Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36223) > Seite 603 nach 604
| Foto | Bezeichnung | Hersteller | Beschreibung |
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| MPC8535BVJANGA | NXP USA Inc. |
 Description: POWERQUICC, 32 BIT POWER ARCH SOPackaging: Bulk |
auf Bestellung 720 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC07APW,112 | NXP USA Inc. |
Description: IC BUFF HEX OPEN DRAIN 14TSSOP Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74LVC07ABQ,115 | NXP USA Inc. |
Description: IC BUFF HEX OPEN DRAIN 14DHVQFN Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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74LVC07APW,118 | NXP USA Inc. |
Description: IC BUFF HEX OPEN DRAIN 14TSSOP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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74LVC07AD,112 | NXP USA Inc. |
Description: IC BUFF HEX OPEN DRAIN 14SOIC Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| 88Q9098-A2-NYKA/MP | NXP USA Inc. |
Description: 88Q9098-A2-NYKA/A Packaging: Tape & Reel (TR) Package / Case: 148-VFQFN Dual Rows, Exposed Pad Mounting Type: Surface Mount Frequency: 2.4GHz, 5GHz Type: TxRx Only Operating Temperature: -40°C ~ 105°C Voltage - Supply: 1.8V ~ 3.3V Protocol: 802.11ac/ax, Bluetooth v5.3 Supplier Device Package: 148-HVQFN (11x11) Modulation: 1024QAM RF Family/Standard: Bluetooth, WiFi Serial Interfaces: SDIO, PCle, UART Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| 88Q9098-A2-NYKA/AK | NXP USA Inc. |
Description: 88Q9098-A2-NYKA/A Packaging: Tray Package / Case: 148-VFQFN Dual Rows, Exposed Pad Mounting Type: Surface Mount Frequency: 2.4GHz, 5GHz Type: TxRx Only Operating Temperature: -40°C ~ 105°C Voltage - Supply: 1.8V ~ 3.3V Protocol: 802.11ac/ax, Bluetooth v5.3 Supplier Device Package: 148-HVQFN (11x11) Modulation: 1024QAM RF Family/Standard: Bluetooth, WiFi Serial Interfaces: SDIO, PCle, UART Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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BZV55-C3V0,115 | NXP USA Inc. |
 Description: DIODE ZENER 3V 500MW LLDSPackaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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BAS70-05,235 | NXP USA Inc. |
Description: DIODE SCHOTTKY 70V 70MA TO236AB Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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MC9S12GC16CFUE | NXP USA Inc. |
Description: IC MCU 16BIT 16KB FLASH 80QFP Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HCS12 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 60 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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CLRD710,599 | NXP USA Inc. |
Description: CARD READER MIFARE Packaging: Box Frequency: 13.56MHz Interface: Ethernet, RS 232, RS 422, RS 485, USB Type: Read/Write Standards: ISO 14443 |
Produkt ist nicht verfügbar |
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| MFS2612AMDA0ADR2 | NXP USA Inc. |
Description: AUTO SBC Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3.2V ~ 40V Current - Supply: 30µA Supplier Device Package: 48-LQFP-EP (7x7) Grade: Automotive |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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MCIMX503CVM8B | NXP USA Inc. |
Description: IC MPU I.MX50 800MHZ 400LFBGA Packaging: Bulk Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: ARM® Cortex®-A8 Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V Supplier Device Package: 400-LFBGA (17x17) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, LPDDR2, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: LCD Security Features: Boot Security, Cryptography, Secure JTAG Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART |
auf Bestellung 57 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33FS6507KAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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| BT139B-600E,118 | NXP USA Inc. |
Description: TRIAC SENS GATE 600V 16A D2PAK Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| PCA9422BUKZ | NXP USA Inc. |
Description: IC Packaging: Tape & Reel (TR) Package / Case: 49-UFBGA, WLCSP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.5V ~ 5.5V Applications: Microcontroller, MCU Supplier Device Package: 49-WLCSP (3x2.9) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| PCA9422BUKZ | NXP USA Inc. |
Description: IC Packaging: Cut Tape (CT) Package / Case: 49-UFBGA, WLCSP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.5V ~ 5.5V Applications: Microcontroller, MCU Supplier Device Package: 49-WLCSP (3x2.9) |
auf Bestellung 1450 Stücke: Lieferzeit 10-14 Tag (e) |
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| BLF246B,112 | NXP USA Inc. |
Description: TRANSISTOR RF DMOS SOT161A Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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MC33FS8430G0KS | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN5 Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: System Basis Chip Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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S32G274AABK1VUCR | NXP USA Inc. |
Description: S32G274A ARM CORTEX-M7 AND -A53, Packaging: Tape & Reel (TR) Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 400MHz, 1GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) Ethernet: 1/2.5Gbps (4) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 3 Core, 64-Bit/4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Graphics Acceleration: No Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| BZV55-C6V2,115 | NXP USA Inc. |
Description: DIODE ZENER 6.2V 500MW LLDS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| BZV55-C6V2,135 | NXP USA Inc. |
Description: DIODE ZENER 6.2V 500MW LLDS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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PMCM650VNEZ | NXP USA Inc. |
Description: MOSFET N-CH 12V 6.4A 6WLCSP Packaging: Bulk Package / Case: 6-XFBGA, WLCSP Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 6.4A (Ta) Rds On (Max) @ Id, Vgs: 25mOhm @ 3A, 4.5V Power Dissipation (Max): 556mW (Ta), 12.5W (Tc) Vgs(th) (Max) @ Id: 900mV @ 250µA Supplier Device Package: 6-WLCSP (1.48x0.98) Drive Voltage (Max Rds On, Min Rds On): 4.5V Vgs (Max): ±8V Drain to Source Voltage (Vdss): 12 V Gate Charge (Qg) (Max) @ Vgs: 15.4 nC @ 4.5 V Input Capacitance (Ciss) (Max) @ Vds: 1060 pF @ 6 V |
auf Bestellung 461124 Stücke: Lieferzeit 10-14 Tag (e) |
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| BYV44-500,127 | NXP USA Inc. |
Description: DIODE RECT 500V 30A TO220AB Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| MIMX8QX5CVLDZAC | NXP USA Inc. |
Description: I.MX 8QUADXPLUS 21X21 Packaging: Tray Package / Case: 609-BFBGA Mounting Type: Surface Mount Supplier Device Package: 609-FBGA (21x21) |
Produkt ist nicht verfügbar |
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MIMX8QX5CVLFZAC | NXP USA Inc. |
Description: MIMX8QX5CVLFZAC Packaging: Tray Package / Case: 609-BFBGA Mounting Type: Surface Mount Supplier Device Package: 609-FBGA (21x21) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| BT137-800,127 | NXP USA Inc. |
Description: TRIAC 800V 8A TO220AB Packaging: Tube |
Produkt ist nicht verfügbar |
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74AHC14D,118 | NXP USA Inc. |
Description: IC HEX INV SCHMITT TRIG 14-SOIC Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74HC112N,652 | NXP USA Inc. |
Description: IC FF JK TYPE DOUBLE 1BIT 16DIP Packaging: Tube Package / Case: 16-DIP (0.300", 7.62mm) Output Type: Complementary Mounting Type: Through Hole Number of Elements: 2 Function: Set(Preset) and Reset Type: JK Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Current - Quiescent (Iq): 4 µA Current - Output High, Low: 5.2mA, 5.2mA Trigger Type: Negative Edge Clock Frequency: 71 MHz Input Capacitance: 3.5 pF Supplier Device Package: 16-DIP Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF Number of Bits per Element: 1 |
Produkt ist nicht verfügbar |
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BAT54CV,115 | NXP USA Inc. |
Description: DIODE SCHOTTKY 30V 200MA SOT666 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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BAT54CW,115 | NXP USA Inc. |
Description: DIODE SCHOTTKY 30V 200MA SOT323 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| PBHV8550Z,115 | NXP USA Inc. |
Description: TRANS NPN 500V 0.4A SC-73 Packaging: Tape & Reel (TR) Package / Case: TO-261-4, TO-261AA Mounting Type: Surface Mount Transistor Type: NPN Supplier Device Package: SC-73 Current - Collector (Ic) (Max): 400 mA Voltage - Collector Emitter Breakdown (Max): 500 V Power - Max: 1.7 W |
Produkt ist nicht verfügbar |
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PDZ7.5B,115 | NXP USA Inc. |
Description: DIODE ZENER 7.5V 400MW SOD323 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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PUMX1,115 | NXP USA Inc. |
Description: TRANS 2NPN 40V 0.1A 6TSSOP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SFS2623HMDF5AD | NXP USA Inc. |
Description: AUTO SBC Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3.2V ~ 36V Applications: System Basis Chip Current - Supply: 30µA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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74LVCH32374AEC,557 | NXP USA Inc. |
Description: IC FF D-TYPE QDR 8BIT 96LFBGA Packaging: Tray Package / Case: 96-LFBGA Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Number of Elements: 4 Function: Standard Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.65V ~ 3.6V Current - Quiescent (Iq): 40 µA Current - Output High, Low: 24mA, 24mA Trigger Type: Positive Edge Clock Frequency: 300 MHz Input Capacitance: 5 pF Supplier Device Package: 96-LFBGA (13.5x5.5) Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF Number of Bits per Element: 8 |
Produkt ist nicht verfügbar |
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74LVCH32374AEC,551 | NXP USA Inc. |
Description: IC FF D-TYPE QDR 8BIT 96LFBGA Packaging: Tray Package / Case: 96-LFBGA Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Number of Elements: 4 Function: Standard Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.65V ~ 3.6V Current - Quiescent (Iq): 40 µA Current - Output High, Low: 24mA, 24mA Trigger Type: Positive Edge Clock Frequency: 300 MHz Input Capacitance: 5 pF Supplier Device Package: 96-LFBGA (13.5x5.5) Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF Number of Bits per Element: 8 |
Produkt ist nicht verfügbar |
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P1014NSN5HFA | NXP USA Inc. |
Description: IC MPU QORIQ P1 800MHZ 425TEPBGA Packaging: Tray Package / Case: 425-FBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 425-TEPBGA I (19x19) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR3, DDR3L Graphics Acceleration: No SATA: SATA 3Gbps (2) Additional Interfaces: DUART, I2C, MMC/SD, SPI |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SPC5746BSK1AMMH6 | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA Packaging: Tray Package / Case: 100-LFBGA Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 3MB (3M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4 Data Converters: A/D 36x10b, 16x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, I2S, POR, WDT Supplier Device Package: 100-MAPBGA (11x11) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| SPF5020CVNAQESR2 | NXP USA Inc. |
Description: PMIC 3 HIGH PERFORMANCE BUCKS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| SPF5020CVNAQES | NXP USA Inc. |
Description: PMIC 3 HIGH PERFORMANCE BUCKS Packaging: Tray |
Produkt ist nicht verfügbar |
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| SPF5020CMBAKESR2 | NXP USA Inc. |
Description: PMIC -4 HIGH PERFORMANCE BUCKS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| SPF5020CMBAZESR2 | NXP USA Inc. |
Description: PMIC -3 HIGH PERFORMANCE BUCKS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| SPF5020AMBADESR2 | NXP USA Inc. |
Description: PMIC -3 HIGH PERFORMANCE BUCKS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| SPF5020CMBAKES | NXP USA Inc. |
Description: PMIC - 4 HIGH PERFORMANCE BUCKS Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| SPF5020AMBADES | NXP USA Inc. |
Description: PMIC - 3 HIGH PERFORMANCE BUCKS Packaging: Tray |
Produkt ist nicht verfügbar |
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| SPF5020CMBAZES | NXP USA Inc. |
Description: PMIC - 3 HIGH PERFORMANCE BUCKS Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| SPF5020AMBACES | NXP USA Inc. |
Description: PMIC - 3 HIGH PERFORMANCE BUCKS Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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SPF5024AMMAMESR2 | NXP USA Inc. |
Description: PMIC -4 HIGH PERFORMANCE BUCKS Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Applications: Automotive Systems Supplier Device Package: 40-HVQFN (6x6) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| SPF5024AMMAWESR2 | NXP USA Inc. |
Description: PMIC -4 HIGH PERFORMANCE BUCKS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| SPF5024AMMAWES | NXP USA Inc. |
Description: PMIC - 4 HIGH PERFORMANCE BUCKS Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| SPF5024AMMAMES | NXP USA Inc. |
Description: PMIC - 4 HIGH PERFORMANCE BUCKS Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| SPF5024CMBAYESR2 | NXP USA Inc. |
Description: PMIC -4 HIGH PERFORMANCE BUCKS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| SPF5024CMBAYES | NXP USA Inc. |
Description: PMIC - 4 HIGH PERFORMANCE BUCKS Packaging: Tray |
Produkt ist nicht verfügbar |
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BZV55-C4V7,135 | NXP USA Inc. |
Description: DIODE ZENER 4.7V 500MW LLDS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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BZV55-C4V7,115 | NXP USA Inc. |
Description: DIODE ZENER 4.7V 500MW LLDS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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PCA9849PWJ | NXP USA Inc. |
Description: IC MULTIPLEXER 2 X 4:1 16-TSSOP Packaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Circuit: 2 x 4:1 Type: Multiplexer Operating Temperature: -40°C ~ 85°C Voltage - Supply: 0.8V ~ 3.6V, 1.65V ~ 3.6V Independent Circuits: 1 Voltage Supply Source: Dual Supply Supplier Device Package: 16-TSSOP |
Produkt ist nicht verfügbar |
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| BCV62B,215 | NXP USA Inc. |
Description: TRANS PNP 30V 100MA DUAL SOT143B Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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PCA9554PW/DG,118 | NXP USA Inc. |
Description: IC XPND 400KHZ I2C SMBUS 16TSSOP Packaging: Tape & Reel (TR) Features: POR Package / Case: 16-TSSOP (0.173", 4.40mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Interface: I2C, SMBus Number of I/O: 8 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 16-TSSOP Current - Output Source/Sink: 10mA, 25mA DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PCA9554PW/DG,118 | NXP USA Inc. |
Description: IC XPND 400KHZ I2C SMBUS 16TSSOP Packaging: Cut Tape (CT) Features: POR Package / Case: 16-TSSOP (0.173", 4.40mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Interface: I2C, SMBus Number of I/O: 8 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 16-TSSOP Current - Output Source/Sink: 10mA, 25mA DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| MPC8535BVJANGA |
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auf Bestellung 720 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 272.85 EUR |
| 88Q9098-A2-NYKA/MP |
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Hersteller: NXP USA Inc.
Description: 88Q9098-A2-NYKA/A
Packaging: Tape & Reel (TR)
Package / Case: 148-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 3.3V
Protocol: 802.11ac/ax, Bluetooth v5.3
Supplier Device Package: 148-HVQFN (11x11)
Modulation: 1024QAM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: SDIO, PCle, UART
Grade: Automotive
Qualification: AEC-Q100
Description: 88Q9098-A2-NYKA/A
Packaging: Tape & Reel (TR)
Package / Case: 148-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 3.3V
Protocol: 802.11ac/ax, Bluetooth v5.3
Supplier Device Package: 148-HVQFN (11x11)
Modulation: 1024QAM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: SDIO, PCle, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
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| 88Q9098-A2-NYKA/AK |
|
Hersteller: NXP USA Inc.
Description: 88Q9098-A2-NYKA/A
Packaging: Tray
Package / Case: 148-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 3.3V
Protocol: 802.11ac/ax, Bluetooth v5.3
Supplier Device Package: 148-HVQFN (11x11)
Modulation: 1024QAM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: SDIO, PCle, UART
Grade: Automotive
Qualification: AEC-Q100
Description: 88Q9098-A2-NYKA/A
Packaging: Tray
Package / Case: 148-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 3.3V
Protocol: 802.11ac/ax, Bluetooth v5.3
Supplier Device Package: 148-HVQFN (11x11)
Modulation: 1024QAM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: SDIO, PCle, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MC9S12GC16CFUE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 60
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 16KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 60
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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| CLRD710,599 |
|
Hersteller: NXP USA Inc.
Description: CARD READER MIFARE
Packaging: Box
Frequency: 13.56MHz
Interface: Ethernet, RS 232, RS 422, RS 485, USB
Type: Read/Write
Standards: ISO 14443
Description: CARD READER MIFARE
Packaging: Box
Frequency: 13.56MHz
Interface: Ethernet, RS 232, RS 422, RS 485, USB
Type: Read/Write
Standards: ISO 14443
Produkt ist nicht verfügbar
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| MFS2612AMDA0ADR2 |
Hersteller: NXP USA Inc.
Description: AUTO SBC
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Description: AUTO SBC
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MCIMX503CVM8B |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX50 800MHZ 400LFBGA
Packaging: Bulk
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, LPDDR2, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: LCD
Security Features: Boot Security, Cryptography, Secure JTAG
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Description: IC MPU I.MX50 800MHZ 400LFBGA
Packaging: Bulk
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, LPDDR2, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: LCD
Security Features: Boot Security, Cryptography, Secure JTAG
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
auf Bestellung 57 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 14+ | 33.34 EUR |
| MC33FS6507KAE |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
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| PCA9422BUKZ |
|
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 5.5V
Applications: Microcontroller, MCU
Supplier Device Package: 49-WLCSP (3x2.9)
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 5.5V
Applications: Microcontroller, MCU
Supplier Device Package: 49-WLCSP (3x2.9)
Produkt ist nicht verfügbar
Im Einkaufswagen
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| PCA9422BUKZ |
|
Hersteller: NXP USA Inc.
Description: IC
Packaging: Cut Tape (CT)
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 5.5V
Applications: Microcontroller, MCU
Supplier Device Package: 49-WLCSP (3x2.9)
Description: IC
Packaging: Cut Tape (CT)
Package / Case: 49-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 5.5V
Applications: Microcontroller, MCU
Supplier Device Package: 49-WLCSP (3x2.9)
auf Bestellung 1450 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 8.41 EUR |
| 10+ | 6.43 EUR |
| 25+ | 5.93 EUR |
| 100+ | 5.38 EUR |
| 250+ | 5.12 EUR |
| 500+ | 5.06 EUR |
| MC33FS8430G0KS |
|
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
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| S32G274AABK1VUCR |
|
Hersteller: NXP USA Inc.
Description: S32G274A ARM CORTEX-M7 AND -A53,
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 1/2.5Gbps (4)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 3 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Description: S32G274A ARM CORTEX-M7 AND -A53,
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 1/2.5Gbps (4)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 3 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
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| PMCM650VNEZ |
|
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 12V 6.4A 6WLCSP
Packaging: Bulk
Package / Case: 6-XFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6.4A (Ta)
Rds On (Max) @ Id, Vgs: 25mOhm @ 3A, 4.5V
Power Dissipation (Max): 556mW (Ta), 12.5W (Tc)
Vgs(th) (Max) @ Id: 900mV @ 250µA
Supplier Device Package: 6-WLCSP (1.48x0.98)
Drive Voltage (Max Rds On, Min Rds On): 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 12 V
Gate Charge (Qg) (Max) @ Vgs: 15.4 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 1060 pF @ 6 V
Description: MOSFET N-CH 12V 6.4A 6WLCSP
Packaging: Bulk
Package / Case: 6-XFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6.4A (Ta)
Rds On (Max) @ Id, Vgs: 25mOhm @ 3A, 4.5V
Power Dissipation (Max): 556mW (Ta), 12.5W (Tc)
Vgs(th) (Max) @ Id: 900mV @ 250µA
Supplier Device Package: 6-WLCSP (1.48x0.98)
Drive Voltage (Max Rds On, Min Rds On): 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 12 V
Gate Charge (Qg) (Max) @ Vgs: 15.4 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 1060 pF @ 6 V
auf Bestellung 461124 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 124+ | 3.67 EUR |
| MIMX8QX5CVLDZAC |
Hersteller: NXP USA Inc.
Description: I.MX 8QUADXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 609-FBGA (21x21)
Description: I.MX 8QUADXPLUS 21X21
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 609-FBGA (21x21)
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MIMX8QX5CVLFZAC |
|
Hersteller: NXP USA Inc.
Description: MIMX8QX5CVLFZAC
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 609-FBGA (21x21)
Description: MIMX8QX5CVLFZAC
Packaging: Tray
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 609-FBGA (21x21)
Produkt ist nicht verfügbar
Im Einkaufswagen
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| 74HC112N,652 |
|
Hersteller: NXP USA Inc.
Description: IC FF JK TYPE DOUBLE 1BIT 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Complementary
Mounting Type: Through Hole
Number of Elements: 2
Function: Set(Preset) and Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 71 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-DIP
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 1
Description: IC FF JK TYPE DOUBLE 1BIT 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Complementary
Mounting Type: Through Hole
Number of Elements: 2
Function: Set(Preset) and Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 71 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-DIP
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 1
Produkt ist nicht verfügbar
Im Einkaufswagen
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| PBHV8550Z,115 |
Hersteller: NXP USA Inc.
Description: TRANS NPN 500V 0.4A SC-73
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Transistor Type: NPN
Supplier Device Package: SC-73
Current - Collector (Ic) (Max): 400 mA
Voltage - Collector Emitter Breakdown (Max): 500 V
Power - Max: 1.7 W
Description: TRANS NPN 500V 0.4A SC-73
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Transistor Type: NPN
Supplier Device Package: SC-73
Current - Collector (Ic) (Max): 400 mA
Voltage - Collector Emitter Breakdown (Max): 500 V
Power - Max: 1.7 W
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SFS2623HMDF5AD |
|
Hersteller: NXP USA Inc.
Description: AUTO SBC
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: AUTO SBC
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen
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| 74LVCH32374AEC,557 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE QDR 8BIT 96LFBGA
Packaging: Tray
Package / Case: 96-LFBGA
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 4
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 40 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 5 pF
Supplier Device Package: 96-LFBGA (13.5x5.5)
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF
Number of Bits per Element: 8
Description: IC FF D-TYPE QDR 8BIT 96LFBGA
Packaging: Tray
Package / Case: 96-LFBGA
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 4
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 40 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 5 pF
Supplier Device Package: 96-LFBGA (13.5x5.5)
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF
Number of Bits per Element: 8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74LVCH32374AEC,551 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE QDR 8BIT 96LFBGA
Packaging: Tray
Package / Case: 96-LFBGA
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 4
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 40 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 5 pF
Supplier Device Package: 96-LFBGA (13.5x5.5)
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF
Number of Bits per Element: 8
Description: IC FF D-TYPE QDR 8BIT 96LFBGA
Packaging: Tray
Package / Case: 96-LFBGA
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 4
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 40 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 5 pF
Supplier Device Package: 96-LFBGA (13.5x5.5)
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF
Number of Bits per Element: 8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| P1014NSN5HFA |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 800MHZ 425TEPBGA
Packaging: Tray
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Description: IC MPU QORIQ P1 800MHZ 425TEPBGA
Packaging: Tray
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
Im Einkaufswagen
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| SPC5746BSK1AMMH6 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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| SPF5024AMMAMESR2 |
|
Hersteller: NXP USA Inc.
Description: PMIC -4 HIGH PERFORMANCE BUCKS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Applications: Automotive Systems
Supplier Device Package: 40-HVQFN (6x6)
Description: PMIC -4 HIGH PERFORMANCE BUCKS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Applications: Automotive Systems
Supplier Device Package: 40-HVQFN (6x6)
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| PCA9849PWJ |
|
Hersteller: NXP USA Inc.
Description: IC MULTIPLEXER 2 X 4:1 16-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.8V ~ 3.6V, 1.65V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Dual Supply
Supplier Device Package: 16-TSSOP
Description: IC MULTIPLEXER 2 X 4:1 16-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.8V ~ 3.6V, 1.65V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Dual Supply
Supplier Device Package: 16-TSSOP
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| PCA9554PW/DG,118 |
|
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
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| PCA9554PW/DG,118 |
|
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH