LPC1830FET256K NXP USA Inc.
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256LBGA
DigiKey Programmable: Not Verified
Number of I/O: 164
Supplier Device Package: 256-LBGA (17x17)
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 200K x 8
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
| Anzahl | Privatkunde |
|---|---|
| 1+ | 23.23 EUR |
| 10+ | 18.29 EUR |
| 25+ | 17.05 EUR |
| 100+ | 15.68 EUR |
| 250+ | 15.04 EUR |
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Technische Details LPC1830FET256K NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256LBGA, DigiKey Programmable: Not Verified, Number of I/O: 164, Supplier Device Package: 256-LBGA (17x17), Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT, Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG, Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V, Core Size: 32-Bit, Data Converters: A/D 8x10b SAR; D/A 1x10b, Core Processor: ARM® Cortex®-M3, Program Memory Type: ROMless, Oscillator Type: Internal, Operating Temperature: -40°C ~ 85°C (TA), RAM Size: 200K x 8, Speed: 180MHz, Mounting Type: Surface Mount, Package / Case: 256-LBGA, Packaging: Tray.
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