MC33PF8100FJESR2 NXP Semiconductors
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Technische Details MC33PF8100FJESR2 NXP Semiconductors
Description: POWER MANAGEMENT IC, I.MX8, PRE-, Packaging: Tape & Reel (TR), Package / Case: 56-VFQFN Exposed Pad, Mounting Type: Surface Mount, Wettable Flank, Operating Temperature: -40°C ~ 105°C (TA), Voltage - Supply: 2.5V ~ 5.5V, Applications: Processor, Current - Supply: 10µA, Supplier Device Package: 56-HVQFN (8x8), Grade: Automotive, Qualification: AEC-Q100.
Weitere Produktangebote MC33PF8100FJESR2
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MC33PF8100FJESR2 | Hersteller : NXP USA Inc. |
 Description: POWER MANAGEMENT IC, I.MX8, PRE-Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: Processor Current - Supply: 10µA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MC33PF8100FJESR2 | Hersteller : NXP Semiconductors |
Power Management Specialised - PMIC Power Management IC, i.MX8, pre-prog, 7 buck, 4 LDO, Industrial, QFN 56 |
Produkt ist nicht verfügbar |