Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35546) > Seite 231 nach 593
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S9S08DN48F2MLF | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 48KB (48K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1.5K x 8 Core Processor: S08 Data Converters: A/D 16x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 39 |
Produkt ist nicht verfügbar |
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S9S08DV16F2MLC | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 10x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 25 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S08DV32F2MLH | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 53 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S08DZ32F2MLC | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S08 Data Converters: A/D 10x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 25 |
Produkt ist nicht verfügbar |
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S9S08DZ32F2MLF | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S08 Data Converters: A/D 16x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 39 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S08DZ32F2MLH | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S08 Data Converters: A/D 24x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 53 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S08DZ48F2CLH | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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S9S08DZ48F2MLF | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 48KB (48K x 8) RAM Size: 3K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 1.5K x 8 Core Processor: S08 Data Converters: A/D 16x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 39 DigiKey Programmable: Not Verified |
auf Bestellung 1250 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S08DZ60F2CLC | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 60KB (60K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S08 Data Converters: A/D 10x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 25 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S08DZ60F2CLH | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 60KB (60K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S08 Data Converters: A/D 24x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 53 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S08DZ60F2MLC | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 60KB (60K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S08 Data Converters: A/D 10x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 25 DigiKey Programmable: Not Verified |
auf Bestellung 1379 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S08SG16E1CTGR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 16-TSSOP Number of I/O: 12 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S08SG32E1CTJR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 12x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 20-TSSOP Part Status: Active Number of I/O: 16 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S08SG4E2MTGR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 4KB (4K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 16-TSSOP Part Status: Active Number of I/O: 12 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S9S08SG8E2VTG | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 8KB (8K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 16-TSSOP Part Status: Active Number of I/O: 12 DigiKey Programmable: Not Verified |
auf Bestellung 96 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S08SG8E2VTGR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 8KB (8K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 16-TSSOP Number of I/O: 12 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S12B128F0MFUE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 128KB (128K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: HCS12 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, I²C, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Part Status: Obsolete Number of I/O: 59 |
Produkt ist nicht verfügbar |
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S9S12DG12F1CFUE | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 80QFP Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12 Data Converters: A/D 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V Connectivity: CANbus, I2C, SCI, SPI Peripherals: PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S12G64F0CLFR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: 12V1 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 40 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S12G64F0CLH | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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S9S12GN32F1VLC | NXP USA Inc. |
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auf Bestellung 1250 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S9S12GN48F0CLF | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1.5K x 8 Core Processor: 12V1 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 40 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S12GN48F0CLFR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1.5K x 8 Core Processor: 12V1 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 40 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S12P64J0CLH | NXP USA Inc. |
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auf Bestellung 800 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S9S12VR48F2CLCR | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 32LQFP Packaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: 12V1 Data Converters: A/D 2x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 16 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SPC5121YVY400B | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 516-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 400MHz RAM Size: 128K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: e300 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, USB OTG Peripherals: DMA, WDT Supplier Device Package: 516-TEPBGA (27x27) Number of I/O: 147 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SPC5516EAVMG80 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 208-BGA Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 1MB (1M x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z0, e200z1 Data Converters: A/D 40x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 208-BGA (17x17) Part Status: Active Number of I/O: 144 DigiKey Programmable: Not Verified |
auf Bestellung 349 Stücke: Lieferzeit 10-14 Tag (e) |
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SPC561MVR56D | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 388-BBGA Mounting Type: Surface Mount Speed: 56MHz RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: PowerPC Data Converters: A/D 32x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 388-PBGA (27x27) Part Status: Not For New Designs Number of I/O: 64 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SPC5632MF2MLQ60 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 768KB (768K x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 150°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z3 Data Converters: A/D 32x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Obsolete Number of I/O: 80 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SPC5644BF0VLT1 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4d Data Converters: A/D 33x10b, 10x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 208-TQFP (28x28) Number of I/O: 177 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SPC5644BF0VLU1 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4d Data Converters: A/D 27x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 176-LQFP (24x24) Part Status: Active Number of I/O: 147 DigiKey Programmable: Not Verified |
auf Bestellung 200 Stücke: Lieferzeit 10-14 Tag (e) |
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SPC5644CF0VLU1 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 80MHz/120MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 192K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4d, e200z0h Data Converters: A/D 27x10b, 5x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 176-LQFP (24x24) Part Status: Active Number of I/O: 147 DigiKey Programmable: Not Verified |
auf Bestellung 200 Stücke: Lieferzeit 10-14 Tag (e) |
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SPC5645CF0MLU1 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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SPC5645SF1VLT | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 125MHz Program Memory Size: 2MB (2M x 8) RAM Size: 1.064M x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z4d Data Converters: A/D 20x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 208-TQFP (28x28) Part Status: Active Number of I/O: 150 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SPC5645SF1VLU | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 125MHz Program Memory Size: 2MB (2M x 8) RAM Size: 1.064M x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z4d Data Converters: A/D 16x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 128 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SPC5645SF1VVU | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 416-BBGA Mounting Type: Surface Mount Speed: 125MHz Program Memory Size: 2MB (2M x 8) RAM Size: 1.064M x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z4d Data Converters: A/D 20x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 416-PBGA (27x27) Number of I/O: 177 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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SPC5645SF1VVUR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 416-BBGA Mounting Type: Surface Mount Speed: 125MHz Program Memory Size: 2MB (2M x 8) RAM Size: 1.064M x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z4d Data Converters: A/D 20x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 416-PBGA (27x27) Number of I/O: 177 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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SPC5646CCF0MLT1 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 80MHz/120MHz Program Memory Size: 3MB (3M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4d, e200z0h Data Converters: A/D 33x10b, 10x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 208-TQFP (28x28) Number of I/O: 177 DigiKey Programmable: Not Verified |
auf Bestellung 180 Stücke: Lieferzeit 10-14 Tag (e) |
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SPC5646CCF0MLU1 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 80MHz/120MHz Program Memory Size: 3MB (3M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4d, e200z0h Data Converters: A/D 27x10b, 5x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 176-LQFP (24x24) Part Status: Active Number of I/O: 147 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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SPC5646CCF0MMJ1 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz/120MHz Program Memory Size: 3MB (3M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4d, e200z0h Data Converters: A/D 33x10b, 10x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 256-MAPBGA (17x17) Number of I/O: 199 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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SPC5673FF3MVY2 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 3MB (3M x 8) RAM Size: 192K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z7 Data Converters: A/D 64x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM Supplier Device Package: 516-PBGA (27x27) Part Status: Active Number of I/O: 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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SVF311R3K1CKU2 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A5 Voltage - I/O: 3.3V Supplier Device Package: 176-HLQFP (24x24) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: No Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART Part Status: Active |
auf Bestellung 40 Stücke: Lieferzeit 10-14 Tag (e) |
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SVF512R3K1CMK4 | NXP USA Inc. |
Description: IC MPU VYBRID 400MHZ 364LFBGA Packaging: Tray Package / Case: 364-LFBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A5 Voltage - I/O: 3.3V Supplier Device Package: 364-LFBGA (17x17) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: Yes Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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SVF521R3K1CMK4 | NXP USA Inc. |
Description: IC MPU VYBRID 133MHZ 364LFBGA Packaging: Tray Package / Case: 364-LFBGA Mounting Type: Surface Mount Speed: 400MHz, 133MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A5 + Cortex®-M4 Voltage - I/O: 3.3V Supplier Device Package: 364-LFBGA (17x17) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: No Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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SVF522R2K1CMK4 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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SVF522R3K1CMK4 | NXP USA Inc. |
Description: IC MPU VYBRID 133MHZ 364LFBGA Packaging: Tray Package / Case: 364-LFBGA Mounting Type: Surface Mount Speed: 400MHz, 133MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A5 + Cortex®-M4 Voltage - I/O: 3.3V Supplier Device Package: 364-LFBGA (17x17) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: Yes Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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SVF532R3K1CMK4 | NXP USA Inc. |
Description: IC MPU VYBRID 133MHZ 364LFBGA Packaging: Tray Package / Case: 364-LFBGA Mounting Type: Surface Mount Speed: 400MHz, 133MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A5 + Cortex®-M4 Voltage - I/O: 3.3V Supplier Device Package: 364-LFBGA (17x17) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: Yes Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
TRACELINK | NXP USA Inc. |
Description: DEBUG & TRACE MCU 32BIT Packaging: Bulk For Use With/Related Products: Coldfire®, Kinetis® Type: Debugger Contents: Board(s) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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MM912F634DV1AE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Interface: LIN, SCI RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.25V ~ 5.5V Controller Series: HCS12 Program Memory Type: FLASH (32kB) Applications: Automotive Core Processor: S12 Supplier Device Package: 48-HLQFP (7x7) Part Status: Active Number of I/O: 9 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MM912F634DV1AER2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Interface: LIN, SCI RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.25V ~ 5.5V Controller Series: HCS12 Program Memory Type: FLASH (32kB) Applications: Automotive Core Processor: S12 Supplier Device Package: 48-HLQFP (7x7) Part Status: Active Number of I/O: 9 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MM912F634DV2AE | NXP USA Inc. |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MM912F634DV2AP | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Interface: LIN, SCI RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.25V ~ 5.5V Controller Series: HCS12 Program Memory Type: FLASH (32kB) Core Processor: S12 Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 9 DigiKey Programmable: Not Verified Grade: Automotive |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MM912F634DV2APR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Interface: LIN, SCI RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.25V ~ 5.5V Controller Series: HCS12 Program Memory Type: FLASH (32kB) Core Processor: S12 Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 9 DigiKey Programmable: Not Verified Grade: Automotive |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MM912G634DC1AE | NXP USA Inc. |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MM912G634DC1AER2 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MM912G634DC2AP | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Interface: LIN, SCI RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.25V ~ 5.5V Controller Series: HCS12 Program Memory Type: FLASH (48kB) Applications: Automotive Core Processor: S12 Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 9 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MM912G634DM1AE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Interface: LIN, SCI RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.25V ~ 5.5V Controller Series: HCS12 Program Memory Type: FLASH (48kB) Core Processor: S12 Supplier Device Package: 48-HLQFP (7x7) Part Status: Active Number of I/O: 9 DigiKey Programmable: Not Verified Grade: Automotive |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MM912G634DM1AER2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Interface: LIN, SCI RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.25V ~ 5.5V Controller Series: HCS12 Program Memory Type: FLASH (48kB) Core Processor: S12 Supplier Device Package: 48-HLQFP (7x7) Part Status: Active Number of I/O: 9 DigiKey Programmable: Not Verified Grade: Automotive |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MM912G634DV1AER2 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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MM912G634DV2AP | NXP USA Inc. |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
S9S08DN48F2MLF |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
Description: IC MCU 8BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
S9S08DV16F2MLC |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
S9S08DV32F2MLH |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
S9S08DZ32F2MLC |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 25
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 25
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
S9S08DZ32F2MLF |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
S9S08DZ32F2MLH |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
S9S08DZ48F2CLH |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 64LQFP
Description: IC MCU 8BIT 48KB FLASH 64LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
S9S08DZ48F2MLF |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 3K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 3K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 12.27 EUR |
10+ | 9.69 EUR |
S9S08DZ60F2CLC |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
S9S08DZ60F2CLH |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
S9S08DZ60F2MLC |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
auf Bestellung 1379 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 17.79 EUR |
10+ | 13.93 EUR |
25+ | 12.96 EUR |
80+ | 12.04 EUR |
230+ | 11.43 EUR |
440+ | 11.13 EUR |
1250+ | 10.76 EUR |
S9S08SG16E1CTGR |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 12
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 12
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
S9S08SG32E1CTJR |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
S9S08SG4E2MTGR |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
S9S08SG8E2VTG |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
auf Bestellung 96 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
4+ | 5.09 EUR |
10+ | 3.80 EUR |
96+ | 3.14 EUR |
S9S08SG8E2VTGR |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 12
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 12
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
S9S12B128F0MFUE |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Obsolete
Number of I/O: 59
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Obsolete
Number of I/O: 59
Produkt ist nicht verfügbar
Im Einkaufswagen
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S9S12DG12F1CFUE |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
S9S12G64F0CLFR |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
S9S12G64F0CLH |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
S9S12GN32F1VLC |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 32LQFP
Description: IC MCU 16BIT 32KB FLASH 32LQFP
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)Im Einkaufswagen Stück im Wert von UAH
S9S12GN48F0CLF |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
S9S12GN48F0CLFR |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
S9S12P64J0CLH |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Description: IC MCU 16BIT 64KB FLASH 64LQFP
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)Im Einkaufswagen Stück im Wert von UAH
S9S12VR48F2CLCR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SPC5121YVY400B |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: e300
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 516-TEPBGA (27x27)
Number of I/O: 147
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: e300
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 516-TEPBGA (27x27)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SPC5516EAVMG80 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0, e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Part Status: Active
Number of I/O: 144
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z0, e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Part Status: Active
Number of I/O: 144
DigiKey Programmable: Not Verified
auf Bestellung 349 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 50.97 EUR |
10+ | 46.02 EUR |
SPC561MVR56D |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Bulk
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Part Status: Not For New Designs
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Bulk
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Part Status: Not For New Designs
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SPC5632MF2MLQ60 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z3
Data Converters: A/D 32x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 80
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z3
Data Converters: A/D 32x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 80
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SPC5644BF0VLT1 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 208TQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-TQFP (28x28)
Number of I/O: 177
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5MB FLASH 208TQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-TQFP (28x28)
Number of I/O: 177
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SPC5644BF0VLU1 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 147
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 147
DigiKey Programmable: Not Verified
auf Bestellung 200 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 46.41 EUR |
10+ | 41.39 EUR |
SPC5644CF0VLU1 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 147
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 147
DigiKey Programmable: Not Verified
auf Bestellung 200 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 70.14 EUR |
10+ | 53.62 EUR |
25+ | 49.39 EUR |
80+ | 45.32 EUR |
SPC5645CF0MLU1 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SPC5645SF1VLT |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 208TQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1.064M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4d
Data Converters: A/D 20x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-TQFP (28x28)
Part Status: Active
Number of I/O: 150
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 208TQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1.064M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4d
Data Converters: A/D 20x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-TQFP (28x28)
Part Status: Active
Number of I/O: 150
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SPC5645SF1VLU |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Packaging: Bulk
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1.064M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4d
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 128
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Packaging: Bulk
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1.064M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4d
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SPC5645SF1VVU |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 416PBGA
Packaging: Bulk
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1.064M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4d
Data Converters: A/D 20x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 177
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 416PBGA
Packaging: Bulk
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1.064M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4d
Data Converters: A/D 20x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 177
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SPC5645SF1VVUR |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 416PBGA
Packaging: Tape & Reel (TR)
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1.064M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4d
Data Converters: A/D 20x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 177
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 416PBGA
Packaging: Tape & Reel (TR)
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1.064M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4d
Data Converters: A/D 20x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 177
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SPC5646CCF0MLT1 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 208TQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-TQFP (28x28)
Number of I/O: 177
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 3MB FLASH 208TQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-TQFP (28x28)
Number of I/O: 177
DigiKey Programmable: Not Verified
auf Bestellung 180 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 71.32 EUR |
10+ | 66.13 EUR |
SPC5646CCF0MLU1 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Packaging: Bulk
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 147
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Packaging: Bulk
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SPC5646CCF0MMJ1 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 256MAPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 199
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 3MB FLASH 256MAPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 199
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SPC5673FF3MVY2 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 516FPBGA
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 516-PBGA (27x27)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 3MB FLASH 516FPBGA
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 516-PBGA (27x27)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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SVF311R3K1CKU2 |
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Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 266MHZ 176HLQFP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: No
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Part Status: Active
Description: IC MPU VYBRID 266MHZ 176HLQFP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: No
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Part Status: Active
auf Bestellung 40 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 57.29 EUR |
10+ | 46.50 EUR |
40+ | 42.67 EUR |
SVF512R3K1CMK4 |
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 400MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Description: IC MPU VYBRID 400MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Produkt ist nicht verfügbar
Im Einkaufswagen
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SVF521R3K1CMK4 |
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 133MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: No
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Part Status: Active
Description: IC MPU VYBRID 133MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: No
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
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SVF522R2K1CMK4 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 364MAPBGA
Description: IC MCU 32BIT ROMLESS 364MAPBGA
Produkt ist nicht verfügbar
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SVF522R3K1CMK4 |
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 133MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Description: IC MPU VYBRID 133MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Produkt ist nicht verfügbar
Im Einkaufswagen
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SVF532R3K1CMK4 |
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 133MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Description: IC MPU VYBRID 133MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Produkt ist nicht verfügbar
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TRACELINK |
Hersteller: NXP USA Inc.
Description: DEBUG & TRACE MCU 32BIT
Packaging: Bulk
For Use With/Related Products: Coldfire®, Kinetis®
Type: Debugger
Contents: Board(s)
Description: DEBUG & TRACE MCU 32BIT
Packaging: Bulk
For Use With/Related Products: Coldfire®, Kinetis®
Type: Debugger
Contents: Board(s)
Produkt ist nicht verfügbar
Im Einkaufswagen
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MM912F634DV1AE |
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Hersteller: NXP USA Inc.
Description: IC MCU DUAL LS/HS SWITCH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (32kB)
Applications: Automotive
Core Processor: S12
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Description: IC MCU DUAL LS/HS SWITCH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (32kB)
Applications: Automotive
Core Processor: S12
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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MM912F634DV1AER2 |
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Hersteller: NXP USA Inc.
Description: IC MCU DUAL LS/HS SWITCH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (32kB)
Applications: Automotive
Core Processor: S12
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Description: IC MCU DUAL LS/HS SWITCH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (32kB)
Applications: Automotive
Core Processor: S12
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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MM912F634DV2AE |
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Hersteller: NXP USA Inc.
Description: IC MCU DUAL LS/HS SWITCH 48LQFP
Description: IC MCU DUAL LS/HS SWITCH 48LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
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MM912F634DV2AP |
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Hersteller: NXP USA Inc.
Description: IC MCU DUAL LS/HS SWITCH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (32kB)
Core Processor: S12
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Grade: Automotive
Description: IC MCU DUAL LS/HS SWITCH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (32kB)
Core Processor: S12
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Grade: Automotive
Produkt ist nicht verfügbar
Im Einkaufswagen
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MM912F634DV2APR2 |
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Hersteller: NXP USA Inc.
Description: IC MCU DUAL LS/HS SWITCH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (32kB)
Core Processor: S12
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Grade: Automotive
Description: IC MCU DUAL LS/HS SWITCH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (32kB)
Core Processor: S12
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Grade: Automotive
Produkt ist nicht verfügbar
Im Einkaufswagen
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MM912G634DC1AE |
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Hersteller: NXP USA Inc.
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
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MM912G634DC1AER2 |
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Hersteller: NXP USA Inc.
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MM912G634DC2AP |
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Hersteller: NXP USA Inc.
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (48kB)
Applications: Automotive
Core Processor: S12
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (48kB)
Applications: Automotive
Core Processor: S12
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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MM912G634DM1AE |
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Hersteller: NXP USA Inc.
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (48kB)
Core Processor: S12
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Grade: Automotive
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (48kB)
Core Processor: S12
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Grade: Automotive
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MM912G634DM1AER2 |
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Hersteller: NXP USA Inc.
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (48kB)
Core Processor: S12
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Grade: Automotive
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (48kB)
Core Processor: S12
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Grade: Automotive
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
MM912G634DV1AER2 |
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Hersteller: NXP USA Inc.
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
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MM912G634DV2AP |
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Hersteller: NXP USA Inc.
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
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