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OM13059UL OM13059UL NXP USA Inc. LPC185x,3x,2x,1x.pdf Description: FLEX CAMERA INTERFACE SOLUTION
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FXLS8471QR1 FXLS8471QR1 NXP USA Inc. FXLS8471Q.pdf Description: ACCELEROMETER 2-8G I2C/SPI 16QFN
Part Status: Obsolete
Sensitivity (LSB/g): 4096 (±2g) ~ 1024 (±8g)
Supplier Device Package: 16-QFN (3x3)
Bandwidth: 0.78Hz ~ 400Hz
Voltage - Supply: 1.95V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Acceleration Range: ±2g, 4g, 8g
Axis: X, Y, Z
Type: Digital
Mounting Type: Surface Mount
Output Type: I²C, SPI
Package / Case: 16-VFQFN
Features: Adjustable Bandwidth, Selectable Low Pass Filter, Selectable Scale
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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TWR-KV10Z32 TWR-KV10Z32 NXP USA Inc. Description: TOWER SYSTEM KV1X EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: KV1x
Platform: Tower System
Produkt ist nicht verfügbar
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MKW01Z128CHN MKW01Z128CHN NXP USA Inc. MKW01Z128.pdf Description: IC RF TXRX+MCU ISM<1GHZ 60VFLGA
Produkt ist nicht verfügbar
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MRB-KW019030JA MRB-KW019030JA NXP USA Inc. MKW01Z128.pdf Description: DEV TOOL FOR KW SERIES MCU
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TEA1708T/1J TEA1708T/1J NXP USA Inc. TEA1708T.pdf Description: IC AUTOMATIC DISCHARGE 8-SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Automatic Discharge
Supplier Device Package: 8-SO
Part Status: Active
DigiKey Programmable: Not Verified
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13+1.64 EUR
25+1.49 EUR
100+1.32 EUR
250+1.24 EUR
500+1.19 EUR
1000+1.17 EUR
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MPL3115A2R1 MPL3115A2R1 NXP USA Inc. MPL3115A2.pdf Description: SENSOR 15.95PSIA 24BIT 8LGA
Part Status: Obsolete
Maximum Pressure: 72.52PSI (500kPa)
Port Style: No Port
Supplier Device Package: 8-LGA (3x5)
Applications: Board Mount
Voltage - Supply: 1.95V ~ 3.6V
Termination Style: SMD (SMT) Tab
Operating Temperature: -40°C ~ 85°C
Accuracy: ±0.058PSI (±0.4kPa)
Pressure Type: Absolute
Operating Pressure: 7.25PSI ~ 15.95PSI (50kPa ~ 110kPa)
Output: 24 b
Mounting Type: Surface Mount
Output Type: I2C
Package / Case: 8-TLGA
Features: Temperature Compensated
Packaging: Cut Tape (CT)
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NX5P3001UKZ NX5P3001UKZ NXP USA Inc. NX5P3001.pdf Description: IC PWR SWITCH N-CHAN 1:1 12WLCSP
Part Status: Active
Fault Protection: Current Limiting (Adjustable), Over Temperature, UVLO
Supplier Device Package: 12-WLCSP (1.6x1.3)
Ratio - Input:Output: 1:1
Current - Output (Max): 3A
Voltage - Load: 3V ~ 30V
Input Type: Non-Inverting
Rds On (Typ): 62mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TJ)
Switch Type: USB Switch
Interface: On/Off
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 12-UFBGA, WLCSP
Features: Slew Rate Controlled
Packaging: Tape & Reel (TR)
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NX5P2924BUKZ NX5P2924BUKZ NXP USA Inc. NX5P2924B.pdf Description: IC PWR SWITCH N-CHAN 1:1 6WLCSP
Supplier Device Package: 6-WLCSP (0.87x1.37)
Ratio - Input:Output: 1:1
Current - Output (Max): 2.5A
Voltage - Supply (Vcc/Vdd): Not Required
Voltage - Load: 0.8V ~ 5.5V
Input Type: Non-Inverting
Rds On (Typ): 14mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TJ)
Switch Type: General Purpose
Interface: On/Off
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 6-XFBGA, WLCSP
Features: Load Discharge, Slew Rate Controlled
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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NX5P2924UKZ NX5P2924UKZ NXP USA Inc. NX5P2924.pdf Description: IC PWR SWITCH N-CHAN 1:1 6WLCSP
Part Status: Obsolete
Supplier Device Package: 6-WLCSP (0.87x1.37)
Ratio - Input:Output: 1:1
Current - Output (Max): 2.5A
Voltage - Supply (Vcc/Vdd): Not Required
Voltage - Load: 0.8V ~ 5.5V
Input Type: Non-Inverting
Rds On (Typ): 14mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TJ)
Switch Type: General Purpose
Interface: On/Off
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 6-UFBGA, WLCSP
Features: Load Discharge, Slew Rate Controlled
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NX18P3001UKZ NX18P3001UKZ NXP USA Inc. NX18P3001.pdf Description: IC PWR SWITCH ESD PROT 12WLCSP
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NX5P2090UKZ NX5P2090UKZ NXP USA Inc. NX5P2090.pdf Description: IC PWR SWITCH N-CHAN 1:1 9WLCSP
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO
Supplier Device Package: 9-WLCSP (1.3x1.3)
Ratio - Input:Output: 1:1
Current - Output (Max): 2A
Voltage - Supply (Vcc/Vdd): Not Required
Voltage - Load: 3V ~ 5.5V
Input Type: Non-Inverting
Rds On (Typ): 60mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TJ)
Switch Type: USB Switch
Interface: On/Off
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 9-UFBGA, WLCSP
Features: Slew Rate Controlled
Packaging: Tape & Reel (TR)
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NX5P3001UKZ NX5P3001UKZ NXP USA Inc. NX5P3001.pdf Description: IC PWR SWITCH N-CHAN 1:1 12WLCSP
Part Status: Active
Fault Protection: Current Limiting (Adjustable), Over Temperature, UVLO
Supplier Device Package: 12-WLCSP (1.6x1.3)
Ratio - Input:Output: 1:1
Current - Output (Max): 3A
Voltage - Load: 3V ~ 30V
Input Type: Non-Inverting
Rds On (Typ): 62mOhm
Output Configuration: High Side
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 12-UFBGA, WLCSP
Features: Slew Rate Controlled
Packaging: Cut Tape (CT)
Operating Temperature: -40°C ~ 125°C (TJ)
Switch Type: USB Switch
Interface: On/Off
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250+1.7 EUR
500+1.63 EUR
1000+1.62 EUR
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NX5P2090UKZ NX5P2090UKZ NXP USA Inc. NX5P2090.pdf Description: IC PWR SWITCH N-CHAN 1:1 9WLCSP
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO
Supplier Device Package: 9-WLCSP (1.3x1.3)
Ratio - Input:Output: 1:1
Current - Output (Max): 2A
Voltage - Supply (Vcc/Vdd): Not Required
Voltage - Load: 3V ~ 5.5V
Input Type: Non-Inverting
Rds On (Typ): 60mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TJ)
Switch Type: USB Switch
Interface: On/Off
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 9-UFBGA, WLCSP
Features: Slew Rate Controlled
Packaging: Cut Tape (CT)
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TWR-SHIELD TWR-SHIELD NXP USA Inc. TWRSHIELDQSG.pdf Description: ADAPTER MODULE TOWER SHIELD
Utilized IC / Part: Arduino Board
Accessory Type: Adapter Board
For Use With/Related Products: Arduino Board
Packaging: Box
Produkt ist nicht verfügbar
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MMPF0200F3AEP MMPF0200F3AEP NXP USA Inc. MMPF0200.pdf Description: IC REG CONV I.MX6 11OUT 56HVQFN
Supplier Device Package: 56-HVQFN (8x8)
Applications: Converter, i.MX6
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Input: 2.8V ~ 4.5V
Number of Outputs: 11
Mounting Type: Surface Mount
Voltage - Output: Multiple
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
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MMPF0200F4AEP MMPF0200F4AEP NXP USA Inc. MMPF0200.pdf Description: IC REG CONV I.MX6 11OUT 56HVQFN
Part Status: Active
Supplier Device Package: 56-HVQFN (8x8)
Applications: Converter, i.MX6
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Input: 2.8V ~ 4.5V
Number of Outputs: 11
Mounting Type: Surface Mount
Voltage - Output: Multiple
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
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PCA8547AHT/AY PCA8547AHT/AY NXP USA Inc. PCA8547.pdf Description: IC DRVR 7 SEGMENT 64TQFP
Current - Supply: 90 µA
Part Status: Active
Supplier Device Package: 64-TQFP (10x10)
Digits or Characters: 11 Characters, 22 Characters, 176 Elements
Voltage - Supply: 1.8V ~ 5.5V
Operating Temperature: -40°C ~ 95°C
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Interface: I2C
Mounting Type: Surface Mount
Display Type: LCD
Package / Case: 64-TQFP
Packaging: Tape & Reel (TR)
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PCA8547BHT/AY PCA8547BHT/AY NXP USA Inc. PCA8547.pdf Description: IC DRVR 7 SEGMENT 64TQFP
Current - Supply: 90 µA
Part Status: Obsolete
Supplier Device Package: 64-TQFP (10x10)
Digits or Characters: 11 Characters, 22 Characters, 176 Elements
Voltage - Supply: 1.8V ~ 5.5V
Operating Temperature: -40°C ~ 95°C
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Interface: SPI
Mounting Type: Surface Mount
Display Type: LCD
Package / Case: 64-TQFP
Packaging: Tape & Reel (TR)
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PCA85276ATT/AJ PCA85276ATT/AJ NXP USA Inc. PCA85276.pdf Description: IC DRVR 7 SEGMENT 56TSSOP
Current - Supply: 6 µA
Part Status: Obsolete
Supplier Device Package: 56-TSSOP
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Operating Temperature: -40°C ~ 105°C
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Interface: I2C
Mounting Type: Surface Mount
Display Type: LCD
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Packaging: Tape & Reel (TR)
Voltage - Supply: 1.8V ~ 5.5V
Produkt ist nicht verfügbar
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PCA85262ATT/AJ PCA85262ATT/AJ NXP USA Inc. PCA85262.pdf Description: IC DRVR 7 SEGMENT 48TSSOP
Current - Supply: 6 µA
Supplier Device Package: 48-TSSOP
Digits or Characters: 8 Characters, 16 Characters, 128 Elements
Voltage - Supply: 1.8V ~ 5.5V
Operating Temperature: -40°C ~ 105°C
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Interface: I2C
Mounting Type: Surface Mount
Display Type: LCD
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FRDM-KE02Z40M FRDM-KE02Z40M NXP USA Inc. KinetisMCUs_PB.pdf Description: FREEDOM KE02 EVAL BRD
Part Status: Active
Platform: Freedom
Utilized IC / Part: KE02
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-M0+
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
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FRDM-KE04Z FRDM-KE04Z NXP USA Inc. FRDM-KE04ZUG.pdf Description: FREEDOM KE04 EVAL BRD
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-M0+
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Part Status: Active
Platform: Freedom
Utilized IC / Part: KE04
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FRDM-KE06Z FRDM-KE06Z NXP USA Inc. FRDMKE06UG.pdf Description: FREEDOM KE06 EVAL BRD
Platform: Freedom
Utilized IC / Part: KE06
Core Processor: ARM® Cortex®-M0+
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
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LPC11E68JBD100E LPC11E68JBD100E NXP USA Inc. LPC11E6X.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 80
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 36K x 8
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LPC11E67JBD48E LPC11E67JBD48E NXP USA Inc. LPC11E6X.pdf Description: IC MCU 32BIT 128KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 36
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 20K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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LPC11E68JBD64E LPC11E68JBD64E NXP USA Inc. LPC11E6X.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Number of I/O: 50
Part Status: Discontinued at Digi-Key
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 36K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
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MC33742PEGR2 MC33742PEGR2 NXP USA Inc. MC33742.pdf Description: IC INTERFACE SPECIALIZED 28SOIC
Grade: Automotive
Supplier Device Package: 28-SOIC
Voltage - Supply: 5.5V ~ 18V
Interface: SPI Serial
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Packaging: Cut Tape (CT)
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MC33742SPEGR2 MC33742SPEGR2 NXP USA Inc. Description: IC INTERFACE SPECIALIZED 28SOIC
Supplier Device Package: 28-SOIC
Voltage - Supply: 5.5V ~ 18V
Interface: SPI Serial
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Packaging: Cut Tape (CT)
Grade: Automotive
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FRDM-K64F FRDM-K64F NXP USA Inc. K64P144M120SF5.pdf Description: FREEDOM K24/K63/K64 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: K24, K63, K64
Platform: Freedom
Part Status: Active
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LPC11A14JBD48/30QL LPC11A14JBD48/30QL NXP USA Inc. LPC11AXX.pdf Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
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LPC1114JHI33/303E LPC1114JHI33/303E NXP USA Inc. LPC1102_1104.pdf Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
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LPC1111JHN33/103E LPC1111JHN33/103E NXP USA Inc. LPC111X.pdf Description: IC MCU 32BIT 8KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Tray
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LPC1114JHN33/303E LPC1114JHN33/303E NXP USA Inc. LPC111X.pdf Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1114JBD48/333QL LPC1114JBD48/333QL NXP USA Inc. LPC1102_1104.pdf Description: IC MCU 32BIT 56KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 56KB (56K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
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LPC1115JBD48/303QL LPC1115JBD48/303QL NXP USA Inc. LPC1102_1104.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 42
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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LPC1115JET48/303QL LPC1115JET48/303QL NXP USA Inc. LPC111X.pdf Description: IC MCU 32BIT 64KB FLASH 48TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 42
Part Status: Active
Supplier Device Package: 48-TFBGA (4.5x4.5)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-TFBGA
Packaging: Tray
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CBTL05024BSHP CBTL05024BSHP NXP USA Inc. CBTL05024.pdf Description: IC MUX/DEMUX SWITCH CHIP 24HVQFN
Number of Channels: 2
Part Status: Obsolete
Multiplexer/Demultiplexer Circuit: 3:1, 2:1
Voltage - Supply, Single (V+): 3V ~ 3.6V
Supplier Device Package: 24-HVQFN (3x3)
-3db Bandwidth: 10GHz
Applications: Thunderbolt
Operating Temperature: -20°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MK22DX128VMC5 MK22DX128VMC5 NXP USA Inc. K22P121M50SF4.pdf Description: IC MCU 32B 128KB FLASH 121MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 56
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tray
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MK22DX256VMC5 MK22DX256VMC5 NXP USA Inc. K22P121M50SF4.pdf Description: IC MCU 32B 256KB FLASH 121MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 56
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MK22FN128VLH10 MK22FN128VLH10 NXP USA Inc. K22FPB_Rev.5_Mar3%2C2014_PB.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 40
DigiKey Programmable: Not Verified
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2+13.17 EUR
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100+8.57 EUR
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MK22FN128VLL10 MK22FN128VLL10 NXP USA Inc. K22FPB_Rev.5_Mar3%2C2014_PB.pdf Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 33x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 66
DigiKey Programmable: Not Verified
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MK22FN128VMP10 MK22FN128VMP10 NXP USA Inc. K22FPB_Rev.5_Mar3%2C2014_PB.pdf Description: IC MCU 32BIT 128KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Number of I/O: 40
DigiKey Programmable: Not Verified
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100+8.1 EUR
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MK22FN256VDC12 MK22FN256VDC12 NXP USA Inc. K22P121M120SF8.pdf Description: IC MCU 32BIT 256KB FLASH 121BGA
Packaging: Tray
Package / Case: 121-XFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 36x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-BGA (10x10)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
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100+15.82 EUR
348+14.96 EUR
696+14.6 EUR
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MK22FN512VDC12 MK22FN512VDC12 NXP USA Inc. K22P121M120SF7.pdf Description: IC MCU 32BIT 512KB FLSH 121XFBGA
Packaging: Tray
Package / Case: 121-XFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-XFBGA (8x8)
Number of I/O: 81
DigiKey Programmable: Not Verified
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1044+12.91 EUR
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MK50DX256CMD10 MK50DX256CMD10 NXP USA Inc. K50PB.pdf Description: IC MCU 32B 256KB FLASH 144MAPBGA
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 144-LBGA
Packaging: Tray
Number of I/O: 96
Part Status: Active
Supplier Device Package: 144-MAPBGA (13x13)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 41x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKL03Z16VFG4 MKL03Z16VFG4 NXP USA Inc. KL03P24M48SF0.pdf Description: IC MCU 32BIT 16KB FLASH 16QFN
DigiKey Programmable: Not Verified
Number of I/O: 14
Part Status: Active
Supplier Device Package: 16-QFN (3x3)
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 7x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 16-UFQFN Exposed Pad
Packaging: Tray
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6+4.14 EUR
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25+2.78 EUR
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MKL03Z16VFK4 MKL03Z16VFK4 NXP USA Inc. KL03P24M48SF0.pdf Description: IC MCU 32BIT 16KB FLASH 24QFN
DigiKey Programmable: Not Verified
Number of I/O: 22
Supplier Device Package: 24-QFN (4x4)
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 7x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tray
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4+6.26 EUR
10+4.09 EUR
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MKL03Z32VFG4 MKL03Z32VFG4 NXP USA Inc. KL03P24M48SF0.pdf Description: IC MCU 32BIT 32KB FLASH 16QFN
Packaging: Tray
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 7x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN (3x3)
Number of I/O: 14
DigiKey Programmable: Not Verified
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MKL03Z32VFK4 MKL03Z32VFK4 NXP USA Inc. KL03P24M48SF0.pdf Description: IC MCU 32BIT 32KB FLASH 24QFN
DigiKey Programmable: Not Verified
Number of I/O: 22
Supplier Device Package: 24-QFN (4x4)
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 7x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tray
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5+5.09 EUR
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100+3.11 EUR
490+2.83 EUR
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MKL03Z8VFG4 MKL03Z8VFG4 NXP USA Inc. KL03P24M48SF0.pdf Description: IC MCU 32BIT 8KB FLASH 16QFN
DigiKey Programmable: Not Verified
Number of I/O: 14
Supplier Device Package: 16-QFN (3x3)
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 7x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 16-UFQFN Exposed Pad
Packaging: Tray
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10+2.26 EUR
13+1.67 EUR
25+1.51 EUR
80+1.45 EUR
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MKL03Z8VFK4 MKL03Z8VFK4 NXP USA Inc. KL03P24M48SF0.pdf Description: IC MCU 32BIT 8KB FLASH 24QFN
Number of I/O: 22
Part Status: Active
Supplier Device Package: 24-QFN (4x4)
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 7x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 24-UFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MK10DX256VLH7R MK10DX256VLH7R NXP USA Inc. K10P64M72SF1.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 44
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 26x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MK20DX256VMC7R MK20DX256VMC7R NXP USA Inc. K20P100M72SF1.pdf Description: IC MCU 32B 256KB FLASH 121MAPBGA
Produkt ist nicht verfügbar
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MK50DX128CLH7R MK50DX128CLH7R NXP USA Inc. K50PB.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 35
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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MKL03Z32CAF4R MKL03Z32CAF4R NXP USA Inc. KL03P24M48SF0.pdf Description: IC MCU 32BIT 32KB FLASH 20WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 20-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 7x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 20-WLCSP (2x1.61)
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
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5000+3.18 EUR
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MK10DX256VLH7R MK10DX256VLH7R NXP USA Inc. K10P64M72SF1.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 26x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
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MK50DX128CLH7R MK50DX128CLH7R NXP USA Inc. K50PB.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 35
DigiKey Programmable: Verified
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MKL03Z32CAF4R MKL03Z32CAF4R NXP USA Inc. KL03P24M48SF0.pdf Description: IC MCU 32BIT 32KB FLASH 20WLCSP
Packaging: Cut Tape (CT)
Package / Case: 20-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 7x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 20-WLCSP (2x1.61)
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
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HEF4025BT,653 HEF4025BT,653 NXP USA Inc. HEF4025B.pdf Description: IC GATE NOR 3CH 3-INP 14SO
Number of Circuits: 3
Part Status: Obsolete
Max Propagation Delay @ V, Max CL: 40ns @ 15V, 50pF
Supplier Device Package: 14-SO
Number of Inputs: 3
Current - Output High, Low: 2.4mA, 2.4mA
Voltage - Supply: 3V ~ 15V
Operating Temperature: -40°C ~ 85°C
Logic Type: NOR Gate
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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OM13059UL LPC185x,3x,2x,1x.pdf
OM13059UL
Hersteller: NXP USA Inc.
Description: FLEX CAMERA INTERFACE SOLUTION
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FXLS8471QR1 FXLS8471Q.pdf
FXLS8471QR1
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 2-8G I2C/SPI 16QFN
Part Status: Obsolete
Sensitivity (LSB/g): 4096 (±2g) ~ 1024 (±8g)
Supplier Device Package: 16-QFN (3x3)
Bandwidth: 0.78Hz ~ 400Hz
Voltage - Supply: 1.95V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Acceleration Range: ±2g, 4g, 8g
Axis: X, Y, Z
Type: Digital
Mounting Type: Surface Mount
Output Type: I²C, SPI
Package / Case: 16-VFQFN
Features: Adjustable Bandwidth, Selectable Low Pass Filter, Selectable Scale
Packaging: Cut Tape (CT)
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TWR-KV10Z32
TWR-KV10Z32
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM KV1X EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: KV1x
Platform: Tower System
Produkt ist nicht verfügbar
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MKW01Z128CHN MKW01Z128.pdf
MKW01Z128CHN
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU ISM<1GHZ 60VFLGA
Produkt ist nicht verfügbar
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MRB-KW019030JA MKW01Z128.pdf
MRB-KW019030JA
Hersteller: NXP USA Inc.
Description: DEV TOOL FOR KW SERIES MCU
Produkt ist nicht verfügbar
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TEA1708T/1J TEA1708T.pdf
TEA1708T/1J
Hersteller: NXP USA Inc.
Description: IC AUTOMATIC DISCHARGE 8-SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Automatic Discharge
Supplier Device Package: 8-SO
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 3080 Stücke:
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10+2.28 EUR
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25+1.49 EUR
100+1.32 EUR
250+1.24 EUR
500+1.19 EUR
1000+1.17 EUR
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MPL3115A2R1 MPL3115A2.pdf
MPL3115A2R1
Hersteller: NXP USA Inc.
Description: SENSOR 15.95PSIA 24BIT 8LGA
Part Status: Obsolete
Maximum Pressure: 72.52PSI (500kPa)
Port Style: No Port
Supplier Device Package: 8-LGA (3x5)
Applications: Board Mount
Voltage - Supply: 1.95V ~ 3.6V
Termination Style: SMD (SMT) Tab
Operating Temperature: -40°C ~ 85°C
Accuracy: ±0.058PSI (±0.4kPa)
Pressure Type: Absolute
Operating Pressure: 7.25PSI ~ 15.95PSI (50kPa ~ 110kPa)
Output: 24 b
Mounting Type: Surface Mount
Output Type: I2C
Package / Case: 8-TLGA
Features: Temperature Compensated
Packaging: Cut Tape (CT)
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NX5P3001UKZ NX5P3001.pdf
NX5P3001UKZ
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 12WLCSP
Part Status: Active
Fault Protection: Current Limiting (Adjustable), Over Temperature, UVLO
Supplier Device Package: 12-WLCSP (1.6x1.3)
Ratio - Input:Output: 1:1
Current - Output (Max): 3A
Voltage - Load: 3V ~ 30V
Input Type: Non-Inverting
Rds On (Typ): 62mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TJ)
Switch Type: USB Switch
Interface: On/Off
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 12-UFBGA, WLCSP
Features: Slew Rate Controlled
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NX5P2924BUKZ NX5P2924B.pdf
NX5P2924BUKZ
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 6WLCSP
Supplier Device Package: 6-WLCSP (0.87x1.37)
Ratio - Input:Output: 1:1
Current - Output (Max): 2.5A
Voltage - Supply (Vcc/Vdd): Not Required
Voltage - Load: 0.8V ~ 5.5V
Input Type: Non-Inverting
Rds On (Typ): 14mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TJ)
Switch Type: General Purpose
Interface: On/Off
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 6-XFBGA, WLCSP
Features: Load Discharge, Slew Rate Controlled
Packaging: Tape & Reel (TR)
Part Status: Obsolete
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NX5P2924UKZ NX5P2924.pdf
NX5P2924UKZ
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 6WLCSP
Part Status: Obsolete
Supplier Device Package: 6-WLCSP (0.87x1.37)
Ratio - Input:Output: 1:1
Current - Output (Max): 2.5A
Voltage - Supply (Vcc/Vdd): Not Required
Voltage - Load: 0.8V ~ 5.5V
Input Type: Non-Inverting
Rds On (Typ): 14mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TJ)
Switch Type: General Purpose
Interface: On/Off
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 6-UFBGA, WLCSP
Features: Load Discharge, Slew Rate Controlled
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NX18P3001UKZ NX18P3001.pdf
NX18P3001UKZ
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH ESD PROT 12WLCSP
Produkt ist nicht verfügbar
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NX5P2090UKZ NX5P2090.pdf
NX5P2090UKZ
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 9WLCSP
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO
Supplier Device Package: 9-WLCSP (1.3x1.3)
Ratio - Input:Output: 1:1
Current - Output (Max): 2A
Voltage - Supply (Vcc/Vdd): Not Required
Voltage - Load: 3V ~ 5.5V
Input Type: Non-Inverting
Rds On (Typ): 60mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TJ)
Switch Type: USB Switch
Interface: On/Off
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 9-UFBGA, WLCSP
Features: Slew Rate Controlled
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NX5P3001UKZ NX5P3001.pdf
NX5P3001UKZ
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 12WLCSP
Part Status: Active
Fault Protection: Current Limiting (Adjustable), Over Temperature, UVLO
Supplier Device Package: 12-WLCSP (1.6x1.3)
Ratio - Input:Output: 1:1
Current - Output (Max): 3A
Voltage - Load: 3V ~ 30V
Input Type: Non-Inverting
Rds On (Typ): 62mOhm
Output Configuration: High Side
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 12-UFBGA, WLCSP
Features: Slew Rate Controlled
Packaging: Cut Tape (CT)
Operating Temperature: -40°C ~ 125°C (TJ)
Switch Type: USB Switch
Interface: On/Off
auf Bestellung 1854 Stücke:
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7+3.06 EUR
10+2.24 EUR
25+2.03 EUR
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NX5P2090UKZ NX5P2090.pdf
NX5P2090UKZ
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 9WLCSP
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO
Supplier Device Package: 9-WLCSP (1.3x1.3)
Ratio - Input:Output: 1:1
Current - Output (Max): 2A
Voltage - Supply (Vcc/Vdd): Not Required
Voltage - Load: 3V ~ 5.5V
Input Type: Non-Inverting
Rds On (Typ): 60mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TJ)
Switch Type: USB Switch
Interface: On/Off
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 9-UFBGA, WLCSP
Features: Slew Rate Controlled
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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TWR-SHIELD TWRSHIELDQSG.pdf
TWR-SHIELD
Hersteller: NXP USA Inc.
Description: ADAPTER MODULE TOWER SHIELD
Utilized IC / Part: Arduino Board
Accessory Type: Adapter Board
For Use With/Related Products: Arduino Board
Packaging: Box
Produkt ist nicht verfügbar
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MMPF0200F3AEP MMPF0200.pdf
MMPF0200F3AEP
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 11OUT 56HVQFN
Supplier Device Package: 56-HVQFN (8x8)
Applications: Converter, i.MX6
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Input: 2.8V ~ 4.5V
Number of Outputs: 11
Mounting Type: Surface Mount
Voltage - Output: Multiple
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
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2+14.96 EUR
10+11.59 EUR
25+10.76 EUR
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MMPF0200F4AEP MMPF0200.pdf
MMPF0200F4AEP
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 11OUT 56HVQFN
Part Status: Active
Supplier Device Package: 56-HVQFN (8x8)
Applications: Converter, i.MX6
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Input: 2.8V ~ 4.5V
Number of Outputs: 11
Mounting Type: Surface Mount
Voltage - Output: Multiple
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
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2+14.96 EUR
10+11.59 EUR
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100+9.83 EUR
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PCA8547AHT/AY PCA8547.pdf
PCA8547AHT/AY
Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 64TQFP
Current - Supply: 90 µA
Part Status: Active
Supplier Device Package: 64-TQFP (10x10)
Digits or Characters: 11 Characters, 22 Characters, 176 Elements
Voltage - Supply: 1.8V ~ 5.5V
Operating Temperature: -40°C ~ 95°C
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Interface: I2C
Mounting Type: Surface Mount
Display Type: LCD
Package / Case: 64-TQFP
Packaging: Tape & Reel (TR)
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PCA8547BHT/AY PCA8547.pdf
PCA8547BHT/AY
Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 64TQFP
Current - Supply: 90 µA
Part Status: Obsolete
Supplier Device Package: 64-TQFP (10x10)
Digits or Characters: 11 Characters, 22 Characters, 176 Elements
Voltage - Supply: 1.8V ~ 5.5V
Operating Temperature: -40°C ~ 95°C
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Interface: SPI
Mounting Type: Surface Mount
Display Type: LCD
Package / Case: 64-TQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PCA85276ATT/AJ PCA85276.pdf
PCA85276ATT/AJ
Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 56TSSOP
Current - Supply: 6 µA
Part Status: Obsolete
Supplier Device Package: 56-TSSOP
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Operating Temperature: -40°C ~ 105°C
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Interface: I2C
Mounting Type: Surface Mount
Display Type: LCD
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Packaging: Tape & Reel (TR)
Voltage - Supply: 1.8V ~ 5.5V
Produkt ist nicht verfügbar
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PCA85262ATT/AJ PCA85262.pdf
PCA85262ATT/AJ
Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 48TSSOP
Current - Supply: 6 µA
Supplier Device Package: 48-TSSOP
Digits or Characters: 8 Characters, 16 Characters, 128 Elements
Voltage - Supply: 1.8V ~ 5.5V
Operating Temperature: -40°C ~ 105°C
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Interface: I2C
Mounting Type: Surface Mount
Display Type: LCD
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FRDM-KE02Z40M KinetisMCUs_PB.pdf
FRDM-KE02Z40M
Hersteller: NXP USA Inc.
Description: FREEDOM KE02 EVAL BRD
Part Status: Active
Platform: Freedom
Utilized IC / Part: KE02
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-M0+
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
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1+91.9 EUR
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FRDM-KE04Z FRDM-KE04ZUG.pdf
FRDM-KE04Z
Hersteller: NXP USA Inc.
Description: FREEDOM KE04 EVAL BRD
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-M0+
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Part Status: Active
Platform: Freedom
Utilized IC / Part: KE04
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FRDM-KE06Z FRDMKE06UG.pdf
FRDM-KE06Z
Hersteller: NXP USA Inc.
Description: FREEDOM KE06 EVAL BRD
Platform: Freedom
Utilized IC / Part: KE06
Core Processor: ARM® Cortex®-M0+
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
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1+98.06 EUR
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LPC11E68JBD100E LPC11E6X.pdf
LPC11E68JBD100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 80
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 36K x 8
Produkt ist nicht verfügbar
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LPC11E67JBD48E LPC11E6X.pdf
LPC11E67JBD48E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 36
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 20K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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LPC11E68JBD64E LPC11E6X.pdf
LPC11E68JBD64E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Number of I/O: 50
Part Status: Discontinued at Digi-Key
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 36K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC33742PEGR2 MC33742.pdf
MC33742PEGR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SOIC
Grade: Automotive
Supplier Device Package: 28-SOIC
Voltage - Supply: 5.5V ~ 18V
Interface: SPI Serial
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Packaging: Cut Tape (CT)
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2+15.37 EUR
10+11.9 EUR
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MC33742SPEGR2
MC33742SPEGR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SOIC
Supplier Device Package: 28-SOIC
Voltage - Supply: 5.5V ~ 18V
Interface: SPI Serial
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Packaging: Cut Tape (CT)
Grade: Automotive
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2+14.53 EUR
10+11.21 EUR
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FRDM-K64F K64P144M120SF5.pdf
FRDM-K64F
Hersteller: NXP USA Inc.
Description: FREEDOM K24/K63/K64 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: K24, K63, K64
Platform: Freedom
Part Status: Active
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LPC11A14JBD48/30QL LPC11AXX.pdf
LPC11A14JBD48/30QL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.6V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1114JHI33/303E LPC1102_1104.pdf
LPC1114JHI33/303E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
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LPC1111JHN33/103E LPC111X.pdf
LPC1111JHN33/103E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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LPC1114JHN33/303E LPC111X.pdf
LPC1114JHN33/303E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1114JBD48/333QL LPC1102_1104.pdf
LPC1114JBD48/333QL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 56KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 56KB (56K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
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LPC1115JBD48/303QL LPC1102_1104.pdf
LPC1115JBD48/303QL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 42
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
auf Bestellung 29 Stücke:
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3+8.43 EUR
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LPC1115JET48/303QL LPC111X.pdf
LPC1115JET48/303QL
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48TFBGA
DigiKey Programmable: Not Verified
Number of I/O: 42
Part Status: Active
Supplier Device Package: 48-TFBGA (4.5x4.5)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-TFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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CBTL05024BSHP CBTL05024.pdf
CBTL05024BSHP
Hersteller: NXP USA Inc.
Description: IC MUX/DEMUX SWITCH CHIP 24HVQFN
Number of Channels: 2
Part Status: Obsolete
Multiplexer/Demultiplexer Circuit: 3:1, 2:1
Voltage - Supply, Single (V+): 3V ~ 3.6V
Supplier Device Package: 24-HVQFN (3x3)
-3db Bandwidth: 10GHz
Applications: Thunderbolt
Operating Temperature: -20°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MK22DX128VMC5 K22P121M50SF4.pdf
MK22DX128VMC5
Hersteller: NXP USA Inc.
Description: IC MCU 32B 128KB FLASH 121MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 56
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tray
auf Bestellung 3430 Stücke:
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MK22DX256VMC5 K22P121M50SF4.pdf
MK22DX256VMC5
Hersteller: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 121MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 56
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MK22FN128VLH10 K22FPB_Rev.5_Mar3%2C2014_PB.pdf
MK22FN128VLH10
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 40
DigiKey Programmable: Not Verified
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2+13.17 EUR
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160+8.35 EUR
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MK22FN128VLL10 K22FPB_Rev.5_Mar3%2C2014_PB.pdf
MK22FN128VLL10
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 33x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 66
DigiKey Programmable: Not Verified
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2+13.42 EUR
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MK22FN128VMP10 K22FPB_Rev.5_Mar3%2C2014_PB.pdf
MK22FN128VMP10
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 368 Stücke:
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2+12.46 EUR
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100+8.1 EUR
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MK22FN256VDC12 K22P121M120SF8.pdf
MK22FN256VDC12
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 121BGA
Packaging: Tray
Package / Case: 121-XFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 36x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-BGA (10x10)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
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1+23.51 EUR
10+18.47 EUR
50+16.45 EUR
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696+14.6 EUR
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MK22FN512VDC12 K22P121M120SF7.pdf
MK22FN512VDC12
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 121XFBGA
Packaging: Tray
Package / Case: 121-XFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-XFBGA (8x8)
Number of I/O: 81
DigiKey Programmable: Not Verified
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696+13.08 EUR
1044+12.91 EUR
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MK50DX256CMD10 K50PB.pdf
MK50DX256CMD10
Hersteller: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 144MAPBGA
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 144-LBGA
Packaging: Tray
Number of I/O: 96
Part Status: Active
Supplier Device Package: 144-MAPBGA (13x13)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 41x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKL03Z16VFG4 KL03P24M48SF0.pdf
MKL03Z16VFG4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 16QFN
DigiKey Programmable: Not Verified
Number of I/O: 14
Part Status: Active
Supplier Device Package: 16-QFN (3x3)
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 7x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 16-UFQFN Exposed Pad
Packaging: Tray
auf Bestellung 950 Stücke:
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6+4.14 EUR
10+3.06 EUR
25+2.78 EUR
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MKL03Z16VFK4 KL03P24M48SF0.pdf
MKL03Z16VFK4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 24QFN
DigiKey Programmable: Not Verified
Number of I/O: 22
Supplier Device Package: 24-QFN (4x4)
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 7x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 479 Stücke:
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4+6.26 EUR
10+4.09 EUR
25+3.52 EUR
80+2.98 EUR
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MKL03Z32VFG4 KL03P24M48SF0.pdf
MKL03Z32VFG4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 16QFN
Packaging: Tray
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 7x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN (3x3)
Number of I/O: 14
DigiKey Programmable: Not Verified
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5+4.66 EUR
10+3.46 EUR
50+2.99 EUR
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MKL03Z32VFK4 KL03P24M48SF0.pdf
MKL03Z32VFK4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 24QFN
DigiKey Programmable: Not Verified
Number of I/O: 22
Supplier Device Package: 24-QFN (4x4)
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 7x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 2519 Stücke:
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5+5.09 EUR
10+3.8 EUR
50+3.27 EUR
100+3.11 EUR
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980+2.75 EUR
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MKL03Z8VFG4 KL03P24M48SF0.pdf
MKL03Z8VFG4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 16QFN
DigiKey Programmable: Not Verified
Number of I/O: 14
Supplier Device Package: 16-QFN (3x3)
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 7x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 16-UFQFN Exposed Pad
Packaging: Tray
auf Bestellung 1996 Stücke:
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10+2.26 EUR
13+1.67 EUR
25+1.51 EUR
80+1.45 EUR
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MKL03Z8VFK4 KL03P24M48SF0.pdf
MKL03Z8VFK4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 24QFN
Number of I/O: 22
Part Status: Active
Supplier Device Package: 24-QFN (4x4)
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 7x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 24-UFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MK10DX256VLH7R K10P64M72SF1.pdf
MK10DX256VLH7R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 44
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 26x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MK20DX256VMC7R K20P100M72SF1.pdf
MK20DX256VMC7R
Hersteller: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 121MAPBGA
Produkt ist nicht verfügbar
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MK50DX128CLH7R K50PB.pdf
MK50DX128CLH7R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 35
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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MKL03Z32CAF4R KL03P24M48SF0.pdf
MKL03Z32CAF4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 20WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 20-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 7x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 20-WLCSP (2x1.61)
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
auf Bestellung 5000 Stücke:
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AnzahlPrivatkunde
5000+3.18 EUR
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MK10DX256VLH7R K10P64M72SF1.pdf
MK10DX256VLH7R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 26x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
auf Bestellung 2063 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+14.35 EUR
10+11.66 EUR
25+11.52 EUR
100+11.4 EUR
250+10.75 EUR
500+10.32 EUR
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MK50DX128CLH7R K50PB.pdf
MK50DX128CLH7R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 35
DigiKey Programmable: Verified
auf Bestellung 10 Stücke:
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AnzahlPrivatkunde
1+22.1 EUR
10+17.33 EUR
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MKL03Z32CAF4R KL03P24M48SF0.pdf
MKL03Z32CAF4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 20WLCSP
Packaging: Cut Tape (CT)
Package / Case: 20-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 7x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 20-WLCSP (2x1.61)
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
auf Bestellung 8799 Stücke:
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4+6.26 EUR
10+4.69 EUR
50+4.07 EUR
100+3.87 EUR
500+3.55 EUR
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HEF4025BT,653 HEF4025B.pdf
HEF4025BT,653
Hersteller: NXP USA Inc.
Description: IC GATE NOR 3CH 3-INP 14SO
Number of Circuits: 3
Part Status: Obsolete
Max Propagation Delay @ V, Max CL: 40ns @ 15V, 50pF
Supplier Device Package: 14-SO
Number of Inputs: 3
Current - Output High, Low: 2.4mA, 2.4mA
Voltage - Supply: 3V ~ 15V
Operating Temperature: -40°C ~ 85°C
Logic Type: NOR Gate
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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