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HEF4093BT/AUJ HEF4093BT/AUJ NXP USA Inc. HEF4093B.pdf Description: IC GATE NAND SCHMIT 4CH 2IN 14SO
Packaging: Tape & Reel (TR)
Features: Schmitt Trigger
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3.4mA, 3.4mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 3.5V ~ 11V
Input Logic Level - Low: 1.5V ~ 4V
Max Propagation Delay @ V, Max CL: 60ns @ 15V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 1 µA
Produkt ist nicht verfügbar
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HEF4013BP-Q100U NXP USA Inc. HEF4013B_Q100.pdf Description: IC FF D-TYPE DOUBLE 1BIT 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: Complementary
Mounting Type: Through Hole
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3V ~ 15V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 3.4mA, 3.4mA
Trigger Type: Positive Edge
Clock Frequency: 40 MHz
Input Capacitance: 7.5 pF
Supplier Device Package: 14-DIP
Max Propagation Delay @ V, Max CL: 60ns @ 15V, 50pF
Part Status: Obsolete
Number of Bits per Element: 1
Produkt ist nicht verfügbar
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HEF4021BP-Q100U HEF4021BP-Q100U NXP USA Inc. HEF4021B_Q100.pdf Description: IC SHIFT REGISTER 8BIT 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Push-Pull
Mounting Type: Through Hole
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 15V
Supplier Device Package: 16-DIP
Part Status: Obsolete
Number of Bits per Element: 8
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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HEF4070BP-Q100U HEF4070BP-Q100U NXP USA Inc. Description: IC GATE XOR 4CH 2-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3mA, 3mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 3.5V ~ 11V
Input Logic Level - Low: 1.5V ~ 4V
Max Propagation Delay @ V, Max CL: 55ns @ 15V, 50pF
Part Status: Obsolete
Number of Circuits: 4
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TEA1721ADB1061,598 NXP USA Inc. 75017320.pdf Description: EVAL BOARD FOR TEA1721
Packaging: Box
Voltage - Output: 3.3V, 12V
Voltage - Input: 85 ~ 265 VAC
Current - Output: 400mA, 400mA
Frequency - Switching: 51kHz
Regulator Topology: Flyback
Board Type: Fully Populated
Utilized IC / Part: TEA1721
Supplied Contents: Board(s)
Main Purpose: AC/DC, Primary Side
Outputs and Type: 2 Isolated Outputs
Part Status: Active
Power - Output: 5W
Contents: Board(s)
Produkt ist nicht verfügbar
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TEA1721ADB1059,598 NXP USA Inc. 75017320.pdf Description: EVAL BOARD FOR TEA1721
Packaging: Box
Voltage - Output: 12V
Voltage - Input: 85 ~ 265 VAC
Current - Output: 200mA
Frequency - Switching: 50kHz
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: TEA1721
Supplied Contents: Board(s)
Main Purpose: AC/DC, Non-Isolated
Outputs and Type: 1 Non-Isolated Output
Part Status: Active
Power - Output: 2.5W
Contents: Board(s)
Produkt ist nicht verfügbar
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TEA1721ADB1060,598 NXP USA Inc. UM10522.pdf Description: EVAL BOARD FOR TEA1721
Packaging: Box
Voltage - Output: -12V
Voltage - Input: 85 ~ 265 VAC
Current - Output: 200mA
Frequency - Switching: 50kHz
Regulator Topology: Flyback
Board Type: Fully Populated
Utilized IC / Part: TEA1721
Supplied Contents: Board(s)
Main Purpose: AC/DC, Non-Isolated
Outputs and Type: 1 Non-Isolated Output
Part Status: Active
Power - Output: 2.5W
Contents: Board(s)
Produkt ist nicht verfügbar
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TEA1721ADB1062,598 NXP USA Inc. 75017320.pdf Description: EVAL BOARD FOR TEA1721
Packaging: Box
Voltage - Output: 3.3V, 5V, 24V
Voltage - Input: 85 ~ 560 VAC
Current - Output: 300mA, 300mA, 200mA
Frequency - Switching: 50kHz
Regulator Topology: Flyback
Board Type: Fully Populated
Utilized IC / Part: TEA1721
Supplied Contents: Board(s)
Main Purpose: AC/DC, Primary Side
Outputs and Type: 3 Isolated Outputs
Part Status: Active
Power - Output: 5W
Contents: Board(s)
Produkt ist nicht verfügbar
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TEA1721BDB1065,598 NXP USA Inc. 75017320.pdf Description: EVAL BOARD FOR TEA1721
Packaging: Box
Voltage - Output: -3.3V, -12V
Voltage - Input: 85 ~ 265 VAC
Current - Output: 400mA, 400mA
Frequency - Switching: 50kHz
Regulator Topology: Flyback
Board Type: Fully Populated
Utilized IC / Part: TEA1721
Supplied Contents: Board(s)
Main Purpose: AC/DC, Primary Side
Outputs and Type: 2 Isolated Outputs
Part Status: Active
Power - Output: 5W
Contents: Board(s)
Produkt ist nicht verfügbar
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MKL02Z32CAF4R MKL02Z32CAF4R NXP USA Inc. KL0xPB.pdf Description: IC MCU 32BIT 32KB FLASH 20WLCSP
Packaging: Cut Tape (CT)
Package / Case: 20-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 20-WLCSP (1.99x1.94)
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
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10+2.91 EUR
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100+2.85 EUR
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NX3P2902BUKZ NX3P2902BUKZ NXP USA Inc. NX3P2902B.pdf Description: IC PWR SWITCH P-CHAN 1:1 4WLCSP
Packaging: Tape & Reel (TR)
Features: Load Discharge, Slew Rate Controlled
Package / Case: 4-UFBGA, WLCSP
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: High Side
Rds On (Typ): 65mOhm
Input Type: Non-Inverting
Voltage - Load: 1.1V ~ 3.6V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 500mA
Ratio - Input:Output: 1:1
Supplier Device Package: 4-WLCSP (0.74x0.74)
Part Status: Active
Produkt ist nicht verfügbar
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N74F38D-Q100J N74F38D-Q100J NXP USA Inc. Description: IC GATE NAND OP COL 4CH 2IN 14SO
Produkt ist nicht verfügbar
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NTS0102GD-Q100H NTS0102GD-Q100H NXP USA Inc. NTS0102_Q100.pdf Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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NX3DV221TKX NX3DV221TKX NXP USA Inc. NX3DV221.pdf Description: IC USB 2.0 SWITCH HS 10HVSON
Packaging: Cut Tape (CT)
Features: Bi-Directional
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: USB
On-State Resistance (Max): 7Ohm
-3db Bandwidth: 1GHz
Supplier Device Package: 10-HVSON (3x3)
Voltage - Supply, Single (V+): 2.3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 1
auf Bestellung 9281 Stücke:
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24+0.75 EUR
27+0.67 EUR
100+0.59 EUR
250+0.55 EUR
500+0.52 EUR
Mindestbestellmenge: 17
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NX3DV42GU10X NX3DV42GU10X NXP USA Inc. NX3DV42.pdf Description: IC USB 2.0 SWITCH HS 10XQFN
Packaging: Cut Tape (CT)
Features: Break-Before-Make, USB 2.0
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: USB
On-State Resistance (Max): 6.5Ohm
-3db Bandwidth: 950MHz
Supplier Device Package: 10-XQFN (1.3x1.6)
Voltage - Supply, Single (V+): 3V ~ 4.3V
Switch Circuit: DPDT
Part Status: Active
Number of Channels: 1
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22+0.80 EUR
25+0.72 EUR
100+0.63 EUR
250+0.59 EUR
500+0.56 EUR
1000+0.55 EUR
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NX3L1G3157GM-Q100X NX3L1G3157GM-Q100X NXP USA Inc. Description: IC SWITCH SPDT X 1 750MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 25ns, 10ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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NX3P2902BUKZ NX3P2902BUKZ NXP USA Inc. NX3P2902B.pdf Description: IC PWR SWITCH P-CHAN 1:1 4WLCSP
Packaging: Cut Tape (CT)
Features: Load Discharge, Slew Rate Controlled
Package / Case: 4-UFBGA, WLCSP
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: High Side
Rds On (Typ): 65mOhm
Input Type: Non-Inverting
Voltage - Load: 1.1V ~ 3.6V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 500mA
Ratio - Input:Output: 1:1
Supplier Device Package: 4-WLCSP (0.74x0.74)
Part Status: Active
Produkt ist nicht verfügbar
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DC6M602X6/1215A,13 DC6M602X6/1215A,13 NXP USA Inc. DC6M60xX6_Family.pdf Description: IC REG BUCK PROG 650MA 6WLCSP
Packaging: Cut Tape (CT)
Package / Case: 6-XFBGA, WLCSP
Output Type: Programmable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 650mA
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 6MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 6-WLCSP (1.36x0.96)
Synchronous Rectifier: Yes
Voltage - Input (Min): 2.3V
Voltage - Output (Min/Fixed): 1.2V, 1.5V
Part Status: Obsolete
Produkt ist nicht verfügbar
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DC6M602X6/1218A,13 DC6M602X6/1218A,13 NXP USA Inc. DC6M60xX6_Family.pdf Description: IC REG BUCK PROG 650MA 6WLCSP
Packaging: Cut Tape (CT)
Package / Case: 6-XFBGA, WLCSP
Output Type: Programmable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 650mA
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 6MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 6-WLCSP (1.36x0.96)
Synchronous Rectifier: Yes
Voltage - Input (Min): 2.3V
Voltage - Output (Min/Fixed): 1.2V, 1.8V
Part Status: Obsolete
Produkt ist nicht verfügbar
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DC6M601X6/285SF DC6M601X6/285SF NXP USA Inc. DC6M60xX6_Family.pdf Description: IC REG BUCK 2.85V 650MA 6WLCSP
Packaging: Cut Tape (CT)
Package / Case: 6-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 650mA
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 6MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 6-WLCSP (1.36x0.96)
Synchronous Rectifier: Yes
Voltage - Input (Min): 2.3V
Voltage - Output (Min/Fixed): 2.85V
Part Status: Obsolete
Produkt ist nicht verfügbar
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LPC812M101JDH16FP LPC812M101JDH16FP NXP USA Inc. LPC81XM.pdf Description: IC MCU 32BIT 16KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 1991 Stücke:
Lieferzeit 10-14 Tag (e)
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13+1.44 EUR
96+1.39 EUR
192+1.34 EUR
288+1.27 EUR
576+1.20 EUR
1056+1.17 EUR
Mindestbestellmenge: 8
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LPC812M101JDH20FP LPC812M101JDH20FP NXP USA Inc. LPC81XM.pdf Description: IC MCU 32BIT 16KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
auf Bestellung 19055 Stücke:
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10+1.91 EUR
75+1.42 EUR
300+1.41 EUR
525+1.38 EUR
1050+1.34 EUR
Mindestbestellmenge: 8
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BSS84AKT,115 BSS84AKT,115 NXP USA Inc. BSS84AKT.pdf Description: MOSFET P-CH 50V 150MA SC75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 150mA (Ta)
Rds On (Max) @ Id, Vgs: 7.5Ohm @ 100mA, 10V
Power Dissipation (Max): 250mW (Ta), 770mW (Tc)
Vgs(th) (Max) @ Id: 2.1V @ 250µA
Supplier Device Package: SC-75
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 50 V
Gate Charge (Qg) (Max) @ Vgs: 0.35 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 36 pF @ 25 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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IP4238CZ10,115 IP4238CZ10,115 NXP USA Inc. Description: TVS DIODE 5.5VWM 7.3VC 10DFN
Produkt ist nicht verfügbar
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IP4264CZ8-40-TTL,1 IP4264CZ8-40-TTL,1 NXP USA Inc. IP4264CZ8-10_20_40-TTL.pdf Description: FILTER RC(PI) ESD SMD
Produkt ist nicht verfügbar
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IP4357CX17,135 NXP USA Inc. SD(HC)-Memory_Card_MMC_AN.pdf Description: TVS DIODE 17CSP
Packaging: Cut Tape (CT)
Part Status: Obsolete
Produkt ist nicht verfügbar
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NX3008NBKT,115 NX3008NBKT,115 NXP USA Inc. NX3008NBKT.pdf Description: MOSFET N-CH 30V 350MA SC75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 350mA (Ta)
Rds On (Max) @ Id, Vgs: 1.4Ohm @ 350mA, 4.5V
Power Dissipation (Max): 250mW (Ta), 770mW (Tc)
Vgs(th) (Max) @ Id: 1.1V @ 250µA
Supplier Device Package: SC-75
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 0.68 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 50 pF @ 15 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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NX3008PBKT,115 NX3008PBKT,115 NXP USA Inc. Description: MOSFET P-CH 30V 200MA SC75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 200mA (Ta)
Rds On (Max) @ Id, Vgs: 4.1Ohm @ 200mA, 4.5V
Power Dissipation (Max): 250mW (Ta), 770mW (Tc)
Vgs(th) (Max) @ Id: 1.1V @ 250µA
Supplier Device Package: SC-75
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 0.72 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 46 pF @ 15 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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NX3020NAKT,115 NX3020NAKT,115 NXP USA Inc. Description: MOSFET N-CH 30V 180MA SC75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 180mA (Ta)
Rds On (Max) @ Id, Vgs: 4.5Ohm @ 100mA, 10V
Power Dissipation (Max): 230mW (Ta), 1.06W (Tc)
Vgs(th) (Max) @ Id: 1.5V @ 250µA
Supplier Device Package: SC-75
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 0.44 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 13 pF @ 10 V
Produkt ist nicht verfügbar
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PEMI1QFN/CK,315 PEMI1QFN/CK,315 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 20 OHM/13.5PF SMD
Packaging: Cut Tape (CT)
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 13.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 10dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 1
Produkt ist nicht verfügbar
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PEMI2QFN/WM,115 PEMI2QFN/WM,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 200 OHM/16PF SMD
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PEMI2STD/CP,115 PEMI2STD/CP,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 20 OHM/18.5PF SMD
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PEMI2STD/HG,115 PEMI2STD/HG,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 45 OHM/11PF SMD
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PEMI2STD/LT,115 PEMI2STD/LT,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 65 OHM/23PF SMD
Packaging: Cut Tape (CT)
Package / Case: SOT-665
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 23pF (Total)
Height: 0.024" (0.60mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 2
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PEMI2STD/WK,115 PEMI2STD/WK,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 200 OHM/13.5PF SMD
Packaging: Cut Tape (CT)
Package / Case: SOT-665
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 13.5pF (Total)
Height: 0.024" (0.60mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Number of Channels: 2
Produkt ist nicht verfügbar
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PEMI2STD/WM,115 PEMI2STD/WM,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 200 OHM/16PF SMD
Packaging: Cut Tape (CT)
Package / Case: SOT-665
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 16pF (Total)
Height: 0.024" (0.60mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 2
Produkt ist nicht verfügbar
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PEMI4QFN/HR,132 PEMI4QFN/HR,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 45 OHM/21PF SMD
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PEMI4QFN/WG,132 PEMI4QFN/WG,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 200 OHM/11PF SMD
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 11pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 21dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 4
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PEMI8QFN/LR,132 PEMI8QFN/LR,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 65 OHM/21PF SMD
Packaging: Cut Tape (CT)
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 21pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 21dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8
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PEMI8QFN/WP,132 PEMI8QFN/WP,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 200 OHM/18.5PF SMD
Packaging: Cut Tape (CT)
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 30dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Number of Channels: 8
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PMDPB28UN,115 PMDPB28UN,115 NXP USA Inc. PMDPB28UN.pdf Description: MOSFET 2N-CH 20V 4.6A 6HUSON
Packaging: Cut Tape (CT)
Package / Case: 6-UDFN Exposed Pad
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Dual)
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 510mW
Drain to Source Voltage (Vdss): 20V
Current - Continuous Drain (Id) @ 25°C: 4.6A
Input Capacitance (Ciss) (Max) @ Vds: 265pF @ 10V
Rds On (Max) @ Id, Vgs: 37mOhm @ 4.6A, 4.5V
Gate Charge (Qg) (Max) @ Vgs: 4.7nC @ 4.5V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: 6-HUSON (2x2)
Part Status: Obsolete
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PMF63UN,115 PMF63UN,115 NXP USA Inc. PMF63UN.pdf Description: MOSFET N-CH 20V 1.8A SOT323-3
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1.8A (Ta)
Rds On (Max) @ Id, Vgs: 74mOhm @ 1.8A, 4.5V
Power Dissipation (Max): 275mW (Ta), 1.785W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: SC-70
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 3.3 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 185 pF @ 10 V
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PMG45UN,115 PMG45UN,115 NXP USA Inc. PMG45UN_Rev_Nov_2012.pdf Description: MOSFET N-CH 20V 3A SOT363
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PMV90EN,215 PMV90EN,215 NXP USA Inc. PMV90EN.pdf Description: MOSFET N-CH 30V 1.9A TO236AB
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1.9A (Ta)
Rds On (Max) @ Id, Vgs: 84mOhm @ 1.9A, 10V
Power Dissipation (Max): 310mW (Ta), 2.09W (Tc)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SOT-23 (TO-236AB)
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 4 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 132 pF @ 15 V
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MKL16Z256VMP4 MKL16Z256VMP4 NXP USA Inc. KL16P64M48SF4.pdf Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D - 16bit; D/A - 12bit
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, TSI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Number of I/O: 54
DigiKey Programmable: Not Verified
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MKL26Z256VMP4 MKL26Z256VMP4 NXP USA Inc. KL26P121M48SF4.pdf Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D - 16bit; D/A - 12bit
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
auf Bestellung 640 Stücke:
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NXPMOSFET-DESIGNKIT NXPMOSFET-DESIGNKIT NXP USA Inc. Description: KIT DESIGN MOSFET LFPAK
Packaging: Box
Mounting Type: Surface Mount
Quantity: 180 Pieces (18 Values - 10 Each)
Kit Type: MOSFETs
Part Status: Obsolete
Produkt ist nicht verfügbar
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OM13054UL OM13054UL NXP USA Inc. OM13054_Web.pdf Description: BOARD EVAL LPC-LINK2
Packaging: Box
Type: Debugger
Contents: Board(s), Cable(s)
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NT2H1611F0DTLH NT2H1611F0DTLH NXP USA Inc. Description: NFC TYPE2 TAG IC 144/888 BYTES
Packaging: Tube
Package / Case: 4-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Standards: ISO 14443, NFC
Supplier Device Package: 4-HXSON (2x1.5)
Produkt ist nicht verfügbar
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AFT09H310-03SR6 AFT09H310-03SR6 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230S
Mounting Type: Chassis Mount
Frequency: 920MHz
Power - Output: 56W
Gain: 17.9dB
Technology: LDMOS
Supplier Device Package: NI-1230S
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 680 mA
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AFT09H310-04GSR6 NXP USA Inc. Description: RF MOSFET 28V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230S-4 GW
Mounting Type: Chassis Mount
Frequency: 920MHz
Configuration: N-Channel
Power - Output: 56W
Gain: 17.9dB
Technology: MOSFET (Metal Oxide)
Supplier Device Package: NI-1230S-4 GULL
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 680 mA
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AFT09MP055GNR1 AFT09MP055GNR1 NXP USA Inc. AFT09MP055N.pdf Description: RF MOSFET LDMOS 12.5V TO270-4
Packaging: Tape & Reel (TR)
Package / Case: TO-270BB
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 1W
Gain: 15.7dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4 Gull
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 550 mA
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AFT09MP055NR1 AFT09MP055NR1 NXP USA Inc. AFT09MP055N.pdf Description: RF MOSFET LDMOS 12.5V TO270-4
Packaging: Tape & Reel (TR)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 1W
Gain: 15.7dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 550 mA
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AFT09MS007NT1 AFT09MS007NT1 NXP USA Inc. AFT09MS007N.pdf Description: RF MOSFET LDMOS 7.5V PLD-1.5W
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 7.3W
Gain: 15.2dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 7.5 V
Current - Test: 100 mA
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
1000+3.75 EUR
2000+3.66 EUR
3000+3.62 EUR
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AFT18H356-24SR6 AFT18H356-24SR6 NXP USA Inc. Description: FET RF 2CH 65V 1.88GHZ NI1230-4
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4LS2L
Mounting Type: Chassis Mount
Frequency: 1.88GHz
Power - Output: 63W
Gain: 15dB
Supplier Device Package: NI-1230-4LS2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.1 A
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AFT26H160-4S4R3 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI880X-4
Packaging: Tape & Reel (TR)
Package / Case: NI-880X-4L4S-8
Mounting Type: Chassis Mount
Frequency: 2.5GHz
Power - Output: 32W
Gain: 14.9dB
Technology: LDMOS
Supplier Device Package: NI-880X-4L4S-8
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 500 mA
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MC10XS3412JHFKR2 MC10XS3412JHFKR2 NXP USA Inc. Description: IC PWR SWITCH N-CHAN 1:1 24PQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 10mOhm, 12mOhm
Voltage - Load: 6V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Ratio - Input:Output: 1:1
Supplier Device Package: 24-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Obsolete
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MC34903CP5EKR2 MC34903CP5EKR2 NXP USA Inc. MC34903,4,5.pdf Description: IC SBC HIGH SPEED CAN 5V 32SOIC
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MC34903CS3EKR2 MC34903CS3EKR2 NXP USA Inc. MC34903,4,5.pdf Description: IC SBC HIGH SPD CAN 3.3V 32SOIC
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MC34903CS5EKR2 MC34903CS5EKR2 NXP USA Inc. MC34903,4,5.pdf Description: IC SBC HIGH SPEED CAN 5V 32SOIC
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HEF4093BT/AUJ HEF4093B.pdf
HEF4093BT/AUJ
Hersteller: NXP USA Inc.
Description: IC GATE NAND SCHMIT 4CH 2IN 14SO
Packaging: Tape & Reel (TR)
Features: Schmitt Trigger
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3.4mA, 3.4mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 3.5V ~ 11V
Input Logic Level - Low: 1.5V ~ 4V
Max Propagation Delay @ V, Max CL: 60ns @ 15V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 1 µA
Produkt ist nicht verfügbar
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HEF4013BP-Q100U HEF4013B_Q100.pdf
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE DOUBLE 1BIT 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: Complementary
Mounting Type: Through Hole
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3V ~ 15V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 3.4mA, 3.4mA
Trigger Type: Positive Edge
Clock Frequency: 40 MHz
Input Capacitance: 7.5 pF
Supplier Device Package: 14-DIP
Max Propagation Delay @ V, Max CL: 60ns @ 15V, 50pF
Part Status: Obsolete
Number of Bits per Element: 1
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HEF4021BP-Q100U HEF4021B_Q100.pdf
HEF4021BP-Q100U
Hersteller: NXP USA Inc.
Description: IC SHIFT REGISTER 8BIT 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Push-Pull
Mounting Type: Through Hole
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 15V
Supplier Device Package: 16-DIP
Part Status: Obsolete
Number of Bits per Element: 8
Grade: Automotive
Qualification: AEC-Q100
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HEF4070BP-Q100U
HEF4070BP-Q100U
Hersteller: NXP USA Inc.
Description: IC GATE XOR 4CH 2-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3mA, 3mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 3.5V ~ 11V
Input Logic Level - Low: 1.5V ~ 4V
Max Propagation Delay @ V, Max CL: 55ns @ 15V, 50pF
Part Status: Obsolete
Number of Circuits: 4
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TEA1721ADB1061,598 75017320.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR TEA1721
Packaging: Box
Voltage - Output: 3.3V, 12V
Voltage - Input: 85 ~ 265 VAC
Current - Output: 400mA, 400mA
Frequency - Switching: 51kHz
Regulator Topology: Flyback
Board Type: Fully Populated
Utilized IC / Part: TEA1721
Supplied Contents: Board(s)
Main Purpose: AC/DC, Primary Side
Outputs and Type: 2 Isolated Outputs
Part Status: Active
Power - Output: 5W
Contents: Board(s)
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TEA1721ADB1059,598 75017320.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR TEA1721
Packaging: Box
Voltage - Output: 12V
Voltage - Input: 85 ~ 265 VAC
Current - Output: 200mA
Frequency - Switching: 50kHz
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: TEA1721
Supplied Contents: Board(s)
Main Purpose: AC/DC, Non-Isolated
Outputs and Type: 1 Non-Isolated Output
Part Status: Active
Power - Output: 2.5W
Contents: Board(s)
Produkt ist nicht verfügbar
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TEA1721ADB1060,598 UM10522.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR TEA1721
Packaging: Box
Voltage - Output: -12V
Voltage - Input: 85 ~ 265 VAC
Current - Output: 200mA
Frequency - Switching: 50kHz
Regulator Topology: Flyback
Board Type: Fully Populated
Utilized IC / Part: TEA1721
Supplied Contents: Board(s)
Main Purpose: AC/DC, Non-Isolated
Outputs and Type: 1 Non-Isolated Output
Part Status: Active
Power - Output: 2.5W
Contents: Board(s)
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TEA1721ADB1062,598 75017320.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR TEA1721
Packaging: Box
Voltage - Output: 3.3V, 5V, 24V
Voltage - Input: 85 ~ 560 VAC
Current - Output: 300mA, 300mA, 200mA
Frequency - Switching: 50kHz
Regulator Topology: Flyback
Board Type: Fully Populated
Utilized IC / Part: TEA1721
Supplied Contents: Board(s)
Main Purpose: AC/DC, Primary Side
Outputs and Type: 3 Isolated Outputs
Part Status: Active
Power - Output: 5W
Contents: Board(s)
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TEA1721BDB1065,598 75017320.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR TEA1721
Packaging: Box
Voltage - Output: -3.3V, -12V
Voltage - Input: 85 ~ 265 VAC
Current - Output: 400mA, 400mA
Frequency - Switching: 50kHz
Regulator Topology: Flyback
Board Type: Fully Populated
Utilized IC / Part: TEA1721
Supplied Contents: Board(s)
Main Purpose: AC/DC, Primary Side
Outputs and Type: 2 Isolated Outputs
Part Status: Active
Power - Output: 5W
Contents: Board(s)
Produkt ist nicht verfügbar
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MKL02Z32CAF4R KL0xPB.pdf
MKL02Z32CAF4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 20WLCSP
Packaging: Cut Tape (CT)
Package / Case: 20-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 20-WLCSP (1.99x1.94)
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
auf Bestellung 239 Stücke:
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6+3.33 EUR
10+2.91 EUR
25+2.88 EUR
100+2.85 EUR
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NX3P2902BUKZ NX3P2902B.pdf
NX3P2902BUKZ
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH P-CHAN 1:1 4WLCSP
Packaging: Tape & Reel (TR)
Features: Load Discharge, Slew Rate Controlled
Package / Case: 4-UFBGA, WLCSP
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: High Side
Rds On (Typ): 65mOhm
Input Type: Non-Inverting
Voltage - Load: 1.1V ~ 3.6V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 500mA
Ratio - Input:Output: 1:1
Supplier Device Package: 4-WLCSP (0.74x0.74)
Part Status: Active
Produkt ist nicht verfügbar
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N74F38D-Q100J
N74F38D-Q100J
Hersteller: NXP USA Inc.
Description: IC GATE NAND OP COL 4CH 2IN 14SO
Produkt ist nicht verfügbar
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NTS0102GD-Q100H NTS0102_Q100.pdf
NTS0102GD-Q100H
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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NX3DV221TKX NX3DV221.pdf
NX3DV221TKX
Hersteller: NXP USA Inc.
Description: IC USB 2.0 SWITCH HS 10HVSON
Packaging: Cut Tape (CT)
Features: Bi-Directional
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: USB
On-State Resistance (Max): 7Ohm
-3db Bandwidth: 1GHz
Supplier Device Package: 10-HVSON (3x3)
Voltage - Supply, Single (V+): 2.3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 1
auf Bestellung 9281 Stücke:
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17+1.06 EUR
24+0.75 EUR
27+0.67 EUR
100+0.59 EUR
250+0.55 EUR
500+0.52 EUR
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NX3DV42GU10X NX3DV42.pdf
NX3DV42GU10X
Hersteller: NXP USA Inc.
Description: IC USB 2.0 SWITCH HS 10XQFN
Packaging: Cut Tape (CT)
Features: Break-Before-Make, USB 2.0
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: USB
On-State Resistance (Max): 6.5Ohm
-3db Bandwidth: 950MHz
Supplier Device Package: 10-XQFN (1.3x1.6)
Voltage - Supply, Single (V+): 3V ~ 4.3V
Switch Circuit: DPDT
Part Status: Active
Number of Channels: 1
auf Bestellung 26797 Stücke:
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16+1.13 EUR
22+0.80 EUR
25+0.72 EUR
100+0.63 EUR
250+0.59 EUR
500+0.56 EUR
1000+0.55 EUR
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NX3L1G3157GM-Q100X
NX3L1G3157GM-Q100X
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDT X 1 750MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 25ns, 10ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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NX3P2902BUKZ NX3P2902B.pdf
NX3P2902BUKZ
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH P-CHAN 1:1 4WLCSP
Packaging: Cut Tape (CT)
Features: Load Discharge, Slew Rate Controlled
Package / Case: 4-UFBGA, WLCSP
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: High Side
Rds On (Typ): 65mOhm
Input Type: Non-Inverting
Voltage - Load: 1.1V ~ 3.6V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 500mA
Ratio - Input:Output: 1:1
Supplier Device Package: 4-WLCSP (0.74x0.74)
Part Status: Active
Produkt ist nicht verfügbar
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DC6M602X6/1215A,13 DC6M60xX6_Family.pdf
DC6M602X6/1215A,13
Hersteller: NXP USA Inc.
Description: IC REG BUCK PROG 650MA 6WLCSP
Packaging: Cut Tape (CT)
Package / Case: 6-XFBGA, WLCSP
Output Type: Programmable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 650mA
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 6MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 6-WLCSP (1.36x0.96)
Synchronous Rectifier: Yes
Voltage - Input (Min): 2.3V
Voltage - Output (Min/Fixed): 1.2V, 1.5V
Part Status: Obsolete
Produkt ist nicht verfügbar
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DC6M602X6/1218A,13 DC6M60xX6_Family.pdf
DC6M602X6/1218A,13
Hersteller: NXP USA Inc.
Description: IC REG BUCK PROG 650MA 6WLCSP
Packaging: Cut Tape (CT)
Package / Case: 6-XFBGA, WLCSP
Output Type: Programmable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 650mA
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 6MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 6-WLCSP (1.36x0.96)
Synchronous Rectifier: Yes
Voltage - Input (Min): 2.3V
Voltage - Output (Min/Fixed): 1.2V, 1.8V
Part Status: Obsolete
Produkt ist nicht verfügbar
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DC6M601X6/285SF DC6M60xX6_Family.pdf
DC6M601X6/285SF
Hersteller: NXP USA Inc.
Description: IC REG BUCK 2.85V 650MA 6WLCSP
Packaging: Cut Tape (CT)
Package / Case: 6-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 650mA
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 6MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 6-WLCSP (1.36x0.96)
Synchronous Rectifier: Yes
Voltage - Input (Min): 2.3V
Voltage - Output (Min/Fixed): 2.85V
Part Status: Obsolete
Produkt ist nicht verfügbar
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LPC812M101JDH16FP LPC81XM.pdf
LPC812M101JDH16FP
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 1991 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.46 EUR
13+1.44 EUR
96+1.39 EUR
192+1.34 EUR
288+1.27 EUR
576+1.20 EUR
1056+1.17 EUR
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LPC812M101JDH20FP LPC81XM.pdf
LPC812M101JDH20FP
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
auf Bestellung 19055 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.41 EUR
10+1.91 EUR
75+1.42 EUR
300+1.41 EUR
525+1.38 EUR
1050+1.34 EUR
Mindestbestellmenge: 8
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BSS84AKT,115 BSS84AKT.pdf
BSS84AKT,115
Hersteller: NXP USA Inc.
Description: MOSFET P-CH 50V 150MA SC75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 150mA (Ta)
Rds On (Max) @ Id, Vgs: 7.5Ohm @ 100mA, 10V
Power Dissipation (Max): 250mW (Ta), 770mW (Tc)
Vgs(th) (Max) @ Id: 2.1V @ 250µA
Supplier Device Package: SC-75
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 50 V
Gate Charge (Qg) (Max) @ Vgs: 0.35 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 36 pF @ 25 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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IP4238CZ10,115
IP4238CZ10,115
Hersteller: NXP USA Inc.
Description: TVS DIODE 5.5VWM 7.3VC 10DFN
Produkt ist nicht verfügbar
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IP4264CZ8-40-TTL,1 IP4264CZ8-10_20_40-TTL.pdf
IP4264CZ8-40-TTL,1
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) ESD SMD
Produkt ist nicht verfügbar
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IP4357CX17,135 SD(HC)-Memory_Card_MMC_AN.pdf
Hersteller: NXP USA Inc.
Description: TVS DIODE 17CSP
Packaging: Cut Tape (CT)
Part Status: Obsolete
Produkt ist nicht verfügbar
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NX3008NBKT,115 NX3008NBKT.pdf
NX3008NBKT,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 350MA SC75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 350mA (Ta)
Rds On (Max) @ Id, Vgs: 1.4Ohm @ 350mA, 4.5V
Power Dissipation (Max): 250mW (Ta), 770mW (Tc)
Vgs(th) (Max) @ Id: 1.1V @ 250µA
Supplier Device Package: SC-75
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 0.68 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 50 pF @ 15 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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NX3008PBKT,115
NX3008PBKT,115
Hersteller: NXP USA Inc.
Description: MOSFET P-CH 30V 200MA SC75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 200mA (Ta)
Rds On (Max) @ Id, Vgs: 4.1Ohm @ 200mA, 4.5V
Power Dissipation (Max): 250mW (Ta), 770mW (Tc)
Vgs(th) (Max) @ Id: 1.1V @ 250µA
Supplier Device Package: SC-75
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 0.72 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 46 pF @ 15 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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NX3020NAKT,115
NX3020NAKT,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 180MA SC75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 180mA (Ta)
Rds On (Max) @ Id, Vgs: 4.5Ohm @ 100mA, 10V
Power Dissipation (Max): 230mW (Ta), 1.06W (Tc)
Vgs(th) (Max) @ Id: 1.5V @ 250µA
Supplier Device Package: SC-75
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 0.44 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 13 pF @ 10 V
Produkt ist nicht verfügbar
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PEMI1QFN/CK,315 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI1QFN/CK,315
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 20 OHM/13.5PF SMD
Packaging: Cut Tape (CT)
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 13.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 10dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 1
Produkt ist nicht verfügbar
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PEMI2QFN/WM,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2QFN/WM,115
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/16PF SMD
Produkt ist nicht verfügbar
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PEMI2STD/CP,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2STD/CP,115
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 20 OHM/18.5PF SMD
Produkt ist nicht verfügbar
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PEMI2STD/HG,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2STD/HG,115
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 45 OHM/11PF SMD
Produkt ist nicht verfügbar
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PEMI2STD/LT,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2STD/LT,115
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 65 OHM/23PF SMD
Packaging: Cut Tape (CT)
Package / Case: SOT-665
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 23pF (Total)
Height: 0.024" (0.60mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 2
Produkt ist nicht verfügbar
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PEMI2STD/WK,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2STD/WK,115
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/13.5PF SMD
Packaging: Cut Tape (CT)
Package / Case: SOT-665
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 13.5pF (Total)
Height: 0.024" (0.60mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Number of Channels: 2
Produkt ist nicht verfügbar
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PEMI2STD/WM,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2STD/WM,115
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/16PF SMD
Packaging: Cut Tape (CT)
Package / Case: SOT-665
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 16pF (Total)
Height: 0.024" (0.60mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 2
Produkt ist nicht verfügbar
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PEMI4QFN/HR,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI4QFN/HR,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 45 OHM/21PF SMD
Produkt ist nicht verfügbar
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PEMI4QFN/WG,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI4QFN/WG,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/11PF SMD
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 11pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 21dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 4
Produkt ist nicht verfügbar
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PEMI8QFN/LR,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI8QFN/LR,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 65 OHM/21PF SMD
Packaging: Cut Tape (CT)
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 21pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 21dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8
Produkt ist nicht verfügbar
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PEMI8QFN/WP,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI8QFN/WP,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/18.5PF SMD
Packaging: Cut Tape (CT)
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 30dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Number of Channels: 8
Produkt ist nicht verfügbar
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PMDPB28UN,115 PMDPB28UN.pdf
PMDPB28UN,115
Hersteller: NXP USA Inc.
Description: MOSFET 2N-CH 20V 4.6A 6HUSON
Packaging: Cut Tape (CT)
Package / Case: 6-UDFN Exposed Pad
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Dual)
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 510mW
Drain to Source Voltage (Vdss): 20V
Current - Continuous Drain (Id) @ 25°C: 4.6A
Input Capacitance (Ciss) (Max) @ Vds: 265pF @ 10V
Rds On (Max) @ Id, Vgs: 37mOhm @ 4.6A, 4.5V
Gate Charge (Qg) (Max) @ Vgs: 4.7nC @ 4.5V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: 6-HUSON (2x2)
Part Status: Obsolete
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PMF63UN,115 PMF63UN.pdf
PMF63UN,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 20V 1.8A SOT323-3
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1.8A (Ta)
Rds On (Max) @ Id, Vgs: 74mOhm @ 1.8A, 4.5V
Power Dissipation (Max): 275mW (Ta), 1.785W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: SC-70
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 3.3 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 185 pF @ 10 V
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PMG45UN,115 PMG45UN_Rev_Nov_2012.pdf
PMG45UN,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 20V 3A SOT363
Produkt ist nicht verfügbar
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PMV90EN,215 PMV90EN.pdf
PMV90EN,215
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 1.9A TO236AB
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1.9A (Ta)
Rds On (Max) @ Id, Vgs: 84mOhm @ 1.9A, 10V
Power Dissipation (Max): 310mW (Ta), 2.09W (Tc)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SOT-23 (TO-236AB)
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 4 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 132 pF @ 15 V
Produkt ist nicht verfügbar
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MKL16Z256VMP4 KL16P64M48SF4.pdf
MKL16Z256VMP4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D - 16bit; D/A - 12bit
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, TSI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MKL26Z256VMP4 KL26P121M48SF4.pdf
MKL26Z256VMP4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D - 16bit; D/A - 12bit
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
auf Bestellung 640 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.22 EUR
10+7.15 EUR
25+7.09 EUR
Mindestbestellmenge: 2
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NXPMOSFET-DESIGNKIT
NXPMOSFET-DESIGNKIT
Hersteller: NXP USA Inc.
Description: KIT DESIGN MOSFET LFPAK
Packaging: Box
Mounting Type: Surface Mount
Quantity: 180 Pieces (18 Values - 10 Each)
Kit Type: MOSFETs
Part Status: Obsolete
Produkt ist nicht verfügbar
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OM13054UL OM13054_Web.pdf
OM13054UL
Hersteller: NXP USA Inc.
Description: BOARD EVAL LPC-LINK2
Packaging: Box
Type: Debugger
Contents: Board(s), Cable(s)
Produkt ist nicht verfügbar
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NT2H1611F0DTLH
NT2H1611F0DTLH
Hersteller: NXP USA Inc.
Description: NFC TYPE2 TAG IC 144/888 BYTES
Packaging: Tube
Package / Case: 4-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Standards: ISO 14443, NFC
Supplier Device Package: 4-HXSON (2x1.5)
Produkt ist nicht verfügbar
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AFT09H310-03SR6
AFT09H310-03SR6
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230S
Mounting Type: Chassis Mount
Frequency: 920MHz
Power - Output: 56W
Gain: 17.9dB
Technology: LDMOS
Supplier Device Package: NI-1230S
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 680 mA
Produkt ist nicht verfügbar
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AFT09H310-04GSR6
Hersteller: NXP USA Inc.
Description: RF MOSFET 28V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230S-4 GW
Mounting Type: Chassis Mount
Frequency: 920MHz
Configuration: N-Channel
Power - Output: 56W
Gain: 17.9dB
Technology: MOSFET (Metal Oxide)
Supplier Device Package: NI-1230S-4 GULL
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 680 mA
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AFT09MP055GNR1 AFT09MP055N.pdf
AFT09MP055GNR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 12.5V TO270-4
Packaging: Tape & Reel (TR)
Package / Case: TO-270BB
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 1W
Gain: 15.7dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4 Gull
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 550 mA
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AFT09MP055NR1 AFT09MP055N.pdf
AFT09MP055NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 12.5V TO270-4
Packaging: Tape & Reel (TR)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 1W
Gain: 15.7dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 550 mA
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AFT09MS007NT1 AFT09MS007N.pdf
AFT09MS007NT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 7.5V PLD-1.5W
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 7.3W
Gain: 15.2dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 7.5 V
Current - Test: 100 mA
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+3.75 EUR
2000+3.66 EUR
3000+3.62 EUR
Mindestbestellmenge: 1000
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AFT18H356-24SR6
AFT18H356-24SR6
Hersteller: NXP USA Inc.
Description: FET RF 2CH 65V 1.88GHZ NI1230-4
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4LS2L
Mounting Type: Chassis Mount
Frequency: 1.88GHz
Power - Output: 63W
Gain: 15dB
Supplier Device Package: NI-1230-4LS2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.1 A
Produkt ist nicht verfügbar
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AFT26H160-4S4R3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI880X-4
Packaging: Tape & Reel (TR)
Package / Case: NI-880X-4L4S-8
Mounting Type: Chassis Mount
Frequency: 2.5GHz
Power - Output: 32W
Gain: 14.9dB
Technology: LDMOS
Supplier Device Package: NI-880X-4L4S-8
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
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MC10XS3412JHFKR2
MC10XS3412JHFKR2
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 24PQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 10mOhm, 12mOhm
Voltage - Load: 6V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Ratio - Input:Output: 1:1
Supplier Device Package: 24-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC34903CP5EKR2 MC34903,4,5.pdf
MC34903CP5EKR2
Hersteller: NXP USA Inc.
Description: IC SBC HIGH SPEED CAN 5V 32SOIC
Produkt ist nicht verfügbar
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MC34903CS3EKR2 MC34903,4,5.pdf
MC34903CS3EKR2
Hersteller: NXP USA Inc.
Description: IC SBC HIGH SPD CAN 3.3V 32SOIC
Produkt ist nicht verfügbar
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MC34903CS5EKR2 MC34903,4,5.pdf
MC34903CS5EKR2
Hersteller: NXP USA Inc.
Description: IC SBC HIGH SPEED CAN 5V 32SOIC
Produkt ist nicht verfügbar
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