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HEF4070BP-Q100U NXP USA Inc. Description: IC GATE XOR 4CH 2-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3mA, 3mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 3.5V ~ 11V
Input Logic Level - Low: 1.5V ~ 4V
Max Propagation Delay @ V, Max CL: 55ns @ 15V, 50pF
Grade: Automotive
Part Status: Obsolete
Number of Circuits: 4
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TEA1721ADB1061,598 NXP USA Inc. 75017320.pdf Description: EVAL BOARD FOR TEA1721
Packaging: Box
Voltage - Output: 3.3V, 12V
Voltage - Input: 85 ~ 265 VAC
Current - Output: 400mA, 400mA
Contents: Board(s)
Frequency - Switching: 51kHz
Regulator Topology: Flyback
Board Type: Fully Populated
Utilized IC / Part: TEA1721
Supplied Contents: Board(s)
Main Purpose: AC/DC, Primary Side
Outputs and Type: 2 Isolated Outputs
Part Status: Active
Power - Output: 5W
Produkt ist nicht verfügbar
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TEA1721ADB1059,598 NXP USA Inc. 75017320.pdf Description: EVAL BOARD FOR TEA1721
Packaging: Box
Voltage - Output: 12V
Voltage - Input: 85 ~ 265 VAC
Current - Output: 200mA
Contents: Board(s)
Frequency - Switching: 50kHz
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: TEA1721
Supplied Contents: Board(s)
Main Purpose: AC/DC, Non-Isolated
Outputs and Type: 1 Non-Isolated Output
Part Status: Active
Power - Output: 2.5W
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TEA1721ADB1060,598 NXP USA Inc. UM10522.pdf Description: EVAL BOARD FOR TEA1721
Packaging: Box
Voltage - Output: -12V
Voltage - Input: 85 ~ 265 VAC
Current - Output: 200mA
Contents: Board(s)
Frequency - Switching: 50kHz
Regulator Topology: Flyback
Board Type: Fully Populated
Utilized IC / Part: TEA1721
Supplied Contents: Board(s)
Main Purpose: AC/DC, Non-Isolated
Outputs and Type: 1 Non-Isolated Output
Part Status: Active
Power - Output: 2.5W
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TEA1721ADB1062,598 NXP USA Inc. 75017320.pdf Description: EVAL BOARD FOR TEA1721
Packaging: Box
Voltage - Output: 3.3V, 5V, 24V
Voltage - Input: 85 ~ 560 VAC
Current - Output: 300mA, 300mA, 200mA
Frequency - Switching: 50kHz
Regulator Topology: Flyback
Board Type: Fully Populated
Utilized IC / Part: TEA1721
Supplied Contents: Board(s)
Main Purpose: AC/DC, Primary Side
Outputs and Type: 3 Isolated Outputs
Part Status: Active
Power - Output: 5W
Contents: Board(s)
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TEA1721BDB1065,598 NXP USA Inc. 75017320.pdf Description: EVAL BOARD FOR TEA1721
Power - Output: 5W
Part Status: Active
Contents: Board(s)
Outputs and Type: 2 Isolated Outputs
Main Purpose: AC/DC, Primary Side
Supplied Contents: Board(s)
Utilized IC / Part: TEA1721
Board Type: Fully Populated
Regulator Topology: Flyback
Frequency - Switching: 50kHz
Current - Output: 400mA, 400mA
Voltage - Input: 85 ~ 265 VAC
Voltage - Output: -3.3V, -12V
Packaging: Box
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MKL02Z32CAF4R MKL02Z32CAF4R NXP USA Inc. KL0xPB.pdf Description: IC MCU 32BIT 32KB FLASH 20WLCSP
DigiKey Programmable: Not Verified
Number of I/O: 18
Part Status: Active
Supplier Device Package: 20-WLCSP (1.99x1.94)
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 20-UFBGA, WLCSP
Packaging: Cut Tape (CT)
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NX3P2902BUKZ NX3P2902BUKZ NXP USA Inc. NX3P2902B.pdf Description: IC PWR SWITCH P-CHAN 1:1 4WLCSP
Part Status: Active
Supplier Device Package: 4-WLCSP (0.74x0.74)
Ratio - Input:Output: 1:1
Current - Output (Max): 500mA
Voltage - Supply (Vcc/Vdd): Not Required
Voltage - Load: 1.1V ~ 3.6V
Input Type: Non-Inverting
Rds On (Typ): 65mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TJ)
Switch Type: General Purpose
Interface: On/Off
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: P-Channel
Package / Case: 4-UFBGA, WLCSP
Features: Load Discharge, Slew Rate Controlled
Packaging: Tape & Reel (TR)
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NX3DV221TKX NX3DV221TKX NXP USA Inc. NX3DV221.pdf Description: IC USB 2.0 SWITCH HS 10HVSON
Features: Bi-Directional
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: USB
On-State Resistance (Max): 7Ohm
-3db Bandwidth: 1GHz
Supplier Device Package: 10-HVSON (3x3)
Voltage - Supply, Single (V+): 2.3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 1
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NX3DV42GU10X NX3DV42GU10X NXP USA Inc. NX3DV42.pdf Description: IC USB 2.0 SWITCH HS 10XQFN
Features: Break-Before-Make, USB 2.0
Packaging: Cut Tape (CT)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: USB
On-State Resistance (Max): 6.5Ohm
-3db Bandwidth: 950MHz
Supplier Device Package: 10-XQFN (1.3x1.6)
Voltage - Supply, Single (V+): 3V ~ 4.3V
Switch Circuit: DPDT
Part Status: Active
Number of Channels: 1
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DC6M602X6/1215A,13 DC6M602X6/1215A,13 NXP USA Inc. DC6M60xX6_Family.pdf Description: IC REG BUCK PROG 650MA 6WLCSP
Part Status: Obsolete
Voltage - Output (Min/Fixed): 1.2V, 1.5V
Voltage - Input (Min): 2.3V
Synchronous Rectifier: Yes
Supplier Device Package: 6-WLCSP (1.36x0.96)
Topology: Buck
Voltage - Input (Max): 5.5V
Frequency - Switching: 6MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output: 650mA
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Programmable
Package / Case: 6-XFBGA, WLCSP
Packaging: Cut Tape (CT)
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DC6M602X6/1218A,13 DC6M602X6/1218A,13 NXP USA Inc. DC6M60xX6_Family.pdf Description: IC REG BUCK PROG 650MA 6WLCSP
Part Status: Obsolete
Voltage - Output (Min/Fixed): 1.2V, 1.8V
Voltage - Input (Min): 2.3V
Synchronous Rectifier: Yes
Supplier Device Package: 6-WLCSP (1.36x0.96)
Topology: Buck
Voltage - Input (Max): 5.5V
Frequency - Switching: 6MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output: 650mA
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Programmable
Package / Case: 6-XFBGA, WLCSP
Packaging: Cut Tape (CT)
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DC6M601X6/285SF DC6M601X6/285SF NXP USA Inc. DC6M60xX6_Family.pdf Description: IC REG BUCK 2.85V 650MA 6WLCSP
Supplier Device Package: 6-WLCSP (1.36x0.96)
Topology: Buck
Voltage - Input (Max): 5.5V
Frequency - Switching: 6MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output: 650mA
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 6-XFBGA, WLCSP
Packaging: Cut Tape (CT)
Part Status: Obsolete
Voltage - Output (Min/Fixed): 2.85V
Voltage - Input (Min): 2.3V
Synchronous Rectifier: Yes
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LPC812M101JDH16FP LPC812M101JDH16FP NXP USA Inc. LPC81XM.pdf Description: IC MCU 32BIT 16KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 14
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 30MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
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LPC812M101JDH20FP LPC812M101JDH20FP NXP USA Inc. LPC81XM.pdf Description: IC MCU 32BIT 16KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
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IP4264CZ8-40-TTL,1 IP4264CZ8-40-TTL,1 NXP USA Inc. IP4264CZ8-10_20_40-TTL.pdf Description: FILTER RC(PI) ESD SMD
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IP4357CX17,135 NXP USA Inc. SD(HC)-Memory_Card_MMC_AN.pdf Description: TVS DIODE 17CSP
Packaging: Cut Tape (CT)
Part Status: Obsolete
Produkt ist nicht verfügbar
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NX3020NAKT,115 NX3020NAKT,115 NXP USA Inc. Description: MOSFET N-CH 30V 180MA SC75
Input Capacitance (Ciss) (Max) @ Vds: 13 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 0.44 nC @ 4.5 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 10V
Supplier Device Package: SC-75
Vgs(th) (Max) @ Id: 1.5V @ 250µA
Power Dissipation (Max): 230mW (Ta), 1.06W (Tc)
Rds On (Max) @ Id, Vgs: 4.5Ohm @ 100mA, 10V
Current - Continuous Drain (Id) @ 25°C: 180mA (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-75, SOT-416
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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PEMI1QFN/CK,315 PEMI1QFN/CK,315 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 20 OHM/13.5PF SMD
Number of Channels: 1
Part Status: Obsolete
ESD Protection: Yes
Resistance - Channel (Ohms): 20
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 10dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 20Ohms, C = 13.5pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Package / Case: SC-101, SOT-883
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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PEMI2QFN/WM,115 PEMI2QFN/WM,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 200 OHM/16PF SMD
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PEMI2STD/CP,115 PEMI2STD/CP,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 20 OHM/18.5PF SMD
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PEMI2STD/LT,115 PEMI2STD/LT,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 65 OHM/23PF SMD
Number of Channels: 2
ESD Protection: Yes
Resistance - Channel (Ohms): 65
Technology: RC (Pi)
Applications: Data Lines for Mobile Devices
Filter Order: 2nd
Height: 0.024" (0.60mm)
Values: R = 65Ohms, C = 23pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Package / Case: SOT-665
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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PEMI2STD/WK,115 PEMI2STD/WK,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 200 OHM/13.5PF SMD
Height: 0.024" (0.60mm)
Values: R = 200Ohms, C = 13.5pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Package / Case: SOT-665
Packaging: Cut Tape (CT)
Number of Channels: 2
ESD Protection: Yes
Resistance - Channel (Ohms): 200
Technology: RC (Pi)
Applications: Data Lines for Mobile Devices
Filter Order: 2nd
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PEMI2STD/WM,115 PEMI2STD/WM,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 200 OHM/16PF SMD
Number of Channels: 2
Part Status: Obsolete
ESD Protection: Yes
Resistance - Channel (Ohms): 200
Technology: RC (Pi)
Applications: Data Lines for Mobile Devices
Filter Order: 2nd
Height: 0.024" (0.60mm)
Values: R = 200Ohms, C = 16pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Package / Case: SOT-665
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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PEMI4QFN/HR,132 PEMI4QFN/HR,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 45 OHM/21PF SMD
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PEMI4QFN/WG,132 PEMI4QFN/WG,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 200 OHM/11PF SMD
Number of Channels: 4
Part Status: Obsolete
ESD Protection: Yes
Resistance - Channel (Ohms): 200
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 21dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 200Ohms, C = 11pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Package / Case: 8-XFDFN
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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PEMI8QFN/WP,132 PEMI8QFN/WP,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 200 OHM/18.5PF SMD
Number of Channels: 8
ESD Protection: Yes
Resistance - Channel (Ohms): 200
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 30dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 200Ohms, C = 18.5pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Package / Case: 16-XFDFN Exposed Pad
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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PMF63UN,115 PMF63UN,115 NXP USA Inc. PMF63UN.pdf Description: MOSFET N-CH 20V 1.8A SOT323-3
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Packaging: Cut Tape (CT)
Input Capacitance (Ciss) (Max) @ Vds: 185 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 3.3 nC @ 4.5 V
Drain to Source Voltage (Vdss): 20 V
Vgs (Max): ±8V
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Supplier Device Package: SC-70
Vgs(th) (Max) @ Id: 1V @ 250µA
Power Dissipation (Max): 275mW (Ta), 1.785W (Tc)
Rds On (Max) @ Id, Vgs: 74mOhm @ 1.8A, 4.5V
Current - Continuous Drain (Id) @ 25°C: 1.8A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
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PMV90EN,215 PMV90EN,215 NXP USA Inc. PMV90EN.pdf Description: MOSFET N-CH 30V 1.9A TO236AB
Packaging: Cut Tape (CT)
Input Capacitance (Ciss) (Max) @ Vds: 132 pF @ 15 V
Gate Charge (Qg) (Max) @ Vgs: 4 nC @ 10 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Supplier Device Package: SOT-23 (TO-236AB)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Power Dissipation (Max): 310mW (Ta), 2.09W (Tc)
Rds On (Max) @ Id, Vgs: 84mOhm @ 1.9A, 10V
Current - Continuous Drain (Id) @ 25°C: 1.9A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Produkt ist nicht verfügbar
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MKL16Z256VMP4 MKL16Z256VMP4 NXP USA Inc. KL16P64M48SF4.pdf Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, TSI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D - 16bit; D/A - 12bit
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 64-MAPBGA (5x5)
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MKL26Z256VMP4 MKL26Z256VMP4 NXP USA Inc. KL26P121M48SF4.pdf Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D - 16bit; D/A - 12bit
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
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NXPMOSFET-DESIGNKIT NXPMOSFET-DESIGNKIT NXP USA Inc. Description: KIT DESIGN MOSFET LFPAK
Packaging: Box
Mounting Type: Surface Mount
Quantity: 180 Pieces (18 Values - 10 Each)
Kit Type: MOSFETs
Part Status: Obsolete
Produkt ist nicht verfügbar
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OM13054UL OM13054UL NXP USA Inc. OM13054_Web.pdf Description: BOARD EVAL LPC-LINK2
Packaging: Box
Type: Debugger
Contents: Board(s), Cable(s)
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NT2H1611F0DTLH NT2H1611F0DTLH NXP USA Inc. NTAG213F_216F.pdf Description: NFC TYPE2 TAG IC 144/888 BYTES
Packaging: Tube
Package / Case: 4-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Standards: ISO 14443, NFC
Supplier Device Package: 4-HXSON (2x1.5)
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AFT09H310-03SR6 AFT09H310-03SR6 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI1230
Current - Test: 680 mA
Voltage - Test: 28 V
Voltage - Rated: 70 V
Supplier Device Package: NI-1230S
Technology: LDMOS
Gain: 17.9dB
Power - Output: 56W
Frequency: 920MHz
Mounting Type: Chassis Mount
Package / Case: NI-1230S
Packaging: Tape & Reel (TR)
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AFT09H310-04GSR6 NXP USA Inc. Description: RF MOSFET 28V NI1230
Technology: MOSFET (Metal Oxide)
Gain: 17.9dB
Power - Output: 56W
Configuration: N-Channel
Frequency: 920MHz
Mounting Type: Chassis Mount
Package / Case: NI-1230S-4 GW
Packaging: Tape & Reel (TR)
Current - Test: 680 mA
Voltage - Test: 28 V
Voltage - Rated: 70 V
Supplier Device Package: NI-1230S-4 GULL
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AFT09MP055GNR1 AFT09MP055GNR1 NXP USA Inc. AFT09MP055N.pdf Description: RF MOSFET LDMOS 12.5V TO270-4
Current - Test: 550 mA
Voltage - Test: 12.5 V
Voltage - Rated: 40 V
Part Status: Active
Supplier Device Package: TO-270 WB-4 Gull
Technology: LDMOS
Gain: 15.7dB
Power - Output: 1W
Frequency: 870MHz
Mounting Type: Surface Mount
Package / Case: TO-270BB
Packaging: Tape & Reel (TR)
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AFT09MP055NR1 AFT09MP055NR1 NXP USA Inc. AFT09MP055N.pdf Description: RF MOSFET LDMOS 12.5V TO270-4
Current - Test: 550 mA
Voltage - Test: 12.5 V
Voltage - Rated: 40 V
Supplier Device Package: TO-270 WB-4
Technology: LDMOS
Gain: 15.7dB
Power - Output: 1W
Frequency: 870MHz
Mounting Type: Surface Mount
Package / Case: TO-270AB
Packaging: Tape & Reel (TR)
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AFT09MS007NT1 AFT09MS007NT1 NXP USA Inc. AFT09MS007N.pdf Description: RF MOSFET LDMOS 7.5V PLD-1.5W
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 7.3W
Gain: 15.2dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 7.5 V
Current - Test: 100 mA
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AFT18H356-24SR6 AFT18H356-24SR6 NXP USA Inc. Description: FET RF 2CH 65V 1.88GHZ NI1230-4
Current - Test: 1.1 A
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: NI-1230-4LS2L
Gain: 15dB
Power - Output: 63W
Frequency: 1.88GHz
Mounting Type: Chassis Mount
Package / Case: NI-1230-4LS2L
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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AFT26H160-4S4R3 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI880X-4
Current - Test: 500 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-880X-4L4S-8
Technology: LDMOS
Gain: 14.9dB
Power - Output: 32W
Frequency: 2.5GHz
Mounting Type: Chassis Mount
Package / Case: NI-880X-4L4S-8
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC10XS3412JHFKR2 MC10XS3412JHFKR2 NXP USA Inc. Description: IC PWR SWITCH N-CHAN 1:1 24PQFN
Part Status: Obsolete
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Supplier Device Package: 24-PQFN (12x12)
Ratio - Input:Output: 1:1
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 6V ~ 20V
Rds On (Typ): 10mOhm, 12mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 150°C (TJ)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 4
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 24-PowerQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC34903CP5EKR2 MC34903CP5EKR2 NXP USA Inc. MC34903,4,5.pdf Description: IC SBC HIGH SPEED CAN 5V 32SOIC
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MC34903CS3EKR2 MC34903CS3EKR2 NXP USA Inc. MC34903,4,5.pdf Description: IC SBC HIGH SPD CAN 3.3V 32SOIC
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MC34903CS5EKR2 MC34903CS5EKR2 NXP USA Inc. MC34903,4,5.pdf Description: IC SBC HIGH SPEED CAN 5V 32SOIC
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MC34904C5EKR2 MC34904C5EKR2 NXP USA Inc. MC34903,4,5.pdf Description: IC SBC HIGH SPEED CAN 5V 32SOIC
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MC34905CS3EKR2 MC34905CS3EKR2 NXP USA Inc. MC34903%2C4%2C5.pdf Description: IC SBC HIGH SPD CAN 3.3V 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 2mA
Supplier Device Package: 32-SOIC-EP
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MC34905CS5EKR2 MC34905CS5EKR2 NXP USA Inc. MC34903%2C4%2C5.pdf Description: IC SBC HIGH SPEED CAN 5V 32SOIC
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tape & Reel (TR)
Supplier Device Package: 32-SOIC-EP
Current - Supply: 2mA
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Operating Temperature: -40°C ~ 125°C
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MC56F8025VLDR MC56F8025VLDR NXP USA Inc. MC56F8023.pdf Description: IC MCU 16BIT 32KB FLASH 44LQFP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 16
Program Memory Size: 32KB (16K x 16)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 35
Supplier Device Package: 44-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 8x12b; D/A 2x12b
Core Processor: 56800E
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MCIMX6D4AVT10ADR MCIMX6D4AVT10ADR NXP USA Inc. IMX6DQIEC.pdf Description: IC MPU I.MX6D 1.0GHZ 624FCBGA
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tape & Reel (TR)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Produkt ist nicht verfügbar
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MCIMX6D5EYM10ADR MCIMX6D5EYM10ADR NXP USA Inc. IMX6DQCEC.pdf Description: IC MPU I.MX6D 1.0GHZ 624FCPBGA
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MCIMX6D6AVT08ADR MCIMX6D6AVT08ADR NXP USA Inc. IMX6DQAEC.pdf Description: IC MPU I.MX6D 852MHZ 624FCBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 852MHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tape & Reel (TR)
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MCIMX6D6AVT10ADR MCIMX6D6AVT10ADR NXP USA Inc. IMX6DQAEC.pdf Description: IC MPU I.MX6D 1.0GHZ 624FCBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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MCIMX6Q4AVT08ADR MCIMX6Q4AVT08ADR NXP USA Inc. IMX6DQAEC.pdf Description: IC MPU I.MX6Q 852MHZ 624FCBGA
Part Status: Active
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 4 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 852MHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tape & Reel (TR)
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MCIMX6Q5EYM10ADR MCIMX6Q5EYM10ADR NXP USA Inc. IMX6DQAEC.pdf Description: IC MPU I.MX6Q 1.0GHZ 624FCPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
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MCIMX6Q6AVT08ADR MCIMX6Q6AVT08ADR NXP USA Inc. IMX6DQAEC.pdf Description: IC MPU I.MX6Q 852MHZ 624FCBGA
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MCIMX6S1AVM08ACR MCIMX6S1AVM08ACR NXP USA Inc. IMX6SDLCEC.pdf Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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MCIMX6S4AVM08ACR MCIMX6S4AVM08ACR NXP USA Inc. IMX6SDLAEC.pdf Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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MCIMX6S5DVM10ACR MCIMX6S5DVM10ACR NXP USA Inc. IMX6SDLAEC.pdf Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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MCIMX6S5EVM10ACR MCIMX6S5EVM10ACR NXP USA Inc. IMX6SDLAEC.pdf Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tape & Reel (TR)
Part Status: Active
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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HEF4070BP-Q100U
Hersteller: NXP USA Inc.
Description: IC GATE XOR 4CH 2-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3mA, 3mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 3.5V ~ 11V
Input Logic Level - Low: 1.5V ~ 4V
Max Propagation Delay @ V, Max CL: 55ns @ 15V, 50pF
Grade: Automotive
Part Status: Obsolete
Number of Circuits: 4
Qualification: AEC-Q100
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TEA1721ADB1061,598 75017320.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR TEA1721
Packaging: Box
Voltage - Output: 3.3V, 12V
Voltage - Input: 85 ~ 265 VAC
Current - Output: 400mA, 400mA
Contents: Board(s)
Frequency - Switching: 51kHz
Regulator Topology: Flyback
Board Type: Fully Populated
Utilized IC / Part: TEA1721
Supplied Contents: Board(s)
Main Purpose: AC/DC, Primary Side
Outputs and Type: 2 Isolated Outputs
Part Status: Active
Power - Output: 5W
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TEA1721ADB1059,598 75017320.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR TEA1721
Packaging: Box
Voltage - Output: 12V
Voltage - Input: 85 ~ 265 VAC
Current - Output: 200mA
Contents: Board(s)
Frequency - Switching: 50kHz
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: TEA1721
Supplied Contents: Board(s)
Main Purpose: AC/DC, Non-Isolated
Outputs and Type: 1 Non-Isolated Output
Part Status: Active
Power - Output: 2.5W
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TEA1721ADB1060,598 UM10522.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR TEA1721
Packaging: Box
Voltage - Output: -12V
Voltage - Input: 85 ~ 265 VAC
Current - Output: 200mA
Contents: Board(s)
Frequency - Switching: 50kHz
Regulator Topology: Flyback
Board Type: Fully Populated
Utilized IC / Part: TEA1721
Supplied Contents: Board(s)
Main Purpose: AC/DC, Non-Isolated
Outputs and Type: 1 Non-Isolated Output
Part Status: Active
Power - Output: 2.5W
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TEA1721ADB1062,598 75017320.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR TEA1721
Packaging: Box
Voltage - Output: 3.3V, 5V, 24V
Voltage - Input: 85 ~ 560 VAC
Current - Output: 300mA, 300mA, 200mA
Frequency - Switching: 50kHz
Regulator Topology: Flyback
Board Type: Fully Populated
Utilized IC / Part: TEA1721
Supplied Contents: Board(s)
Main Purpose: AC/DC, Primary Side
Outputs and Type: 3 Isolated Outputs
Part Status: Active
Power - Output: 5W
Contents: Board(s)
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TEA1721BDB1065,598 75017320.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR TEA1721
Power - Output: 5W
Part Status: Active
Contents: Board(s)
Outputs and Type: 2 Isolated Outputs
Main Purpose: AC/DC, Primary Side
Supplied Contents: Board(s)
Utilized IC / Part: TEA1721
Board Type: Fully Populated
Regulator Topology: Flyback
Frequency - Switching: 50kHz
Current - Output: 400mA, 400mA
Voltage - Input: 85 ~ 265 VAC
Voltage - Output: -3.3V, -12V
Packaging: Box
Produkt ist nicht verfügbar
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MKL02Z32CAF4R KL0xPB.pdf
MKL02Z32CAF4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 20WLCSP
DigiKey Programmable: Not Verified
Number of I/O: 18
Part Status: Active
Supplier Device Package: 20-WLCSP (1.99x1.94)
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 20-UFBGA, WLCSP
Packaging: Cut Tape (CT)
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NX3P2902BUKZ NX3P2902B.pdf
NX3P2902BUKZ
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH P-CHAN 1:1 4WLCSP
Part Status: Active
Supplier Device Package: 4-WLCSP (0.74x0.74)
Ratio - Input:Output: 1:1
Current - Output (Max): 500mA
Voltage - Supply (Vcc/Vdd): Not Required
Voltage - Load: 1.1V ~ 3.6V
Input Type: Non-Inverting
Rds On (Typ): 65mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TJ)
Switch Type: General Purpose
Interface: On/Off
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: P-Channel
Package / Case: 4-UFBGA, WLCSP
Features: Load Discharge, Slew Rate Controlled
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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NX3DV221TKX NX3DV221.pdf
NX3DV221TKX
Hersteller: NXP USA Inc.
Description: IC USB 2.0 SWITCH HS 10HVSON
Features: Bi-Directional
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: USB
On-State Resistance (Max): 7Ohm
-3db Bandwidth: 1GHz
Supplier Device Package: 10-HVSON (3x3)
Voltage - Supply, Single (V+): 2.3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 1
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15+1.44 EUR
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NX3DV42GU10X NX3DV42.pdf
NX3DV42GU10X
Hersteller: NXP USA Inc.
Description: IC USB 2.0 SWITCH HS 10XQFN
Features: Break-Before-Make, USB 2.0
Packaging: Cut Tape (CT)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: USB
On-State Resistance (Max): 6.5Ohm
-3db Bandwidth: 950MHz
Supplier Device Package: 10-XQFN (1.3x1.6)
Voltage - Supply, Single (V+): 3V ~ 4.3V
Switch Circuit: DPDT
Part Status: Active
Number of Channels: 1
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500+0.95 EUR
1000+0.93 EUR
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DC6M602X6/1215A,13 DC6M60xX6_Family.pdf
DC6M602X6/1215A,13
Hersteller: NXP USA Inc.
Description: IC REG BUCK PROG 650MA 6WLCSP
Part Status: Obsolete
Voltage - Output (Min/Fixed): 1.2V, 1.5V
Voltage - Input (Min): 2.3V
Synchronous Rectifier: Yes
Supplier Device Package: 6-WLCSP (1.36x0.96)
Topology: Buck
Voltage - Input (Max): 5.5V
Frequency - Switching: 6MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output: 650mA
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Programmable
Package / Case: 6-XFBGA, WLCSP
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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DC6M602X6/1218A,13 DC6M60xX6_Family.pdf
DC6M602X6/1218A,13
Hersteller: NXP USA Inc.
Description: IC REG BUCK PROG 650MA 6WLCSP
Part Status: Obsolete
Voltage - Output (Min/Fixed): 1.2V, 1.8V
Voltage - Input (Min): 2.3V
Synchronous Rectifier: Yes
Supplier Device Package: 6-WLCSP (1.36x0.96)
Topology: Buck
Voltage - Input (Max): 5.5V
Frequency - Switching: 6MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output: 650mA
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Programmable
Package / Case: 6-XFBGA, WLCSP
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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DC6M601X6/285SF DC6M60xX6_Family.pdf
DC6M601X6/285SF
Hersteller: NXP USA Inc.
Description: IC REG BUCK 2.85V 650MA 6WLCSP
Supplier Device Package: 6-WLCSP (1.36x0.96)
Topology: Buck
Voltage - Input (Max): 5.5V
Frequency - Switching: 6MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output: 650mA
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 6-XFBGA, WLCSP
Packaging: Cut Tape (CT)
Part Status: Obsolete
Voltage - Output (Min/Fixed): 2.85V
Voltage - Input (Min): 2.3V
Synchronous Rectifier: Yes
Produkt ist nicht verfügbar
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LPC812M101JDH16FP LPC81XM.pdf
LPC812M101JDH16FP
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 14
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 30MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
auf Bestellung 1991 Stücke:
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8+2.93 EUR
13+1.71 EUR
96+1.65 EUR
192+1.59 EUR
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576+1.43 EUR
1056+1.39 EUR
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LPC812M101JDH20FP LPC81XM.pdf
LPC812M101JDH20FP
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
auf Bestellung 4302 Stücke:
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6+3.81 EUR
10+2.81 EUR
75+2.33 EUR
150+2.23 EUR
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525+2.07 EUR
1050+2.01 EUR
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IP4264CZ8-40-TTL,1 IP4264CZ8-10_20_40-TTL.pdf
IP4264CZ8-40-TTL,1
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) ESD SMD
Produkt ist nicht verfügbar
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IP4357CX17,135 SD(HC)-Memory_Card_MMC_AN.pdf
Hersteller: NXP USA Inc.
Description: TVS DIODE 17CSP
Packaging: Cut Tape (CT)
Part Status: Obsolete
Produkt ist nicht verfügbar
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NX3020NAKT,115
NX3020NAKT,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 180MA SC75
Input Capacitance (Ciss) (Max) @ Vds: 13 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 0.44 nC @ 4.5 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 10V
Supplier Device Package: SC-75
Vgs(th) (Max) @ Id: 1.5V @ 250µA
Power Dissipation (Max): 230mW (Ta), 1.06W (Tc)
Rds On (Max) @ Id, Vgs: 4.5Ohm @ 100mA, 10V
Current - Continuous Drain (Id) @ 25°C: 180mA (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-75, SOT-416
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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PEMI1QFN/CK,315 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI1QFN/CK,315
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 20 OHM/13.5PF SMD
Number of Channels: 1
Part Status: Obsolete
ESD Protection: Yes
Resistance - Channel (Ohms): 20
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 10dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 20Ohms, C = 13.5pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Package / Case: SC-101, SOT-883
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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PEMI2QFN/WM,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2QFN/WM,115
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/16PF SMD
Produkt ist nicht verfügbar
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PEMI2STD/CP,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2STD/CP,115
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 20 OHM/18.5PF SMD
Produkt ist nicht verfügbar
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PEMI2STD/LT,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2STD/LT,115
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 65 OHM/23PF SMD
Number of Channels: 2
ESD Protection: Yes
Resistance - Channel (Ohms): 65
Technology: RC (Pi)
Applications: Data Lines for Mobile Devices
Filter Order: 2nd
Height: 0.024" (0.60mm)
Values: R = 65Ohms, C = 23pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Package / Case: SOT-665
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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PEMI2STD/WK,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2STD/WK,115
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/13.5PF SMD
Height: 0.024" (0.60mm)
Values: R = 200Ohms, C = 13.5pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Package / Case: SOT-665
Packaging: Cut Tape (CT)
Number of Channels: 2
ESD Protection: Yes
Resistance - Channel (Ohms): 200
Technology: RC (Pi)
Applications: Data Lines for Mobile Devices
Filter Order: 2nd
Produkt ist nicht verfügbar
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PEMI2STD/WM,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2STD/WM,115
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/16PF SMD
Number of Channels: 2
Part Status: Obsolete
ESD Protection: Yes
Resistance - Channel (Ohms): 200
Technology: RC (Pi)
Applications: Data Lines for Mobile Devices
Filter Order: 2nd
Height: 0.024" (0.60mm)
Values: R = 200Ohms, C = 16pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Package / Case: SOT-665
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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PEMI4QFN/HR,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI4QFN/HR,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 45 OHM/21PF SMD
Produkt ist nicht verfügbar
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PEMI4QFN/WG,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI4QFN/WG,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/11PF SMD
Number of Channels: 4
Part Status: Obsolete
ESD Protection: Yes
Resistance - Channel (Ohms): 200
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 21dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 200Ohms, C = 11pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Package / Case: 8-XFDFN
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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PEMI8QFN/WP,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI8QFN/WP,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/18.5PF SMD
Number of Channels: 8
ESD Protection: Yes
Resistance - Channel (Ohms): 200
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 30dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 200Ohms, C = 18.5pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Package / Case: 16-XFDFN Exposed Pad
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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PMF63UN,115 PMF63UN.pdf
PMF63UN,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 20V 1.8A SOT323-3
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Packaging: Cut Tape (CT)
Input Capacitance (Ciss) (Max) @ Vds: 185 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 3.3 nC @ 4.5 V
Drain to Source Voltage (Vdss): 20 V
Vgs (Max): ±8V
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Supplier Device Package: SC-70
Vgs(th) (Max) @ Id: 1V @ 250µA
Power Dissipation (Max): 275mW (Ta), 1.785W (Tc)
Rds On (Max) @ Id, Vgs: 74mOhm @ 1.8A, 4.5V
Current - Continuous Drain (Id) @ 25°C: 1.8A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Produkt ist nicht verfügbar
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PMV90EN,215 PMV90EN.pdf
PMV90EN,215
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 1.9A TO236AB
Packaging: Cut Tape (CT)
Input Capacitance (Ciss) (Max) @ Vds: 132 pF @ 15 V
Gate Charge (Qg) (Max) @ Vgs: 4 nC @ 10 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Supplier Device Package: SOT-23 (TO-236AB)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Power Dissipation (Max): 310mW (Ta), 2.09W (Tc)
Rds On (Max) @ Id, Vgs: 84mOhm @ 1.9A, 10V
Current - Continuous Drain (Id) @ 25°C: 1.9A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Produkt ist nicht verfügbar
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MKL16Z256VMP4 KL16P64M48SF4.pdf
MKL16Z256VMP4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, TSI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D - 16bit; D/A - 12bit
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 64-MAPBGA (5x5)
auf Bestellung 640 Stücke:
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2+12.38 EUR
10+7.58 EUR
25+7.45 EUR
100+7.27 EUR
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MKL26Z256VMP4 KL26P121M48SF4.pdf
MKL26Z256VMP4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D - 16bit; D/A - 12bit
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
auf Bestellung 640 Stücke:
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AnzahlPrivatkunde
2+17.22 EUR
10+13.39 EUR
25+12.44 EUR
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640+10.47 EUR
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NXPMOSFET-DESIGNKIT
NXPMOSFET-DESIGNKIT
Hersteller: NXP USA Inc.
Description: KIT DESIGN MOSFET LFPAK
Packaging: Box
Mounting Type: Surface Mount
Quantity: 180 Pieces (18 Values - 10 Each)
Kit Type: MOSFETs
Part Status: Obsolete
Produkt ist nicht verfügbar
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OM13054UL OM13054_Web.pdf
OM13054UL
Hersteller: NXP USA Inc.
Description: BOARD EVAL LPC-LINK2
Packaging: Box
Type: Debugger
Contents: Board(s), Cable(s)
Produkt ist nicht verfügbar
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NT2H1611F0DTLH NTAG213F_216F.pdf
NT2H1611F0DTLH
Hersteller: NXP USA Inc.
Description: NFC TYPE2 TAG IC 144/888 BYTES
Packaging: Tube
Package / Case: 4-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Standards: ISO 14443, NFC
Supplier Device Package: 4-HXSON (2x1.5)
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12+1.86 EUR
25+1.75 EUR
100+1.61 EUR
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AFT09H310-03SR6
AFT09H310-03SR6
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI1230
Current - Test: 680 mA
Voltage - Test: 28 V
Voltage - Rated: 70 V
Supplier Device Package: NI-1230S
Technology: LDMOS
Gain: 17.9dB
Power - Output: 56W
Frequency: 920MHz
Mounting Type: Chassis Mount
Package / Case: NI-1230S
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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AFT09H310-04GSR6
Hersteller: NXP USA Inc.
Description: RF MOSFET 28V NI1230
Technology: MOSFET (Metal Oxide)
Gain: 17.9dB
Power - Output: 56W
Configuration: N-Channel
Frequency: 920MHz
Mounting Type: Chassis Mount
Package / Case: NI-1230S-4 GW
Packaging: Tape & Reel (TR)
Current - Test: 680 mA
Voltage - Test: 28 V
Voltage - Rated: 70 V
Supplier Device Package: NI-1230S-4 GULL
Produkt ist nicht verfügbar
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AFT09MP055GNR1 AFT09MP055N.pdf
AFT09MP055GNR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 12.5V TO270-4
Current - Test: 550 mA
Voltage - Test: 12.5 V
Voltage - Rated: 40 V
Part Status: Active
Supplier Device Package: TO-270 WB-4 Gull
Technology: LDMOS
Gain: 15.7dB
Power - Output: 1W
Frequency: 870MHz
Mounting Type: Surface Mount
Package / Case: TO-270BB
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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AFT09MP055NR1 AFT09MP055N.pdf
AFT09MP055NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 12.5V TO270-4
Current - Test: 550 mA
Voltage - Test: 12.5 V
Voltage - Rated: 40 V
Supplier Device Package: TO-270 WB-4
Technology: LDMOS
Gain: 15.7dB
Power - Output: 1W
Frequency: 870MHz
Mounting Type: Surface Mount
Package / Case: TO-270AB
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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AFT09MS007NT1 AFT09MS007N.pdf
AFT09MS007NT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 7.5V PLD-1.5W
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 7.3W
Gain: 15.2dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 7.5 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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AFT18H356-24SR6
AFT18H356-24SR6
Hersteller: NXP USA Inc.
Description: FET RF 2CH 65V 1.88GHZ NI1230-4
Current - Test: 1.1 A
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: NI-1230-4LS2L
Gain: 15dB
Power - Output: 63W
Frequency: 1.88GHz
Mounting Type: Chassis Mount
Package / Case: NI-1230-4LS2L
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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AFT26H160-4S4R3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI880X-4
Current - Test: 500 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-880X-4L4S-8
Technology: LDMOS
Gain: 14.9dB
Power - Output: 32W
Frequency: 2.5GHz
Mounting Type: Chassis Mount
Package / Case: NI-880X-4L4S-8
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC10XS3412JHFKR2
MC10XS3412JHFKR2
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 24PQFN
Part Status: Obsolete
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Supplier Device Package: 24-PQFN (12x12)
Ratio - Input:Output: 1:1
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 6V ~ 20V
Rds On (Typ): 10mOhm, 12mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 150°C (TJ)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 4
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 24-PowerQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC34903CP5EKR2 MC34903,4,5.pdf
MC34903CP5EKR2
Hersteller: NXP USA Inc.
Description: IC SBC HIGH SPEED CAN 5V 32SOIC
Produkt ist nicht verfügbar
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MC34903CS3EKR2 MC34903,4,5.pdf
MC34903CS3EKR2
Hersteller: NXP USA Inc.
Description: IC SBC HIGH SPD CAN 3.3V 32SOIC
Produkt ist nicht verfügbar
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MC34903CS5EKR2 MC34903,4,5.pdf
MC34903CS5EKR2
Hersteller: NXP USA Inc.
Description: IC SBC HIGH SPEED CAN 5V 32SOIC
Produkt ist nicht verfügbar
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MC34904C5EKR2 MC34903,4,5.pdf
MC34904C5EKR2
Hersteller: NXP USA Inc.
Description: IC SBC HIGH SPEED CAN 5V 32SOIC
Produkt ist nicht verfügbar
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MC34905CS3EKR2 MC34903%2C4%2C5.pdf
MC34905CS3EKR2
Hersteller: NXP USA Inc.
Description: IC SBC HIGH SPD CAN 3.3V 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 2mA
Supplier Device Package: 32-SOIC-EP
Produkt ist nicht verfügbar
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MC34905CS5EKR2 MC34903%2C4%2C5.pdf
MC34905CS5EKR2
Hersteller: NXP USA Inc.
Description: IC SBC HIGH SPEED CAN 5V 32SOIC
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tape & Reel (TR)
Supplier Device Package: 32-SOIC-EP
Current - Supply: 2mA
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Operating Temperature: -40°C ~ 125°C
Produkt ist nicht verfügbar
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MC56F8025VLDR MC56F8023.pdf
MC56F8025VLDR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 44LQFP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 16
Program Memory Size: 32KB (16K x 16)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 35
Supplier Device Package: 44-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 8x12b; D/A 2x12b
Core Processor: 56800E
Produkt ist nicht verfügbar
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MCIMX6D4AVT10ADR IMX6DQIEC.pdf
MCIMX6D4AVT10ADR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 1.0GHZ 624FCBGA
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tape & Reel (TR)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Produkt ist nicht verfügbar
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MCIMX6D5EYM10ADR IMX6DQCEC.pdf
MCIMX6D5EYM10ADR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 1.0GHZ 624FCPBGA
Produkt ist nicht verfügbar
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MCIMX6D6AVT08ADR IMX6DQAEC.pdf
MCIMX6D6AVT08ADR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 852MHZ 624FCBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 852MHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCIMX6D6AVT10ADR IMX6DQAEC.pdf
MCIMX6D6AVT10ADR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 1.0GHZ 624FCBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX6Q4AVT08ADR IMX6DQAEC.pdf
MCIMX6Q4AVT08ADR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6Q 852MHZ 624FCBGA
Part Status: Active
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 4 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 852MHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCIMX6Q5EYM10ADR IMX6DQAEC.pdf
MCIMX6Q5EYM10ADR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6Q 1.0GHZ 624FCPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
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500+106.29 EUR
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MCIMX6Q6AVT08ADR IMX6DQAEC.pdf
MCIMX6Q6AVT08ADR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6Q 852MHZ 624FCBGA
Produkt ist nicht verfügbar
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MCIMX6S1AVM08ACR IMX6SDLCEC.pdf
MCIMX6S1AVM08ACR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX6S4AVM08ACR IMX6SDLAEC.pdf
MCIMX6S4AVM08ACR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX6S5DVM10ACR IMX6SDLAEC.pdf
MCIMX6S5DVM10ACR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
500+69.77 EUR
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MCIMX6S5EVM10ACR IMX6SDLAEC.pdf
MCIMX6S5EVM10ACR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tape & Reel (TR)
Part Status: Active
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
500+47.23 EUR
Mindestbestellmenge: 500 Stücke
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