ist nicht verfügbar
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KIT34674EPEVBE
Hersteller: NXP USA Inc.
Description: KIT EVAL BOARD 10CH LED BACKLGHT
Packaging: Box
Function: Battery Charger
Type: Power Management
Utilized IC / Part: MC34674
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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KIT34712EPEVBE KIT34712EPEVBE.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR MC34712
Packaging: Box
Voltage - Output: 0.7V ~ 1.35V
Voltage - Input: 3V ~ 6V
Current - Output: 3A
Frequency - Switching: 1MHz
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: MC34712
Supplied Contents: Board(s)
Main Purpose: Special Purpose DC/DC, DDR Memory Supply
Outputs and Type: 1 Non-Isolated Output
Contents: Board(s)
Produkt ist nicht verfügbar
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KIT34713EPEVBE KIT34713EPEVBE.pdf
Hersteller: NXP USA Inc.
Description: KIT EVAL BOARD 5A 1MHZ
Packaging: Box
Voltage - Output: 0.7V ~ 3.6V
Voltage - Input: 3V ~ 6V
Current - Output: 5A
Frequency - Switching: 1MHz
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: MC34713
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 1, Non-Isolated
Part Status: Active
Produkt ist nicht verfügbar
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KIT34716EPEVBE
Hersteller: NXP USA Inc.
Description: KIT EVAL BOARD 1MHZ DUAL SW-MODE
Packaging: Box
Voltage - Input: 3V ~ 6V
Current - Output: 5A, 3A
Frequency - Switching: 1MHz
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: MC34716
Supplied Contents: Board(s)
Main Purpose: Special Purpose DC/DC, DDR Memory Supply
Outputs and Type: 2, Non-Isolated
Produkt ist nicht verfügbar
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KIT34717EPEVBE KIT34717EPEVBE.pdf
Hersteller: NXP USA Inc.
Description: KIT EVAL BOARD 5A 1.0MHZ
Packaging: Box
Voltage - Output: 1.5V, 1.8V
Voltage - Input: 3V ~ 6V
Current - Output: 5A, 5A
Frequency - Switching: 1MHz
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: MC34717
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 2, Non-Isolated
Part Status: Active
Produkt ist nicht verfügbar
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KIT34844AEPEVBE
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR MC34844A
Packaging: Box
Voltage - Output: 47V
Voltage - Input: 21.6V ~ 26.4V
Current - Output / Channel: 60mA
Utilized IC / Part: MC34844A
Supplied Contents: Board(s), Cable(s)
Outputs and Type: 10 Non-Isolated Outputs
Part Status: Active
Contents: Board(s), Cable(s)
Produkt ist nicht verfügbar
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KIT35XS3500EVBE MC35XS3500.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR MC35XS3500
Packaging: Box
Function: Automotive
Type: Opto/Lighting
Utilized IC / Part: MC35XS3500
Supplied Contents: Board(s)
Contents: Board(s)
Produkt ist nicht verfügbar
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74AHC240D,112 74AHC%28T%29240.pdf
74AHC240D,112
Hersteller: NXP USA Inc.
Description: IC BUFFER INVERT 5.5V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-SO
Produkt ist nicht verfügbar
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CLRD852,599
Hersteller: NXP USA Inc.
Description: RFID READER MIFARE
Produkt ist nicht verfügbar
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HT2ICS2002W/V9F,00
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 125KHZ UNCASED
Produkt ist nicht verfügbar
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PCF2123U/12HA/1,00 PCF2123.pdf
Hersteller: NXP USA Inc.
Description: IC RTC CLOCK/CALENDAR SPI DIE
Packaging: Bulk
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Package / Case: Die
Interface: SPI
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.6V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: Die
Current - Timekeeping (Max): 0.33µA ~ 0.38µA @ 2V ~ 5V
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCF85132U/2DA/1,02 PCF85132.pdf
Hersteller: NXP USA Inc.
Description: IC DRVR MULTIPLE DIE
Packaging: Bulk
Package / Case: Die
Display Type: LCD
Interface: I2C
Configuration: Multiple
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: Any Digit Type
Supplier Device Package: Die
Current - Supply: 60 µA
Produkt ist nicht verfügbar
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SL2ICS2001DW/V1D,3 058031.pdf
Hersteller: NXP USA Inc.
Description: RFID TAG R/W 13.56MHZ INLAY
Produkt ist nicht verfügbar
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SL2S2002FUD,003 SL2S2002_SL2S2102.pdf
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Produkt ist nicht verfügbar
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SL2S2102FUD,003 SL2S2002_SL2S2102.pdf
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 1.7V
Standards: ISO 15693, ISO 18000-3
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SL2S5002FUD,003 SL2S5002_SL2S5102.pdf
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 1.7V
Standards: ISO 15693, ISO 18000-3
Supplier Device Package: Die
Produkt ist nicht verfügbar
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SL2S5102FUD,003 SL2S5002_SL2S5102.pdf
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 1.7V
Standards: ISO 15693, ISO 18000-3
Supplier Device Package: Die
Produkt ist nicht verfügbar
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SL2S5302FUD,003 SL2S5302_SL2S5402.pdf
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Produkt ist nicht verfügbar
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SL2S5402FUD,003 SL2S5302_SL2S5402.pdf
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 1.7V
Standards: ISO 15693, ISO 18000-3
Supplier Device Package: Die
Produkt ist nicht verfügbar
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SL3ICS1001FW/V7AJ,
Hersteller: NXP USA Inc.
Description: IC I-CODE SLI UNCASED FOIL
Produkt ist nicht verfügbar
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BFG505/X,235 BFG505_X_Rev4.pdf
BFG505/X,235
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 15V 9GHZ SOT-143B
Packaging: Tape & Reel (TR)
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 150mW
Current - Collector (Ic) (Max): 18mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 6V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.2dB ~ 1.9dB @ 900MHz ~ 2GHz
Supplier Device Package: SOT-143B
Produkt ist nicht verfügbar
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BFR94A,215 BFR94A_Rev4.pdf
BFR94A,215
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 15V 5GHZ SOT-23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 25mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 65 @ 15mA, 10V
Frequency - Transition: 5GHz
Noise Figure (dB Typ @ f): 2.1dB ~ 3dB @ 1GHz ~ 2GHz
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Produkt ist nicht verfügbar
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IP3048CX5,135
Hersteller: NXP USA Inc.
Description: FILTER LC(PI) 3NH/190PF ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 5-WFBGA, WLCSP
Size / Dimension: 0.059" L x 0.045" W (1.51mm x 1.14mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: L = 3nH (Total), C = 190pF (Total)
Height: 0.027" (0.69mm)
Attenuation Value: 35dB @ 800MHz ~ 2GHz
Filter Order: 3rd
Applications: GSM, LAN, PCS, WAN
Technology: LC (Pi)
Resistance - Channel (Ohms): 0.25
ESD Protection: Yes
Number of Channels: 2
Current: 625 mA
Produkt ist nicht verfügbar
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IP4305CX4/LF/P,315 DiscreteSemiconductors.pdf
IP4305CX4/LF/P,315
Hersteller: NXP USA Inc.
Description: TVS DIODE 4WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 4-UFBGA, WLCSP
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Supplier Device Package: 4-WLCSP (0.96x0.96)
Unidirectional Channels: 2
Voltage - Breakdown (Min): 15V
Produkt ist nicht verfügbar
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IP4309CX9,135 IP4309CX9.pdf
IP4309CX9,135
Hersteller: NXP USA Inc.
Description: TVS DIODE 5.5VWM 9-CSP
Packaging: Tape & Reel (TR)
Package / Case: 9-WFBGA, CSPBGA
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -35°C ~ 85°C (TA)
Applications: HDMI
Voltage - Reverse Standoff (Typ): 5.5V
Supplier Device Package: 9-CSP
Unidirectional Channels: 8
Voltage - Breakdown (Min): 6V
Power Line Protection: Yes
Produkt ist nicht verfügbar
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IP4342CX5/LF,135
Hersteller: NXP USA Inc.
Description: TVS DIODE 5.5VWM 5WLCSP
Produkt ist nicht verfügbar
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ADC1012D065HN/C1:5
ADC1012D065HN/C1:5
Hersteller: NXP USA Inc.
Description: IC ADC 65MHZ SOT804-3
Produkt ist nicht verfügbar
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ADC1012D080HN/C1:5
ADC1012D080HN/C1:5
Hersteller: NXP USA Inc.
Description: IC ADC 80MHZ SOT804-3
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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ADC1012D105HN/C1,5
ADC1012D105HN/C1,5
Hersteller: NXP USA Inc.
Description: IC ADC 105MHZ SOT804-3
Produkt ist nicht verfügbar
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ADC1012D125HN/C1:5
ADC1012D125HN/C1:5
Hersteller: NXP USA Inc.
Description: IC ADC 125MHZ SOT804-3
Produkt ist nicht verfügbar
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BUK6207-30C,118
BUK6207-30C,118
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 90A DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 90A (Tc)
Rds On (Max) @ Id, Vgs: 5.2mOhm @ 15A, 10V
Power Dissipation (Max): 128W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: DPAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 54.8 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3470 pF @ 25 V
Produkt ist nicht verfügbar
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BUK6208-40C,118 BUK6208-40C.pdf
BUK6208-40C,118
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 40V 90A DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 90A (Tc)
Rds On (Max) @ Id, Vgs: 6.2mOhm @ 15A, 10V
Power Dissipation (Max): 128W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: DPAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 67 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3720 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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BUK6240-75C,118 BUK6240-75C.pdf
BUK6240-75C,118
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 75V 22A DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 22A (Tc)
Rds On (Max) @ Id, Vgs: 46mOhm @ 10A, 10V
Power Dissipation (Max): 60W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: DPAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 75 V
Gate Charge (Qg) (Max) @ Vgs: 21.4 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1280 pF @ 25 V
Produkt ist nicht verfügbar
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CX24133-12Z,518
CX24133-12Z,518
Hersteller: NXP USA Inc.
Description: IC SATELLITE TUNER DGTL DUAL 48H
Produkt ist nicht verfügbar
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IP3253CZ12-6,118 IP3253_54CZ8_CZ12_CZ16.pdf
Hersteller: NXP USA Inc.
Description: FILTER LC(PI) 18NH/25PF ESD SMD
Produkt ist nicht verfügbar
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IP4251CZ8-4,118 IP4251,52,53,54-TTL.pdf
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHM/10PF SMD
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Size / Dimension: 0.067" L x 0.053" W (1.70mm x 1.35mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 10pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 16dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 4
Produkt ist nicht verfügbar
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LM75ADP/DG,118 LM75A.pdf
LM75ADP/DG,118
Hersteller: NXP USA Inc.
Description: SENSOR DIGITAL -55C-125C 8TSSOP
Packaging: Tape & Reel (TR)
Features: Output Switch, Programmable Limit, Programmable Resolution, Shutdown Mode
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-TSSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Obsolete
Produkt ist nicht verfügbar
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LPC2102FBD48,118 LPC2101_02_03.pdf
LPC2102FBD48,118
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT 16KB FLSH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 70MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2131FBD64/01,11 LPC2131_32_34_36_38.pdf
LPC2131FBD64/01,11
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT 32KB FLSH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 47
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2132FBD64/01,11 LPC2131_32_34_36_38.pdf
LPC2132FBD64/01,11
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT 64KB FLSH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 47
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2134FBD64/01,11 LPC2131_32_34_36_38.pdf
LPC2134FBD64/01,11
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 47
DigiKey Programmable: Not Verified
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1500+16.18 EUR
Mindestbestellmenge: 1500
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LPC2138FBD64/01,11 LPC2131_32_34_36_38.pdf
LPC2138FBD64/01,11
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 512KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 16x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 47
DigiKey Programmable: Not Verified
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1500+21.35 EUR
Mindestbestellmenge: 1500
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LPC2220FET144/G,51 LPC2210_2220.pdf
LPC2220FET144/G,51
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 144TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 75MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-TFBGA (12x12)
Number of I/O: 76
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P5DF081HN/T1AD2060 P5CF081.pdf
P5DF081HN/T1AD2060
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.3V
Standards: ISO 14443, MIFARE
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Obsolete
Produkt ist nicht verfügbar
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P5DF081X0/T1AD2060 P5CF081.pdf
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.3V
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
Part Status: Active
Produkt ist nicht verfügbar
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P5DF081X0T1AD2060S P5CF081.pdf
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.3V
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
Part Status: Active
Produkt ist nicht verfügbar
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PCA82C250T/YM,118 PCA82C250.pdf
PCA82C250T/YM,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 150 mV
Duplex: Half
Part Status: Active
auf Bestellung 22500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+1.96 EUR
5000+1.92 EUR
7500+1.9 EUR
Mindestbestellmenge: 2500
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PCA82C251T/YM,118 PCA82C251.pdf
PCA82C251T/YM,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 1MBd
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 150 mV
Duplex: Half
Part Status: Active
auf Bestellung 19000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+2.13 EUR
5000+2.09 EUR
Mindestbestellmenge: 2500
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PCA9509DP/DG,118 PCA9509.pdf
PCA9509DP/DG,118
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Applications: I2C
Current - Supply: 3mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
Capacitance - Input: 2 pF
Produkt ist nicht verfügbar
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