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TEA19031AGT/1J NXP USA Inc. TEA19031AT.pdf Description: SMART CHARGING PROTOCOL CONTR US
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74HC165PW/S400118 74HC165PW/S400118 NXP USA Inc. PHGLS15363-1.pdf?t.download=true&u=5oefqw Description: 8-BIT SHIFT REGISTER
Number of Bits per Element: 8
Part Status: Active
Supplier Device Package: 16-TSSOP
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Logic Type: Shift Register
Function: Parallel or Serial to Serial
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Complementary
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
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MFRC50001T/OFE MFRC50001T/OFE NXP USA Inc. PHGLS20212-1.pdf?t.download=true&u=5oefqw Description: IC MIFARE READER 32SO
Packaging: Bulk
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BB178/L315 BB178/L315 NXP USA Inc. PHGLS23158-1.pdf?t.download=true&u=5oefqw Description: VARIABLE CAPACITANCE DIODE, VERY
Capacitance Ratio: 15
Voltage - Peak Reverse (Max): 32 V
Supplier Device Package: SOD-523
Capacitance Ratio Condition: C1/C28
Capacitance @ Vr, F: 2.75pF @ 28V, 1MHz
Operating Temperature: -55°C ~ 125°C (TJ)
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: SC-79, SOD-523
Packaging: Bulk
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BUK7E4R0-80E,127 BUK7E4R0-80E,127 NXP USA Inc. BUK7E4R0-80E.pdf Description: MOSFET N-CH 80V 120A I2PAK
Input Capacitance (Ciss) (Max) @ Vds: 12030 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 169 nC @ 10 V
Drain to Source Voltage (Vdss): 80 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: I2PAK
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 349W (Tc)
Rds On (Max) @ Id, Vgs: 4mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Packaging: Tube
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LS1021ASN7KQB LS1021ASN7KQB NXP USA Inc. LS1021AFS.pdf Description: IC MPU QORIQ 1.0GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (3)
USB: USB 3.0 (1) + PHY
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR3L, DDR4
Display & Interface Controllers: 2D-ACE
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
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PCA9541D/03,118 PCA9541D/03,118 NXP USA Inc. PCA9541.pdf Description: IC INTERFACE SPECIALIZED 16SO
Part Status: Obsolete
Supplier Device Package: 16-SO
Applications: 2-Channel I2C Multiplexer
Voltage - Supply: 2.3V ~ 5.5V
Interface: I2C, SMBus
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
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MKW41Z256VHT4,557 NXP USA Inc. Description: KINETIS KW41Z, WIRELESS MCU BASE
DigiKey Programmable: Not Verified
Part Status: Active
Serial Interfaces: ADC, GPIO, I²C, SPI, UART
RF Family/Standard: 802.15.4, Bluetooth
Modulation: FSK, GFSK, MSK, O-QPSK
Supplier Device Package: 64-VFLGA (7x7)
Current - Transmitting: 6mA
Data Rate (Max): 1Mbps
Current - Receiving: 6.2mA
Protocol: Bluetooth v4.2
Power - Output: 3.5dBm
Voltage - Supply: 1.71V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 256kB Flash, 64kB RAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -102dBm
Package / Case: 64-VFLGA
Packaging: Tray
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74HCT373DB,112-NXP 74HCT373DB,112-NXP NXP USA Inc. Description: BUS DRIVER, HCT SERIES, 1-FUNC,
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 1:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 6mA, 6mA
Delay Time - Propagation: 14ns
Supplier Device Package: 20-SSOP
Part Status: Active
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NXQ1TXA5/404J NXQ1TXA5/404J NXP USA Inc. NXQ1TXA5.pdf Description: RF TRANSMITTER 205MHZ 32VFQFN
Operating Temperature: -20°C ~ 85°C
Data Interface: I2C
Frequency: 205MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
Part Status: Obsolete
Supplier Device Package: 32-HVQFN (5x5)
Current - Transmitting: 15mA
Applications: General Purpose
Voltage - Supply: 5V
DigiKey Programmable: Not Verified
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PBSS5330PAS115 PBSS5330PAS115 NXP USA Inc. PBSS5330PAS.pdf Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
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PDTC123JQA147 PDTC123JQA147 NXP USA Inc. PDTC143X_123J_143Z_114YQA_SER.pdf Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
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NCX2222GFX NCX2222GFX NXP USA Inc. NCX2222.pdf Description: IC COMPARATOR 2 GEN PUR 8XSON
Hysteresis: 9mV
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Current - Output (Typ): 68mA
Current - Input Bias (Max): 1pA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Quiescent (Max): 5µA
Propagation Delay (Max): 0.8µs
Supplier Device Package: 8-XSON, SOT1089 (1.35x1)
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: General Purpose
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Open-Drain
Package / Case: 8-XFDFN
Packaging: Tape & Reel (TR)
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NCX2222GFX NCX2222GFX NXP USA Inc. NCX2222.pdf Description: IC COMPARATOR 2 GEN PUR 8XSON
Hysteresis: 9mV
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Current - Output (Typ): 68mA
Current - Input Bias (Max): 1pA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Quiescent (Max): 5µA
Propagation Delay (Max): 0.8µs
Supplier Device Package: 8-XSON, SOT1089 (1.35x1)
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: General Purpose
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Open-Drain
Package / Case: 8-XFDFN
Packaging: Cut Tape (CT)
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74LVCU04APW/S400118 74LVCU04APW/S400118 NXP USA Inc. PHGL-S-A0001342233-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER
Packaging: Bulk
Part Status: Active
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F104X8A F104X8A NXP USA Inc. F104S8A_F104X8A.pdf Description: IC TRANSCEIVER 2/2 138QFN
Packaging: Tray
Package / Case: 138-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Number of Drivers/Receivers: 2/2
Protocol: Gigabit Ethernet
Supplier Device Package: 138-QFN (12x12)
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MC33FS8530A1ES MC33FS8530A1ES NXP USA Inc. PB_FS84_FS85C.pdf Description: SYSTEM BASIS CHIP FS8500
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
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BGW200EG/01,515 NXP USA Inc. BGW200EG.pdf Description: IC RF TXRX+MCU WIFI 68LFLGA
DigiKey Programmable: Not Verified
Sensitivity: -91dBm
Package / Case: 68-LFLGA Exposed Pad
Part Status: Obsolete
Serial Interfaces: JTAG, SDIO, SPI, UART
RF Family/Standard: WiFi
Modulation: CCK, DSSS, QPSK
GPIO: 11
Supplier Device Package: 68-HLLGAR (10x15)
Current - Transmitting: 16mA ~ 94.2mA
Data Rate (Max): 11Mbps
Current - Receiving: 93.7mA ~ 111.5mA
Protocol: 802.11b
Power - Output: 17.6dBm
Voltage - Supply: 2.7V ~ 3V
Operating Temperature: -30°C ~ 85°C
Type: TxRx + MCU
Memory Size: 256kb ROM, 1280kb SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Packaging: Cut Tape (CT)
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KIT40XS6500EKEVB NXP USA Inc. KT12XS6UG.pdf Description: EVAL BOARD FOR MC40XS6500
Utilized IC / Part: MC40XS6500
Contents: Board(s)
Type: Power Management
Function: Power Distribution Switch (Load Switch)
Packaging: Bulk
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OM12000/1020000557 NXP USA Inc. Description: AUTOMOTIVE TELEMATICS ON-BOARD U
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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74HCT08D/AU118 74HCT08D/AU118 NXP USA Inc. 74HC_HCT08.pdf Description: IC GATE AND 4CH 2-INP 14SO
Current - Quiescent (Max): 2 µA
Number of Circuits: 4
Part Status: Active
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Input Logic Level - Low: 0.8V
Input Logic Level - High: 2V
Supplier Device Package: 14-SO
Number of Inputs: 2
Current - Output High, Low: 4mA, 5.2mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: AND Gate
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
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74HCT08D/C118 74HCT08D/C118 NXP USA Inc. 74HC_HCT08.pdf Description: IC GATE AND 4CH 2-INP 14SO
Number of Circuits: 4
Part Status: Active
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Input Logic Level - Low: 0.8V
Input Logic Level - High: 2V
Supplier Device Package: 14-SO
Number of Inputs: 2
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: AND Gate
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
Current - Quiescent (Max): 2 µA
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74HCT08D/C4118 74HCT08D/C4118 NXP USA Inc. 74HC_HCT08.pdf Description: IC GATE AND 4CH 2-INP 14SO
Current - Quiescent (Max): 2 µA
Number of Circuits: 4
Part Status: Active
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Input Logic Level - Low: 0.8V
Input Logic Level - High: 2V
Supplier Device Package: 14-SO
Number of Inputs: 2
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: AND Gate
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
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S9S08RNA8W2CTJ S9S08RNA8W2CTJ NXP USA Inc. Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
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NXB0102GF115 NXP USA Inc. PHGLS20866-1.pdf?t.download=true&u=5oefqw Description: IC BUS TRANSCEIVER NTSX2102 SER
Packaging: Bulk
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NXS0102GF115 NXP USA Inc. PHGLS20788-1.pdf?t.download=true&u=5oefqw Description: IC BUS TRANSCEIVER NTSX2102 SER
Packaging: Bulk
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NXS0102GT115 NXS0102GT115 NXP USA Inc. PHGLS20788-1.pdf?t.download=true&u=5oefqw Description: IC BUS TRANSCEIVER NTSX2102 SER
Number of Circuits: 1
Voltage - VCCB: 2.3 V ~ 5.5 V
Voltage - VCCA: 1.65 V ~ 3.6 V
Channels per Circuit: 2
Translator Type: Voltage Level
Channel Type: Bidirectional
Supplier Device Package: 8-XSON (1.95x1)
Data Rate: 24Mbps
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Output Type: Open Drain, Push-Pull, Tri-State
Package / Case: 8-XFDFN
Packaging: Bulk
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NXB0102GT115 NXP USA Inc. PHGLS20866-1.pdf?t.download=true&u=5oefqw Description: BUS TRANSCEIVER NTSX2102 SERIES
Packaging: Bulk
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PBSS5240X115 PBSS5240X115 NXP USA Inc. PBSS5240X.pdf Description: SMALL SIGNAL BIPOLAR TRANSISTOR
DC Current Gain (hFE) (Min) @ Ic, Vce: 300 @ 1mA, 5V
Current - Collector Cutoff (Max): 100nA (ICBO)
Power - Max: 500 mW
Vce Saturation (Max) @ Ib, Ic: 630mV @ 200mA, 2A
Operating Temperature: 150°C (TJ)
Packaging: Bulk
Voltage - Collector Emitter Breakdown (Max): 40 V
Current - Collector (Ic) (Max): 2 A
Supplier Device Package: SOT-89
Transistor Type: PNP
Mounting Type: Surface Mount
Package / Case: TO-243AA
Frequency - Transition: 150MHz
Part Status: Active
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PBSS5240Z115 PBSS5240Z115 NXP USA Inc. PBSS5240Z.pdf Description: SMALL SIGNAL BIPOLAR TRANSISTOR
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PCA9450AHNY PCA9450AHNY NXP USA Inc. PCA9450DS.pdf Description: PMIC I.MX 8M MINI/NANO/PLUS HVQF
Supplier Device Package: 56-HVQFN (7x7)
Current - Supply: 20µA
Applications: General Purpose
Voltage - Supply: 2.85V ~ 5.5V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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PCA9450AHNY PCA9450AHNY NXP USA Inc. PCA9450DS.pdf Description: PMIC I.MX 8M MINI/NANO/PLUS HVQF
Supplier Device Package: 56-HVQFN (7x7)
Current - Supply: 20µA
Applications: General Purpose
Voltage - Supply: 2.85V ~ 5.5V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 56-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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MC3PHACVDWE MC3PHACVDWE NXP USA Inc. MC3PHAC.pdf description Description: AC MOTOR CONTROLLER, CMOS, PDSO2
Packaging: Tube
Part Status: Obsolete
Motor Type - AC, DC: AC, Synchronous
Supplier Device Package: 28-SOIC
Technology: IGBT
Applications: General Purpose
Voltage - Supply: 4.5V ~ 5.5V
Output Configuration: Pre-Driver - Half Bridge (3)
Operating Temperature: -40°C ~ 105°C (TA)
Interface: Serial
Function: Controller - Commutation, Direction Management
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.295", 7.50mm Width)
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SAF7741HV/N135518 NXP USA Inc. _SAF7741HV.pdf?t.download=true&u=ovmfp3 Description: CAR RADIO DIGITAL SIGNAL PROCESS
Packaging: Bulk
Part Status: Active
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KITPF502XSKTEVM KITPF502XSKTEVM NXP USA Inc. KITPF502XSKTEVM.pdf Description: EVAL BOARD FOR PF502X
Packaging: Bulk
Contents: Board(s)
Utilized IC / Part: PF502x
Supplied Contents: Board(s)
Part Status: Active
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PMV90ENE215 PMV90ENE215 NXP USA Inc. PMV90ENE.pdf Description: SMALL SIGNAL N-CHANNEL MOSFET
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74HC1G125GW/C4125 74HC1G125GW/C4125 NXP USA Inc. 74HC_HCT1G125.pdf Description: IC BUFFER NON-INVERT 6V 5TSSOP
Packaging: Bulk
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 5-TSSOP
Part Status: Active
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74HC1G125GW/C2125 74HC1G125GW/C2125 NXP USA Inc. 74HC_HCT1G125.pdf Description: IC BUFFER NON-INVERT 6V 5TSSOP
Packaging: Bulk
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 5-TSSOP
Part Status: Active
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74HC1G125GW-Q100125 74HC1G125GW-Q100125 NXP USA Inc. 74HC_HCT1G125_Q100.pdf Description: IC BUFFER NON-INVERT 6V 5TSSOP
Packaging: Bulk
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 5-TSSOP
Part Status: Active
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74HC1G125GW132 74HC1G125GW132 NXP USA Inc. 74HC_HCT1G125.pdf Description: IC BUFFER NON-INVERT 6V 5TSSOP
Packaging: Bulk
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 5-TSSOP
Part Status: Active
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74HCT1G125GW/C2125 NXP USA Inc. 74HC_HCT1G125.pdf Description: IC BUFFER NON-INVERT 5.5V 5TSSOP
Packaging: Bulk
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 5-TSSOP
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BCP56-16H,115 BCP56-16H,115 NXP USA Inc. BCP56H_SER.pdf Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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FRDM-GD3100EVM FRDM-GD3100EVM NXP USA Inc. 568_UM11108.pdf Description: EVAL BOARD FOR GD3100
Packaging: Bulk
Function: Half H-Bridge Driver (Internal FET)
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: GD3100
Embedded: Yes, MCU, 32-Bit
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74HC237D-Q100118 74HC237D-Q100118 NXP USA Inc. 74HC237_Q100.pdf Description: DECODER/DRIVER, HC/UH SERIES
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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TJA1128ETK/0Z TJA1128ETK/0Z NXP USA Inc. TJA1128.pdf Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBd
Protocol: LIN
Supplier Device Package: 14-HVSON (3x4.5)
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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TJA1128ETK/0Z TJA1128ETK/0Z NXP USA Inc. TJA1128.pdf Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBd
Protocol: LIN
Supplier Device Package: 14-HVSON (3x4.5)
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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PMV48XPA215 PMV48XPA215 NXP USA Inc. PMV48XPA.pdf Description: P-CHANNEL MOSFET
Packaging: Bulk
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PMV48XP/MI215 NXP USA Inc. PMV48XP.pdf Description: P-CHANNEL MOSFET
Packaging: Bulk
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PMP4201G135 NXP USA Inc. PMP4201V_G_Y.pdf Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Transistor Type: 2 NPN (Dual) Matched Pair, Common Emitter
Operating Temperature: 150°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 45V
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 2mA, 5V
Frequency - Transition: 250MHz
Supplier Device Package: 5-TSSOP
Part Status: Active
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PH3120L,115-NXP PH3120L,115-NXP NXP USA Inc. Description: POWER FIELD-EFFECT TRANSISTOR, 1
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FS32R372SCK0MMMT FS32R372SCK0MMMT NXP USA Inc. S32R372.pdf Description: IC MCU 32B 1.3MB FLASH 257MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 257-LFBGA (14x14)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 16x12b SAR
Core Processor: e200z7260
EEPROM Size: 32K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 768K x 8
Program Memory Size: 1.3MB (1.3M x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 257-LFBGA
Packaging: Tray
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FS32R372SCK0MMVT NXP USA Inc. Description: IC MCU 32B 1.3MB FLASH 141MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 141-MAPBGA (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, I²C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 16x12b SAR
Core Processor: e200z7260
EEPROM Size: 32K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 768K x 8
Program Memory Size: 1.3MB (1.3M x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 141-LFBGA
Packaging: Tray
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BZX84-A8V2/DG/B3215 BZX84-A8V2/DG/B3215 NXP USA Inc. PHGL-S-A0000014340-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER
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BZX84-A4V7/DG/B3215 BZX84-A4V7/DG/B3215 NXP USA Inc. PHGL-S-A0000014340-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER
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TDA8541T/N1112 TDA8541T/N1112 NXP USA Inc. Description: AUDIO AMPLIFIER 1.2W
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 18V
Max Output Power x Channels @ Load: 1.2W x 1 @ 8Ohm
Supplier Device Package: 8-SOIC
Part Status: Active
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PEMZ7315 NXP USA Inc. PEMZ7.pdf Description: NPN/PNP TRANSISTOR TRANSISTOR
Packaging: Bulk
Produkt ist nicht verfügbar
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PCA9519PW,118 PCA9519PW,118 NXP USA Inc. PCA9519.pdf Description: IC REDRIVER I2C 4CH 20TSSOP
Operating Temperature: -40°C ~ 85°C
Input: 2-Wire Bus
Type: Buffer, ReDriver
Output: 2-Wire Bus
Mounting Type: Surface Mount
Number of Channels: 4
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
Capacitance - Input: 6 pF
Part Status: Active
Supplier Device Package: 20-TSSOP
Data Rate (Max): 400kHz
Current - Supply: 11.6mA
Applications: I²C
Voltage - Supply: 3V ~ 5.5V
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BZX585-C5V1115 NXP USA Inc. Description: DIODE ZENER 56V 0.3W 5% UNIDIR
Current - Reverse Leakage @ Vr: 2 µA @ 2 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Power - Max: 300 mW
Part Status: Active
Supplier Device Package: SOD-523
Impedance (Max) (Zzt): 60 Ohms
Voltage - Zener (Nom) (Vz): 5.1 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SC-79, SOD-523
Tolerance: ±5%
Packaging: Bulk
Produkt ist nicht verfügbar
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S9S08RNA32W1VLCR S9S08RNA32W1VLCR NXP USA Inc. S9S08RN60DS.pdf Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74LVC2G08DC-Q100125 74LVC2G08DC-Q100125 NXP USA Inc. 74LVC2G08_Q100.pdf Description: AND GATE, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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TEA19031AGT/1J TEA19031AT.pdf
Hersteller: NXP USA Inc.
Description: SMART CHARGING PROTOCOL CONTR US
Produkt ist nicht verfügbar
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74HC165PW/S400118 PHGLS15363-1.pdf?t.download=true&u=5oefqw
74HC165PW/S400118
Hersteller: NXP USA Inc.
Description: 8-BIT SHIFT REGISTER
Number of Bits per Element: 8
Part Status: Active
Supplier Device Package: 16-TSSOP
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 125°C
Logic Type: Shift Register
Function: Parallel or Serial to Serial
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Complementary
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Produkt ist nicht verfügbar
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MFRC50001T/OFE PHGLS20212-1.pdf?t.download=true&u=5oefqw
MFRC50001T/OFE
Hersteller: NXP USA Inc.
Description: IC MIFARE READER 32SO
Packaging: Bulk
Produkt ist nicht verfügbar
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BB178/L315 PHGLS23158-1.pdf?t.download=true&u=5oefqw
BB178/L315
Hersteller: NXP USA Inc.
Description: VARIABLE CAPACITANCE DIODE, VERY
Capacitance Ratio: 15
Voltage - Peak Reverse (Max): 32 V
Supplier Device Package: SOD-523
Capacitance Ratio Condition: C1/C28
Capacitance @ Vr, F: 2.75pF @ 28V, 1MHz
Operating Temperature: -55°C ~ 125°C (TJ)
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: SC-79, SOD-523
Packaging: Bulk
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BUK7E4R0-80E,127 BUK7E4R0-80E.pdf
BUK7E4R0-80E,127
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 80V 120A I2PAK
Input Capacitance (Ciss) (Max) @ Vds: 12030 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 169 nC @ 10 V
Drain to Source Voltage (Vdss): 80 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: I2PAK
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 349W (Tc)
Rds On (Max) @ Id, Vgs: 4mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Packaging: Tube
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LS1021ASN7KQB LS1021AFS.pdf
LS1021ASN7KQB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.0GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (3)
USB: USB 3.0 (1) + PHY
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR3L, DDR4
Display & Interface Controllers: 2D-ACE
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
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1+134.43 EUR
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PCA9541D/03,118 PCA9541.pdf
PCA9541D/03,118
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 16SO
Part Status: Obsolete
Supplier Device Package: 16-SO
Applications: 2-Channel I2C Multiplexer
Voltage - Supply: 2.3V ~ 5.5V
Interface: I2C, SMBus
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
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MKW41Z256VHT4,557
Hersteller: NXP USA Inc.
Description: KINETIS KW41Z, WIRELESS MCU BASE
DigiKey Programmable: Not Verified
Part Status: Active
Serial Interfaces: ADC, GPIO, I²C, SPI, UART
RF Family/Standard: 802.15.4, Bluetooth
Modulation: FSK, GFSK, MSK, O-QPSK
Supplier Device Package: 64-VFLGA (7x7)
Current - Transmitting: 6mA
Data Rate (Max): 1Mbps
Current - Receiving: 6.2mA
Protocol: Bluetooth v4.2
Power - Output: 3.5dBm
Voltage - Supply: 1.71V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 256kB Flash, 64kB RAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -102dBm
Package / Case: 64-VFLGA
Packaging: Tray
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74HCT373DB,112-NXP
74HCT373DB,112-NXP
Hersteller: NXP USA Inc.
Description: BUS DRIVER, HCT SERIES, 1-FUNC,
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 1:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 6mA, 6mA
Delay Time - Propagation: 14ns
Supplier Device Package: 20-SSOP
Part Status: Active
Produkt ist nicht verfügbar
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NXQ1TXA5/404J NXQ1TXA5.pdf
NXQ1TXA5/404J
Hersteller: NXP USA Inc.
Description: RF TRANSMITTER 205MHZ 32VFQFN
Operating Temperature: -20°C ~ 85°C
Data Interface: I2C
Frequency: 205MHz
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Bulk
Part Status: Obsolete
Supplier Device Package: 32-HVQFN (5x5)
Current - Transmitting: 15mA
Applications: General Purpose
Voltage - Supply: 5V
DigiKey Programmable: Not Verified
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PBSS5330PAS115 PBSS5330PAS.pdf
PBSS5330PAS115
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Produkt ist nicht verfügbar
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PDTC123JQA147 PDTC143X_123J_143Z_114YQA_SER.pdf
PDTC123JQA147
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
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NCX2222GFX NCX2222.pdf
NCX2222GFX
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 2 GEN PUR 8XSON
Hysteresis: 9mV
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Current - Output (Typ): 68mA
Current - Input Bias (Max): 1pA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Quiescent (Max): 5µA
Propagation Delay (Max): 0.8µs
Supplier Device Package: 8-XSON, SOT1089 (1.35x1)
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: General Purpose
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Open-Drain
Package / Case: 8-XFDFN
Packaging: Tape & Reel (TR)
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NCX2222GFX NCX2222.pdf
NCX2222GFX
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 2 GEN PUR 8XSON
Hysteresis: 9mV
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Current - Output (Typ): 68mA
Current - Input Bias (Max): 1pA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Quiescent (Max): 5µA
Propagation Delay (Max): 0.8µs
Supplier Device Package: 8-XSON, SOT1089 (1.35x1)
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: General Purpose
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Open-Drain
Package / Case: 8-XFDFN
Packaging: Cut Tape (CT)
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74LVCU04APW/S400118 PHGL-S-A0001342233-1.pdf?t.download=true&u=5oefqw
74LVCU04APW/S400118
Hersteller: NXP USA Inc.
Description: IC INVERTER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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F104X8A F104S8A_F104X8A.pdf
F104X8A
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 2/2 138QFN
Packaging: Tray
Package / Case: 138-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Number of Drivers/Receivers: 2/2
Protocol: Gigabit Ethernet
Supplier Device Package: 138-QFN (12x12)
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MC33FS8530A1ES PB_FS84_FS85C.pdf
MC33FS8530A1ES
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP FS8500
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
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1+22.71 EUR
10+17.78 EUR
25+16.55 EUR
80+15.39 EUR
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520+14.15 EUR
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BGW200EG/01,515 BGW200EG.pdf
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU WIFI 68LFLGA
DigiKey Programmable: Not Verified
Sensitivity: -91dBm
Package / Case: 68-LFLGA Exposed Pad
Part Status: Obsolete
Serial Interfaces: JTAG, SDIO, SPI, UART
RF Family/Standard: WiFi
Modulation: CCK, DSSS, QPSK
GPIO: 11
Supplier Device Package: 68-HLLGAR (10x15)
Current - Transmitting: 16mA ~ 94.2mA
Data Rate (Max): 11Mbps
Current - Receiving: 93.7mA ~ 111.5mA
Protocol: 802.11b
Power - Output: 17.6dBm
Voltage - Supply: 2.7V ~ 3V
Operating Temperature: -30°C ~ 85°C
Type: TxRx + MCU
Memory Size: 256kb ROM, 1280kb SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Packaging: Cut Tape (CT)
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KIT40XS6500EKEVB KT12XS6UG.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR MC40XS6500
Utilized IC / Part: MC40XS6500
Contents: Board(s)
Type: Power Management
Function: Power Distribution Switch (Load Switch)
Packaging: Bulk
Produkt ist nicht verfügbar
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OM12000/1020000557
Hersteller: NXP USA Inc.
Description: AUTOMOTIVE TELEMATICS ON-BOARD U
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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74HCT08D/AU118 74HC_HCT08.pdf
74HCT08D/AU118
Hersteller: NXP USA Inc.
Description: IC GATE AND 4CH 2-INP 14SO
Current - Quiescent (Max): 2 µA
Number of Circuits: 4
Part Status: Active
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Input Logic Level - Low: 0.8V
Input Logic Level - High: 2V
Supplier Device Package: 14-SO
Number of Inputs: 2
Current - Output High, Low: 4mA, 5.2mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: AND Gate
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
Produkt ist nicht verfügbar
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74HCT08D/C118 74HC_HCT08.pdf
74HCT08D/C118
Hersteller: NXP USA Inc.
Description: IC GATE AND 4CH 2-INP 14SO
Number of Circuits: 4
Part Status: Active
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Input Logic Level - Low: 0.8V
Input Logic Level - High: 2V
Supplier Device Package: 14-SO
Number of Inputs: 2
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: AND Gate
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
Current - Quiescent (Max): 2 µA
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74HCT08D/C4118 74HC_HCT08.pdf
74HCT08D/C4118
Hersteller: NXP USA Inc.
Description: IC GATE AND 4CH 2-INP 14SO
Current - Quiescent (Max): 2 µA
Number of Circuits: 4
Part Status: Active
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Input Logic Level - Low: 0.8V
Input Logic Level - High: 2V
Supplier Device Package: 14-SO
Number of Inputs: 2
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: AND Gate
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
Produkt ist nicht verfügbar
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S9S08RNA8W2CTJ
S9S08RNA8W2CTJ
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NXB0102GF115 PHGLS20866-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC BUS TRANSCEIVER NTSX2102 SER
Packaging: Bulk
Produkt ist nicht verfügbar
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NXS0102GF115 PHGLS20788-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC BUS TRANSCEIVER NTSX2102 SER
Packaging: Bulk
Produkt ist nicht verfügbar
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NXS0102GT115 PHGLS20788-1.pdf?t.download=true&u=5oefqw
NXS0102GT115
Hersteller: NXP USA Inc.
Description: IC BUS TRANSCEIVER NTSX2102 SER
Number of Circuits: 1
Voltage - VCCB: 2.3 V ~ 5.5 V
Voltage - VCCA: 1.65 V ~ 3.6 V
Channels per Circuit: 2
Translator Type: Voltage Level
Channel Type: Bidirectional
Supplier Device Package: 8-XSON (1.95x1)
Data Rate: 24Mbps
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Output Type: Open Drain, Push-Pull, Tri-State
Package / Case: 8-XFDFN
Packaging: Bulk
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NXB0102GT115 PHGLS20866-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: BUS TRANSCEIVER NTSX2102 SERIES
Packaging: Bulk
Produkt ist nicht verfügbar
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PBSS5240X115 PBSS5240X.pdf
PBSS5240X115
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
DC Current Gain (hFE) (Min) @ Ic, Vce: 300 @ 1mA, 5V
Current - Collector Cutoff (Max): 100nA (ICBO)
Power - Max: 500 mW
Vce Saturation (Max) @ Ib, Ic: 630mV @ 200mA, 2A
Operating Temperature: 150°C (TJ)
Packaging: Bulk
Voltage - Collector Emitter Breakdown (Max): 40 V
Current - Collector (Ic) (Max): 2 A
Supplier Device Package: SOT-89
Transistor Type: PNP
Mounting Type: Surface Mount
Package / Case: TO-243AA
Frequency - Transition: 150MHz
Part Status: Active
auf Bestellung 56555 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
5236+0.11 EUR
Mindestbestellmenge: 5236 Stücke
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PBSS5240Z115 PBSS5240Z.pdf
PBSS5240Z115
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Produkt ist nicht verfügbar
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PCA9450AHNY PCA9450DS.pdf
PCA9450AHNY
Hersteller: NXP USA Inc.
Description: PMIC I.MX 8M MINI/NANO/PLUS HVQF
Supplier Device Package: 56-HVQFN (7x7)
Current - Supply: 20µA
Applications: General Purpose
Voltage - Supply: 2.85V ~ 5.5V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PCA9450AHNY PCA9450DS.pdf
PCA9450AHNY
Hersteller: NXP USA Inc.
Description: PMIC I.MX 8M MINI/NANO/PLUS HVQF
Supplier Device Package: 56-HVQFN (7x7)
Current - Supply: 20µA
Applications: General Purpose
Voltage - Supply: 2.85V ~ 5.5V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 56-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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MC3PHACVDWE description MC3PHAC.pdf
MC3PHACVDWE
Hersteller: NXP USA Inc.
Description: AC MOTOR CONTROLLER, CMOS, PDSO2
Packaging: Tube
Part Status: Obsolete
Motor Type - AC, DC: AC, Synchronous
Supplier Device Package: 28-SOIC
Technology: IGBT
Applications: General Purpose
Voltage - Supply: 4.5V ~ 5.5V
Output Configuration: Pre-Driver - Half Bridge (3)
Operating Temperature: -40°C ~ 105°C (TA)
Interface: Serial
Function: Controller - Commutation, Direction Management
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.295", 7.50mm Width)
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30+35.94 EUR
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SAF7741HV/N135518 _SAF7741HV.pdf?t.download=true&u=ovmfp3
Hersteller: NXP USA Inc.
Description: CAR RADIO DIGITAL SIGNAL PROCESS
Packaging: Bulk
Part Status: Active
auf Bestellung 750 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
40+15.76 EUR
Mindestbestellmenge: 40 Stücke
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KITPF502XSKTEVM KITPF502XSKTEVM.pdf
KITPF502XSKTEVM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR PF502X
Packaging: Bulk
Contents: Board(s)
Utilized IC / Part: PF502x
Supplied Contents: Board(s)
Part Status: Active
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1+678.61 EUR
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PMV90ENE215 PMV90ENE.pdf
PMV90ENE215
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL N-CHANNEL MOSFET
auf Bestellung 51000 Stücke:
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Mindestbestellmenge: 7797 Stücke
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74HC1G125GW/C4125 74HC_HCT1G125.pdf
74HC1G125GW/C4125
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 6V 5TSSOP
Packaging: Bulk
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 5-TSSOP
Part Status: Active
Produkt ist nicht verfügbar
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74HC1G125GW/C2125 74HC_HCT1G125.pdf
74HC1G125GW/C2125
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 6V 5TSSOP
Packaging: Bulk
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 5-TSSOP
Part Status: Active
Produkt ist nicht verfügbar
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74HC1G125GW-Q100125 74HC_HCT1G125_Q100.pdf
74HC1G125GW-Q100125
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 6V 5TSSOP
Packaging: Bulk
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 5-TSSOP
Part Status: Active
Produkt ist nicht verfügbar
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74HC1G125GW132 74HC_HCT1G125.pdf
74HC1G125GW132
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 6V 5TSSOP
Packaging: Bulk
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 5-TSSOP
Part Status: Active
Produkt ist nicht verfügbar
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74HCT1G125GW/C2125 74HC_HCT1G125.pdf
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 5TSSOP
Packaging: Bulk
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 5-TSSOP
Produkt ist nicht verfügbar
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BCP56-16H,115 BCP56H_SER.pdf
BCP56-16H,115
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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FRDM-GD3100EVM 568_UM11108.pdf
FRDM-GD3100EVM
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR GD3100
Packaging: Bulk
Function: Half H-Bridge Driver (Internal FET)
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: GD3100
Embedded: Yes, MCU, 32-Bit
auf Bestellung 1 Stücke:
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AnzahlPrivatkunde
1+559.86 EUR
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74HC237D-Q100118 74HC237_Q100.pdf
74HC237D-Q100118
Hersteller: NXP USA Inc.
Description: DECODER/DRIVER, HC/UH SERIES
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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AnzahlPrivatkunde
982+0.6 EUR
Mindestbestellmenge: 982 Stücke
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TJA1128ETK/0Z TJA1128.pdf
TJA1128ETK/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBd
Protocol: LIN
Supplier Device Package: 14-HVSON (3x4.5)
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
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AnzahlPrivatkunde
6000+2.18 EUR
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TJA1128ETK/0Z TJA1128.pdf
TJA1128ETK/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBd
Protocol: LIN
Supplier Device Package: 14-HVSON (3x4.5)
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 9309 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
5+4.24 EUR
10+3.14 EUR
25+2.87 EUR
100+2.57 EUR
250+2.42 EUR
500+2.34 EUR
Mindestbestellmenge: 5 Stücke
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PMV48XPA215 PMV48XPA.pdf
PMV48XPA215
Hersteller: NXP USA Inc.
Description: P-CHANNEL MOSFET
Packaging: Bulk
Produkt ist nicht verfügbar
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PMV48XP/MI215 PMV48XP.pdf
Hersteller: NXP USA Inc.
Description: P-CHANNEL MOSFET
Packaging: Bulk
Produkt ist nicht verfügbar
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PMP4201G135 PMP4201V_G_Y.pdf
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Transistor Type: 2 NPN (Dual) Matched Pair, Common Emitter
Operating Temperature: 150°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 45V
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 2mA, 5V
Frequency - Transition: 250MHz
Supplier Device Package: 5-TSSOP
Part Status: Active
Produkt ist nicht verfügbar
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PH3120L,115-NXP
PH3120L,115-NXP
Hersteller: NXP USA Inc.
Description: POWER FIELD-EFFECT TRANSISTOR, 1
Produkt ist nicht verfügbar
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FS32R372SCK0MMMT S32R372.pdf
FS32R372SCK0MMMT
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.3MB FLASH 257MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 257-LFBGA (14x14)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 16x12b SAR
Core Processor: e200z7260
EEPROM Size: 32K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 768K x 8
Program Memory Size: 1.3MB (1.3M x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 257-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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FS32R372SCK0MMVT
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.3MB FLASH 141MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 141-MAPBGA (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, I²C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 16x12b SAR
Core Processor: e200z7260
EEPROM Size: 32K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 768K x 8
Program Memory Size: 1.3MB (1.3M x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 141-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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BZX84-A8V2/DG/B3215 PHGL-S-A0000014340-1.pdf?t.download=true&u=5oefqw
BZX84-A8V2/DG/B3215
Hersteller: NXP USA Inc.
Description: DIODE ZENER
auf Bestellung 48000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2404+0.25 EUR
Mindestbestellmenge: 2404 Stücke
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BZX84-A4V7/DG/B3215 PHGL-S-A0000014340-1.pdf?t.download=true&u=5oefqw
BZX84-A4V7/DG/B3215
Hersteller: NXP USA Inc.
Description: DIODE ZENER
auf Bestellung 164090 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1803+0.35 EUR
Mindestbestellmenge: 1803 Stücke
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TDA8541T/N1112
TDA8541T/N1112
Hersteller: NXP USA Inc.
Description: AUDIO AMPLIFIER 1.2W
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 18V
Max Output Power x Channels @ Load: 1.2W x 1 @ 8Ohm
Supplier Device Package: 8-SOIC
Part Status: Active
Produkt ist nicht verfügbar
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PEMZ7315 PEMZ7.pdf
Hersteller: NXP USA Inc.
Description: NPN/PNP TRANSISTOR TRANSISTOR
Packaging: Bulk
Produkt ist nicht verfügbar
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PCA9519PW,118 PCA9519.pdf
PCA9519PW,118
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 4CH 20TSSOP
Operating Temperature: -40°C ~ 85°C
Input: 2-Wire Bus
Type: Buffer, ReDriver
Output: 2-Wire Bus
Mounting Type: Surface Mount
Number of Channels: 4
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
Capacitance - Input: 6 pF
Part Status: Active
Supplier Device Package: 20-TSSOP
Data Rate (Max): 400kHz
Current - Supply: 11.6mA
Applications: I²C
Voltage - Supply: 3V ~ 5.5V
auf Bestellung 805 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+8.25 EUR
10+7.41 EUR
25+7.01 EUR
100+6.08 EUR
250+5.76 EUR
500+5.18 EUR
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BZX585-C5V1115
Hersteller: NXP USA Inc.
Description: DIODE ZENER 56V 0.3W 5% UNIDIR
Current - Reverse Leakage @ Vr: 2 µA @ 2 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Power - Max: 300 mW
Part Status: Active
Supplier Device Package: SOD-523
Impedance (Max) (Zzt): 60 Ohms
Voltage - Zener (Nom) (Vz): 5.1 V
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SC-79, SOD-523
Tolerance: ±5%
Packaging: Bulk
Produkt ist nicht verfügbar
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S9S08RNA32W1VLCR S9S08RN60DS.pdf
S9S08RNA32W1VLCR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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74LVC2G08DC-Q100125 74LVC2G08_Q100.pdf
74LVC2G08DC-Q100125
Hersteller: NXP USA Inc.
Description: AND GATE, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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