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MCHRC705KJ1CPE MCHRC705KJ1CPE NXP USA Inc. MC68HC705KJ1.pdf Description: IC MCU 8BIT 1.2KB OTP 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 16-PDIP
Number of I/O: 10
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MRF6S9045NBR1 MRF6S9045NBR1 NXP USA Inc. MRF6S9045N.pdf Description: RF MOSFET LDMOS 28V TO272-2
Packaging: Tape & Reel (TR)
Package / Case: TO-272BC
Mounting Type: Chassis Mount
Frequency: 880MHz
Power - Output: 10W
Gain: 22.7dB
Technology: LDMOS
Supplier Device Package: TO-272-2
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 350 mA
Produkt ist nicht verfügbar
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BAS40-05W,115 BAS40-05W,115 NXP USA Inc. BAS40-05W.pdf Description: DIODE SCHOTTKY 40V 120MA SOT323
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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HEF4073BT,652 HEF4073BT,652 NXP USA Inc. HEF4073B.pdf Description: IC GATE AND 3CH 3-INP 14-SO
Packaging: Tube
Produkt ist nicht verfügbar
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74HC14DB,112 74HC14DB,112 NXP USA Inc. 74HC_HCT14.pdf Description: IC HEX INVERT SCHM TRIG 14SSOP
Packaging: Tube
Features: Schmitt Trigger
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 1
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.3V ~ 1.2V
Max Propagation Delay @ V, Max CL: 21ns @ 6V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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LS1046ASN8P1A LS1046ASN8P1A NXP USA Inc. LS1046A.pdf Description: IC MPU QORIQ 1.4GHZ 780FCPBGA
Packaging: Bulk
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
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LS1088AXN7PTA LS1088AXN7PTA NXP USA Inc. LS1088AFS.pdf Description: IC MPU QORIQ 1.4GHZ 780FBGA
Packaging: Bulk
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
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LS1012AXN7HKB LS1012AXN7HKB NXP USA Inc. LS1012AFS.pdf Description: IC MPU QORIQ 800MHZ 211FCLGA
Packaging: Bulk
Package / Case: 211-VFLGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 211-FCLGA (9.6x9.6)
Ethernet: GbE (2)
USB: USB 2.0 (1), USB 3.0 + PHY
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
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LS1043AXE7MQB LS1043AXE7MQB NXP USA Inc. LS1043AFS.pdf Description: IC MPU QORIQ 1.2GHZ 621FCPBGA
Packaging: Bulk
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
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BUJ100,412 NXP USA Inc. Description: TRANS NPN 400V 1A TO92
Packaging: Tube
Produkt ist nicht verfügbar
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BTA416Y-600B,127 NXP USA Inc. BTA416Y-600B.pdf Description: TRIAC 600V 16A TO220AB
Packaging: Tube
Produkt ist nicht verfügbar
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TEA1654T/N1,518 TEA1654T/N1,518 NXP USA Inc. TEA1654.pdf Description: IC GREENCHIP SMPS CNTRLR 14SOIC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74HC7266N,652 74HC7266N,652 NXP USA Inc. 74HC7266.pdf Description: IC GATE XNOR 4CH 2-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: XNOR (Exclusive NOR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 20ns @ 6V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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74HCT7541D,118 74HCT7541D,118 NXP USA Inc. 74HC_HCT7541.pdf Description: IC BUFFER NON-INVERT 5.5V 20-SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Input Type: Schmitt Trigger
Number of Bits per Element: 8
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SO
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74HCT7540D,112 74HCT7540D,112 NXP USA Inc. 74HC_HCT7540.pdf Description: IC BUFFER INVERTING 5.5V 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SO
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74HCT7541D,112 74HCT7541D,112 NXP USA Inc. 74HC_HCT7541.pdf Description: IC BUFFER NON-INVERT 5.5V 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Input Type: Schmitt Trigger
Number of Bits per Element: 8
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SO
Produkt ist nicht verfügbar
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74HC4066DB,112 74HC4066DB,112 NXP USA Inc. 74HC_HCT4066.pdf Description: IC SWITCH QUAD 1X1 14SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 95Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 14-SSOP
Voltage - Supply, Single (V+): 2V ~ 10V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPST - NO
Switch Time (Ton, Toff) (Max): 30ns, 20ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 1µA
Number of Circuits: 4
Produkt ist nicht verfügbar
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BZX84-A15,215 BZX84-A15,215 NXP USA Inc. BZX84_Series.pdf Description: DIODE ZENER 15V 250MW TO236AB
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74HC595D,118 74HC595D,118 NXP USA Inc. PHGL-S-A0000283114-1.pdf?t.download=true&u=5oefqw Description: IC SHFT REG TRI-STATE 8BIT 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel, Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SO
Number of Bits per Element: 8
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74AHCT125D,118 74AHCT125D,118 NXP USA Inc. 74AHC_AHCT125.pdf Description: IC BUFF DVR TRI-ST QD 14SOIC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74HC541D,653 74HC541D,653 NXP USA Inc. 74HC_HCT541.pdf Description: IC BUFFER NON-INVERTING 6V 20-SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 8
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SO
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74HC541DB,112 74HC541DB,112 NXP USA Inc. 74HC_HCT541.pdf Description: IC BUFFER NON-INVERT 6V 20-SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 8
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SSOP
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74HC240D,652 74HC240D,652 NXP USA Inc. 74HC_HCT240.pdf Description: IC BUFFER INVERTING 6V 20-SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 4
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SO
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74HC240D,653 74HC240D,653 NXP USA Inc. 74HC_HCT240.pdf Description: IC BUFFER INVERTING 6V 20-SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 4
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SO
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74HC240DB,112 74HC240DB,112 NXP USA Inc. 74HC_HCT240.pdf Description: IC BUFFER INVERTING 6V 20-SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 4
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SSOP
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74HC240DB,118 74HC240DB,118 NXP USA Inc. 74HC_HCT240.pdf Description: IC BUFFER INVERTING 6V 20-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 4
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SSOP
Produkt ist nicht verfügbar
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MC35FS6515CAE MC35FS6515CAE NXP USA Inc. FS6500-FS4500-ASILD.pdf Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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2+13.85 EUR
10+10.76 EUR
25+9.99 EUR
100+9.14 EUR
250+8.73 EUR
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BTA316-800B,127 NXP USA Inc. BTA316-800B.pdf Description: TRIAC 800V 16A TO220AB
Packaging: Tube
Produkt ist nicht verfügbar
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MCXC141VFM MCXC141VFM NXP USA Inc. MCXC24XP64M48SF2.pdf Description: 48MHZ, CORTEX-M0+ 32 KB QFN32
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 28
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10+2.65 EUR
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100+2.16 EUR
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TJA1042ATK/3/0Z NXP USA Inc. Description: IC TRANSCEIVER 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 120 mV
Grade: Automotive
Qualification: AEC-Q100
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TJA1042AT/3/0Z NXP USA Inc. Description: IC TRANSCEIVER 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 120 mV
Grade: Automotive
Qualification: AEC-Q100
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BZX79-C5V1,133 NXP USA Inc. BZX79.pdf Description: DIODE ZENER 5.1V 400MW ALF2
Packaging: Tape & Box (TB)
Produkt ist nicht verfügbar
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BZX84J-C3V9,115 BZX84J-C3V9,115 NXP USA Inc. BZX84J_SER.pdf Description: DIODE ZENER 3.9V 550MW SOD323F
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BT151U-650C,127 NXP USA Inc. BT151U-650C.pdf BT151U-650C-127.pdf Description: THYRISTOR 650V 12A SOT533
Packaging: Bulk
Produkt ist nicht verfügbar
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BT151U-500C,127 NXP USA Inc. Description: THYRISTOR 12A 500V SOT-533
Packaging: Tube
Produkt ist nicht verfügbar
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74HC253D,653 74HC253D,653 NXP USA Inc. 74HC_HCT253.pdf Description: IC MULTIPLEXER 2 X 4:1 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 7.8mA, 7.8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
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74HC253D,652 74HC253D,652 NXP USA Inc. 74HC_HCT253.pdf Description: IC MULTIPLEXER 2 X 4:1 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 7.8mA, 7.8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Produkt ist nicht verfügbar
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PIP213-12M,518 PIP213-12M,518 NXP USA Inc. PIP213-12M.pdf Description: IC HALF BRIDGE DRVR 25A 56HVQFN
Packaging: Tape & Reel (TR)
Features: Bootstrap Circuit, 5V Regulated Output
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: PWM
Operating Temperature: -55°C ~ 150°C (TJ)
Output Configuration: Half Bridge
Voltage - Supply: 3.3V ~ 16V
Rds On (Typ): 3.8mOhm LS, 6.5mOhm HS
Applications: Synchronous Buck Converters
Current - Output / Channel: 25A
Current - Peak Output: 40A
Technology: DrMOS
Voltage - Load: 24V (Max)
Supplier Device Package: 56-HVQFN (8x8)
Fault Protection: Over Temperature, UVLO
Load Type: Inductive
Produkt ist nicht verfügbar
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BUK7515-100A,127 NXP USA Inc. 2156_BUK7515-100A.pdf Description: MOSFET N-CH 100V 75A TO220AB
Packaging: Tube
Produkt ist nicht verfügbar
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BUK7513-75B,127 NXP USA Inc. BUK7513-75B-127.PDF Description: MOSFET N-CH 75V 75A TO220AB
Packaging: Tube
Produkt ist nicht verfügbar
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NX3L1G3157GW-Q100H NX3L1G3157GW-Q100H NXP USA Inc. NX3L1G3157_Q100.pdf Description: IC SWITCH SPDTX1 750MOHM 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-TSSOP
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 25ns, 10ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Grade: Automotive
Number of Circuits: 1
Qualification: AEC-Q100
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FS32K146HRT0MLLR FS32K146HRT0MLLR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC273PW,118 74LVC273PW,118 NXP USA Inc. 74LVC273.pdf Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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2N7002BKV,115 2N7002BKV,115 NXP USA Inc. 2N7002BKV.pdf Description: MOSFET 2N-CH 60V 0.34A SOT666
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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2N7002F,215 2N7002F,215 NXP USA Inc. 2N7002F_Rev03.pdf Description: MOSFET N-CH 60V 475MA SOT23
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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2N7002E,215 2N7002E,215 NXP USA Inc. 2N7002E_Rev_03.pdf Description: MOSFET N-CH 60V 385MA SOT23
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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2N7002CK,215 2N7002CK,215 NXP USA Inc. PHGLS19134-1.pdf?t.download=true&u=5oefqw Description: MOSFET N-CH 60V 0.3A SOT-23
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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2N7002AK,215 NXP USA Inc. Description: MOSFET N-CH SOT-23
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MIMX9352DVVXMAC NXP USA Inc. IMX93CEC.pdf Description: I.MX93 BGA11
Packaging: Tray
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
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10+26.5 EUR
25+24.83 EUR
176+22.44 EUR
352+21.86 EUR
528+21.57 EUR
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FRDM-IMX95 FRDM-IMX95 NXP USA Inc. IMX95FS.pdf Description: I.MX95 DEV KIT
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A55, Cortex®-M7, Cortex®-M33
Utilized IC / Part: i.MX 95
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MIMX9331CVVXMAC NXP USA Inc. IMX93IEC.pdf Description: I.MX93 BGA11
Packaging: Tray
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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FRDM-IMX91S FRDM-IMX91S NXP USA Inc. FRDM-IMX91-UG.pdf Description: FRDM-IMX91S
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A55
Utilized IC / Part: i.MX 91
Produkt ist nicht verfügbar
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MIMX9556CVTXNAC NXP USA Inc. IMX95FS.pdf Description: I.MX95 HMI SEGMENT IC
Packaging: Tray
Produkt ist nicht verfügbar
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MIMX9536CVZXNAC NXP USA Inc. IMX95FS.pdf Description: I.MX95 COMPUTE SEGMENT IC
Packaging: Tray
Produkt ist nicht verfügbar
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MIMX9556CVZXNAC NXP USA Inc. IMX95FS.pdf Description: I.MX95 HMI SEGMENT IC
Packaging: Tray
Produkt ist nicht verfügbar
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MC908GR60ACFJE MC908GR60ACFJE NXP USA Inc. MC68HC908GR60A.pdf Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 24x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 21
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MMA9559LR1 MMA9559LR1 NXP USA Inc. FSCL-S-A0000775362-1.pdf?t.download=true&u=5oefqw Description: MMA9559, INTELLIGENT MOTION-SENS
Packaging: Bulk
auf Bestellung 1105 Stücke:
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98+4.62 EUR
Mindestbestellmenge: 98
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MMA9555LR1 MMA9555LR1 NXP USA Inc. PHGL-S-A0002390083-1.pdf?t.download=true&u=5oefqw Description: MMA9555, INTELLIGENT MOTION-SENS
Packaging: Bulk
auf Bestellung 3634 Stücke:
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92+4.94 EUR
Mindestbestellmenge: 92
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MPC8533EVTANGA MPC8533EVTANGA NXP USA Inc. MPC8533EEC.pdf Description: IC MPU MPC85XX 800MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 90°C (TA)
Core Processor: PowerPC e500v2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HSSI, I2C, PCI
Produkt ist nicht verfügbar
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MPC8536EAVTANGA MPC8536EAVTANGA NXP USA Inc. MPC8536E.pdf Description: IC MPU MPC85XX 800MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 90°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
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MCHRC705KJ1CPE MC68HC705KJ1.pdf
MCHRC705KJ1CPE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.2KB OTP 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 16-PDIP
Number of I/O: 10
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MRF6S9045NBR1 MRF6S9045N.pdf
MRF6S9045NBR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO272-2
Packaging: Tape & Reel (TR)
Package / Case: TO-272BC
Mounting Type: Chassis Mount
Frequency: 880MHz
Power - Output: 10W
Gain: 22.7dB
Technology: LDMOS
Supplier Device Package: TO-272-2
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 350 mA
Produkt ist nicht verfügbar
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BAS40-05W,115 BAS40-05W.pdf
BAS40-05W,115
Hersteller: NXP USA Inc.
Description: DIODE SCHOTTKY 40V 120MA SOT323
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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HEF4073BT,652 HEF4073B.pdf
HEF4073BT,652
Hersteller: NXP USA Inc.
Description: IC GATE AND 3CH 3-INP 14-SO
Packaging: Tube
Produkt ist nicht verfügbar
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74HC14DB,112 74HC_HCT14.pdf
74HC14DB,112
Hersteller: NXP USA Inc.
Description: IC HEX INVERT SCHM TRIG 14SSOP
Packaging: Tube
Features: Schmitt Trigger
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 1
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.3V ~ 1.2V
Max Propagation Delay @ V, Max CL: 21ns @ 6V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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LS1046ASN8P1A LS1046A.pdf
LS1046ASN8P1A
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.4GHZ 780FCPBGA
Packaging: Bulk
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
auf Bestellung 3138 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+154.31 EUR
Mindestbestellmenge: 3
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LS1088AXN7PTA LS1088AFS.pdf
LS1088AXN7PTA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.4GHZ 780FBGA
Packaging: Bulk
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
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Anzahl Preis
1+357.54 EUR
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LS1012AXN7HKB LS1012AFS.pdf
LS1012AXN7HKB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 211FCLGA
Packaging: Bulk
Package / Case: 211-VFLGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 211-FCLGA (9.6x9.6)
Ethernet: GbE (2)
USB: USB 2.0 (1), USB 3.0 + PHY
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
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Anzahl Preis
10+45.61 EUR
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LS1043AXE7MQB LS1043AFS.pdf
LS1043AXE7MQB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.2GHZ 621FCPBGA
Packaging: Bulk
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
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Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+125.61 EUR
Mindestbestellmenge: 4
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BUJ100,412
Hersteller: NXP USA Inc.
Description: TRANS NPN 400V 1A TO92
Packaging: Tube
Produkt ist nicht verfügbar
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BTA416Y-600B,127 BTA416Y-600B.pdf
Hersteller: NXP USA Inc.
Description: TRIAC 600V 16A TO220AB
Packaging: Tube
Produkt ist nicht verfügbar
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TEA1654T/N1,518 TEA1654.pdf
TEA1654T/N1,518
Hersteller: NXP USA Inc.
Description: IC GREENCHIP SMPS CNTRLR 14SOIC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74HC7266N,652 74HC7266.pdf
74HC7266N,652
Hersteller: NXP USA Inc.
Description: IC GATE XNOR 4CH 2-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: XNOR (Exclusive NOR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 20ns @ 6V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
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74HCT7541D,118 74HC_HCT7541.pdf
74HCT7541D,118
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 20-SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Input Type: Schmitt Trigger
Number of Bits per Element: 8
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SO
Produkt ist nicht verfügbar
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74HCT7540D,112 74HC_HCT7540.pdf
74HCT7540D,112
Hersteller: NXP USA Inc.
Description: IC BUFFER INVERTING 5.5V 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SO
Produkt ist nicht verfügbar
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74HCT7541D,112 74HC_HCT7541.pdf
74HCT7541D,112
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Input Type: Schmitt Trigger
Number of Bits per Element: 8
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SO
Produkt ist nicht verfügbar
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74HC4066DB,112 74HC_HCT4066.pdf
74HC4066DB,112
Hersteller: NXP USA Inc.
Description: IC SWITCH QUAD 1X1 14SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 95Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 14-SSOP
Voltage - Supply, Single (V+): 2V ~ 10V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPST - NO
Switch Time (Ton, Toff) (Max): 30ns, 20ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 1µA
Number of Circuits: 4
Produkt ist nicht verfügbar
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BZX84-A15,215 BZX84_Series.pdf
BZX84-A15,215
Hersteller: NXP USA Inc.
Description: DIODE ZENER 15V 250MW TO236AB
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74HC595D,118 PHGL-S-A0000283114-1.pdf?t.download=true&u=5oefqw
74HC595D,118
Hersteller: NXP USA Inc.
Description: IC SHFT REG TRI-STATE 8BIT 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel, Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SO
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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74AHCT125D,118 74AHC_AHCT125.pdf
74AHCT125D,118
Hersteller: NXP USA Inc.
Description: IC BUFF DVR TRI-ST QD 14SOIC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74HC541D,653 74HC_HCT541.pdf
74HC541D,653
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERTING 6V 20-SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 8
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SO
Produkt ist nicht verfügbar
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74HC541DB,112 74HC_HCT541.pdf
74HC541DB,112
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 6V 20-SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 8
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SSOP
Produkt ist nicht verfügbar
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74HC240D,652 74HC_HCT240.pdf
74HC240D,652
Hersteller: NXP USA Inc.
Description: IC BUFFER INVERTING 6V 20-SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 4
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SO
Produkt ist nicht verfügbar
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74HC240D,653 74HC_HCT240.pdf
74HC240D,653
Hersteller: NXP USA Inc.
Description: IC BUFFER INVERTING 6V 20-SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 4
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SO
Produkt ist nicht verfügbar
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74HC240DB,112 74HC_HCT240.pdf
74HC240DB,112
Hersteller: NXP USA Inc.
Description: IC BUFFER INVERTING 6V 20-SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 4
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SSOP
Produkt ist nicht verfügbar
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74HC240DB,118 74HC_HCT240.pdf
74HC240DB,118
Hersteller: NXP USA Inc.
Description: IC BUFFER INVERTING 6V 20-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 4
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SSOP
Produkt ist nicht verfügbar
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MC35FS6515CAE FS6500-FS4500-ASILD.pdf
MC35FS6515CAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+13.85 EUR
10+10.76 EUR
25+9.99 EUR
100+9.14 EUR
250+8.73 EUR
Mindestbestellmenge: 2
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BTA316-800B,127 BTA316-800B.pdf
Hersteller: NXP USA Inc.
Description: TRIAC 800V 16A TO220AB
Packaging: Tube
Produkt ist nicht verfügbar
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MCXC141VFM MCXC24XP64M48SF2.pdf
MCXC141VFM
Hersteller: NXP USA Inc.
Description: 48MHZ, CORTEX-M0+ 32 KB QFN32
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 28
auf Bestellung 440 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+3.57 EUR
10+2.65 EUR
25+2.41 EUR
100+2.16 EUR
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TJA1042ATK/3/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 120 mV
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TJA1042AT/3/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 120 mV
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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BZX79-C5V1,133 BZX79.pdf
Hersteller: NXP USA Inc.
Description: DIODE ZENER 5.1V 400MW ALF2
Packaging: Tape & Box (TB)
Produkt ist nicht verfügbar
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BZX84J-C3V9,115 BZX84J_SER.pdf
BZX84J-C3V9,115
Hersteller: NXP USA Inc.
Description: DIODE ZENER 3.9V 550MW SOD323F
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BT151U-650C,127 BT151U-650C.pdf BT151U-650C-127.pdf
Hersteller: NXP USA Inc.
Description: THYRISTOR 650V 12A SOT533
Packaging: Bulk
Produkt ist nicht verfügbar
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BT151U-500C,127
Hersteller: NXP USA Inc.
Description: THYRISTOR 12A 500V SOT-533
Packaging: Tube
Produkt ist nicht verfügbar
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74HC253D,653 74HC_HCT253.pdf
74HC253D,653
Hersteller: NXP USA Inc.
Description: IC MULTIPLEXER 2 X 4:1 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 7.8mA, 7.8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Produkt ist nicht verfügbar
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74HC253D,652 74HC_HCT253.pdf
74HC253D,652
Hersteller: NXP USA Inc.
Description: IC MULTIPLEXER 2 X 4:1 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 7.8mA, 7.8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Produkt ist nicht verfügbar
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PIP213-12M,518 PIP213-12M.pdf
PIP213-12M,518
Hersteller: NXP USA Inc.
Description: IC HALF BRIDGE DRVR 25A 56HVQFN
Packaging: Tape & Reel (TR)
Features: Bootstrap Circuit, 5V Regulated Output
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: PWM
Operating Temperature: -55°C ~ 150°C (TJ)
Output Configuration: Half Bridge
Voltage - Supply: 3.3V ~ 16V
Rds On (Typ): 3.8mOhm LS, 6.5mOhm HS
Applications: Synchronous Buck Converters
Current - Output / Channel: 25A
Current - Peak Output: 40A
Technology: DrMOS
Voltage - Load: 24V (Max)
Supplier Device Package: 56-HVQFN (8x8)
Fault Protection: Over Temperature, UVLO
Load Type: Inductive
Produkt ist nicht verfügbar
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BUK7515-100A,127 2156_BUK7515-100A.pdf
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 100V 75A TO220AB
Packaging: Tube
Produkt ist nicht verfügbar
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BUK7513-75B,127 BUK7513-75B-127.PDF
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 75V 75A TO220AB
Packaging: Tube
Produkt ist nicht verfügbar
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NX3L1G3157GW-Q100H NX3L1G3157_Q100.pdf
NX3L1G3157GW-Q100H
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDTX1 750MOHM 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-TSSOP
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 25ns, 10ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Grade: Automotive
Number of Circuits: 1
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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FS32K146HRT0MLLR S32K1xx.pdf
FS32K146HRT0MLLR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC273PW,118 74LVC273.pdf
74LVC273PW,118
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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2N7002BKV,115 2N7002BKV.pdf
2N7002BKV,115
Hersteller: NXP USA Inc.
Description: MOSFET 2N-CH 60V 0.34A SOT666
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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2N7002F,215 2N7002F_Rev03.pdf
2N7002F,215
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 60V 475MA SOT23
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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2N7002E,215 2N7002E_Rev_03.pdf
2N7002E,215
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 60V 385MA SOT23
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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2N7002CK,215 PHGLS19134-1.pdf?t.download=true&u=5oefqw
2N7002CK,215
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 60V 0.3A SOT-23
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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2N7002AK,215
Hersteller: NXP USA Inc.
Description: MOSFET N-CH SOT-23
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MIMX9352DVVXMAC IMX93CEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX93 BGA11
Packaging: Tray
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
auf Bestellung 821 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+33.16 EUR
10+26.5 EUR
25+24.83 EUR
176+22.44 EUR
352+21.86 EUR
528+21.57 EUR
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FRDM-IMX95 IMX95FS.pdf
FRDM-IMX95
Hersteller: NXP USA Inc.
Description: I.MX95 DEV KIT
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A55, Cortex®-M7, Cortex®-M33
Utilized IC / Part: i.MX 95
Produkt ist nicht verfügbar
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MIMX9331CVVXMAC IMX93IEC.pdf
Hersteller: NXP USA Inc.
Description: I.MX93 BGA11
Packaging: Tray
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Produkt ist nicht verfügbar
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FRDM-IMX91S FRDM-IMX91-UG.pdf
FRDM-IMX91S
Hersteller: NXP USA Inc.
Description: FRDM-IMX91S
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A55
Utilized IC / Part: i.MX 91
Produkt ist nicht verfügbar
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MIMX9556CVTXNAC IMX95FS.pdf
Hersteller: NXP USA Inc.
Description: I.MX95 HMI SEGMENT IC
Packaging: Tray
Produkt ist nicht verfügbar
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MIMX9536CVZXNAC IMX95FS.pdf
Hersteller: NXP USA Inc.
Description: I.MX95 COMPUTE SEGMENT IC
Packaging: Tray
Produkt ist nicht verfügbar
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MIMX9556CVZXNAC IMX95FS.pdf
Hersteller: NXP USA Inc.
Description: I.MX95 HMI SEGMENT IC
Packaging: Tray
Produkt ist nicht verfügbar
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MC908GR60ACFJE MC68HC908GR60A.pdf
MC908GR60ACFJE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 24x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 21
DigiKey Programmable: Not Verified
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MMA9559LR1 FSCL-S-A0000775362-1.pdf?t.download=true&u=5oefqw
MMA9559LR1
Hersteller: NXP USA Inc.
Description: MMA9559, INTELLIGENT MOTION-SENS
Packaging: Bulk
auf Bestellung 1105 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
98+4.62 EUR
Mindestbestellmenge: 98
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MMA9555LR1 PHGL-S-A0002390083-1.pdf?t.download=true&u=5oefqw
MMA9555LR1
Hersteller: NXP USA Inc.
Description: MMA9555, INTELLIGENT MOTION-SENS
Packaging: Bulk
auf Bestellung 3634 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
92+4.94 EUR
Mindestbestellmenge: 92
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MPC8533EVTANGA MPC8533EEC.pdf
MPC8533EVTANGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 800MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 90°C (TA)
Core Processor: PowerPC e500v2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HSSI, I2C, PCI
Produkt ist nicht verfügbar
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MPC8536EAVTANGA MPC8536E.pdf
MPC8536EAVTANGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 800MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 90°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
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