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P2041NXE7NNC P2041NXE7NNC NXP USA Inc. P2040_Rev2.pdf Description: IC MPU Q OR IQ 1.3GHZ 780FCBGA
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P2041NXE7PNC P2041NXE7PNC NXP USA Inc. P2040_Rev2.pdf Description: IC MPU Q OR IQ 1.5GHZ 780FCBGA
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P2041RDB-PC NXP USA Inc. P2041RDBFS.pdf Description: P2041 EVAL BRD
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MC10XS3425EK MC10XS3425EK NXP USA Inc. MC10XS3425.pdf Description: IC SWITCH 32SOIC SPQL1025
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DLD-MCTB-PXS20-N NXP USA Inc. Description: MOTOR CONTROL TOOLBOX
Applications: Motor Control
Type: Integrated Development Environment (IDE)
Packaging: Electronic Delivery
Media Delivery Type: Electronically Delivered
Utilized IC / Part: Manufacturer Specific Products
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MC10XS3535DHFK MC10XS3535DHFK NXP USA Inc. Description: IC PWR SWITCH N-CHAN 1:6 24PQFN
Part Status: Obsolete
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Supplier Device Package: 24-PQFN (12x12)
Ratio - Input:Output: 1:6
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 7V ~ 20V
Rds On (Typ): 10mOhm (Max), 35mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 6
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 24-PowerQFN
Features: Watchdog Timer
Packaging: Tray
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MC10XS3535DHFKR2 MC10XS3535DHFKR2 NXP USA Inc. Description: IC PWR SWITCH N-CHAN 1:6 24PQFN
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Supplier Device Package: 24-PQFN (12x12)
Ratio - Input:Output: 1:6
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 7V ~ 20V
Rds On (Typ): 10mOhm (Max), 35mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 6
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 24-PowerQFN
Features: Watchdog Timer
Packaging: Tape & Reel (TR)
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MC17XS6500EKR2 MC17XS6500EKR2 NXP USA Inc. Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
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MC33730EK MC33730EK NXP USA Inc. Description: IC REG TRIPLE BUCK/LINEAR 32SOIC
Number of Outputs: 3
Part Status: Active
w/Sequencer: No
w/Supervisor: No
w/LED Driver: No
Voltage/Current - Output 3: Adjustable, 15mA
Voltage/Current - Output 2: Adjustable, 15mA
Voltage/Current - Output 1: 5V, 2A
Supplier Device Package: 32-SOIC-EP
Topology: Step-Down (Buck) (1), Linear (LDO) (2)
Frequency - Switching: 100kHz ~ 500kHz
Voltage - Supply: 6V ~ 26.5V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
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MC33813AE MC33813AE NXP USA Inc. Description: IC CTRL SMALL ENG 1CYL 48LQFP
Supplier Device Package: 48-LQFP-EP (7x7)
Current - Supply: 10mA
Applications: Small Engine
Voltage - Supply: 4.5V ~ 36V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
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MC33813AER2 MC33813AER2 NXP USA Inc. Description: IC CTRL SMALL ENG 1CYL 48LQFP
Supplier Device Package: 48-LQFP-EP (7x7)
Current - Supply: 10mA
Applications: Small Engine
Voltage - Supply: 4.5V ~ 36V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
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MC33981ABHFK MC33981ABHFK NXP USA Inc. MC33981.pdf Description: IC PWR SWITCH N-CHAN 1:1 16QFN
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MC34903CP3EKR2 MC34903CP3EKR2 NXP USA Inc. MC34903,4,5.pdf Description: IC SWITCH HIGH SIDE 32SOIC
Part Status: Obsolete
Supplier Device Package: 32-SOIC-EP
Current - Supply: 2mA
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tape & Reel (TR)
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MC34904C3EKR2 MC34904C3EKR2 NXP USA Inc. MC34903,4,5.pdf Description: IC SWITCH HIGH SIDE
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MC34931EKR2 MC34931EKR2 NXP USA Inc. Description: IC BRIDGE DRIVER PAR 32SOIC
Motor Type - AC, DC: Brushed DC, DC Servo
Supplier Device Package: 32-SOIC-EP
Voltage - Load: 5V ~ 36V
Technology: Power MOSFET
Applications: DC Motors, General Purpose
Voltage - Supply: 5V ~ 36V
Output Configuration: Half Bridge (2)
Operating Temperature: -40°C ~ 85°C (TA)
Interface: Logic
Current - Output: 5A
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tape & Reel (TR)
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MC34932EK MC34932EK NXP USA Inc. MC34932.pdf Description: IC BRIDGE DRIVER PAR 54SOIC
Part Status: Active
Motor Type - AC, DC: Brushed DC, DC Servo
Supplier Device Package: 54-SOIC-EP
Voltage - Load: 5V ~ 36V
Technology: Power MOSFET
Applications: DC Motors, General Purpose
Voltage - Supply: 5V ~ 36V
Output Configuration: Half Bridge (4)
Operating Temperature: -40°C ~ 150°C (TJ)
Interface: Logic
Current - Output: 5A
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
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MC34932EKR2 MC34932EKR2 NXP USA Inc. MC34932.pdf Description: IC BRIDGE DRIVER PAR 54SOIC
Part Status: Active
Motor Type - AC, DC: Brushed DC, DC Servo
Supplier Device Package: 54-SOIC-EP
Voltage - Load: 5V ~ 36V
Technology: Power MOSFET
Applications: DC Motors, General Purpose
Voltage - Supply: 5V ~ 36V
Output Configuration: Half Bridge (4)
Operating Temperature: -40°C ~ 150°C (TJ)
Interface: Logic
Current - Output: 5A
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tape & Reel (TR)
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MC34937APEKR2 MC34937APEKR2 NXP USA Inc. MC34937.pdf Description: IC MOTOR DRIVER 6V-58V 54SOIC
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MC34981ABHFKR2 MC34981ABHFKR2 NXP USA Inc. MC34981ABHFK.pdf Description: IC PWR SWITCH N-CHAN 1:1 16QFN
Part Status: Obsolete
Fault Protection: Current Limiting (Fixed), Over Temperature
Supplier Device Package: 16-PQFN (12x12)
Ratio - Input:Output: 1:1
Current - Output (Max): 40A
Voltage - Load: 6V ~ 27V
Rds On (Typ): 4mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 150°C (TJ)
Switch Type: General Purpose
Interface: PWM
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 16-PowerQFN
Features: Slew Rate Controlled
Packaging: Tape & Reel (TR)
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MC35XS3500DHFK MC35XS3500DHFK NXP USA Inc. MC35XS3500.pdf Description: IC PWR SWITCH N-CHAN 1:6 24PQFN
Part Status: Obsolete
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Supplier Device Package: 24-PQFN (12x12)
Ratio - Input:Output: 1:6
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 7V ~ 20V
Rds On (Typ): 35mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 150°C (TJ)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 6
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 24-PowerQFN
Features: Watchdog Timer
Packaging: Tray
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MC35XS3500DHFKR2 MC35XS3500DHFKR2 NXP USA Inc. MC35XS3500.pdf Description: IC PWR SWITCH N-CHAN 1:6 24PQFN
Part Status: Obsolete
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Supplier Device Package: 24-PQFN (12x12)
Ratio - Input:Output: 1:6
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 7V ~ 20V
Rds On (Typ): 35mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 150°C (TJ)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 6
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 24-PowerQFN
Features: Watchdog Timer
Packaging: Tape & Reel (TR)
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MC56F82723VFM MC56F82723VFM NXP USA Inc. MC56F827XXDS.pdf Description: IC MCU 32BIT 32KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 26
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: DMA, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 6x12b; D/A 2x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 3K x 16
Program Memory Size: 32KB (16K x 16)
Speed: 100MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
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MC56F82726VLF MC56F82726VLF NXP USA Inc. MC56F827XXDS.pdf Description: IC MCU 32BIT 32KB FLASH 48LQFP
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MC56F82743VLC MC56F82743VLC NXP USA Inc. MC56F827XXDS.pdf Description: IC MCU 32BIT 64KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 6x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
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MC56F82746VLF MC56F82746VLF NXP USA Inc. MC56F827XXDS.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 10x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
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10+10.72 EUR
25+9.95 EUR
100+9.1 EUR
250+8.7 EUR
500+8.46 EUR
1000+8.26 EUR
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MC56F84441VLFR MC56F84441VLFR NXP USA Inc. MC56F8458X.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 56800EX
Data Converters: A/D 10x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
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MC9S08AC8MFJER MC9S08AC8MFJER NXP USA Inc. www.nxp.com Description: IC MCU 8BIT 8KB FLASH 32LQFP
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 768 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tape & Reel (TR)
Number of I/O: 22
Part Status: Active
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 6x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
DigiKey Programmable: Not Verified
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MC9S08PA16VLC MC9S08PA16VLC NXP USA Inc. MC9S08PA4.pdf Description: IC MCU 8BIT 16KB FLASH 32LQFP
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x12b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
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10+3.5 EUR
25+3.21 EUR
100+2.89 EUR
250+2.73 EUR
500+2.64 EUR
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MC9S08PA16VTG MC9S08PA16VTG NXP USA Inc. MC9S08PA16_Rev.1.pdf Description: IC MCU 8BIT 16KB FLASH 16TSSOP
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MC9S08PA16VWJ MC9S08PA16VWJ NXP USA Inc. MC9S08PA4.pdf Description: IC MCU 8BIT 16KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Number of I/O: 18
DigiKey Programmable: Not Verified
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MC9S08PA4VTG MC9S08PA4VTG NXP USA Inc. MC9S08PA4.pdf Description: IC MCU 8BIT 4KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 14
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x12b
Core Processor: S08
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 512 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
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MC9S08PA4VWJ MC9S08PA4VWJ NXP USA Inc. MC9S08PA4.pdf Description: IC MCU 8BIT 4KB FLASH 20SOIC
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Number of I/O: 18
Part Status: Not For New Designs
Supplier Device Package: 20-SOIC
Peripherals: LVD, POR, PWM, WDT
Connectivity: LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x12b
Core Processor: S08
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 512 x 8
Program Memory Size: 4KB (4K x 8)
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MC9S08PA8VLC MC9S08PA8VLC NXP USA Inc. MC9S08PA16_Rev.1.pdf Description: IC MCU 8BIT 8KB FLASH 32LQFP
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Not For New Designs
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x12b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
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MC9S08PA8VTG MC9S08PA8VTG NXP USA Inc. MC9S08PA16_Rev.1.pdf Description: IC MCU 8BIT 8KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 14
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x12b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tray
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10+2.43 EUR
25+2.09 EUR
96+1.72 EUR
288+1.58 EUR
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MC9S08PA8VWJ MC9S08PA8VWJ NXP USA Inc. MC9S08PA16_Rev.1.pdf Description: IC MCU 8BIT 8KB FLASH 20SOIC
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MC9S08PT16VTG MC9S08PT16VTG NXP USA Inc. Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x12b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 14
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MC9S08PT32VLCR MC9S08PT32VLCR NXP USA Inc. MC9S08PT16.pdf Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Not For New Designs
Number of I/O: 28
DigiKey Programmable: Not Verified
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MC9S08PT8VLC MC9S08PT8VLC NXP USA Inc. Description: IC MCU 8BIT 8KB FLASH 32LQFP
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x12b
Core Processor: S08
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MC9S08PT8VTG MC9S08PT8VTG NXP USA Inc. MC9S08PT16.pdf Description: IC MCU 8BIT 8KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 14
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x12b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
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MC9S08QG84CDTER MC9S08QG84CDTER NXP USA Inc. MC9S08QG8.pdf Description: IC MCU 8BIT 8KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 12
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
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MC9S08SE8VTGR MC9S08SE8VTGR NXP USA Inc. MC9S08SE8.pdf Description: IC MCU 8BIT 8KB FLASH 16TSSOP
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MCIMX251AJM4AR2 MCIMX251AJM4AR2 NXP USA Inc. IMX25AEC.pdf Description: IC MPU I.MX25 400MHZ 400LFBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Part Status: Active
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
Display & Interface Controllers: Keypad
Graphics Acceleration: No
RAM Controllers: LPDDR, DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 400-LFBGA (17x17)
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Core Processor: ARM926EJ-S
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tape & Reel (TR)
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MCIMX255AJM4AR2 MCIMX255AJM4AR2 NXP USA Inc. IMX25AEC.pdf Description: IC MPU I.MX25 400MHZ 400LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
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MCIMX6D4AVT10ACR MCIMX6D4AVT10ACR NXP USA Inc. IMX6DQIEC.pdf Description: IC MPU I.MX6D 1.0GHZ 624FCBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Not For New Designs
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tape & Reel (TR)
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MCIMX6D6AVT08ACR MCIMX6D6AVT08ACR NXP USA Inc. IMX6DQIEC.pdf Description: IC MPU I.MX6D 852MHZ 624FCBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Not For New Designs
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 852MHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tape & Reel (TR)
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MCIMX6D6AVT10ACR MCIMX6D6AVT10ACR NXP USA Inc. IMX6DQCEC.pdf Description: IC MPU I.MX6D 1.0GHZ 624FCBGA
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MCIMX6L2EVN10AB MCIMX6L2EVN10AB NXP USA Inc. IMX6SLCEC.pdf Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (3)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 432-MAPBGA (13x13)
Voltage - I/O: 1.2V, 1.8V, 3.0V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 432-TFBGA
Packaging: Tray
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10+34.68 EUR
25+32.61 EUR
160+29.74 EUR
320+29 EUR
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MCIMX6L3DVN10AB MCIMX6L3DVN10AB NXP USA Inc. IMX6SLCEC.pdf Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
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25+31.89 EUR
160+29.06 EUR
320+28.33 EUR
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MCIMX6L3EVN10AB MCIMX6L3EVN10AB NXP USA Inc. IMX6SLCEC.pdf Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
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10+37.1 EUR
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100+32.48 EUR
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MCIMX6Q4AVT08ACR MCIMX6Q4AVT08ACR NXP USA Inc. IMX6DQAEC.pdf Description: IC MPU I.MX6Q 852MHZ 624FCBGA
Packaging: Tape & Reel (TR)
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 4 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 852MHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
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MCIMX6Q5EYM10ACR MCIMX6Q5EYM10ACR NXP USA Inc. IMX6DQAEC.pdf Description: IC MPU I.MX6Q 1.0GHZ 624FCPBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Not For New Designs
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 4 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA, FCBGA
Packaging: Tape & Reel (TR)
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MCIMX6Q6AVT10ACR MCIMX6Q6AVT10ACR NXP USA Inc. IMX6DQAEC.pdf Description: IC MPU I.MX6Q 1.0GHZ 624FCBGA
Part Status: Not For New Designs
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 4 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tape & Reel (TR)
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MCIMX6S5DVM10ABR MCIMX6S5DVM10ABR NXP USA Inc. IMX6SDLAEC.pdf Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tape & Reel (TR)
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MCIMX6S5EVM10ABR MCIMX6S5EVM10ABR NXP USA Inc. IMX6SDLCEC.pdf Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tape & Reel (TR)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
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MCIMX6U5EVM10ABR MCIMX6U5EVM10ABR NXP USA Inc. IMX6SDLCEC.pdf Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tape & Reel (TR)
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MCIMX6U6AVM08ABR MCIMX6U6AVM08ABR NXP USA Inc. IMX6SDLAEC.pdf Description: IC MPU I.MX6DL 800MHZ 624MAPBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Not For New Designs
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tape & Reel (TR)
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MCZ33903C5EKR2 MCZ33903C5EKR2 NXP USA Inc. MC33903%2C4%2C5.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Supplier Device Package: 32-SOIC-EP
Applications: System Basis Chip
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MD7IC2012NR1 NXP USA Inc. Description: IC AMP CDMA 1.805-2.17GHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-14 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 1.805GHz ~ 2.17GHz
RF Type: W-CDMA
Voltage - Supply: 24V ~ 32V
Gain: 31.5dB
Current - Supply: 70mA
P1dB: 40dBm
Supplier Device Package: TO-270 WB-14
Part Status: Obsolete
Produkt ist nicht verfügbar
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MD8IC925GNR1 MD8IC925GNR1 NXP USA Inc. MD8IC925N.pdf Description: IC AMP W-CDMA 728-960MHZ TO270
Supplier Device Package: TO-270 WB-14 GULL
Test Frequency: 700MHz
P1dB: 43dBm
Current - Supply: 222mA
Gain: 36.2dB
Voltage - Supply: 24V ~ 32V
RF Type: W-CDMA
Frequency: 728MHz ~ 960MHz
Mounting Type: Surface Mount
Package / Case: TO-270-14 Variant, Gull Wing
Packaging: Tape & Reel (TR)
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MD8IC925NR1 MD8IC925NR1 NXP USA Inc. MD8IC925N.pdf Description: IC AMP W-CDMA 728-960MHZ TO270
Supplier Device Package: TO-270 WB-14
Test Frequency: 700MHz
P1dB: 43dBm
Current - Supply: 222mA
Gain: 36.2dB
Voltage - Supply: 24V ~ 32V
RF Type: W-CDMA
Frequency: 728MHz ~ 960MHz
Mounting Type: Chassis Mount
Package / Case: TO-270-14 Variant, Flat Leads
Packaging: Tape & Reel (TR)
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P2041NXE7NNC P2040_Rev2.pdf
P2041NXE7NNC
Hersteller: NXP USA Inc.
Description: IC MPU Q OR IQ 1.3GHZ 780FCBGA
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P2041NXE7PNC P2040_Rev2.pdf
P2041NXE7PNC
Hersteller: NXP USA Inc.
Description: IC MPU Q OR IQ 1.5GHZ 780FCBGA
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P2041RDB-PC P2041RDBFS.pdf
Hersteller: NXP USA Inc.
Description: P2041 EVAL BRD
Produkt ist nicht verfügbar
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MC10XS3425EK MC10XS3425.pdf
MC10XS3425EK
Hersteller: NXP USA Inc.
Description: IC SWITCH 32SOIC SPQL1025
auf Bestellung 42 Stücke:
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DLD-MCTB-PXS20-N
Hersteller: NXP USA Inc.
Description: MOTOR CONTROL TOOLBOX
Applications: Motor Control
Type: Integrated Development Environment (IDE)
Packaging: Electronic Delivery
Media Delivery Type: Electronically Delivered
Utilized IC / Part: Manufacturer Specific Products
Produkt ist nicht verfügbar
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MC10XS3535DHFK
MC10XS3535DHFK
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:6 24PQFN
Part Status: Obsolete
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Supplier Device Package: 24-PQFN (12x12)
Ratio - Input:Output: 1:6
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 7V ~ 20V
Rds On (Typ): 10mOhm (Max), 35mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 6
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 24-PowerQFN
Features: Watchdog Timer
Packaging: Tray
Produkt ist nicht verfügbar
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MC10XS3535DHFKR2
MC10XS3535DHFKR2
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:6 24PQFN
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Supplier Device Package: 24-PQFN (12x12)
Ratio - Input:Output: 1:6
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 7V ~ 20V
Rds On (Typ): 10mOhm (Max), 35mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 6
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 24-PowerQFN
Features: Watchdog Timer
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC17XS6500EKR2
MC17XS6500EKR2
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
Produkt ist nicht verfügbar
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MC33730EK
MC33730EK
Hersteller: NXP USA Inc.
Description: IC REG TRIPLE BUCK/LINEAR 32SOIC
Number of Outputs: 3
Part Status: Active
w/Sequencer: No
w/Supervisor: No
w/LED Driver: No
Voltage/Current - Output 3: Adjustable, 15mA
Voltage/Current - Output 2: Adjustable, 15mA
Voltage/Current - Output 1: 5V, 2A
Supplier Device Package: 32-SOIC-EP
Topology: Step-Down (Buck) (1), Linear (LDO) (2)
Frequency - Switching: 100kHz ~ 500kHz
Voltage - Supply: 6V ~ 26.5V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
Produkt ist nicht verfügbar
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MC33813AE
MC33813AE
Hersteller: NXP USA Inc.
Description: IC CTRL SMALL ENG 1CYL 48LQFP
Supplier Device Package: 48-LQFP-EP (7x7)
Current - Supply: 10mA
Applications: Small Engine
Voltage - Supply: 4.5V ~ 36V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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MC33813AER2
MC33813AER2
Hersteller: NXP USA Inc.
Description: IC CTRL SMALL ENG 1CYL 48LQFP
Supplier Device Package: 48-LQFP-EP (7x7)
Current - Supply: 10mA
Applications: Small Engine
Voltage - Supply: 4.5V ~ 36V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC33981ABHFK MC33981.pdf
MC33981ABHFK
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 16QFN
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MC34903CP3EKR2 MC34903,4,5.pdf
MC34903CP3EKR2
Hersteller: NXP USA Inc.
Description: IC SWITCH HIGH SIDE 32SOIC
Part Status: Obsolete
Supplier Device Package: 32-SOIC-EP
Current - Supply: 2mA
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC34904C3EKR2 MC34903,4,5.pdf
MC34904C3EKR2
Hersteller: NXP USA Inc.
Description: IC SWITCH HIGH SIDE
Produkt ist nicht verfügbar
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MC34931EKR2
MC34931EKR2
Hersteller: NXP USA Inc.
Description: IC BRIDGE DRIVER PAR 32SOIC
Motor Type - AC, DC: Brushed DC, DC Servo
Supplier Device Package: 32-SOIC-EP
Voltage - Load: 5V ~ 36V
Technology: Power MOSFET
Applications: DC Motors, General Purpose
Voltage - Supply: 5V ~ 36V
Output Configuration: Half Bridge (2)
Operating Temperature: -40°C ~ 85°C (TA)
Interface: Logic
Current - Output: 5A
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC34932EK MC34932.pdf
MC34932EK
Hersteller: NXP USA Inc.
Description: IC BRIDGE DRIVER PAR 54SOIC
Part Status: Active
Motor Type - AC, DC: Brushed DC, DC Servo
Supplier Device Package: 54-SOIC-EP
Voltage - Load: 5V ~ 36V
Technology: Power MOSFET
Applications: DC Motors, General Purpose
Voltage - Supply: 5V ~ 36V
Output Configuration: Half Bridge (4)
Operating Temperature: -40°C ~ 150°C (TJ)
Interface: Logic
Current - Output: 5A
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
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3+8.75 EUR
10+6.67 EUR
26+6.13 EUR
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MC34932EKR2 MC34932.pdf
MC34932EKR2
Hersteller: NXP USA Inc.
Description: IC BRIDGE DRIVER PAR 54SOIC
Part Status: Active
Motor Type - AC, DC: Brushed DC, DC Servo
Supplier Device Package: 54-SOIC-EP
Voltage - Load: 5V ~ 36V
Technology: Power MOSFET
Applications: DC Motors, General Purpose
Voltage - Supply: 5V ~ 36V
Output Configuration: Half Bridge (4)
Operating Temperature: -40°C ~ 150°C (TJ)
Interface: Logic
Current - Output: 5A
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tape & Reel (TR)
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1000+8.03 EUR
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MC34937APEKR2 MC34937.pdf
MC34937APEKR2
Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 6V-58V 54SOIC
Produkt ist nicht verfügbar
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MC34981ABHFKR2 MC34981ABHFK.pdf
MC34981ABHFKR2
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 16QFN
Part Status: Obsolete
Fault Protection: Current Limiting (Fixed), Over Temperature
Supplier Device Package: 16-PQFN (12x12)
Ratio - Input:Output: 1:1
Current - Output (Max): 40A
Voltage - Load: 6V ~ 27V
Rds On (Typ): 4mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 150°C (TJ)
Switch Type: General Purpose
Interface: PWM
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 16-PowerQFN
Features: Slew Rate Controlled
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC35XS3500DHFK MC35XS3500.pdf
MC35XS3500DHFK
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:6 24PQFN
Part Status: Obsolete
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Supplier Device Package: 24-PQFN (12x12)
Ratio - Input:Output: 1:6
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 7V ~ 20V
Rds On (Typ): 35mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 150°C (TJ)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 6
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 24-PowerQFN
Features: Watchdog Timer
Packaging: Tray
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2+13.55 EUR
10+12.24 EUR
25+11.68 EUR
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MC35XS3500DHFKR2 MC35XS3500.pdf
MC35XS3500DHFKR2
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:6 24PQFN
Part Status: Obsolete
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Supplier Device Package: 24-PQFN (12x12)
Ratio - Input:Output: 1:6
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 7V ~ 20V
Rds On (Typ): 35mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 150°C (TJ)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 6
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 24-PowerQFN
Features: Watchdog Timer
Packaging: Tape & Reel (TR)
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MC56F82723VFM MC56F827XXDS.pdf
MC56F82723VFM
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 26
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: DMA, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 6x12b; D/A 2x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 3K x 16
Program Memory Size: 32KB (16K x 16)
Speed: 100MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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MC56F82726VLF MC56F827XXDS.pdf
MC56F82726VLF
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
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MC56F82743VLC MC56F827XXDS.pdf
MC56F82743VLC
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 6x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC56F82746VLF MC56F827XXDS.pdf
MC56F82746VLF
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 10x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
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2+13.8 EUR
10+10.72 EUR
25+9.95 EUR
100+9.1 EUR
250+8.7 EUR
500+8.46 EUR
1000+8.26 EUR
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MC56F84441VLFR MC56F8458X.pdf
MC56F84441VLFR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 56800EX
Data Converters: A/D 10x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08AC8MFJER www.nxp.com
MC9S08AC8MFJER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 32LQFP
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 768 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tape & Reel (TR)
Number of I/O: 22
Part Status: Active
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 6x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08PA16VLC MC9S08PA4.pdf
MC9S08PA16VLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x12b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
auf Bestellung 1185 Stücke:
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4+4.68 EUR
10+3.5 EUR
25+3.21 EUR
100+2.89 EUR
250+2.73 EUR
500+2.64 EUR
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MC9S08PA16VTG MC9S08PA16_Rev.1.pdf
MC9S08PA16VTG
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Produkt ist nicht verfügbar
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MC9S08PA16VWJ MC9S08PA4.pdf
MC9S08PA16VWJ
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08PA4VTG MC9S08PA4.pdf
MC9S08PA4VTG
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 14
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x12b
Core Processor: S08
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 512 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
auf Bestellung 1532 Stücke:
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AnzahlPreis
11+1.74 EUR
14+1.26 EUR
96+1.09 EUR
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MC9S08PA4VWJ MC9S08PA4.pdf
MC9S08PA4VWJ
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20SOIC
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Number of I/O: 18
Part Status: Not For New Designs
Supplier Device Package: 20-SOIC
Peripherals: LVD, POR, PWM, WDT
Connectivity: LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x12b
Core Processor: S08
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 512 x 8
Program Memory Size: 4KB (4K x 8)
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MC9S08PA8VLC MC9S08PA16_Rev.1.pdf
MC9S08PA8VLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 32LQFP
DigiKey Programmable: Not Verified
Number of I/O: 28
Part Status: Not For New Designs
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x12b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MC9S08PA8VTG MC9S08PA16_Rev.1.pdf
MC9S08PA8VTG
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 14
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x12b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tray
auf Bestellung 2721 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
5+3.71 EUR
10+2.43 EUR
25+2.09 EUR
96+1.72 EUR
288+1.58 EUR
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MC9S08PA8VWJ MC9S08PA16_Rev.1.pdf
MC9S08PA8VWJ
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20SOIC
Produkt ist nicht verfügbar
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MC9S08PT16VTG
MC9S08PT16VTG
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x12b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 14
Produkt ist nicht verfügbar
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MC9S08PT32VLCR MC9S08PT16.pdf
MC9S08PT32VLCR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Not For New Designs
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08PT8VLC
MC9S08PT8VLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 32LQFP
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x12b
Core Processor: S08
Produkt ist nicht verfügbar
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MC9S08PT8VTG MC9S08PT16.pdf
MC9S08PT8VTG
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 14
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x12b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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MC9S08QG84CDTER MC9S08QG8.pdf
MC9S08QG84CDTER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 12
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC9S08SE8VTGR MC9S08SE8.pdf
MC9S08SE8VTGR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Produkt ist nicht verfügbar
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MCIMX251AJM4AR2 IMX25AEC.pdf
MCIMX251AJM4AR2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX25 400MHZ 400LFBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Part Status: Active
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
Display & Interface Controllers: Keypad
Graphics Acceleration: No
RAM Controllers: LPDDR, DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 400-LFBGA (17x17)
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Core Processor: ARM926EJ-S
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCIMX255AJM4AR2 IMX25AEC.pdf
MCIMX255AJM4AR2
Hersteller: NXP USA Inc.
Description: IC MPU I.MX25 400MHZ 400LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: LPDDR, DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Produkt ist nicht verfügbar
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MCIMX6D4AVT10ACR IMX6DQIEC.pdf
MCIMX6D4AVT10ACR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 1.0GHZ 624FCBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Not For New Designs
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCIMX6D6AVT08ACR IMX6DQIEC.pdf
MCIMX6D6AVT08ACR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 852MHZ 624FCBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Not For New Designs
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 852MHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCIMX6D6AVT10ACR IMX6DQCEC.pdf
MCIMX6D6AVT10ACR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 1.0GHZ 624FCBGA
Produkt ist nicht verfügbar
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MCIMX6L2EVN10AB IMX6SLCEC.pdf
MCIMX6L2EVN10AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (3)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 432-MAPBGA (13x13)
Voltage - I/O: 1.2V, 1.8V, 3.0V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 432-TFBGA
Packaging: Tray
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+43 EUR
10+34.68 EUR
25+32.61 EUR
160+29.74 EUR
320+29 EUR
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MCIMX6L3DVN10AB IMX6SLCEC.pdf
MCIMX6L3DVN10AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+42.12 EUR
10+33.93 EUR
25+31.89 EUR
160+29.06 EUR
320+28.33 EUR
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MCIMX6L3EVN10AB IMX6SLCEC.pdf
MCIMX6L3EVN10AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
auf Bestellung 117 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+45.92 EUR
10+37.1 EUR
25+34.9 EUR
100+32.48 EUR
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MCIMX6Q4AVT08ACR IMX6DQAEC.pdf
MCIMX6Q4AVT08ACR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6Q 852MHZ 624FCBGA
Packaging: Tape & Reel (TR)
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 4 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 852MHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Produkt ist nicht verfügbar
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MCIMX6Q5EYM10ACR IMX6DQAEC.pdf
MCIMX6Q5EYM10ACR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6Q 1.0GHZ 624FCPBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Not For New Designs
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 4 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA, FCBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCIMX6Q6AVT10ACR IMX6DQAEC.pdf
MCIMX6Q6AVT10ACR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6Q 1.0GHZ 624FCBGA
Part Status: Not For New Designs
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 4 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCIMX6S5DVM10ABR IMX6SDLAEC.pdf
MCIMX6S5DVM10ABR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCIMX6S5EVM10ABR IMX6SDLCEC.pdf
MCIMX6S5EVM10ABR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tape & Reel (TR)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Produkt ist nicht verfügbar
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MCIMX6U5EVM10ABR IMX6SDLCEC.pdf
MCIMX6U5EVM10ABR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCIMX6U6AVM08ABR IMX6SDLAEC.pdf
MCIMX6U6AVM08ABR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DL 800MHZ 624MAPBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Not For New Designs
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCZ33903C5EKR2 MC33903%2C4%2C5.pdf
MCZ33903C5EKR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Supplier Device Package: 32-SOIC-EP
Applications: System Basis Chip
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MD7IC2012NR1
Hersteller: NXP USA Inc.
Description: IC AMP CDMA 1.805-2.17GHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-14 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 1.805GHz ~ 2.17GHz
RF Type: W-CDMA
Voltage - Supply: 24V ~ 32V
Gain: 31.5dB
Current - Supply: 70mA
P1dB: 40dBm
Supplier Device Package: TO-270 WB-14
Part Status: Obsolete
Produkt ist nicht verfügbar
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MD8IC925GNR1 MD8IC925N.pdf
MD8IC925GNR1
Hersteller: NXP USA Inc.
Description: IC AMP W-CDMA 728-960MHZ TO270
Supplier Device Package: TO-270 WB-14 GULL
Test Frequency: 700MHz
P1dB: 43dBm
Current - Supply: 222mA
Gain: 36.2dB
Voltage - Supply: 24V ~ 32V
RF Type: W-CDMA
Frequency: 728MHz ~ 960MHz
Mounting Type: Surface Mount
Package / Case: TO-270-14 Variant, Gull Wing
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MD8IC925NR1 MD8IC925N.pdf
MD8IC925NR1
Hersteller: NXP USA Inc.
Description: IC AMP W-CDMA 728-960MHZ TO270
Supplier Device Package: TO-270 WB-14
Test Frequency: 700MHz
P1dB: 43dBm
Current - Supply: 222mA
Gain: 36.2dB
Voltage - Supply: 24V ~ 32V
RF Type: W-CDMA
Frequency: 728MHz ~ 960MHz
Mounting Type: Chassis Mount
Package / Case: TO-270-14 Variant, Flat Leads
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
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