Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36616) > Seite 236 nach 611
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MCIMX6D4AVT10AD | NXP USA Inc. |
Description: IC MPU I.MX6D 1.0GHZ 624FCBGAAdditional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART SATA: SATA 3Gbps (1) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Display & Interface Controllers: Keypad, LCD Graphics Acceleration: Yes RAM Controllers: LPDDR2, LVDDR3, DDR3 Co-Processors/DSP: Multimedia; NEON™ SIMD Number of Cores/Bus Width: 2 Core, 32-Bit USB: USB 2.0 + PHY (4) Ethernet: 10/100/1000Mbps (1) Supplier Device Package: 624-FCBGA (21x21) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Core Processor: ARM® Cortex®-A9 Operating Temperature: -40°C ~ 125°C (TJ) Speed: 1.0GHz Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MCIMX6D5EYM10AD | NXP USA Inc. |
Description: IC MPU I.MX6D 1.0GHZ 624FCPBGAPackaging: Tray Package / Case: 624-LFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 3Gbps (1) Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
auf Bestellung 347 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6D6AVT10AD | NXP USA Inc. |
Description: IC MPU I.MX6D 1.0GHZ 624FCBGAPackaging: Tray Package / Case: 624-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 3Gbps (1) Part Status: Active Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
auf Bestellung 292 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6Q4AVT08AD | NXP USA Inc. |
Description: IC MPU I.MX6Q 852MHZ 624FCBGAAdditional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART Part Status: Active SATA: SATA 3Gbps (1) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Display & Interface Controllers: Keypad, LCD Graphics Acceleration: Yes RAM Controllers: LPDDR2, LVDDR3, DDR3 Co-Processors/DSP: Multimedia; NEON™ SIMD Number of Cores/Bus Width: 4 Core, 32-Bit USB: USB 2.0 + PHY (4) Ethernet: 10/100/1000Mbps (1) Supplier Device Package: 624-FCBGA (21x21) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Core Processor: ARM® Cortex®-A9 Operating Temperature: -40°C ~ 125°C (TJ) Speed: 852MHz Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MCIMX6Q5EYM10AD | NXP USA Inc. |
Description: IC MPU I.MX6Q 1.0GHZ 624FCPBGAPackaging: Tray Package / Case: 624-LFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 3Gbps (1) Part Status: Active Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
auf Bestellung 151 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6Q6AVT08AD | NXP USA Inc. |
Description: IC MPU I.MX6Q 852MHZ 624FCBGAUSB: USB 2.0 + PHY (4) Ethernet: 10/100/1000Mbps (1) Supplier Device Package: 624-FCBGA (21x21) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Core Processor: ARM® Cortex®-A9 Operating Temperature: -40°C ~ 125°C (TJ) Speed: 852MHz Mounting Type: Surface Mount Package / Case: 624-FBGA, FCBGA Packaging: Tray Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART Part Status: Active SATA: SATA 3Gbps (1) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Display & Interface Controllers: Keypad, LCD Graphics Acceleration: Yes RAM Controllers: LPDDR2, LVDDR3, DDR3 Co-Processors/DSP: Multimedia; NEON™ SIMD Number of Cores/Bus Width: 4 Core, 32-Bit |
auf Bestellung 58 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6Q6AVT10AD | NXP USA Inc. |
Description: IC MPU I.MX6Q 1.0GHZ 624FCBGAPackaging: Tray Package / Case: 624-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 3Gbps (1) Part Status: Active Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
auf Bestellung 253 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6S1AVM08AC | NXP USA Inc. |
Description: IC MPU I.MX6S 800MHZ 624MAPBGAAdditional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Display & Interface Controllers: Keypad, LCD Graphics Acceleration: Yes RAM Controllers: LPDDR2, LVDDR3, DDR3 Co-Processors/DSP: Multimedia; NEON™ SIMD Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (4) Ethernet: 10/100/1000Mbps (1) Supplier Device Package: 624-MAPBGA (21x21) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Core Processor: ARM® Cortex®-A9 Operating Temperature: -40°C ~ 125°C (TJ) Speed: 800MHz Mounting Type: Surface Mount Package / Case: 624-LFBGA Packaging: Tray Part Status: Active |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MCIMX6S4AVM08AC | NXP USA Inc. |
Description: IC MPU I.MX6S 800MHZ 624MAPBGASupplier Device Package: 624-MAPBGA (21x21) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Core Processor: ARM® Cortex®-A9 Operating Temperature: -40°C ~ 125°C (TJ) Speed: 800MHz Mounting Type: Surface Mount Package / Case: 624-LFBGA Packaging: Tray Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Display & Interface Controllers: Keypad, LCD Graphics Acceleration: Yes RAM Controllers: LPDDR2, LVDDR3, DDR3 Co-Processors/DSP: Multimedia; NEON™ SIMD Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (4) Ethernet: 10/100/1000Mbps (1) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MCIMX6S5DVM10AC | NXP USA Inc. |
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGAPackaging: Tray Package / Case: 624-LFBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-MAPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
auf Bestellung 247 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6S5EVM10AC | NXP USA Inc. |
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGAPart Status: Active Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Display & Interface Controllers: Keypad, LCD Graphics Acceleration: Yes RAM Controllers: LPDDR2, LVDDR3, DDR3 Co-Processors/DSP: Multimedia; NEON™ SIMD Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (4) Ethernet: 10/100/1000Mbps (1) Supplier Device Package: 624-MAPBGA (21x21) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Core Processor: ARM® Cortex®-A9 Operating Temperature: -20°C ~ 105°C (TJ) Speed: 1.0GHz Mounting Type: Surface Mount Package / Case: 624-LFBGA Packaging: Tray Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
auf Bestellung 228 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6S6AVM08AC | NXP USA Inc. |
Description: IC MPU I.MX6S 800MHZ 624MAPBGAPackaging: Tray Package / Case: 624-LFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-MAPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Part Status: Active Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
auf Bestellung 47 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6U5DVM10AC | NXP USA Inc. |
Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGAPackaging: Tray Package / Case: 624-LFBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-MAPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART Part Status: Active |
auf Bestellung 2715 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6U6AVM08AC | NXP USA Inc. |
Description: IC MPU I.MX6DL 800MHZ 624MAPBGASupplier Device Package: 624-MAPBGA (21x21) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Core Processor: ARM® Cortex®-A9 Operating Temperature: -40°C ~ 125°C (TJ) Speed: 800MHz Mounting Type: Surface Mount Package / Case: 624-LFBGA Packaging: Tray Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART Part Status: Active Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Display & Interface Controllers: Keypad, LCD Graphics Acceleration: Yes RAM Controllers: LPDDR2, LVDDR3, DDR3 Co-Processors/DSP: Multimedia; NEON™ SIMD Number of Cores/Bus Width: 2 Core, 32-Bit USB: USB 2.0 + PHY (4) Ethernet: 10/100/1000Mbps (1) |
auf Bestellung 280 Stücke: Lieferzeit 10-14 Tag (e) |
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MK20DX256VLL10 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 100LQFPSupplier Device Package: 100-LQFP (14x14) Peripherals: DMA, I2S, LVD, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 33x16b; D/A 1x12b Core Processor: ARM® Cortex®-M4 EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 64K x 8 Program Memory Size: 256KB (256K x 8) Speed: 100MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 66 |
auf Bestellung 445 Stücke: Lieferzeit 10-14 Tag (e) |
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MK63FN1M0VLQ12 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 144LQFP |
auf Bestellung 38 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MK63FN1M0VMD12 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 144MAPBGADigiKey Programmable: Not Verified Number of I/O: 95 Supplier Device Package: 144-MAPBGA (13x13) Peripherals: DMA, I2S, LVD, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 41x16b; D/A 2x12b Core Processor: ARM® Cortex®-M4 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 256K x 8 Program Memory Size: 1MB (1M x 8) Speed: 120MHz Mounting Type: Surface Mount Package / Case: 144-LBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MK64FN1M0VDC12 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 121XFBGADigiKey Programmable: Not Verified Number of I/O: 83 Part Status: Active Supplier Device Package: 121-XFBGA (8x8) Peripherals: DMA, I2S, LVD, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 37x16b; D/A 2x12b Core Processor: ARM® Cortex®-M4 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 256K x 8 Program Memory Size: 1MB (1M x 8) Speed: 120MHz Mounting Type: Surface Mount Package / Case: 121-XFBGA Packaging: Tray |
auf Bestellung 937 Stücke: Lieferzeit 10-14 Tag (e) |
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MK64FN1M0VLL12 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 100LQFPPackaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 32x16b; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 66 DigiKey Programmable: Not Verified |
auf Bestellung 1039 Stücke: Lieferzeit 10-14 Tag (e) |
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MK64FN1M0VLQ12 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 144LQFPPackaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 41x16b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 100 DigiKey Programmable: Not Verified |
auf Bestellung 875 Stücke: Lieferzeit 10-14 Tag (e) |
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MK64FN1M0VMD12 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 144MAPBGAPackaging: Tray Package / Case: 144-LBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 41x16b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 144-MAPBGA (13x13) Part Status: Active Number of I/O: 100 DigiKey Programmable: Not Verified |
auf Bestellung 659 Stücke: Lieferzeit 10-14 Tag (e) |
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MK64FX512VDC12 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 121XFBGAPackaging: Tray Package / Case: 121-XFBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 192K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 37x16b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 121-XFBGA (8x8) Number of I/O: 86 DigiKey Programmable: Not Verified |
auf Bestellung 1360 Stücke: Lieferzeit 10-14 Tag (e) |
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MK64FX512VLL12 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFPPackaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 192K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 32x16b; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 66 DigiKey Programmable: Not Verified |
auf Bestellung 479 Stücke: Lieferzeit 10-14 Tag (e) |
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MK64FX512VLQ12 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 144LQFPPackaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 192K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 41x16b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 100 DigiKey Programmable: Not Verified |
auf Bestellung 274 Stücke: Lieferzeit 10-14 Tag (e) |
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MK64FX512VMD12 | NXP USA Inc. |
Description: IC MCU 32B 512KB FLASH 144MAPBGADigiKey Programmable: Not Verified Number of I/O: 100 Supplier Device Package: 144-MAPBGA (13x13) Peripherals: DMA, I2S, LVD, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 41x16b; D/A 2x12b Core Processor: ARM® Cortex®-M4 EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 192K x 8 Program Memory Size: 512KB (512K x 8) Speed: 120MHz Mounting Type: Surface Mount Package / Case: 144-LBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 800 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MKE02Z16VLC2 | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 32LQFPDigiKey Programmable: Not Verified Number of I/O: 28 Supplier Device Package: 32-LQFP (7x7) Peripherals: LVD, PWM, WDT Connectivity: I2C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 16x12b; D/A 2x6b Core Processor: ARM® Cortex®-M0+ EEPROM Size: 256 x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 2K x 8 Program Memory Size: 16KB (16K x 8) Speed: 20MHz Mounting Type: Surface Mount Package / Case: 32-LQFP Packaging: Tray |
auf Bestellung 1500 Stücke: Lieferzeit 10-14 Tag (e) |
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MKE02Z16VLD2 | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 44LQFPDigiKey Programmable: Not Verified Number of I/O: 37 Supplier Device Package: 44-LQFP (10x10) Peripherals: LVD, PWM, WDT Connectivity: I2C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 16x12b; D/A 2x6b Core Processor: ARM® Cortex®-M0+ EEPROM Size: 256 x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 2K x 8 Program Memory Size: 16KB (16K x 8) Speed: 20MHz Mounting Type: Surface Mount Package / Case: 44-LQFP Packaging: Tray |
auf Bestellung 150 Stücke: Lieferzeit 10-14 Tag (e) |
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MKE02Z32VLC2 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32LQFPPackaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b; D/A 2x6b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
auf Bestellung 5669 Stücke: Lieferzeit 10-14 Tag (e) |
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MKE02Z64VLH2 | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 64LQFPDigiKey Programmable: Not Verified Number of I/O: 57 Supplier Device Package: 64-LQFP (10x10) Peripherals: LVD, PWM, WDT Connectivity: I2C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 16x12b; D/A 2x6b Core Processor: ARM® Cortex®-M0+ EEPROM Size: 256 x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 4K x 8 Program Memory Size: 64KB (64K x 8) Speed: 20MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tray |
auf Bestellung 738 Stücke: Lieferzeit 10-14 Tag (e) |
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MKE04Z8VFK4 | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 24QFNSpeed: 48MHz Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 22 Part Status: Active Supplier Device Package: 24-QFN (4x4) Peripherals: LVD, PWM, WDT Connectivity: I2C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 12x12b; D/A 2x6b Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 1K x 8 Program Memory Size: 8KB (8K x 8) |
auf Bestellung 705 Stücke: Lieferzeit 10-14 Tag (e) |
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MKE04Z8VTG4 | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 16TSSOPDigiKey Programmable: Not Verified Number of I/O: 14 Supplier Device Package: 16-TSSOP Packaging: Tube Peripherals: LVD, PWM, WDT Connectivity: I2C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 6x12b; D/A 2x6b Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 1K x 8 Program Memory Size: 8KB (8K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173", 4.40mm Width) |
auf Bestellung 30 Stücke: Lieferzeit 10-14 Tag (e) |
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MKE04Z8VWJ4 | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 20SOICDigiKey Programmable: Not Verified Number of I/O: 18 Part Status: Active Supplier Device Package: 20-SOIC Peripherals: LVD, PWM, WDT Connectivity: I2C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 10x12b; D/A 2x6b Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 1K x 8 Program Memory Size: 8KB (8K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 20-SOIC (0.295", 7.50mm Width) Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MMPF0100F0AEP | NXP USA Inc. |
Description: IC REG CONV I.MX6 12OUT 56HVQFNPackaging: Tray Package / Case: 56-VFQFN Exposed Pad Voltage - Output: Multiple Mounting Type: Surface Mount Number of Outputs: 12 Voltage - Input: 2.8V ~ 4.5V Operating Temperature: -40°C ~ 85°C (TA) Applications: Converter, i.MX6 Supplier Device Package: 56-HVQFN (8x8) Part Status: Active |
auf Bestellung 642 Stücke: Lieferzeit 10-14 Tag (e) |
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MMPF0100F1AEP | NXP USA Inc. |
Description: IC REG CONV I.MX6 12OUT 56HVQFNPackaging: Tray Package / Case: 56-VFQFN Exposed Pad Voltage - Output: Multiple Mounting Type: Surface Mount Number of Outputs: 12 Voltage - Input: 2.8V ~ 4.5V Operating Temperature: -40°C ~ 85°C (TA) Applications: Converter, i.MX6 Supplier Device Package: 56-HVQFN (8x8) Part Status: Active |
auf Bestellung 518 Stücke: Lieferzeit 10-14 Tag (e) |
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MMPF0100F2AEP | NXP USA Inc. |
Description: IC REG CONV I.MX6 12OUT 56HVQFNPackaging: Tray Package / Case: 56-VFQFN Exposed Pad Voltage - Output: Multiple Mounting Type: Surface Mount Number of Outputs: 12 Voltage - Input: 2.8V ~ 4.5V Operating Temperature: -40°C ~ 85°C (TA) Applications: Converter, i.MX6 Supplier Device Package: 56-HVQFN (8x8) |
auf Bestellung 260 Stücke: Lieferzeit 10-14 Tag (e) |
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MMPF0100NPAEP | NXP USA Inc. |
Description: IC REG CONV I.MX6 12OUT 56HVQFNPackaging: Tray Package / Case: 56-VFQFN Exposed Pad Voltage - Output: Multiple Mounting Type: Surface Mount Number of Outputs: 12 Voltage - Input: 2.8V ~ 4.5V Operating Temperature: -40°C ~ 85°C (TA) Applications: Converter, i.MX6 Supplier Device Package: 56-HVQFN (8x8) Part Status: Active |
auf Bestellung 1250 Stücke: Lieferzeit 10-14 Tag (e) |
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MMPF0200F0AEP | NXP USA Inc. |
Description: IC REG CONV I.MX6 11OUT 56HVQFNPackaging: Tray Package / Case: 56-VFQFN Exposed Pad Voltage - Output: Multiple Mounting Type: Surface Mount Number of Outputs: 11 Voltage - Input: 2.8V ~ 4.5V Operating Temperature: -40°C ~ 85°C (TA) Applications: Converter, i.MX6 Supplier Device Package: 56-HVQFN (8x8) |
auf Bestellung 1288 Stücke: Lieferzeit 10-14 Tag (e) |
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MMPF0200NPAEP | NXP USA Inc. |
Description: IC REG CONV I.MX6 11OUT 56HVQFNSupplier Device Package: 56-HVQFN (8x8) Applications: Converter, i.MX6 Operating Temperature: -40°C ~ 85°C (TA) Voltage - Input: 2.8V ~ 4.5V Number of Outputs: 11 Mounting Type: Surface Mount Voltage - Output: Multiple Package / Case: 56-VFQFN Exposed Pad Packaging: Tray |
auf Bestellung 270 Stücke: Lieferzeit 10-14 Tag (e) |
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P2010NSE2NHC | NXP USA Inc. |
Description: IC MPU Q OR IQ 1.2GHZ 689TEBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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P2010NSN2NHC | NXP USA Inc. |
Description: IC MPU QORIQ P2 1.2GHZ PBGA689Part Status: Obsolete Graphics Acceleration: No RAM Controllers: DDR2, DDR3 Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100/1000Mbps (3) Supplier Device Package: 689-TEPBGA II (31x31) Core Processor: PowerPC e500v2 Operating Temperature: 0°C ~ 125°C (TA) Speed: 1.2GHz Mounting Type: Surface Mount Package / Case: 689-BBGA Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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P2020NSN2NHC | NXP USA Inc. |
Description: IC MPU Q OR IQ 1.2GHZ 689TEBGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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P2041NSE7NNC | NXP USA Inc. |
Description: IC MPU QORIQ P2 1.3GHZ 780FCPBGAPart Status: Obsolete SATA: SATA 3Gbps (2) Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox Graphics Acceleration: No RAM Controllers: DDR3, DDR3L Co-Processors/DSP: Security; SEC 4.2 Number of Cores/Bus Width: 4 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100/1000Mbps (5), 10Gbps (1) Supplier Device Package: 780-FCPBGA (23x23) Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V Core Processor: PowerPC e500mc Operating Temperature: 0°C ~ 105°C (TA) Speed: 1.3GHz Mounting Type: Surface Mount Package / Case: 780-BBGA, FCBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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P2041NSN7NNC | NXP USA Inc. |
Description: IC MPU QORIQ P2 1.3GHZ 780FCPBGAAdditional Interfaces: DUART, I2C, MMC/SD, RapidIO, SPI Part Status: Obsolete SATA: SATA 3Gbps (2) Graphics Acceleration: No RAM Controllers: DDR3, DDR3L Number of Cores/Bus Width: 4 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100/1000Mbps (5), 10Gbps (1) Supplier Device Package: 780-FCPBGA (23x23) Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V Core Processor: PowerPC e500mc Operating Temperature: 0°C ~ 105°C (TA) Speed: 1.3GHz Mounting Type: Surface Mount Package / Case: 780-BFBGA, FCBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| P2041NXN7NNC | NXP USA Inc. |
Description: IC MPU QORIQ P2 1.3GHZ 780FCPBGAAdditional Interfaces: DUART, I2C, MMC/SD, RapidIO, SPI SATA: SATA 3Gbps (2) Graphics Acceleration: No RAM Controllers: DDR3, DDR3L Number of Cores/Bus Width: 4 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100/1000Mbps (5), 10Gbps (1) Supplier Device Package: 780-FCPBGA (23x23) Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V Core Processor: PowerPC e500mc Operating Temperature: -40°C ~ 105°C (TA) Speed: 1.3GHz Mounting Type: Surface Mount Package / Case: 780-BFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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P3041NSN7NNC | NXP USA Inc. |
Description: IC MPU QORIQ 1.333GHZ 1295FCPBGAPart Status: Obsolete SATA: SATA 3Gbps (2) Graphics Acceleration: No RAM Controllers: DDR3, DDR3L Number of Cores/Bus Width: 4 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100/1000Mbps (5), 10Gbps (1) Supplier Device Package: 1295-FCPBGA (37.5x37.5) Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V Core Processor: PowerPC e500mc Operating Temperature: 0°C ~ 105°C (TA) Speed: 1.333GHz Mounting Type: Surface Mount Package / Case: 1295-BBGA, FCBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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P3041NXE7PNC | NXP USA Inc. |
Description: IC MPU QORIQ P3 1.5GHZ 1295BGAAdditional Interfaces: DUART, I2C, MMC/SD, RapidIO, SPI SATA: SATA 3Gbps (2) Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox Graphics Acceleration: No RAM Controllers: DDR3, DDR3L Co-Processors/DSP: Security; SEC 4.2 Number of Cores/Bus Width: 4 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100/1000Mbps (5), 10Gbps (1) Supplier Device Package: 1295-FCPBGA (37.5x37.5) Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V Core Processor: PowerPC e500mc Operating Temperature: -40°C ~ 105°C (TA) Speed: 1.5GHz Mounting Type: Surface Mount Package / Case: 1295-BBGA, FCBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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S9S08AW16AE0VFT | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 48QFNDigiKey Programmable: Not Verified Number of I/O: 38 Supplier Device Package: 48-QFN-EP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 8x10b Core Processor: S08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 1K x 8 Program Memory Size: 16KB (16K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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S9S08AW32E7CFDE | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 48QFN Core Processor: S08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 2K x 8 Program Memory Size: 32KB (32K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 38 Supplier Device Package: 48-QFN-EP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 8x10b |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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S9S08DZ16F2VLF | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 48LQFPNumber of I/O: 39 Part Status: Active Supplier Device Package: 48-LQFP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, I²C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 16x12b Core Processor: S08 EEPROM Size: 512 x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 1K x 8 Program Memory Size: 16KB (16K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1250 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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S9S12GN16F1MLC | NXP USA Inc. |
Description: IC MCU 16BIT 16KB FLASH 32LQFP |
auf Bestellung 1230 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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S9S12GN16F1VLC | NXP USA Inc. |
Description: IC MCU 16BIT 16KB FLASH 32LQFPPackaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: 12V1 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 26 DigiKey Programmable: Not Verified |
auf Bestellung 1059 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S12GN32F0CFT | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 48QFNDigiKey Programmable: Not Verified Number of I/O: 40 Part Status: Active Supplier Device Package: 48-QFN-EP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: IrDA, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Mounting Type: Surface Mount Package / Case: 48-TFQFN Exposed Pad Packaging: Tray Core Size: 16-Bit Data Converters: A/D 8x10b Core Processor: 12V1 EEPROM Size: 1K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 2K x 8 Program Memory Size: 32KB (32K x 8) Speed: 25MHz |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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S9S12HY64J0VLL | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 100LQFPNumber of I/O: 80 Part Status: Active Supplier Device Package: 100-LQFP (14x14) Peripherals: LCD, Motor control PWM, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 8x10b Core Processor: HCS12 EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 4K x 8 Program Memory Size: 64KB (64K x 8) DigiKey Programmable: Not Verified Speed: 32MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tray |
auf Bestellung 1345 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S12P128J0VFT | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 48QFN EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 6K x 8 Program Memory Size: 128KB (128K x 8) Speed: 32MHz Mounting Type: Surface Mount Package / Case: 48-TFQFN Exposed Pad Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 34 Supplier Device Package: 48-QFN-EP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 10x12b Core Processor: HCS12 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MC34903CP5EK | NXP USA Inc. |
Description: IC SBC HIGH SPEED CAN 5V 32SOICPart Status: Obsolete Supplier Device Package: 32-SOIC-EP Current - Supply: 2mA Applications: System Basis Chip Voltage - Supply: 5.5V ~ 28V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MC34904C5EK | NXP USA Inc. |
Description: IC SBC HIGH SPEED CAN 5V 32SOIC |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 42 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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MC34905CS5EK | NXP USA Inc. |
Description: IC SBC HIGH SPEED CAN 5V 32SOIC |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 42 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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74HCT574PW/AUJ | NXP USA Inc. | Description: IC FF D-TYPE SNGL 8BIT 20TSSOP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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BGA3031J | NXP USA Inc. |
Description: IC AMP CATV 5MHZ-85MHZ 20HVQFNPart Status: Active Supplier Device Package: 20-HVQFN (5x5) Noise Figure: 3.5dB Current - Supply: 325mA Gain: 34dB Voltage - Supply: 5V RF Type: CATV Frequency: 5MHz ~ 85MHz Mounting Type: Surface Mount Package / Case: 20-VQFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 6000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| BLF8G22LS-310AVJ | NXP USA Inc. |
Description: RF MOSFET LDMOSPart Status: Active Technology: LDMOS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| MCIMX6D4AVT10AD |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 1.0GHZ 624FCBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tray
Description: IC MPU I.MX6D 1.0GHZ 624FCBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 300 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX6D5EYM10AD |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 1.0GHZ 624FCPBGA
Packaging: Tray
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6D 1.0GHZ 624FCPBGA
Packaging: Tray
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 347 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 151.02 EUR |
| 10+ | 125.69 EUR |
| 60+ | 114.66 EUR |
| 120+ | 111.68 EUR |
| MCIMX6D6AVT10AD |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 1.0GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6D 1.0GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 292 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 171.91 EUR |
| 10+ | 143.6 EUR |
| 60+ | 131.27 EUR |
| 120+ | 127.94 EUR |
| MCIMX6Q4AVT08AD |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6Q 852MHZ 624FCBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 4 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 852MHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tray
Description: IC MPU I.MX6Q 852MHZ 624FCBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 4 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 852MHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX6Q5EYM10AD |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6Q 1.0GHZ 624FCPBGA
Packaging: Tray
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6Q 1.0GHZ 624FCPBGA
Packaging: Tray
Package / Case: 624-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 151 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 225.31 EUR |
| 10+ | 189.5 EUR |
| 60+ | 173.91 EUR |
| MCIMX6Q6AVT08AD |
![]() |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6Q 852MHZ 624FCBGA
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 852MHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tray
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 4 Core, 32-Bit
Description: IC MPU I.MX6Q 852MHZ 624FCBGA
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 852MHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tray
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 4 Core, 32-Bit
auf Bestellung 58 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 138.75 EUR |
| 10+ | 133.63 EUR |
| MCIMX6Q6AVT10AD |
![]() |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6Q 1.0GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6Q 1.0GHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 253 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 304.46 EUR |
| 10+ | 258.12 EUR |
| 60+ | 237.96 EUR |
| MCIMX6S1AVM08AC |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tray
Part Status: Active
Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 300 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX6S4AVM08AC |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tray
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tray
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MCIMX6S5DVM10AC |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 247 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 103.17 EUR |
| 10+ | 84.86 EUR |
| 25+ | 80.29 EUR |
| 100+ | 75.27 EUR |
| MCIMX6S5EVM10AC |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Part Status: Active
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tray
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Part Status: Active
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tray
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 228 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 107.31 EUR |
| 10+ | 88.51 EUR |
| 60+ | 80.61 EUR |
| MCIMX6S6AVM08AC |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 47 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 103.13 EUR |
| 10+ | 84.84 EUR |
| MCIMX6U5DVM10AC |
![]() |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
auf Bestellung 2715 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 105.18 EUR |
| 10+ | 86.63 EUR |
| 60+ | 78.55 EUR |
| 120+ | 76.36 EUR |
| MCIMX6U6AVM08AC |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DL 800MHZ 624MAPBGA
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tray
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Description: IC MPU I.MX6DL 800MHZ 624MAPBGA
Supplier Device Package: 624-MAPBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 624-LFBGA
Packaging: Tray
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Part Status: Active
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
auf Bestellung 280 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 100.56 EUR |
| 10+ | 82.81 EUR |
| 60+ | 75.09 EUR |
| 120+ | 72.99 EUR |
| MK20DX256VLL10 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 33x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 66
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 33x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 66
auf Bestellung 445 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 24.53 EUR |
| 10+ | 19.27 EUR |
| 25+ | 17.95 EUR |
| 90+ | 16.6 EUR |
| 270+ | 15.77 EUR |
| MK63FN1M0VLQ12 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Description: IC MCU 32BIT 1MB FLASH 144LQFP
auf Bestellung 38 Stücke:
Lieferzeit 10-14 Tag (e)
| MK63FN1M0VMD12 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 95
Supplier Device Package: 144-MAPBGA (13x13)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 41x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 144-LBGA
Packaging: Tray
Description: IC MCU 32BIT 1MB FLASH 144MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 95
Supplier Device Package: 144-MAPBGA (13x13)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 41x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 144-LBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MK64FN1M0VDC12 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 121XFBGA
DigiKey Programmable: Not Verified
Number of I/O: 83
Part Status: Active
Supplier Device Package: 121-XFBGA (8x8)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 37x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 121-XFBGA
Packaging: Tray
Description: IC MCU 32BIT 1MB FLASH 121XFBGA
DigiKey Programmable: Not Verified
Number of I/O: 83
Part Status: Active
Supplier Device Package: 121-XFBGA (8x8)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 37x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 121-XFBGA
Packaging: Tray
auf Bestellung 937 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 25.07 EUR |
| 10+ | 20.6 EUR |
| 25+ | 20.59 EUR |
| 100+ | 20.49 EUR |
| MK64FN1M0VLL12 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 32x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 66
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 32x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 66
DigiKey Programmable: Not Verified
auf Bestellung 1039 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 40.78 EUR |
| 10+ | 32.61 EUR |
| 24+ | 30.65 EUR |
| 90+ | 28.46 EUR |
| 270+ | 27.18 EUR |
| 450+ | 26.7 EUR |
| MK64FN1M0VLQ12 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 41x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 41x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 100
DigiKey Programmable: Not Verified
auf Bestellung 875 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 42.41 EUR |
| 10+ | 33.95 EUR |
| 60+ | 30.27 EUR |
| 120+ | 29.27 EUR |
| 540+ | 27.68 EUR |
| MK64FN1M0VMD12 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 41x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Part Status: Active
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 41x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Part Status: Active
Number of I/O: 100
DigiKey Programmable: Not Verified
auf Bestellung 659 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 42.74 EUR |
| 10+ | 34.22 EUR |
| 50+ | 30.82 EUR |
| 100+ | 29.76 EUR |
| 160+ | 29.16 EUR |
| 640+ | 27.76 EUR |
| MK64FX512VDC12 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 121XFBGA
Packaging: Tray
Package / Case: 121-XFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 37x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-XFBGA (8x8)
Number of I/O: 86
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLSH 121XFBGA
Packaging: Tray
Package / Case: 121-XFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 37x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-XFBGA (8x8)
Number of I/O: 86
DigiKey Programmable: Not Verified
auf Bestellung 1360 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 31.48 EUR |
| 10+ | 24.99 EUR |
| 25+ | 23.37 EUR |
| 100+ | 21.59 EUR |
| 348+ | 20.48 EUR |
| 696+ | 20.02 EUR |
| MK64FX512VLL12 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 32x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 66
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 32x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 66
DigiKey Programmable: Not Verified
auf Bestellung 479 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 30.54 EUR |
| 10+ | 24.2 EUR |
| 24+ | 22.69 EUR |
| 90+ | 21 EUR |
| 270+ | 20 EUR |
| 450+ | 19.64 EUR |
| MK64FX512VLQ12 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 41x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 41x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
auf Bestellung 274 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 32.33 EUR |
| 10+ | 25.69 EUR |
| 60+ | 22.8 EUR |
| 120+ | 22.02 EUR |
| MK64FX512VMD12 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 144MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 100
Supplier Device Package: 144-MAPBGA (13x13)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 41x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 192K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 144-LBGA
Packaging: Tray
Description: IC MCU 32B 512KB FLASH 144MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 100
Supplier Device Package: 144-MAPBGA (13x13)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 41x16b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 192K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 144-LBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 800 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MKE02Z16VLC2 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32LQFP
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Description: IC MCU 32BIT 16KB FLASH 32LQFP
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5+ | 5.21 EUR |
| 10+ | 3.26 EUR |
| 25+ | 2.93 EUR |
| 100+ | 2.88 EUR |
| 250+ | 2.83 EUR |
| 500+ | 2.67 EUR |
| MKE02Z16VLD2 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 44LQFP
DigiKey Programmable: Not Verified
Number of I/O: 37
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tray
Description: IC MCU 32BIT 16KB FLASH 44LQFP
DigiKey Programmable: Not Verified
Number of I/O: 37
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tray
auf Bestellung 150 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 5.37 EUR |
| 10+ | 3.7 EUR |
| 25+ | 3.52 EUR |
| MKE02Z32VLC2 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 5669 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 7.41 EUR |
| 10+ | 5.59 EUR |
| 25+ | 5.14 EUR |
| 100+ | 4.64 EUR |
| 250+ | 4.4 EUR |
| 500+ | 4.26 EUR |
| 1000+ | 4.14 EUR |
| 2500+ | 4.02 EUR |
| MKE02Z64VLH2 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 57
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Description: IC MCU 32BIT 64KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 57
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
auf Bestellung 738 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 9.29 EUR |
| 10+ | 7.09 EUR |
| 25+ | 6.53 EUR |
| 160+ | 5.76 EUR |
| 320+ | 5.56 EUR |
| 640+ | 5.4 EUR |
| MKE04Z8VFK4 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 24QFN
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 22
Part Status: Active
Supplier Device Package: 24-QFN (4x4)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Description: IC MCU 32BIT 8KB FLASH 24QFN
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 22
Part Status: Active
Supplier Device Package: 24-QFN (4x4)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
auf Bestellung 705 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 10+ | 2.23 EUR |
| 11+ | 2.08 EUR |
| 25+ | 2.06 EUR |
| 100+ | 2.03 EUR |
| MKE04Z8VTG4 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 14
Supplier Device Package: 16-TSSOP
Packaging: Tube
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 6x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Description: IC MCU 32BIT 8KB FLASH 16TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 14
Supplier Device Package: 16-TSSOP
Packaging: Tube
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 6x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
auf Bestellung 30 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6+ | 3.72 EUR |
| 10+ | 2.74 EUR |
| MKE04Z8VWJ4 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 20SOIC
DigiKey Programmable: Not Verified
Number of I/O: 18
Part Status: Active
Supplier Device Package: 20-SOIC
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 10x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Description: IC MCU 32BIT 8KB FLASH 20SOIC
DigiKey Programmable: Not Verified
Number of I/O: 18
Part Status: Active
Supplier Device Package: 20-SOIC
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 10x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MMPF0100F0AEP |
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Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
auf Bestellung 642 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 18.05 EUR |
| 10+ | 14.04 EUR |
| 25+ | 13.04 EUR |
| 100+ | 11.95 EUR |
| 260+ | 11.4 EUR |
| 520+ | 11.09 EUR |
| MMPF0100F1AEP |
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Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
auf Bestellung 518 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 16.45 EUR |
| 10+ | 12.78 EUR |
| 25+ | 11.88 EUR |
| 100+ | 10.86 EUR |
| 260+ | 10.38 EUR |
| MMPF0100F2AEP |
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Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 16.31 EUR |
| 10+ | 12.7 EUR |
| 25+ | 11.78 EUR |
| 100+ | 10.79 EUR |
| 260+ | 10.29 EUR |
| MMPF0100NPAEP |
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Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Description: IC REG CONV I.MX6 12OUT 56HVQFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 12
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 16.45 EUR |
| 10+ | 12.78 EUR |
| 25+ | 11.88 EUR |
| 100+ | 10.86 EUR |
| 260+ | 10.38 EUR |
| 520+ | 10.09 EUR |
| 1040+ | 9.85 EUR |
| MMPF0200F0AEP |
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Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 11OUT 56HVQFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 11
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
Description: IC REG CONV I.MX6 11OUT 56HVQFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 11
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-HVQFN (8x8)
auf Bestellung 1288 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 12.71 EUR |
| 10+ | 9.85 EUR |
| 25+ | 9.14 EUR |
| 100+ | 8.35 EUR |
| 260+ | 8.09 EUR |
| MMPF0200NPAEP |
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Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 11OUT 56HVQFN
Supplier Device Package: 56-HVQFN (8x8)
Applications: Converter, i.MX6
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Input: 2.8V ~ 4.5V
Number of Outputs: 11
Mounting Type: Surface Mount
Voltage - Output: Multiple
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
Description: IC REG CONV I.MX6 11OUT 56HVQFN
Supplier Device Package: 56-HVQFN (8x8)
Applications: Converter, i.MX6
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Input: 2.8V ~ 4.5V
Number of Outputs: 11
Mounting Type: Surface Mount
Voltage - Output: Multiple
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 270 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 14.96 EUR |
| 10+ | 11.59 EUR |
| 25+ | 10.76 EUR |
| 100+ | 9.83 EUR |
| 260+ | 9.38 EUR |
| P2010NSE2NHC |
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Hersteller: NXP USA Inc.
Description: IC MPU Q OR IQ 1.2GHZ 689TEBGA
Description: IC MPU Q OR IQ 1.2GHZ 689TEBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| P2010NSN2NHC |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 689-TEPBGA II (31x31)
Core Processor: PowerPC e500v2
Operating Temperature: 0°C ~ 125°C (TA)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 689-TEPBGA II (31x31)
Core Processor: PowerPC e500v2
Operating Temperature: 0°C ~ 125°C (TA)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| P2020NSN2NHC |
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Hersteller: NXP USA Inc.
Description: IC MPU Q OR IQ 1.2GHZ 689TEBGA
Description: IC MPU Q OR IQ 1.2GHZ 689TEBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| P2041NSE7NNC |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P2 1.3GHZ 780FCPBGA
Part Status: Obsolete
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Security; SEC 4.2
Number of Cores/Bus Width: 4 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
Supplier Device Package: 780-FCPBGA (23x23)
Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500mc
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.3GHz
Mounting Type: Surface Mount
Package / Case: 780-BBGA, FCBGA
Packaging: Tray
Description: IC MPU QORIQ P2 1.3GHZ 780FCPBGA
Part Status: Obsolete
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Security; SEC 4.2
Number of Cores/Bus Width: 4 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
Supplier Device Package: 780-FCPBGA (23x23)
Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500mc
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.3GHz
Mounting Type: Surface Mount
Package / Case: 780-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| P2041NSN7NNC |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P2 1.3GHZ 780FCPBGA
Additional Interfaces: DUART, I2C, MMC/SD, RapidIO, SPI
Part Status: Obsolete
SATA: SATA 3Gbps (2)
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Number of Cores/Bus Width: 4 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
Supplier Device Package: 780-FCPBGA (23x23)
Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500mc
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.3GHz
Mounting Type: Surface Mount
Package / Case: 780-BFBGA, FCBGA
Packaging: Tray
Description: IC MPU QORIQ P2 1.3GHZ 780FCPBGA
Additional Interfaces: DUART, I2C, MMC/SD, RapidIO, SPI
Part Status: Obsolete
SATA: SATA 3Gbps (2)
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Number of Cores/Bus Width: 4 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
Supplier Device Package: 780-FCPBGA (23x23)
Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500mc
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.3GHz
Mounting Type: Surface Mount
Package / Case: 780-BFBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| P2041NXN7NNC |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P2 1.3GHZ 780FCPBGA
Additional Interfaces: DUART, I2C, MMC/SD, RapidIO, SPI
SATA: SATA 3Gbps (2)
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Number of Cores/Bus Width: 4 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
Supplier Device Package: 780-FCPBGA (23x23)
Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500mc
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.3GHz
Mounting Type: Surface Mount
Package / Case: 780-BFBGA
Packaging: Tray
Description: IC MPU QORIQ P2 1.3GHZ 780FCPBGA
Additional Interfaces: DUART, I2C, MMC/SD, RapidIO, SPI
SATA: SATA 3Gbps (2)
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Number of Cores/Bus Width: 4 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
Supplier Device Package: 780-FCPBGA (23x23)
Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500mc
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.3GHz
Mounting Type: Surface Mount
Package / Case: 780-BFBGA
Packaging: Tray
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| P3041NSN7NNC |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.333GHZ 1295FCPBGA
Part Status: Obsolete
SATA: SATA 3Gbps (2)
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Number of Cores/Bus Width: 4 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500mc
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.333GHz
Mounting Type: Surface Mount
Package / Case: 1295-BBGA, FCBGA
Packaging: Tray
Description: IC MPU QORIQ 1.333GHZ 1295FCPBGA
Part Status: Obsolete
SATA: SATA 3Gbps (2)
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Number of Cores/Bus Width: 4 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500mc
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.333GHz
Mounting Type: Surface Mount
Package / Case: 1295-BBGA, FCBGA
Packaging: Tray
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| P3041NXE7PNC |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P3 1.5GHZ 1295BGA
Additional Interfaces: DUART, I2C, MMC/SD, RapidIO, SPI
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Security; SEC 4.2
Number of Cores/Bus Width: 4 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500mc
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.5GHz
Mounting Type: Surface Mount
Package / Case: 1295-BBGA, FCBGA
Packaging: Tray
Description: IC MPU QORIQ P3 1.5GHZ 1295BGA
Additional Interfaces: DUART, I2C, MMC/SD, RapidIO, SPI
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Security; SEC 4.2
Number of Cores/Bus Width: 4 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500mc
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.5GHz
Mounting Type: Surface Mount
Package / Case: 1295-BBGA, FCBGA
Packaging: Tray
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| S9S08AW16AE0VFT |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48QFN
DigiKey Programmable: Not Verified
Number of I/O: 38
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Description: IC MCU 8BIT 16KB FLASH 48QFN
DigiKey Programmable: Not Verified
Number of I/O: 38
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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| S9S08AW32E7CFDE |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48QFN
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 38
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Description: IC MCU 8BIT 32KB FLASH 48QFN
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 38
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Produkt ist nicht verfügbar
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| S9S08DZ16F2VLF |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Number of I/O: 39
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Number of I/O: 39
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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| S9S12GN16F1MLC |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 32LQFP
Description: IC MCU 16BIT 16KB FLASH 32LQFP
auf Bestellung 1230 Stücke:
Lieferzeit 10-14 Tag (e)
| S9S12GN16F1VLC |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 1059 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 9.12 EUR |
| 10+ | 6.94 EUR |
| 25+ | 6.39 EUR |
| 100+ | 5.8 EUR |
| 250+ | 5.51 EUR |
| 500+ | 5.33 EUR |
| S9S12GN32F0CFT |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48QFN
DigiKey Programmable: Not Verified
Number of I/O: 40
Part Status: Active
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Mounting Type: Surface Mount
Package / Case: 48-TFQFN Exposed Pad
Packaging: Tray
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: 12V1
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 25MHz
Description: IC MCU 16BIT 32KB FLASH 48QFN
DigiKey Programmable: Not Verified
Number of I/O: 40
Part Status: Active
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Mounting Type: Surface Mount
Package / Case: 48-TFQFN Exposed Pad
Packaging: Tray
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: 12V1
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 25MHz
Produkt ist nicht verfügbar
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| S9S12HY64J0VLL |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 100LQFP
Number of I/O: 80
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: HCS12
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
DigiKey Programmable: Not Verified
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Description: IC MCU 16BIT 64KB FLASH 100LQFP
Number of I/O: 80
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: HCS12
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
DigiKey Programmable: Not Verified
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
auf Bestellung 1345 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 25.18 EUR |
| 10+ | 19.81 EUR |
| 24+ | 18.53 EUR |
| 80+ | 17.2 EUR |
| 230+ | 16.35 EUR |
| 450+ | 15.93 EUR |
| S9S12P128J0VFT |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48QFN
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 6K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-TFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 34
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 10x12b
Core Processor: HCS12
Description: IC MCU 16BIT 128KB FLASH 48QFN
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 6K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-TFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 34
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 10x12b
Core Processor: HCS12
Produkt ist nicht verfügbar
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| MC34903CP5EK |
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Hersteller: NXP USA Inc.
Description: IC SBC HIGH SPEED CAN 5V 32SOIC
Part Status: Obsolete
Supplier Device Package: 32-SOIC-EP
Current - Supply: 2mA
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
Description: IC SBC HIGH SPEED CAN 5V 32SOIC
Part Status: Obsolete
Supplier Device Package: 32-SOIC-EP
Current - Supply: 2mA
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
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| MC34904C5EK |
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Hersteller: NXP USA Inc.
Description: IC SBC HIGH SPEED CAN 5V 32SOIC
Description: IC SBC HIGH SPEED CAN 5V 32SOIC
Produkt ist nicht verfügbar
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| MC34905CS5EK |
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Hersteller: NXP USA Inc.
Description: IC SBC HIGH SPEED CAN 5V 32SOIC
Description: IC SBC HIGH SPEED CAN 5V 32SOIC
Produkt ist nicht verfügbar
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| 74HCT574PW/AUJ |
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
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| BGA3031J |
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Hersteller: NXP USA Inc.
Description: IC AMP CATV 5MHZ-85MHZ 20HVQFN
Part Status: Active
Supplier Device Package: 20-HVQFN (5x5)
Noise Figure: 3.5dB
Current - Supply: 325mA
Gain: 34dB
Voltage - Supply: 5V
RF Type: CATV
Frequency: 5MHz ~ 85MHz
Mounting Type: Surface Mount
Package / Case: 20-VQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC AMP CATV 5MHZ-85MHZ 20HVQFN
Part Status: Active
Supplier Device Package: 20-HVQFN (5x5)
Noise Figure: 3.5dB
Current - Supply: 325mA
Gain: 34dB
Voltage - Supply: 5V
RF Type: CATV
Frequency: 5MHz ~ 85MHz
Mounting Type: Surface Mount
Package / Case: 20-VQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| BLF8G22LS-310AVJ |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS
Part Status: Active
Technology: LDMOS
Packaging: Tape & Reel (TR)
Description: RF MOSFET LDMOS
Part Status: Active
Technology: LDMOS
Packaging: Tape & Reel (TR)
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