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MRFG35020AR1 MRFG35020AR1 NXP USA Inc. MRFG35020A.pdf Description: FET RF 15V 3.5GHZ NI-360
Produkt ist nicht verfügbar
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MRFG35020AR5 MRFG35020AR5 NXP USA Inc. Description: FET RF 15V 3.5GHZ NI-360
Produkt ist nicht verfügbar
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MW7IC18100NBR1 MW7IC18100NBR1 NXP USA Inc. MW7IC18100N.pdf Description: IC AMP GSM 1.805-2.05GHZ TO272WB
Packaging: Tape & Reel (TR)
Package / Case: TO-272-14 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 1.805GHz ~ 2.05GHz
RF Type: GSM, EDGE
Voltage - Supply: 24V ~ 32V
Gain: 30dB
Current - Supply: 1.18A
P1dB: 51.93dBm
Test Frequency: 1.9GHz
Supplier Device Package: TO-272 WB-14
Produkt ist nicht verfügbar
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MWE6IC9100NBR1 MWE6IC9100NBR1 NXP USA Inc. MWE6IC9100.pdf Description: IC RF AMP GSM 960MHZ TO272WB
Packaging: Tape & Reel (TR)
Package / Case: TO-272-14 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 960MHz
RF Type: GSM, EDGE
Voltage - Supply: 28V
Gain: 33.5dB
Supplier Device Package: TO-272 WB-14
Part Status: Obsolete
Produkt ist nicht verfügbar
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MXC9ACCSRYK-AB NXP USA Inc. Description: ACCY CARDS ZAS ACCESSORY
Produkt ist nicht verfügbar
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MXC9ATLAS-PMB NXP USA Inc. Description: BOARD ATLAS PM
Produkt ist nicht verfügbar
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USBMLPPCBDM NXP USA Inc. Description: MULTILINK P&E POWERPC USB
Packaging: Bulk
For Use With/Related Products: MPC5xx / 55xx
Type: Debugger (In-Circuit/In-System)
Contents: Board(s)
Utilized IC / Part: MPC5xx / 55xx
Part Status: Active
Produkt ist nicht verfügbar
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USBMLPPCNEXUS USBMLPPCNEXUS NXP USA Inc. Description: MULTILINK P&E POWERPC NEXUS USB
Packaging: Bulk
For Use With/Related Products: MPC5xx / 55xx
Type: Debugger (In-Circuit/In-System)
Contents: Board(s)
Produkt ist nicht verfügbar
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TJA1041T/N1,512 TJA1041T/N1,512 NXP USA Inc. TJA1041.pdf Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
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TJA1041T/N1,518 TJA1041T/N1,518 NXP USA Inc. TJA1041.pdf Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
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LH79520N0Q000B1;55 LH79520N0Q000B1;55 NXP USA Inc. LH79520.pdf Description: IC MCU 32BIT ROMLESS 176LQFP
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LH79524N0F100A1;55 LH79524N0F100A1;55 NXP USA Inc. LH79524_525_N.pdf Description: IC MCU 32BIT ROMLESS 208LFBGA
Packaging: Tray
Package / Case: 208-LFBGA
Mounting Type: Surface Mount
Speed: 76.2MHz
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 10x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LFBGA (14x14)
Number of I/O: 108
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LH79525N0Q100A1;55 LH79525N0Q100A1;55 NXP USA Inc. LH79524_525_N.pdf Description: IC MCU 32BIT ROMLESS 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 76.2MHz
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 10x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 176-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 86
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LH7A404N0F000B3;55 LH7A404N0F000B3;55 NXP USA Inc. LH7A404_N.pdf Description: IC MCU 32BIT ROMLESS 324LFBGA
Packaging: Tray
Package / Case: 324-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM9®
Data Converters: A/D 9x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, PS/2, SmartCard, SPI, SSI, SSP, UART/USART, USB
Peripherals: AC'97, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 324-LFBGA (17x17)
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LH7A404N0F092B3;55 LH7A404N0F092B3;55 NXP USA Inc. LH7A404_N.pdf Description: IC MCU 32BIT ROMLESS 324LFBGA
Packaging: Tray
Package / Case: 324-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM9®
Data Converters: A/D 9x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, PS/2, SmartCard, SPI, SSI, SSP, UART/USART, USB
Peripherals: AC'97, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 324-LFBGA (17x17)
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LH75411N0Q100C0;55 LH75411N0Q100C0;55 NXP USA Inc. LH75(401,411).pdf Description: IC MCU 32BIT ROMLESS 144LQFP
Produkt ist nicht verfügbar
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LH7A400N0G000B5;55 LH7A400N0G000B5;55 NXP USA Inc. LH7A400_N.pdf Description: IC MCU 32BIT ROMLESS 256BGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM9®
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, SmartCard, SPI, SSI, SSP, UART/USART, USB
Peripherals: AC'97, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 256-BGA (17x17)
Number of I/O: 60
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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3806620 3806620 NXP USA Inc. Description: KIT BISS TRANSISTORS 17 VALUES
Packaging: Case
Mounting Type: Surface Mount
Quantity: 425 Pieces (17 Values - 25 Each)
Kit Type: Transistors
Produkt ist nicht verfügbar
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3806684 3806684 NXP USA Inc. Description: KIT SCHOTTKY DIODE 17 VALUES
Produkt ist nicht verfügbar
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BLF6G20-230P BLF6G20-230P NXP USA Inc. Description: RF MOSFET LDMOS 28V LDMOST
Packaging: Bag
Package / Case: SOT-502A
Current Rating (Amps): 5µA
Mounting Type: Chassis Mount
Frequency: 1.8GHz
Power - Output: 50W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: LDMOST
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 2 A
Produkt ist nicht verfügbar
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MCF51JM128EVLK MCF51JM128EVLK NXP USA Inc. MCF51JM128.pdf Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 66
DigiKey Programmable: Not Verified
auf Bestellung 842 Stücke:
Lieferzeit 10-14 Tag (e)
1+28.51 EUR
10+22.63 EUR
25+21.16 EUR
80+19.77 EUR
230+18.84 EUR
450+18.38 EUR
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MCF51JM128VLK MCF51JM128VLK NXP USA Inc. MCF51JM128.pdf Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 66
DigiKey Programmable: Not Verified
auf Bestellung 492 Stücke:
Lieferzeit 10-14 Tag (e)
1+25.31 EUR
10+18.13 EUR
25+16.29 EUR
80+14.51 EUR
230+13.31 EUR
450+12.71 EUR
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MCF51JM128VQH MCF51JM128VQH NXP USA Inc. MCF51JM128.pdf Description: IC MCU 32BIT 128KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Not Verified
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1+22.65 EUR
10+17.85 EUR
25+16.65 EUR
80+15.51 EUR
420+14.41 EUR
840+14.09 EUR
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MCF51JM128VLH MCF51JM128VLH NXP USA Inc. MCF51JM128.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Verified
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Lieferzeit 10-14 Tag (e)
1+22.81 EUR
10+18.03 EUR
25+16.83 EUR
100+15.52 EUR
250+14.89 EUR
800+14.30 EUR
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MCF51JM128VLD MCF51JM128VLD NXP USA Inc. MCF51JM128.pdf Description: IC MCU 32BIT 128KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 33
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCF51JM64VLD MCF51JM64VLD NXP USA Inc. MCF51JM128.pdf Description: IC MCU 32BIT 64KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 33
DigiKey Programmable: Not Verified
auf Bestellung 1600 Stücke:
Lieferzeit 10-14 Tag (e)
1+21.54 EUR
10+17.21 EUR
80+14.54 EUR
800+14.45 EUR
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DEMOJM DEMOJM NXP USA Inc. DEMOJMUM.pdf Description: MCF51JM128/MC9S08JM60 EVAL BRD
Packaging: Box
Mounting Type: Socket
Type: MCU
Contents: Board(s), Cable(s), Accessories
Board Type: Evaluation Platform
Utilized IC / Part: MCF51JM128, MC9S08JM60
Part Status: Obsolete
Produkt ist nicht verfügbar
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SL3ICS1002FUG/V7AF NXP USA Inc. Description: IC UCODE G2XM FFC
Packaging: Tube
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 840MHz ~ 960MHz
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C
Standards: ISO 15962, ISO 15963, ISO 18000-1, ISO 18000-6, ISO 19762
Supplier Device Package: Wafer
Part Status: Active
Produkt ist nicht verfügbar
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SA58670ABS,115 SA58670ABS,115 NXP USA Inc. SA58670A.pdf Description: IC AMP CLASS D STER 2.1W 20HVQFN
Packaging: Tape & Reel (TR)
Features: Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
Package / Case: 20-VFQFN Exposed Pad
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 2.1W x 2 @ 4Ohm
Supplier Device Package: 20-HVQFN (4x4)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SA58671UK,027 SA58671UK,027 NXP USA Inc. SA58671.pdf Description: IC AMP CLASS D STER 1.3W 16WLCSP
Produkt ist nicht verfügbar
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SA58637BS,118 SA58637BS,118 NXP USA Inc. SA58637.pdf Description: IC AMP CLSS AB STER 2.2W 20HVQFN
Produkt ist nicht verfügbar
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SA58670ABS,115 SA58670ABS,115 NXP USA Inc. SA58670A.pdf Description: IC AMP CLASS D STER 2.1W 20HVQFN
Packaging: Cut Tape (CT)
Features: Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
Package / Case: 20-VFQFN Exposed Pad
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 2.1W x 2 @ 4Ohm
Supplier Device Package: 20-HVQFN (4x4)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SA58671UK,027 SA58671UK,027 NXP USA Inc. SA58671.pdf Description: IC AMP CLASS D STER 1.3W 16WLCSP
Produkt ist nicht verfügbar
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CWP-PRO-NL CWP-PRO-NL NXP USA Inc. 950-00088.pdf Description: SOFTWARE CODE WARRIOR
Packaging: Box
For Use With/Related Products: Code Warrior™ Software
Type: Integrated Development Environment (IDE)
Applications: Programming
Operating System: Windows XP, 7
Edition: Professional
License Length: Perpetual
License - User Details: Fixed Node
Media Delivery Type: Electronically Delivered
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
1+9522.18 EUR
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TJA1080TS,118 TJA1080TS,118 NXP USA Inc. TJA1080.pdf Description: IC INTERFACE SPECIALIZED 20SSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 20-SSOP
Grade: Automotive
Produkt ist nicht verfügbar
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OM11005 OM11005 NXP USA Inc. Description: DISPLAY QVGA TFT FOR OM10100
Packaging: Box
For Use With/Related Products: OM10100
Accessory Type: LCD Display
Produkt ist nicht verfügbar
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OM11013,598 OM11013,598 NXP USA Inc. Description: LPC2387 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM7
Utilized IC / Part: LPC2387
Produkt ist nicht verfügbar
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MC34671AEPR2 MC34671AEPR2 NXP USA Inc. MC34671.pdf Description: IC BATT CHG LI-ION 1CELL 8UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 8-UDFN (3x2)
Charge Current - Max: 600mA
Fault Protection: Over Temperature, Over Voltage
Voltage - Supply (Max): 10V
Battery Pack Voltage: 4.2V
Current - Charging: Constant - Programmable
auf Bestellung 9512 Stücke:
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6+3.29 EUR
10+2.44 EUR
25+2.22 EUR
100+1.98 EUR
250+1.87 EUR
500+1.80 EUR
1000+1.75 EUR
Mindestbestellmenge: 6
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MC34673AEPR2 MC34673AEPR2 NXP USA Inc. MC34673.pdf Description: IC BATT CHG LI-ION 1CELL 8UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 8-UDFN (3x2)
Charge Current - Max: 1.2A
Fault Protection: Over Voltage
Voltage - Supply (Max): 6.6V
Battery Pack Voltage: 4.2V
Current - Charging: Constant - Programmable
auf Bestellung 9093 Stücke:
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5+3.57 EUR
10+2.64 EUR
25+2.41 EUR
100+2.15 EUR
250+2.03 EUR
500+1.96 EUR
1000+1.90 EUR
Mindestbestellmenge: 5
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MC34674AEPR2 MC34674AEPR2 NXP USA Inc. MC34674.pdf Description: IC BATT CHG LI-ION 1CELL 8UDFN
Produkt ist nicht verfügbar
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MC9S08QE128CFT MC9S08QE128CFT NXP USA Inc. MC9S08QE128.pdf Description: IC MCU 8BIT 128KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
1+20.31 EUR
10+15.95 EUR
80+13.21 EUR
1300+11.52 EUR
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MC9S08QE96CLH MC9S08QE96CLH NXP USA Inc. MC9S08QE128.pdf Description: IC MCU 8BIT 96KB FLASH 64LQFP
Produkt ist nicht verfügbar
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MC9S08QE128CLD MC9S08QE128CLD NXP USA Inc. MC9S08QE128.pdf Description: IC MCU 8BIT 128KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 34
DigiKey Programmable: Not Verified
auf Bestellung 3200 Stücke:
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MC9S08QE64CFT MC9S08QE64CFT NXP USA Inc. MC9S08QE128.pdf Description: IC MCU 8BIT 64KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
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MC9S08QE64CLD MC9S08QE64CLD NXP USA Inc. MC9S08QE128.pdf Description: IC MCU 8BIT 64KB FLASH 44LQFP
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DEMOACKIT DEMOACKIT NXP USA Inc. DEMOACKIT_QSG.pdf Description: MC9S08AC128/MCF51AC256 EVAL BRD
Packaging: Box
Mounting Type: Socket
Type: MCU
Contents: Board(s), Cable(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08AC128, MCF51AC256
Part Status: Active
Produkt ist nicht verfügbar
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MC9S08AC128CFGE MC9S08AC128CFGE NXP USA Inc. MC9S08AC128.pdf Description: IC MCU 8BIT 128KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
auf Bestellung 775 Stücke:
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10+13.31 EUR
25+12.39 EUR
100+11.37 EUR
250+10.89 EUR
Mindestbestellmenge: 2
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MC9S08AC128CLKE MC9S08AC128CLKE NXP USA Inc. MC9S08AC128.pdf Description: IC MCU 8BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 69
DigiKey Programmable: Not Verified
auf Bestellung 258 Stücke:
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1+18.25 EUR
10+14.31 EUR
25+13.32 EUR
100+12.24 EUR
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LPC2470FBD208,551 LPC2470FBD208,551 NXP USA Inc. LPC2470.pdf Description: IC MCU 16/32BIT ROMLESS 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
RAM Size: 98K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2470FET208,551 LPC2470FET208,551 NXP USA Inc. LPC2470.pdf Description: IC MCU 16/32BIT ROMLESS 208TFBGA
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LPC2478FBD208,551 LPC2478FBD208,551 NXP USA Inc. LPC2478.pdf Description: IC MCU 16/32B 512KB FLSH 208LQFP
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LPC2478FET208,551 LPC2478FET208,551 NXP USA Inc. LPC2478.pdf Description: IC MCU 16/32BIT 512KB 208TFBGA
Packaging: Tray
Package / Case: 208-TFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-TFBGA (15x15)
Part Status: Not For New Designs
Number of I/O: 160
DigiKey Programmable: Not Verified
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LPC2104FBD48/01,15 LPC2104FBD48/01,15 NXP USA Inc. LPC2104_2105_2106.pdf Description: IC MCU 16/32B 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Not For New Designs
Number of I/O: 32
DigiKey Programmable: Not Verified
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LPC2105FBD48/01,15 LPC2105FBD48/01,15 NXP USA Inc. LPC2104_2105_2106.pdf Description: IC MCU 16/32B 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2106FBD48/01,15 LPC2106FBD48/01,15 NXP USA Inc. LPC2104_2105_2106.pdf Description: IC MCU 16/32B 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Not For New Designs
Number of I/O: 32
DigiKey Programmable: Not Verified
auf Bestellung 190 Stücke:
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1+41.73 EUR
10+33.54 EUR
25+31.49 EUR
80+29.54 EUR
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LPC2106FHN48/01,55 LPC2106FHN48/01,55 NXP USA Inc. LPC2104_2105_2106.pdf Description: IC MCU 16/32B 128KB FLSH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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OM11015 OM11015 NXP USA Inc. LPC2478_Rev3.1.pdf Description: LPC2478 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), LCD
Core Processor: ARM7
Board Type: Evaluation Platform
Utilized IC / Part: LPC2478
Part Status: Obsolete
Produkt ist nicht verfügbar
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TJA1055T/3,518 TJA1055T/3,518 NXP USA Inc. TJA1055.pdf Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
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UJA1065TW/3V0,518 UJA1065TW/3V0,518 NXP USA Inc. UJA1065.pdf Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Cut Tape (CT)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 52V
Applications: Networking
Supplier Device Package: 32-HTSSOP
Produkt ist nicht verfügbar
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DEMO9S08QE8 DEMO9S08QE8 NXP USA Inc. QE8QE4QSG.pdf description Description: MC9S08QE8 EVAL BRD
Produkt ist nicht verfügbar
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MRFG35020AR1 MRFG35020A.pdf
MRFG35020AR1
Hersteller: NXP USA Inc.
Description: FET RF 15V 3.5GHZ NI-360
Produkt ist nicht verfügbar
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MRFG35020AR5
MRFG35020AR5
Hersteller: NXP USA Inc.
Description: FET RF 15V 3.5GHZ NI-360
Produkt ist nicht verfügbar
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MW7IC18100NBR1 MW7IC18100N.pdf
MW7IC18100NBR1
Hersteller: NXP USA Inc.
Description: IC AMP GSM 1.805-2.05GHZ TO272WB
Packaging: Tape & Reel (TR)
Package / Case: TO-272-14 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 1.805GHz ~ 2.05GHz
RF Type: GSM, EDGE
Voltage - Supply: 24V ~ 32V
Gain: 30dB
Current - Supply: 1.18A
P1dB: 51.93dBm
Test Frequency: 1.9GHz
Supplier Device Package: TO-272 WB-14
Produkt ist nicht verfügbar
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MWE6IC9100NBR1 MWE6IC9100.pdf
MWE6IC9100NBR1
Hersteller: NXP USA Inc.
Description: IC RF AMP GSM 960MHZ TO272WB
Packaging: Tape & Reel (TR)
Package / Case: TO-272-14 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 960MHz
RF Type: GSM, EDGE
Voltage - Supply: 28V
Gain: 33.5dB
Supplier Device Package: TO-272 WB-14
Part Status: Obsolete
Produkt ist nicht verfügbar
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MXC9ACCSRYK-AB
Hersteller: NXP USA Inc.
Description: ACCY CARDS ZAS ACCESSORY
Produkt ist nicht verfügbar
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MXC9ATLAS-PMB
Hersteller: NXP USA Inc.
Description: BOARD ATLAS PM
Produkt ist nicht verfügbar
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USBMLPPCBDM
Hersteller: NXP USA Inc.
Description: MULTILINK P&E POWERPC USB
Packaging: Bulk
For Use With/Related Products: MPC5xx / 55xx
Type: Debugger (In-Circuit/In-System)
Contents: Board(s)
Utilized IC / Part: MPC5xx / 55xx
Part Status: Active
Produkt ist nicht verfügbar
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USBMLPPCNEXUS
USBMLPPCNEXUS
Hersteller: NXP USA Inc.
Description: MULTILINK P&E POWERPC NEXUS USB
Packaging: Bulk
For Use With/Related Products: MPC5xx / 55xx
Type: Debugger (In-Circuit/In-System)
Contents: Board(s)
Produkt ist nicht verfügbar
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TJA1041T/N1,512 TJA1041.pdf
TJA1041T/N1,512
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
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TJA1041T/N1,518 TJA1041.pdf
TJA1041T/N1,518
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
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LH79520N0Q000B1;55 LH79520.pdf
LH79520N0Q000B1;55
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 176LQFP
Produkt ist nicht verfügbar
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LH79524N0F100A1;55 LH79524_525_N.pdf
LH79524N0F100A1;55
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 208LFBGA
Packaging: Tray
Package / Case: 208-LFBGA
Mounting Type: Surface Mount
Speed: 76.2MHz
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 10x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LFBGA (14x14)
Number of I/O: 108
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LH79525N0Q100A1;55 LH79524_525_N.pdf
LH79525N0Q100A1;55
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 76.2MHz
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 10x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 176-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 86
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LH7A404N0F000B3;55 LH7A404_N.pdf
LH7A404N0F000B3;55
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 324LFBGA
Packaging: Tray
Package / Case: 324-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM9®
Data Converters: A/D 9x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, PS/2, SmartCard, SPI, SSI, SSP, UART/USART, USB
Peripherals: AC'97, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 324-LFBGA (17x17)
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LH7A404N0F092B3;55 LH7A404_N.pdf
LH7A404N0F092B3;55
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 324LFBGA
Packaging: Tray
Package / Case: 324-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM9®
Data Converters: A/D 9x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, PS/2, SmartCard, SPI, SSI, SSP, UART/USART, USB
Peripherals: AC'97, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 324-LFBGA (17x17)
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LH75411N0Q100C0;55 LH75(401,411).pdf
LH75411N0Q100C0;55
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Produkt ist nicht verfügbar
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LH7A400N0G000B5;55 LH7A400_N.pdf
LH7A400N0G000B5;55
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256BGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM9®
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, SmartCard, SPI, SSI, SSP, UART/USART, USB
Peripherals: AC'97, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 256-BGA (17x17)
Number of I/O: 60
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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3806620
3806620
Hersteller: NXP USA Inc.
Description: KIT BISS TRANSISTORS 17 VALUES
Packaging: Case
Mounting Type: Surface Mount
Quantity: 425 Pieces (17 Values - 25 Each)
Kit Type: Transistors
Produkt ist nicht verfügbar
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3806684
3806684
Hersteller: NXP USA Inc.
Description: KIT SCHOTTKY DIODE 17 VALUES
Produkt ist nicht verfügbar
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BLF6G20-230P
BLF6G20-230P
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V LDMOST
Packaging: Bag
Package / Case: SOT-502A
Current Rating (Amps): 5µA
Mounting Type: Chassis Mount
Frequency: 1.8GHz
Power - Output: 50W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: LDMOST
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 2 A
Produkt ist nicht verfügbar
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MCF51JM128EVLK MCF51JM128.pdf
MCF51JM128EVLK
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 66
DigiKey Programmable: Not Verified
auf Bestellung 842 Stücke:
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1+28.51 EUR
10+22.63 EUR
25+21.16 EUR
80+19.77 EUR
230+18.84 EUR
450+18.38 EUR
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MCF51JM128VLK MCF51JM128.pdf
MCF51JM128VLK
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 66
DigiKey Programmable: Not Verified
auf Bestellung 492 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+25.31 EUR
10+18.13 EUR
25+16.29 EUR
80+14.51 EUR
230+13.31 EUR
450+12.71 EUR
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MCF51JM128VQH MCF51JM128.pdf
MCF51JM128VQH
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Not Verified
auf Bestellung 934 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+22.65 EUR
10+17.85 EUR
25+16.65 EUR
80+15.51 EUR
420+14.41 EUR
840+14.09 EUR
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MCF51JM128VLH MCF51JM128.pdf
MCF51JM128VLH
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Verified
auf Bestellung 1231 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+22.81 EUR
10+18.03 EUR
25+16.83 EUR
100+15.52 EUR
250+14.89 EUR
800+14.30 EUR
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MCF51JM128VLD MCF51JM128.pdf
MCF51JM128VLD
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 33
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCF51JM64VLD MCF51JM128.pdf
MCF51JM64VLD
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 33
DigiKey Programmable: Not Verified
auf Bestellung 1600 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+21.54 EUR
10+17.21 EUR
80+14.54 EUR
800+14.45 EUR
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DEMOJM DEMOJMUM.pdf
DEMOJM
Hersteller: NXP USA Inc.
Description: MCF51JM128/MC9S08JM60 EVAL BRD
Packaging: Box
Mounting Type: Socket
Type: MCU
Contents: Board(s), Cable(s), Accessories
Board Type: Evaluation Platform
Utilized IC / Part: MCF51JM128, MC9S08JM60
Part Status: Obsolete
Produkt ist nicht verfügbar
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SL3ICS1002FUG/V7AF
Hersteller: NXP USA Inc.
Description: IC UCODE G2XM FFC
Packaging: Tube
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 840MHz ~ 960MHz
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C
Standards: ISO 15962, ISO 15963, ISO 18000-1, ISO 18000-6, ISO 19762
Supplier Device Package: Wafer
Part Status: Active
Produkt ist nicht verfügbar
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SA58670ABS,115 SA58670A.pdf
SA58670ABS,115
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D STER 2.1W 20HVQFN
Packaging: Tape & Reel (TR)
Features: Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
Package / Case: 20-VFQFN Exposed Pad
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 2.1W x 2 @ 4Ohm
Supplier Device Package: 20-HVQFN (4x4)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SA58671UK,027 SA58671.pdf
SA58671UK,027
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D STER 1.3W 16WLCSP
Produkt ist nicht verfügbar
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SA58637BS,118 SA58637.pdf
SA58637BS,118
Hersteller: NXP USA Inc.
Description: IC AMP CLSS AB STER 2.2W 20HVQFN
Produkt ist nicht verfügbar
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SA58670ABS,115 SA58670A.pdf
SA58670ABS,115
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D STER 2.1W 20HVQFN
Packaging: Cut Tape (CT)
Features: Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
Package / Case: 20-VFQFN Exposed Pad
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 2.1W x 2 @ 4Ohm
Supplier Device Package: 20-HVQFN (4x4)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SA58671UK,027 SA58671.pdf
SA58671UK,027
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D STER 1.3W 16WLCSP
Produkt ist nicht verfügbar
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CWP-PRO-NL 950-00088.pdf
CWP-PRO-NL
Hersteller: NXP USA Inc.
Description: SOFTWARE CODE WARRIOR
Packaging: Box
For Use With/Related Products: Code Warrior™ Software
Type: Integrated Development Environment (IDE)
Applications: Programming
Operating System: Windows XP, 7
Edition: Professional
License Length: Perpetual
License - User Details: Fixed Node
Media Delivery Type: Electronically Delivered
Part Status: Active
auf Bestellung 1 Stücke:
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Anzahl Preis
1+9522.18 EUR
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TJA1080TS,118 TJA1080.pdf
TJA1080TS,118
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 20SSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 20-SSOP
Grade: Automotive
Produkt ist nicht verfügbar
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OM11005
OM11005
Hersteller: NXP USA Inc.
Description: DISPLAY QVGA TFT FOR OM10100
Packaging: Box
For Use With/Related Products: OM10100
Accessory Type: LCD Display
Produkt ist nicht verfügbar
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OM11013,598
OM11013,598
Hersteller: NXP USA Inc.
Description: LPC2387 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM7
Utilized IC / Part: LPC2387
Produkt ist nicht verfügbar
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MC34671AEPR2 MC34671.pdf
MC34671AEPR2
Hersteller: NXP USA Inc.
Description: IC BATT CHG LI-ION 1CELL 8UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 8-UDFN (3x2)
Charge Current - Max: 600mA
Fault Protection: Over Temperature, Over Voltage
Voltage - Supply (Max): 10V
Battery Pack Voltage: 4.2V
Current - Charging: Constant - Programmable
auf Bestellung 9512 Stücke:
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Anzahl Preis
6+3.29 EUR
10+2.44 EUR
25+2.22 EUR
100+1.98 EUR
250+1.87 EUR
500+1.80 EUR
1000+1.75 EUR
Mindestbestellmenge: 6
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MC34673AEPR2 MC34673.pdf
MC34673AEPR2
Hersteller: NXP USA Inc.
Description: IC BATT CHG LI-ION 1CELL 8UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 8-UDFN (3x2)
Charge Current - Max: 1.2A
Fault Protection: Over Voltage
Voltage - Supply (Max): 6.6V
Battery Pack Voltage: 4.2V
Current - Charging: Constant - Programmable
auf Bestellung 9093 Stücke:
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Anzahl Preis
5+3.57 EUR
10+2.64 EUR
25+2.41 EUR
100+2.15 EUR
250+2.03 EUR
500+1.96 EUR
1000+1.90 EUR
Mindestbestellmenge: 5
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MC34674AEPR2 MC34674.pdf
MC34674AEPR2
Hersteller: NXP USA Inc.
Description: IC BATT CHG LI-ION 1CELL 8UDFN
Produkt ist nicht verfügbar
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MC9S08QE128CFT MC9S08QE128.pdf
MC9S08QE128CFT
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+20.31 EUR
10+15.95 EUR
80+13.21 EUR
1300+11.52 EUR
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MC9S08QE96CLH MC9S08QE128.pdf
MC9S08QE96CLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 96KB FLASH 64LQFP
Produkt ist nicht verfügbar
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MC9S08QE128CLD MC9S08QE128.pdf
MC9S08QE128CLD
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 34
DigiKey Programmable: Not Verified
auf Bestellung 3200 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+18.64 EUR
10+14.64 EUR
80+12.12 EUR
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MC9S08QE64CFT MC9S08QE128.pdf
MC9S08QE64CFT
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 64KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08QE64CLD MC9S08QE128.pdf
MC9S08QE64CLD
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 64KB FLASH 44LQFP
Produkt ist nicht verfügbar
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DEMOACKIT DEMOACKIT_QSG.pdf
DEMOACKIT
Hersteller: NXP USA Inc.
Description: MC9S08AC128/MCF51AC256 EVAL BRD
Packaging: Box
Mounting Type: Socket
Type: MCU
Contents: Board(s), Cable(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08AC128, MCF51AC256
Part Status: Active
Produkt ist nicht verfügbar
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MC9S08AC128CFGE MC9S08AC128.pdf
MC9S08AC128CFGE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
auf Bestellung 775 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+17.00 EUR
10+13.31 EUR
25+12.39 EUR
100+11.37 EUR
250+10.89 EUR
Mindestbestellmenge: 2
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MC9S08AC128CLKE MC9S08AC128.pdf
MC9S08AC128CLKE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 69
DigiKey Programmable: Not Verified
auf Bestellung 258 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+18.25 EUR
10+14.31 EUR
25+13.32 EUR
100+12.24 EUR
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LPC2470FBD208,551 LPC2470.pdf
LPC2470FBD208,551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
RAM Size: 98K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2470FET208,551 LPC2470.pdf
LPC2470FET208,551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 208TFBGA
Produkt ist nicht verfügbar
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LPC2478FBD208,551 LPC2478.pdf
LPC2478FBD208,551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 512KB FLSH 208LQFP
Produkt ist nicht verfügbar
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LPC2478FET208,551 LPC2478.pdf
LPC2478FET208,551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT 512KB 208TFBGA
Packaging: Tray
Package / Case: 208-TFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-TFBGA (15x15)
Part Status: Not For New Designs
Number of I/O: 160
DigiKey Programmable: Not Verified
auf Bestellung 38 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+48.28 EUR
10+39.02 EUR
25+36.71 EUR
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LPC2104FBD48/01,15 LPC2104_2105_2106.pdf
LPC2104FBD48/01,15
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Not For New Designs
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2105FBD48/01,15 LPC2104_2105_2106.pdf
LPC2105FBD48/01,15
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2106FBD48/01,15 LPC2104_2105_2106.pdf
LPC2106FBD48/01,15
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Not For New Designs
Number of I/O: 32
DigiKey Programmable: Not Verified
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Anzahl Preis
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10+33.54 EUR
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80+29.54 EUR
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LPC2106FHN48/01,55 LPC2104_2105_2106.pdf
LPC2106FHN48/01,55
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLSH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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OM11015 LPC2478_Rev3.1.pdf
OM11015
Hersteller: NXP USA Inc.
Description: LPC2478 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), LCD
Core Processor: ARM7
Board Type: Evaluation Platform
Utilized IC / Part: LPC2478
Part Status: Obsolete
Produkt ist nicht verfügbar
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TJA1055T/3,518 TJA1055.pdf
TJA1055T/3,518
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
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UJA1065TW/3V0,518 UJA1065.pdf
UJA1065TW/3V0,518
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Cut Tape (CT)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 52V
Applications: Networking
Supplier Device Package: 32-HTSSOP
Produkt ist nicht verfügbar
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DEMO9S08QE8 description QE8QE4QSG.pdf
DEMO9S08QE8
Hersteller: NXP USA Inc.
Description: MC9S08QE8 EVAL BRD
Produkt ist nicht verfügbar
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