Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36616) > Seite 238 nach 611
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||||
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| PCT1075TP,147 | NXP USA Inc. |
Description: IC BUS I2C 8HWSON Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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TFF1013HN/N1,115 | NXP USA Inc. |
 Description: IC DOWNCONVERTER 16DHVQFNPackaging: Tape & Reel (TR) Package / Case: 16-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 10.7GHz ~ 12.75GHz RF Type: Ku-Band Voltage - Supply: 5V Gain: 33dB Current - Supply: 52mA Secondary Attributes: Down Converter Noise Figure: 9dB Number of Mixers: 1 Supplier Device Package: 16-DHVQFN (2.5x3.5) Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| MFA100FHI33/01E | NXP USA Inc. |
Description: IC AUDIO DEVICE 32HVQFN Mounting Type: Surface Mount Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 490 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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PN512AA0HN1/C2,551 | NXP USA Inc. |
Description: IC RFID RDR/TRAN 13.56MZ 32HVQFN Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C, SPI, UART Type: RFID Reader/Transponder Operating Temperature: -40°C ~ 90°C Voltage - Supply: 2.5V ~ 3.6V Standards: FeliCa, ISO 14443, MIFARE, NFC Supplier Device Package: 32-HVQFN (5x5) Part Status: Obsolete |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 490 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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PN512AA0HN1/C2,557 | NXP USA Inc. |
Description: IC RFID RDR/TRAN 13.56MZ 32HVQFN Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C, SPI, UART Type: RFID Reader/Transponder Operating Temperature: -40°C ~ 90°C Voltage - Supply: 2.5V ~ 3.6V Standards: FeliCa, ISO 14443, MIFARE, NFC Supplier Device Package: 32-HVQFN (5x5) Part Status: Obsolete |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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PR5331C3HN/C370E | NXP USA Inc. |
Description: IC RFID READER 13.56MHZ 40HVQFN |
auf Bestellung 634 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| BLF8G22LS-310AVU | NXP USA Inc. |
Description: RF MOSFET LDMOS Packaging: Tube Part Status: Active Technology: LDMOS |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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PSMN3R9-60XSQ | NXP USA Inc. |
Description: MOSFET N-CH 60V 75A TO220F Packaging: Tube Package / Case: TO-220-3 Full Pack, Isolated Tab Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 75A (Tc) Rds On (Max) @ Id, Vgs: 4mOhm @ 25A, 10V Power Dissipation (Max): 55W (Tc) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: TO-220F Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 60 V Gate Charge (Qg) (Max) @ Vgs: 103 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 5494 pF @ 25 V |
Produkt ist nicht verfügbar |
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TDA3629/YWU | NXP USA Inc. |
Description: IC LIGHT POSITION CTRLR 8-DIP Packaging: Tube Package / Case: 8-DIP (0.300", 7.62mm) Mounting Type: Through Hole Operating Temperature: -40°C ~ 105°C Voltage - Supply: 8V ~ 18V Current - Supply: 6mA Supplier Device Package: 8-DIP Grade: Automotive Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| TDF8546AJ/N1,112 | NXP USA Inc. |
Description: IC AUDIO AMP AB DBS27P Features: Depop, Short-Circuit and Thermal Protection Packaging: Tube Package / Case: 27-SIP, Formed Leads Output Type: 4-Channel (Quad) Mounting Type: Through Hole Type: Class AB Voltage - Supply: 6V ~ 18V Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm Supplier Device Package: DBS27P Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| TDF8546ASD/N1,112 | NXP USA Inc. |
Description: IC AUDIO AMP AB 27-RDBS Features: Depop, Short-Circuit and Thermal Protection Packaging: Tube Package / Case: 27-SIP Formed Leads Output Type: 4-Channel (Quad) Mounting Type: Through Hole Type: Class AB Voltage - Supply: 6V ~ 18V Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm Supplier Device Package: 27-RDBS Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| TDF8548AJ/N1U | NXP USA Inc. |
Description: IC AMP CLASS AB QUAD 28W DBS27P Features: Depop, Short-Circuit and Thermal Protection Packaging: Tube Package / Case: 27-SIP, Formed Leads Output Type: 4-Channel (Quad) Mounting Type: Through Hole Type: Class AB Voltage - Supply: 6V ~ 18V Max Output Power x Channels @ Load: 28W x 4 @ 4Ohm Supplier Device Package: DBS27P Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| TDF8548ATH/N1U | NXP USA Inc. | Description: IC AMP CLASS AB QUAD 28W 36HSOP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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FXLC95000CLR1 | NXP USA Inc. |
Description: ACCEL 2-8G I2C/SPI 24LLPEP Part Status: Obsolete Sensitivity (LSB/g): 16393 (±2g) ~ 4098 (±8g) Supplier Device Package: 24-LLP-EP (4x5) Voltage - Supply: 1.71V ~ 1.89V Operating Temperature: -40°C ~ 85°C Acceleration Range: ±2g, 4g, 8g Axis: X, Y, Z Type: Digital Mounting Type: Surface Mount Output Type: I2C, SPI Package / Case: 24-TFLGA Features: Selectable Scale, Sleep Mode Packaging: Cut Tape (CT) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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PCA9570GMH | NXP USA Inc. |
Description: IC XPNDR 100KHZ I2C SMBUS 8XQFN Packaging: Cut Tape (CT) Features: POR Package / Case: 8-XFQFN Exposed Pad Output Type: Push-Pull Mounting Type: Surface Mount Interface: I2C, SMBus Number of I/O: 4 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.1V ~ 3.6V Clock Frequency: 100 kHz Interrupt Output: No Supplier Device Package: 8-XQFN (1.6x1.6) Current - Output Source/Sink: 4mA Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 56834 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA9952TW/Q900,118 | NXP USA Inc. |
Description: IC LED DRV LIN PWM 57MA 28HTSSOP Packaging: Cut Tape (CT) Package / Case: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad Voltage - Output: 40V Mounting Type: Surface Mount Number of Outputs: 16 Type: Linear Operating Temperature: -40°C ~ 85°C (TA) Applications: Backlight Current - Output / Channel: 57mA Internal Switch(s): Yes Supplier Device Package: 28-HTSSOP Dimming: PWM Voltage - Supply (Min): 3V Voltage - Supply (Max): 5.5V Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 11828 Stücke: Lieferzeit 10-14 Tag (e) |
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| PCAL6416AEXX | NXP USA Inc. |
Description: IC XPND 400KHZ I2C SMBUS 24XFBGA DigiKey Programmable: Not Verified Part Status: Obsolete Current - Output Source/Sink: 10mA, 25mA Supplier Device Package: 24-XFBGA (2x2) Interrupt Output: Yes Clock Frequency: 400 kHz Voltage - Supply: 1.65V ~ 5.5V Operating Temperature: -40°C ~ 85°C Number of I/O: 16 Interface: I2C, SMBus Mounting Type: Surface Mount Output Type: Open Drain, Push-Pull Package / Case: 24-XFBGA Features: POR Packaging: Cut Tape (CT) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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PCT2075DP,118 | NXP USA Inc. |
Description: SENSOR DIGITAL -55C-125C 8TSSOP Packaging: Cut Tape (CT) Features: Output Switch, Programmable Limit Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Output Type: I2C/SMBus Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C Voltage - Supply: 2.7V ~ 5.5V Sensor Type: Digital, Local Resolution: 11 b Supplier Device Package: 8-TSSOP Test Condition: -25°C ~ 100°C (-55°C ~ 125°C) Accuracy - Highest (Lowest): ±1°C (±2°C) Sensing Temperature - Local: -55°C ~ 125°C Part Status: Active |
auf Bestellung 38150 Stücke: Lieferzeit 10-14 Tag (e) |
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PTN36242LBS,518 | NXP USA Inc. |
Description: IC REDRIVER USB 3.0 2CH 32HVQFN Signal Conditioning: Input Equalization, Output De-Emphasis Supplier Device Package: 32-HVQFN (3x6) Applications: USB 3.0 Voltage - Supply: 3V ~ 3.6V Operating Temperature: 0°C ~ 85°C Type: Buffer, ReDriver Mounting Type: Surface Mount Number of Channels: 2 Delay Time: 0.4ns Package / Case: 32-VFQFN Exposed Pad Packaging: Cut Tape (CT) Current - Supply: 225mA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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SC16IS741AIPWJ | NXP USA Inc. |
Description: IC UART SGL I2C BUS SPI 16TSSOP Packaging: Cut Tape (CT) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Number of Channels: 1, UART Mounting Type: Surface Mount Voltage - Supply: 2.3V ~ 3.6V FIFO's: 64 Byte Protocol: RS232, RS485 Data Rate (Max): 5Mbps Supplier Device Package: 16-TSSOP With Auto Flow Control: Yes With IrDA Encoder/Decoder: Yes With Modem Control: Yes Part Status: Active |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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SDIO101AIHRZ | NXP USA Inc. |
Description: IC FLASH MEMORY CTRLR 60HXQFN |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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LPC11E37HFBD64/4QL | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFP Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 10K x 8 Program Memory Size: 128KB (128K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tray Number of I/O: 54 Part Status: Active Supplier Device Package: 64-LQFP (10x10) Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 8x10b Core Processor: ARM® Cortex®-M0 EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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OM13062UL | NXP USA Inc. |
Description: LPCXPRESSO LPC11U37H EVAL BRD Part Status: Active Platform: LPCXpresso™ Utilized IC / Part: LPC11U37H Board Type: Evaluation Platform Core Processor: ARM® Cortex®-M0 Contents: Board(s) Type: MCU 32-Bit Mounting Type: Fixed Packaging: Box |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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FRDM-FXS-MULTI-B | NXP USA Inc. |
Description: DEV KIT FOR XTRINSIC SENSOR BT Utilized IC / Part: Kinetis, mbed-Enabled Development Accessory Type: Sensor Board For Use With/Related Products: Kinetis, mbed-Enabled Development Packaging: Box |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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FRDM-FXS-9AXIS | NXP USA Inc. |
Description: DEV KIT FOR 9AXIS XTRINSIC SNSR Packaging: Box Accessory Type: Sensor Board Utilized IC / Part: Kinetis, mbed-Enabled Development |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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OM13061UL | NXP USA Inc. |
Description: XPLORER LPC1837 EVAL BRD Part Status: Obsolete Platform: Xplorer Utilized IC / Part: LPC1837 Board Type: Evaluation Platform Core Processor: ARM® Cortex®-M3 Contents: Board(s), Cable(s), Accessories Type: MCU 32-Bit Mounting Type: Fixed Packaging: Box |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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TWR-KW24D512 | NXP USA Inc. |
Description: TOWER SYSTEM KIT |
auf Bestellung 26 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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TWR-KW21D256 | NXP USA Inc. |
Description: TOWER SYSTEM KIT Utilized IC / Part: KW2x Contents: Board(s), Cable(s) Supplied Contents: Board(s), Cable(s) Type: Transceiver; 802.15.4 Frequency: 2.4GHz For Use With/Related Products: KW2x Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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PCF8545ATT/AJ | NXP USA Inc. |
Description: IC DRVR 320 SEGMENT 56TSSOP Packaging: Tape & Reel (TR) Package / Case: 56-TFSOP (0.240", 6.10mm Width) Display Type: LCD Mounting Type: Surface Mount Interface: I²C Configuration: 320 Segment Operating Temperature: -40°C ~ 95°C Voltage - Supply: 1.8V ~ 5.5V Supplier Device Package: 56-TSSOP Current - Supply: 30 µA |
Produkt ist nicht verfügbar |
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PCF8545BTT/AJ | NXP USA Inc. |
Description: IC DRVR 320 SEGMENT 56TSSOP Packaging: Tape & Reel (TR) Package / Case: 56-TFSOP (0.240", 6.10mm Width) Display Type: LCD Mounting Type: Surface Mount Interface: SPI Configuration: 320 Segment Operating Temperature: -40°C ~ 95°C Voltage - Supply: 1.8V ~ 5.5V Supplier Device Package: 56-TSSOP Part Status: Obsolete Current - Supply: 30 µA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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PCA8546ATT/AJ | NXP USA Inc. |
Description: IC DRVR 176 SEGMENT 56TSSOP Packaging: Tape & Reel (TR) Package / Case: 56-TFSOP (0.240", 6.10mm Width) Display Type: LCD Mounting Type: Surface Mount Interface: I2C Configuration: 176 Segment Operating Temperature: -40°C ~ 95°C Voltage - Supply: 1.8V ~ 5.5V Supplier Device Package: 56-TSSOP Current - Supply: 30 µA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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PCA8546BTT/AJ | NXP USA Inc. |
Description: IC DRVR 176 SEGMENT 56TSSOP Packaging: Tape & Reel (TR) Package / Case: 56-TFSOP (0.240", 6.10mm Width) Display Type: LCD Mounting Type: Surface Mount Interface: SPI Configuration: 176 Segment Operating Temperature: -40°C ~ 95°C Voltage - Supply: 1.8V ~ 5.5V Supplier Device Package: 56-TSSOP Current - Supply: 30 µA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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LPC11U67JBD48E | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 20K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 8x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 34 DigiKey Programmable: Not Verified |
auf Bestellung 1102 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC11U68JBD64E | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP DigiKey Programmable: Not Verified Number of I/O: 48 Supplier Device Package: 64-LQFP (10x10) Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Core Size: 32-Bit Single-Core Core Processor: ARM® Cortex®-M0+ EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Data Converters: A/D 10x12b Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 36K x 8 Program Memory Size: 256KB (256K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
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LPC11U68JBD100E | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 100LQFP DigiKey Programmable: Not Verified Number of I/O: 80 Supplier Device Package: 100-LQFP (14x14) Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 12x12b Core Processor: ARM® Cortex®-M0+ EEPROM Size: 4K x 8 Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 36K x 8 Program Memory Size: 256KB (256K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tray Program Memory Type: FLASH |
Produkt ist nicht verfügbar |
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OM13058UL | NXP USA Inc. |
Description: LPCXPRESSO LPC11U68 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M0+ Board Type: Evaluation Platform Utilized IC / Part: LPC11U68 Platform: LPCXpresso™ Part Status: Active |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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TWR-K64F120M | NXP USA Inc. |
Description: TOWER SYSTEM K64 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s) Core Processor: ARM® Cortex®-M4 Utilized IC / Part: K64 Platform: Tower System Part Status: Active |
Produkt ist nicht verfügbar |
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TWR-13237 | NXP USA Inc. |
Description: KIT DEVELOPMENT MC13237CHT Packaging: Box For Use With/Related Products: MC1323x Frequency: 2.4GHz Type: Transceiver; 802.15.4 (ZigBee®) Supplied Contents: Board(s) Part Status: Active |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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TWR-13237-KIT | NXP USA Inc. |
Description: KIT DEVELOPMENT MC13237CHT Packaging: Box For Use With/Related Products: MC1323x Frequency: 2.4GHz Type: Transceiver; 802.15.4 (ZigBee®) Supplied Contents: Board(s) Part Status: Active |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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| TWR-MC-FRDMKE02Z | NXP USA Inc. |
Description: TOWER MOD KE BD TWR-MC-LV3PH Packaging: Box For Use With/Related Products: Freescale Tower System Accessory Type: Interface Board Part Status: Active |
Produkt ist nicht verfügbar |
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13237ADC-BDM | NXP USA Inc. |
Description: KIT DEV MC13237CHT BDM Packaging: Bulk For Use With/Related Products: MC1323x Frequency: 2.4GHz Type: Transceiver; 802.15.4 (ZigBee®) Contents: Board(s) Utilized IC / Part: MC1323x Supplied Contents: Board(s) Part Status: Active |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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| ADAM20G1KIT | NXP USA Inc. |
Description: KIT EVAL ADAM 2.1GHZ Packaging: Bulk Type: Amplifier Supplied Contents: Board(s), Cable(s) Part Status: Active |
Produkt ist nicht verfügbar |
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BRKOUT-FXLN8361Q | NXP USA Inc. |
Description: BOARD BREAKOUT FXLN8361Q Packaging: Box Sensitivity: 229mV/g, 57.25mV/g Interface: Analog Contents: Board(s) Voltage - Supply: 1.71V ~ 3.6V Sensor Type: Accelerometer, 3 Axis Utilized IC / Part: FXLN8361Q Supplied Contents: Board(s) Sensing Range: ±2g, 8g |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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| BRKOUT-FXLN8362Q | NXP USA Inc. |
Description: BOARD BREAKOUT FXLN8362Q Packaging: Bulk Sensitivity: 114.5mV/g, 28.62mV/g Interface: Analog Voltage - Supply: 1.71V ~ 3.6V Sensor Type: Accelerometer, 3 Axis Utilized IC / Part: FXLN8362Q Supplied Contents: Board(s) Sensing Range: ±4g, ±16g |
Produkt ist nicht verfügbar |
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BRKOUT-FXLN8371Q | NXP USA Inc. |
Description: BOARD BREAKOUT FXLN8371Q Packaging: Box Sensitivity: 229mV/g, 57.25mV/g Interface: Analog Voltage - Supply: 1.71V ~ 3.6V Sensor Type: Accelerometer, 3 Axis Utilized IC / Part: FXLN8371Q Supplied Contents: Board(s) Sensing Range: ±2g, 8g |
Produkt ist nicht verfügbar |
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| BRKOUT-FXLS8471Q | NXP USA Inc. |
Description: BOARD BREAKOUT FXLS8471Q |
Produkt ist nicht verfügbar |
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| CWP-MCTB-S12ZV-N | NXP USA Inc. | Description: MOTOR CTRL TOOLBOX MC9S12ZVMX |
Produkt ist nicht verfügbar |
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| DLD-MCTB-S12ZV-N | NXP USA Inc. | Description: DNLD MC9S12ZVMX CTRL TOOLBOX |
Produkt ist nicht verfügbar |
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| DL-RAPPID577XKSW | NXP USA Inc. |
Description: DL PEX RAPPID SUITE V10 MPC577XK Packaging: Electronic Delivery For Use With/Related Products: MPC5xx Type: Integrated Development Environment (IDE) Applications: Programming Operating System: Windows Media Delivery Type: Electronically Delivered Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| KITFXLC95000MAG | NXP USA Inc. |
Description: KIT XTRINSIC FXLC95000 Packaging: Bulk Sensitivity: 0.061mg/LSB, 0.122mg/LSB, 0.244mg/LSB Interface: I2C, Serial, SPI Voltage - Supply: 1.71V ~ 1.89V Sensor Type: Accelerometer, Temperature Utilized IC / Part: FXLC95000CL Supplied Contents: Board(s) Embedded: Yes, MCU, 32-Bit Sensing Range: ±2g, 4g, 8g Part Status: Active |
Produkt ist nicht verfügbar |
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S912XDG128F2CAAR | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 80QFP Packaging: Tape & Reel (TR) Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12X Data Converters: A/D 8x10b, 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Part Status: Not For New Designs Number of I/O: 59 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
S9S12VR48AF0MLFR | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 48LQFP DigiKey Programmable: Not Verified Number of I/O: 28 Supplier Device Package: 48-LQFP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: IrDA, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 6x10b Core Processor: 12V1 EEPROM Size: 512 x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 2K x 8 Program Memory Size: 48KB (48K x 8) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
AFT21H350W03SR6 | NXP USA Inc. |
Description: FET RF 2CH 65V 2.11GHZ NI1230S Current - Test: 750 mA Voltage - Test: 28 V Voltage - Rated: 65 V Part Status: Obsolete Supplier Device Package: NI-1230S Technology: LDMOS Gain: 16.4dB Power - Output: 63W Frequency: 2.11GHz Mounting Type: Chassis Mount Package / Case: NI-1230S Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| AFT21H350W04GSR6 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI1230 Current - Test: 750 mA Voltage - Test: 28 V Voltage - Rated: 65 V Supplier Device Package: NI-1230S-4 GULL Technology: LDMOS Gain: 16.4dB Power - Output: 63W Frequency: 2.11GHz Mounting Type: Chassis Mount Package / Case: NI-1230S-4 GW Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| AFT23S160W02GSR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Current - Test: 1.1 A Voltage - Test: 28 V Voltage - Rated: 65 V Part Status: Obsolete Supplier Device Package: NI-780GS-2L Technology: LDMOS Gain: 17.9dB Power - Output: 45W Frequency: 2.4GHz Mounting Type: Surface Mount Package / Case: NI-780GS-2L Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
 |
AFT23S160W02SR3 | NXP USA Inc. |
Description: FET RF 65V 2.4GHZ NI780S-2 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
AFT26H200W03SR6 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI1230 Current - Test: 500 mA Voltage - Test: 28 V Voltage - Rated: 65 V Part Status: Obsolete Supplier Device Package: NI-1230-4S Technology: LDMOS Gain: 14.1dB Power - Output: 45W Frequency: 2.5GHz Mounting Type: Chassis Mount Package / Case: NI-1230-4S Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
AFT27S006NT1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V PLD-1.5W Packaging: Tape & Reel (TR) Package / Case: PLD-1.5W Mounting Type: Surface Mount Frequency: 2.17GHz Power - Output: 28.8dBm Gain: 22dB Technology: LDMOS Supplier Device Package: PLD-1.5W Part Status: Active Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 70 mA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
 |
MC06XS4200BFKR2 | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:1 23PQFN Features: Internal PWM, Slew Rate Controlled Packaging: Tape & Reel (TR) Package / Case: 23-PowerQFN Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 2 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 6mOhm (Max) Voltage - Load: 8V ~ 36V Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Current - Output (Max): 9A Ratio - Input:Output: 1:1 Supplier Device Package: 23-PQFN (12x12) Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| MC10XS3535JHFKR2 | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:6 24PQFN Features: Watchdog Timer Packaging: Tape & Reel (TR) Package / Case: 24-PowerQFN Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 6 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 10mOhm (Max), 35mOhm (Max) Voltage - Load: 7V ~ 20V Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Ratio - Input:Output: 1:6 Supplier Device Package: 24-PQFN (12x12) Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| PCT1075TP,147 |
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| TFF1013HN/N1,115 |
|
Hersteller: NXP USA Inc.
Description: IC DOWNCONVERTER 16DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 10.7GHz ~ 12.75GHz
RF Type: Ku-Band
Voltage - Supply: 5V
Gain: 33dB
Current - Supply: 52mA
Secondary Attributes: Down Converter
Noise Figure: 9dB
Number of Mixers: 1
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Part Status: Obsolete
Description: IC DOWNCONVERTER 16DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 10.7GHz ~ 12.75GHz
RF Type: Ku-Band
Voltage - Supply: 5V
Gain: 33dB
Current - Supply: 52mA
Secondary Attributes: Down Converter
Noise Figure: 9dB
Number of Mixers: 1
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MFA100FHI33/01E |
Hersteller: NXP USA Inc.
Description: IC AUDIO DEVICE 32HVQFN
Mounting Type: Surface Mount
Packaging: Tray
Description: IC AUDIO DEVICE 32HVQFN
Mounting Type: Surface Mount
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 490 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| PN512AA0HN1/C2,551 |
|
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 90°C
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Obsolete
Description: IC RFID RDR/TRAN 13.56MZ 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 90°C
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Obsolete
Produkt ist nicht verfügbar
Mindestbestellmenge: 490 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| PN512AA0HN1/C2,557 |
|
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 90°C
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Obsolete
Description: IC RFID RDR/TRAN 13.56MZ 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 90°C
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Obsolete
Produkt ist nicht verfügbar
Mindestbestellmenge: 2450 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| PR5331C3HN/C370E |
|
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 40HVQFN
Description: IC RFID READER 13.56MHZ 40HVQFN
auf Bestellung 634 Stücke:
Lieferzeit 10-14 Tag (e)
| BLF8G22LS-310AVU |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS
Packaging: Tube
Part Status: Active
Technology: LDMOS
Description: RF MOSFET LDMOS
Packaging: Tube
Part Status: Active
Technology: LDMOS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PSMN3R9-60XSQ |
|
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 60V 75A TO220F
Packaging: Tube
Package / Case: TO-220-3 Full Pack, Isolated Tab
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 4mOhm @ 25A, 10V
Power Dissipation (Max): 55W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220F
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 103 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5494 pF @ 25 V
Description: MOSFET N-CH 60V 75A TO220F
Packaging: Tube
Package / Case: TO-220-3 Full Pack, Isolated Tab
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 4mOhm @ 25A, 10V
Power Dissipation (Max): 55W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220F
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 103 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5494 pF @ 25 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TDA3629/YWU |
|
Hersteller: NXP USA Inc.
Description: IC LIGHT POSITION CTRLR 8-DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 8V ~ 18V
Current - Supply: 6mA
Supplier Device Package: 8-DIP
Grade: Automotive
Part Status: Obsolete
Description: IC LIGHT POSITION CTRLR 8-DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 8V ~ 18V
Current - Supply: 6mA
Supplier Device Package: 8-DIP
Grade: Automotive
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TDF8546AJ/N1,112 |
Hersteller: NXP USA Inc.
Description: IC AUDIO AMP AB DBS27P
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tube
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm
Supplier Device Package: DBS27P
Part Status: Obsolete
Description: IC AUDIO AMP AB DBS27P
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tube
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm
Supplier Device Package: DBS27P
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TDF8546ASD/N1,112 |
Hersteller: NXP USA Inc.
Description: IC AUDIO AMP AB 27-RDBS
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tube
Package / Case: 27-SIP Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm
Supplier Device Package: 27-RDBS
Part Status: Active
Description: IC AUDIO AMP AB 27-RDBS
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tube
Package / Case: 27-SIP Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm
Supplier Device Package: 27-RDBS
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TDF8548AJ/N1U |
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB QUAD 28W DBS27P
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tube
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 28W x 4 @ 4Ohm
Supplier Device Package: DBS27P
Part Status: Obsolete
Description: IC AMP CLASS AB QUAD 28W DBS27P
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tube
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 28W x 4 @ 4Ohm
Supplier Device Package: DBS27P
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TDF8548ATH/N1U |
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB QUAD 28W 36HSOP
Description: IC AMP CLASS AB QUAD 28W 36HSOP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FXLC95000CLR1 |
|
Hersteller: NXP USA Inc.
Description: ACCEL 2-8G I2C/SPI 24LLPEP
Part Status: Obsolete
Sensitivity (LSB/g): 16393 (±2g) ~ 4098 (±8g)
Supplier Device Package: 24-LLP-EP (4x5)
Voltage - Supply: 1.71V ~ 1.89V
Operating Temperature: -40°C ~ 85°C
Acceleration Range: ±2g, 4g, 8g
Axis: X, Y, Z
Type: Digital
Mounting Type: Surface Mount
Output Type: I2C, SPI
Package / Case: 24-TFLGA
Features: Selectable Scale, Sleep Mode
Packaging: Cut Tape (CT)
Description: ACCEL 2-8G I2C/SPI 24LLPEP
Part Status: Obsolete
Sensitivity (LSB/g): 16393 (±2g) ~ 4098 (±8g)
Supplier Device Package: 24-LLP-EP (4x5)
Voltage - Supply: 1.71V ~ 1.89V
Operating Temperature: -40°C ~ 85°C
Acceleration Range: ±2g, 4g, 8g
Axis: X, Y, Z
Type: Digital
Mounting Type: Surface Mount
Output Type: I2C, SPI
Package / Case: 24-TFLGA
Features: Selectable Scale, Sleep Mode
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCA9570GMH |
|
Hersteller: NXP USA Inc.
Description: IC XPNDR 100KHZ I2C SMBUS 8XQFN
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 8-XFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 4
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 3.6V
Clock Frequency: 100 kHz
Interrupt Output: No
Supplier Device Package: 8-XQFN (1.6x1.6)
Current - Output Source/Sink: 4mA
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC XPNDR 100KHZ I2C SMBUS 8XQFN
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 8-XFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 4
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 3.6V
Clock Frequency: 100 kHz
Interrupt Output: No
Supplier Device Package: 8-XQFN (1.6x1.6)
Current - Output Source/Sink: 4mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 56834 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 13+ | 1.74 EUR |
| 17+ | 1.25 EUR |
| 25+ | 1.12 EUR |
| 100+ | 0.99 EUR |
| 250+ | 0.93 EUR |
| 500+ | 0.88 EUR |
| 1000+ | 0.86 EUR |
| PCA9952TW/Q900,118 |
|
Hersteller: NXP USA Inc.
Description: IC LED DRV LIN PWM 57MA 28HTSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
Voltage - Output: 40V
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 57mA
Internal Switch(s): Yes
Supplier Device Package: 28-HTSSOP
Dimming: PWM
Voltage - Supply (Min): 3V
Voltage - Supply (Max): 5.5V
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC LED DRV LIN PWM 57MA 28HTSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
Voltage - Output: 40V
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 57mA
Internal Switch(s): Yes
Supplier Device Package: 28-HTSSOP
Dimming: PWM
Voltage - Supply (Min): 3V
Voltage - Supply (Max): 5.5V
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 11828 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 8.19 EUR |
| 10+ | 6.2 EUR |
| 25+ | 5.71 EUR |
| 100+ | 5.16 EUR |
| 250+ | 4.9 EUR |
| PCAL6416AEXX |
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24XFBGA
DigiKey Programmable: Not Verified
Part Status: Obsolete
Current - Output Source/Sink: 10mA, 25mA
Supplier Device Package: 24-XFBGA (2x2)
Interrupt Output: Yes
Clock Frequency: 400 kHz
Voltage - Supply: 1.65V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Number of I/O: 16
Interface: I2C, SMBus
Mounting Type: Surface Mount
Output Type: Open Drain, Push-Pull
Package / Case: 24-XFBGA
Features: POR
Packaging: Cut Tape (CT)
Description: IC XPND 400KHZ I2C SMBUS 24XFBGA
DigiKey Programmable: Not Verified
Part Status: Obsolete
Current - Output Source/Sink: 10mA, 25mA
Supplier Device Package: 24-XFBGA (2x2)
Interrupt Output: Yes
Clock Frequency: 400 kHz
Voltage - Supply: 1.65V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Number of I/O: 16
Interface: I2C, SMBus
Mounting Type: Surface Mount
Output Type: Open Drain, Push-Pull
Package / Case: 24-XFBGA
Features: POR
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCT2075DP,118 |
|
Hersteller: NXP USA Inc.
Description: SENSOR DIGITAL -55C-125C 8TSSOP
Packaging: Cut Tape (CT)
Features: Output Switch, Programmable Limit
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-TSSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Active
Description: SENSOR DIGITAL -55C-125C 8TSSOP
Packaging: Cut Tape (CT)
Features: Output Switch, Programmable Limit
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-TSSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±1°C (±2°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Active
auf Bestellung 38150 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 15+ | 1.49 EUR |
| 17+ | 1.3 EUR |
| 18+ | 1.23 EUR |
| 25+ | 1.15 EUR |
| 50+ | 1.09 EUR |
| 100+ | 1.05 EUR |
| 500+ | 0.94 EUR |
| 1000+ | 0.9 EUR |
| PTN36242LBS,518 |
|
Hersteller: NXP USA Inc.
Description: IC REDRIVER USB 3.0 2CH 32HVQFN
Signal Conditioning: Input Equalization, Output De-Emphasis
Supplier Device Package: 32-HVQFN (3x6)
Applications: USB 3.0
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: 0°C ~ 85°C
Type: Buffer, ReDriver
Mounting Type: Surface Mount
Number of Channels: 2
Delay Time: 0.4ns
Package / Case: 32-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Current - Supply: 225mA
Description: IC REDRIVER USB 3.0 2CH 32HVQFN
Signal Conditioning: Input Equalization, Output De-Emphasis
Supplier Device Package: 32-HVQFN (3x6)
Applications: USB 3.0
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: 0°C ~ 85°C
Type: Buffer, ReDriver
Mounting Type: Surface Mount
Number of Channels: 2
Delay Time: 0.4ns
Package / Case: 32-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Current - Supply: 225mA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SC16IS741AIPWJ |
|
Hersteller: NXP USA Inc.
Description: IC UART SGL I2C BUS SPI 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Number of Channels: 1, UART
Mounting Type: Surface Mount
Voltage - Supply: 2.3V ~ 3.6V
FIFO's: 64 Byte
Protocol: RS232, RS485
Data Rate (Max): 5Mbps
Supplier Device Package: 16-TSSOP
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With Modem Control: Yes
Part Status: Active
Description: IC UART SGL I2C BUS SPI 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Number of Channels: 1, UART
Mounting Type: Surface Mount
Voltage - Supply: 2.3V ~ 3.6V
FIFO's: 64 Byte
Protocol: RS232, RS485
Data Rate (Max): 5Mbps
Supplier Device Package: 16-TSSOP
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With Modem Control: Yes
Part Status: Active
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 6.18 EUR |
| SDIO101AIHRZ |
|
Hersteller: NXP USA Inc.
Description: IC FLASH MEMORY CTRLR 60HXQFN
Description: IC FLASH MEMORY CTRLR 60HXQFN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC11E37HFBD64/4QL |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 10K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 10K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| OM13062UL |
|
Hersteller: NXP USA Inc.
Description: LPCXPRESSO LPC11U37H EVAL BRD
Part Status: Active
Platform: LPCXpresso™
Utilized IC / Part: LPC11U37H
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-M0
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Description: LPCXPRESSO LPC11U37H EVAL BRD
Part Status: Active
Platform: LPCXpresso™
Utilized IC / Part: LPC11U37H
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-M0
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FRDM-FXS-MULTI-B |
|
Hersteller: NXP USA Inc.
Description: DEV KIT FOR XTRINSIC SENSOR BT
Utilized IC / Part: Kinetis, mbed-Enabled Development
Accessory Type: Sensor Board
For Use With/Related Products: Kinetis, mbed-Enabled Development
Packaging: Box
Description: DEV KIT FOR XTRINSIC SENSOR BT
Utilized IC / Part: Kinetis, mbed-Enabled Development
Accessory Type: Sensor Board
For Use With/Related Products: Kinetis, mbed-Enabled Development
Packaging: Box
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FRDM-FXS-9AXIS |
|
Hersteller: NXP USA Inc.
Description: DEV KIT FOR 9AXIS XTRINSIC SNSR
Packaging: Box
Accessory Type: Sensor Board
Utilized IC / Part: Kinetis, mbed-Enabled Development
Description: DEV KIT FOR 9AXIS XTRINSIC SNSR
Packaging: Box
Accessory Type: Sensor Board
Utilized IC / Part: Kinetis, mbed-Enabled Development
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| OM13061UL |
|
Hersteller: NXP USA Inc.
Description: XPLORER LPC1837 EVAL BRD
Part Status: Obsolete
Platform: Xplorer
Utilized IC / Part: LPC1837
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-M3
Contents: Board(s), Cable(s), Accessories
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Description: XPLORER LPC1837 EVAL BRD
Part Status: Obsolete
Platform: Xplorer
Utilized IC / Part: LPC1837
Board Type: Evaluation Platform
Core Processor: ARM® Cortex®-M3
Contents: Board(s), Cable(s), Accessories
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TWR-KW24D512 |
|
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM KIT
Description: TOWER SYSTEM KIT
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)
| TWR-KW21D256 |
|
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM KIT
Utilized IC / Part: KW2x
Contents: Board(s), Cable(s)
Supplied Contents: Board(s), Cable(s)
Type: Transceiver; 802.15.4
Frequency: 2.4GHz
For Use With/Related Products: KW2x
Packaging: Bulk
Description: TOWER SYSTEM KIT
Utilized IC / Part: KW2x
Contents: Board(s), Cable(s)
Supplied Contents: Board(s), Cable(s)
Type: Transceiver; 802.15.4
Frequency: 2.4GHz
For Use With/Related Products: KW2x
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCF8545ATT/AJ |
|
Hersteller: NXP USA Inc.
Description: IC DRVR 320 SEGMENT 56TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I²C
Configuration: 320 Segment
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.8V ~ 5.5V
Supplier Device Package: 56-TSSOP
Current - Supply: 30 µA
Description: IC DRVR 320 SEGMENT 56TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I²C
Configuration: 320 Segment
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.8V ~ 5.5V
Supplier Device Package: 56-TSSOP
Current - Supply: 30 µA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PCF8545BTT/AJ |
|
Hersteller: NXP USA Inc.
Description: IC DRVR 320 SEGMENT 56TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: SPI
Configuration: 320 Segment
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.8V ~ 5.5V
Supplier Device Package: 56-TSSOP
Part Status: Obsolete
Current - Supply: 30 µA
Description: IC DRVR 320 SEGMENT 56TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: SPI
Configuration: 320 Segment
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.8V ~ 5.5V
Supplier Device Package: 56-TSSOP
Part Status: Obsolete
Current - Supply: 30 µA
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| PCA8546ATT/AJ |
|
Hersteller: NXP USA Inc.
Description: IC DRVR 176 SEGMENT 56TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 176 Segment
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.8V ~ 5.5V
Supplier Device Package: 56-TSSOP
Current - Supply: 30 µA
Description: IC DRVR 176 SEGMENT 56TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 176 Segment
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.8V ~ 5.5V
Supplier Device Package: 56-TSSOP
Current - Supply: 30 µA
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| PCA8546BTT/AJ |
|
Hersteller: NXP USA Inc.
Description: IC DRVR 176 SEGMENT 56TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: SPI
Configuration: 176 Segment
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.8V ~ 5.5V
Supplier Device Package: 56-TSSOP
Current - Supply: 30 µA
Description: IC DRVR 176 SEGMENT 56TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: SPI
Configuration: 176 Segment
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.8V ~ 5.5V
Supplier Device Package: 56-TSSOP
Current - Supply: 30 µA
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| LPC11U67JBD48E |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
auf Bestellung 1102 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 14.24 EUR |
| 10+ | 11 EUR |
| 50+ | 9.7 EUR |
| 100+ | 9.29 EUR |
| 250+ | 8.88 EUR |
| 500+ | 8.62 EUR |
| LPC11U68JBD64E |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 48
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit Single-Core
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Data Converters: A/D 10x12b
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 36K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Description: IC MCU 32BIT 256KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 48
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit Single-Core
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Data Converters: A/D 10x12b
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 36K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPC11U68JBD100E |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 80
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 4K x 8
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 36K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Program Memory Type: FLASH
Description: IC MCU 32BIT 256KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 80
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 4K x 8
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 36K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Program Memory Type: FLASH
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| OM13058UL |
|
Hersteller: NXP USA Inc.
Description: LPCXPRESSO LPC11U68 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: LPC11U68
Platform: LPCXpresso™
Part Status: Active
Description: LPCXPRESSO LPC11U68 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Board Type: Evaluation Platform
Utilized IC / Part: LPC11U68
Platform: LPCXpresso™
Part Status: Active
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 60.15 EUR |
| TWR-K64F120M |
|
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM K64 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: K64
Platform: Tower System
Part Status: Active
Description: TOWER SYSTEM K64 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: K64
Platform: Tower System
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TWR-13237 |
|
Hersteller: NXP USA Inc.
Description: KIT DEVELOPMENT MC13237CHT
Packaging: Box
For Use With/Related Products: MC1323x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (ZigBee®)
Supplied Contents: Board(s)
Part Status: Active
Description: KIT DEVELOPMENT MC13237CHT
Packaging: Box
For Use With/Related Products: MC1323x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (ZigBee®)
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 432.49 EUR |
| TWR-13237-KIT |
|
Hersteller: NXP USA Inc.
Description: KIT DEVELOPMENT MC13237CHT
Packaging: Box
For Use With/Related Products: MC1323x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (ZigBee®)
Supplied Contents: Board(s)
Part Status: Active
Description: KIT DEVELOPMENT MC13237CHT
Packaging: Box
For Use With/Related Products: MC1323x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (ZigBee®)
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 688.39 EUR |
| TWR-MC-FRDMKE02Z |
Hersteller: NXP USA Inc.
Description: TOWER MOD KE BD TWR-MC-LV3PH
Packaging: Box
For Use With/Related Products: Freescale Tower System
Accessory Type: Interface Board
Part Status: Active
Description: TOWER MOD KE BD TWR-MC-LV3PH
Packaging: Box
For Use With/Related Products: Freescale Tower System
Accessory Type: Interface Board
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 13237ADC-BDM |
|
Hersteller: NXP USA Inc.
Description: KIT DEV MC13237CHT BDM
Packaging: Bulk
For Use With/Related Products: MC1323x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (ZigBee®)
Contents: Board(s)
Utilized IC / Part: MC1323x
Supplied Contents: Board(s)
Part Status: Active
Description: KIT DEV MC13237CHT BDM
Packaging: Bulk
For Use With/Related Products: MC1323x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (ZigBee®)
Contents: Board(s)
Utilized IC / Part: MC1323x
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 846.52 EUR |
| ADAM20G1KIT |
Hersteller: NXP USA Inc.
Description: KIT EVAL ADAM 2.1GHZ
Packaging: Bulk
Type: Amplifier
Supplied Contents: Board(s), Cable(s)
Part Status: Active
Description: KIT EVAL ADAM 2.1GHZ
Packaging: Bulk
Type: Amplifier
Supplied Contents: Board(s), Cable(s)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BRKOUT-FXLN8361Q |
|
Hersteller: NXP USA Inc.
Description: BOARD BREAKOUT FXLN8361Q
Packaging: Box
Sensitivity: 229mV/g, 57.25mV/g
Interface: Analog
Contents: Board(s)
Voltage - Supply: 1.71V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: FXLN8361Q
Supplied Contents: Board(s)
Sensing Range: ±2g, 8g
Description: BOARD BREAKOUT FXLN8361Q
Packaging: Box
Sensitivity: 229mV/g, 57.25mV/g
Interface: Analog
Contents: Board(s)
Voltage - Supply: 1.71V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: FXLN8361Q
Supplied Contents: Board(s)
Sensing Range: ±2g, 8g
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 27.89 EUR |
| BRKOUT-FXLN8362Q |
|
Hersteller: NXP USA Inc.
Description: BOARD BREAKOUT FXLN8362Q
Packaging: Bulk
Sensitivity: 114.5mV/g, 28.62mV/g
Interface: Analog
Voltage - Supply: 1.71V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: FXLN8362Q
Supplied Contents: Board(s)
Sensing Range: ±4g, ±16g
Description: BOARD BREAKOUT FXLN8362Q
Packaging: Bulk
Sensitivity: 114.5mV/g, 28.62mV/g
Interface: Analog
Voltage - Supply: 1.71V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: FXLN8362Q
Supplied Contents: Board(s)
Sensing Range: ±4g, ±16g
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BRKOUT-FXLN8371Q |
|
Hersteller: NXP USA Inc.
Description: BOARD BREAKOUT FXLN8371Q
Packaging: Box
Sensitivity: 229mV/g, 57.25mV/g
Interface: Analog
Voltage - Supply: 1.71V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: FXLN8371Q
Supplied Contents: Board(s)
Sensing Range: ±2g, 8g
Description: BOARD BREAKOUT FXLN8371Q
Packaging: Box
Sensitivity: 229mV/g, 57.25mV/g
Interface: Analog
Voltage - Supply: 1.71V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: FXLN8371Q
Supplied Contents: Board(s)
Sensing Range: ±2g, 8g
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BRKOUT-FXLS8471Q |
|
Hersteller: NXP USA Inc.
Description: BOARD BREAKOUT FXLS8471Q
Description: BOARD BREAKOUT FXLS8471Q
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| CWP-MCTB-S12ZV-N |
Hersteller: NXP USA Inc.
Description: MOTOR CTRL TOOLBOX MC9S12ZVMX
Description: MOTOR CTRL TOOLBOX MC9S12ZVMX
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| DLD-MCTB-S12ZV-N |
Hersteller: NXP USA Inc.
Description: DNLD MC9S12ZVMX CTRL TOOLBOX
Description: DNLD MC9S12ZVMX CTRL TOOLBOX
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| DL-RAPPID577XKSW |
Hersteller: NXP USA Inc.
Description: DL PEX RAPPID SUITE V10 MPC577XK
Packaging: Electronic Delivery
For Use With/Related Products: MPC5xx
Type: Integrated Development Environment (IDE)
Applications: Programming
Operating System: Windows
Media Delivery Type: Electronically Delivered
Part Status: Active
Description: DL PEX RAPPID SUITE V10 MPC577XK
Packaging: Electronic Delivery
For Use With/Related Products: MPC5xx
Type: Integrated Development Environment (IDE)
Applications: Programming
Operating System: Windows
Media Delivery Type: Electronically Delivered
Part Status: Active
Produkt ist nicht verfügbar
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| KITFXLC95000MAG |
Hersteller: NXP USA Inc.
Description: KIT XTRINSIC FXLC95000
Packaging: Bulk
Sensitivity: 0.061mg/LSB, 0.122mg/LSB, 0.244mg/LSB
Interface: I2C, Serial, SPI
Voltage - Supply: 1.71V ~ 1.89V
Sensor Type: Accelerometer, Temperature
Utilized IC / Part: FXLC95000CL
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Sensing Range: ±2g, 4g, 8g
Part Status: Active
Description: KIT XTRINSIC FXLC95000
Packaging: Bulk
Sensitivity: 0.061mg/LSB, 0.122mg/LSB, 0.244mg/LSB
Interface: I2C, Serial, SPI
Voltage - Supply: 1.71V ~ 1.89V
Sensor Type: Accelerometer, Temperature
Utilized IC / Part: FXLC95000CL
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Sensing Range: ±2g, 4g, 8g
Part Status: Active
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| S912XDG128F2CAAR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Not For New Designs
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Not For New Designs
Number of I/O: 59
DigiKey Programmable: Not Verified
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| S9S12VR48AF0MLFR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 6x10b
Core Processor: 12V1
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Description: IC MCU 16BIT 48KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 6x10b
Core Processor: 12V1
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 2K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
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| AFT21H350W03SR6 |
Hersteller: NXP USA Inc.
Description: FET RF 2CH 65V 2.11GHZ NI1230S
Current - Test: 750 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: NI-1230S
Technology: LDMOS
Gain: 16.4dB
Power - Output: 63W
Frequency: 2.11GHz
Mounting Type: Chassis Mount
Package / Case: NI-1230S
Packaging: Tape & Reel (TR)
Description: FET RF 2CH 65V 2.11GHZ NI1230S
Current - Test: 750 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: NI-1230S
Technology: LDMOS
Gain: 16.4dB
Power - Output: 63W
Frequency: 2.11GHz
Mounting Type: Chassis Mount
Package / Case: NI-1230S
Packaging: Tape & Reel (TR)
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| AFT21H350W04GSR6 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI1230
Current - Test: 750 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-1230S-4 GULL
Technology: LDMOS
Gain: 16.4dB
Power - Output: 63W
Frequency: 2.11GHz
Mounting Type: Chassis Mount
Package / Case: NI-1230S-4 GW
Packaging: Tape & Reel (TR)
Description: RF MOSFET LDMOS 28V NI1230
Current - Test: 750 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-1230S-4 GULL
Technology: LDMOS
Gain: 16.4dB
Power - Output: 63W
Frequency: 2.11GHz
Mounting Type: Chassis Mount
Package / Case: NI-1230S-4 GW
Packaging: Tape & Reel (TR)
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| AFT23S160W02GSR3 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Current - Test: 1.1 A
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: NI-780GS-2L
Technology: LDMOS
Gain: 17.9dB
Power - Output: 45W
Frequency: 2.4GHz
Mounting Type: Surface Mount
Package / Case: NI-780GS-2L
Packaging: Tape & Reel (TR)
Description: RF MOSFET LDMOS 28V NI780
Current - Test: 1.1 A
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: NI-780GS-2L
Technology: LDMOS
Gain: 17.9dB
Power - Output: 45W
Frequency: 2.4GHz
Mounting Type: Surface Mount
Package / Case: NI-780GS-2L
Packaging: Tape & Reel (TR)
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| AFT23S160W02SR3 |
|
Hersteller: NXP USA Inc.
Description: FET RF 65V 2.4GHZ NI780S-2
Description: FET RF 65V 2.4GHZ NI780S-2
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| AFT26H200W03SR6 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI1230
Current - Test: 500 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: NI-1230-4S
Technology: LDMOS
Gain: 14.1dB
Power - Output: 45W
Frequency: 2.5GHz
Mounting Type: Chassis Mount
Package / Case: NI-1230-4S
Packaging: Tape & Reel (TR)
Description: RF MOSFET LDMOS 28V NI1230
Current - Test: 500 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: NI-1230-4S
Technology: LDMOS
Gain: 14.1dB
Power - Output: 45W
Frequency: 2.5GHz
Mounting Type: Chassis Mount
Package / Case: NI-1230-4S
Packaging: Tape & Reel (TR)
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| AFT27S006NT1 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V PLD-1.5W
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 28.8dBm
Gain: 22dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 70 mA
Description: RF MOSFET LDMOS 28V PLD-1.5W
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 28.8dBm
Gain: 22dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 70 mA
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| MC06XS4200BFKR2 |
|
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 23PQFN
Features: Internal PWM, Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 6mOhm (Max)
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 9A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Description: IC PWR SWITCH N-CHAN 1:1 23PQFN
Features: Internal PWM, Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 6mOhm (Max)
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 9A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
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| MC10XS3535JHFKR2 |
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:6 24PQFN
Features: Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm (Max), 35mOhm (Max)
Voltage - Load: 7V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Ratio - Input:Output: 1:6
Supplier Device Package: 24-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Part Status: Obsolete
Description: IC PWR SWITCH N-CHAN 1:6 24PQFN
Features: Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm (Max), 35mOhm (Max)
Voltage - Load: 7V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Ratio - Input:Output: 1:6
Supplier Device Package: 24-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Part Status: Obsolete
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