Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36223) > Seite 358 nach 604
| Foto | Bezeichnung | Hersteller | Beschreibung |
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| MCF5212LCVM66-NXP | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 81MAPBGA |
Produkt ist nicht verfügbar |
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| 74HCT573DB,112-NXP | NXP USA Inc. |
Description: IC D-TYPE TRANSP SGL 8:8 20SSOPPackaging: Tube Package / Case: 20-SSOP (0.209", 5.30mm Width) Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Circuit: 8:8 Logic Type: D-Type Transparent Latch Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 1 Current - Output High, Low: 6mA, 6mA Delay Time - Propagation: 17ns Supplier Device Package: 20-SSOP Part Status: Active |
Produkt ist nicht verfügbar |
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LPC2364FET100,518 | NXP USA Inc. |
Description: IC MCU 16/32BIT 128KB 100TFBGAPackaging: Cut Tape (CT) Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 128KB (128K x 8) RAM Size: 34K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 6x10b; D/A 1x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 100-TFBGA (9x9) Part Status: Not For New Designs Number of I/O: 70 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PDTD113ZQA147 | NXP USA Inc. |
Description: TRANS PREBIAS NPN 50V 500MAPackaging: Bulk Part Status: Active Package / Case: 3-XDFN Exposed Pad Mounting Type: Surface Mount Transistor Type: NPN - Pre-Biased Vce Saturation (Max) @ Ib, Ic: 100mV @ 2.5mA, 50mA Current - Collector Cutoff (Max): 500nA DC Current Gain (hFE) (Min) @ Ic, Vce: 70 @ 50mA, 5V Supplier Device Package: DFN1010D-3 Grade: Automotive Current - Collector (Ic) (Max): 500 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 940 mW Frequency - Transition: 210 MHz Resistor - Base (R1): 1 kOhms Resistor - Emitter Base (R2): 10 kOhms Qualification: AEC-Q101 |
Produkt ist nicht verfügbar |
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| PDTD113ZU115 | NXP USA Inc. |
Description: 500 MA, 50 V NPN RESISTOR-EQUIPPPackaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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PDTD143XT215 | NXP USA Inc. |
Description: 500 MA, 50 V NPN RESISTOR-EQUIPP Packaging: Bulk |
Produkt ist nicht verfügbar |
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| PDTD123YU115 | NXP USA Inc. | Description: 0.5A, 50V, NPN, SOT323 |
Produkt ist nicht verfügbar |
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ASL5008FHV/0Y | NXP USA Inc. |
Description: ASL5008FHV/0 |
Produkt ist nicht verfügbar |
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74LVC16245AEV,518 | NXP USA Inc. |
Description: IC TXRX NON-INVERT 3.6V 56VFBGAPackaging: Bulk Package / Case: 56-VFBGA Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Transceiver, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.2V ~ 3.6V Number of Bits per Element: 8 Current - Output High, Low: 24mA, 24mA Supplier Device Package: 56-VFBGA (4.5x7) Part Status: Active |
auf Bestellung 3239 Stücke: Lieferzeit 10-14 Tag (e) |
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| TJA1027TK/20/1,118 | NXP USA Inc. | Description: LIN 2.2A/SAE J2602 TRANSCEIVER |
Produkt ist nicht verfügbar |
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| TJA1027TK/20/1 | NXP USA Inc. | Description: LIN 2.2A/SAE J2602 TRANSCEIVER |
Produkt ist nicht verfügbar |
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| OM13062UL,598 | NXP USA Inc. |
Description: LPCXPRESSO LPC11U37H EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M0 Utilized IC / Part: LPC11U37H Platform: LPCXpresso™ |
Produkt ist nicht verfügbar |
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OM13022598 | NXP USA Inc. |
Description: IAR KICKSTART LPC11U24 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M0 Utilized IC / Part: LPC11U24 Platform: IAR KickStart |
Produkt ist nicht verfügbar |
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| MIMX8MD6DVAJZAA557 | NXP USA Inc. |
Description: 8M QUAD APPLICATIONS PROCESSOR |
Produkt ist nicht verfügbar |
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MIMX8MQ6DVAJZAA | NXP USA Inc. |
Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGAPackaging: Tray Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.5GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A53 Supplier Device Package: 621-FCPBGA (17x17) Ethernet: GbE USB: USB 3.0 (2) Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS Part Status: Active Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC |
auf Bestellung 758 Stücke: Lieferzeit 10-14 Tag (e) |
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| MIMX8MQ6DVAJZAA,557 | NXP USA Inc. |
Description: I.MX 8M: ARM CORTEX A53 QUAD CORPackaging: Tray Part Status: Active |
Produkt ist nicht verfügbar |
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8MIC-RPI-MX8 | NXP USA Inc. |
Description: 8 MICROPHONE BOARD FOR VOICEPackaging: Bulk Function: Microphone Type: Audio Contents: Board(s) Part Status: Active |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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| 74LVC1T45U/C025 | NXP USA Inc. |
Description: BUS TRANSCVR, LVC/LCX/Z SERIESPackaging: Bulk Part Status: Active Output Type: Tri-State Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 420Mbps Channel Type: Bidirectional Output Signal: CMOS, LVTTL Translator Type: Voltage Level Channels per Circuit: 1 Voltage - VCCA: 1.2 V ~ 5.5 V Voltage - VCCB: 1.2 V ~ 5.5 V Number of Circuits: 1 |
Produkt ist nicht verfügbar |
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LPC2420FBD208K | NXP USA Inc. |
Description: IC MCU 16/32BIT ROMLESS 208LQFPPackaging: Tray Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 72MHz RAM Size: 82K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM7® Data Converters: A/D 8x10b; D/A 1x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 208-LQFP (28x28) Part Status: Active Number of I/O: 160 DigiKey Programmable: Not Verified |
auf Bestellung 340 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC253DB,112-NXP | NXP USA Inc. |
Description: IC DATA SEL/MULTPL 2X4:1 16SSOPPackaging: Tube Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Circuit: 2 x 4:1 Type: Data Selector/Multiplexer Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Independent Circuits: 2 Current - Output High, Low: 7.8mA, 7.8mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SSOP Part Status: Active |
Produkt ist nicht verfügbar |
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| JN5179-001-M10Z | NXP USA Inc. |
Description: RF TXRX MOD 802.15.4 TH SMDPackaging: Bulk Package / Case: Module Sensitivity: -96dBm Mounting Type: Surface Mount Frequency: 2.4GHz Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.6V Power - Output: 8.5dBm Protocol: Zigbee® Current - Receiving: 16.4mA Current - Transmitting: 114mA Antenna Type: Integrated, Trace RF Family/Standard: 802.15.4 Serial Interfaces: I2C, SPI, UART Part Status: Obsolete DigiKey Programmable: Not Verified |
auf Bestellung 3965 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6Q7CVT08AE | NXP USA Inc. |
Description: IC MPU I.MX6Q 800MHZ 624FCBGAPackaging: Tray Package / Case: 624-FBGA, FCBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 3Gbps (1) Part Status: Active Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
auf Bestellung 238 Stücke: Lieferzeit 10-14 Tag (e) |
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FRDM-K32L2B3 | NXP USA Inc. |
Description: FREEDOM EVAL BOARD K32L2B3Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s) Core Processor: ARM® Cortex®-M0+ Utilized IC / Part: K32 L2B Platform: Freedom |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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S08PB16-EVK | NXP USA Inc. |
Description: S08PLS EVAL KITPackaging: Box Mounting Type: Fixed Type: MCU 8-Bit Contents: Board(s) Core Processor: HCS08 Board Type: Evaluation Platform Utilized IC / Part: MC9S08PB16 Part Status: Active |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC5748G-GW-RDB | NXP USA Inc. |
Description: MPC5748G ETHERNET GATEWAYPackaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Board Type: Evaluation Platform Utilized IC / Part: MPC5748G Part Status: Active |
auf Bestellung 12 Stücke: Lieferzeit 10-14 Tag (e) |
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BC859CW/ZL115 | NXP USA Inc. |
Description: SMALL SIGNAL BIPOLAR TRANSISTORPackaging: Bulk Part Status: Active |
auf Bestellung 280999 Stücke: Lieferzeit 10-14 Tag (e) |
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MKV46F128VLL16 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 100LQFP |
Produkt ist nicht verfügbar |
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A2I20D020GNR1 | NXP USA Inc. |
Description: IC AMP W-CDMA 1.4-2.2GHZ TO270WBPackaging: Tape & Reel (TR) Package / Case: TO-270-17 Variant, Flat Leads Mounting Type: Surface Mount Frequency: 1.4GHz ~ 2.2GHz RF Type: W-CDMA Voltage - Supply: 28V Gain: 35dB Test Frequency: 2.2GHz Supplier Device Package: TO-270WB-17 |
Produkt ist nicht verfügbar |
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SPC5645SF1VLUR | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 176LQFP Packaging: Tape & Reel (TR) Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 125MHz Program Memory Size: 2MB (2M x 8) RAM Size: 1.064M x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z4d Data Converters: A/D 16x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 176-LQFP (24x24) Part Status: Active Number of I/O: 128 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LS1043AXE7KQA | NXP USA Inc. |
Description: QORIQ 4XCPU 64-BIT ARM ARCH 1. |
Produkt ist nicht verfügbar |
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BF821/DG/B2215 | NXP USA Inc. |
Description: SMALL SIGNAL BIPOLAR TRANSISTORPackaging: Bulk Part Status: Active Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Transistor Type: PNP Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 800mV @ 5mA, 30mA Current - Collector Cutoff (Max): 10nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 25mA, 20V Frequency - Transition: 60MHz Supplier Device Package: SOT-23-3 (TO-236) Grade: Automotive Current - Collector (Ic) (Max): 50 mA Voltage - Collector Emitter Breakdown (Max): 300 V Power - Max: 250 mW Qualification: AEC-Q101 |
Produkt ist nicht verfügbar |
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PCA9450CHNY | NXP USA Inc. |
Description: PMIC I.MX 8M MINI/NANO/PLUS HVQFPackaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.85V ~ 5.5V Applications: General Purpose Current - Supply: 20µA Supplier Device Package: 56-HVQFN (7x7) |
Produkt ist nicht verfügbar |
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PCA9450CHNY | NXP USA Inc. |
Description: PMIC I.MX 8M MINI/NANO/PLUS HVQFPackaging: Cut Tape (CT) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.85V ~ 5.5V Applications: General Purpose Current - Supply: 20µA Supplier Device Package: 56-HVQFN (7x7) |
auf Bestellung 173 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1820FBD144,551 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 144LQFPPackaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 180MHz RAM Size: 168K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Discontinued at Digi-Key Number of I/O: 83 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| BZX84-B9V1/DG/B3215 | NXP USA Inc. |
Description: DIODE ZENERPackaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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BZX84-B9V1/LF1R | NXP USA Inc. |
Description: DIODE ZENER 9.1V 250MW TO236ABPackaging: Tape & Reel (TR) Tolerance: ±2% Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 9.1 V Impedance (Max) (Zzt): 15 Ohms Supplier Device Package: SOT-23 (TO-236AB) Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 500 nA @ 6 V Grade: Automotive Qualification: AEC-Q101 |
Produkt ist nicht verfügbar |
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74LVC1G19GW-Q100125 | NXP USA Inc. |
Description: DECODER/DRIVER, LVC/LCX/Z SERIESPackaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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| 74LVC1G19GS132 | NXP USA Inc. |
Description: DECODER/DRIVER, LVC/LCX/Z SERIE Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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| BLF8G10LS-160,112 | NXP USA Inc. |
Description: RF PFET, 1-ELEMENT, ULTRA HIGH F |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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| MC908QY4CDWER518 | NXP USA Inc. |
Description: MICROCONTROLLER, 8 BIT, HC08/S08Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MPF5024AMBA0ES | NXP USA Inc. |
Description: POWER MANAGEMENT IC, PRE-PROG, 4 Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: 10µA Supplier Device Package: 40-HVQFN (6x6) Part Status: Active |
auf Bestellung 490 Stücke: Lieferzeit 10-14 Tag (e) |
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74HCT4066PW-Q100118 | NXP USA Inc. |
Description: DIFFERENTIAL MUXPackaging: Bulk Part Status: Active Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 95Ohm -3db Bandwidth: 200MHz Supplier Device Package: 14-TSSOP Voltage - Supply, Single (V+): 4.5V ~ 5.5V Crosstalk: -60dB @ 1MHz Switch Circuit: SPST - NO Multiplexer/Demultiplexer Circuit: 1:1 Channel-to-Channel Matching (ΔRon): 3Ohm Switch Time (Ton, Toff) (Max): 20ns, 30ns Channel Capacitance (CS(off), CD(off)): 3.5pF Current - Leakage (IS(off)) (Max): 1µA Grade: Automotive Number of Circuits: 4 Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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74HCT4066PW/C118 | NXP USA Inc. |
Description: 74HCT4066PW - SPST, 4 FUNCPackaging: Bulk Part Status: Active |
auf Bestellung 3500 Stücke: Lieferzeit 10-14 Tag (e) |
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| 74HCT4066D-Q100118 | NXP USA Inc. |
Description: DIFFERENTIAL MUX Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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NTP52101G0JHKZ | NXP USA Inc. |
Description: NTAGPackaging: Tape & Reel (TR) Package / Case: 16-XFQFN Mounting Type: Surface Mount Frequency: 13.56MHz Interface: PWM Type: RFID Reader Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.62V ~ 5.5V Standards: NFC, ISO 15693 Supplier Device Package: 16-XQFN (1.8x2.6) Part Status: Active |
Produkt ist nicht verfügbar |
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NTP52101G0JHKZ | NXP USA Inc. |
Description: NTAGPackaging: Cut Tape (CT) Package / Case: 16-XFQFN Mounting Type: Surface Mount Frequency: 13.56MHz Interface: PWM Type: RFID Reader Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.62V ~ 5.5V Standards: NFC, ISO 15693 Supplier Device Package: 16-XQFN (1.8x2.6) Part Status: Active |
auf Bestellung 5065 Stücke: Lieferzeit 10-14 Tag (e) |
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NTP53121G0JHKZ | NXP USA Inc. |
Description: RFID NTAG5 XQFNPackaging: Tape & Reel (TR) Package / Case: 16-XFQFN Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C Type: RFID Reader Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.62V ~ 5.5V Standards: ISO 15693, NFC Supplier Device Package: 16-XQFN (1.8x2.6) Part Status: Active Size / Dimension: 0.071" L x 0.102" W (1.80mm x 2.60mm) Memory Type: Read/Write Writable Memory: 16kb (User) |
Produkt ist nicht verfügbar |
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NTP53121G0JHKZ | NXP USA Inc. |
Description: RFID NTAG5 XQFNPackaging: Cut Tape (CT) Package / Case: 16-XFQFN Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C Type: RFID Reader Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.62V ~ 5.5V Standards: ISO 15693, NFC Supplier Device Package: 16-XQFN (1.8x2.6) Part Status: Active Size / Dimension: 0.071" L x 0.102" W (1.80mm x 2.60mm) Memory Type: Read/Write Writable Memory: 16kb (User) |
auf Bestellung 533 Stücke: Lieferzeit 10-14 Tag (e) |
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NTP53321G0JHK | NXP USA Inc. |
Description: RFID NTAG5 XQFNPackaging: Tape & Reel (TR) Size / Dimension: 0.071" L x 0.102" W (1.80mm x 2.60mm) Frequency: 13.56MHz Memory Type: Read/Write Operating Temperature: -40°C ~ 85°C Standards: ISO 15693, NFC Writable Memory: 16kb (User) |
Produkt ist nicht verfügbar |
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NTP53321G0JHK | NXP USA Inc. |
Description: RFID NTAG5 XQFNPackaging: Cut Tape (CT) Size / Dimension: 0.071" L x 0.102" W (1.80mm x 2.60mm) Frequency: 13.56MHz Memory Type: Read/Write Operating Temperature: -40°C ~ 85°C Standards: ISO 15693, NFC Writable Memory: 16kb (User) |
Produkt ist nicht verfügbar |
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NTA53321G0FTTZ | NXP USA Inc. |
Description: NTAGPackaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C Type: RFID Reader Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.62V ~ 5.5V Standards: ISO 15693, NFC Supplier Device Package: 16-TSSOP Part Status: Active Size / Dimension: 0.173" L x 0.197" W (4.40mm x 5.00mm) Memory Type: Read/Write Writable Memory: 16kb (User) |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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| NTAGFCL5LEDM | NXP USA Inc. | Description: DEV TOOL NFC NTAG |
Produkt ist nicht verfügbar |
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| BLF888DU112 | NXP USA Inc. |
Description: UHF POWER LDMOS TRANSISTOR, SOT5 |
auf Bestellung 141 Stücke: Lieferzeit 10-14 Tag (e) |
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| BLF888D112 | NXP USA Inc. |
Description: RF MOSFET LDMOS SOT5Packaging: Bulk |
auf Bestellung 122 Stücke: Lieferzeit 10-14 Tag (e) |
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| BLF888DS112 | NXP USA Inc. |
Description: RF MOSFET LDMOS SOT5Packaging: Bulk |
auf Bestellung 40 Stücke: Lieferzeit 10-14 Tag (e) |
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| BLM7G1822S-20PB518 | NXP USA Inc. |
Description: LDMOS 2-STAGE POWER MMIC, SOT121Packaging: Bulk |
auf Bestellung 594 Stücke: Lieferzeit 10-14 Tag (e) |
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74LV367PW,118 | NXP USA Inc. |
Description: IC BUF NON-INVERT 3.6V 16TSSOPPackaging: Bulk Package / Case: 16-TSSOP (0.173", 4.40mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1V ~ 3.6V Number of Bits per Element: 2, 4 (Hex) Current - Output High, Low: 8mA, 8mA Supplier Device Package: 16-TSSOP |
auf Bestellung 4910 Stücke: Lieferzeit 10-14 Tag (e) |
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74LV367D,112 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 3.6V 16SOPackaging: Tube Package / Case: 16-SOIC (0.154", 3.90mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1V ~ 3.6V Number of Bits per Element: 2, 4 (Hex) Current - Output High, Low: 8mA, 8mA Supplier Device Package: 16-SO |
auf Bestellung 4000 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC244APW-Q100118 | NXP USA Inc. |
Description: BUS DRIVER, LVC/LCX/Z SERIESPackaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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LX2160A-RDB-B | NXP USA Inc. |
Description: EVAL BOARD LX2160A REV BPackaging: Box Mounting Type: Fixed Type: MPU Contents: Board(s), Cable(s), Accessories Core Processor: ARM® Cortex®-A72 Utilized IC / Part: LX2160A |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| MCF5212LCVM66-NXP |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 81MAPBGA
Description: IC MCU 32BIT 256KB FLSH 81MAPBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HCT573DB,112-NXP |
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Hersteller: NXP USA Inc.
Description: IC D-TYPE TRANSP SGL 8:8 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 6mA, 6mA
Delay Time - Propagation: 17ns
Supplier Device Package: 20-SSOP
Part Status: Active
Description: IC D-TYPE TRANSP SGL 8:8 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 6mA, 6mA
Delay Time - Propagation: 17ns
Supplier Device Package: 20-SSOP
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC2364FET100,518 |
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Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT 128KB 100TFBGA
Packaging: Cut Tape (CT)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 34K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 6x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Not For New Designs
Number of I/O: 70
DigiKey Programmable: Not Verified
Description: IC MCU 16/32BIT 128KB 100TFBGA
Packaging: Cut Tape (CT)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 34K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 6x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Not For New Designs
Number of I/O: 70
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PDTD113ZQA147 |
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Hersteller: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V 500MA
Packaging: Bulk
Part Status: Active
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 2.5mA, 50mA
Current - Collector Cutoff (Max): 500nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 70 @ 50mA, 5V
Supplier Device Package: DFN1010D-3
Grade: Automotive
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 940 mW
Frequency - Transition: 210 MHz
Resistor - Base (R1): 1 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Qualification: AEC-Q101
Description: TRANS PREBIAS NPN 50V 500MA
Packaging: Bulk
Part Status: Active
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 2.5mA, 50mA
Current - Collector Cutoff (Max): 500nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 70 @ 50mA, 5V
Supplier Device Package: DFN1010D-3
Grade: Automotive
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 940 mW
Frequency - Transition: 210 MHz
Resistor - Base (R1): 1 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Qualification: AEC-Q101
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PDTD113ZU115 |
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Hersteller: NXP USA Inc.
Description: 500 MA, 50 V NPN RESISTOR-EQUIPP
Packaging: Bulk
Part Status: Active
Description: 500 MA, 50 V NPN RESISTOR-EQUIPP
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PDTD123YU115 |
Hersteller: NXP USA Inc.
Description: 0.5A, 50V, NPN, SOT323
Description: 0.5A, 50V, NPN, SOT323
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| ASL5008FHV/0Y |
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Hersteller: NXP USA Inc.
Description: ASL5008FHV/0
Description: ASL5008FHV/0
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74LVC16245AEV,518 |
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Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 56VFBGA
Packaging: Bulk
Package / Case: 56-VFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 56-VFBGA (4.5x7)
Part Status: Active
Description: IC TXRX NON-INVERT 3.6V 56VFBGA
Packaging: Bulk
Package / Case: 56-VFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 56-VFBGA (4.5x7)
Part Status: Active
auf Bestellung 3239 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 143+ | 3.52 EUR |
| TJA1027TK/20/1,118 |
Hersteller: NXP USA Inc.
Description: LIN 2.2A/SAE J2602 TRANSCEIVER
Description: LIN 2.2A/SAE J2602 TRANSCEIVER
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TJA1027TK/20/1 |
Hersteller: NXP USA Inc.
Description: LIN 2.2A/SAE J2602 TRANSCEIVER
Description: LIN 2.2A/SAE J2602 TRANSCEIVER
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| OM13062UL,598 |
Hersteller: NXP USA Inc.
Description: LPCXPRESSO LPC11U37H EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC11U37H
Platform: LPCXpresso™
Description: LPCXPRESSO LPC11U37H EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC11U37H
Platform: LPCXpresso™
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| OM13022598 |
Hersteller: NXP USA Inc.
Description: IAR KICKSTART LPC11U24 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC11U24
Platform: IAR KickStart
Description: IAR KICKSTART LPC11U24 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC11U24
Platform: IAR KickStart
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MIMX8MD6DVAJZAA557 |
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Hersteller: NXP USA Inc.
Description: 8M QUAD APPLICATIONS PROCESSOR
Description: 8M QUAD APPLICATIONS PROCESSOR
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MIMX8MQ6DVAJZAA |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Part Status: Active
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Description: IC MPU I.MX8MQ 1.5GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
USB: USB 3.0 (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Part Status: Active
Additional Interfaces: EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
auf Bestellung 758 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 5+ | 90.28 EUR |
| MIMX8MQ6DVAJZAA,557 |
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Hersteller: NXP USA Inc.
Description: I.MX 8M: ARM CORTEX A53 QUAD COR
Packaging: Tray
Part Status: Active
Description: I.MX 8M: ARM CORTEX A53 QUAD COR
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 8MIC-RPI-MX8 |
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Hersteller: NXP USA Inc.
Description: 8 MICROPHONE BOARD FOR VOICE
Packaging: Bulk
Function: Microphone
Type: Audio
Contents: Board(s)
Part Status: Active
Description: 8 MICROPHONE BOARD FOR VOICE
Packaging: Bulk
Function: Microphone
Type: Audio
Contents: Board(s)
Part Status: Active
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 361.49 EUR |
| 74LVC1T45U/C025 |
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Hersteller: NXP USA Inc.
Description: BUS TRANSCVR, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Output Type: Tri-State
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 420Mbps
Channel Type: Bidirectional
Output Signal: CMOS, LVTTL
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 5.5 V
Voltage - VCCB: 1.2 V ~ 5.5 V
Number of Circuits: 1
Description: BUS TRANSCVR, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Output Type: Tri-State
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 420Mbps
Channel Type: Bidirectional
Output Signal: CMOS, LVTTL
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 5.5 V
Voltage - VCCB: 1.2 V ~ 5.5 V
Number of Circuits: 1
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC2420FBD208K |
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Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
RAM Size: 82K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 160
DigiKey Programmable: Not Verified
Description: IC MCU 16/32BIT ROMLESS 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
RAM Size: 82K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 160
DigiKey Programmable: Not Verified
auf Bestellung 340 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 22.16 EUR |
| 10+ | 17.72 EUR |
| 180+ | 16.16 EUR |
| 74HC253DB,112-NXP |
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Hersteller: NXP USA Inc.
Description: IC DATA SEL/MULTPL 2X4:1 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Data Selector/Multiplexer
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Independent Circuits: 2
Current - Output High, Low: 7.8mA, 7.8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Part Status: Active
Description: IC DATA SEL/MULTPL 2X4:1 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Data Selector/Multiplexer
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Independent Circuits: 2
Current - Output High, Low: 7.8mA, 7.8mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| JN5179-001-M10Z |
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Hersteller: NXP USA Inc.
Description: RF TXRX MOD 802.15.4 TH SMD
Packaging: Bulk
Package / Case: Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.6V
Power - Output: 8.5dBm
Protocol: Zigbee®
Current - Receiving: 16.4mA
Current - Transmitting: 114mA
Antenna Type: Integrated, Trace
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: RF TXRX MOD 802.15.4 TH SMD
Packaging: Bulk
Package / Case: Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.6V
Power - Output: 8.5dBm
Protocol: Zigbee®
Current - Receiving: 16.4mA
Current - Transmitting: 114mA
Antenna Type: Integrated, Trace
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
auf Bestellung 3965 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 25+ | 18.62 EUR |
| MCIMX6Q7CVT08AE |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6Q 800MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6Q 800MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 238 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 178.68 EUR |
| 10+ | 150.11 EUR |
| 60+ | 137.68 EUR |
| FRDM-K32L2B3 |
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Hersteller: NXP USA Inc.
Description: FREEDOM EVAL BOARD K32L2B3
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: K32 L2B
Platform: Freedom
Description: FREEDOM EVAL BOARD K32L2B3
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: K32 L2B
Platform: Freedom
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 48.29 EUR |
| S08PB16-EVK |
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Hersteller: NXP USA Inc.
Description: S08PLS EVAL KIT
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08PB16
Part Status: Active
Description: S08PLS EVAL KIT
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08PB16
Part Status: Active
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 49.72 EUR |
| MPC5748G-GW-RDB |
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Hersteller: NXP USA Inc.
Description: MPC5748G ETHERNET GATEWAY
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5748G
Part Status: Active
Description: MPC5748G ETHERNET GATEWAY
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5748G
Part Status: Active
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 910.08 EUR |
| BC859CW/ZL115 |
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Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
auf Bestellung 280999 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 15000+ | 0.035 EUR |
| MKV46F128VLL16 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
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| A2I20D020GNR1 |
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Hersteller: NXP USA Inc.
Description: IC AMP W-CDMA 1.4-2.2GHZ TO270WB
Packaging: Tape & Reel (TR)
Package / Case: TO-270-17 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 1.4GHz ~ 2.2GHz
RF Type: W-CDMA
Voltage - Supply: 28V
Gain: 35dB
Test Frequency: 2.2GHz
Supplier Device Package: TO-270WB-17
Description: IC AMP W-CDMA 1.4-2.2GHZ TO270WB
Packaging: Tape & Reel (TR)
Package / Case: TO-270-17 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 1.4GHz ~ 2.2GHz
RF Type: W-CDMA
Voltage - Supply: 28V
Gain: 35dB
Test Frequency: 2.2GHz
Supplier Device Package: TO-270WB-17
Produkt ist nicht verfügbar
Im Einkaufswagen
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| SPC5645SF1VLUR |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1.064M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4d
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 128
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1.064M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4d
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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| LS1043AXE7KQA |
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Hersteller: NXP USA Inc.
Description: QORIQ 4XCPU 64-BIT ARM ARCH 1.
Description: QORIQ 4XCPU 64-BIT ARM ARCH 1.
Produkt ist nicht verfügbar
Im Einkaufswagen
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| BF821/DG/B2215 |
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Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 800mV @ 5mA, 30mA
Current - Collector Cutoff (Max): 10nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 25mA, 20V
Frequency - Transition: 60MHz
Supplier Device Package: SOT-23-3 (TO-236)
Grade: Automotive
Current - Collector (Ic) (Max): 50 mA
Voltage - Collector Emitter Breakdown (Max): 300 V
Power - Max: 250 mW
Qualification: AEC-Q101
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 800mV @ 5mA, 30mA
Current - Collector Cutoff (Max): 10nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 25mA, 20V
Frequency - Transition: 60MHz
Supplier Device Package: SOT-23-3 (TO-236)
Grade: Automotive
Current - Collector (Ic) (Max): 50 mA
Voltage - Collector Emitter Breakdown (Max): 300 V
Power - Max: 250 mW
Qualification: AEC-Q101
Produkt ist nicht verfügbar
Im Einkaufswagen
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| PCA9450CHNY |
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Hersteller: NXP USA Inc.
Description: PMIC I.MX 8M MINI/NANO/PLUS HVQF
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.85V ~ 5.5V
Applications: General Purpose
Current - Supply: 20µA
Supplier Device Package: 56-HVQFN (7x7)
Description: PMIC I.MX 8M MINI/NANO/PLUS HVQF
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.85V ~ 5.5V
Applications: General Purpose
Current - Supply: 20µA
Supplier Device Package: 56-HVQFN (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen
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| PCA9450CHNY |
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Hersteller: NXP USA Inc.
Description: PMIC I.MX 8M MINI/NANO/PLUS HVQF
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.85V ~ 5.5V
Applications: General Purpose
Current - Supply: 20µA
Supplier Device Package: 56-HVQFN (7x7)
Description: PMIC I.MX 8M MINI/NANO/PLUS HVQF
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.85V ~ 5.5V
Applications: General Purpose
Current - Supply: 20µA
Supplier Device Package: 56-HVQFN (7x7)
auf Bestellung 173 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 9.15 EUR |
| 10+ | 7.01 EUR |
| 25+ | 6.47 EUR |
| 100+ | 5.88 EUR |
| LPC1820FBD144,551 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 168K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Discontinued at Digi-Key
Number of I/O: 83
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 168K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Discontinued at Digi-Key
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BZX84-B9V1/LF1R |
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Hersteller: NXP USA Inc.
Description: DIODE ZENER 9.1V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±2%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 500 nA @ 6 V
Grade: Automotive
Qualification: AEC-Q101
Description: DIODE ZENER 9.1V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±2%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 500 nA @ 6 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
Im Einkaufswagen
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| 74LVC1G19GW-Q100125 |
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Hersteller: NXP USA Inc.
Description: DECODER/DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Description: DECODER/DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74LVC1G19GS132 |
Hersteller: NXP USA Inc.
Description: DECODER/DRIVER, LVC/LCX/Z SERIE
Packaging: Bulk
Part Status: Active
Description: DECODER/DRIVER, LVC/LCX/Z SERIE
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BLF8G10LS-160,112 |
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Hersteller: NXP USA Inc.
Description: RF PFET, 1-ELEMENT, ULTRA HIGH F
Description: RF PFET, 1-ELEMENT, ULTRA HIGH F
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)Im Einkaufswagen Stück im Wert von UAH
| MC908QY4CDWER518 |
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Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MPF5024AMBA0ES |
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 4
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Description: POWER MANAGEMENT IC, PRE-PROG, 4
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 11.14 EUR |
| 10+ | 8.6 EUR |
| 25+ | 7.97 EUR |
| 100+ | 7.27 EUR |
| 490+ | 6.74 EUR |
| 74HCT4066PW-Q100118 |
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Hersteller: NXP USA Inc.
Description: DIFFERENTIAL MUX
Packaging: Bulk
Part Status: Active
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 95Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 14-TSSOP
Voltage - Supply, Single (V+): 4.5V ~ 5.5V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 3Ohm
Switch Time (Ton, Toff) (Max): 20ns, 30ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 1µA
Grade: Automotive
Number of Circuits: 4
Qualification: AEC-Q100
Description: DIFFERENTIAL MUX
Packaging: Bulk
Part Status: Active
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 95Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 14-TSSOP
Voltage - Supply, Single (V+): 4.5V ~ 5.5V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 3Ohm
Switch Time (Ton, Toff) (Max): 20ns, 30ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 1µA
Grade: Automotive
Number of Circuits: 4
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 74HCT4066PW/C118 |
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auf Bestellung 3500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2404+ | 0.21 EUR |
| NTP52101G0JHKZ |
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Hersteller: NXP USA Inc.
Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: PWM
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 5.5V
Standards: NFC, ISO 15693
Supplier Device Package: 16-XQFN (1.8x2.6)
Part Status: Active
Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: PWM
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 5.5V
Standards: NFC, ISO 15693
Supplier Device Package: 16-XQFN (1.8x2.6)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| NTP52101G0JHKZ |
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Hersteller: NXP USA Inc.
Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: PWM
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 5.5V
Standards: NFC, ISO 15693
Supplier Device Package: 16-XQFN (1.8x2.6)
Part Status: Active
Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: PWM
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 5.5V
Standards: NFC, ISO 15693
Supplier Device Package: 16-XQFN (1.8x2.6)
Part Status: Active
auf Bestellung 5065 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 9+ | 2.09 EUR |
| 10+ | 1.8 EUR |
| 25+ | 1.69 EUR |
| 100+ | 1.55 EUR |
| 250+ | 1.47 EUR |
| 500+ | 1.41 EUR |
| 1000+ | 1.35 EUR |
| NTP53121G0JHKZ |
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Hersteller: NXP USA Inc.
Description: RFID NTAG5 XQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-XQFN (1.8x2.6)
Part Status: Active
Size / Dimension: 0.071" L x 0.102" W (1.80mm x 2.60mm)
Memory Type: Read/Write
Writable Memory: 16kb (User)
Description: RFID NTAG5 XQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-XQFN (1.8x2.6)
Part Status: Active
Size / Dimension: 0.071" L x 0.102" W (1.80mm x 2.60mm)
Memory Type: Read/Write
Writable Memory: 16kb (User)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| NTP53121G0JHKZ |
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Hersteller: NXP USA Inc.
Description: RFID NTAG5 XQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-XQFN (1.8x2.6)
Part Status: Active
Size / Dimension: 0.071" L x 0.102" W (1.80mm x 2.60mm)
Memory Type: Read/Write
Writable Memory: 16kb (User)
Description: RFID NTAG5 XQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-XQFN (1.8x2.6)
Part Status: Active
Size / Dimension: 0.071" L x 0.102" W (1.80mm x 2.60mm)
Memory Type: Read/Write
Writable Memory: 16kb (User)
auf Bestellung 533 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 8+ | 2.32 EUR |
| 10+ | 2 EUR |
| 25+ | 1.88 EUR |
| 100+ | 1.73 EUR |
| 250+ | 1.63 EUR |
| 500+ | 1.57 EUR |
| NTP53321G0JHK |
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Hersteller: NXP USA Inc.
Description: RFID NTAG5 XQFN
Packaging: Tape & Reel (TR)
Size / Dimension: 0.071" L x 0.102" W (1.80mm x 2.60mm)
Frequency: 13.56MHz
Memory Type: Read/Write
Operating Temperature: -40°C ~ 85°C
Standards: ISO 15693, NFC
Writable Memory: 16kb (User)
Description: RFID NTAG5 XQFN
Packaging: Tape & Reel (TR)
Size / Dimension: 0.071" L x 0.102" W (1.80mm x 2.60mm)
Frequency: 13.56MHz
Memory Type: Read/Write
Operating Temperature: -40°C ~ 85°C
Standards: ISO 15693, NFC
Writable Memory: 16kb (User)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| NTP53321G0JHK |
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Hersteller: NXP USA Inc.
Description: RFID NTAG5 XQFN
Packaging: Cut Tape (CT)
Size / Dimension: 0.071" L x 0.102" W (1.80mm x 2.60mm)
Frequency: 13.56MHz
Memory Type: Read/Write
Operating Temperature: -40°C ~ 85°C
Standards: ISO 15693, NFC
Writable Memory: 16kb (User)
Description: RFID NTAG5 XQFN
Packaging: Cut Tape (CT)
Size / Dimension: 0.071" L x 0.102" W (1.80mm x 2.60mm)
Frequency: 13.56MHz
Memory Type: Read/Write
Operating Temperature: -40°C ~ 85°C
Standards: ISO 15693, NFC
Writable Memory: 16kb (User)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| NTA53321G0FTTZ |
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Hersteller: NXP USA Inc.
Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-TSSOP
Part Status: Active
Size / Dimension: 0.173" L x 0.197" W (4.40mm x 5.00mm)
Memory Type: Read/Write
Writable Memory: 16kb (User)
Description: NTAG
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 5.5V
Standards: ISO 15693, NFC
Supplier Device Package: 16-TSSOP
Part Status: Active
Size / Dimension: 0.173" L x 0.197" W (4.40mm x 5.00mm)
Memory Type: Read/Write
Writable Memory: 16kb (User)
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2500+ | 1.49 EUR |
| NTAGFCL5LEDM |
Hersteller: NXP USA Inc.
Description: DEV TOOL NFC NTAG
Description: DEV TOOL NFC NTAG
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BLF888DU112 |
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Hersteller: NXP USA Inc.
Description: UHF POWER LDMOS TRANSISTOR, SOT5
Description: UHF POWER LDMOS TRANSISTOR, SOT5
auf Bestellung 141 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 485.99 EUR |
| BLF888D112 |
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auf Bestellung 122 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 402.69 EUR |
| BLF888DS112 |
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auf Bestellung 40 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 400.52 EUR |
| BLM7G1822S-20PB518 |
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auf Bestellung 594 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 13+ | 39.76 EUR |
| 74LV367PW,118 |
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Hersteller: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 16-TSSOP
Description: IC BUF NON-INVERT 3.6V 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 16-TSSOP
auf Bestellung 4910 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1025+ | 0.47 EUR |
| 74LV367D,112 |
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Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 16SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 16-SO
Description: IC BUFFER NON-INVERT 3.6V 16SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 16-SO
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1025+ | 0.48 EUR |
| LX2160A-RDB-B |
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Hersteller: NXP USA Inc.
Description: EVAL BOARD LX2160A REV B
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Accessories
Core Processor: ARM® Cortex®-A72
Utilized IC / Part: LX2160A
Description: EVAL BOARD LX2160A REV B
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Accessories
Core Processor: ARM® Cortex®-A72
Utilized IC / Part: LX2160A
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