LPC1830FET256K NXP USA Inc.
Hersteller: NXP USA Inc.Description: IC MCU 32BIT ROMLESS 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Number of I/O: 164
DigiKey Programmable: Not Verified
auf Bestellung 425 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 19.57 EUR |
| 10+ | 15.4 EUR |
| 25+ | 14.36 EUR |
| 100+ | 13.21 EUR |
| 250+ | 12.67 EUR |
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Technische Details LPC1830FET256K NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256LBGA, Packaging: Tray, Package / Case: 256-LBGA, Mounting Type: Surface Mount, Speed: 180MHz, RAM Size: 200K x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: Internal, Program Memory Type: ROMless, Core Processor: ARM® Cortex®-M3, Data Converters: A/D 8x10b SAR; D/A 1x10b, Core Size: 32-Bit, Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V, Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG, Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT, Supplier Device Package: 256-LBGA (17x17), Number of I/O: 164, DigiKey Programmable: Not Verified.
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