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MCF51JM128EVLK MCF51JM128EVLK NXP USA Inc. MCF51JM128.pdf Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 66
DigiKey Programmable: Not Verified
auf Bestellung 842 Stücke:
Lieferzeit 10-14 Tag (e)
1+28.51 EUR
10+22.63 EUR
25+21.16 EUR
80+19.77 EUR
230+18.84 EUR
450+18.38 EUR
Im Einkaufswagen  Stück im Wert von  UAH
MCF51JM128VLK MCF51JM128VLK NXP USA Inc. MCF51JM128.pdf Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 66
DigiKey Programmable: Not Verified
auf Bestellung 492 Stücke:
Lieferzeit 10-14 Tag (e)
1+25.31 EUR
10+18.13 EUR
25+16.29 EUR
80+14.51 EUR
230+13.31 EUR
450+12.71 EUR
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MCF51JM128VQH MCF51JM128VQH NXP USA Inc. MCF51JM128.pdf Description: IC MCU 32BIT 128KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Not Verified
auf Bestellung 934 Stücke:
Lieferzeit 10-14 Tag (e)
1+22.65 EUR
10+17.85 EUR
25+16.65 EUR
80+15.51 EUR
420+14.41 EUR
840+14.09 EUR
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MCF51JM128VLH MCF51JM128VLH NXP USA Inc. MCF51JM128.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Verified
auf Bestellung 1231 Stücke:
Lieferzeit 10-14 Tag (e)
1+22.81 EUR
10+18.03 EUR
25+16.83 EUR
100+15.52 EUR
250+14.89 EUR
800+14.3 EUR
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MCF51JM128VLD MCF51JM128VLD NXP USA Inc. MCF51JM128.pdf Description: IC MCU 32BIT 128KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 33
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCF51JM64VLD MCF51JM64VLD NXP USA Inc. MCF51JM128.pdf Description: IC MCU 32BIT 64KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 33
DigiKey Programmable: Not Verified
auf Bestellung 1600 Stücke:
Lieferzeit 10-14 Tag (e)
1+21.54 EUR
10+17.21 EUR
80+14.54 EUR
800+14.45 EUR
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DEMOJM DEMOJM NXP USA Inc. DEMOJMUM.pdf Description: MCF51JM128/MC9S08JM60 EVAL BRD
Packaging: Box
Mounting Type: Socket
Type: MCU
Contents: Board(s), Cable(s), Accessories
Board Type: Evaluation Platform
Utilized IC / Part: MCF51JM128, MC9S08JM60
Part Status: Obsolete
Produkt ist nicht verfügbar
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SL3ICS1002FUG/V7AF NXP USA Inc. Description: IC UCODE G2XM FFC
Packaging: Tube
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 840MHz ~ 960MHz
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C
Standards: ISO 15962, ISO 15963, ISO 18000-1, ISO 18000-6, ISO 19762
Supplier Device Package: Wafer
Part Status: Active
Produkt ist nicht verfügbar
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SA58670ABS,115 SA58670ABS,115 NXP USA Inc. SA58670A.pdf Description: IC AMP CLASS D STER 2.1W 20HVQFN
Features: Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 2.1W x 2 @ 4Ohm
Supplier Device Package: 20-HVQFN (4x4)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SA58671UK,027 SA58671UK,027 NXP USA Inc. SA58671.pdf Description: IC AMP CLASS D STER 1.3W 16WLCSP
Produkt ist nicht verfügbar
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SA58637BS,118 SA58637BS,118 NXP USA Inc. SA58637.pdf Description: IC AMP CLSS AB STER 2.2W 20HVQFN
Produkt ist nicht verfügbar
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SA58670ABS,115 SA58670ABS,115 NXP USA Inc. SA58670A.pdf Description: IC AMP CLASS D STER 2.1W 20HVQFN
Features: Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 2.1W x 2 @ 4Ohm
Supplier Device Package: 20-HVQFN (4x4)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SA58671UK,027 SA58671UK,027 NXP USA Inc. SA58671.pdf Description: IC AMP CLASS D STER 1.3W 16WLCSP
Produkt ist nicht verfügbar
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CWP-PRO-NL CWP-PRO-NL NXP USA Inc. 950-00088.pdf Description: SOFTWARE CODE WARRIOR
Packaging: Box
For Use With/Related Products: Code Warrior™ Software
Type: Integrated Development Environment (IDE)
Applications: Programming
Operating System: Windows XP, 7
Edition: Professional
License Length: Perpetual
License - User Details: Fixed Node
Media Delivery Type: Electronically Delivered
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
1+9522.18 EUR
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TJA1080TS,118 TJA1080TS,118 NXP USA Inc. TJA1080.pdf Description: IC INTERFACE SPECIALIZED 20SSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 20-SSOP
Grade: Automotive
Produkt ist nicht verfügbar
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OM11005 OM11005 NXP USA Inc. Description: DISPLAY QVGA TFT FOR OM10100
Packaging: Box
For Use With/Related Products: OM10100
Accessory Type: LCD Display
Produkt ist nicht verfügbar
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OM11013,598 OM11013,598 NXP USA Inc. Description: LPC2387 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM7
Utilized IC / Part: LPC2387
Produkt ist nicht verfügbar
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MC34671AEPR2 MC34671AEPR2 NXP USA Inc. MC34671.pdf Description: IC BATT CHG LI-ION 1CELL 8UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 8-UDFN (3x2)
Charge Current - Max: 600mA
Fault Protection: Over Temperature, Over Voltage
Voltage - Supply (Max): 10V
Battery Pack Voltage: 4.2V
Current - Charging: Constant - Programmable
auf Bestellung 9453 Stücke:
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6+3.17 EUR
10+2.34 EUR
25+2.14 EUR
100+1.91 EUR
250+1.8 EUR
500+1.74 EUR
1000+1.68 EUR
Mindestbestellmenge: 6
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MC34673AEPR2 MC34673AEPR2 NXP USA Inc. MC34673.pdf Description: IC BATT CHG LI-ION 1CELL 8UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 8-UDFN (3x2)
Charge Current - Max: 1.2A
Fault Protection: Over Voltage
Voltage - Supply (Max): 6.6V
Battery Pack Voltage: 4.2V
Current - Charging: Constant - Programmable
auf Bestellung 5605 Stücke:
Lieferzeit 10-14 Tag (e)
6+3.17 EUR
10+2.34 EUR
25+2.14 EUR
100+1.91 EUR
250+1.8 EUR
500+1.74 EUR
1000+1.68 EUR
Mindestbestellmenge: 6
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MC34674AEPR2 MC34674AEPR2 NXP USA Inc. MC34674.pdf Description: IC BATT CHG LI-ION 1CELL 8UDFN
Produkt ist nicht verfügbar
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MC9S08QE128CFT MC9S08QE128CFT NXP USA Inc. MC9S08QE128.pdf Description: IC MCU 8BIT 128KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
1+20.31 EUR
10+15.95 EUR
80+13.21 EUR
1300+11.52 EUR
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MC9S08QE96CLH MC9S08QE96CLH NXP USA Inc. MC9S08QE128.pdf Description: IC MCU 8BIT 96KB FLASH 64LQFP
Produkt ist nicht verfügbar
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MC9S08QE128CLD MC9S08QE128CLD NXP USA Inc. MC9S08QE128.pdf Description: IC MCU 8BIT 128KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 34
DigiKey Programmable: Not Verified
auf Bestellung 3200 Stücke:
Lieferzeit 10-14 Tag (e)
1+18.64 EUR
10+14.64 EUR
80+12.12 EUR
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MC9S08QE64CFT MC9S08QE64CFT NXP USA Inc. MC9S08QE128.pdf Description: IC MCU 8BIT 64KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08QE64CLD MC9S08QE64CLD NXP USA Inc. MC9S08QE128.pdf Description: IC MCU 8BIT 64KB FLASH 44LQFP
Produkt ist nicht verfügbar
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DEMOACKIT DEMOACKIT NXP USA Inc. DEMOACKIT_QSG.pdf Description: MC9S08AC128/MCF51AC256 EVAL BRD
Packaging: Box
Mounting Type: Socket
Type: MCU
Contents: Board(s), Cable(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08AC128, MCF51AC256
Part Status: Active
Produkt ist nicht verfügbar
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MC9S08AC128CFGE MC9S08AC128CFGE NXP USA Inc. MC9S08AC60AD.pdf Description: IC MCU 8BIT 128KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
auf Bestellung 665 Stücke:
Lieferzeit 10-14 Tag (e)
2+16.37 EUR
10+12.81 EUR
25+11.92 EUR
100+10.95 EUR
250+10.48 EUR
Mindestbestellmenge: 2
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MC9S08AC128CLKE MC9S08AC128CLKE NXP USA Inc. MC9S08AC60AD.pdf Description: IC MCU 8BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 69
DigiKey Programmable: Not Verified
auf Bestellung 256 Stücke:
Lieferzeit 10-14 Tag (e)
2+17.56 EUR
10+13.77 EUR
25+12.82 EUR
100+11.79 EUR
Mindestbestellmenge: 2
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LPC2470FBD208,551 LPC2470FBD208,551 NXP USA Inc. LPC2470.pdf Description: IC MCU 16/32BIT ROMLESS 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
RAM Size: 98K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2470FET208,551 LPC2470FET208,551 NXP USA Inc. LPC2470.pdf Description: IC MCU 16/32BIT ROMLESS 208TFBGA
Produkt ist nicht verfügbar
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LPC2478FBD208,551 LPC2478FBD208,551 NXP USA Inc. LPC2478.pdf Description: IC MCU 16/32B 512KB FLSH 208LQFP
Produkt ist nicht verfügbar
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LPC2478FET208,551 LPC2478FET208,551 NXP USA Inc. LPC2478.pdf Description: IC MCU 16/32BIT 512KB 208TFBGA
Packaging: Tray
Package / Case: 208-TFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-TFBGA (15x15)
Part Status: Not For New Designs
Number of I/O: 160
DigiKey Programmable: Not Verified
auf Bestellung 38 Stücke:
Lieferzeit 10-14 Tag (e)
1+48.28 EUR
10+39.02 EUR
25+36.71 EUR
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LPC2104FBD48/01,15 LPC2104FBD48/01,15 NXP USA Inc. LPC2104_2105_2106.pdf Description: IC MCU 16/32B 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Not For New Designs
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2105FBD48/01,15 LPC2105FBD48/01,15 NXP USA Inc. LPC2104_2105_2106.pdf Description: IC MCU 16/32B 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2106FBD48/01,15 LPC2106FBD48/01,15 NXP USA Inc. LPC2104_2105_2106.pdf Description: IC MCU 16/32B 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Not For New Designs
Number of I/O: 32
DigiKey Programmable: Not Verified
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LPC2106FHN48/01,55 LPC2106FHN48/01,55 NXP USA Inc. LPC2104_2105_2106.pdf Description: IC MCU 16/32B 128KB FLSH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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OM11015 OM11015 NXP USA Inc. LPC2478_Rev3.1.pdf Description: LPC2478 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), LCD
Core Processor: ARM7
Board Type: Evaluation Platform
Utilized IC / Part: LPC2478
Part Status: Obsolete
Produkt ist nicht verfügbar
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TJA1055T/3,518 TJA1055T/3,518 NXP USA Inc. TJA1055.pdf Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
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UJA1065TW/3V0,518 UJA1065TW/3V0,518 NXP USA Inc. UJA1065.pdf Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Cut Tape (CT)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 52V
Applications: Networking
Supplier Device Package: 32-HTSSOP
Produkt ist nicht verfügbar
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DEMO9S08QE8 DEMO9S08QE8 NXP USA Inc. QE8QE4QSG.pdf description Description: MC9S08QE8 EVAL BRD
Produkt ist nicht verfügbar
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MC34700EP MC34700EP NXP USA Inc. MC34700FS.pdf Description: IC REG QUAD BUCK/LNR SYNC 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 9V ~ 18V
Frequency - Switching: 800kHz
Topology: Step-Down (Buck) Synchronous (3), Linear (LDO) (1)
Supplier Device Package: 32-QFN-EP (5x5)
Voltage/Current - Output 1: 2V ~ 5.25V, 1.5A
Voltage/Current - Output 2: 0.7V ~ 3.6V, 1.25A
Voltage/Current - Output 3: 0.7V ~ 3.6V, 1.25A
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Number of Outputs: 4
Produkt ist nicht verfügbar
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MC9S08AC32CFDE MC9S08AC32CFDE NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 32KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Verified
auf Bestellung 822 Stücke:
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MC9S08AC32CFGE MC9S08AC32CFGE NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 32KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
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MC9S08AC32CPUE MC9S08AC32CPUE NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Verified
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MC9S08AC48CFGE MC9S08AC48CFGE NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 48KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08AC48CFJE MC9S08AC48CFJE NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
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MC9S08AC48CPUE MC9S08AC48CPUE NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08QE96CLD MC9S08QE96CLD NXP USA Inc. MC9S08QE128.pdf Description: IC MCU 8BIT 96KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S12XB128MAA MC9S12XB128MAA NXP USA Inc. MC9S12XDP512RMV2.pdf Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Not For New Designs
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCF52277CVM160 MCF52277CVM160 NXP USA Inc. MCF52277.pdf Description: IC MCU 32BIT ROMLESS 196MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 166.67MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 196-MAPBGA (15x15)
Part Status: Active
Number of I/O: 55
DigiKey Programmable: Not Verified
auf Bestellung 630 Stücke:
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MCZ33975AEK MCZ33975AEK NXP USA Inc. MC33975.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 28V
Supplier Device Package: 32-SOIC-EP
Grade: Automotive
Produkt ist nicht verfügbar
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MPC8544AVTALF MPC8544AVTALF NXP USA Inc. MPC8544E.pdf Description: IC MPU MPC85XX 667MHZ 783FCBGA
Produkt ist nicht verfügbar
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MPC8544AVTANG MPC8544AVTANG NXP USA Inc. MPC8544E.pdf Description: IC MPU MPC85XX 800MHZ 783FCBGA
Produkt ist nicht verfügbar
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MPC8544AVTAQG MPC8544AVTAQG NXP USA Inc. MPC8544E.pdf Description: IC MPU MPC85XX 1.0GHZ 783FCBGA
Produkt ist nicht verfügbar
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MPC8544AVTARJ MPC8544AVTARJ NXP USA Inc. MPC8544E.pdf Description: IC MPU MPC85XX 1.067GHZ 783BGA
Produkt ist nicht verfügbar
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LPC2365FBD100,551 LPC2365FBD100,551 NXP USA Inc. LPC2364_65_66_67_68.pdf Description: IC MCU 16/32B 256KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 58K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 6x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Not For New Designs
Number of I/O: 70
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2367FBD100,551 LPC2367FBD100,551 NXP USA Inc. LPC2364_65_66_67_68.pdf Description: IC MCU 16/32B 512KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 58K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 6x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Not For New Designs
Number of I/O: 70
DigiKey Programmable: Not Verified
auf Bestellung 58 Stücke:
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LPC2377FBD144,551 LPC2377FBD144,551 NXP USA Inc. LPC2377_78.pdf Description: IC MCU 16/32B 512KB FLSH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 58K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 104
DigiKey Programmable: Not Verified
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PTN3300AHF,518 PTN3300AHF,518 NXP USA Inc. PTN3300A.pdf Description: IC INTERFACE SPECIALIZED 48HWQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-WFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 3V ~ 3.6V
Applications: DVI, HDMI Level Switching
Supplier Device Package: 48-HWQFNR (7x7)
Produkt ist nicht verfügbar
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PTN3300BHF,518 PTN3300BHF,518 NXP USA Inc. PTN3300B.pdf Description: IC INTERFACE SPECIALIZED 48HWQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-WFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 3V ~ 3.6V
Applications: DVI, HDMI Level Switching
Supplier Device Package: 48-HWQFNR (7x7)
Produkt ist nicht verfügbar
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MCF51JM128EVLK MCF51JM128.pdf
MCF51JM128EVLK
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 66
DigiKey Programmable: Not Verified
auf Bestellung 842 Stücke:
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1+28.51 EUR
10+22.63 EUR
25+21.16 EUR
80+19.77 EUR
230+18.84 EUR
450+18.38 EUR
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MCF51JM128VLK MCF51JM128.pdf
MCF51JM128VLK
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 66
DigiKey Programmable: Not Verified
auf Bestellung 492 Stücke:
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Anzahl Preis
1+25.31 EUR
10+18.13 EUR
25+16.29 EUR
80+14.51 EUR
230+13.31 EUR
450+12.71 EUR
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MCF51JM128VQH MCF51JM128.pdf
MCF51JM128VQH
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Not Verified
auf Bestellung 934 Stücke:
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Anzahl Preis
1+22.65 EUR
10+17.85 EUR
25+16.65 EUR
80+15.51 EUR
420+14.41 EUR
840+14.09 EUR
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MCF51JM128VLH MCF51JM128.pdf
MCF51JM128VLH
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Verified
auf Bestellung 1231 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+22.81 EUR
10+18.03 EUR
25+16.83 EUR
100+15.52 EUR
250+14.89 EUR
800+14.3 EUR
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MCF51JM128VLD MCF51JM128.pdf
MCF51JM128VLD
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 33
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCF51JM64VLD MCF51JM128.pdf
MCF51JM64VLD
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 33
DigiKey Programmable: Not Verified
auf Bestellung 1600 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+21.54 EUR
10+17.21 EUR
80+14.54 EUR
800+14.45 EUR
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DEMOJM DEMOJMUM.pdf
DEMOJM
Hersteller: NXP USA Inc.
Description: MCF51JM128/MC9S08JM60 EVAL BRD
Packaging: Box
Mounting Type: Socket
Type: MCU
Contents: Board(s), Cable(s), Accessories
Board Type: Evaluation Platform
Utilized IC / Part: MCF51JM128, MC9S08JM60
Part Status: Obsolete
Produkt ist nicht verfügbar
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SL3ICS1002FUG/V7AF
Hersteller: NXP USA Inc.
Description: IC UCODE G2XM FFC
Packaging: Tube
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 840MHz ~ 960MHz
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C
Standards: ISO 15962, ISO 15963, ISO 18000-1, ISO 18000-6, ISO 19762
Supplier Device Package: Wafer
Part Status: Active
Produkt ist nicht verfügbar
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SA58670ABS,115 SA58670A.pdf
SA58670ABS,115
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D STER 2.1W 20HVQFN
Features: Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 2.1W x 2 @ 4Ohm
Supplier Device Package: 20-HVQFN (4x4)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SA58671UK,027 SA58671.pdf
SA58671UK,027
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D STER 1.3W 16WLCSP
Produkt ist nicht verfügbar
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SA58637BS,118 SA58637.pdf
SA58637BS,118
Hersteller: NXP USA Inc.
Description: IC AMP CLSS AB STER 2.2W 20HVQFN
Produkt ist nicht verfügbar
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SA58670ABS,115 SA58670A.pdf
SA58670ABS,115
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D STER 2.1W 20HVQFN
Features: Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 2.1W x 2 @ 4Ohm
Supplier Device Package: 20-HVQFN (4x4)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SA58671UK,027 SA58671.pdf
SA58671UK,027
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D STER 1.3W 16WLCSP
Produkt ist nicht verfügbar
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CWP-PRO-NL 950-00088.pdf
CWP-PRO-NL
Hersteller: NXP USA Inc.
Description: SOFTWARE CODE WARRIOR
Packaging: Box
For Use With/Related Products: Code Warrior™ Software
Type: Integrated Development Environment (IDE)
Applications: Programming
Operating System: Windows XP, 7
Edition: Professional
License Length: Perpetual
License - User Details: Fixed Node
Media Delivery Type: Electronically Delivered
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+9522.18 EUR
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TJA1080TS,118 TJA1080.pdf
TJA1080TS,118
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 20SSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 20-SSOP
Grade: Automotive
Produkt ist nicht verfügbar
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OM11005
OM11005
Hersteller: NXP USA Inc.
Description: DISPLAY QVGA TFT FOR OM10100
Packaging: Box
For Use With/Related Products: OM10100
Accessory Type: LCD Display
Produkt ist nicht verfügbar
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OM11013,598
OM11013,598
Hersteller: NXP USA Inc.
Description: LPC2387 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM7
Utilized IC / Part: LPC2387
Produkt ist nicht verfügbar
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MC34671AEPR2 MC34671.pdf
MC34671AEPR2
Hersteller: NXP USA Inc.
Description: IC BATT CHG LI-ION 1CELL 8UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 8-UDFN (3x2)
Charge Current - Max: 600mA
Fault Protection: Over Temperature, Over Voltage
Voltage - Supply (Max): 10V
Battery Pack Voltage: 4.2V
Current - Charging: Constant - Programmable
auf Bestellung 9453 Stücke:
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Anzahl Preis
6+3.17 EUR
10+2.34 EUR
25+2.14 EUR
100+1.91 EUR
250+1.8 EUR
500+1.74 EUR
1000+1.68 EUR
Mindestbestellmenge: 6
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MC34673AEPR2 MC34673.pdf
MC34673AEPR2
Hersteller: NXP USA Inc.
Description: IC BATT CHG LI-ION 1CELL 8UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 8-UDFN (3x2)
Charge Current - Max: 1.2A
Fault Protection: Over Voltage
Voltage - Supply (Max): 6.6V
Battery Pack Voltage: 4.2V
Current - Charging: Constant - Programmable
auf Bestellung 5605 Stücke:
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Anzahl Preis
6+3.17 EUR
10+2.34 EUR
25+2.14 EUR
100+1.91 EUR
250+1.8 EUR
500+1.74 EUR
1000+1.68 EUR
Mindestbestellmenge: 6
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MC34674AEPR2 MC34674.pdf
MC34674AEPR2
Hersteller: NXP USA Inc.
Description: IC BATT CHG LI-ION 1CELL 8UDFN
Produkt ist nicht verfügbar
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MC9S08QE128CFT MC9S08QE128.pdf
MC9S08QE128CFT
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+20.31 EUR
10+15.95 EUR
80+13.21 EUR
1300+11.52 EUR
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MC9S08QE96CLH MC9S08QE128.pdf
MC9S08QE96CLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 96KB FLASH 64LQFP
Produkt ist nicht verfügbar
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MC9S08QE128CLD MC9S08QE128.pdf
MC9S08QE128CLD
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 34
DigiKey Programmable: Not Verified
auf Bestellung 3200 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+18.64 EUR
10+14.64 EUR
80+12.12 EUR
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MC9S08QE64CFT MC9S08QE128.pdf
MC9S08QE64CFT
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 64KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08QE64CLD MC9S08QE128.pdf
MC9S08QE64CLD
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 64KB FLASH 44LQFP
Produkt ist nicht verfügbar
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DEMOACKIT DEMOACKIT_QSG.pdf
DEMOACKIT
Hersteller: NXP USA Inc.
Description: MC9S08AC128/MCF51AC256 EVAL BRD
Packaging: Box
Mounting Type: Socket
Type: MCU
Contents: Board(s), Cable(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08AC128, MCF51AC256
Part Status: Active
Produkt ist nicht verfügbar
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MC9S08AC128CFGE MC9S08AC60AD.pdf
MC9S08AC128CFGE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
auf Bestellung 665 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+16.37 EUR
10+12.81 EUR
25+11.92 EUR
100+10.95 EUR
250+10.48 EUR
Mindestbestellmenge: 2
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MC9S08AC128CLKE MC9S08AC60AD.pdf
MC9S08AC128CLKE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 69
DigiKey Programmable: Not Verified
auf Bestellung 256 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+17.56 EUR
10+13.77 EUR
25+12.82 EUR
100+11.79 EUR
Mindestbestellmenge: 2
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LPC2470FBD208,551 LPC2470.pdf
LPC2470FBD208,551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
RAM Size: 98K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2470FET208,551 LPC2470.pdf
LPC2470FET208,551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 208TFBGA
Produkt ist nicht verfügbar
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LPC2478FBD208,551 LPC2478.pdf
LPC2478FBD208,551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 512KB FLSH 208LQFP
Produkt ist nicht verfügbar
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LPC2478FET208,551 LPC2478.pdf
LPC2478FET208,551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT 512KB 208TFBGA
Packaging: Tray
Package / Case: 208-TFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-TFBGA (15x15)
Part Status: Not For New Designs
Number of I/O: 160
DigiKey Programmable: Not Verified
auf Bestellung 38 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+48.28 EUR
10+39.02 EUR
25+36.71 EUR
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LPC2104FBD48/01,15 LPC2104_2105_2106.pdf
LPC2104FBD48/01,15
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Not For New Designs
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2105FBD48/01,15 LPC2104_2105_2106.pdf
LPC2105FBD48/01,15
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2106FBD48/01,15 LPC2104_2105_2106.pdf
LPC2106FBD48/01,15
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Not For New Designs
Number of I/O: 32
DigiKey Programmable: Not Verified
auf Bestellung 190 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+41.73 EUR
10+33.54 EUR
25+31.49 EUR
80+29.54 EUR
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LPC2106FHN48/01,55 LPC2104_2105_2106.pdf
LPC2106FHN48/01,55
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLSH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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OM11015 LPC2478_Rev3.1.pdf
OM11015
Hersteller: NXP USA Inc.
Description: LPC2478 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), LCD
Core Processor: ARM7
Board Type: Evaluation Platform
Utilized IC / Part: LPC2478
Part Status: Obsolete
Produkt ist nicht verfügbar
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TJA1055T/3,518 TJA1055.pdf
TJA1055T/3,518
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
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UJA1065TW/3V0,518 UJA1065.pdf
UJA1065TW/3V0,518
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Cut Tape (CT)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 52V
Applications: Networking
Supplier Device Package: 32-HTSSOP
Produkt ist nicht verfügbar
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DEMO9S08QE8 description QE8QE4QSG.pdf
DEMO9S08QE8
Hersteller: NXP USA Inc.
Description: MC9S08QE8 EVAL BRD
Produkt ist nicht verfügbar
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MC34700EP MC34700FS.pdf
MC34700EP
Hersteller: NXP USA Inc.
Description: IC REG QUAD BUCK/LNR SYNC 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 9V ~ 18V
Frequency - Switching: 800kHz
Topology: Step-Down (Buck) Synchronous (3), Linear (LDO) (1)
Supplier Device Package: 32-QFN-EP (5x5)
Voltage/Current - Output 1: 2V ~ 5.25V, 1.5A
Voltage/Current - Output 2: 0.7V ~ 3.6V, 1.25A
Voltage/Current - Output 3: 0.7V ~ 3.6V, 1.25A
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Number of Outputs: 4
Produkt ist nicht verfügbar
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MC9S08AC32CFDE MC9S08AC60.pdf
MC9S08AC32CFDE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Verified
auf Bestellung 822 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+13.62 EUR
10+10.55 EUR
25+9.78 EUR
80+9.06 EUR
230+8.57 EUR
440+8.34 EUR
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MC9S08AC32CFGE MC9S08AC60.pdf
MC9S08AC32CFGE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
auf Bestellung 860 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+12.58 EUR
10+9.72 EUR
25+9.01 EUR
80+8.33 EUR
230+7.88 EUR
800+7.49 EUR
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MC9S08AC32CPUE MC9S08AC60.pdf
MC9S08AC32CPUE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Verified
auf Bestellung 210 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+16.23 EUR
10+11.3 EUR
25+10.02 EUR
80+8.79 EUR
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MC9S08AC48CFGE MC9S08AC60.pdf
MC9S08AC48CFGE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08AC48CFJE MC9S08AC60.pdf
MC9S08AC48CFJE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 1158 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.48 EUR
10+5.72 EUR
25+5.28 EUR
100+4.85 EUR
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MC9S08AC48CPUE MC9S08AC60.pdf
MC9S08AC48CPUE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08QE96CLD MC9S08QE128.pdf
MC9S08QE96CLD
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 96KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S12XB128MAA MC9S12XDP512RMV2.pdf
MC9S12XB128MAA
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Not For New Designs
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCF52277CVM160 MCF52277.pdf
MCF52277CVM160
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 196MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 166.67MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, I2C, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 196-MAPBGA (15x15)
Part Status: Active
Number of I/O: 55
DigiKey Programmable: Not Verified
auf Bestellung 630 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+37.96 EUR
10+30.45 EUR
80+26 EUR
630+25.66 EUR
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MCZ33975AEK MC33975.pdf
MCZ33975AEK
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 28V
Supplier Device Package: 32-SOIC-EP
Grade: Automotive
Produkt ist nicht verfügbar
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MPC8544AVTALF MPC8544E.pdf
MPC8544AVTALF
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 667MHZ 783FCBGA
Produkt ist nicht verfügbar
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MPC8544AVTANG MPC8544E.pdf
MPC8544AVTANG
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 800MHZ 783FCBGA
Produkt ist nicht verfügbar
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MPC8544AVTAQG MPC8544E.pdf
MPC8544AVTAQG
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.0GHZ 783FCBGA
Produkt ist nicht verfügbar
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MPC8544AVTARJ MPC8544E.pdf
MPC8544AVTARJ
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.067GHZ 783BGA
Produkt ist nicht verfügbar
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LPC2365FBD100,551 LPC2364_65_66_67_68.pdf
LPC2365FBD100,551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 256KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 58K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 6x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Not For New Designs
Number of I/O: 70
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2367FBD100,551 LPC2364_65_66_67_68.pdf
LPC2367FBD100,551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 512KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 58K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 6x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Not For New Designs
Number of I/O: 70
DigiKey Programmable: Not Verified
auf Bestellung 58 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+27.16 EUR
10+21.6 EUR
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LPC2377FBD144,551 LPC2377_78.pdf
LPC2377FBD144,551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 512KB FLSH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 58K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 104
DigiKey Programmable: Not Verified
auf Bestellung 64 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+24.57 EUR
10+19.61 EUR
60+18.14 EUR
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PTN3300AHF,518 PTN3300A.pdf
PTN3300AHF,518
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 48HWQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-WFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 3V ~ 3.6V
Applications: DVI, HDMI Level Switching
Supplier Device Package: 48-HWQFNR (7x7)
Produkt ist nicht verfügbar
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PTN3300BHF,518 PTN3300B.pdf
PTN3300BHF,518
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 48HWQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-WFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 3V ~ 3.6V
Applications: DVI, HDMI Level Switching
Supplier Device Package: 48-HWQFNR (7x7)
Produkt ist nicht verfügbar
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