Technische Details MCZ33905BD3EK NXP Semiconductors
Description: IC INTERFACE SPECIALIZED 54SOIC, Packaging: Box, Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad, Mounting Type: Surface Mount, Interface: CAN, LIN, Voltage - Supply: 5.5V ~ 28V, Applications: System Basis Chip, Supplier Device Package: 54-SOIC-EP.
Weitere Produktangebote MCZ33905BD3EK
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MCZ33905BD3EK | Hersteller : NXP Semiconductors |
 High Performance System Basis Chip Automotive AEC-Q100 |
Produkt ist nicht verfügbar |
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MCZ33905BD3EK | Hersteller : NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 54SOIC Packaging: Box Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: CAN, LIN Voltage - Supply: 5.5V ~ 28V Applications: System Basis Chip Supplier Device Package: 54-SOIC-EP |
Produkt ist nicht verfügbar |