Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36403) > Seite 227 nach 607
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
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SPC5645CF0MLU1 | NXP USA Inc. |
 Description: IC MCU 32BIT 2MB FLASH 176LQFPPackaging: Tray Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 80MHz/120MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4d, e200z0h Data Converters: A/D 27x10b, 5x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 147 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 200 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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SPC5645SF1VLT | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 208TQFP DigiKey Programmable: Not Verified Number of I/O: 150 Part Status: Active Supplier Device Package: 208-TQFP (28x28) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 20x10b Core Processor: e200z4d Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 1.064M x 8 Program Memory Size: 2MB (2M x 8) Speed: 125MHz Mounting Type: Surface Mount Package / Case: 208-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 180 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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SPC5645SF1VLU | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 176LQFP Mounting Type: Surface Mount Package / Case: 176-LQFP Packaging: Bulk Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 1.064M x 8 Program Memory Size: 2MB (2M x 8) Speed: 125MHz DigiKey Programmable: Not Verified Number of I/O: 128 Supplier Device Package: 176-LQFP (24x24) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 16x10b Core Processor: e200z4d |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 200 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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SPC5645SF1VVU | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 416PBGA DigiKey Programmable: Not Verified Number of I/O: 177 Supplier Device Package: 416-PBGA (27x27) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 20x10b Core Processor: e200z4d Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 1.064M x 8 Program Memory Size: 2MB (2M x 8) Speed: 125MHz Mounting Type: Surface Mount Package / Case: 416-BBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 200 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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SPC5645SF1VVUR | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 416PBGA DigiKey Programmable: Not Verified Number of I/O: 177 Supplier Device Package: 416-PBGA (27x27) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 20x10b Core Processor: e200z4d Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 1.064M x 8 Program Memory Size: 2MB (2M x 8) Speed: 125MHz Mounting Type: Surface Mount Package / Case: 416-BBGA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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SPC5646CCF0MLT1 | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLASH 208TQFP Packaging: Tray Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 80MHz/120MHz Program Memory Size: 3MB (3M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4d, e200z0h Data Converters: A/D 33x10b, 10x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 208-TQFP (28x28) Number of I/O: 177 DigiKey Programmable: Not Verified |
auf Bestellung 180 Stücke: Lieferzeit 10-14 Tag (e) |
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SPC5646CCF0MLU1 | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 80MHz/120MHz Program Memory Size: 3MB (3M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4d, e200z0h Data Converters: A/D 27x10b, 5x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 176-LQFP (24x24) Part Status: Active Number of I/O: 147 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 200 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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SPC5646CCF0MMJ1 | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLASH 256MAPBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz/120MHz Program Memory Size: 3MB (3M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4d, e200z0h Data Converters: A/D 33x10b, 10x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 256-MAPBGA (17x17) Number of I/O: 199 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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SPC5673FF3MVY2 | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLASH 516FPBGA Packaging: Tray Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 3MB (3M x 8) RAM Size: 192K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z7 Data Converters: A/D 64x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM Supplier Device Package: 516-PBGA (27x27) Part Status: Active Number of I/O: 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 40 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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SVF311R3K1CKU2 | NXP USA Inc. |
Description: IC MPU VYBRID 266MHZ 176HLQFP Packaging: Tray Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A5 Voltage - I/O: 3.3V Supplier Device Package: 176-HLQFP (24x24) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: No Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART Part Status: Active |
auf Bestellung 40 Stücke: Lieferzeit 10-14 Tag (e) |
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SVF322R3K1CKU2 | NXP USA Inc. |
Description: IC MPU VYBRID 133MHZ 176HLQFP Number of Cores/Bus Width: 2 Core, 32-Bit USB: USB 2.0 OTG + PHY (1) Ethernet: 10/100Mbps (2) Supplier Device Package: 176-HLQFP (24x24) Voltage - I/O: 3.3V Core Processor: ARM® Cortex®-A5 + Cortex®-M4 Operating Temperature: -40°C ~ 85°C (TA) Speed: 266MHz, 133MHz Mounting Type: Surface Mount Package / Case: 176-LQFP Exposed Pad Packaging: Tray Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Graphics Acceleration: Yes RAM Controllers: LPDDR2, DDR3, DRAM Co-Processors/DSP: Multimedia; NEON™ MPE |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 40 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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SVF512R3K1CMK4 | NXP USA Inc. |
Description: IC MPU VYBRID 400MHZ 364LFBGA Speed: 400MHz Mounting Type: Surface Mount Package / Case: 364-LFBGA Packaging: Tray Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Graphics Acceleration: Yes RAM Controllers: LPDDR2, DDR3, DRAM Co-Processors/DSP: Multimedia; NEON™ MPE Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 OTG + PHY (1) Ethernet: 10/100Mbps (2) Supplier Device Package: 364-LFBGA (17x17) Voltage - I/O: 3.3V Core Processor: ARM® Cortex®-A5 Operating Temperature: -40°C ~ 85°C (TA) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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SVF521R3K1CMK4 | NXP USA Inc. |
Description: IC MPU VYBRID 133MHZ 364LFBGA Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART Part Status: Active Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Graphics Acceleration: No RAM Controllers: LPDDR2, DDR3, DRAM Co-Processors/DSP: Multimedia; NEON™ MPE Number of Cores/Bus Width: 2 Core, 32-Bit USB: USB 2.0 OTG + PHY (1) Ethernet: 10/100Mbps (2) Supplier Device Package: 364-LFBGA (17x17) Voltage - I/O: 3.3V Core Processor: ARM® Cortex®-A5 + Cortex®-M4 Operating Temperature: -40°C ~ 85°C (TA) Speed: 400MHz, 133MHz Mounting Type: Surface Mount Package / Case: 364-LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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SVF522R2K1CMK4 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 364MAPBGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 90 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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SVF522R3K1CMK4 | NXP USA Inc. |
Description: IC MPU VYBRID 133MHZ 364LFBGA Packaging: Tray Package / Case: 364-LFBGA Mounting Type: Surface Mount Speed: 400MHz, 133MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A5 + Cortex®-M4 Voltage - I/O: 3.3V Supplier Device Package: 364-LFBGA (17x17) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: Yes Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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SVF532R3K1CMK4 | NXP USA Inc. |
Description: IC MPU VYBRID 133MHZ 364LFBGA Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Graphics Acceleration: Yes RAM Controllers: LPDDR2, DDR3, DRAM Co-Processors/DSP: Multimedia; NEON™ MPE Number of Cores/Bus Width: 2 Core, 32-Bit USB: USB 2.0 OTG + PHY (1) Ethernet: 10/100Mbps (2) Supplier Device Package: 364-LFBGA (17x17) Voltage - I/O: 3.3V Core Processor: ARM® Cortex®-A5 + Cortex®-M4 Operating Temperature: -40°C ~ 85°C (TA) Speed: 400MHz, 133MHz Mounting Type: Surface Mount Package / Case: 364-LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| TRACELINK | NXP USA Inc. |
Description: DEBUG & TRACE MCU 32BIT Packaging: Bulk For Use With/Related Products: Coldfire®, Kinetis® Type: Debugger Contents: Board(s) Utilized IC / Part: Coldfire®, Kinetis® |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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MM912F634DV1AE | NXP USA Inc. |
Description: IC MCU DUAL LS/HS SWITCH 48LQFP Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Interface: LIN, SCI RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.25V ~ 5.5V Controller Series: HCS12 Program Memory Type: FLASH (32kB) Core Processor: S12 Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Part Status: Active Number of I/O: 9 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MM912F634DV1AER2 | NXP USA Inc. |
Description: IC MCU DUAL LS/HS SWITCH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Interface: LIN, SCI RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.25V ~ 5.5V Controller Series: HCS12 Program Memory Type: FLASH (32kB) Core Processor: S12 Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Part Status: Active Number of I/O: 9 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MM912F634DV2AE | NXP USA Inc. |
Description: IC MCU DUAL LS/HS SWITCH 48LQFP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MM912F634DV2AP | NXP USA Inc. |
Description: IC MCU DUAL LS/HS SWITCH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Interface: LIN, SCI RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.25V ~ 5.5V Controller Series: HCS12 Program Memory Type: FLASH (32kB) Core Processor: S12 Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 9 DigiKey Programmable: Not Verified Grade: Automotive |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MM912F634DV2APR2 | NXP USA Inc. |
Description: IC MCU DUAL LS/HS SWITCH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Interface: LIN, SCI RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.25V ~ 5.5V Controller Series: HCS12 Program Memory Type: FLASH (32kB) Core Processor: S12 Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 9 DigiKey Programmable: Not Verified Grade: Automotive |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MM912G634DC1AE | NXP USA Inc. |
Description: IC MCU 48KB LS/HS SWITCH 48LQFP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MM912G634DC1AER2 | NXP USA Inc. |
Description: IC MCU 48KB LS/HS SWITCH 48LQFP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MM912G634DC2AP | NXP USA Inc. |
Description: IC MCU 48KB LS/HS SWITCH 48LQFP Package / Case: 48-LQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 9 Part Status: Active Supplier Device Package: 48-LQFP (7x7) Core Processor: S12 Applications: Automotive Program Memory Type: FLASH (48kB) Controller Series: HCS12 Voltage - Supply: 2.25V ~ 5.5V Operating Temperature: -40°C ~ 105°C RAM Size: 2K x 8 Interface: LIN, SCI Mounting Type: Surface Mount |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MM912G634DM1AE | NXP USA Inc. |
Description: IC MCU 48KB LS/HS SWITCH 48LQFP Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Interface: LIN, SCI RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.25V ~ 5.5V Controller Series: HCS12 Program Memory Type: FLASH (48kB) Core Processor: S12 Supplier Device Package: 48-HLQFP (7x7) Part Status: Active Number of I/O: 9 DigiKey Programmable: Not Verified Grade: Automotive |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MM912G634DM1AER2 | NXP USA Inc. |
Description: IC MCU 48KB LS/HS SWITCH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Interface: LIN, SCI RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.25V ~ 5.5V Controller Series: HCS12 Program Memory Type: FLASH (48kB) Core Processor: S12 Supplier Device Package: 48-HLQFP (7x7) Part Status: Active Number of I/O: 9 DigiKey Programmable: Not Verified Grade: Automotive |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MM912G634DV1AER2 | NXP USA Inc. |
Description: IC MCU 48KB LS/HS SWITCH 48LQFP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MM912G634DV2AP | NXP USA Inc. |
Description: IC MCU 48KB LS/HS SWITCH 48LQFP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MM912G634DV2APR2 | NXP USA Inc. |
Description: IC MCU 48KB LS/HS SWITCH 48LQFP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MM912H634DM1AER2 | NXP USA Inc. |
Description: IC MCU 64KB LS/HS SWITCH 48LQFP Voltage - Supply: 2.25V ~ 5.5V Operating Temperature: -40°C ~ 105°C RAM Size: 6K x 8 Interface: LIN, SCI Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Number of I/O: 9 Supplier Device Package: 48-HLQFP (7x7) Core Processor: S12 Applications: Automotive Program Memory Type: FLASH (64kB) Controller Series: HCS12 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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RD4247FXOS8700 | NXP USA Inc. |
Description: KIT SENSOR TOOL BOX CONT Part Status: Active Sensing Range: ±2g, 4g, 8g, ±1200µT Embedded: No Supplied Contents: Board(s) Utilized IC / Part: FXOS8700CQ Sensor Type: Accelerometer, Magnetometer Voltage - Supply: 1.95V ~ 3.6V Interface: I2C, Serial, SPI Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g, 0.1µT/LSB Packaging: Box |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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S912XEQ384F1VALR | NXP USA Inc. |
Description: IC MCU 16BIT 384KB FLASH 112LQFP Packaging: Tape & Reel (TR) Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 384KB (384K x 8) RAM Size: 24K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Part Status: Active Number of I/O: 91 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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S9S08DN32F2CLF | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 48LQFP DigiKey Programmable: Not Verified Number of I/O: 39 Supplier Device Package: 48-LQFP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: I²C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 16x12b Core Processor: S08 EEPROM Size: 1K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 1.5K x 8 Program Memory Size: 32KB (32K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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SPC5646BF0MLU1 | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLASH 176LQFP Mounting Type: Surface Mount Package / Case: 176-LQFP Packaging: Bulk DigiKey Programmable: Not Verified Number of I/O: 147 Supplier Device Package: 176-LQFP (24x24) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 27x10b, 5x12b Core Processor: e200z4d EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 192K x 8 Program Memory Size: 3MB (3M x 8) Speed: 120MHz |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 200 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MM912H634DV1AER2 | NXP USA Inc. |
Description: IC MCU 64KB LS/HS SWITCH 48LQFP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MM912JS812AMAF | NXP USA Inc. |
Description: IC DRVR INJECTOR/IGN 100LQFP Packaging: Tray Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Interface: CAN, SCI, SPI RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.7V ~ 36V Controller Series: HCS12 Program Memory Type: FLASH (128kB) Applications: Engine Control Core Processor: S12XS Supplier Device Package: 100-LQFP-EP (14x14) Number of I/O: 6 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MM912JS812AMAFR2 | NXP USA Inc. |
Description: IC DRVR INJECTOR/IGN 100LQFP DigiKey Programmable: Not Verified Number of I/O: 6 Supplier Device Package: 100-LQFP-EP (14x14) Core Processor: S12XS Applications: Engine Control Program Memory Type: FLASH (128kB) Controller Series: HCS12 Voltage - Supply: 4.7V ~ 36V Operating Temperature: -40°C ~ 125°C RAM Size: 8K x 8 Interface: CAN, SCI, SPI Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MMA6853BKW | NXP USA Inc. |
Description: ACCELEROMETER 50G SPI 16QFN Qualification: AEC-Q100 Grade: Automotive Supplier Device Package: 16-QFN-EP (6x6) Voltage - Supply: 3.135V ~ 5.25V Operating Temperature: -40°C ~ 105°C Axis: X, Y Type: Digital Mounting Type: Surface Mount Output Type: SPI Package / Case: 16-QFN Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 75 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MMDS20254HT1 | NXP USA Inc. |
Description: IC MOD RF ALIGNMENT 2G 32QFN Supplier Device Package: 32-QFN (6x6) RF Type: Cellular Frequency: 1.8GHz ~ 2.2GHz Function: Advanced Doherty Alignment Module Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MML09231HT1 | NXP USA Inc. |
Description: IC RF AMP GSM 700MHZ-1.4GHZ 8DFN Supplier Device Package: 8-DFN (2x2) Test Frequency: 900MHz P1dB: 24.5dBm Noise Figure: 0.36dB Current - Supply: 55mA Gain: 17.2dB Voltage - Supply: 5V RF Type: GSM, LTE, W-CDMA Frequency: 700MHz ~ 1.4GHz Mounting Type: Surface Mount Package / Case: 8-VFDFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MPC8308CZQADDA | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ 473MAPBGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 84 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MPC8308CZQAFDA | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ 473MAPBGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 84 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MPC8308ZQADDA | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ 473MAPBGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 84 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MM912G634DC2APR2 | NXP USA Inc. |
Description: IC MCU 48KB LS/HS SWITCH 48LQFP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MVF61NS151CMK50 | NXP USA Inc. |
Description: IC MPU VYBRID 167MHZ 364LFBGA Packaging: Tray Package / Case: 364-LFBGA Mounting Type: Surface Mount Speed: 500MHz, 167MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A5 + Cortex®-M4 Voltage - I/O: 3.3V Supplier Device Package: 364-LFBGA (17x17) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: Yes Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART |
auf Bestellung 555 Stücke: Lieferzeit 10-14 Tag (e) |
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P2020NXE2MHC | NXP USA Inc. |
Description: IC MPU Q OR IQ 1.2GHZ 689TEBGA |
auf Bestellung 36 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MVF30NS151CKU26 | NXP USA Inc. |
Description: IC MPU VYBRID 266MHZ 176HLQFP Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Graphics Acceleration: Yes RAM Controllers: LPDDR2, DDR3, DRAM Co-Processors/DSP: Multimedia; NEON™ MPE Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 OTG + PHY (1) Ethernet: 10/100Mbps (2) Supplier Device Package: 176-HLQFP (24x24) Voltage - I/O: 3.3V Core Processor: ARM® Cortex®-A5 Operating Temperature: -40°C ~ 85°C (TA) Speed: 266MHz Mounting Type: Surface Mount Package / Case: 176-LQFP Exposed Pad Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 40 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MVF50NN151CMK40 | NXP USA Inc. |
Description: IC MPU VYBRID 400MHZ 364LFBGA USB: USB 2.0 OTG + PHY (1) Ethernet: 10/100Mbps (2) Supplier Device Package: 364-LFBGA (17x17) Voltage - I/O: 3.3V Core Processor: ARM® Cortex®-A5 Operating Temperature: -40°C ~ 85°C (TA) Speed: 400MHz Mounting Type: Surface Mount Package / Case: 364-LFBGA Packaging: Tray Part Status: Active Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Graphics Acceleration: Yes RAM Controllers: LPDDR2, DDR3, DRAM Co-Processors/DSP: Multimedia; NEON™ MPE Number of Cores/Bus Width: 1 Core, 32-Bit Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MVF50NN151CMK50 | NXP USA Inc. |
Description: IC MPU VYBRID 500MHZ 364LFBGA Packaging: Tray Package / Case: 364-LFBGA Mounting Type: Surface Mount Speed: 500MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A5 Voltage - I/O: 3.3V Supplier Device Package: 364-LFBGA (17x17) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: Yes Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MVF50NS151CMK50 | NXP USA Inc. |
Description: IC MPU VYBRID 500MHZ 364LFBGA Packaging: Tray Package / Case: 364-LFBGA Mounting Type: Surface Mount Speed: 500MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A5 Voltage - I/O: 3.3V Supplier Device Package: 364-LFBGA (17x17) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: Yes Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MVF60NN151CMK40 | NXP USA Inc. |
Description: IC MPU VYBRID 167MHZ 364LFBGA Packaging: Tray Package / Case: 364-LFBGA Mounting Type: Surface Mount Speed: 400MHz, 167MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A5 + Cortex®-M4 Voltage - I/O: 3.3V Supplier Device Package: 364-LFBGA (17x17) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: Yes Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MVF60NN151CMK50 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 364MAPBGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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MVF61NN151CMK50 | NXP USA Inc. |
Description: IC MPU VYBRID 167MHZ 364LFBGA Packaging: Tray Package / Case: 364-LFBGA Mounting Type: Surface Mount Speed: 500MHz, 167MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A5 + Cortex®-M4 Voltage - I/O: 3.3V Supplier Device Package: 364-LFBGA (17x17) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: Yes Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART |
auf Bestellung 445 Stücke: Lieferzeit 10-14 Tag (e) |
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| P1023RDB-PA | NXP USA Inc. |
Description: PLATFORM REF DESIGN WLAN P1023 Packaging: Tray For Use With/Related Products: P1023 Type: Transceiver; 802.11 a/b/g/n (Wi-Fi, WiFi, WLAN) Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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P2010NXE2MHC | NXP USA Inc. |
Description: IC MPU QORIQ P2 1.2GHZ PBGA689 Part Status: Obsolete Security Features: Cryptography, Random Number Generator Graphics Acceleration: No RAM Controllers: DDR2, DDR3 Co-Processors/DSP: Security; SEC 3.3 Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100/1000Mbps (3) Supplier Device Package: 689-TEPBGA II (31x31) Core Processor: PowerPC e500v2 Operating Temperature: -40°C ~ 125°C (TA) Speed: 1.2GHz Mounting Type: Surface Mount Package / Case: 689-BBGA Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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P2010NXN2MHC | NXP USA Inc. |
Description: IC MPU QORIQ P2 1.2GHZ PBGA689 Part Status: Obsolete Graphics Acceleration: No RAM Controllers: DDR2, DDR3 Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100/1000Mbps (3) Supplier Device Package: 689-TEPBGA II (31x31) Core Processor: PowerPC e500v2 Operating Temperature: -40°C ~ 125°C (TA) Speed: 1.2GHz Mounting Type: Surface Mount Package / Case: 689-BBGA Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| P2040NSN7HLC | NXP USA Inc. |
Description: IC MPU QORIQ P2 800MHZ 780FCPBGA Additional Interfaces: DUART, I2C, MMC/SD, RapidIO, SPI SATA: SATA 3Gbps (2) Graphics Acceleration: No RAM Controllers: DDR3, DDR3L Number of Cores/Bus Width: 4 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100/1000Mbps (5) Supplier Device Package: 780-FCPBGA (23x23) Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V Core Processor: PowerPC e500mc Operating Temperature: 0°C ~ 105°C (TA) Speed: 800MHz Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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P2041NSE7MMC | NXP USA Inc. |
Description: IC MPU Q OR IQ 1.2GHZ 780FCBGA Package / Case: 780-BBGA, FCBGA Packaging: Tray Part Status: Obsolete SATA: SATA 3Gbps (2) Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox Graphics Acceleration: No RAM Controllers: DDR3, DDR3L Co-Processors/DSP: Security; SEC 4.2 Number of Cores/Bus Width: 4 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100/1000Mbps (5), 10Gbps (1) Supplier Device Package: 780-FCPBGA (23x23) Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V Core Processor: PowerPC e500mc Operating Temperature: 0°C ~ 105°C (TA) Speed: 1.2GHz Mounting Type: Surface Mount |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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P2041NSN7PNC | NXP USA Inc. |
Description: IC MPU Q OR IQ 1.5GHZ 780FCBGA |
auf Bestellung 58 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
| SPC5645CF0MLU1 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 200 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5645SF1VLT |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 208TQFP
DigiKey Programmable: Not Verified
Number of I/O: 150
Part Status: Active
Supplier Device Package: 208-TQFP (28x28)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x10b
Core Processor: e200z4d
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1.064M x 8
Program Memory Size: 2MB (2M x 8)
Speed: 125MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
Description: IC MCU 32BIT 2MB FLASH 208TQFP
DigiKey Programmable: Not Verified
Number of I/O: 150
Part Status: Active
Supplier Device Package: 208-TQFP (28x28)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x10b
Core Processor: e200z4d
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1.064M x 8
Program Memory Size: 2MB (2M x 8)
Speed: 125MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 180 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5645SF1VLU |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Bulk
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1.064M x 8
Program Memory Size: 2MB (2M x 8)
Speed: 125MHz
DigiKey Programmable: Not Verified
Number of I/O: 128
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x10b
Core Processor: e200z4d
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Bulk
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1.064M x 8
Program Memory Size: 2MB (2M x 8)
Speed: 125MHz
DigiKey Programmable: Not Verified
Number of I/O: 128
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x10b
Core Processor: e200z4d
Produkt ist nicht verfügbar
Mindestbestellmenge: 200 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5645SF1VVU |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 416PBGA
DigiKey Programmable: Not Verified
Number of I/O: 177
Supplier Device Package: 416-PBGA (27x27)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 20x10b
Core Processor: e200z4d
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1.064M x 8
Program Memory Size: 2MB (2M x 8)
Speed: 125MHz
Mounting Type: Surface Mount
Package / Case: 416-BBGA
Packaging: Tray
Description: IC MCU 32BIT 2MB FLASH 416PBGA
DigiKey Programmable: Not Verified
Number of I/O: 177
Supplier Device Package: 416-PBGA (27x27)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 20x10b
Core Processor: e200z4d
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1.064M x 8
Program Memory Size: 2MB (2M x 8)
Speed: 125MHz
Mounting Type: Surface Mount
Package / Case: 416-BBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 200 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5645SF1VVUR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 416PBGA
DigiKey Programmable: Not Verified
Number of I/O: 177
Supplier Device Package: 416-PBGA (27x27)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 20x10b
Core Processor: e200z4d
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1.064M x 8
Program Memory Size: 2MB (2M x 8)
Speed: 125MHz
Mounting Type: Surface Mount
Package / Case: 416-BBGA
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 2MB FLASH 416PBGA
DigiKey Programmable: Not Verified
Number of I/O: 177
Supplier Device Package: 416-PBGA (27x27)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 20x10b
Core Processor: e200z4d
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1.064M x 8
Program Memory Size: 2MB (2M x 8)
Speed: 125MHz
Mounting Type: Surface Mount
Package / Case: 416-BBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SPC5646CCF0MLT1 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 208TQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-TQFP (28x28)
Number of I/O: 177
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 3MB FLASH 208TQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-TQFP (28x28)
Number of I/O: 177
DigiKey Programmable: Not Verified
auf Bestellung 180 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 94.56 EUR |
| 10+ | 78.06 EUR |
| 25+ | 73.93 EUR |
| 180+ | 67.96 EUR |
| SPC5646CCF0MLU1 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 147
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 147
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| SPC5646CCF0MMJ1 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 199
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 3MB FLASH 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 199
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| SPC5673FF3MVY2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 516FPBGA
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 516-PBGA (27x27)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 3MB FLASH 516FPBGA
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 516-PBGA (27x27)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| SVF311R3K1CKU2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 266MHZ 176HLQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: No
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Part Status: Active
Description: IC MPU VYBRID 266MHZ 176HLQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: No
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Part Status: Active
auf Bestellung 40 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 56.37 EUR |
| 10+ | 45.87 EUR |
| 40+ | 42.15 EUR |
| SVF322R3K1CKU2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 133MHZ 176HLQFP
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 176-HLQFP (24x24)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 266MHz, 133MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tray
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
Description: IC MPU VYBRID 133MHZ 176HLQFP
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 176-HLQFP (24x24)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 266MHz, 133MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tray
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
Produkt ist nicht verfügbar
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| SVF512R3K1CMK4 |
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 400MHZ 364LFBGA
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Packaging: Tray
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 364-LFBGA (17x17)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5
Operating Temperature: -40°C ~ 85°C (TA)
Description: IC MPU VYBRID 400MHZ 364LFBGA
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Packaging: Tray
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 364-LFBGA (17x17)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5
Operating Temperature: -40°C ~ 85°C (TA)
Produkt ist nicht verfügbar
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| SVF521R3K1CMK4 |
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 133MHZ 364LFBGA
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Part Status: Active
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: No
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 364-LFBGA (17x17)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 400MHz, 133MHz
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Packaging: Tray
Description: IC MPU VYBRID 133MHZ 364LFBGA
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Part Status: Active
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: No
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 364-LFBGA (17x17)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 400MHz, 133MHz
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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| SVF522R2K1CMK4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 364MAPBGA
Description: IC MCU 32BIT ROMLESS 364MAPBGA
Produkt ist nicht verfügbar
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| SVF522R3K1CMK4 |
|
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 133MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Description: IC MPU VYBRID 133MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Produkt ist nicht verfügbar
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| SVF532R3K1CMK4 |
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 133MHZ 364LFBGA
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 364-LFBGA (17x17)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 400MHz, 133MHz
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Packaging: Tray
Description: IC MPU VYBRID 133MHZ 364LFBGA
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 364-LFBGA (17x17)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 400MHz, 133MHz
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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| TRACELINK |
Hersteller: NXP USA Inc.
Description: DEBUG & TRACE MCU 32BIT
Packaging: Bulk
For Use With/Related Products: Coldfire®, Kinetis®
Type: Debugger
Contents: Board(s)
Utilized IC / Part: Coldfire®, Kinetis®
Description: DEBUG & TRACE MCU 32BIT
Packaging: Bulk
For Use With/Related Products: Coldfire®, Kinetis®
Type: Debugger
Contents: Board(s)
Utilized IC / Part: Coldfire®, Kinetis®
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MM912F634DV1AE |
|
Hersteller: NXP USA Inc.
Description: IC MCU DUAL LS/HS SWITCH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (32kB)
Core Processor: S12
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Description: IC MCU DUAL LS/HS SWITCH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (32kB)
Core Processor: S12
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| MM912F634DV1AER2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU DUAL LS/HS SWITCH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (32kB)
Core Processor: S12
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Description: IC MCU DUAL LS/HS SWITCH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (32kB)
Core Processor: S12
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| MM912F634DV2AE |
|
Hersteller: NXP USA Inc.
Description: IC MCU DUAL LS/HS SWITCH 48LQFP
Description: IC MCU DUAL LS/HS SWITCH 48LQFP
Produkt ist nicht verfügbar
Mindestbestellmenge: 1250 Stücke
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| MM912F634DV2AP |
|
Hersteller: NXP USA Inc.
Description: IC MCU DUAL LS/HS SWITCH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (32kB)
Core Processor: S12
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Grade: Automotive
Description: IC MCU DUAL LS/HS SWITCH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (32kB)
Core Processor: S12
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Grade: Automotive
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MM912F634DV2APR2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU DUAL LS/HS SWITCH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (32kB)
Core Processor: S12
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Grade: Automotive
Description: IC MCU DUAL LS/HS SWITCH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (32kB)
Core Processor: S12
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Grade: Automotive
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MM912G634DC1AE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Produkt ist nicht verfügbar
Mindestbestellmenge: 250 Stücke
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| MM912G634DC1AER2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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| MM912G634DC2AP |
|
Hersteller: NXP USA Inc.
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 9
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Core Processor: S12
Applications: Automotive
Program Memory Type: FLASH (48kB)
Controller Series: HCS12
Voltage - Supply: 2.25V ~ 5.5V
Operating Temperature: -40°C ~ 105°C
RAM Size: 2K x 8
Interface: LIN, SCI
Mounting Type: Surface Mount
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 9
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Core Processor: S12
Applications: Automotive
Program Memory Type: FLASH (48kB)
Controller Series: HCS12
Voltage - Supply: 2.25V ~ 5.5V
Operating Temperature: -40°C ~ 105°C
RAM Size: 2K x 8
Interface: LIN, SCI
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MM912G634DM1AE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (48kB)
Core Processor: S12
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Grade: Automotive
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (48kB)
Core Processor: S12
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Grade: Automotive
Produkt ist nicht verfügbar
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| MM912G634DM1AER2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (48kB)
Core Processor: S12
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Grade: Automotive
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (48kB)
Core Processor: S12
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Grade: Automotive
Produkt ist nicht verfügbar
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| MM912G634DV1AER2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Produkt ist nicht verfügbar
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| MM912G634DV2AP |
|
Hersteller: NXP USA Inc.
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Produkt ist nicht verfügbar
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| MM912G634DV2APR2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Produkt ist nicht verfügbar
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| MM912H634DM1AER2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 64KB LS/HS SWITCH 48LQFP
Voltage - Supply: 2.25V ~ 5.5V
Operating Temperature: -40°C ~ 105°C
RAM Size: 6K x 8
Interface: LIN, SCI
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 9
Supplier Device Package: 48-HLQFP (7x7)
Core Processor: S12
Applications: Automotive
Program Memory Type: FLASH (64kB)
Controller Series: HCS12
Description: IC MCU 64KB LS/HS SWITCH 48LQFP
Voltage - Supply: 2.25V ~ 5.5V
Operating Temperature: -40°C ~ 105°C
RAM Size: 6K x 8
Interface: LIN, SCI
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 9
Supplier Device Package: 48-HLQFP (7x7)
Core Processor: S12
Applications: Automotive
Program Memory Type: FLASH (64kB)
Controller Series: HCS12
Produkt ist nicht verfügbar
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| RD4247FXOS8700 |
Hersteller: NXP USA Inc.
Description: KIT SENSOR TOOL BOX CONT
Part Status: Active
Sensing Range: ±2g, 4g, 8g, ±1200µT
Embedded: No
Supplied Contents: Board(s)
Utilized IC / Part: FXOS8700CQ
Sensor Type: Accelerometer, Magnetometer
Voltage - Supply: 1.95V ~ 3.6V
Interface: I2C, Serial, SPI
Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g, 0.1µT/LSB
Packaging: Box
Description: KIT SENSOR TOOL BOX CONT
Part Status: Active
Sensing Range: ±2g, 4g, 8g, ±1200µT
Embedded: No
Supplied Contents: Board(s)
Utilized IC / Part: FXOS8700CQ
Sensor Type: Accelerometer, Magnetometer
Voltage - Supply: 1.95V ~ 3.6V
Interface: I2C, Serial, SPI
Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g, 0.1µT/LSB
Packaging: Box
Produkt ist nicht verfügbar
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| S912XEQ384F1VALR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| S9S08DN32F2CLF |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1.5K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Description: IC MCU 8BIT 32KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1.5K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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| SPC5646BF0MLU1 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 147
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 27x10b, 5x12b
Core Processor: e200z4d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 120MHz
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 147
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 27x10b, 5x12b
Core Processor: e200z4d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 120MHz
Produkt ist nicht verfügbar
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| MM912H634DV1AER2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 64KB LS/HS SWITCH 48LQFP
Description: IC MCU 64KB LS/HS SWITCH 48LQFP
Produkt ist nicht verfügbar
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| MM912JS812AMAF |
|
Hersteller: NXP USA Inc.
Description: IC DRVR INJECTOR/IGN 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SCI, SPI
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.7V ~ 36V
Controller Series: HCS12
Program Memory Type: FLASH (128kB)
Applications: Engine Control
Core Processor: S12XS
Supplier Device Package: 100-LQFP-EP (14x14)
Number of I/O: 6
DigiKey Programmable: Not Verified
Description: IC DRVR INJECTOR/IGN 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SCI, SPI
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.7V ~ 36V
Controller Series: HCS12
Program Memory Type: FLASH (128kB)
Applications: Engine Control
Core Processor: S12XS
Supplier Device Package: 100-LQFP-EP (14x14)
Number of I/O: 6
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| MM912JS812AMAFR2 |
|
Hersteller: NXP USA Inc.
Description: IC DRVR INJECTOR/IGN 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 6
Supplier Device Package: 100-LQFP-EP (14x14)
Core Processor: S12XS
Applications: Engine Control
Program Memory Type: FLASH (128kB)
Controller Series: HCS12
Voltage - Supply: 4.7V ~ 36V
Operating Temperature: -40°C ~ 125°C
RAM Size: 8K x 8
Interface: CAN, SCI, SPI
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC DRVR INJECTOR/IGN 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 6
Supplier Device Package: 100-LQFP-EP (14x14)
Core Processor: S12XS
Applications: Engine Control
Program Memory Type: FLASH (128kB)
Controller Series: HCS12
Voltage - Supply: 4.7V ~ 36V
Operating Temperature: -40°C ~ 125°C
RAM Size: 8K x 8
Interface: CAN, SCI, SPI
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| MMA6853BKW |
|
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 50G SPI 16QFN
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 16-QFN-EP (6x6)
Voltage - Supply: 3.135V ~ 5.25V
Operating Temperature: -40°C ~ 105°C
Axis: X, Y
Type: Digital
Mounting Type: Surface Mount
Output Type: SPI
Package / Case: 16-QFN Exposed Pad
Packaging: Tray
Description: ACCELEROMETER 50G SPI 16QFN
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 16-QFN-EP (6x6)
Voltage - Supply: 3.135V ~ 5.25V
Operating Temperature: -40°C ~ 105°C
Axis: X, Y
Type: Digital
Mounting Type: Surface Mount
Output Type: SPI
Package / Case: 16-QFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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| MMDS20254HT1 |
Hersteller: NXP USA Inc.
Description: IC MOD RF ALIGNMENT 2G 32QFN
Supplier Device Package: 32-QFN (6x6)
RF Type: Cellular
Frequency: 1.8GHz ~ 2.2GHz
Function: Advanced Doherty Alignment Module
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC MOD RF ALIGNMENT 2G 32QFN
Supplier Device Package: 32-QFN (6x6)
RF Type: Cellular
Frequency: 1.8GHz ~ 2.2GHz
Function: Advanced Doherty Alignment Module
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| MML09231HT1 |
|
Hersteller: NXP USA Inc.
Description: IC RF AMP GSM 700MHZ-1.4GHZ 8DFN
Supplier Device Package: 8-DFN (2x2)
Test Frequency: 900MHz
P1dB: 24.5dBm
Noise Figure: 0.36dB
Current - Supply: 55mA
Gain: 17.2dB
Voltage - Supply: 5V
RF Type: GSM, LTE, W-CDMA
Frequency: 700MHz ~ 1.4GHz
Mounting Type: Surface Mount
Package / Case: 8-VFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC RF AMP GSM 700MHZ-1.4GHZ 8DFN
Supplier Device Package: 8-DFN (2x2)
Test Frequency: 900MHz
P1dB: 24.5dBm
Noise Figure: 0.36dB
Current - Supply: 55mA
Gain: 17.2dB
Voltage - Supply: 5V
RF Type: GSM, LTE, W-CDMA
Frequency: 700MHz ~ 1.4GHz
Mounting Type: Surface Mount
Package / Case: 8-VFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| MPC8308CZQADDA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 473MAPBGA
Description: IC MPU MPC83XX 266MHZ 473MAPBGA
Produkt ist nicht verfügbar
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| MPC8308CZQAFDA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 473MAPBGA
Description: IC MPU MPC83XX 333MHZ 473MAPBGA
Produkt ist nicht verfügbar
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| MPC8308ZQADDA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 473MAPBGA
Description: IC MPU MPC83XX 266MHZ 473MAPBGA
Produkt ist nicht verfügbar
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| MM912G634DC2APR2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Produkt ist nicht verfügbar
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| MVF61NS151CMK50 |
|
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 167MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz, 167MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
Description: IC MPU VYBRID 167MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz, 167MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
auf Bestellung 555 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 72.44 EUR |
| 10+ | 59.33 EUR |
| 90+ | 52.67 EUR |
| 180+ | 51.29 EUR |
| 270+ | 50.6 EUR |
| P2020NXE2MHC |
|
Hersteller: NXP USA Inc.
Description: IC MPU Q OR IQ 1.2GHZ 689TEBGA
Description: IC MPU Q OR IQ 1.2GHZ 689TEBGA
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)
| MVF30NS151CKU26 |
|
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 266MHZ 176HLQFP
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 176-HLQFP (24x24)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Packaging: Tray
Description: IC MPU VYBRID 266MHZ 176HLQFP
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 176-HLQFP (24x24)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Packaging: Tray
Produkt ist nicht verfügbar
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| MVF50NN151CMK40 |
|
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 400MHZ 364LFBGA
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 364-LFBGA (17x17)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Packaging: Tray
Part Status: Active
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1 Core, 32-Bit
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
Description: IC MPU VYBRID 400MHZ 364LFBGA
USB: USB 2.0 OTG + PHY (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 364-LFBGA (17x17)
Voltage - I/O: 3.3V
Core Processor: ARM® Cortex®-A5
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Packaging: Tray
Part Status: Active
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR3, DRAM
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 1 Core, 32-Bit
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
Produkt ist nicht verfügbar
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| MVF50NN151CMK50 |
|
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 500MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
Description: IC MPU VYBRID 500MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
Produkt ist nicht verfügbar
Mindestbestellmenge: 450 Stücke
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| MVF50NS151CMK50 |
|
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 500MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
Description: IC MPU VYBRID 500MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
Produkt ist nicht verfügbar
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| MVF60NN151CMK40 |
|
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 167MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 167MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Description: IC MPU VYBRID 167MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 167MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Produkt ist nicht verfügbar
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| MVF60NN151CMK50 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 364MAPBGA
Description: IC MCU 32BIT ROMLESS 364MAPBGA
Produkt ist nicht verfügbar
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| MVF61NN151CMK50 |
|
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 167MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz, 167MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
Description: IC MPU VYBRID 167MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz, 167MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
auf Bestellung 445 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 70.52 EUR |
| 10+ | 57.69 EUR |
| 90+ | 51.19 EUR |
| 180+ | 49.85 EUR |
| 270+ | 49.17 EUR |
| P1023RDB-PA |
|
Hersteller: NXP USA Inc.
Description: PLATFORM REF DESIGN WLAN P1023
Packaging: Tray
For Use With/Related Products: P1023
Type: Transceiver; 802.11 a/b/g/n (Wi-Fi, WiFi, WLAN)
Supplied Contents: Board(s)
Part Status: Active
Description: PLATFORM REF DESIGN WLAN P1023
Packaging: Tray
For Use With/Related Products: P1023
Type: Transceiver; 802.11 a/b/g/n (Wi-Fi, WiFi, WLAN)
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
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Stück im Wert von UAH
| P2010NXE2MHC |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Part Status: Obsolete
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Co-Processors/DSP: Security; SEC 3.3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 689-TEPBGA II (31x31)
Core Processor: PowerPC e500v2
Operating Temperature: -40°C ~ 125°C (TA)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Part Status: Obsolete
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Co-Processors/DSP: Security; SEC 3.3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 689-TEPBGA II (31x31)
Core Processor: PowerPC e500v2
Operating Temperature: -40°C ~ 125°C (TA)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
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Stück im Wert von UAH
| P2010NXN2MHC |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 689-TEPBGA II (31x31)
Core Processor: PowerPC e500v2
Operating Temperature: -40°C ~ 125°C (TA)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 689-TEPBGA II (31x31)
Core Processor: PowerPC e500v2
Operating Temperature: -40°C ~ 125°C (TA)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
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| P2040NSN7HLC |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P2 800MHZ 780FCPBGA
Additional Interfaces: DUART, I2C, MMC/SD, RapidIO, SPI
SATA: SATA 3Gbps (2)
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Number of Cores/Bus Width: 4 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (5)
Supplier Device Package: 780-FCPBGA (23x23)
Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500mc
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 800MHz
Packaging: Tray
Description: IC MPU QORIQ P2 800MHZ 780FCPBGA
Additional Interfaces: DUART, I2C, MMC/SD, RapidIO, SPI
SATA: SATA 3Gbps (2)
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Number of Cores/Bus Width: 4 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (5)
Supplier Device Package: 780-FCPBGA (23x23)
Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500mc
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 800MHz
Packaging: Tray
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| P2041NSE7MMC |
|
Hersteller: NXP USA Inc.
Description: IC MPU Q OR IQ 1.2GHZ 780FCBGA
Package / Case: 780-BBGA, FCBGA
Packaging: Tray
Part Status: Obsolete
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Security; SEC 4.2
Number of Cores/Bus Width: 4 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
Supplier Device Package: 780-FCPBGA (23x23)
Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500mc
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.2GHz
Mounting Type: Surface Mount
Description: IC MPU Q OR IQ 1.2GHZ 780FCBGA
Package / Case: 780-BBGA, FCBGA
Packaging: Tray
Part Status: Obsolete
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Security; SEC 4.2
Number of Cores/Bus Width: 4 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
Supplier Device Package: 780-FCPBGA (23x23)
Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500mc
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.2GHz
Mounting Type: Surface Mount
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| P2041NSN7PNC |
|
Hersteller: NXP USA Inc.
Description: IC MPU Q OR IQ 1.5GHZ 780FCBGA
Description: IC MPU Q OR IQ 1.5GHZ 780FCBGA
auf Bestellung 58 Stücke:
Lieferzeit 10-14 Tag (e)