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PEMI2STD/CP,115 PEMI2STD/CP,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 20 OHM/18.5PF SMD
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PEMI2STD/LT,115 PEMI2STD/LT,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 65 OHM/23PF SMD
Number of Channels: 2
ESD Protection: Yes
Resistance - Channel (Ohms): 65
Technology: RC (Pi)
Applications: Data Lines for Mobile Devices
Filter Order: 2nd
Height: 0.024" (0.60mm)
Values: R = 65Ohms, C = 23pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Package / Case: SOT-665
Packaging: Cut Tape (CT)
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PEMI2STD/WK,115 PEMI2STD/WK,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 200 OHM/13.5PF SMD
Height: 0.024" (0.60mm)
Values: R = 200Ohms, C = 13.5pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Package / Case: SOT-665
Packaging: Cut Tape (CT)
Number of Channels: 2
ESD Protection: Yes
Resistance - Channel (Ohms): 200
Technology: RC (Pi)
Applications: Data Lines for Mobile Devices
Filter Order: 2nd
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PEMI2STD/WM,115 PEMI2STD/WM,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 200 OHM/16PF SMD
Number of Channels: 2
Part Status: Obsolete
ESD Protection: Yes
Resistance - Channel (Ohms): 200
Technology: RC (Pi)
Applications: Data Lines for Mobile Devices
Filter Order: 2nd
Height: 0.024" (0.60mm)
Values: R = 200Ohms, C = 16pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Package / Case: SOT-665
Packaging: Cut Tape (CT)
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PEMI4QFN/HR,132 PEMI4QFN/HR,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 45 OHM/21PF SMD
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PEMI4QFN/WG,132 PEMI4QFN/WG,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 200 OHM/11PF SMD
Number of Channels: 4
Part Status: Obsolete
ESD Protection: Yes
Resistance - Channel (Ohms): 200
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 21dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 200Ohms, C = 11pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Package / Case: 8-XFDFN
Packaging: Cut Tape (CT)
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PEMI8QFN/WP,132 PEMI8QFN/WP,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 200 OHM/18.5PF SMD
Number of Channels: 8
ESD Protection: Yes
Resistance - Channel (Ohms): 200
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 30dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 200Ohms, C = 18.5pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Package / Case: 16-XFDFN Exposed Pad
Packaging: Cut Tape (CT)
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PMF63UN,115 PMF63UN,115 NXP USA Inc. PMF63UN.pdf Description: MOSFET N-CH 20V 1.8A SOT323-3
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Packaging: Cut Tape (CT)
Input Capacitance (Ciss) (Max) @ Vds: 185 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 3.3 nC @ 4.5 V
Drain to Source Voltage (Vdss): 20 V
Vgs (Max): ±8V
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Supplier Device Package: SC-70
Vgs(th) (Max) @ Id: 1V @ 250µA
Power Dissipation (Max): 275mW (Ta), 1.785W (Tc)
Rds On (Max) @ Id, Vgs: 74mOhm @ 1.8A, 4.5V
Current - Continuous Drain (Id) @ 25°C: 1.8A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
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PMG45UN,115 PMG45UN,115 NXP USA Inc. PMG45UN_Rev_Nov_2012.pdf Description: MOSFET N-CH 20V 3A SOT363
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PMV90EN,215 PMV90EN,215 NXP USA Inc. PMV90EN.pdf Description: MOSFET N-CH 30V 1.9A TO236AB
Packaging: Cut Tape (CT)
Input Capacitance (Ciss) (Max) @ Vds: 132 pF @ 15 V
Gate Charge (Qg) (Max) @ Vgs: 4 nC @ 10 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Supplier Device Package: SOT-23 (TO-236AB)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Power Dissipation (Max): 310mW (Ta), 2.09W (Tc)
Rds On (Max) @ Id, Vgs: 84mOhm @ 1.9A, 10V
Current - Continuous Drain (Id) @ 25°C: 1.9A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
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MKL16Z256VMP4 MKL16Z256VMP4 NXP USA Inc. KL16P64M48SF4.pdf Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, TSI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D - 16bit; D/A - 12bit
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 64-MAPBGA (5x5)
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10+6.37 EUR
25+6.26 EUR
100+6.11 EUR
250+6.1 EUR
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MKL26Z256VMP4 MKL26Z256VMP4 NXP USA Inc. KL26P121M48SF4.pdf Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D - 16bit; D/A - 12bit
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
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2+12.37 EUR
10+9.57 EUR
25+8.87 EUR
100+8.1 EUR
250+7.74 EUR
640+7.45 EUR
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NXPMOSFET-DESIGNKIT NXPMOSFET-DESIGNKIT NXP USA Inc. Description: KIT DESIGN MOSFET LFPAK
Packaging: Box
Mounting Type: Surface Mount
Quantity: 180 Pieces (18 Values - 10 Each)
Kit Type: MOSFETs
Part Status: Obsolete
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OM13054UL OM13054UL NXP USA Inc. OM13054_Web.pdf Description: BOARD EVAL LPC-LINK2
Packaging: Box
Type: Debugger
Contents: Board(s), Cable(s)
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NT2H1611F0DTLH NT2H1611F0DTLH NXP USA Inc. NTAG213F_216F.pdf Description: NFC TYPE2 TAG IC 144/888 BYTES
Packaging: Tube
Package / Case: 4-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Standards: ISO 14443, NFC
Supplier Device Package: 4-HXSON (2x1.5)
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12+1.56 EUR
25+1.47 EUR
100+1.35 EUR
250+1.28 EUR
500+1.23 EUR
1000+1.18 EUR
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AFT09H310-03SR6 AFT09H310-03SR6 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI1230
Current - Test: 680 mA
Voltage - Test: 28 V
Voltage - Rated: 70 V
Supplier Device Package: NI-1230S
Technology: LDMOS
Gain: 17.9dB
Power - Output: 56W
Frequency: 920MHz
Mounting Type: Chassis Mount
Package / Case: NI-1230S
Packaging: Tape & Reel (TR)
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AFT09H310-04GSR6 NXP USA Inc. Description: RF MOSFET 28V NI1230
Technology: MOSFET (Metal Oxide)
Gain: 17.9dB
Power - Output: 56W
Configuration: N-Channel
Frequency: 920MHz
Mounting Type: Chassis Mount
Package / Case: NI-1230S-4 GW
Packaging: Tape & Reel (TR)
Current - Test: 680 mA
Voltage - Test: 28 V
Voltage - Rated: 70 V
Supplier Device Package: NI-1230S-4 GULL
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AFT09MP055GNR1 AFT09MP055GNR1 NXP USA Inc. AFT09MP055N.pdf Description: RF MOSFET LDMOS 12.5V TO270-4
Current - Test: 550 mA
Voltage - Test: 12.5 V
Voltage - Rated: 40 V
Part Status: Active
Supplier Device Package: TO-270 WB-4 Gull
Technology: LDMOS
Gain: 15.7dB
Power - Output: 1W
Frequency: 870MHz
Mounting Type: Surface Mount
Package / Case: TO-270BB
Packaging: Tape & Reel (TR)
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AFT09MP055NR1 AFT09MP055NR1 NXP USA Inc. AFT09MP055N.pdf Description: RF MOSFET LDMOS 12.5V TO270-4
Current - Test: 550 mA
Voltage - Test: 12.5 V
Voltage - Rated: 40 V
Supplier Device Package: TO-270 WB-4
Technology: LDMOS
Gain: 15.7dB
Power - Output: 1W
Frequency: 870MHz
Mounting Type: Surface Mount
Package / Case: TO-270AB
Packaging: Tape & Reel (TR)
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AFT09MS007NT1 AFT09MS007NT1 NXP USA Inc. AFT09MS007N.pdf Description: RF MOSFET LDMOS 7.5V PLD-1.5W
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 7.3W
Gain: 15.2dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 7.5 V
Current - Test: 100 mA
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AFT18H356-24SR6 AFT18H356-24SR6 NXP USA Inc. Description: FET RF 2CH 65V 1.88GHZ NI1230-4
Current - Test: 1.1 A
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: NI-1230-4LS2L
Gain: 15dB
Power - Output: 63W
Frequency: 1.88GHz
Mounting Type: Chassis Mount
Package / Case: NI-1230-4LS2L
Packaging: Tape & Reel (TR)
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AFT26H160-4S4R3 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI880X-4
Current - Test: 500 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-880X-4L4S-8
Technology: LDMOS
Gain: 14.9dB
Power - Output: 32W
Frequency: 2.5GHz
Mounting Type: Chassis Mount
Package / Case: NI-880X-4L4S-8
Packaging: Tape & Reel (TR)
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MC10XS3412JHFKR2 MC10XS3412JHFKR2 NXP USA Inc. Description: IC PWR SWITCH N-CHAN 1:1 24PQFN
Part Status: Obsolete
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Supplier Device Package: 24-PQFN (12x12)
Ratio - Input:Output: 1:1
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 6V ~ 20V
Rds On (Typ): 10mOhm, 12mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 150°C (TJ)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 4
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 24-PowerQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
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MC34903CP5EKR2 MC34903CP5EKR2 NXP USA Inc. MC34903,4,5.pdf Description: IC SBC HIGH SPEED CAN 5V 32SOIC
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MC34903CS3EKR2 MC34903CS3EKR2 NXP USA Inc. MC34903,4,5.pdf Description: IC SBC HIGH SPD CAN 3.3V 32SOIC
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MC34903CS5EKR2 MC34903CS5EKR2 NXP USA Inc. MC34903,4,5.pdf Description: IC SBC HIGH SPEED CAN 5V 32SOIC
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MC34904C5EKR2 MC34904C5EKR2 NXP USA Inc. MC34903,4,5.pdf Description: IC SBC HIGH SPEED CAN 5V 32SOIC
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MC34905CS3EKR2 MC34905CS3EKR2 NXP USA Inc. MC34903%2C4%2C5.pdf Description: IC SBC HIGH SPD CAN 3.3V 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 2mA
Supplier Device Package: 32-SOIC-EP
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MC34905CS5EKR2 MC34905CS5EKR2 NXP USA Inc. MC34903%2C4%2C5.pdf Description: IC SBC HIGH SPEED CAN 5V 32SOIC
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tape & Reel (TR)
Supplier Device Package: 32-SOIC-EP
Current - Supply: 2mA
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Operating Temperature: -40°C ~ 125°C
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MC56F8025VLDR MC56F8025VLDR NXP USA Inc. MC56F8023.pdf Description: IC MCU 16BIT 32KB FLASH 44LQFP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 16
Program Memory Size: 32KB (16K x 16)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 35
Supplier Device Package: 44-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 8x12b; D/A 2x12b
Core Processor: 56800E
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MCIMX6D4AVT10ADR MCIMX6D4AVT10ADR NXP USA Inc. IMX6DQIEC.pdf Description: IC MPU I.MX6D 1.0GHZ 624FCBGA
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tape & Reel (TR)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
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MCIMX6D5EYM10ADR MCIMX6D5EYM10ADR NXP USA Inc. IMX6DQCEC.pdf Description: IC MPU I.MX6D 1.0GHZ 624FCBGA
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MCIMX6D6AVT08ADR MCIMX6D6AVT08ADR NXP USA Inc. IMX6DQAEC.pdf Description: IC MPU I.MX6D 852MHZ 624FCBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 852MHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tape & Reel (TR)
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MCIMX6D6AVT10ADR MCIMX6D6AVT10ADR NXP USA Inc. IMX6DQAEC.pdf Description: IC MPU I.MX6D 1.0GHZ 624FCBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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500+103.28 EUR
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MCIMX6Q4AVT08ADR MCIMX6Q4AVT08ADR NXP USA Inc. IMX6DQAEC.pdf Description: IC MPU I.MX6Q 852MHZ 624FCBGA
Part Status: Active
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 4 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 852MHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCIMX6Q5EYM10ADR MCIMX6Q5EYM10ADR NXP USA Inc. IMX6DQAEC.pdf Description: IC MPU I.MX6Q 1.0GHZ 624FCPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
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MCIMX6Q6AVT08ADR MCIMX6Q6AVT08ADR NXP USA Inc. IMX6DQAEC.pdf Description: IC MPU I.MX6Q 852MHZ 624FCBGA
Produkt ist nicht verfügbar
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MCIMX6S1AVM08ACR MCIMX6S1AVM08ACR NXP USA Inc. IMX6SDLCEC.pdf Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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MCIMX6S4AVM08ACR MCIMX6S4AVM08ACR NXP USA Inc. IMX6SDLAEC.pdf Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX6S5DVM10ACR MCIMX6S5DVM10ACR NXP USA Inc. IMX6SDLAEC.pdf Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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MCIMX6S5EVM10ACR MCIMX6S5EVM10ACR NXP USA Inc. IMX6SDLAEC.pdf Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tape & Reel (TR)
Part Status: Active
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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MCIMX6S6AVM08ACR MCIMX6S6AVM08ACR NXP USA Inc. IMX6SDLAEC.pdf Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Produkt ist nicht verfügbar
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MCIMX6U5EVM10ACR MCIMX6U5EVM10ACR NXP USA Inc. IMX6SDLCEC.pdf Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Package / Case: 624-LFBGA
Packaging: Tape & Reel (TR)
Part Status: Active
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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MCIMX6U6AVM08ACR MCIMX6U6AVM08ACR NXP USA Inc. IMX6SDLAEC.pdf Description: IC MPU I.MX6DL 800MHZ 624MAPBGA
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tape & Reel (TR)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 800MHz
Produkt ist nicht verfügbar
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MK20DX256VLK7R MK20DX256VLK7R NXP USA Inc. K20P81M72SF1.pdf Description: IC MCU 32BIT 256KB FLASH 80FQFP
DigiKey Programmable: Not Verified
Number of I/O: 52
Supplier Device Package: 80-FQFP (12x12)
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 29x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MK60DN256VLL10R MK60DN256VLL10R NXP USA Inc. K60P100M100SF2V2.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 66
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 33x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MKL15Z64VFM4R MKL15Z64VFM4R NXP USA Inc. KL15P80M48SF0.pdf Description: IC MCU 32BIT 64KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 9x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, TSI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
DigiKey Programmable: Not Verified
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MMPF0100F0AEPR2 MMPF0100F0AEPR2 NXP USA Inc. MMPF0100.pdf Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
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MMPF0100F1AEPR2 MMPF0100F1AEPR2 NXP USA Inc. MMPF0100.pdf Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
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MMPF0100F2AEPR2 MMPF0100F2AEPR2 NXP USA Inc. MMPF0100.pdf Description: IC REG CONV I.MX6 12OUT 56HVQFN
Supplier Device Package: 56-HVQFN (8x8)
Applications: Converter, i.MX6
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Input: 2.8V ~ 4.5V
Number of Outputs: 12
Mounting Type: Surface Mount
Voltage - Output: Multiple
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MMPF0200NPAEPR2 MMPF0200NPAEPR2 NXP USA Inc. MMPF0200.pdf Description: IC REG CONV I.MX6 11OUT 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 11
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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MPC5125YVN400R MPC5125YVN400R NXP USA Inc. MPC5125PB.pdf Description: IC MCU 32BIT ROMLESS 324PBGA
DigiKey Programmable: Not Verified
Number of I/O: 64
Supplier Device Package: 324-PBGA (23x23)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, USB OTG
Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V
Core Size: 32-Bit Single-Core
Core Processor: e300
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 32K x 8
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 324-BBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S9S08AW16AE0VFTR S9S08AW16AE0VFTR NXP USA Inc. MC9S08AC16.pdf Description: IC MCU 8BIT 16KB FLASH 48QFN
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 38
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: LVD, POR, PWM, WDT
Produkt ist nicht verfügbar
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S9S08DZ60F2MLFR S9S08DZ60F2MLFR NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
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2000+11.23 EUR
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S9S08SG8E2CTJR S9S08SG8E2CTJR NXP USA Inc. MC9S08SG8.pdf Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
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2500+2.85 EUR
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S9S08SL8F1MTJR S9S08SL8F1MTJR NXP USA Inc. MC9S08EL32AD.pdf Description: IC MCU 8BIT 8KB FLASH 20TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 16
Supplier Device Package: 20-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S9S12G128F0CLLR S9S12G128F0CLLR NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 128KB FLASH 100LQFP
Produkt ist nicht verfügbar
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S9S12G128F0MLHR S9S12G128F0MLHR NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 128KB FLASH 64LQFP
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1500 Stücke
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S9S12G128F0VLFR S9S12G128F0VLFR NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 128KB FLASH 48LQFP
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 40
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2000 Stücke
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S9S12G96F0CLHR S9S12G96F0CLHR NXP USA Inc. MC9S12GRMV1.pdf Description: IC MCU 16BIT 96KB FLASH 64LQFP
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1500 Stücke
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PEMI2STD/CP,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2STD/CP,115
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 20 OHM/18.5PF SMD
Produkt ist nicht verfügbar
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PEMI2STD/LT,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2STD/LT,115
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 65 OHM/23PF SMD
Number of Channels: 2
ESD Protection: Yes
Resistance - Channel (Ohms): 65
Technology: RC (Pi)
Applications: Data Lines for Mobile Devices
Filter Order: 2nd
Height: 0.024" (0.60mm)
Values: R = 65Ohms, C = 23pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Package / Case: SOT-665
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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PEMI2STD/WK,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2STD/WK,115
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/13.5PF SMD
Height: 0.024" (0.60mm)
Values: R = 200Ohms, C = 13.5pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Package / Case: SOT-665
Packaging: Cut Tape (CT)
Number of Channels: 2
ESD Protection: Yes
Resistance - Channel (Ohms): 200
Technology: RC (Pi)
Applications: Data Lines for Mobile Devices
Filter Order: 2nd
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PEMI2STD/WM,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2STD/WM,115
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/16PF SMD
Number of Channels: 2
Part Status: Obsolete
ESD Protection: Yes
Resistance - Channel (Ohms): 200
Technology: RC (Pi)
Applications: Data Lines for Mobile Devices
Filter Order: 2nd
Height: 0.024" (0.60mm)
Values: R = 200Ohms, C = 16pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Package / Case: SOT-665
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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PEMI4QFN/HR,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI4QFN/HR,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 45 OHM/21PF SMD
Produkt ist nicht verfügbar
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PEMI4QFN/WG,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI4QFN/WG,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/11PF SMD
Number of Channels: 4
Part Status: Obsolete
ESD Protection: Yes
Resistance - Channel (Ohms): 200
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 21dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 200Ohms, C = 11pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Package / Case: 8-XFDFN
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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PEMI8QFN/WP,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI8QFN/WP,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/18.5PF SMD
Number of Channels: 8
ESD Protection: Yes
Resistance - Channel (Ohms): 200
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 30dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 200Ohms, C = 18.5pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Package / Case: 16-XFDFN Exposed Pad
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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PMF63UN,115 PMF63UN.pdf
PMF63UN,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 20V 1.8A SOT323-3
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Packaging: Cut Tape (CT)
Input Capacitance (Ciss) (Max) @ Vds: 185 pF @ 10 V
Gate Charge (Qg) (Max) @ Vgs: 3.3 nC @ 4.5 V
Drain to Source Voltage (Vdss): 20 V
Vgs (Max): ±8V
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Supplier Device Package: SC-70
Vgs(th) (Max) @ Id: 1V @ 250µA
Power Dissipation (Max): 275mW (Ta), 1.785W (Tc)
Rds On (Max) @ Id, Vgs: 74mOhm @ 1.8A, 4.5V
Current - Continuous Drain (Id) @ 25°C: 1.8A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Produkt ist nicht verfügbar
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PMG45UN,115 PMG45UN_Rev_Nov_2012.pdf
PMG45UN,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 20V 3A SOT363
Produkt ist nicht verfügbar
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PMV90EN,215 PMV90EN.pdf
PMV90EN,215
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 1.9A TO236AB
Packaging: Cut Tape (CT)
Input Capacitance (Ciss) (Max) @ Vds: 132 pF @ 15 V
Gate Charge (Qg) (Max) @ Vgs: 4 nC @ 10 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Supplier Device Package: SOT-23 (TO-236AB)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Power Dissipation (Max): 310mW (Ta), 2.09W (Tc)
Rds On (Max) @ Id, Vgs: 84mOhm @ 1.9A, 10V
Current - Continuous Drain (Id) @ 25°C: 1.9A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Produkt ist nicht verfügbar
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MKL16Z256VMP4 KL16P64M48SF4.pdf
MKL16Z256VMP4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, TSI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D - 16bit; D/A - 12bit
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 64-MAPBGA (5x5)
auf Bestellung 640 Stücke:
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AnzahlPreis
2+10.4 EUR
10+6.37 EUR
25+6.26 EUR
100+6.11 EUR
250+6.1 EUR
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MKL26Z256VMP4 KL26P121M48SF4.pdf
MKL26Z256VMP4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D - 16bit; D/A - 12bit
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
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AnzahlPreis
2+12.37 EUR
10+9.57 EUR
25+8.87 EUR
100+8.1 EUR
250+7.74 EUR
640+7.45 EUR
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NXPMOSFET-DESIGNKIT
NXPMOSFET-DESIGNKIT
Hersteller: NXP USA Inc.
Description: KIT DESIGN MOSFET LFPAK
Packaging: Box
Mounting Type: Surface Mount
Quantity: 180 Pieces (18 Values - 10 Each)
Kit Type: MOSFETs
Part Status: Obsolete
Produkt ist nicht verfügbar
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OM13054UL OM13054_Web.pdf
OM13054UL
Hersteller: NXP USA Inc.
Description: BOARD EVAL LPC-LINK2
Packaging: Box
Type: Debugger
Contents: Board(s), Cable(s)
Produkt ist nicht verfügbar
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NT2H1611F0DTLH NTAG213F_216F.pdf
NT2H1611F0DTLH
Hersteller: NXP USA Inc.
Description: NFC TYPE2 TAG IC 144/888 BYTES
Packaging: Tube
Package / Case: 4-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Standards: ISO 14443, NFC
Supplier Device Package: 4-HXSON (2x1.5)
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AnzahlPreis
10+1.81 EUR
12+1.56 EUR
25+1.47 EUR
100+1.35 EUR
250+1.28 EUR
500+1.23 EUR
1000+1.18 EUR
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AFT09H310-03SR6
AFT09H310-03SR6
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI1230
Current - Test: 680 mA
Voltage - Test: 28 V
Voltage - Rated: 70 V
Supplier Device Package: NI-1230S
Technology: LDMOS
Gain: 17.9dB
Power - Output: 56W
Frequency: 920MHz
Mounting Type: Chassis Mount
Package / Case: NI-1230S
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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AFT09H310-04GSR6
Hersteller: NXP USA Inc.
Description: RF MOSFET 28V NI1230
Technology: MOSFET (Metal Oxide)
Gain: 17.9dB
Power - Output: 56W
Configuration: N-Channel
Frequency: 920MHz
Mounting Type: Chassis Mount
Package / Case: NI-1230S-4 GW
Packaging: Tape & Reel (TR)
Current - Test: 680 mA
Voltage - Test: 28 V
Voltage - Rated: 70 V
Supplier Device Package: NI-1230S-4 GULL
Produkt ist nicht verfügbar
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AFT09MP055GNR1 AFT09MP055N.pdf
AFT09MP055GNR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 12.5V TO270-4
Current - Test: 550 mA
Voltage - Test: 12.5 V
Voltage - Rated: 40 V
Part Status: Active
Supplier Device Package: TO-270 WB-4 Gull
Technology: LDMOS
Gain: 15.7dB
Power - Output: 1W
Frequency: 870MHz
Mounting Type: Surface Mount
Package / Case: TO-270BB
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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AFT09MP055NR1 AFT09MP055N.pdf
AFT09MP055NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 12.5V TO270-4
Current - Test: 550 mA
Voltage - Test: 12.5 V
Voltage - Rated: 40 V
Supplier Device Package: TO-270 WB-4
Technology: LDMOS
Gain: 15.7dB
Power - Output: 1W
Frequency: 870MHz
Mounting Type: Surface Mount
Package / Case: TO-270AB
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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AFT09MS007NT1 AFT09MS007N.pdf
AFT09MS007NT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 7.5V PLD-1.5W
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 7.3W
Gain: 15.2dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 7.5 V
Current - Test: 100 mA
auf Bestellung 5000 Stücke:
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AnzahlPreis
1000+11.92 EUR
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AFT18H356-24SR6
AFT18H356-24SR6
Hersteller: NXP USA Inc.
Description: FET RF 2CH 65V 1.88GHZ NI1230-4
Current - Test: 1.1 A
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: NI-1230-4LS2L
Gain: 15dB
Power - Output: 63W
Frequency: 1.88GHz
Mounting Type: Chassis Mount
Package / Case: NI-1230-4LS2L
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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AFT26H160-4S4R3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI880X-4
Current - Test: 500 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-880X-4L4S-8
Technology: LDMOS
Gain: 14.9dB
Power - Output: 32W
Frequency: 2.5GHz
Mounting Type: Chassis Mount
Package / Case: NI-880X-4L4S-8
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC10XS3412JHFKR2
MC10XS3412JHFKR2
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 24PQFN
Part Status: Obsolete
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Supplier Device Package: 24-PQFN (12x12)
Ratio - Input:Output: 1:1
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 6V ~ 20V
Rds On (Typ): 10mOhm, 12mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 150°C (TJ)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 4
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 24-PowerQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC34903CP5EKR2 MC34903,4,5.pdf
MC34903CP5EKR2
Hersteller: NXP USA Inc.
Description: IC SBC HIGH SPEED CAN 5V 32SOIC
Produkt ist nicht verfügbar
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MC34903CS3EKR2 MC34903,4,5.pdf
MC34903CS3EKR2
Hersteller: NXP USA Inc.
Description: IC SBC HIGH SPD CAN 3.3V 32SOIC
Produkt ist nicht verfügbar
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MC34903CS5EKR2 MC34903,4,5.pdf
MC34903CS5EKR2
Hersteller: NXP USA Inc.
Description: IC SBC HIGH SPEED CAN 5V 32SOIC
Produkt ist nicht verfügbar
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MC34904C5EKR2 MC34903,4,5.pdf
MC34904C5EKR2
Hersteller: NXP USA Inc.
Description: IC SBC HIGH SPEED CAN 5V 32SOIC
Produkt ist nicht verfügbar
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MC34905CS3EKR2 MC34903%2C4%2C5.pdf
MC34905CS3EKR2
Hersteller: NXP USA Inc.
Description: IC SBC HIGH SPD CAN 3.3V 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 2mA
Supplier Device Package: 32-SOIC-EP
Produkt ist nicht verfügbar
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MC34905CS5EKR2 MC34903%2C4%2C5.pdf
MC34905CS5EKR2
Hersteller: NXP USA Inc.
Description: IC SBC HIGH SPEED CAN 5V 32SOIC
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tape & Reel (TR)
Supplier Device Package: 32-SOIC-EP
Current - Supply: 2mA
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Operating Temperature: -40°C ~ 125°C
Produkt ist nicht verfügbar
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MC56F8025VLDR MC56F8023.pdf
MC56F8025VLDR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 44LQFP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 16
Program Memory Size: 32KB (16K x 16)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 35
Supplier Device Package: 44-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 8x12b; D/A 2x12b
Core Processor: 56800E
Produkt ist nicht verfügbar
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MCIMX6D4AVT10ADR IMX6DQIEC.pdf
MCIMX6D4AVT10ADR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 1.0GHZ 624FCBGA
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tape & Reel (TR)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Produkt ist nicht verfügbar
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MCIMX6D5EYM10ADR IMX6DQCEC.pdf
MCIMX6D5EYM10ADR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 1.0GHZ 624FCBGA
Produkt ist nicht verfügbar
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MCIMX6D6AVT08ADR IMX6DQAEC.pdf
MCIMX6D6AVT08ADR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 852MHZ 624FCBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 852MHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCIMX6D6AVT10ADR IMX6DQAEC.pdf
MCIMX6D6AVT10ADR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 1.0GHZ 624FCBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
500+103.28 EUR
Mindestbestellmenge: 500 Stücke
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MCIMX6Q4AVT08ADR IMX6DQAEC.pdf
MCIMX6Q4AVT08ADR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6Q 852MHZ 624FCBGA
Part Status: Active
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 4 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 852MHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCIMX6Q5EYM10ADR IMX6DQAEC.pdf
MCIMX6Q5EYM10ADR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6Q 1.0GHZ 624FCPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
500+89.32 EUR
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MCIMX6Q6AVT08ADR IMX6DQAEC.pdf
MCIMX6Q6AVT08ADR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6Q 852MHZ 624FCBGA
Produkt ist nicht verfügbar
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MCIMX6S1AVM08ACR IMX6SDLCEC.pdf
MCIMX6S1AVM08ACR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX6S4AVM08ACR IMX6SDLAEC.pdf
MCIMX6S4AVM08ACR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX6S5DVM10ACR IMX6SDLAEC.pdf
MCIMX6S5DVM10ACR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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MCIMX6S5EVM10ACR IMX6SDLAEC.pdf
MCIMX6S5EVM10ACR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tape & Reel (TR)
Part Status: Active
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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500+39.69 EUR
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MCIMX6S6AVM08ACR IMX6SDLAEC.pdf
MCIMX6S6AVM08ACR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Produkt ist nicht verfügbar
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MCIMX6U5EVM10ACR IMX6SDLCEC.pdf
MCIMX6U5EVM10ACR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Package / Case: 624-LFBGA
Packaging: Tape & Reel (TR)
Part Status: Active
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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500+52.87 EUR
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MCIMX6U6AVM08ACR IMX6SDLAEC.pdf
MCIMX6U6AVM08ACR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DL 800MHZ 624MAPBGA
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tape & Reel (TR)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 800MHz
Produkt ist nicht verfügbar
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MK20DX256VLK7R K20P81M72SF1.pdf
MK20DX256VLK7R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80FQFP
DigiKey Programmable: Not Verified
Number of I/O: 52
Supplier Device Package: 80-FQFP (12x12)
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 29x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MK60DN256VLL10R K60P100M100SF2V2.pdf
MK60DN256VLL10R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 66
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 33x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MKL15Z64VFM4R KL15P80M48SF0.pdf
MKL15Z64VFM4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 9x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, TSI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MMPF0100F0AEPR2 MMPF0100.pdf
MMPF0100F0AEPR2
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
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AnzahlPreis
4000+8.37 EUR
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MMPF0100F1AEPR2 MMPF0100.pdf
MMPF0100F1AEPR2
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
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AnzahlPreis
4000+8.59 EUR
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MMPF0100F2AEPR2 MMPF0100.pdf
MMPF0100F2AEPR2
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56HVQFN
Supplier Device Package: 56-HVQFN (8x8)
Applications: Converter, i.MX6
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Input: 2.8V ~ 4.5V
Number of Outputs: 12
Mounting Type: Surface Mount
Voltage - Output: Multiple
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MMPF0200NPAEPR2 MMPF0200.pdf
MMPF0200NPAEPR2
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 11OUT 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 11
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
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MPC5125YVN400R MPC5125PB.pdf
MPC5125YVN400R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 324PBGA
DigiKey Programmable: Not Verified
Number of I/O: 64
Supplier Device Package: 324-PBGA (23x23)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, USB OTG
Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V
Core Size: 32-Bit Single-Core
Core Processor: e300
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 32K x 8
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 324-BBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S9S08AW16AE0VFTR MC9S08AC16.pdf
S9S08AW16AE0VFTR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48QFN
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 38
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: LVD, POR, PWM, WDT
Produkt ist nicht verfügbar
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S9S08DZ60F2MLFR MC9S08AC60.pdf
S9S08DZ60F2MLFR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
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AnzahlPreis
2000+11.23 EUR
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S9S08SG8E2CTJR MC9S08SG8.pdf
S9S08SG8E2CTJR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2500+2.85 EUR
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S9S08SL8F1MTJR MC9S08EL32AD.pdf
S9S08SL8F1MTJR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 16
Supplier Device Package: 20-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S9S12G128F0CLLR MC9S12GRMV1.pdf
S9S12G128F0CLLR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 100LQFP
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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S9S12G128F0MLHR MC9S12GRMV1.pdf
S9S12G128F0MLHR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
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S9S12G128F0VLFR MC9S12GRMV1.pdf
S9S12G128F0VLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 40
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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S9S12G96F0CLHR MC9S12GRMV1.pdf
S9S12G96F0CLHR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 64LQFP
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
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