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TFF11145HN/N1X TFF11145HN/N1X NXP USA Inc. TFF11145HN.pdf Description: IC FREQUENCY GENERATOR 24HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 14.8GHz
Input: Clock
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Main Purpose: Ku band VSAT applications
Ratio - Input:Output: 1:4
Differential - Input:Output: Yes/No
Supplier Device Package: 24-HVQFN (4x4)
PLL: Yes
Number of Circuits: 1
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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OM12030/100,551 NXP USA Inc. Description: MOD ATOP AUTO TELEMATIC
Part Status: Active
RF Type: Cellular
Mounting Type: Surface Mount
Packaging: Tray
Produkt ist nicht verfügbar
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LPC4370FET256E LPC4370FET256E NXP USA Inc. LPC4370.pdf Description: IC MCU 32BIT ROMLESS 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 282K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0/M0
Data Converters: A/D 16x10b, 6x12b; D/A 1x10b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Part Status: Active
Number of I/O: 164
DigiKey Programmable: Not Verified
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10+22.34 EUR
90+19.42 EUR
180+18.82 EUR
270+18.51 EUR
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LPC43S30FET256E LPC43S30FET256E NXP USA Inc. LPC43S50_30_20.pdf Description: IC MCU 32BIT ROMLESS 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Part Status: Active
Number of I/O: 164
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC43S50FET256,551 LPC43S50FET256,551 NXP USA Inc. LPC43S50_30_20.pdf Description: IC MCU 32BIT ROMLESS 256LBGA
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OM12004/0020000,55 NXP USA Inc. Description: MOD ATOP AUTO TELEMATIC
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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OM12004/1000000,55 NXP USA Inc. Description: MOD ATOP AUTO TELEMATIC
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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OM12030/100,557 NXP USA Inc. Description: MOD ATOP AUTO TELEMATIC
Packaging: Tray
Mounting Type: Surface Mount
RF Type: Cellular
Part Status: Active
Produkt ist nicht verfügbar
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EM783-MC3E EM783-MC3E NXP USA Inc. 75017322.pdf Description: MCU 32BIT ENERGY METER 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, IrDA, SPI, UART/USART
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.6V ~ 3.6V
Program Memory Type: FLASH (32kB)
Applications: Energy Measurement
Core Processor: ARM® Cortex®-M0
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Obsolete
Number of I/O: 22
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EM783-MC6E EM783-MC6E NXP USA Inc. 75017322.pdf Description: MCU 32BIT ENERGY METER 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, IrDA, SPI, UART/USART
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.6V ~ 3.6V
Program Memory Type: FLASH (32kB)
Applications: Energy Measurement
Core Processor: ARM® Cortex®-M0
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Obsolete
Number of I/O: 22
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EM783-SCE EM783-SCE NXP USA Inc. 75017322.pdf Description: MCU 32BIT ENERGY METER 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, IrDA, SPI, UART/USART
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.6V ~ 3.6V
Program Memory Type: FLASH (32kB)
Applications: Energy Measurement
Core Processor: ARM® Cortex®-M0
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Obsolete
Number of I/O: 22
Produkt ist nicht verfügbar
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EM783-SPE EM783-SPE NXP USA Inc. 75017322.pdf Description: MCU 32BIT ENERGY METER 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, IrDA, SPI, UART/USART
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.6V ~ 3.6V
Program Memory Type: FLASH (32kB)
Applications: Energy Measurement
Core Processor: ARM® Cortex®-M0
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Obsolete
Number of I/O: 22
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EM783-TPE EM783-TPE NXP USA Inc. 75017322.pdf Description: MCU 32BIT ENERGY METER 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, IrDA, SPI, UART/USART
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.6V ~ 3.6V
Program Memory Type: FLASH (32kB)
Applications: Energy Measurement
Core Processor: ARM® Cortex®-M0
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Obsolete
Number of I/O: 22
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LPC4370FET100E LPC4370FET100E NXP USA Inc. LPC4370.pdf Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 282K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0/M0
Data Converters: A/D 3x12b; D/A 1x10b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Discontinued at Digi-Key
Number of I/O: 49
DigiKey Programmable: Not Verified
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HEF4051BT/AUJ HEF4051BT/AUJ NXP USA Inc. HEF4051B.pdf Description: IC MUX 8:1 155OHM 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 155Ohm
-3db Bandwidth: 70MHz
Supplier Device Package: 16-SO
Voltage - Supply, Single (V+): 3V ~ 15V
Crosstalk: -50dB @ 1MHz
Multiplexer/Demultiplexer Circuit: 8:1
Channel-to-Channel Matching (ΔRon): 5Ohm
Channel Capacitance (CS(off), CD(off)): 7.5pF
Current - Leakage (IS(off)) (Max): 200nA
Part Status: Active
Number of Circuits: 1
Produkt ist nicht verfügbar
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HEF4052BT/AUJ HEF4052BT/AUJ NXP USA Inc. HEF4052B.pdf Description: IC SWITCH SP4T X 2 155OHM 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 155Ohm
-3db Bandwidth: 70MHz
Supplier Device Package: 16-SO
Voltage - Supply, Single (V+): 3V ~ 15V
Crosstalk: -50dB @ 1MHz
Switch Circuit: SP4T
Multiplexer/Demultiplexer Circuit: 4:1
Channel-to-Channel Matching (ΔRon): 5Ohm
Channel Capacitance (CS(off), CD(off)): 7.5pF
Current - Leakage (IS(off)) (Max): 200nA
Part Status: Active
Number of Circuits: 2
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HEF4053BT/AUJ HEF4053BT/AUJ NXP USA Inc. HEF4053B.pdf Description: IC SWITCH SPDT X 3 155OHM 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 155Ohm
-3db Bandwidth: 70MHz
Supplier Device Package: 16-SO
Voltage - Supply, Single (V+): 3V ~ 15V
Crosstalk: -50dB @ 1MHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 5Ohm
Channel Capacitance (CS(off), CD(off)): 7.5pF
Current - Leakage (IS(off)) (Max): 200nA
Part Status: Active
Number of Circuits: 3
Produkt ist nicht verfügbar
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HEF4069UBT/AUJ HEF4069UBT/AUJ NXP USA Inc. HEF4069UB.pdf Description: IC INVERTER 6CH 1-INP 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3.4mA, 3.4mA
Number of Inputs: 1
Supplier Device Package: 14-SO
Input Logic Level - High: 4V ~ 12.5V
Input Logic Level - Low: 1V ~ 2.5V
Max Propagation Delay @ V, Max CL: 25ns @ 15V, 50pF
Part Status: Active
Number of Circuits: 6
Current - Quiescent (Max): 1 µA
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HEF4081BT/AUJ HEF4081BT/AUJ NXP USA Inc. HEF4081B.pdf Description: IC GATE AND 4CH 2-INP 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3.4mA, 3.4mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 3.5V ~ 11V
Input Logic Level - Low: 1.5V ~ 4V
Max Propagation Delay @ V, Max CL: 40ns @ 15V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 1 µA
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HEF4528BT/AUJ HEF4528BT/AUJ NXP USA Inc. HEF4528B.pdf Description: IC MULTIVIBRATOR 35NS 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 85°C
Propagation Delay: 35 ns
Independent Circuits: 2
Current - Output High, Low: 3mA, 3mA
Schmitt Trigger Input: No
Supplier Device Package: 16-SO
Part Status: Active
Voltage - Supply: 3 V ~ 15 V
Produkt ist nicht verfügbar
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N74F38D-Q100J N74F38D-Q100J NXP USA Inc. Description: IC GATE NAND OP COL 4CH 2IN 14SO
Produkt ist nicht verfügbar
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NX3L4053PW-Q100J NX3L4053PW-Q100J NXP USA Inc. NX3L4053_Q100.pdf Description: IC SWITCH SPDTX3 800MOHM 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 800mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 16-TSSOP
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 120mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Grade: Automotive
Part Status: Active
Number of Circuits: 3
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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PCA9952TW/Q900,118 PCA9952TW/Q900,118 NXP USA Inc. PCA9952_PCA9955.pdf Description: IC LED DRV LIN PWM 57MA 28HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
Voltage - Output: 40V
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 57mA
Internal Switch(s): Yes
Supplier Device Package: 28-HTSSOP
Dimming: PWM
Voltage - Supply (Min): 3V
Voltage - Supply (Max): 5.5V
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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PCA9956ATWY PCA9956ATWY NXP USA Inc. PCA9956A.pdf Description: IC LED DRV LIN PWM 65MA 38HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 38-TFSOP (0.173", 4.40mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 24
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 65mA
Internal Switch(s): Yes
Supplier Device Package: 38-HTSSOP
Dimming: PWM
Voltage - Supply (Min): 3V
Voltage - Supply (Max): 5.5V
Part Status: Obsolete
Produkt ist nicht verfügbar
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NTB0102DP-Q100H NTB0102DP-Q100H NXP USA Inc. NTB0102_Q100.pdf Description: IC XLTR VL BIDIR 8-TSSOP
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Grade: Automotive
Part Status: Active
Number of Circuits: 1
Qualification: AEC-Q100
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9000+0.8 EUR
15000+0.79 EUR
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NTB0102GD-Q100H NTB0102GD-Q100H NXP USA Inc. NTB0102_Q100.pdf Description: IC XLTR VL BIDIR 8-XSON/SOT996-2
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Grade: Automotive
Number of Circuits: 1
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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NTB0104BQ-Q100X NTB0104BQ-Q100X NXP USA Inc. NTB0104_Q100.pdf Description: IC XLTR VL BIDIR 14-DHVQFN
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 14-VFQFN Exposed Pad
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 14-DHVQFN (2.5x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Grade: Automotive
Part Status: Active
Number of Circuits: 1
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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NTS0102GD-Q100H NTS0102GD-Q100H NXP USA Inc. NTS0102_Q100.pdf Description: IC XLTR VL BIDIR 8-XSON/SOT996-2
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Grade: Automotive
Part Status: Obsolete
Number of Circuits: 1
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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NTS0104BQ-Q100X NTS0104BQ-Q100X NXP USA Inc. NTS0104_Q100.pdf Description: IC XLTR VL BIDIR 14-DHVQFN
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 14-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 14-DHVQFN (2.5x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Grade: Automotive
Part Status: Active
Number of Circuits: 1
Qualification: AEC-Q100
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LPC4072FET80K NXP USA Inc. LPC408X_7X.pdf Description: IC MCU 32BIT 64KB FLASH 80TFBGA
Packaging: Tray
Package / Case: 80-TFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 80-TFBGA (7x7)
DigiKey Programmable: Not Verified
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BLF8G20LS-400PVQ BLF8G20LS-400PVQ NXP USA Inc. BLF8G20LS-400(PV,PGV).pdf Description: RF MOSFET LDMOS 28V CDFM8
Packaging: Tube
Package / Case: SOT-1242B
Mounting Type: Chassis Mount
Frequency: 1.81GHz ~ 1.88GHz
Configuration: Dual
Power - Output: 95W
Gain: 19dB
Technology: LDMOS
Supplier Device Package: CDFM8
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 3.4 A
Produkt ist nicht verfügbar
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NTS0104PW-Q100J NTS0104PW-Q100J NXP USA Inc. NTS0104_Q100.pdf Description: IC XLTR VL BIDIR 14-TSSOP
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 14-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Grade: Automotive
Part Status: Active
Number of Circuits: 1
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TFF11086HN/N1,111 TFF11086HN/N1,111 NXP USA Inc. TFF11086HN.pdf Description: IC FREQUENCY GENERATOR 24HVQFN
DigiKey Programmable: Not Verified
Number of Circuits: 1
Supplier Device Package: 24-HVQFN (4x4)
Differential - Input:Output: Yes/No
Ratio - Input:Output: 1:4
Main Purpose: Ku band VSAT applications
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Input: Clock
Frequency - Max: 8.71GHz
Output: Clock
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tray
PLL: Yes
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HEF4093BT/AUJ HEF4093BT/AUJ NXP USA Inc. HEF4093B.pdf Description: IC GATE NAND SCHMIT 4CH 2IN 14SO
Packaging: Tape & Reel (TR)
Features: Schmitt Trigger
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3.4mA, 3.4mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 3.5V ~ 11V
Input Logic Level - Low: 1.5V ~ 4V
Max Propagation Delay @ V, Max CL: 60ns @ 15V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 1 µA
Produkt ist nicht verfügbar
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HEF4013BP-Q100U NXP USA Inc. HEF4013B_Q100.pdf Description: IC FF D-TYPE DOUBLE 1BIT 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: Complementary
Mounting Type: Through Hole
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3V ~ 15V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 3.4mA, 3.4mA
Trigger Type: Positive Edge
Clock Frequency: 40 MHz
Input Capacitance: 7.5 pF
Supplier Device Package: 14-DIP
Max Propagation Delay @ V, Max CL: 60ns @ 15V, 50pF
Part Status: Obsolete
Number of Bits per Element: 1
Produkt ist nicht verfügbar
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HEF4021BP-Q100U HEF4021BP-Q100U NXP USA Inc. HEF4021B_Q100.pdf Description: IC SR PUSH-PULL 8BIT 16-DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Push-Pull
Mounting Type: Through Hole
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 15V
Supplier Device Package: 16-DIP
Part Status: Obsolete
Number of Bits per Element: 8
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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HEF4070BP-Q100U NXP USA Inc. Description: IC GATE XOR 4CH 2-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3mA, 3mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 3.5V ~ 11V
Input Logic Level - Low: 1.5V ~ 4V
Max Propagation Delay @ V, Max CL: 55ns @ 15V, 50pF
Grade: Automotive
Part Status: Obsolete
Number of Circuits: 4
Qualification: AEC-Q100
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TEA1721ADB1061,598 NXP USA Inc. 75017320.pdf Description: EVAL BOARD FOR TEA1721
Packaging: Box
Voltage - Output: 3.3V, 12V
Voltage - Input: 85 ~ 265 VAC
Current - Output: 400mA, 400mA
Contents: Board(s)
Frequency - Switching: 51kHz
Regulator Topology: Flyback
Board Type: Fully Populated
Utilized IC / Part: TEA1721
Supplied Contents: Board(s)
Main Purpose: AC/DC, Primary Side
Outputs and Type: 2 Isolated Outputs
Part Status: Active
Power - Output: 5W
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TEA1721ADB1059,598 NXP USA Inc. 75017320.pdf Description: EVAL BOARD FOR TEA1721
Packaging: Box
Voltage - Output: 12V
Voltage - Input: 85 ~ 265 VAC
Current - Output: 200mA
Contents: Board(s)
Frequency - Switching: 50kHz
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: TEA1721
Supplied Contents: Board(s)
Main Purpose: AC/DC, Non-Isolated
Outputs and Type: 1 Non-Isolated Output
Part Status: Active
Power - Output: 2.5W
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TEA1721ADB1060,598 NXP USA Inc. UM10522.pdf Description: EVAL BOARD FOR TEA1721
Packaging: Box
Voltage - Output: -12V
Voltage - Input: 85 ~ 265 VAC
Current - Output: 200mA
Contents: Board(s)
Frequency - Switching: 50kHz
Regulator Topology: Flyback
Board Type: Fully Populated
Utilized IC / Part: TEA1721
Supplied Contents: Board(s)
Main Purpose: AC/DC, Non-Isolated
Outputs and Type: 1 Non-Isolated Output
Part Status: Active
Power - Output: 2.5W
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TEA1721ADB1062,598 NXP USA Inc. 75017320.pdf Description: EVAL BOARD FOR TEA1721
Packaging: Box
Voltage - Output: 3.3V, 5V, 24V
Voltage - Input: 85 ~ 560 VAC
Current - Output: 300mA, 300mA, 200mA
Frequency - Switching: 50kHz
Regulator Topology: Flyback
Board Type: Fully Populated
Utilized IC / Part: TEA1721
Supplied Contents: Board(s)
Main Purpose: AC/DC, Primary Side
Outputs and Type: 3 Isolated Outputs
Part Status: Active
Power - Output: 5W
Contents: Board(s)
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TEA1721BDB1065,598 NXP USA Inc. 75017320.pdf Description: EVAL BOARD FOR TEA1721
Power - Output: 5W
Part Status: Active
Contents: Board(s)
Outputs and Type: 2 Isolated Outputs
Main Purpose: AC/DC, Primary Side
Supplied Contents: Board(s)
Utilized IC / Part: TEA1721
Board Type: Fully Populated
Regulator Topology: Flyback
Frequency - Switching: 50kHz
Current - Output: 400mA, 400mA
Voltage - Input: 85 ~ 265 VAC
Voltage - Output: -3.3V, -12V
Packaging: Box
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MKL02Z32CAF4R MKL02Z32CAF4R NXP USA Inc. KL0xPB.pdf Description: IC MCU 32BIT 32KB FLASH 20WLCSP
DigiKey Programmable: Not Verified
Number of I/O: 18
Part Status: Active
Supplier Device Package: 20-WLCSP (1.99x1.94)
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 20-UFBGA, WLCSP
Packaging: Cut Tape (CT)
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NX3P2902BUKZ NX3P2902BUKZ NXP USA Inc. NX3P2902B.pdf Description: IC PWR SWITCH P-CHAN 1:1 4WLCSP
Part Status: Active
Supplier Device Package: 4-WLCSP (0.74x0.74)
Ratio - Input:Output: 1:1
Current - Output (Max): 500mA
Voltage - Supply (Vcc/Vdd): Not Required
Voltage - Load: 1.1V ~ 3.6V
Input Type: Non-Inverting
Rds On (Typ): 65mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TJ)
Switch Type: General Purpose
Interface: On/Off
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: P-Channel
Package / Case: 4-UFBGA, WLCSP
Features: Load Discharge, Slew Rate Controlled
Packaging: Tape & Reel (TR)
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N74F38D-Q100J N74F38D-Q100J NXP USA Inc. Description: IC GATE NAND OP COL 4CH 2IN 14SO
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NX3DV221TKX NX3DV221TKX NXP USA Inc. NX3DV221.pdf Description: IC USB 2.0 SWITCH HS 10HVSON
Features: Bi-Directional
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: USB
On-State Resistance (Max): 7Ohm
-3db Bandwidth: 1GHz
Supplier Device Package: 10-HVSON (3x3)
Voltage - Supply, Single (V+): 2.3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 1
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NX3DV42GU10X NX3DV42GU10X NXP USA Inc. NX3DV42.pdf Description: IC USB 2.0 SWITCH HS 10XQFN
Features: Break-Before-Make, USB 2.0
Packaging: Cut Tape (CT)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: USB
On-State Resistance (Max): 6.5Ohm
-3db Bandwidth: 950MHz
Supplier Device Package: 10-XQFN (1.3x1.6)
Voltage - Supply, Single (V+): 3V ~ 4.3V
Switch Circuit: DPDT
Part Status: Active
Number of Channels: 1
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NX3L1G3157GM-Q100X NX3L1G3157GM-Q100X NXP USA Inc. Description: IC SWITCH SPDT X 1 750MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 25ns, 10ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Grade: Automotive
Number of Circuits: 1
Qualification: AEC-Q100
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DC6M602X6/1215A,13 DC6M602X6/1215A,13 NXP USA Inc. DC6M60xX6_Family.pdf Description: IC REG BUCK PROG 650MA 6WLCSP
Part Status: Obsolete
Voltage - Output (Min/Fixed): 1.2V, 1.5V
Voltage - Input (Min): 2.3V
Synchronous Rectifier: Yes
Supplier Device Package: 6-WLCSP (1.36x0.96)
Topology: Buck
Voltage - Input (Max): 5.5V
Frequency - Switching: 6MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output: 650mA
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Programmable
Package / Case: 6-XFBGA, WLCSP
Packaging: Cut Tape (CT)
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DC6M602X6/1218A,13 DC6M602X6/1218A,13 NXP USA Inc. DC6M60xX6_Family.pdf Description: IC REG BUCK PROG 650MA 6WLCSP
Part Status: Obsolete
Voltage - Output (Min/Fixed): 1.2V, 1.8V
Voltage - Input (Min): 2.3V
Synchronous Rectifier: Yes
Supplier Device Package: 6-WLCSP (1.36x0.96)
Topology: Buck
Voltage - Input (Max): 5.5V
Frequency - Switching: 6MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output: 650mA
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Programmable
Package / Case: 6-XFBGA, WLCSP
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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DC6M601X6/285SF DC6M601X6/285SF NXP USA Inc. DC6M60xX6_Family.pdf Description: IC REG BUCK 2.85V 650MA 6WLCSP
Supplier Device Package: 6-WLCSP (1.36x0.96)
Topology: Buck
Voltage - Input (Max): 5.5V
Frequency - Switching: 6MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output: 650mA
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 6-XFBGA, WLCSP
Packaging: Cut Tape (CT)
Part Status: Obsolete
Voltage - Output (Min/Fixed): 2.85V
Voltage - Input (Min): 2.3V
Synchronous Rectifier: Yes
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LPC812M101JDH16FP LPC812M101JDH16FP NXP USA Inc. LPC81XM.pdf Description: IC MCU 32BIT 16KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 14
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 30MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
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LPC812M101JDH20FP LPC812M101JDH20FP NXP USA Inc. LPC81XM.pdf Description: IC MCU 32BIT 16KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
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IP4264CZ8-40-TTL,1 IP4264CZ8-40-TTL,1 NXP USA Inc. IP4264CZ8-10_20_40-TTL.pdf Description: FILTER RC(PI) ESD SMD
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IP4357CX17,135 NXP USA Inc. SD(HC)-Memory_Card_MMC_AN.pdf Description: TVS DIODE 17CSP
Packaging: Cut Tape (CT)
Part Status: Obsolete
Produkt ist nicht verfügbar
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NX3008NBKT,115 NX3008NBKT,115 NXP USA Inc. NX3008NBKT.pdf Description: MOSFET N-CH 30V 350MA SC75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 350mA (Ta)
Rds On (Max) @ Id, Vgs: 1.4Ohm @ 350mA, 4.5V
Power Dissipation (Max): 250mW (Ta), 770mW (Tc)
Vgs(th) (Max) @ Id: 1.1V @ 250µA
Supplier Device Package: SC-75
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 0.68 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 50 pF @ 15 V
Qualification: AEC-Q101
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NX3008PBKT,115 NX3008PBKT,115 NXP USA Inc. Description: MOSFET P-CH 30V 200MA SC75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 200mA (Ta)
Rds On (Max) @ Id, Vgs: 4.1Ohm @ 200mA, 4.5V
Power Dissipation (Max): 250mW (Ta), 770mW (Tc)
Vgs(th) (Max) @ Id: 1.1V @ 250µA
Supplier Device Package: SC-75
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 0.72 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 46 pF @ 15 V
Qualification: AEC-Q101
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NX3020NAKT,115 NX3020NAKT,115 NXP USA Inc. Description: MOSFET N-CH 30V 180MA SC75
Input Capacitance (Ciss) (Max) @ Vds: 13 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 0.44 nC @ 4.5 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 10V
Supplier Device Package: SC-75
Vgs(th) (Max) @ Id: 1.5V @ 250µA
Power Dissipation (Max): 230mW (Ta), 1.06W (Tc)
Rds On (Max) @ Id, Vgs: 4.5Ohm @ 100mA, 10V
Current - Continuous Drain (Id) @ 25°C: 180mA (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-75, SOT-416
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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PEMI1QFN/CK,315 PEMI1QFN/CK,315 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 20 OHM/13.5PF SMD
Number of Channels: 1
Part Status: Obsolete
ESD Protection: Yes
Resistance - Channel (Ohms): 20
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 10dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 20Ohms, C = 13.5pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Package / Case: SC-101, SOT-883
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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PEMI2QFN/WM,115 PEMI2QFN/WM,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 200 OHM/16PF SMD
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TFF11145HN/N1X TFF11145HN.pdf
TFF11145HN/N1X
Hersteller: NXP USA Inc.
Description: IC FREQUENCY GENERATOR 24HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 14.8GHz
Input: Clock
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Main Purpose: Ku band VSAT applications
Ratio - Input:Output: 1:4
Differential - Input:Output: Yes/No
Supplier Device Package: 24-HVQFN (4x4)
PLL: Yes
Number of Circuits: 1
DigiKey Programmable: Not Verified
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OM12030/100,551
Hersteller: NXP USA Inc.
Description: MOD ATOP AUTO TELEMATIC
Part Status: Active
RF Type: Cellular
Mounting Type: Surface Mount
Packaging: Tray
Produkt ist nicht verfügbar
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LPC4370FET256E LPC4370.pdf
LPC4370FET256E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 282K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0/M0
Data Converters: A/D 16x10b, 6x12b; D/A 1x10b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Part Status: Active
Number of I/O: 164
DigiKey Programmable: Not Verified
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LPC43S30FET256E LPC43S50_30_20.pdf
LPC43S30FET256E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Part Status: Active
Number of I/O: 164
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 90 Stücke
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LPC43S50FET256,551 LPC43S50_30_20.pdf
LPC43S50FET256,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256LBGA
auf Bestellung 73 Stücke:
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OM12004/0020000,55
Hersteller: NXP USA Inc.
Description: MOD ATOP AUTO TELEMATIC
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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OM12004/1000000,55
Hersteller: NXP USA Inc.
Description: MOD ATOP AUTO TELEMATIC
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
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OM12030/100,557
Hersteller: NXP USA Inc.
Description: MOD ATOP AUTO TELEMATIC
Packaging: Tray
Mounting Type: Surface Mount
RF Type: Cellular
Part Status: Active
Produkt ist nicht verfügbar
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EM783-MC3E 75017322.pdf
EM783-MC3E
Hersteller: NXP USA Inc.
Description: MCU 32BIT ENERGY METER 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, IrDA, SPI, UART/USART
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.6V ~ 3.6V
Program Memory Type: FLASH (32kB)
Applications: Energy Measurement
Core Processor: ARM® Cortex®-M0
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Obsolete
Number of I/O: 22
Produkt ist nicht verfügbar
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EM783-MC6E 75017322.pdf
EM783-MC6E
Hersteller: NXP USA Inc.
Description: MCU 32BIT ENERGY METER 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, IrDA, SPI, UART/USART
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.6V ~ 3.6V
Program Memory Type: FLASH (32kB)
Applications: Energy Measurement
Core Processor: ARM® Cortex®-M0
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Obsolete
Number of I/O: 22
Produkt ist nicht verfügbar
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EM783-SCE 75017322.pdf
EM783-SCE
Hersteller: NXP USA Inc.
Description: MCU 32BIT ENERGY METER 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, IrDA, SPI, UART/USART
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.6V ~ 3.6V
Program Memory Type: FLASH (32kB)
Applications: Energy Measurement
Core Processor: ARM® Cortex®-M0
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Obsolete
Number of I/O: 22
Produkt ist nicht verfügbar
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EM783-SPE 75017322.pdf
EM783-SPE
Hersteller: NXP USA Inc.
Description: MCU 32BIT ENERGY METER 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, IrDA, SPI, UART/USART
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.6V ~ 3.6V
Program Memory Type: FLASH (32kB)
Applications: Energy Measurement
Core Processor: ARM® Cortex®-M0
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Obsolete
Number of I/O: 22
Produkt ist nicht verfügbar
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EM783-TPE 75017322.pdf
EM783-TPE
Hersteller: NXP USA Inc.
Description: MCU 32BIT ENERGY METER 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, IrDA, SPI, UART/USART
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.6V ~ 3.6V
Program Memory Type: FLASH (32kB)
Applications: Energy Measurement
Core Processor: ARM® Cortex®-M0
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Obsolete
Number of I/O: 22
Produkt ist nicht verfügbar
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LPC4370FET100E LPC4370.pdf
LPC4370FET100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 282K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0/M0
Data Converters: A/D 3x12b; D/A 1x10b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Discontinued at Digi-Key
Number of I/O: 49
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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HEF4051BT/AUJ HEF4051B.pdf
HEF4051BT/AUJ
Hersteller: NXP USA Inc.
Description: IC MUX 8:1 155OHM 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 155Ohm
-3db Bandwidth: 70MHz
Supplier Device Package: 16-SO
Voltage - Supply, Single (V+): 3V ~ 15V
Crosstalk: -50dB @ 1MHz
Multiplexer/Demultiplexer Circuit: 8:1
Channel-to-Channel Matching (ΔRon): 5Ohm
Channel Capacitance (CS(off), CD(off)): 7.5pF
Current - Leakage (IS(off)) (Max): 200nA
Part Status: Active
Number of Circuits: 1
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HEF4052BT/AUJ HEF4052B.pdf
HEF4052BT/AUJ
Hersteller: NXP USA Inc.
Description: IC SWITCH SP4T X 2 155OHM 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 155Ohm
-3db Bandwidth: 70MHz
Supplier Device Package: 16-SO
Voltage - Supply, Single (V+): 3V ~ 15V
Crosstalk: -50dB @ 1MHz
Switch Circuit: SP4T
Multiplexer/Demultiplexer Circuit: 4:1
Channel-to-Channel Matching (ΔRon): 5Ohm
Channel Capacitance (CS(off), CD(off)): 7.5pF
Current - Leakage (IS(off)) (Max): 200nA
Part Status: Active
Number of Circuits: 2
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HEF4053BT/AUJ HEF4053B.pdf
HEF4053BT/AUJ
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDT X 3 155OHM 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 155Ohm
-3db Bandwidth: 70MHz
Supplier Device Package: 16-SO
Voltage - Supply, Single (V+): 3V ~ 15V
Crosstalk: -50dB @ 1MHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 5Ohm
Channel Capacitance (CS(off), CD(off)): 7.5pF
Current - Leakage (IS(off)) (Max): 200nA
Part Status: Active
Number of Circuits: 3
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HEF4069UBT/AUJ HEF4069UB.pdf
HEF4069UBT/AUJ
Hersteller: NXP USA Inc.
Description: IC INVERTER 6CH 1-INP 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3.4mA, 3.4mA
Number of Inputs: 1
Supplier Device Package: 14-SO
Input Logic Level - High: 4V ~ 12.5V
Input Logic Level - Low: 1V ~ 2.5V
Max Propagation Delay @ V, Max CL: 25ns @ 15V, 50pF
Part Status: Active
Number of Circuits: 6
Current - Quiescent (Max): 1 µA
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HEF4081BT/AUJ HEF4081B.pdf
HEF4081BT/AUJ
Hersteller: NXP USA Inc.
Description: IC GATE AND 4CH 2-INP 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3.4mA, 3.4mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 3.5V ~ 11V
Input Logic Level - Low: 1.5V ~ 4V
Max Propagation Delay @ V, Max CL: 40ns @ 15V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 1 µA
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HEF4528BT/AUJ HEF4528B.pdf
HEF4528BT/AUJ
Hersteller: NXP USA Inc.
Description: IC MULTIVIBRATOR 35NS 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 85°C
Propagation Delay: 35 ns
Independent Circuits: 2
Current - Output High, Low: 3mA, 3mA
Schmitt Trigger Input: No
Supplier Device Package: 16-SO
Part Status: Active
Voltage - Supply: 3 V ~ 15 V
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N74F38D-Q100J
N74F38D-Q100J
Hersteller: NXP USA Inc.
Description: IC GATE NAND OP COL 4CH 2IN 14SO
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
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NX3L4053PW-Q100J NX3L4053_Q100.pdf
NX3L4053PW-Q100J
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDTX3 800MOHM 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 800mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 16-TSSOP
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 120mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Grade: Automotive
Part Status: Active
Number of Circuits: 3
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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PCA9952TW/Q900,118 PCA9952_PCA9955.pdf
PCA9952TW/Q900,118
Hersteller: NXP USA Inc.
Description: IC LED DRV LIN PWM 57MA 28HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad
Voltage - Output: 40V
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 57mA
Internal Switch(s): Yes
Supplier Device Package: 28-HTSSOP
Dimming: PWM
Voltage - Supply (Min): 3V
Voltage - Supply (Max): 5.5V
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 12500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2500+3.65 EUR
Mindestbestellmenge: 2500 Stücke
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PCA9956ATWY PCA9956A.pdf
PCA9956ATWY
Hersteller: NXP USA Inc.
Description: IC LED DRV LIN PWM 65MA 38HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 38-TFSOP (0.173", 4.40mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 24
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 65mA
Internal Switch(s): Yes
Supplier Device Package: 38-HTSSOP
Dimming: PWM
Voltage - Supply (Min): 3V
Voltage - Supply (Max): 5.5V
Part Status: Obsolete
Produkt ist nicht verfügbar
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NTB0102DP-Q100H NTB0102_Q100.pdf
NTB0102DP-Q100H
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-TSSOP
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Grade: Automotive
Part Status: Active
Number of Circuits: 1
Qualification: AEC-Q100
auf Bestellung 21000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3000+0.83 EUR
6000+0.81 EUR
9000+0.8 EUR
15000+0.79 EUR
Mindestbestellmenge: 3000 Stücke
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NTB0102GD-Q100H NTB0102_Q100.pdf
NTB0102GD-Q100H
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-XSON/SOT996-2
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Grade: Automotive
Number of Circuits: 1
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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NTB0104BQ-Q100X NTB0104_Q100.pdf
NTB0104BQ-Q100X
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 14-DHVQFN
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 14-VFQFN Exposed Pad
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 14-DHVQFN (2.5x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Grade: Automotive
Part Status: Active
Number of Circuits: 1
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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NTS0102GD-Q100H NTS0102_Q100.pdf
NTS0102GD-Q100H
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-XSON/SOT996-2
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Grade: Automotive
Part Status: Obsolete
Number of Circuits: 1
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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NTS0104BQ-Q100X NTS0104_Q100.pdf
NTS0104BQ-Q100X
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 14-DHVQFN
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 14-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 14-DHVQFN (2.5x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Grade: Automotive
Part Status: Active
Number of Circuits: 1
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3000+0.87 EUR
6000+0.85 EUR
Mindestbestellmenge: 3000 Stücke
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LPC4072FET80K LPC408X_7X.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 80TFBGA
Packaging: Tray
Package / Case: 80-TFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 80-TFBGA (7x7)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BLF8G20LS-400PVQ BLF8G20LS-400(PV,PGV).pdf
BLF8G20LS-400PVQ
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V CDFM8
Packaging: Tube
Package / Case: SOT-1242B
Mounting Type: Chassis Mount
Frequency: 1.81GHz ~ 1.88GHz
Configuration: Dual
Power - Output: 95W
Gain: 19dB
Technology: LDMOS
Supplier Device Package: CDFM8
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 3.4 A
Produkt ist nicht verfügbar
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NTS0104PW-Q100J NTS0104_Q100.pdf
NTS0104PW-Q100J
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 14-TSSOP
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 14-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Grade: Automotive
Part Status: Active
Number of Circuits: 1
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
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TFF11086HN/N1,111 TFF11086HN.pdf
TFF11086HN/N1,111
Hersteller: NXP USA Inc.
Description: IC FREQUENCY GENERATOR 24HVQFN
DigiKey Programmable: Not Verified
Number of Circuits: 1
Supplier Device Package: 24-HVQFN (4x4)
Differential - Input:Output: Yes/No
Ratio - Input:Output: 1:4
Main Purpose: Ku band VSAT applications
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Input: Clock
Frequency - Max: 8.71GHz
Output: Clock
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tray
PLL: Yes
Produkt ist nicht verfügbar
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HEF4093BT/AUJ HEF4093B.pdf
HEF4093BT/AUJ
Hersteller: NXP USA Inc.
Description: IC GATE NAND SCHMIT 4CH 2IN 14SO
Packaging: Tape & Reel (TR)
Features: Schmitt Trigger
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3.4mA, 3.4mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 3.5V ~ 11V
Input Logic Level - Low: 1.5V ~ 4V
Max Propagation Delay @ V, Max CL: 60ns @ 15V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 1 µA
Produkt ist nicht verfügbar
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HEF4013BP-Q100U HEF4013B_Q100.pdf
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE DOUBLE 1BIT 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: Complementary
Mounting Type: Through Hole
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3V ~ 15V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 3.4mA, 3.4mA
Trigger Type: Positive Edge
Clock Frequency: 40 MHz
Input Capacitance: 7.5 pF
Supplier Device Package: 14-DIP
Max Propagation Delay @ V, Max CL: 60ns @ 15V, 50pF
Part Status: Obsolete
Number of Bits per Element: 1
Produkt ist nicht verfügbar
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HEF4021BP-Q100U HEF4021B_Q100.pdf
HEF4021BP-Q100U
Hersteller: NXP USA Inc.
Description: IC SR PUSH-PULL 8BIT 16-DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Push-Pull
Mounting Type: Through Hole
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 15V
Supplier Device Package: 16-DIP
Part Status: Obsolete
Number of Bits per Element: 8
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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HEF4070BP-Q100U
Hersteller: NXP USA Inc.
Description: IC GATE XOR 4CH 2-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3mA, 3mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 3.5V ~ 11V
Input Logic Level - Low: 1.5V ~ 4V
Max Propagation Delay @ V, Max CL: 55ns @ 15V, 50pF
Grade: Automotive
Part Status: Obsolete
Number of Circuits: 4
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TEA1721ADB1061,598 75017320.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR TEA1721
Packaging: Box
Voltage - Output: 3.3V, 12V
Voltage - Input: 85 ~ 265 VAC
Current - Output: 400mA, 400mA
Contents: Board(s)
Frequency - Switching: 51kHz
Regulator Topology: Flyback
Board Type: Fully Populated
Utilized IC / Part: TEA1721
Supplied Contents: Board(s)
Main Purpose: AC/DC, Primary Side
Outputs and Type: 2 Isolated Outputs
Part Status: Active
Power - Output: 5W
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TEA1721ADB1059,598 75017320.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR TEA1721
Packaging: Box
Voltage - Output: 12V
Voltage - Input: 85 ~ 265 VAC
Current - Output: 200mA
Contents: Board(s)
Frequency - Switching: 50kHz
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: TEA1721
Supplied Contents: Board(s)
Main Purpose: AC/DC, Non-Isolated
Outputs and Type: 1 Non-Isolated Output
Part Status: Active
Power - Output: 2.5W
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TEA1721ADB1060,598 UM10522.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR TEA1721
Packaging: Box
Voltage - Output: -12V
Voltage - Input: 85 ~ 265 VAC
Current - Output: 200mA
Contents: Board(s)
Frequency - Switching: 50kHz
Regulator Topology: Flyback
Board Type: Fully Populated
Utilized IC / Part: TEA1721
Supplied Contents: Board(s)
Main Purpose: AC/DC, Non-Isolated
Outputs and Type: 1 Non-Isolated Output
Part Status: Active
Power - Output: 2.5W
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TEA1721ADB1062,598 75017320.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR TEA1721
Packaging: Box
Voltage - Output: 3.3V, 5V, 24V
Voltage - Input: 85 ~ 560 VAC
Current - Output: 300mA, 300mA, 200mA
Frequency - Switching: 50kHz
Regulator Topology: Flyback
Board Type: Fully Populated
Utilized IC / Part: TEA1721
Supplied Contents: Board(s)
Main Purpose: AC/DC, Primary Side
Outputs and Type: 3 Isolated Outputs
Part Status: Active
Power - Output: 5W
Contents: Board(s)
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TEA1721BDB1065,598 75017320.pdf
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR TEA1721
Power - Output: 5W
Part Status: Active
Contents: Board(s)
Outputs and Type: 2 Isolated Outputs
Main Purpose: AC/DC, Primary Side
Supplied Contents: Board(s)
Utilized IC / Part: TEA1721
Board Type: Fully Populated
Regulator Topology: Flyback
Frequency - Switching: 50kHz
Current - Output: 400mA, 400mA
Voltage - Input: 85 ~ 265 VAC
Voltage - Output: -3.3V, -12V
Packaging: Box
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MKL02Z32CAF4R KL0xPB.pdf
MKL02Z32CAF4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 20WLCSP
DigiKey Programmable: Not Verified
Number of I/O: 18
Part Status: Active
Supplier Device Package: 20-WLCSP (1.99x1.94)
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 20-UFBGA, WLCSP
Packaging: Cut Tape (CT)
auf Bestellung 239 Stücke:
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AnzahlPreis
6+3.33 EUR
10+2.91 EUR
25+2.88 EUR
100+2.85 EUR
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NX3P2902BUKZ NX3P2902B.pdf
NX3P2902BUKZ
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH P-CHAN 1:1 4WLCSP
Part Status: Active
Supplier Device Package: 4-WLCSP (0.74x0.74)
Ratio - Input:Output: 1:1
Current - Output (Max): 500mA
Voltage - Supply (Vcc/Vdd): Not Required
Voltage - Load: 1.1V ~ 3.6V
Input Type: Non-Inverting
Rds On (Typ): 65mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TJ)
Switch Type: General Purpose
Interface: On/Off
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: P-Channel
Package / Case: 4-UFBGA, WLCSP
Features: Load Discharge, Slew Rate Controlled
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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N74F38D-Q100J
N74F38D-Q100J
Hersteller: NXP USA Inc.
Description: IC GATE NAND OP COL 4CH 2IN 14SO
Produkt ist nicht verfügbar
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NX3DV221TKX NX3DV221.pdf
NX3DV221TKX
Hersteller: NXP USA Inc.
Description: IC USB 2.0 SWITCH HS 10HVSON
Features: Bi-Directional
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: USB
On-State Resistance (Max): 7Ohm
-3db Bandwidth: 1GHz
Supplier Device Package: 10-HVSON (3x3)
Voltage - Supply, Single (V+): 2.3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 1
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AnzahlPreis
15+1.21 EUR
21+0.86 EUR
25+0.78 EUR
100+0.68 EUR
250+0.63 EUR
500+0.61 EUR
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NX3DV42GU10X NX3DV42.pdf
NX3DV42GU10X
Hersteller: NXP USA Inc.
Description: IC USB 2.0 SWITCH HS 10XQFN
Features: Break-Before-Make, USB 2.0
Packaging: Cut Tape (CT)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: USB
On-State Resistance (Max): 6.5Ohm
-3db Bandwidth: 950MHz
Supplier Device Package: 10-XQFN (1.3x1.6)
Voltage - Supply, Single (V+): 3V ~ 4.3V
Switch Circuit: DPDT
Part Status: Active
Number of Channels: 1
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13+1.36 EUR
19+0.97 EUR
25+0.87 EUR
100+0.77 EUR
250+0.72 EUR
500+0.69 EUR
1000+0.66 EUR
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NX3L1G3157GM-Q100X
NX3L1G3157GM-Q100X
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDT X 1 750MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 25ns, 10ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Grade: Automotive
Number of Circuits: 1
Qualification: AEC-Q100
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DC6M602X6/1215A,13 DC6M60xX6_Family.pdf
DC6M602X6/1215A,13
Hersteller: NXP USA Inc.
Description: IC REG BUCK PROG 650MA 6WLCSP
Part Status: Obsolete
Voltage - Output (Min/Fixed): 1.2V, 1.5V
Voltage - Input (Min): 2.3V
Synchronous Rectifier: Yes
Supplier Device Package: 6-WLCSP (1.36x0.96)
Topology: Buck
Voltage - Input (Max): 5.5V
Frequency - Switching: 6MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output: 650mA
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Programmable
Package / Case: 6-XFBGA, WLCSP
Packaging: Cut Tape (CT)
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DC6M602X6/1218A,13 DC6M60xX6_Family.pdf
DC6M602X6/1218A,13
Hersteller: NXP USA Inc.
Description: IC REG BUCK PROG 650MA 6WLCSP
Part Status: Obsolete
Voltage - Output (Min/Fixed): 1.2V, 1.8V
Voltage - Input (Min): 2.3V
Synchronous Rectifier: Yes
Supplier Device Package: 6-WLCSP (1.36x0.96)
Topology: Buck
Voltage - Input (Max): 5.5V
Frequency - Switching: 6MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output: 650mA
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Programmable
Package / Case: 6-XFBGA, WLCSP
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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DC6M601X6/285SF DC6M60xX6_Family.pdf
DC6M601X6/285SF
Hersteller: NXP USA Inc.
Description: IC REG BUCK 2.85V 650MA 6WLCSP
Supplier Device Package: 6-WLCSP (1.36x0.96)
Topology: Buck
Voltage - Input (Max): 5.5V
Frequency - Switching: 6MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output: 650mA
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 6-XFBGA, WLCSP
Packaging: Cut Tape (CT)
Part Status: Obsolete
Voltage - Output (Min/Fixed): 2.85V
Voltage - Input (Min): 2.3V
Synchronous Rectifier: Yes
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LPC812M101JDH16FP LPC81XM.pdf
LPC812M101JDH16FP
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 14
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 30MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
auf Bestellung 1991 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
8+2.46 EUR
13+1.44 EUR
96+1.39 EUR
192+1.34 EUR
288+1.27 EUR
576+1.2 EUR
1056+1.17 EUR
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LPC812M101JDH20FP LPC81XM.pdf
LPC812M101JDH20FP
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
auf Bestellung 14027 Stücke:
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AnzahlPreis
7+2.76 EUR
10+2.03 EUR
75+1.68 EUR
150+1.6 EUR
300+1.53 EUR
525+1.49 EUR
1050+1.44 EUR
2550+1.39 EUR
5025+1.36 EUR
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IP4264CZ8-40-TTL,1 IP4264CZ8-10_20_40-TTL.pdf
IP4264CZ8-40-TTL,1
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) ESD SMD
Produkt ist nicht verfügbar
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IP4357CX17,135 SD(HC)-Memory_Card_MMC_AN.pdf
Hersteller: NXP USA Inc.
Description: TVS DIODE 17CSP
Packaging: Cut Tape (CT)
Part Status: Obsolete
Produkt ist nicht verfügbar
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NX3008NBKT,115 NX3008NBKT.pdf
NX3008NBKT,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 350MA SC75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 350mA (Ta)
Rds On (Max) @ Id, Vgs: 1.4Ohm @ 350mA, 4.5V
Power Dissipation (Max): 250mW (Ta), 770mW (Tc)
Vgs(th) (Max) @ Id: 1.1V @ 250µA
Supplier Device Package: SC-75
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 0.68 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 50 pF @ 15 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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NX3008PBKT,115
NX3008PBKT,115
Hersteller: NXP USA Inc.
Description: MOSFET P-CH 30V 200MA SC75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 200mA (Ta)
Rds On (Max) @ Id, Vgs: 4.1Ohm @ 200mA, 4.5V
Power Dissipation (Max): 250mW (Ta), 770mW (Tc)
Vgs(th) (Max) @ Id: 1.1V @ 250µA
Supplier Device Package: SC-75
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 0.72 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 46 pF @ 15 V
Qualification: AEC-Q101
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NX3020NAKT,115
NX3020NAKT,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 180MA SC75
Input Capacitance (Ciss) (Max) @ Vds: 13 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 0.44 nC @ 4.5 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 10V
Supplier Device Package: SC-75
Vgs(th) (Max) @ Id: 1.5V @ 250µA
Power Dissipation (Max): 230mW (Ta), 1.06W (Tc)
Rds On (Max) @ Id, Vgs: 4.5Ohm @ 100mA, 10V
Current - Continuous Drain (Id) @ 25°C: 180mA (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-75, SOT-416
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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PEMI1QFN/CK,315 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI1QFN/CK,315
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 20 OHM/13.5PF SMD
Number of Channels: 1
Part Status: Obsolete
ESD Protection: Yes
Resistance - Channel (Ohms): 20
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 10dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 20Ohms, C = 13.5pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Package / Case: SC-101, SOT-883
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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PEMI2QFN/WM,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2QFN/WM,115
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/16PF SMD
Produkt ist nicht verfügbar
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