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ADC1003S030TS/C1:1 ADC1003S030TS/C1:1 NXP USA Inc. ADC1003S030_040_050.pdf Description: IC ADC 10BIT 28SSOP
Packaging: Bulk
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Bits: 10
Configuration: ADC
Data Interface: Parallel
Reference Type: Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Sampling Rate (Per Second): 30M
Input Type: Single Ended
Number of Inputs: 1
Supplier Device Package: 28-SSOP
Number of A/D Converters: 1
Produkt ist nicht verfügbar
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ADC1003S040TS/C1:1 ADC1003S040TS/C1:1 NXP USA Inc. ADC1003S030_040_050.pdf Description: IC ADC 10BIT 28SSOP
Packaging: Bulk
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Bits: 10
Configuration: ADC
Data Interface: Parallel
Reference Type: Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Sampling Rate (Per Second): 40M
Input Type: Single Ended
Number of Inputs: 1
Supplier Device Package: 28-SSOP
Part Status: Obsolete
Number of A/D Converters: 1
Produkt ist nicht verfügbar
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ADC1003S050TS/C1:1 ADC1003S050TS/C1:1 NXP USA Inc. ADC1003S030_040_050.pdf Description: IC ADC 10BIT 28SSOP
Packaging: Bulk
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Bits: 10
Configuration: ADC
Data Interface: Parallel
Reference Type: Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Sampling Rate (Per Second): 50M
Input Type: Single Ended
Number of Inputs: 1
Supplier Device Package: 28-SSOP
Number of A/D Converters: 1
Produkt ist nicht verfügbar
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ADC1004S030TS/C1:1 ADC1004S030TS/C1:1 NXP USA Inc. ADC1004S050TS-C1-1-2752d47e94cf5451.pdf Description: IC ADC 10BIT 28SSOP
Packaging: Bulk
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Bits: 10
Configuration: ADC
Data Interface: Parallel
Reference Type: External
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Sampling Rate (Per Second): 30M
Input Type: Single Ended
Number of Inputs: 1
Supplier Device Package: 28-SSOP
Number of A/D Converters: 1
Produkt ist nicht verfügbar
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ADC1004S040TS/C1:1 ADC1004S040TS/C1:1 NXP USA Inc. ADC1004S050TS-C1-1-2752d47e94cf5451.pdf Description: IC ADC 10BIT 28SSOP
Packaging: Bulk
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Bits: 10
Configuration: ADC
Data Interface: Parallel
Reference Type: External
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Sampling Rate (Per Second): 40M
Input Type: Single Ended
Number of Inputs: 1
Supplier Device Package: 28-SSOP
Number of A/D Converters: 1
Produkt ist nicht verfügbar
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ADC1004S050TS/C1:1 ADC1004S050TS/C1:1 NXP USA Inc. ADC1004S050TS-C1-1-2752d47e94cf5451.pdf Description: IC ADC 10BIT 28SSOP
Packaging: Bulk
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Bits: 10
Configuration: ADC
Data Interface: Parallel
Reference Type: External
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Sampling Rate (Per Second): 50M
Input Type: Single Ended
Number of Inputs: 1
Supplier Device Package: 28-SSOP
Part Status: Obsolete
Number of A/D Converters: 1
Produkt ist nicht verfügbar
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ADC1005S060TS/C1:1 ADC1005S060TS/C1:1 NXP USA Inc. ADC1005S060.pdf Description: IC ADC 10BIT 28SSOP
Packaging: Bulk
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Bits: 10
Configuration: ADC
Data Interface: Parallel
Reference Type: External
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Sampling Rate (Per Second): 60M
Input Type: Single Ended
Number of Inputs: 1
Supplier Device Package: 28-SSOP
Number of A/D Converters: 1
Produkt ist nicht verfügbar
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ADC1207S080HW/C1:5 ADC1207S080HW/C1:5 NXP USA Inc. DS_568_ADC1207S080.pdf Description: IC ADC 12BIT 48HTQFP
Packaging: Tray
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Number of Bits: 12
Configuration: S/H-ADC
Data Interface: Parallel
Reference Type: Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Sampling Rate (Per Second): 80M
Input Type: Differential
Number of Inputs: 1
Supplier Device Package: 48-HTQFP (7x7)
Ratio - S/H:ADC: 1:1
Part Status: Obsolete
Number of A/D Converters: 1
Produkt ist nicht verfügbar
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74ABT273AD,118 74ABT273AD,118 NXP USA Inc. 74ABT273A.pdf Description: IC FF D-TYPE SNGL 8BIT 20SO
Produkt ist nicht verfügbar
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GTL2010PW,118 GTL2010PW,118 NXP USA Inc. GTL2010.pdf Description: IC TRANSLATOR BIDIR 24TSSOP
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 24-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 10
Voltage - VCCA: 1 V ~ 5.5 V
Voltage - VCCB: 1 V ~ 5.5 V
Number of Circuits: 1
Produkt ist nicht verfügbar
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PCA9554ADB,118 PCA9554ADB,118 NXP USA Inc. PCA9554_9554A.pdf Description: IC XPNDR 400KHZ I2C SMBUS 16SSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-SSOP
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCF8563TS/4,118 PCF8563TS/4,118 NXP USA Inc. PCF8563.pdf Description: IC RTC CLK/CALENDAR I2C 8TSSOP
Features: Alarm, Leap Year, Watchdog Timer
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1V ~ 5.5V
Time Format: HH:MM:SS (24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 8-TSSOP
Current - Timekeeping (Max): 0.6µA ~ 0.75µA @ 2V ~ 5V
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 175 Stücke:
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10+1.82 EUR
25+1.65 EUR
100+1.47 EUR
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MF1FCP2S50/DH,118 MF1FCP2S50/DH,118 NXP USA Inc. MF1FCP2S50.pdf Description: IC RFID TRANSP 13.56MHZ 2FCP
Produkt ist nicht verfügbar
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MPC5567EVBE MPC5567EVBE NXP USA Inc. MPC5567.pdf Description: MPC5567 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Power Supply, USB Multilink Programmer
Core Processor: e200
Utilized IC / Part: MPC5567
Produkt ist nicht verfügbar
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LPC2157FBD100,551 LPC2157FBD100,551 NXP USA Inc. LPC2157_2158.pdf Description: IC MCU 16/32B 512KB FLSH 100LQFP
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LPC2361FBD100,551 LPC2361FBD100,551 NXP USA Inc. LPC2361_62.pdf Description: IC MCU 16/32B 64KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 34K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 6x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Not For New Designs
Number of I/O: 70
DigiKey Programmable: Not Verified
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LPC2362FBD100,551 LPC2362FBD100,551 NXP USA Inc. LPC2361_62.pdf Description: IC MCU 16/32B 128KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 58K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 6x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 70
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2420FBD208,551 LPC2420FBD208,551 NXP USA Inc. LPC2420_60.pdf Description: IC MCU 16/32BIT ROMLESS 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
RAM Size: 82K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC3220FET296,551 LPC3220FET296,551 NXP USA Inc. LPC3220_30_40_50.pdf Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Produkt ist nicht verfügbar
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LPC3230FET296,551 LPC3230FET296,551 NXP USA Inc. LPC3220_30_40_50.pdf Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Tray
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I²S, LCD, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Part Status: Obsolete
Number of I/O: 51
Produkt ist nicht verfügbar
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LPC3240FET296,551 LPC3240FET296,551 NXP USA Inc. LPC3220_30_40_50.pdf Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Tray
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I2S, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC3250FET296,551 LPC3250FET296,551 NXP USA Inc. LPC3220_30_40_50.pdf Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Tray
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I2S, LCD, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Part Status: Obsolete
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BGY588C,112 BGY588C,112 NXP USA Inc. BGY588C.pdf Description: IC AMP CATV SOT115J
Packaging: Tube
Package / Case: SOT-115J
Output Type: Push-Pull
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Part Status: Obsolete
Number of Circuits: 1
Current - Supply: 325 mA
Produkt ist nicht verfügbar
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PCF2123TS/1,118 PCF2123TS/1,118 NXP USA Inc. PCF2123.pdf Description: IC RTC CLK/CALENDAR SPI 14TSSOP
Packaging: Tape & Reel (TR)
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: SPI
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.6V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 14-TSSOP
Current - Timekeeping (Max): 0.33µA ~ 0.38µA @ 2V ~ 5V
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 17500 Stücke:
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5000+1.04 EUR
7500+1.03 EUR
12500+1.01 EUR
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PCF2123TS/1,118 PCF2123TS/1,118 NXP USA Inc. PCF2123.pdf Description: IC RTC CLK/CALENDAR SPI 14TSSOP
Packaging: Cut Tape (CT)
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: SPI
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.6V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 14-TSSOP
Current - Timekeeping (Max): 0.33µA ~ 0.38µA @ 2V ~ 5V
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 19638 Stücke:
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9+2.16 EUR
12+1.58 EUR
25+1.43 EUR
100+1.27 EUR
250+1.19 EUR
500+1.14 EUR
1000+1.1 EUR
Mindestbestellmenge: 9
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74ABT541DB,118 74ABT541DB,118 NXP USA Inc. DS_568_74ABT541.pdf Description: IC BUFF NON-INVERT 5.5V 20SSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-SSOP
Produkt ist nicht verfügbar
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74HC147D,653 74HC147D,653 NXP USA Inc. 74HC%28T%29147.pdf Description: IC PRIORITY ENCOD 1 X 10:4 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 10:4
Type: Priority Encoder
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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74HCT640D,653 74HCT640D,653 NXP USA Inc. 74HC(T)640.pdf Description: IC TRANSCEIVER INVERT 5.5V 20SO
Produkt ist nicht verfügbar
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74LVCH162244ADGG:5 74LVCH162244ADGG:5 NXP USA Inc. 74LVC(H)162244A_Rev6_2017.pdf Description: IC BUF NON-INVERT 3.6V 48TSSOP
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 48-TSSOP
Produkt ist nicht verfügbar
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74LVT574PW,118 74LVT574PW,118 NXP USA Inc. 74LVT%28H%29574.pdf Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Current - Quiescent (Iq): 190 µA
Current - Output High, Low: 32mA, 64mA
Trigger Type: Positive Edge
Clock Frequency: 150 MHz
Input Capacitance: 4 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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N74F138D,623 N74F138D,623 NXP USA Inc. DS_568_74F138.pdf Description: IC DECODER/DEMUX 1 X 3:8 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 1mA, 20mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC44CC375AVEFEVK NXP USA Inc. MC44CC375AV.pdf Description: CCEVK NEJA EVAL KIT
Packaging: Bulk
For Use With/Related Products: MC44CC375AV
Type: Modulator
Contents: Board(s)
Utilized IC / Part: MC44CC375AV
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
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2N7002T,215 2N7002T,215 NXP USA Inc. 2N7002T_1.pdf Description: MOSFET N-CH 60V 300MA TO236AB
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 300mA (Ta)
Rds On (Max) @ Id, Vgs: 5Ohm @ 500mA, 10V
Power Dissipation (Max): 830mW (Ta)
Vgs(th) (Max) @ Id: 2.5V @ 1mA
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Input Capacitance (Ciss) (Max) @ Vds: 40 pF @ 10 V
Produkt ist nicht verfügbar
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74AUP1G32GW/DG,125 74AUP1G32GW/DG,125 NXP USA Inc. 74AUP1G32.pdf Description: IC GATE OR 1CH 2-INP 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 5-TSSOP
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 6.4ns @ 3.3V, 30pF
Part Status: Obsolete
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
Produkt ist nicht verfügbar
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74HCT423BQ,115 74HCT423BQ,115 NXP USA Inc. 74HC_HCT423_Rev_6.pdf Description: IC MULTIVIBRATOR 22NS 16DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 22 ns
Independent Circuits: 2
Current - Output High, Low: 4mA, 4mA
Schmitt Trigger Input: No
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Voltage - Supply: 4.5 V ~ 5.5 V
Produkt ist nicht verfügbar
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74LV259BQ,115 74LV259BQ,115 NXP USA Inc. 74LV259.pdf Description: IC D-TYPE ADDR 1:8 16-DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Output Type: Standard
Mounting Type: Surface Mount
Circuit: 1:8
Logic Type: D-Type, Addressable
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 6mA, 6mA
Delay Time - Propagation: 36ns
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Part Status: Obsolete
Produkt ist nicht verfügbar
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74LV32BQ,115 74LV32BQ,115 NXP USA Inc. 74LV32.pdf Description: IC GATE OR 4CH 2-INP 14DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 14-VFQFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 2
Supplier Device Package: 14-DHVQFN (2.5x3)
Input Logic Level - High: 0.9V ~ 2V
Input Logic Level - Low: 0.3V ~ 0.8V
Max Propagation Delay @ V, Max CL: 8ns @ 3.3V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
Produkt ist nicht verfügbar
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74LV86BQ,115 74LV86BQ,115 NXP USA Inc. 74LV86_Rev3_2017.pdf Description: IC GATE XOR 4CH 2-INP 14DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 14-VFQFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 2
Supplier Device Package: 14-DHVQFN (2.5x3)
Input Logic Level - High: 0.9V ~ 2V
Input Logic Level - Low: 0.3V ~ 0.8V
Max Propagation Delay @ V, Max CL: 13ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
Produkt ist nicht verfügbar
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74LVC126APW/DG,118 74LVC126APW/DG,118 NXP USA Inc. Description: IC BUF NON-INVERT 3.6V 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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74LVC1G07GW/DG,125 74LVC1G07GW/DG,125 NXP USA Inc. 74LVC1G07.pdf Description: IC BUFF NON-INVERT 5.5V 5-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 5-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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74LVC1G08GW/DG,125 74LVC1G08GW/DG,125 NXP USA Inc. Description: IC GATE AND 1CH 2-INP 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: 5-TSSOP
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 1
Current - Quiescent (Max): 200 µA
Produkt ist nicht verfügbar
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74LVC1G125GW/DG,12 74LVC1G125GW/DG,12 NXP USA Inc. PHGLS28878-1.pdf?t.download=true&u=5oefqw Description: IC BUFF NON-INVERT 5.5V 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 32mA
Supplier Device Package: 5-TSSOP
Produkt ist nicht verfügbar
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74LVC1G32GW/DG,125 74LVC1G32GW/DG,125 NXP USA Inc. Description: IC GATE OR 1CH 2-INP 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: 5-TSSOP
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 1.7ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 200 µA
Produkt ist nicht verfügbar
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74LVCH32244AEC/G;5 74LVCH32244AEC/G;5 NXP USA Inc. 74LVCH32244A.pdf Description: IC BUF NON-INVERT 3.6V 96LFBGA
Packaging: Tray
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 8
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
Produkt ist nicht verfügbar
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74LVCH32244AEC/G:5 74LVCH32244AEC/G:5 NXP USA Inc. 74LVCH32244A.pdf Description: IC BUF NON-INVERT 3.6V 96LFBGA
Packaging: Tray
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 8
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
Produkt ist nicht verfügbar
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74LVCH32244AEC/G,5 74LVCH32244AEC/G,5 NXP USA Inc. 74LVCH32244A.pdf Description: IC BUF NON-INVERT 3.6V 96LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 8
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
Produkt ist nicht verfügbar
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74LVCH32245AEC/G;5 74LVCH32245AEC/G;5 NXP USA Inc. 74LVCH32245A.pdf Description: IC TXRX NON-INVERT 3.6V 96LFBGA
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74LVCH32245AEC/G:5 74LVCH32245AEC/G:5 NXP USA Inc. 74LVCH32245A.pdf Description: IC TXRX NON-INVERT 3.6V 96LFBGA
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74LVCH32374AEC/G,5 74LVCH32374AEC/G,5 NXP USA Inc. 74LVCH32374A.pdf Description: IC FF D-TYPE QUAD 8BIT 96LFBGA
Produkt ist nicht verfügbar
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74LVT32374EC/G,518 74LVT32374EC/G,518 NXP USA Inc. 74LVT32374.pdf Description: IC FF D-TYPE QUAD 8BIT 96LFBGA
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74LVT574BQ,115 74LVT574BQ,115 NXP USA Inc. 74LVT(H)574.pdf Description: IC FF D-TYPE SNGL 8BIT 20DHVQFN
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74LVTH322245EC,557 74LVTH322245EC,557 NXP USA Inc. 74LVTH322245.pdf Description: IC TXRX NON-INVERT 3.6V 96LFBGA
Packaging: Tray
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
Produkt ist nicht verfügbar
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74LVTH322245EC,518 74LVTH322245EC,518 NXP USA Inc. 74LVTH322245.pdf Description: IC TXRX NON-INVERT 3.6V 96LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
Produkt ist nicht verfügbar
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74LVU04BQ,115 74LVU04BQ,115 NXP USA Inc. 74LVU04.pdf Description: IC INVERTER 6CH 6-INP 14DHVQFN
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ADC1207S080HW/C1,1 ADC1207S080HW/C1,1 NXP USA Inc. ADC1207S080.pdf Description: IC ADC 12BIT 48HTQFP
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BAP1321LX,315 BAP1321LX,315 NXP USA Inc. BAP1321LX.pdf Description: RF DIODE PIN 60V 130MW 2DFN
Packaging: Tape & Reel (TR)
Package / Case: 2-XDFN
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.28pF @ 20V, 1MHz
Resistance @ If, F: 1.3Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: DFN1006D-2
Current - Max: 100 mA
Power Dissipation (Max): 130 mW
Produkt ist nicht verfügbar
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BAP142LX,315 BAP142LX,315 NXP USA Inc. BAP142LX.pdf Description: RF DIODE PIN 50V 130MW SOD2
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.26pF @ 20V, 1MHz
Resistance @ If, F: 1.3Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOD2
Current - Max: 100 mA
Power Dissipation (Max): 130 mW
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BAP50LX,315 BAP50LX,315 NXP USA Inc. BAP50LX.pdf Description: RF DIODE PIN 50V 150MW SOD2
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Resistance @ If, F: 3Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOD2
Current - Max: 50 mA
Power Dissipation (Max): 150 mW
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BAP51LX,315 BAP51LX,315 NXP USA Inc. BAP51LX.pdf Description: RF DIODE PIN 60V 140MW SOD2
Packaging: Tape & Reel (TR)
Package / Case: 2-XDFN
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 5V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: DFN1006D-2
Current - Max: 100 mA
Power Dissipation (Max): 140 mW
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BAP55LX,315 BAP55LX,315 NXP USA Inc. BAP55LX.pdf Description: RF DIODE PIN 50V 135MW DFN1006D2
Packaging: Tape & Reel (TR)
Package / Case: 2-XDFN
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.28pF @ 20V, 1MHz
Resistance @ If, F: 800mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: DFN1006D-2
Part Status: Active
Current - Max: 100 mA
Power Dissipation (Max): 135 mW
auf Bestellung 10000 Stücke:
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10000+0.22 EUR
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ADC1003S030TS/C1:1 ADC1003S030_040_050.pdf
ADC1003S030TS/C1:1
Hersteller: NXP USA Inc.
Description: IC ADC 10BIT 28SSOP
Packaging: Bulk
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Bits: 10
Configuration: ADC
Data Interface: Parallel
Reference Type: Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Sampling Rate (Per Second): 30M
Input Type: Single Ended
Number of Inputs: 1
Supplier Device Package: 28-SSOP
Number of A/D Converters: 1
Produkt ist nicht verfügbar
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ADC1003S040TS/C1:1 ADC1003S030_040_050.pdf
ADC1003S040TS/C1:1
Hersteller: NXP USA Inc.
Description: IC ADC 10BIT 28SSOP
Packaging: Bulk
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Bits: 10
Configuration: ADC
Data Interface: Parallel
Reference Type: Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Sampling Rate (Per Second): 40M
Input Type: Single Ended
Number of Inputs: 1
Supplier Device Package: 28-SSOP
Part Status: Obsolete
Number of A/D Converters: 1
Produkt ist nicht verfügbar
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ADC1003S050TS/C1:1 ADC1003S030_040_050.pdf
ADC1003S050TS/C1:1
Hersteller: NXP USA Inc.
Description: IC ADC 10BIT 28SSOP
Packaging: Bulk
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Bits: 10
Configuration: ADC
Data Interface: Parallel
Reference Type: Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Sampling Rate (Per Second): 50M
Input Type: Single Ended
Number of Inputs: 1
Supplier Device Package: 28-SSOP
Number of A/D Converters: 1
Produkt ist nicht verfügbar
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ADC1004S030TS/C1:1 ADC1004S050TS-C1-1-2752d47e94cf5451.pdf
ADC1004S030TS/C1:1
Hersteller: NXP USA Inc.
Description: IC ADC 10BIT 28SSOP
Packaging: Bulk
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Bits: 10
Configuration: ADC
Data Interface: Parallel
Reference Type: External
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Sampling Rate (Per Second): 30M
Input Type: Single Ended
Number of Inputs: 1
Supplier Device Package: 28-SSOP
Number of A/D Converters: 1
Produkt ist nicht verfügbar
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ADC1004S040TS/C1:1 ADC1004S050TS-C1-1-2752d47e94cf5451.pdf
ADC1004S040TS/C1:1
Hersteller: NXP USA Inc.
Description: IC ADC 10BIT 28SSOP
Packaging: Bulk
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Bits: 10
Configuration: ADC
Data Interface: Parallel
Reference Type: External
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Sampling Rate (Per Second): 40M
Input Type: Single Ended
Number of Inputs: 1
Supplier Device Package: 28-SSOP
Number of A/D Converters: 1
Produkt ist nicht verfügbar
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ADC1004S050TS/C1:1 ADC1004S050TS-C1-1-2752d47e94cf5451.pdf
ADC1004S050TS/C1:1
Hersteller: NXP USA Inc.
Description: IC ADC 10BIT 28SSOP
Packaging: Bulk
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Bits: 10
Configuration: ADC
Data Interface: Parallel
Reference Type: External
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Sampling Rate (Per Second): 50M
Input Type: Single Ended
Number of Inputs: 1
Supplier Device Package: 28-SSOP
Part Status: Obsolete
Number of A/D Converters: 1
Produkt ist nicht verfügbar
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ADC1005S060TS/C1:1 ADC1005S060.pdf
ADC1005S060TS/C1:1
Hersteller: NXP USA Inc.
Description: IC ADC 10BIT 28SSOP
Packaging: Bulk
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Bits: 10
Configuration: ADC
Data Interface: Parallel
Reference Type: External
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Sampling Rate (Per Second): 60M
Input Type: Single Ended
Number of Inputs: 1
Supplier Device Package: 28-SSOP
Number of A/D Converters: 1
Produkt ist nicht verfügbar
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ADC1207S080HW/C1:5 DS_568_ADC1207S080.pdf
ADC1207S080HW/C1:5
Hersteller: NXP USA Inc.
Description: IC ADC 12BIT 48HTQFP
Packaging: Tray
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Number of Bits: 12
Configuration: S/H-ADC
Data Interface: Parallel
Reference Type: Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Sampling Rate (Per Second): 80M
Input Type: Differential
Number of Inputs: 1
Supplier Device Package: 48-HTQFP (7x7)
Ratio - S/H:ADC: 1:1
Part Status: Obsolete
Number of A/D Converters: 1
Produkt ist nicht verfügbar
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74ABT273AD,118 74ABT273A.pdf
74ABT273AD,118
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SO
Produkt ist nicht verfügbar
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GTL2010PW,118 GTL2010.pdf
GTL2010PW,118
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 24TSSOP
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 24-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 10
Voltage - VCCA: 1 V ~ 5.5 V
Voltage - VCCB: 1 V ~ 5.5 V
Number of Circuits: 1
Produkt ist nicht verfügbar
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PCA9554ADB,118 PCA9554_9554A.pdf
PCA9554ADB,118
Hersteller: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C SMBUS 16SSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-SSOP
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCF8563TS/4,118 PCF8563.pdf
PCF8563TS/4,118
Hersteller: NXP USA Inc.
Description: IC RTC CLK/CALENDAR I2C 8TSSOP
Features: Alarm, Leap Year, Watchdog Timer
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1V ~ 5.5V
Time Format: HH:MM:SS (24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 8-TSSOP
Current - Timekeeping (Max): 0.6µA ~ 0.75µA @ 2V ~ 5V
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 175 Stücke:
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Anzahl Preis
8+2.48 EUR
10+1.82 EUR
25+1.65 EUR
100+1.47 EUR
Mindestbestellmenge: 8
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MF1FCP2S50/DH,118 MF1FCP2S50.pdf
MF1FCP2S50/DH,118
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 2FCP
Produkt ist nicht verfügbar
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MPC5567EVBE MPC5567.pdf
MPC5567EVBE
Hersteller: NXP USA Inc.
Description: MPC5567 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Power Supply, USB Multilink Programmer
Core Processor: e200
Utilized IC / Part: MPC5567
Produkt ist nicht verfügbar
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LPC2157FBD100,551 LPC2157_2158.pdf
LPC2157FBD100,551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 512KB FLSH 100LQFP
Produkt ist nicht verfügbar
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LPC2361FBD100,551 LPC2361_62.pdf
LPC2361FBD100,551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 64KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 34K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 6x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Not For New Designs
Number of I/O: 70
DigiKey Programmable: Not Verified
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Anzahl Preis
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10+17.76 EUR
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LPC2362FBD100,551 LPC2361_62.pdf
LPC2362FBD100,551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 58K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 6x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 70
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2420FBD208,551 LPC2420_60.pdf
LPC2420FBD208,551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
RAM Size: 82K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC3220FET296,551 LPC3220_30_40_50.pdf
LPC3220FET296,551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Produkt ist nicht verfügbar
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LPC3230FET296,551 LPC3220_30_40_50.pdf
LPC3230FET296,551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Tray
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I²S, LCD, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Part Status: Obsolete
Number of I/O: 51
Produkt ist nicht verfügbar
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LPC3240FET296,551 LPC3220_30_40_50.pdf
LPC3240FET296,551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Tray
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I2S, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC3250FET296,551 LPC3220_30_40_50.pdf
LPC3250FET296,551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Tray
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I2S, LCD, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Part Status: Obsolete
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BGY588C,112 BGY588C.pdf
BGY588C,112
Hersteller: NXP USA Inc.
Description: IC AMP CATV SOT115J
Packaging: Tube
Package / Case: SOT-115J
Output Type: Push-Pull
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Part Status: Obsolete
Number of Circuits: 1
Current - Supply: 325 mA
Produkt ist nicht verfügbar
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PCF2123TS/1,118 PCF2123.pdf
PCF2123TS/1,118
Hersteller: NXP USA Inc.
Description: IC RTC CLK/CALENDAR SPI 14TSSOP
Packaging: Tape & Reel (TR)
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: SPI
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.6V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 14-TSSOP
Current - Timekeeping (Max): 0.33µA ~ 0.38µA @ 2V ~ 5V
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 17500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+1.06 EUR
5000+1.04 EUR
7500+1.03 EUR
12500+1.01 EUR
Mindestbestellmenge: 2500
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PCF2123TS/1,118 PCF2123.pdf
PCF2123TS/1,118
Hersteller: NXP USA Inc.
Description: IC RTC CLK/CALENDAR SPI 14TSSOP
Packaging: Cut Tape (CT)
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: SPI
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.6V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 14-TSSOP
Current - Timekeeping (Max): 0.33µA ~ 0.38µA @ 2V ~ 5V
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 19638 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
9+2.16 EUR
12+1.58 EUR
25+1.43 EUR
100+1.27 EUR
250+1.19 EUR
500+1.14 EUR
1000+1.1 EUR
Mindestbestellmenge: 9
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74ABT541DB,118 DS_568_74ABT541.pdf
74ABT541DB,118
Hersteller: NXP USA Inc.
Description: IC BUFF NON-INVERT 5.5V 20SSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-SSOP
Produkt ist nicht verfügbar
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74HC147D,653 74HC%28T%29147.pdf
74HC147D,653
Hersteller: NXP USA Inc.
Description: IC PRIORITY ENCOD 1 X 10:4 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 10:4
Type: Priority Encoder
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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74HCT640D,653 74HC(T)640.pdf
74HCT640D,653
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER INVERT 5.5V 20SO
Produkt ist nicht verfügbar
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74LVCH162244ADGG:5 74LVC(H)162244A_Rev6_2017.pdf
74LVCH162244ADGG:5
Hersteller: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 48TSSOP
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 48-TSSOP
Produkt ist nicht verfügbar
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74LVT574PW,118 74LVT%28H%29574.pdf
74LVT574PW,118
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Current - Quiescent (Iq): 190 µA
Current - Output High, Low: 32mA, 64mA
Trigger Type: Positive Edge
Clock Frequency: 150 MHz
Input Capacitance: 4 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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N74F138D,623 DS_568_74F138.pdf
N74F138D,623
Hersteller: NXP USA Inc.
Description: IC DECODER/DEMUX 1 X 3:8 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 1mA, 20mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC44CC375AVEFEVK MC44CC375AV.pdf
Hersteller: NXP USA Inc.
Description: CCEVK NEJA EVAL KIT
Packaging: Bulk
For Use With/Related Products: MC44CC375AV
Type: Modulator
Contents: Board(s)
Utilized IC / Part: MC44CC375AV
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
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2N7002T,215 2N7002T_1.pdf
2N7002T,215
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 60V 300MA TO236AB
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 300mA (Ta)
Rds On (Max) @ Id, Vgs: 5Ohm @ 500mA, 10V
Power Dissipation (Max): 830mW (Ta)
Vgs(th) (Max) @ Id: 2.5V @ 1mA
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Input Capacitance (Ciss) (Max) @ Vds: 40 pF @ 10 V
Produkt ist nicht verfügbar
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74AUP1G32GW/DG,125 74AUP1G32.pdf
74AUP1G32GW/DG,125
Hersteller: NXP USA Inc.
Description: IC GATE OR 1CH 2-INP 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 5-TSSOP
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 6.4ns @ 3.3V, 30pF
Part Status: Obsolete
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
Produkt ist nicht verfügbar
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74HCT423BQ,115 74HC_HCT423_Rev_6.pdf
74HCT423BQ,115
Hersteller: NXP USA Inc.
Description: IC MULTIVIBRATOR 22NS 16DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 22 ns
Independent Circuits: 2
Current - Output High, Low: 4mA, 4mA
Schmitt Trigger Input: No
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Voltage - Supply: 4.5 V ~ 5.5 V
Produkt ist nicht verfügbar
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74LV259BQ,115 74LV259.pdf
74LV259BQ,115
Hersteller: NXP USA Inc.
Description: IC D-TYPE ADDR 1:8 16-DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Output Type: Standard
Mounting Type: Surface Mount
Circuit: 1:8
Logic Type: D-Type, Addressable
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 6mA, 6mA
Delay Time - Propagation: 36ns
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Part Status: Obsolete
Produkt ist nicht verfügbar
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74LV32BQ,115 74LV32.pdf
74LV32BQ,115
Hersteller: NXP USA Inc.
Description: IC GATE OR 4CH 2-INP 14DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 14-VFQFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 2
Supplier Device Package: 14-DHVQFN (2.5x3)
Input Logic Level - High: 0.9V ~ 2V
Input Logic Level - Low: 0.3V ~ 0.8V
Max Propagation Delay @ V, Max CL: 8ns @ 3.3V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
Produkt ist nicht verfügbar
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74LV86BQ,115 74LV86_Rev3_2017.pdf
74LV86BQ,115
Hersteller: NXP USA Inc.
Description: IC GATE XOR 4CH 2-INP 14DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 14-VFQFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 2
Supplier Device Package: 14-DHVQFN (2.5x3)
Input Logic Level - High: 0.9V ~ 2V
Input Logic Level - Low: 0.3V ~ 0.8V
Max Propagation Delay @ V, Max CL: 13ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
Produkt ist nicht verfügbar
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74LVC126APW/DG,118
74LVC126APW/DG,118
Hersteller: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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74LVC1G07GW/DG,125 74LVC1G07.pdf
74LVC1G07GW/DG,125
Hersteller: NXP USA Inc.
Description: IC BUFF NON-INVERT 5.5V 5-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 5-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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74LVC1G08GW/DG,125
74LVC1G08GW/DG,125
Hersteller: NXP USA Inc.
Description: IC GATE AND 1CH 2-INP 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: 5-TSSOP
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 1
Current - Quiescent (Max): 200 µA
Produkt ist nicht verfügbar
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74LVC1G125GW/DG,12 PHGLS28878-1.pdf?t.download=true&u=5oefqw
74LVC1G125GW/DG,12
Hersteller: NXP USA Inc.
Description: IC BUFF NON-INVERT 5.5V 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 32mA
Supplier Device Package: 5-TSSOP
Produkt ist nicht verfügbar
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74LVC1G32GW/DG,125
74LVC1G32GW/DG,125
Hersteller: NXP USA Inc.
Description: IC GATE OR 1CH 2-INP 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: 5-TSSOP
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 1.7ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 200 µA
Produkt ist nicht verfügbar
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74LVCH32244AEC/G;5 74LVCH32244A.pdf
74LVCH32244AEC/G;5
Hersteller: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 96LFBGA
Packaging: Tray
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 8
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
Produkt ist nicht verfügbar
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74LVCH32244AEC/G:5 74LVCH32244A.pdf
74LVCH32244AEC/G:5
Hersteller: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 96LFBGA
Packaging: Tray
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 8
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
Produkt ist nicht verfügbar
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74LVCH32244AEC/G,5 74LVCH32244A.pdf
74LVCH32244AEC/G,5
Hersteller: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 96LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 8
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
Produkt ist nicht verfügbar
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74LVCH32245AEC/G;5 74LVCH32245A.pdf
74LVCH32245AEC/G;5
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 96LFBGA
Produkt ist nicht verfügbar
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74LVCH32245AEC/G:5 74LVCH32245A.pdf
74LVCH32245AEC/G:5
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 96LFBGA
Produkt ist nicht verfügbar
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74LVCH32374AEC/G,5 74LVCH32374A.pdf
74LVCH32374AEC/G,5
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE QUAD 8BIT 96LFBGA
Produkt ist nicht verfügbar
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74LVT32374EC/G,518 74LVT32374.pdf
74LVT32374EC/G,518
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE QUAD 8BIT 96LFBGA
Produkt ist nicht verfügbar
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74LVT574BQ,115 74LVT(H)574.pdf
74LVT574BQ,115
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20DHVQFN
Produkt ist nicht verfügbar
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74LVTH322245EC,557 74LVTH322245.pdf
74LVTH322245EC,557
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 96LFBGA
Packaging: Tray
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
Produkt ist nicht verfügbar
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74LVTH322245EC,518 74LVTH322245.pdf
74LVTH322245EC,518
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 96LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
Produkt ist nicht verfügbar
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74LVU04BQ,115 74LVU04.pdf
74LVU04BQ,115
Hersteller: NXP USA Inc.
Description: IC INVERTER 6CH 6-INP 14DHVQFN
Produkt ist nicht verfügbar
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ADC1207S080HW/C1,1 ADC1207S080.pdf
ADC1207S080HW/C1,1
Hersteller: NXP USA Inc.
Description: IC ADC 12BIT 48HTQFP
Produkt ist nicht verfügbar
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BAP1321LX,315 BAP1321LX.pdf
BAP1321LX,315
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 60V 130MW 2DFN
Packaging: Tape & Reel (TR)
Package / Case: 2-XDFN
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.28pF @ 20V, 1MHz
Resistance @ If, F: 1.3Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: DFN1006D-2
Current - Max: 100 mA
Power Dissipation (Max): 130 mW
Produkt ist nicht verfügbar
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BAP142LX,315 BAP142LX.pdf
BAP142LX,315
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 130MW SOD2
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.26pF @ 20V, 1MHz
Resistance @ If, F: 1.3Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOD2
Current - Max: 100 mA
Power Dissipation (Max): 130 mW
Produkt ist nicht verfügbar
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BAP50LX,315 BAP50LX.pdf
BAP50LX,315
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 150MW SOD2
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Resistance @ If, F: 3Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOD2
Current - Max: 50 mA
Power Dissipation (Max): 150 mW
Produkt ist nicht verfügbar
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BAP51LX,315 BAP51LX.pdf
BAP51LX,315
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 60V 140MW SOD2
Packaging: Tape & Reel (TR)
Package / Case: 2-XDFN
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 5V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: DFN1006D-2
Current - Max: 100 mA
Power Dissipation (Max): 140 mW
Produkt ist nicht verfügbar
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BAP55LX,315 BAP55LX.pdf
BAP55LX,315
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 135MW DFN1006D2
Packaging: Tape & Reel (TR)
Package / Case: 2-XDFN
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.28pF @ 20V, 1MHz
Resistance @ If, F: 800mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: DFN1006D-2
Part Status: Active
Current - Max: 100 mA
Power Dissipation (Max): 135 mW
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
10000+0.22 EUR
Mindestbestellmenge: 10000
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