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FS32R372SCK0MMVT NXP USA Inc. Description: IC MCU 32B 1.3MB FLASH 141MAPBGA
Packaging: Tray
Package / Case: 141-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 1.3MB (1.3M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: e200z7260
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 141-MAPBGA (10x10)
DigiKey Programmable: Not Verified
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BZX84-A8V2/DG/B3215 BZX84-A8V2/DG/B3215 NXP USA Inc. PHGL-S-A0000014340-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER
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BZX84-A4V7/DG/B3215 BZX84-A4V7/DG/B3215 NXP USA Inc. PHGL-S-A0000014340-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER
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TDA8541T/N1112 TDA8541T/N1112 NXP USA Inc. Description: AUDIO AMPLIFIER 1.2W
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 18V
Max Output Power x Channels @ Load: 1.2W x 1 @ 8Ohm
Supplier Device Package: 8-SOIC
Part Status: Active
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PEMZ7315 NXP USA Inc. PEMZ7.pdf Description: NPN/PNP TRANSISTOR TRANSISTOR
Packaging: Bulk
Produkt ist nicht verfügbar
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PCA9519PW,118 PCA9519PW,118 NXP USA Inc. PCA9519.pdf Description: IC REDRIVER I2C 4CH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Number of Channels: 4
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Applications: I²C
Current - Supply: 11.6mA
Data Rate (Max): 400kHz
Supplier Device Package: 20-TSSOP
Part Status: Active
Capacitance - Input: 6 pF
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BZX585-C5V1115 NXP USA Inc. Description: DIODE ZENER 56V 0.3W 5% UNIDIR
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.1 V
Impedance (Max) (Zzt): 60 Ohms
Supplier Device Package: SOD-523
Part Status: Active
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 2 µA @ 2 V
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S9S08RNA32W1VLCR S9S08RNA32W1VLCR NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
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74LVC2G08DC-Q100125 74LVC2G08DC-Q100125 NXP USA Inc. 74LVC2G08_Q100.pdf Description: AND GATE, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
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74AHC2G08DC-Q100125 74AHC2G08DC-Q100125 NXP USA Inc. 74AHC_AHCT2G08_Q100.pdf Description: IC GATE AND
Packaging: Bulk
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Supplier Device Package: 8-VSSOP
Input Logic Level - High: 1.5V ~ 3.85V
Input Logic Level - Low: 0.5V ~ 1.65V
Max Propagation Delay @ V, Max CL: 7.9ns @ 5V, 50pF
Grade: Automotive
Number of Circuits: 2
Current - Quiescent (Max): 1 µA
Qualification: AEC-Q100
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74AUP1G74DC-Q100125 74AUP1G74DC-Q100125 NXP USA Inc. 74AUP1G74_Q100.pdf Description: IC FF D-TYPE SNGL 1BIT 8VSSOP
Packaging: Bulk
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 1
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Current - Quiescent (Iq): 500 nA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 315 MHz
Input Capacitance: 0.6 pF
Supplier Device Package: 8-VSSOP
Max Propagation Delay @ V, Max CL: 5.8ns @ 3.3V, 30pF
Part Status: Active
Number of Bits per Element: 1
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74LVC2G86DC-Q100125 74LVC2G86DC-Q100125 NXP USA Inc. 74LVC2G86_Q100.pdf Description: XOR GATE, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
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74AHC2G32DC-Q100125 74AHC2G32DC-Q100125 NXP USA Inc. 74AHC_AHCT2G32_Q100.pdf Description: IC GATE OR
Packaging: Bulk
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Supplier Device Package: 8-VSSOP
Input Logic Level - High: 1.5V ~ 3.85V
Input Logic Level - Low: 0.5V ~ 1.65V
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Grade: Automotive
Number of Circuits: 2
Current - Quiescent (Max): 1 µA
Qualification: AEC-Q100
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74HC2G02DC-Q100125 74HC2G02DC-Q100125 NXP USA Inc. 74HC_HCT2G02_Q100.pdf Description: IC GATE NOR 2CH 2-INP 8VSSOP
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74AHCT2G00DC-Q100125 NXP USA Inc. 74AHC_AHCT2G00_Q100.pdf Description: NAND GATE, AHCT/VHCT/VT SERIES
Packaging: Bulk
Part Status: Active
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74AHCT2G32DC-Q100125 NXP USA Inc. 74AHC_AHCT2G32_Q100.pdf Description: OR GATE, AHCT/VHCT/VT SERIES
Packaging: Bulk
Part Status: Active
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74LVC3G34DC-Q100125 74LVC3G34DC-Q100125 NXP USA Inc. 74LVC3G34_Q100.pdf Description: BUFFER, LVC/LCX/Z SERIES
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74HC2G66DC-Q100125 74HC2G66DC-Q100125 NXP USA Inc. 74HC_HCT2G66_Q100.pdf Description: 74HC2G66DC-Q100 - SPST, 2 FUNC
Packaging: Bulk
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 70Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 8-VSSOP
Voltage - Supply, Single (V+): 2V ~ 10V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 3Ohm
Switch Time (Ton, Toff) (Max): 20ns, 27ns
Current - Leakage (IS(off)) (Max): 1µA
Grade: Automotive
Part Status: Active
Number of Circuits: 2
Qualification: AEC-Q100
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74LVC2G66DC-Q100125 74LVC2G66DC-Q100125 NXP USA Inc. 74LVC2G66_Q100.pdf Description: SPST, 2 FUNC
Packaging: Bulk
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 500MHz
Supplier Device Package: 8-VSSOP
Voltage - Supply, Single (V+): 1.65V ~ 5.5V
Charge Injection: 7.5pC
Crosstalk: -56dB @ 1MHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 3.9ns, 5ns
Current - Leakage (IS(off)) (Max): 5µA
Part Status: Active
Number of Circuits: 2
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P89LPC982FDH,529 P89LPC982FDH,529 NXP USA Inc. P89LPC980_982_983_985.pdf Description: IC MCU 8BIT 8KB FLASH 28TSSOP
Packaging: Tube
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Part Status: Obsolete
Number of I/O: 26
DigiKey Programmable: Not Verified
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P89LPC952FA P89LPC952FA NXP USA Inc. PHGLS15789-1.pdf?t.download=true&u=5oefqw Description: IC MCU 8BIT 8KB FLASH 44PLCC
Packaging: Bulk
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
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74AHC1G09GW-Q100125 74AHC1G09GW-Q100125 NXP USA Inc. 74AHC1G09_Q100.pdf Description: AND GATE, AHC/VHC/H/U/V SERIES
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BUK7506-75B,127 BUK7506-75B,127 NXP USA Inc. BUK7506-75B.pdf Description: MOSFET N-CH 75V 75A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 5.6mOhm @ 25A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 75 V
Gate Charge (Qg) (Max) @ Vgs: 91 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 7446 pF @ 25 V
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MCIMX6L8DVN10AA-NXP MCIMX6L8DVN10AA-NXP NXP USA Inc. FSCLS11779-1.pdf?t.download=true&u=5oefqw Description: I.MX 6 SERIES 32 BIT MPU, ARM CO
Packaging: Bulk
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
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BC68-25PAS115 BC68-25PAS115 NXP USA Inc. BC68PAS_SER.pdf Description: SMALL SIGNAL BIPOLAR TRANSISTOR
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BC68PAS115 BC68PAS115 NXP USA Inc. BC68PAS_SER.pdf Description: SMALL SIGNAL BIPOLAR TRANSISTOR
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MCIMX6Q5EZK08AE NXP USA Inc. IMX6DQCPOPEC.pdf Description: IC MPU I.MX6Q 800MHZ 569MAPBGA
Packaging: Tray
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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S9S08RNA48W1MLC S9S08RNA48W1MLC NXP USA Inc. S9S08RN60DS.pdf Description: IC MCU 8BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
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MCIMX7U5CVP06SC MCIMX7U5CVP06SC NXP USA Inc. iMX%207ULP%20SixPack%20Presentation.pdf Description: IC MPU I.MX7ULP 650MHZ
Packaging: Tray
Speed: 650MHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A7
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: LPDDR2, LPDDR3
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: Crypto/TRNG, eFuses/OTP, Secure Fuse, uHAB/HAB-Secure Boot
Additional Interfaces: FlexIO, GPIO, I2C, I2S, SPI, UART
Part Status: Obsolete
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KITFS6523CAEEVM KITFS6523CAEEVM NXP USA Inc. F6500%2C%20F4500%20Data%20Short.pdf Description: EVAL BOARD FOR FS6500
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Contents: Board(s)
Utilized IC / Part: FS6500
Supplied Contents: Board(s)
Part Status: Active
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PMZ550UNE315 PMZ550UNE315 NXP USA Inc. PMZ550UNE.pdf Description: SMALL SIGNAL N-CHANNEL MOSFET
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SAF7741HV/N125Z557 NXP USA Inc. _SAF7741HV.pdf?t.download=true&u=ovmfp3 Description: CAR RADIO DIGITAL SIGNAL PROCESS
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BF1201WR,115 BF1201WR,115 NXP USA Inc. BF1201%28R%2CWR%29_Rev_Oct2010.pdf Description: RF MOSFET 5V CMPAK-4
Packaging: Bulk
Package / Case: SC-82A, SOT-343
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 29dB
Technology: MOSFET (Metal Oxide)
Noise Figure: 1dB
Supplier Device Package: CMPAK-4
Part Status: Obsolete
Voltage - Rated: 10 V
Voltage - Test: 5 V
Current - Test: 15 mA
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BF1201WR,135 BF1201WR,135 NXP USA Inc. BF1201(R,WR)_Rev_Oct2010.pdf Description: MOSFET 2N-CH 10V 30MA SOT343R
Packaging: Bulk
Package / Case: SC-82A, SOT-343
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 29dB
Technology: MOSFET
Noise Figure: 1dB
Supplier Device Package: CMPAK-4
Part Status: Obsolete
Voltage - Rated: 10 V
Voltage - Test: 5 V
Current - Test: 15 mA
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74AHCT241BQ,115 74AHCT241BQ,115 NXP USA Inc. 74AHC_AHCT241_Rev_Feb2017.pdf Description: IC BUF NON-INVERT 5.5V 20DHVQFN
Packaging: Bulk
Package / Case: 20-VFQFN Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-DHVQFN (4.5x2.5)
Part Status: Obsolete
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74HCT241D/C118 NXP USA Inc. PHGLS06122-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 5.5V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SO
Part Status: Active
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PMBT4403YS115 PMBT4403YS115 NXP USA Inc. PMBT4403YS.pdf Description: 40 V, 600 MA, DOUBLE NPN SWITCHI
Packaging: Bulk
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TDA8579T/N1S118 TDA8579T/N1S118 NXP USA Inc. PHGLS28658-1.pdf?t.download=true&u=5oefqw Description: IC DUAL DIFF COMMON MODE REJECT
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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AFT05MP075NR1 AFT05MP075NR1 NXP USA Inc. AFT05MP075N.pdf Description: RF MOSFET LDMOS 12.5V TO270-4
Packaging: Cut Tape (CT)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 520MHz
Configuration: Dual
Power - Output: 70W
Gain: 18.5dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 400 mA
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74HC9115D/S400118 74HC9115D/S400118 NXP USA Inc. 74HC9115.pdf Description: IC BUFF 2V/6V 20-SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 9
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: -, 5.2mA
Supplier Device Package: 20-SO
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74HC251D-Q100118 NXP USA Inc. 74HC_HCT251_Q100.pdf Description: MUX, 8 LINE INPUT
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 8:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Active
Produkt ist nicht verfügbar
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74HC251D/S400118 NXP USA Inc. 74HC_HCT251.pdf Description: MUX, 8 LINE INPUT
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 8:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Active
Produkt ist nicht verfügbar
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NX1A4WPZ NXP USA Inc. NX1A4WP_DS.pdf Description: IC WIRELESS PWR RECEIVER WLCSP42
Packaging: Tape & Reel (TR)
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 6.1V ~ 18V
Applications: Wireless Power Receiver
Current - Supply: 12mA
Supplier Device Package: 42-WLCSP (3.56x3.41)
Part Status: Obsolete
Produkt ist nicht verfügbar
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NX2A4WPZ NXP USA Inc. NX2A4WP_DS.pdf Description: IC WIRELESS PWR RECEIVER
Packaging: Bulk
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 6.1V ~ 18V
Applications: Wireless Power Receiver
Current - Supply: 12mA
Supplier Device Package: 42-WLCSP (3.56x3.41)
Part Status: Obsolete
Produkt ist nicht verfügbar
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74AHC1G32GW/AU125 NXP USA Inc. 74AHC_AHCT1G32.pdf Description: OR GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
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74AHC1G32GV-Q100125 NXP USA Inc. 74AHC_AHCT1G32_Q100.pdf Description: OR GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74AHC1G32GW132 NXP USA Inc. 74AHC_AHCT1G32.pdf Description: OR GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
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74AHC1G32GW/C3125 NXP USA Inc. 74AHC_AHCT1G32.pdf Description: OR GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
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74AHC1G32GW/C4125 NXP USA Inc. 74AHC_AHCT1G32.pdf Description: OR GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MMRF5017HSR5138 NXP USA Inc. PHGL-S-A0005882854-1.pdf?t.download=true&u=5oefqw Description: RF POWER FIELD-EFFECT TRANSISTOR
Packaging: Bulk
Produkt ist nicht verfügbar
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SSL3401HN/1518 NXP USA Inc. PHGLS29832-1.pdf?t.download=true&u=5oefqw Description: DIMMABLE LED CONTROLLER
Packaging: Bulk
Part Status: Active
auf Bestellung 102000 Stücke:
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MC15XS3400DHFK MC15XS3400DHFK NXP USA Inc. Description: IC PWR SWITCH N-CHAN 1:1 24PQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tray
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 15mOhm
Voltage - Load: 6V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 24-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Obsolete
Produkt ist nicht verfügbar
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TEF5000EL/V1K NXP USA Inc. Description: WISPA-ITS
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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TEF5100EL/V1K NXP USA Inc. Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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SAF5000EL/V100Y NXP USA Inc. Description: IC RADIO SYSTEM MULTI
Produkt ist nicht verfügbar
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TEF5000EL/V1Y NXP USA Inc. Description: WISPA-ITS
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
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TEF5100EL/V1Y NXP USA Inc. Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IP4786CZ32518 IP4786CZ32518 NXP USA Inc. IP4786CZ32.pdf Description: IP4786CZ32S - CONSUMER CIRCUIT
Produkt ist nicht verfügbar
 Mindestbestellmenge: 631 Stücke
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LPC1767FBD100K LPC1767FBD100K NXP USA Inc. LPC1769_68_67_66_65_64_63.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
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LPC1758FBD80K LPC1758FBD80K NXP USA Inc. LPC1759_58_56_54_52_51.pdf Description: IC MCU 32BIT 512KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
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FS32R372SCK0MMVT
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.3MB FLASH 141MAPBGA
Packaging: Tray
Package / Case: 141-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 1.3MB (1.3M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: e200z7260
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 141-MAPBGA (10x10)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BZX84-A8V2/DG/B3215 PHGL-S-A0000014340-1.pdf?t.download=true&u=5oefqw
BZX84-A8V2/DG/B3215
Hersteller: NXP USA Inc.
Description: DIODE ZENER
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BZX84-A4V7/DG/B3215 PHGL-S-A0000014340-1.pdf?t.download=true&u=5oefqw
BZX84-A4V7/DG/B3215
Hersteller: NXP USA Inc.
Description: DIODE ZENER
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TDA8541T/N1112
TDA8541T/N1112
Hersteller: NXP USA Inc.
Description: AUDIO AMPLIFIER 1.2W
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 18V
Max Output Power x Channels @ Load: 1.2W x 1 @ 8Ohm
Supplier Device Package: 8-SOIC
Part Status: Active
Produkt ist nicht verfügbar
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PEMZ7315 PEMZ7.pdf
Hersteller: NXP USA Inc.
Description: NPN/PNP TRANSISTOR TRANSISTOR
Packaging: Bulk
Produkt ist nicht verfügbar
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PCA9519PW,118 PCA9519.pdf
PCA9519PW,118
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 4CH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Number of Channels: 4
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Applications: I²C
Current - Supply: 11.6mA
Data Rate (Max): 400kHz
Supplier Device Package: 20-TSSOP
Part Status: Active
Capacitance - Input: 6 pF
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3+8.25 EUR
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25+7.01 EUR
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500+5.18 EUR
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BZX585-C5V1115
Hersteller: NXP USA Inc.
Description: DIODE ZENER 56V 0.3W 5% UNIDIR
Tolerance: ±5%
Packaging: Bulk
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.1 V
Impedance (Max) (Zzt): 60 Ohms
Supplier Device Package: SOD-523
Part Status: Active
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 2 µA @ 2 V
Produkt ist nicht verfügbar
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S9S08RNA32W1VLCR MC9S08AC60.pdf
S9S08RNA32W1VLCR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC2G08DC-Q100125 74LVC2G08_Q100.pdf
74LVC2G08DC-Q100125
Hersteller: NXP USA Inc.
Description: AND GATE, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74AHC2G08DC-Q100125 74AHC_AHCT2G08_Q100.pdf
74AHC2G08DC-Q100125
Hersteller: NXP USA Inc.
Description: IC GATE AND
Packaging: Bulk
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Supplier Device Package: 8-VSSOP
Input Logic Level - High: 1.5V ~ 3.85V
Input Logic Level - Low: 0.5V ~ 1.65V
Max Propagation Delay @ V, Max CL: 7.9ns @ 5V, 50pF
Grade: Automotive
Number of Circuits: 2
Current - Quiescent (Max): 1 µA
Qualification: AEC-Q100
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74AUP1G74DC-Q100125 74AUP1G74_Q100.pdf
74AUP1G74DC-Q100125
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 1BIT 8VSSOP
Packaging: Bulk
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 1
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Current - Quiescent (Iq): 500 nA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 315 MHz
Input Capacitance: 0.6 pF
Supplier Device Package: 8-VSSOP
Max Propagation Delay @ V, Max CL: 5.8ns @ 3.3V, 30pF
Part Status: Active
Number of Bits per Element: 1
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74LVC2G86DC-Q100125 74LVC2G86_Q100.pdf
74LVC2G86DC-Q100125
Hersteller: NXP USA Inc.
Description: XOR GATE, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74AHC2G32DC-Q100125 74AHC_AHCT2G32_Q100.pdf
74AHC2G32DC-Q100125
Hersteller: NXP USA Inc.
Description: IC GATE OR
Packaging: Bulk
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Supplier Device Package: 8-VSSOP
Input Logic Level - High: 1.5V ~ 3.85V
Input Logic Level - Low: 0.5V ~ 1.65V
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Grade: Automotive
Number of Circuits: 2
Current - Quiescent (Max): 1 µA
Qualification: AEC-Q100
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74HC2G02DC-Q100125 74HC_HCT2G02_Q100.pdf
74HC2G02DC-Q100125
Hersteller: NXP USA Inc.
Description: IC GATE NOR 2CH 2-INP 8VSSOP
Produkt ist nicht verfügbar
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74AHCT2G00DC-Q100125 74AHC_AHCT2G00_Q100.pdf
Hersteller: NXP USA Inc.
Description: NAND GATE, AHCT/VHCT/VT SERIES
Packaging: Bulk
Part Status: Active
auf Bestellung 2490 Stücke:
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1420+0.44 EUR
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74AHCT2G32DC-Q100125 74AHC_AHCT2G32_Q100.pdf
Hersteller: NXP USA Inc.
Description: OR GATE, AHCT/VHCT/VT SERIES
Packaging: Bulk
Part Status: Active
auf Bestellung 2490 Stücke:
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1216+0.52 EUR
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74LVC3G34DC-Q100125 74LVC3G34_Q100.pdf
74LVC3G34DC-Q100125
Hersteller: NXP USA Inc.
Description: BUFFER, LVC/LCX/Z SERIES
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74HC2G66DC-Q100125 74HC_HCT2G66_Q100.pdf
74HC2G66DC-Q100125
Hersteller: NXP USA Inc.
Description: 74HC2G66DC-Q100 - SPST, 2 FUNC
Packaging: Bulk
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 70Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 8-VSSOP
Voltage - Supply, Single (V+): 2V ~ 10V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 3Ohm
Switch Time (Ton, Toff) (Max): 20ns, 27ns
Current - Leakage (IS(off)) (Max): 1µA
Grade: Automotive
Part Status: Active
Number of Circuits: 2
Qualification: AEC-Q100
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74LVC2G66DC-Q100125 74LVC2G66_Q100.pdf
74LVC2G66DC-Q100125
Hersteller: NXP USA Inc.
Description: SPST, 2 FUNC
Packaging: Bulk
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 500MHz
Supplier Device Package: 8-VSSOP
Voltage - Supply, Single (V+): 1.65V ~ 5.5V
Charge Injection: 7.5pC
Crosstalk: -56dB @ 1MHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 3.9ns, 5ns
Current - Leakage (IS(off)) (Max): 5µA
Part Status: Active
Number of Circuits: 2
Produkt ist nicht verfügbar
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P89LPC982FDH,529 P89LPC980_982_983_985.pdf
P89LPC982FDH,529
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28TSSOP
Packaging: Tube
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Part Status: Obsolete
Number of I/O: 26
DigiKey Programmable: Not Verified
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AnzahlPrivatkunde
222+3.28 EUR
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P89LPC952FA PHGLS15789-1.pdf?t.download=true&u=5oefqw
P89LPC952FA
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 44PLCC
Packaging: Bulk
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74AHC1G09GW-Q100125 74AHC1G09_Q100.pdf
74AHC1G09GW-Q100125
Hersteller: NXP USA Inc.
Description: AND GATE, AHC/VHC/H/U/V SERIES
Produkt ist nicht verfügbar
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BUK7506-75B,127 BUK7506-75B.pdf
BUK7506-75B,127
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 75V 75A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 5.6mOhm @ 25A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 75 V
Gate Charge (Qg) (Max) @ Vgs: 91 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 7446 pF @ 25 V
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MCIMX6L8DVN10AA-NXP FSCLS11779-1.pdf?t.download=true&u=5oefqw
MCIMX6L8DVN10AA-NXP
Hersteller: NXP USA Inc.
Description: I.MX 6 SERIES 32 BIT MPU, ARM CO
Packaging: Bulk
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR3, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
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BC68-25PAS115 BC68PAS_SER.pdf
BC68-25PAS115
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Produkt ist nicht verfügbar
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BC68PAS115 BC68PAS_SER.pdf
BC68PAS115
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Produkt ist nicht verfügbar
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MCIMX6Q5EZK08AE IMX6DQCPOPEC.pdf
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6Q 800MHZ 569MAPBGA
Packaging: Tray
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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S9S08RNA48W1MLC S9S08RN60DS.pdf
S9S08RNA48W1MLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX7U5CVP06SC iMX%207ULP%20SixPack%20Presentation.pdf
MCIMX7U5CVP06SC
Hersteller: NXP USA Inc.
Description: IC MPU I.MX7ULP 650MHZ
Packaging: Tray
Speed: 650MHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A7
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: LPDDR2, LPDDR3
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: Crypto/TRNG, eFuses/OTP, Secure Fuse, uHAB/HAB-Secure Boot
Additional Interfaces: FlexIO, GPIO, I2C, I2S, SPI, UART
Part Status: Obsolete
Produkt ist nicht verfügbar
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KITFS6523CAEEVM F6500%2C%20F4500%20Data%20Short.pdf
KITFS6523CAEEVM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR FS6500
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Contents: Board(s)
Utilized IC / Part: FS6500
Supplied Contents: Board(s)
Part Status: Active
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PMZ550UNE315 PMZ550UNE.pdf
PMZ550UNE315
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL N-CHANNEL MOSFET
auf Bestellung 6666 Stücke:
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SAF7741HV/N125Z557 _SAF7741HV.pdf?t.download=true&u=ovmfp3
Hersteller: NXP USA Inc.
Description: CAR RADIO DIGITAL SIGNAL PROCESS
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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BF1201WR,115 BF1201%28R%2CWR%29_Rev_Oct2010.pdf
BF1201WR,115
Hersteller: NXP USA Inc.
Description: RF MOSFET 5V CMPAK-4
Packaging: Bulk
Package / Case: SC-82A, SOT-343
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 29dB
Technology: MOSFET (Metal Oxide)
Noise Figure: 1dB
Supplier Device Package: CMPAK-4
Part Status: Obsolete
Voltage - Rated: 10 V
Voltage - Test: 5 V
Current - Test: 15 mA
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1567+0.37 EUR
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BF1201WR,135 BF1201(R,WR)_Rev_Oct2010.pdf
BF1201WR,135
Hersteller: NXP USA Inc.
Description: MOSFET 2N-CH 10V 30MA SOT343R
Packaging: Bulk
Package / Case: SC-82A, SOT-343
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 29dB
Technology: MOSFET
Noise Figure: 1dB
Supplier Device Package: CMPAK-4
Part Status: Obsolete
Voltage - Rated: 10 V
Voltage - Test: 5 V
Current - Test: 15 mA
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1268+0.5 EUR
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74AHCT241BQ,115 74AHC_AHCT241_Rev_Feb2017.pdf
74AHCT241BQ,115
Hersteller: NXP USA Inc.
Description: IC BUF NON-INVERT 5.5V 20DHVQFN
Packaging: Bulk
Package / Case: 20-VFQFN Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-DHVQFN (4.5x2.5)
Part Status: Obsolete
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2219+0.27 EUR
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74HCT241D/C118 PHGLS06122-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SO
Part Status: Active
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1158+0.55 EUR
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PMBT4403YS115 PMBT4403YS.pdf
PMBT4403YS115
Hersteller: NXP USA Inc.
Description: 40 V, 600 MA, DOUBLE NPN SWITCHI
Packaging: Bulk
Produkt ist nicht verfügbar
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TDA8579T/N1S118 PHGLS28658-1.pdf?t.download=true&u=5oefqw
TDA8579T/N1S118
Hersteller: NXP USA Inc.
Description: IC DUAL DIFF COMMON MODE REJECT
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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AFT05MP075NR1 AFT05MP075N.pdf
AFT05MP075NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 12.5V TO270-4
Packaging: Cut Tape (CT)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 520MHz
Configuration: Dual
Power - Output: 70W
Gain: 18.5dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 400 mA
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1+111.42 EUR
10+91.8 EUR
25+86.89 EUR
100+81.52 EUR
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74HC9115D/S400118 74HC9115.pdf
74HC9115D/S400118
Hersteller: NXP USA Inc.
Description: IC BUFF 2V/6V 20-SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 9
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: -, 5.2mA
Supplier Device Package: 20-SO
Produkt ist nicht verfügbar
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74HC251D-Q100118 74HC_HCT251_Q100.pdf
Hersteller: NXP USA Inc.
Description: MUX, 8 LINE INPUT
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 8:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Active
Produkt ist nicht verfügbar
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74HC251D/S400118 74HC_HCT251.pdf
Hersteller: NXP USA Inc.
Description: MUX, 8 LINE INPUT
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 8:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Active
Produkt ist nicht verfügbar
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NX1A4WPZ NX1A4WP_DS.pdf
Hersteller: NXP USA Inc.
Description: IC WIRELESS PWR RECEIVER WLCSP42
Packaging: Tape & Reel (TR)
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 6.1V ~ 18V
Applications: Wireless Power Receiver
Current - Supply: 12mA
Supplier Device Package: 42-WLCSP (3.56x3.41)
Part Status: Obsolete
Produkt ist nicht verfügbar
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NX2A4WPZ NX2A4WP_DS.pdf
Hersteller: NXP USA Inc.
Description: IC WIRELESS PWR RECEIVER
Packaging: Bulk
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 6.1V ~ 18V
Applications: Wireless Power Receiver
Current - Supply: 12mA
Supplier Device Package: 42-WLCSP (3.56x3.41)
Part Status: Obsolete
Produkt ist nicht verfügbar
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74AHC1G32GW/AU125 74AHC_AHCT1G32.pdf
Hersteller: NXP USA Inc.
Description: OR GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74AHC1G32GV-Q100125 74AHC_AHCT1G32_Q100.pdf
Hersteller: NXP USA Inc.
Description: OR GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74AHC1G32GW132 74AHC_AHCT1G32.pdf
Hersteller: NXP USA Inc.
Description: OR GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74AHC1G32GW/C3125 74AHC_AHCT1G32.pdf
Hersteller: NXP USA Inc.
Description: OR GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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74AHC1G32GW/C4125 74AHC_AHCT1G32.pdf
Hersteller: NXP USA Inc.
Description: OR GATE, AHC/VHC/H/U/V SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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MMRF5017HSR5138 PHGL-S-A0005882854-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: RF POWER FIELD-EFFECT TRANSISTOR
Packaging: Bulk
Produkt ist nicht verfügbar
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SSL3401HN/1518 PHGLS29832-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: DIMMABLE LED CONTROLLER
Packaging: Bulk
Part Status: Active
auf Bestellung 102000 Stücke:
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AnzahlPrivatkunde
151+3.83 EUR
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MC15XS3400DHFK
MC15XS3400DHFK
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 24PQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tray
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 15mOhm
Voltage - Load: 6V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 24-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Obsolete
Produkt ist nicht verfügbar
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TEF5000EL/V1K
Hersteller: NXP USA Inc.
Description: WISPA-ITS
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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TEF5100EL/V1K
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Produkt ist nicht verfügbar
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SAF5000EL/V100Y
Hersteller: NXP USA Inc.
Description: IC RADIO SYSTEM MULTI
Produkt ist nicht verfügbar
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TEF5000EL/V1Y
Hersteller: NXP USA Inc.
Description: WISPA-ITS
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
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TEF5100EL/V1Y
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IP4786CZ32518 IP4786CZ32.pdf
IP4786CZ32518
Hersteller: NXP USA Inc.
Description: IP4786CZ32S - CONSUMER CIRCUIT
Produkt ist nicht verfügbar
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LPC1767FBD100K LPC1769_68_67_66_65_64_63.pdf
LPC1767FBD100K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
auf Bestellung 2020 Stücke:
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AnzahlPrivatkunde
1+31.36 EUR
10+24.85 EUR
24+23.29 EUR
80+21.68 EUR
230+20.66 EUR
440+20.17 EUR
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LPC1758FBD80K LPC1759_58_56_54_52_51.pdf
LPC1758FBD80K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
auf Bestellung 521 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+20.99 EUR
10+15.42 EUR
25+14.04 EUR
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